CN105277757A - Device and method for reducing ambient temperature of lens module - Google Patents

Abstract

An apparatus for reducing the ambient temperature of a lens module and a method thereof, the apparatus comprising: the device comprises a probe measuring machine, an optical sensor, a sensing control unit and a heat dissipation unit. Wherein, the needle tester is provided with a bearing disc, and the lens module is used for measuring a wafer to be tested which is placed on the bearing disc; the optical sensor is used for detecting whether the light source of the lens module is started or not; the heat dissipation unit is electrically connected with the optical sensor. When the optical sensor detects that the light source of the lens module is turned on, the sensing control unit outputs a control signal, and then the heat dissipation unit is turned on to dissipate heat of the lens module. Therefore, the invention can improve the thermal accumulation phenomenon of the environment where the lens module is positioned and reduce the measurement error of the lens module.

Description

Device and method for reducing ambient temperature of lens module

technical field

The invention relates to a device and method for reducing the ambient temperature of a lens module (CCD), in particular to a device and method for reducing the ambient temperature of a lens module suitable for testing semiconductor component wafers.

Background technique

The known needle tester for testing semiconductor component chips provides test signals such as specific current and voltage, and transmits the specific current and voltage to the semiconductor component chip through a test interface such as a probe card to confirm whether the electrical properties of the semiconductor component chip are normal. During the testing process of semiconductor component wafers, the lens image sensor module (CCD: Charge Coupled Device, hereinafter referred to as the lens module) of the needle tester needs to measure the distance between the semiconductor component wafer and the probe, and the lens module (CCD) is often affected by the test equipment. The long-time high-temperature baking of the carrier plate (Chuck) leads to errors when measuring the distance between the semiconductor component wafer and the probe. That is to say, the lens module will be affected by the temperature of the surrounding environment, resulting in an error during measurement, rather than the actual distance between the semiconductor component wafer and the probe.

Please refer to FIG. 1 , which is a three-dimensional schematic view of a conventional needle tester. The needle tester mainly includes: a lens unit 26 , a probe card 10 (probecard) and a transmission unit 30 . Wherein, the lens unit 26 has a fixed frame 27 and a lens module 28 fixed on the fixed frame 27; the probe card 10 has a plurality of probes 11 (probeneedle); the transmission unit 30 has a carrier plate 25, a vertical slide plate 38 and a horizontal sliding plate 36, the carrying plate 25 is fixed on the vertical sliding plate 38, the carrying plate 25 can be used for placing the probe card 10, the vertical sliding plate 38 can be longitudinally slid on the horizontal sliding plate 36 by the two longitudinal rails 37, and the horizontal sliding plate 36 can also slide laterally by two lateral rails 35 . Therefore, the probe card 10 disposed on the carrier tray 25 can be slid under the lens unit 26 by the transport unit 30 .

When the lens module is placed in the inner space of the narrow and airtight needle measuring machine, the lens module 28 above the probe card 10 is susceptible to the heat accumulation generated by the carrier plate 25 heated and baked for a long time, which affects the lens module 28. Accuracy in image recognition.

In order to prove that the lens module will be affected by the temperature of the environment, the carrier plate was moved under the lens module for experiments. The experimental data are shown in Figure 2. Figure 2 is a diagram of the change in time and measurement height of the lens module in the probe after baking. The horizontal axis of Figure 2 represents the heating time of the environment where the lens module is located, that is, the heating time of the carrier plate is from 0 to 30 minutes. The vertical axis of 2 represents the distance between the semiconductor component wafer and the probe measured by the lens module. The distance between the wafer to be tested and the probe card measured at 0 minutes and 30 minutes is 775 microns (μm) and 793 microns respectively (μm), so it can be found from Figure 2 that the measurement error continues to increase after thermal baking, and after 30 minutes of thermal baking, the variation from 0 microns (μm) without thermal baking increases to 18 microns (μm ), it can be seen that after the lens module is baked at high temperature, there will be misjudgment of measurement.

Therefore, during the semiconductor component wafer testing process, when the lens module is used to measure the positioning, index (Index) and thickness of the wafer to be tested, and the lens module is in a high-temperature environment, it is easy to produce an abnormal level phenomenon, making the lens module Misjudgment of the height and spacing will cause over-compensation problems, which will cause the needle deviation of the probe, strike the needle, scratch the chip, etc., seriously affect the accuracy of the test, and easily cause damage to the chip. It is not very ideal, and there is still room for improvement. space.

Because of this, the applicant of the present invention, based on the spirit of active invention and creation, thought hard about a "device and method for reducing the ambient temperature of the lens module" that can solve the above-mentioned problems, and finally completed the present invention after several researches and experiments.

Contents of the invention

The object of the present invention is to provide a device for lowering the ambient temperature of the lens module. By using the optical sensor, the induction control unit and the heat dissipation unit, when the light source of the lens module is turned on, the heat dissipation unit can be turned on to dissipate heat from the lens module to improve heat accumulation. Phenomenon, reduce the error of lens module measurement.

Another object of the present invention is to provide a device for reducing the ambient temperature of the lens module, which can make the production line more convenient to use without changing the main structure of the needle tester, greatly improve the test efficiency, and increase the The durability of the probe reduces the occurrence of probe deflection, pin strikes and chip scratches.

In order to achieve the above purpose, the device for reducing the ambient temperature of the lens module provided by the present invention includes: a needle measuring machine, a lens module, a light sensor, an induction control unit and a heat dissipation unit. Wherein, there is a carrying plate in the prober, and the lens module is used to measure a wafer to be tested placed on the carrying plate; the optical sensor is used to sense whether the light source of the lens module of the lens module is turned on, The induction control unit is electrically connected to the light sensor; the heat dissipation unit is electrically connected to the induction control unit, and is arranged adjacent to the lens module. Wherein, when the light sensor detects that the light source of the lens module is turned on, the sensing control unit outputs a control signal, and then turns on the cooling unit to dissipate heat from the lens module.

In addition, when the light sensor detects that the light source of the lens module is turned off, the sensor control unit outputs a control signal, and then turns off the heat dissipation unit, so as not to dissipate heat to the lens module. The above-mentioned control signal can be an on/off switching signal. When the light source of the lens module is turned on, the heat dissipation unit receives the control signal output by the sensor control unit, and then turns on to dissipate heat from the lens module; and when the light source of the lens module is turned off, the heat dissipation unit receives The control signal output by the induction control unit is also turned off. That is, when the lens module is turned on for measurement, the heat dissipation unit is turned on to dissipate heat from the lens module, and when the lens module is turned off for measurement, the heat dissipation unit is also turned off.

According to another embodiment of the present invention, the device for reducing the ambient temperature of the lens module includes: a needle measuring machine, a lens module, a temperature sensor, an induction control unit and a heat dissipation unit. Wherein, there is a carrying plate in the needle measuring machine, and the lens module is used to measure a wafer to be tested placed on the carrying plate; the temperature sensor is used to detect the temperature of the lens module, and the induction control unit is electrically connected to the temperature sensor; The unit is electrically connected to the induction control unit and is arranged adjacent to the lens module. Wherein, when the temperature sensor detects that the temperature of the lens module is higher than a target temperature, the sensing control unit outputs a control signal, and then turns on the cooling unit to dissipate heat from the lens module. The above target temperature may be 45 degrees Celsius or other default values.

In addition, when the temperature sensor detects that the temperature of the lens module is lower than the target temperature, the sensing control unit outputs a control signal, and then turns off the heat dissipation unit, so as not to dissipate heat to the lens module. That is, the above-mentioned control signal can be an on/off switch signal, when the temperature sensor detects that the temperature of the lens module is higher than the target temperature, the cooling unit receives the control signal output by the sensor control unit, and then turns on the lens module heat dissipation; and when the temperature sensor detects that the temperature of the lens module is lower than the target temperature, the heat dissipation unit receives the control signal output by the sensing control unit and then shuts down.

The above-mentioned cooling unit can be a switch valve, the switch valve has an inlet and an outlet, the inlet of the switch valve is connected with a gas supply device, the outlet of the switch valve faces the lens module, when the light sensor detects that the light source of the lens module is turned on, The induction control unit outputs a control signal, and then opens the on-off valve to guide the gas of the gas supply device to directly dissipate heat from the lens module. Or when the temperature sensor detects that the temperature of the lens module is higher than the target temperature, the sensing control unit outputs a control signal, and then opens the switch valve to guide the gas of the gas supply device to directly dissipate heat from the lens module.

The heat dissipation unit can be a heat dissipation fan. The heat dissipation fan faces the lens module. When the light sensor detects that the light source of the lens module is turned on, the sensing control unit outputs a sensing signal, and then turns on the heat dissipation fan to directly dissipate heat from the lens module. Or when the temperature sensor detects that the temperature of the lens module is higher than the target temperature, the sensor control unit outputs a control signal, and then turns on the cooling fan to directly dissipate heat from the lens module.

The device for reducing the ambient temperature of the lens module of the present invention may further include a cooling fin, which is fixed on the lens module and can be used to increase the cooling area of the lens module, thereby reducing the temperature of the lens module.

The device for lowering the ambient temperature of the lens module of the present invention may further include a heat insulating sheet, which is fixed between the lens module and the carrier plate, and can be used to isolate the high temperature of the carrier plate, thereby reducing the temperature of the lens module.

The present invention also provides a method for reducing the ambient temperature of the lens module, including:

Step A: Provide a needle measuring machine with a lens module and a carrier plate, a light sensor, an induction control unit electrically connected with the light sensor, and a heat dissipation unit electrically connected with the induction control unit.

Step B: The light sensor detects whether the light source of the lens module is turned on.

Step C: If yes, the sensing control unit outputs a control signal to turn on the cooling unit; if not, the sensing control unit outputs a control signal to turn off the cooling unit.

The above-mentioned control signal can be an on/off switching signal. When the light sensor detects that the light source of the lens module is turned on, the cooling unit receives the control signal output by the sensing control unit, and then turns on to dissipate heat from the lens module; When it is detected that the light source of the lens module is turned off, the cooling unit receives the control signal output by the sensing control unit and turns off accordingly.

The method for reducing the ambient temperature of the lens module according to another embodiment of the present invention includes:

Step A: Provide a needle measuring machine with a lens module and a carrier plate, a temperature sensor, an induction control unit electrically connected to the temperature sensor, and a heat dissipation unit electrically connected to the induction control unit.

Step B: the temperature sensor detects whether the temperature of the lens module is higher than a target temperature.

Step C: If yes, the sensing control unit outputs a control signal to turn on the cooling unit; if not, the sensing control unit outputs a control signal to turn off the cooling unit.

The above-mentioned control signal can be an on/off switch signal, when the temperature sensor detects that the temperature of the lens module is higher than the target temperature, the heat dissipation unit receives the control signal output by the sensor control unit, and then turns on the lens module to dissipate heat; and When the temperature sensor detects that the temperature of the lens module is lower than a target temperature, the heat dissipation unit receives a control signal output from the sensing control unit, and the heat dissipation unit is also turned off.

Description of drawings

Fig. 1 is a perspective schematic view of a known needle measuring machine.

Fig. 2 is a diagram showing the change of time and measured height of the lens module inside the probe after thermal baking.

FIG. 3 is a system architecture diagram for reducing the ambient temperature of the lens module according to the first preferred embodiment of the present invention.

FIG. 4 is a system architecture diagram for reducing the ambient temperature of the lens module according to the second preferred embodiment of the present invention.

FIG. 5 is a system architecture diagram for reducing the ambient temperature of the lens module according to the third preferred embodiment of the present invention.

FIG. 6 is a system architecture diagram for reducing the ambient temperature of the lens module according to the fourth preferred embodiment of the present invention.

FIG. 7 is a system architecture diagram for reducing the ambient temperature of the lens module according to the fifth preferred embodiment of the present invention.

FIG. 8 is a system architecture diagram for reducing the ambient temperature of the lens module according to the sixth preferred embodiment of the present invention.

FIG. 9 is a flowchart of reducing the ambient temperature of the lens module according to the first preferred embodiment of the present invention.

FIG. 10 is a flowchart of reducing the ambient temperature of the lens module according to the second preferred embodiment of the present invention.

Explanation of symbols in the attached drawings:

10 probe card; 11 probe; 25 carrying plate; 26 lens unit; 27 fixed frame; 28 lens module; 30 transmission unit; 35 horizontal track; , 7,8,9 needle measuring machine; 41 lens module; 411 lens module light source; 42 light sensor; 43 induction control unit; 44 heat dissipation unit; 45 main controller; Switch valve; 55 gas supply device; 64 cooling fan; 71 cooling fin; 81 heat shield; 91 temperature sensor.

detailed description

Please refer to FIG. 3 , which is a system architecture diagram for reducing the ambient temperature of the lens module in the first preferred embodiment of the present invention. The probe measuring machine 4 for reducing the ambient temperature of the lens module in this embodiment has a lens module 41 and a main controller. In addition to basic structures such as a device 45 , a carrier plate 46 , a stage 47 and a base 48 , it also has a light sensor 42 , an induction control unit 43 and a heat dissipation unit 44 . Among them, the carrier 47 is set on the base 48, and the carrier plate 46 is set on the carrier 47. The main controller 45 can control the sliding of the carrier plate 46 and the carrier 47, so that the lens module 41 can be measured and placed. The structure of a wafer to be tested (wafer) on the carrier plate 46 belongs to the known technology and will not be repeated here.

The lens module 41 of this embodiment is used to measure the wafer to be measured (wafer) placed on the carrier plate 46 in the needle measuring machine 4. The lens module 41 has a lens module light source 411; the optical sensor 42 is used to sense the lens module. Whether the light source 411 is turned on; the sensing control unit 43 is electrically connected to the light sensor 42 ; Wherein, when the light sensor 42 detects that the lens module light source 411 is turned on, the sensing control unit 43 outputs a control signal, and then turns on the cooling unit 44 to dissipate heat 41 from the lens module.

In addition, in this embodiment, when the light sensor 42 detects that the lens module light source 411 is turned off, it outputs a sensing signal, and then turns off the cooling unit 44 to prevent the lens module 41 from dissipating heat. That is, the sensing signal in this embodiment is an on/off switch signal, which can be used to switch on or off the cooling unit 44 .

It has been verified by experiments that this embodiment is compared with the previously known time and measurement height variation diagram of FIG. In a stable environment baked for 3 hours, the change in the distance between the wafer to be tested and the probe card was measured to be only 4 microns (μm), far smaller than the change before the cooling unit 44 was installed, which reached 18 microns (μm), or even In this embodiment, after baking for 23 hours, the pitch change is only 4 micrometers (μm), which shows that the heat dissipation unit 44 installed in the needle testing machine 4 in this embodiment can effectively improve the heat accumulation phenomenon.

Thus, in this embodiment, the light sensor 42 and the cooling unit 44 can be utilized, so that when the lens module light source 411 of the lens module 41 is turned on, the cooling unit 44 can be turned on to dissipate heat from the lens module 41, which can improve the position of the lens module 41. The heat accumulation phenomenon in the environment reduces the measurement error of the lens module 41 . In addition, this embodiment can also make the production line more convenient to use without changing the main structure of the needle testing machine 4, greatly improve the testing efficiency, increase the durability of the probes, and reduce the cost of the probes. Needle misalignment, pin strike and chip scratches, etc.

Please refer to Fig. 4, which is a system architecture diagram for reducing the ambient temperature of the lens module in the second preferred embodiment of the present invention. The system architecture of this embodiment is roughly the same as that of the first embodiment, and the only difference lies in the needle testing machine of this embodiment In addition to basic structures such as a lens module 41, a main controller 45, a carrier plate 46, a stage 47, and a base 48, the 5 also has an optical sensor 42, an induction control unit 43, and a switch. Valve 54.

In the switching valve 54 of this embodiment, the inlet of the switching valve 54 is connected to a gas supply device 55 , and the outlet of the switching valve 54 is directed toward the lens module 41 . Therefore, when the light sensor 42 detects that the lens module light source 411 is turned on, the sensing control unit 43 outputs a control signal, and then opens the switch valve 54 to guide the gas of the gas supply device 55 to dissipate heat directly to the lens module 41 . In addition, when the light sensor 42 detects that the lens module light source 411 is turned off, it outputs a sensing signal, and then closes the on-off valve 54 to prevent the lens module 41 from dissipating heat.

This embodiment is also like the first embodiment, which can improve the heat accumulation phenomenon in the environment near the lens module 41 and reduce the measurement error of the lens module 41 . In addition, because the original testing machine 5 already has a gas supply device 55, no additional installation is required, so this embodiment can also make the production line more convenient to use without changing the main structure of the needle testing machine 5. The test efficiency is greatly improved, and the durability of the probe can be increased to reduce the deviation of the probe, pin strike and chip scratches.

Please refer to FIG. 5 , which is a system architecture diagram for reducing the ambient temperature of the lens module according to the third preferred embodiment of the present invention. The system architecture of this embodiment is roughly the same as that of the first embodiment, and the only difference lies in the needle testing machine of this embodiment. In addition to basic structures such as a lens module 41, a main controller 45, a carrier plate 46, a stage 47, and a base 48, the 6 also has an optical sensor 42, an induction control unit 43, and a heat sink. fan64. That is, the heat dissipation unit of this embodiment is the heat dissipation fan 64 .

Thus, when the light sensor 42 detects that the lens module light source 411 is turned on, the sensing control unit 43 outputs a control signal, and then turns on the cooling fan 64 to dissipate heat 41 from the lens module. In addition, when the light sensor 42 detects that the lens module light source 411 is turned off, it outputs a sensing signal, and then turns off the cooling fan 64 to prevent the lens module 41 from dissipating heat. This embodiment is also like the first embodiment, which can improve the heat accumulation phenomenon in the environment near the lens module 41 and reduce the measurement error of the lens module 41 .

Please refer to FIG. 6, which is a system architecture diagram for reducing the ambient temperature of the lens module in the fourth preferred embodiment of the present invention. The system architecture of this embodiment is roughly the same as that of the first embodiment, and the only difference lies in the needle testing machine of this embodiment. 7 In addition to basic structures such as a lens module 41, a main controller 45, a carrier plate 46, a carrier platform 47, a base 48, an optical sensor 42, an induction control unit 43, and a heat dissipation unit 44, Compared with the first embodiment, there is one more heat dissipation fin 71 , and the heat dissipation fin 71 can be fixed on the lens module 41 to increase the heat dissipation area of the lens module 41 .

Therefore, this embodiment is the same as the first embodiment, when the light sensor 42 detects that the lens module light source 411 is turned on, the sensing control unit 43 outputs a control signal, and then turns on the cooling unit 44 to dissipate heat 41 from the lens module. And when the light sensor 42 detects that the lens module light source 411 is turned off, it outputs a sensing signal, and then turns off the cooling unit 44 so as not to dissipate heat from the lens module 41 .

This embodiment is also like the first embodiment, which can improve the heat accumulation phenomenon in the surrounding environment of the lens module 41, reduce the measurement error of the lens module 41, and because the lens module 41 is provided with more heat dissipation fins 71, it can be further improved. The heat accumulation phenomenon in the environment near the lens module 41 reduces the measurement error of the lens module 41 .

Please refer to FIG. 7, which is a system architecture diagram for reducing the ambient temperature of the lens module according to the fifth preferred embodiment of the present invention. The system architecture of this embodiment is roughly the same as that of the first embodiment, and the only difference lies in the needle testing machine of this embodiment. 8 In addition to having a basic structure such as a lens module 41, a main controller 45, a carrier plate 46, a carrier 47, a base 48, an optical sensor 42, an induction control unit 43 and a heat dissipation unit 44, Compared with the first embodiment, there is one more heat insulating sheet 81 . The heat insulating sheet 81 can be fixed between the lens module 41 and the carrier plate 46 to isolate the heat source of the carrier plate 46 and reduce the transfer of heat source to the lens module 41 .

Therefore, this embodiment is the same as the first embodiment, when the light sensor 42 detects that the lens module light source 411 is turned on, the sensing control unit 43 outputs a control signal, and then turns on the cooling unit 44 to dissipate heat 41 from the lens module. And when the light sensor 42 detects that the lens module light source 411 is turned off, it outputs a sensing signal, and then turns off the cooling unit 44 so as not to dissipate heat from the lens module 41 .

This embodiment is also like the first embodiment, which can improve the heat accumulation phenomenon in the environment near the lens module 41, reduce the measurement error of the lens module 41, and because there are more heat insulating sheets 81 between the lens module 41 and the carrier plate 46 , so it can reduce the transfer of the heat source of the carrier plate 46 to the lens module 41 , can further improve the heat accumulation phenomenon in the environment around the lens module 41 , and reduce the measurement error of the lens module 41 .

Please refer to FIG. 8 , which is a system architecture diagram for reducing the ambient temperature of the lens module in the sixth preferred embodiment of the present invention. The system architecture of this embodiment is roughly the same as that of the first embodiment, and the only difference lies in the needle testing machine of this embodiment. 9 is to use the temperature sensor 91 to detect whether the temperature of the lens module 41 is higher than a target temperature to determine whether the heat dissipation unit 44 should be turned on, instead of using the light sensor 42 to detect whether the lens module light source 411 is turned on or not as in the first embodiment. Turn off to determine whether the cooling unit 44 should be turned on.

In addition to basic structures such as a lens module 41, a main controller 45, a carrier plate 46, a carrier platform 47, and a base 48, the probe measuring machine 9 for lowering the ambient temperature of the lens module in this embodiment has other basic structures. It has a temperature sensor 91 , an induction control unit 43 electrically connected to the temperature sensor 91 , and a heat dissipation unit 44 electrically connected to the induction control unit 43 .

In this embodiment, when the temperature sensor 91 detects that the temperature of the lens module 41 is higher than a target temperature, the sensing control unit 43 outputs a control signal to turn on the cooling unit 44 to dissipate heat from the lens module 41 . In addition, when the temperature sensor 91 detects that the temperature of the lens module 41 is lower than the target temperature, the sensing control unit 43 outputs a control signal to close the cooling unit 44 so as not to dissipate heat to the lens module 41 .

In this embodiment, the target temperature is 45 degrees Celsius. That is, 45 degrees Celsius is used as the threshold for turning on or turning off the cooling unit 44 . This embodiment, like the first embodiment, can improve the heat accumulation phenomenon in the environment near the lens module 41 and reduce the measurement error of the lens module 41 .

Please refer to FIG. 9 , which is a flow chart of reducing the ambient temperature of the lens module according to the first preferred embodiment of the present invention, and please refer to FIG. 3 together. The flow chart of reducing the ambient temperature of the lens module in this embodiment includes the following steps:

Step SA: Provide a needle measuring machine 4 with a lens module 41 and a carrier plate 46, an optical sensor 42, an induction control unit 43 electrically connected with the optical sensor 42, and an electrical connection with the induction control unit 43. Connected cooling unit 44.

Step SB: The light sensor 42 detects whether the lens module light source 411 of the lens module 41 is turned on.

Step SC: If the lens module light source 411 of the lens module 41 is turned on, the sensing control unit 43 outputs a control signal to turn on the cooling unit 44 (step SC1) to dissipate heat from the lens module 41; if the lens module light source 411 of the lens module 41 is turned off If so, the sensing control unit 43 outputs a control signal to close the heat dissipation unit 44 (step SC2 ), so as not to dissipate heat to the lens module 41 . In this embodiment, the sensing signal is an on/off switching signal.

Therefore, the method can improve the heat accumulation phenomenon in the environment near the lens module 41 and reduce the measurement error of the lens module 41 . In addition, this method can also make the use of the production line more convenient without changing the main structure of the needle testing machine 4, greatly improve the testing efficiency, increase the durability of the probes, and reduce the needle resistance of the probes. Misalignment, firing pins, and chip scratches.

Please refer to FIG. 10 , which is a flow chart of reducing the ambient temperature of the lens module according to the second preferred embodiment of the present invention, and please refer to FIG. 8 together. The flow chart of reducing the ambient temperature of the lens module in this embodiment includes the following steps:

Step SA: Provide a needle measuring machine 9 with a lens module 41 and a carrier plate 46, a temperature sensor 91, an induction control unit 43 electrically connected to the temperature sensor 91, and an electrical connection with the induction control unit 43. Connected cooling unit 44.

Step SB: the temperature sensor 91 detects whether the temperature of the lens module 41 is higher than a target temperature.

Step C: If the temperature sensor 91 detects that the temperature of the lens module 41 is higher than the target temperature, the sensing control unit 43 outputs a control signal to open the cooling unit 44 (step SC1) to dissipate heat from the lens module 41; if the temperature sensor 91 detects If the temperature of the lens module 41 is not higher than the target temperature, the sensing control unit 43 outputs a control signal to turn off the heat dissipation unit 44 (step SC2 ), so as not to dissipate heat to the lens module 41 . In this embodiment, the sensing signal is an on/off switching signal.

Therefore, this method, like the flow chart of the first embodiment, can improve the heat accumulation phenomenon in the environment near the lens module 41 and reduce the measurement error of the lens module 41 . In addition, this method can also make the use of the production line more convenient without changing the main structure of the needle testing machine 9, greatly improve the testing efficiency, increase the durability of the probes, and reduce the needle resistance of the probes. Misalignment, firing pins, and chip scratches.

The above-mentioned embodiments are only examples for convenience of description, and the scope of rights claimed by the present invention should be based on the scope of claims in the application, rather than limited to the above-mentioned embodiments.

Claims (17)

1. reduce a device for camera lens module environment temperature, be arranged at and have in a pin survey machine of a carrier, comprising:

One camera lens module, in order to detect the wafer to be measured be placed on this carrier, this camera lens module has a camera lens module light source;

Whether one optical sensor, open in order to respond to this camera lens module light source;

One induction control module, is electrically connected this optical sensor; And

One heat-sink unit, is electrically connected this induction control module; Wherein, open when this optical sensor detects this camera lens module light source, this induction control module exports one and controls signal to open this heat-sink unit.

2. reduce a device for camera lens module environment temperature, be arranged at and have in a pin survey machine of a carrier, comprising:

One camera lens module, in order to detect the wafer to be measured be placed on this carrier;

One temperature sensor, in order to detect the temperature of this camera lens module;

One induction control module, is electrically connected this temperature sensor; And

One heat-sink unit, is electrically connected this induction control module; Wherein, when this temperature sensor detects the temperature of this camera lens module higher than a target temperature, this induction control module exports one and controls signal to open this heat-sink unit.

3. reduce the device of camera lens module environment temperature as claimed in claim 1 or 2, wherein, this heat-sink unit is a switch valve, and the entrance of this switch valve is connected with a gas supply device, and the outlet of this switch valve is towards this camera lens module.

4. reduce the device of camera lens module environment temperature as claimed in claim 1 or 2, wherein, this heat-sink unit is a radiator fan, and it is towards this camera lens module.

5. reduce the device of camera lens module environment temperature as claimed in claim 1 or 2, wherein, include a radiating fin, be fixedly arranged on this camera lens module, to increase the area of dissipation of this camera lens module.

6. reduce the device of camera lens module environment temperature as claimed in claim 1 or 2, wherein, include a heat shield, be fixedly arranged between this camera lens module and this carrier.

7. reduce the device of camera lens module environment temperature as claimed in claim 1, wherein, detect this camera lens module light source when this optical sensor and close, this induction control module exports this control signal to close this heat-sink unit.

8. reduce the device of camera lens module environment temperature as claimed in claim 2, wherein, when this temperature sensor detects the temperature of this camera lens module lower than this target temperature, this induction control module exports this control signal to close this heat-sink unit.

9. reduce the device of camera lens module environment temperature as claimed in claim 2, wherein, this target temperature is 45 degree Celsius.

10. reduce the device of camera lens module environment temperature as claimed in claim 1 or 2, wherein, this control signal is that an On/Off switches signal.

11. 1 kinds of methods reducing camera lens module environment temperature, comprising:

Steps A: provide a pin with a camera lens module and a carrier to survey machine, an optical sensor, an induction control module be electrically connected with this optical sensor and a heat-sink unit be electrically connected with this induction control module;

Step B: whether the light source that this camera lens module detected by this optical sensor is opened; And

Step C: if so, this induction control module exports one and controls signal to open this heat-sink unit; If not this induction control module exports one and controls signal to close this heat-sink unit.

12. 1 kinds of methods reducing camera lens module environment temperature, comprising:

Steps A: provide a pin with a camera lens module and a carrier to survey machine, a temperature sensor, an induction control module be electrically connected with this temperature sensor and a heat-sink unit be electrically connected with this induction control module;

Step B: whether this temperature sensor detects the temperature of this camera lens module higher than a target temperature; And

Step C: if so, this induction control module exports one and controls signal to open this heat-sink unit; If not this induction control module exports one and controls signal to close this heat-sink unit.

13. methods reducing camera lens module environment temperature as described in claim 11 or 12, wherein, this heat-sink unit is a switch valve, and the entrance of this switch valve is connected with a gas supply device, and the outlet of this switch valve is towards this camera lens module.

14. methods reducing camera lens module environment temperature as described in claim 11 or 12, wherein, this heat-sink unit is a radiator fan, and it is towards this camera lens module.

15. methods reducing camera lens module environment temperature as described in claim 11 or 12, wherein, this control signal is that an On/Off switches signal.

16. methods reducing camera lens module environment temperature as described in claim 11 or 12, wherein, this camera lens module is installed with a radiating fin, to increase the area of dissipation of this camera lens module.

17. methods reducing camera lens module environment temperature as described in claim 11 or 12, wherein, have one in order to heat insulation heat shield between this camera lens module and this carrier.