CN105277569B - Route board detecting method based on three-dimensional feature - Google Patents
Route board detecting method based on three-dimensional feature Download PDFInfo
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Abstract
The invention discloses a kind of route board detecting method based on three-dimensional feature, the method includes：Obtain the three-dimensional coordinate data for being detected each position on wiring board, each three-dimensional feature value is extracted according to the three-dimensional coordinate data of each position, judge whether each three-dimensional feature value complies with standard value, when three-dimensional feature value does not meet the standard value, determine that position corresponding to the three-dimensional feature value is defective locations.This programme is that the three-dimensional coordinate data for each point being directed on wiring board is acquired, handles, compares and analyzes, obtain testing result, and then all types of route board defects can be detected, simultaneously not by aoxidize, the environment such as dirty are influenced, false detection rate or rate of false alarm caused by due to environment influences can be effectively reduced.Further, it is also possible to detect the depression defect and blind hole that traditional automated optical inspection can not detect.
Description
Technical field
The present invention relates to technical field of optical detection more particularly to a kind of route board detecting methods based on three-dimensional feature.
Background technique
Printed wiring board (PCB, Printed Circuit Board) is the substrate of group apparatus, electronic part, is electronic product
Critical electrical interconnection piece, referred to as " mother of electronic system product ", therefore quality testing is carried out to it, there is important meaning,
It is realized when traditional detection to printed wiring board by automated optical inspection (AOI).
During automated optical inspection detects printed wiring board, existing detection mode is first to obtain to produce
The flat image of product, then the flat image is compared with standard picture, and then according to comparison result testing product is carried out scarce
Fall into judgement.Specifically, for the angle for detecting feature used, existing method is based on " gray feature of flat image ".
Since board substrate is different with the reflection characteristic of conductor, when the more copper defects of appearance, such as the defects of short circuit, copper ashes, burr
When, should the lower position of brightness will appear high-brightness region；It is lacked when there is scarce copper defect, such as open circuit, pin hole, notch etc.
Fall into when, should the higher position of brightness will appear low brightness area.
But the existing method detected based on product image gray feature, there are the shortcomings that include：
On the one hand erroneous detection is led to vulnerable to the interference such as oxidation, dirty due to the product of detection.Field statistics statistics indicate that, it is existing
It is due to oxidation and dirty caused wrong report, in addition, these wrong reports occupy largely that AOI equipment institute's reported defects number, which is more than 40%,
Reinspection acknowledging time and manpower；It on the other hand is that some depression defects can not detected completely.For example, printed wiring
Having a kind of defect on plate is that there are still conductors to connect, but conductor thickness is far below design value.This defect will lead to intensity drop
Low or even impedance changes, and needs to detect, and the existing detection method by AOI instrument based on image grayscale feature can not detect
This defect out.
Summary of the invention
The route board detecting method based on three-dimensional feature is provided in the embodiment of the present invention, to solve the above problems.
In order to solve the above-mentioned technical problem, the embodiment of the invention discloses following technical solutions：
A kind of route board detecting method based on three-dimensional feature, the method includes：
The three-dimensional coordinate data for being detected each position on wiring board is obtained, the three-dimensional coordinate data includes X axis coordinate
Data, Y axis coordinate data and Z axis coordinate data；
The three-dimensional feature value of each position is extracted according to the three-dimensional coordinate data of each position；
Judge whether each three-dimensional feature value complies with standard value；
When three-dimensional feature value does not meet the standard value, determine that position corresponding to the three-dimensional feature value is defective bit
It sets.
Preferably, the three-dimensional coordinate data for obtaining each position on detected wiring board includes：
Obtain the measured data for being detected each position on wiring board；
The measured data is handled, the three-dimensional coordinate data of each position is obtained.
Preferably, described to handle the measured data, the three-dimensional coordinate data for obtaining each position includes：
The measured data is carried out to reject interference processing, obtains the three-dimensional coordinate data of each position.
Preferably, described to further include according to each three-dimensional feature value of the three-dimensional coordinate data of each position extraction：
The Z axis coordinate data of each three-dimensional coordinate data is extracted according to the three-dimensional coordinate data of each position, and will
The Z axis coordinate data is as three-dimensional feature value.
Preferably, the three-dimensional feature value further includes elevation, gradient magnitude and direction, contour or height step.
Preferably, described to judge whether each three-dimensional feature value complies with standard value and include：
Judge whether each three-dimensional feature value complies with standard value, alternatively, whether judging each three-dimensional feature value
Within values.
Preferably, when judging whether each three-dimensional feature value complies with standard value, the method also includes：
According to the requirement of the processing quality of the wiring board and production rule, the standard value is determined.
Preferably, when judging that each three-dimensional feature value is whether within preset threshold range, the method is also wrapped
It includes：
Obtain the design parameter of reference plate line corresponding with the detected wiring board；
According to the design parameter of the reference plate line, the three-dimensional seat of reference of each position on the reference plate line is obtained
Mark data；
According to each described with reference to three-dimensional coordinate data, each reference three-dimensional with reference in three-dimensional coordinate data of extraction
Characteristic value；
According to each values for determining each three-dimensional feature value with reference to three-dimensional feature value.
Preferably, the reference three-dimensional feature value includes elevation, gradient magnitude and direction, contour or height step.
Preferably, which is characterized in that the method also includes：
It counts all defective locations for not meeting the standard value, and draws simulation corresponding with the detected wiring board
Figure.
A kind of route board detecting method based on three-dimensional feature that this programme provides, by acquiring each position of PCB surface
The three-dimensional coordinate data set extracts the three-dimensional feature value of each three-dimensional coordinate data, then by carrying out to these three-dimensional feature values
Compare, when the three-dimensional feature value of acquisition does not meet standard value, shows that the corresponding position of three-dimensional feature value is defective locations.By
It is acquired, handles, compares and analyzes in the three-dimensional coordinate data that this programme is each point being directed on wiring board, detected
As a result.Since when defect occurs in detected wiring board, either more copper still lack copper defect, the conductor of wiring board corresponding position
Thickness can all have change relative to standard value or beyond allowed band, therefore the detection method that this programme provides can detect own
The route board defect of type.Also, even if wiring board is oxidized or dirty, the thickness of the wiring board will not be influenced, so,
This detection method not by aoxidize, the environment such as dirty are influenced, false detection rate or mistake caused by due to environment influences can be effectively reduced
Report rate.
In addition, being based on product gray level image detection method compared to existing, this programme can also judge that wiring board lacks
Sunken specific location, form, size, type can detecte out the undetectable recess of traditional automated optical inspection and lack
It falls into；Since three-dimensional coordinate data can directly embody hole depth, accurate blind hole quality testing may be implemented.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, for those of ordinary skill in the art
Speech, without any creative labor, is also possible to obtain other drawings based on these drawings.
Fig. 1 is a kind of flow chart of the route board detecting method based on three-dimensional feature provided in an embodiment of the present invention；
Fig. 2 is a kind of three dimensional structure diagram of detected wiring board provided in an embodiment of the present invention；
Fig. 3 is the flow chart of another route board detecting method based on three-dimensional feature provided in an embodiment of the present invention；
Fig. 4 is the flow chart of another route board detecting method based on three-dimensional feature provided in an embodiment of the present invention；
Fig. 5 is that a kind of route board detecting method based on three-dimensional feature provided in an embodiment of the present invention and existing AOI are examined
The comparison schematic diagram of survey.
Specific embodiment
Technical solution in order to enable those skilled in the art to better understand the present invention, below in conjunction with of the invention real
The attached drawing in example is applied, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without making creative work, all should belong to protection of the present invention
Range.
The present invention provides a kind of route board detecting method based on three-dimensional feature, as shown in Figure 1, this method includes：
Step S110：Obtain the three-dimensional coordinate data for being detected each position on wiring board, the three-dimensional coordinate data packet
Include X axis coordinate data, Y axis coordinate data and Z axis coordinate data.
Firstly the need of establishing a three-dimensional coordinate system, including X-axis, Y-axis and Z axis；Secondly, detected wiring board is set
In the three-dimensional coordinate system, so that each position being detected on wiring board can be indicated by three dimensional space coordinate
Out；Any point all includes X axis coordinate data, Y axis coordinate data and Z axis coordinate data.
Step S120：Extract each position according to the three-dimensional coordinate data of each position, and with the three-dimensional
The corresponding three-dimensional feature value of coordinate data.
The three-dimensional feature value includes Z axis coordinate data or other values, such as elevation, gradient magnitude and direction, contour
Line or height step etc. can represent the value for being detected route plate features.
Step S130：Judge whether each three-dimensional feature value complies with standard value.
Since X-axis and Y-axis form horizontal plane, Y axis coordinate indicates the height or thickness that are detected wiring board, so detection
When whether wiring board is defective, it can usually judge whether Z axis coordinate data complies with standard value.
Step S140：When three-dimensional feature value does not meet the standard value, the three-dimensional seat where the three-dimensional feature value is determined
Marking the corresponding position of data is defective locations.Not meeting standard value wherein includes higher or lower than the standard value compared.
Step S141：When judging that the three-dimensional feature value complies with standard value, i.e., when identical as standard value, determine the coordinate bit
Set zero defect.
A kind of route board detecting method based on three-dimensional feature provided in this embodiment, it is each by acquisition PCB surface
The three-dimensional coordinate data of position, extracts the three-dimensional feature value in these three-dimensional coordinate datas, and by these three-dimensional feature values with
Standard value compares, and when not meeting standard value, shows that the corresponding position of three-dimensional data coordinate is defective locations.Due to we
For case different from existing according to reflection characteristic, i.e., flat image gray feature acquires the information for being detected wiring board, then is compared
Compared with, but the feature different according to wiring board depth, since the substrate of wiring board is a smooth plate, conductor is convex in substrate
It rises, protrusion thickness is generally at 30 microns to 500 microns, as shown in Fig. 2, when a defect has occurred, either more copper still lack copper and lack
It falls into, the conductor thickness of wiring board corresponding position has change relative to standard value (or design value), or exceeds allowed band, base
In this three-dimensional feature value, the technical program extracts the three-dimensional feature value for each position being detected on wiring board, and to these
Three-dimensional feature value is compared and analyzes, and then obtains testing result.
Even if the detection method that this programme provides is detected wiring board and is oxidized or dirty, the wiring board will not be influenced
Thickness, therefore, this method not by aoxidize, the environment such as dirty are influenced, caused by capable of being effectively reduced due to environment influences accidentally
Inspection rate or rate of false alarm, and can detect all defect problems of wiring board.
As shown in figure 3, in step s 110, it is described to obtain the three-dimensional coordinate data packet for being detected each position on wiring board
It includes：
Step S111：Obtain the measured data for being detected each position on wiring board；The wherein three-dimensional coordinate data packet
Include X axis coordinate data, Y axis coordinate data and Z axis coordinate data.
It wherein, can be by being converted to detected wiring board progress graph scanning, then by the result of scanning in step S111
At data to get arrive the measured data；Or by being taken pictures to obtain the measured data to detected wiring board；This reality
Applying example includes but is not limited to that the graph scanning or two ways of taking pictures obtain the measured data for being detected wiring board.
Step S112：The measured data is handled, the three-dimensional coordinate data of each position is obtained.
In order to reduce or eliminate the interference such as noise in measured data, testing result is influenced, is obtained in step S111
The measured data taken is handled, and the processing includes the processing such as filtering, denoising, amplification.
Preferably, described that the measured data is handled in step S112, obtain the three-dimensional of each position
Coordinate data includes：
Step S1121：The measured data is carried out to reject interference processing, obtains the three-dimensional coordinate number of each position
According to.The three-dimensional coordinate data of the detected wiring board obtained is set to reduce and survey closer to the actual value of practical detected wiring board
Bring error is measured, detection quality is further improved.
In the another aspect of above-described embodiment, step S120：It is extracted according to the three-dimensional coordinate data of each position each
A three-dimensional feature value further includes：
Step S121：The Z axis coordinate of each three-dimensional coordinate data is extracted according to the three-dimensional coordinate data of each position
Data, and using the Z axis coordinate data as three-dimensional feature value.
In addition, the three-dimensional feature value further includes elevation, gradient magnitude and direction, contour or height in step S121
Spend step.Wherein, the elevation, gradient magnitude and direction, contour or height step can be by being higher than X-axis and Y-axis shape
At height above the horizontal plane indicate.The three-dimensional feature extracted can also be determined according to the actual conditions for being detected wiring board
Value.
In another embodiment, in step S130, judge whether each three-dimensional feature value complies with standard value and include：
Step S1301：Judge whether each three-dimensional feature value complies with standard value, alternatively, judging each three-dimensional
Whether characteristic value is within values.
Step S1301 is the alternative steps of step S130, and the optimization to step S120.Step S130 is divided to for two kinds of feelings
Condition, the first situation are that two values being compared are equal；Situation is that two values being compared are unequal in second, but the two
Value is very close to difference very little.The deterministic process of the first situation is identical as abovementioned steps S130, and details are not described herein；Institute
It states in second situation, when the three-dimensional feature value and standard value that compare are unequal, if what the difference of the two allowed in error
In range, then it is determined that the position where the Z axis coordinate is not defective locations, avoid due to subtle error, and by erroneous detection
For defect, and then keep testing result more acurrate.
It is identical as above-mentioned steps S141, if it is determined that the three-dimensional feature value is within values, it is determined that this three
The corresponding position zero defect of three-dimensional coordinate data where dimensional feature value.
As shown in figure 4, for the flow chart of another detection method provided in this embodiment, first in step S1301
Kind situation, when judging whether each three-dimensional feature value complies with standard value, the method also includes：
Step S13011：According to the requirement of the processing quality of the wiring board and production rule, the standard value is determined.
The information that specification or related data provide when being dispatched from the factory according to wiring board, can get the standard value of the wiring board,
Or the three-dimensional feature value of standard, and the standard value or standard three-dimensional characteristic value collection are labeled as G.
Second situation in step S1301：When judging each three-dimensional feature value whether within values
When, the method also includes：
Step S131：Obtain the design parameter of reference plate line corresponding with the detected wiring board；Wherein, described
Design parameter includes but is not limited to obtain from the specification of detected wiring board or data relevant to specification.
Step S132：According to the design parameter of the reference plate line, each position on the reference plate line is obtained
With reference to three-dimensional coordinate data；Wherein, acquisition described in the step includes analyzing, extracting the reference three of each position by computer
Coordinate is tieed up, is perhaps directly read according to design parameter or customized with reference to three-dimensional coordinate data.Step S1221 is specifically combined,
The reference three-dimensional coordinate for obtaining each position is normal data set G.
Step S133：According to each feature with reference to three-dimensional coordinate data, extract each described with reference to three-dimensional coordinate
Three-dimensional feature value in data, and as reference three-dimensional feature value；It is described to extract the step of referring to three-dimensional feature value and aforementioned step
Rapid S120 is identical, and the parameter value of extraction comparison is determined according to the actual characteristic of detected wiring board, but extracted refers to three
Dimensional feature value should be identical as the three-dimensional feature value that detected wiring board extracts or belongs to similar.
Step S134：It is determined according to each three-dimensional feature value with reference in three-dimensional coordinate data each described three-dimensional special
The values of value indicative.
Specifically, the size of the values can be according to reference plate line corresponding with the detected wiring board
Quality technique or empirical data obtain to get arrive standard detection template M to be compared.
Corresponding to step S121, it is described with reference to three-dimensional feature value include Z axis coordinate data, elevation, gradient magnitude and direction,
Contour or height step.Described in being determined according to the design parameter of the actual conditions of this detection wiring board or reference plate line
With reference to three-dimensional feature value, still, three-dimensional feature value is either determined according to the feature for being detected wiring board, according further to reference line
The design parameter of road plate determines three-dimensional feature value, as long as guaranteeing that the three-dimensional feature value of two kinds of selections belongs to same type.Wherein,
The three-dimensional data feature that the same type can be regarded as extracting is all contour, is perhaps all elevation or is all height step.
After standard detection template M is determined, by the three-dimensional feature value of detected wiring board and standard detection template M ratio
Compared with obtaining testing result according to comparison result.
Above-mentioned steps S131 to step S134 is the detailed process of step S1301 values setting, which is
A kind of method for determining its values is not limited to the displacement of above-mentioned steps S131 to sequence between step S134.
In the other side of above-described embodiment, the method also includes：
Step S160：All defective locations for not meeting the standard value are counted, and are drawn and the detected wiring board
Corresponding simulation drawing.As shown in figure 5, being traditional comparison diagram by AOI and this programme based on three-dimensional feature detection method, lead to
The type for the defective locations being detected on wiring board can clearly be judged by crossing the simulation drawing that method provided by the embodiment generates, by
Hole depth can be directly embodied in three-dimensional coordinate data, therefore accurate blind hole quality testing may be implemented.Such as 5 in figure, it can
Determine that (1) number position is open circuit；(2) number position is pad defect；(3) number position is recess；(4) number position is circuit defect.
The route board detecting method that this programme provides is based on product gray level image detection method compared to existing, may be used also
By judge route board defect specific location, in the form of, size, type, can detecte out traditional AOI (automatic optics inspection
Instrument) undetectable recess and defect；Since three-dimensional coordinate data can directly embody hole depth, may be implemented accurately
Blind hole quality testing, provides detection quality, and testing result is more accurate.
The above described is only a preferred embodiment of the present invention, being not intended to limit the present invention in any form.
With device, the mould of same detection function corresponding to any route board detecting method based on above-mentioned three-dimensional feature
Block, equipment etc. have the technical solution of physical objects, or the only replacement corresponding to the device of this method in structure, also belong to
Within the scope of protection of the invention.
It is required that those skilled in the art can be understood that the technology in the embodiment of the present invention can add by software
The mode of general hardware platform realize.Based on this understanding, the technical solution in the embodiment of the present invention substantially or
Say that the part that contributes to existing technology can be embodied in the form of software products, which can deposit
Storage is in storage medium, such as ROM/RAM, magnetic disk, CD, including some instructions are used so that computer equipment (can be with
It is personal computer, server or the network equipment etc.) execute certain part institutes of each embodiment of the present invention or embodiment
The method stated.
Although the present invention has been disclosed in the preferred embodiments as above, however, it is not intended to limit the invention.It is any to be familiar with ability
The technical staff in domain, without departing from the scope of the technical proposal of the invention, all using in the methods and techniques of the disclosure above
Appearance makes many possible changes and modifications or equivalent example modified to equivalent change to technical solution of the present invention.Therefore,
Anything that does not depart from the technical scheme of the invention are made to the above embodiment any simple according to the technical essence of the invention
Modification, equivalent variations and modification, all of which are still within the scope of protection of the technical scheme of the invention.
Claims (8)
1. a kind of route board detecting method based on three-dimensional feature, which is characterized in that the method includes：
Obtain be detected wiring board on each position three-dimensional coordinate data, the three-dimensional coordinate data include X axis coordinate data,
Y axis coordinate data and Z axis coordinate data；
The three-dimensional feature value of each position, the three-dimensional feature value packet are extracted according to the three-dimensional coordinate data of each position
It includes：Elevation, gradient magnitude and direction, contour or height step；
Judge whether each three-dimensional feature value complies with standard value；
When three-dimensional feature value does not meet the standard value, determine that position corresponding to the three-dimensional feature value is defective locations.
2. the method according to claim 1, wherein described obtain the three-dimensional for being detected each position on wiring board
Coordinate data includes：
Obtain the measured data for being detected each position on wiring board；
The measured data is handled, the three-dimensional coordinate data of each position is obtained.
3. according to the method described in claim 2, obtaining described it is characterized in that, described handle the measured data
The three-dimensional coordinate data of each position includes：
The measured data is carried out to reject interference processing, obtains the three-dimensional coordinate data of each position.
4. judging whether each three-dimensional feature value meets mark the method according to claim 1, wherein described
Quasi- value includes：
Judge whether each three-dimensional feature value complies with standard value, alternatively, judging each three-dimensional feature value whether pre-
If within the scope of value.
5. according to the method described in claim 4, it is characterized in that, when judging whether each three-dimensional feature value complies with standard
When value, the method also includes：
According to the requirement of the processing quality of the wiring board and production rule, the standard value is determined.
6. according to the method described in claim 4, it is characterized in that, when judging each three-dimensional feature value whether in default threshold
When within the scope of value, the method also includes：
Obtain the design parameter of reference plate line corresponding with the detected wiring board；
According to the design parameter of the reference plate line, the reference three-dimensional coordinate number of each position on the reference plate line is obtained
According to；
According to each described with reference to three-dimensional coordinate data, each reference three-dimensional feature with reference in three-dimensional coordinate data of extraction
Value；
According to each values for determining each three-dimensional feature value with reference to three-dimensional feature value.
7. according to the method described in claim 6, it is characterized in that, the reference three-dimensional feature value includes elevation, gradient magnitude
With direction, contour or height step.
8. method according to any one of claims 1 to 7, which is characterized in that the method also includes：
It counts all defective locations for not meeting the standard value, and draws simulation drawing corresponding with the detected wiring board.
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| JP2018091807A (en) * | 2016-12-07 | 2018-06-14 | オルボテック リミテッド | Defect pass / fail judgment method and apparatus |
| CN110426582B (en) * | 2019-08-07 | 2021-10-15 | 中国商用飞机有限责任公司北京民用飞机技术研究中心 | Line detection system |
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| CN1299465A (en) * | 1998-08-10 | 2001-06-13 | 三菱电机株式会社 | Inspection device for printed circuit board |
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Address after: 100094 Beijing city Haidian District Cui Hunan loop 13 Hospital No. 7 Building 7 room 701 Patentee after: Lingyunguang Technology Co.,Ltd. Address before: 100094 Beijing city Haidian District road Tamatsu wisdom Valley Center Building 2 Patentee before: LUSTER LIGHTTECH GROUP Co.,Ltd. |
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Address after: 100094 701, 7 floor, 7 building, 13 Cui Hunan Ring Road, Haidian District, Beijing. Patentee after: Lingyunguang Technology Co.,Ltd. Address before: 100094 701, 7 floor, 7 building, 13 Cui Hunan Ring Road, Haidian District, Beijing. Patentee before: Beijing lingyunguang Technology Group Co.,Ltd. Address after: 100094 701, 7 floor, 7 building, 13 Cui Hunan Ring Road, Haidian District, Beijing. Patentee after: Beijing lingyunguang Technology Group Co.,Ltd. Address before: 100094 701, 7 floor, 7 building, 13 Cui Hunan Ring Road, Haidian District, Beijing. Patentee before: LUSTER LIGHTTECH GROUP Co.,Ltd. |
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Effective date of registration: 20230713 Address after: 1st Floor - 2nd Floor, Building 2, Xinqi Industrial Park, No. 789, Changning Avenue, High tech Zone, Hefei City, Anhui Province, 230000 Patentee after: Hefei Jiuchuan Intelligent Equipment Co.,Ltd. Address before: 100094 701, 7 floor, 7 building, 13 Cui Hunan Ring Road, Haidian District, Beijing. Patentee before: Lingyunguang Technology Co.,Ltd. |