CN105234516A - Reflow soldering process for electronic component printed circuit board - Google Patents
Reflow soldering process for electronic component printed circuit board Download PDFInfo
- Publication number
- CN105234516A CN105234516A CN201510664219.6A CN201510664219A CN105234516A CN 105234516 A CN105234516 A CN 105234516A CN 201510664219 A CN201510664219 A CN 201510664219A CN 105234516 A CN105234516 A CN 105234516A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- components
- paste
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000005476 soldering Methods 0.000 title claims abstract description 26
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 238000003466 welding Methods 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a reflow soldering process for an electronic component printed circuit board. The reflow soldering process includes the following steps that firstly, a soldering paste screen mesh is manufactured; secondly, missing printing of soldering paste is performed through the screen mesh; thirdly, SMT components are surface-mounted; fourthly, reflow soldering is performed; fifthly, the printed circuit board is cleaned; and sixthly, during double-side mixed assembling, the SMT components are firstly mounted on the side A of the printed circuit board, a surface-mounting and reflow soldering machine is adopted, then the SMT components are mounted on the side B of the printed circuit board, and wave soldering is adopted. According to the reflow soldering process for the electronic component printed circuit board, the SMT components mounted on the printed circuit board are reliable and stable in performance, and normal running of electronic components is not affected.
Description
Technical field
The present invention relates to electronic applications, be specifically related to a kind of electronic devices and components printed circuit board reflow soldering process.
Background technology
Soldering is after the brazing metal heat fused utilizing low melting point, infiltrates and the welding method in gap, added metal part junction.Because solder is often kamash alloy, therefore named.Heating tool made by conventional flatiron.Be widely used in electronics industry, do not have the reliable soldering process of complete set to carry out Instructing manufacture at present.
Summary of the invention
The technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of electronic devices and components printed circuit board reflow soldering process, comprises following step:
(1) solder(ing) paste silk screen is made: according to SMT components and parts position on a printed circuit board and the shape of pad, make the silk screen for solder(ing) paste of biting;
(2) silk screen process solder(ing) paste: silk screen lid on a printed circuit board, bites equably by solder(ing) paste on the electrode pad of components and parts;
(3) SMT components and parts are mounted: SMT components and parts are mounted printed circuit board, makes its electrode accurately be positioned respective pad;
(4) reflow soldering: weld with reflow method;
(5) printed circuit board is cleaned;
(6) carry out two-sided hybrid precast, first load onto SMT components and parts in the A face of printed circuit board, adopt attachment and reflow machine, then paste SMT components and parts in B face, adopt wave soldering.
Further, in step (4) in welding process, solder(ing) paste is dissolved and again flows, fully invade the pad of profit components and parts and circuit board processed.
Further, the cleaning method in step (5) is: adopt supersonic wave cleaning machine, the printed circuit board bubble after welding in inorganic solution, cleans with ultrasonic impact.
The invention has the beneficial effects as follows: a kind of electronic devices and components printed circuit board reflow soldering process provided by the invention, reliable at the SMT components and parts loaded onto of printed circuit board, stable performance, does not affect the normal operation of electronic component.
Detailed description of the invention
Be described principle of the present invention and feature below in conjunction with instantiation, example, only for explaining the present invention, is not intended to limit scope of the present invention.
A kind of electronic devices and components printed circuit board reflow soldering process, comprises following step:
(1) solder(ing) paste silk screen is made: according to SMT components and parts position on a printed circuit board and the shape of pad. make the silk screen for solder(ing) paste of biting;
(2) silk screen process solder(ing) paste: solder(ing) paste silk screen lid on a printed circuit board, solder(ing) paste of biting, plays and accurately ensures that solder(ing) paste is bitten equably on the electrode pad of components and parts;
(3) SMT components and parts are mounted: SMT components and parts are mounted printed circuit board and dies, make their electrode accurately be positioned respective pad;
(4) reflow soldering: weld with reflow method, in welding process, solder(ing) paste dissolves and again flows, and fully invades the pad of profit components and parts and circuit board processed, prevents short circuit between pad;
(5) cleaning printed circuit board and test: due to the volatilization of solder flux in solder reflow process, solder flux not only can remain in the ate electrode of pad, also can be infected with the whole surface of circuit substrate.Therefore, the matting particular importance that reflow soldering is later.Adopt supersonic wave cleaning machine, the printed circuit board bubble after welding in inorganic solution, with ultrasonic impact cleaning, good effect can be obtained.
(6) in two-sided hybrid precast, first load onto SMT components and parts in the A face of printed circuit board, adopt attachment and reflow machine, then paste SMT components and parts in B face, adopt wave soldering.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (3)
1. an electronic devices and components printed circuit board reflow soldering process, is characterized in that, comprises following step:
(1) solder(ing) paste silk screen is made: according to SMT components and parts position on a printed circuit board and the shape of pad, make the silk screen for solder(ing) paste of biting;
(2) silk screen process solder(ing) paste: silk screen lid on a printed circuit board, bites equably by solder(ing) paste on the electrode pad of components and parts;
(3) SMT components and parts are mounted: SMT components and parts are mounted printed circuit board, makes its electrode accurately be positioned respective pad;
(4) reflow soldering: weld with reflow method;
(5) printed circuit board is cleaned;
(6) carry out two-sided hybrid precast, first load onto SMT components and parts in the A face of printed circuit board, adopt attachment and reflow machine, then paste SMT components and parts in B face, adopt wave soldering.
2. electronic devices and components printed circuit board reflow soldering process according to claim 1, is characterized in that, in step (4) in welding process, is dissolved by solder(ing) paste and again flows, and fully invades the pad of profit components and parts and circuit board processed.
3. electronic devices and components printed circuit board reflow soldering process according to claim 1 and 2, is characterized in that, the cleaning method in step (5) is: the printed circuit board bubble after welding in inorganic solution, clean with ultrasonic impact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510664219.6A CN105234516A (en) | 2015-10-14 | 2015-10-14 | Reflow soldering process for electronic component printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510664219.6A CN105234516A (en) | 2015-10-14 | 2015-10-14 | Reflow soldering process for electronic component printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105234516A true CN105234516A (en) | 2016-01-13 |
Family
ID=55032472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510664219.6A Pending CN105234516A (en) | 2015-10-14 | 2015-10-14 | Reflow soldering process for electronic component printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105234516A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105513977A (en) * | 2016-02-01 | 2016-04-20 | 珠海格力电器股份有限公司 | Intelligent power module and packaging method thereof |
| CN106238844A (en) * | 2016-08-01 | 2016-12-21 | 安徽贝莱电子科技有限公司 | A kind of welding procedure of electronic module |
| CN107278048A (en) * | 2017-06-20 | 2017-10-20 | 苏州市狮威电子有限公司 | A kind of SMT typographies and its printing apparatus |
| CN109511221A (en) * | 2018-11-20 | 2019-03-22 | 咸阳威思曼高压电源有限公司 | A kind of circuit connecting method being miniaturized for Digital DC high voltage power supply and the Digital DC high voltage power supply using this method |
| CN109759661A (en) * | 2018-12-29 | 2019-05-17 | 京信通信技术(广州)有限公司 | Welding method for communication device assembly |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050161252A1 (en) * | 2002-03-15 | 2005-07-28 | Dietmar Birgel | Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method |
| CN102123562A (en) * | 2010-12-30 | 2011-07-13 | 东莞生益电子有限公司 | Method for manufacturing metal substrate by adopting reflow soldering |
| CN103002670A (en) * | 2012-11-27 | 2013-03-27 | 陕西航空电气有限责任公司 | Wave crest soldering technique of printed circuit board |
| CN103281874A (en) * | 2013-05-08 | 2013-09-04 | 无锡江南计算技术研究所 | Welding method of pasted electronic element |
| CN103920956A (en) * | 2013-01-11 | 2014-07-16 | 无锡华润安盛科技有限公司 | Reflow process welding method |
| CN104780720A (en) * | 2015-04-20 | 2015-07-15 | 四川盟宝实业有限公司 | Circuit board manufacturing process based on SMT technology |
-
2015
- 2015-10-14 CN CN201510664219.6A patent/CN105234516A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050161252A1 (en) * | 2002-03-15 | 2005-07-28 | Dietmar Birgel | Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method |
| CN102123562A (en) * | 2010-12-30 | 2011-07-13 | 东莞生益电子有限公司 | Method for manufacturing metal substrate by adopting reflow soldering |
| CN103002670A (en) * | 2012-11-27 | 2013-03-27 | 陕西航空电气有限责任公司 | Wave crest soldering technique of printed circuit board |
| CN103920956A (en) * | 2013-01-11 | 2014-07-16 | 无锡华润安盛科技有限公司 | Reflow process welding method |
| CN103281874A (en) * | 2013-05-08 | 2013-09-04 | 无锡江南计算技术研究所 | Welding method of pasted electronic element |
| CN104780720A (en) * | 2015-04-20 | 2015-07-15 | 四川盟宝实业有限公司 | Circuit board manufacturing process based on SMT technology |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105513977A (en) * | 2016-02-01 | 2016-04-20 | 珠海格力电器股份有限公司 | Intelligent power module and packaging method thereof |
| CN105513977B (en) * | 2016-02-01 | 2018-06-26 | 珠海格力电器股份有限公司 | Intelligent power module and packaging method thereof |
| CN106238844A (en) * | 2016-08-01 | 2016-12-21 | 安徽贝莱电子科技有限公司 | A kind of welding procedure of electronic module |
| CN107278048A (en) * | 2017-06-20 | 2017-10-20 | 苏州市狮威电子有限公司 | A kind of SMT typographies and its printing apparatus |
| CN109511221A (en) * | 2018-11-20 | 2019-03-22 | 咸阳威思曼高压电源有限公司 | A kind of circuit connecting method being miniaturized for Digital DC high voltage power supply and the Digital DC high voltage power supply using this method |
| CN109759661A (en) * | 2018-12-29 | 2019-05-17 | 京信通信技术(广州)有限公司 | Welding method for communication device assembly |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160113 |