CN105201871A - Vacuum pumping device for large semiconductor industry - Google Patents
Vacuum pumping device for large semiconductor industry Download PDFInfo
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- CN105201871A CN105201871A CN201410265696.0A CN201410265696A CN105201871A CN 105201871 A CN105201871 A CN 105201871A CN 201410265696 A CN201410265696 A CN 201410265696A CN 105201871 A CN105201871 A CN 105201871A
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Abstract
The invention discloses a vacuum pumping device for the large semiconductor industry (like SEMI PV LED and FPD). A decompression module not needing extra power consumption generates the Venturi effect through external high-pressure carrier gas, pressure of the exhaust end of a vacuum pump is lowered, hence, loads of the vacuum pump are reduced, and the energy-saving purpose of the vacuum pump is achieved. The vacuum pumping device for the large semiconductor industry (like SEMI PV LED and FPD) comprises the vacuum pump and the decompression module used for reducing the loads of the vacuum pump. The vacuum pump comprises a pump body, a pump inlet pipe, five levels of rotors, a pump motor used for driving the rotors to rotate, and a vacuum pipeline used for connecting the vacuum pump and the decompression module. The vacuum pumping device for the large semiconductor industry can be connected with other processing equipment, and the interior of the equipment can be vacuumized.
Description
Technical field
The present invention relates to vacuum acquirement device field, particularly relate to a kind of vacuum pumping device for large semicon industry.
Background technique
The vacuum pumping device 10 of large semicon industry (as SEMIPVLEDFPD etc.) comprises the process cavity being connected to manufacturing equipment or the vacuum pump 20 uploading-unload chamber, vacuum pump comprises the pump housing 21,5 grades of rotor R 1 of the inside, R2, R3, R4, R5, and drive the motor 22 of rotor turns, and the inlet duct 23 of vacuum pump 20; Be linked in sequence in the one-way valve 28 of vacuum pump discharges end and intermediate connection tube road 25, when vacuum pump 20 works, this one-way valve 28 only allows vacuum pump discharges air-flow to atmospheric side; One with the service pump 30 of the relative little pumping speed of one-way valve 28 parallel join and intermediate connection tube road 26, this service pump is used for reducing when vacuum pump wait state the exhaust pressure of vacuum pump 20.
When the stop valve uploaded-unload between chamber and vacuum pump 20 of manufacturing equipment is opened, vacuum pump 20 works and the chamber of uploading-unload of manufacturing equipment is extracted into vacuum state, and now service pump 30 without effect.But when the stop valve uploaded-unload between chamber and vacuum pump 20 of manufacturing equipment turns off, vacuum pump 20 enters wait state, and now service pump 30 starts effect, reduces the exhaust end pressure of vacuum pump 20, thus reduces the load of vacuum pump 20.Especially, the vacuum pump 20 for multilevel hierarchy is positioned at the rotor R 5 of exhaust end relative to R1, accounts for maximum compression ratio, and the power consumption of R5 section accounts for the maximum ratio of vacuum pump total power consumption.Correspondingly service pump 30 can reduce the load putting on R5, thus greatly can reduce the total power consumption of vacuum pump 20.
But the service pump 30 for reducing the exhaust end load of vacuum pump 20 has some problems intrinsic as follows:
1) service pump 30 needs extra acquisition cost.
2) since service pump 30 can not be connected to outlet pipe 25 simply, complicated additional exhaust pipe 26 is needed.This can produce piping cost, installation cost, and sapce charge is used.
3) even if service pump 30 is the pump of little pumping speed relatively, but itself still needs extra power consumption.
To sum up some, adopt service pump to reduce vacuum pump total power consumption and there is intrinsic limitation, do not reach satisfied level.
Summary of the invention
The technical problem to be solved in the present invention is: cost-saving, reduces energy consumption, extends service life of vacuum pump.
For the technological scheme solving the problems of the technologies described above employing is: a kind of vacuum pumping device being used for large semicon industry (as SEMIPVLEDFPD etc.), comprise vacuum pump and the pressure-reduction module for reducing described vacuum pump load, described vacuum pump comprises the pump housing, pumping intake piping, Pyatyi rotor, drives the pump motor of rotor turns and connects the vacuum pipe of described vacuum pump and described pressure-reduction module.
Further: described pressure-reduction module comprises being linked in sequence and to be in charge of at first of described vacuum pump discharges end, be arranged on first to be in charge of and middle only to allow the one-way valve of the exhaust of vacuum pump from vacuum pump to atmospheric pressure side, be in charge of branch's second of bypass one-way valve that is used for out from first to be in charge of, be positioned at second and be in charge of middle vacuum generator, described vacuum generator utilizes outside carrier gas to allow carrier gas flow into from outside, after flow to atmospheric pressure side, thus reduce vacuum pump discharges pressure.
Further: described pressure-reduction module comprises vacuum generator, carrier gas interface, the vacuum pump side flange of the self-locking Flange joint of flat compact and atmospheric pressure side flange, arrange one-way valve in the middle of two flanges, need not change existing vacuum pump discharges end pipeline;
Further: described pressure-reduction module is seal-installed in protection box, and described protection box periphery comprises carrier gas suction tude and flange, connects vacuum pump discharges side ducts and flange, and atmospheric exhaust pipeline and flange.
Further: described vacuum generator comprises the inducer allowing outside carrier gas flow into, allow the outlet section that carrier gas is flowed out, connect the cross section of inducer and outlet section, and be connected to the intermediate section on cross section, also comprise the second inlet tube be in charge of linked together with intermediate section.
Further: the connection inducer of described vacuum generator and the cross section of outlet section to be compared with outlet section cross section with inducer and diminished suddenly, thus the flow velocity of carrier gas is increased in rain.
Further: described vacuum pump is connected with the chamber of uploading-unload of manufacturing equipment by vacuum pipe, and described vacuum pipe arranges stop valve.
Vacuum pumping device for large semicon industry (as SEMIPVLEDFPD etc.) of the present invention, the pressure-reduction module comprised utilizes high pressure draught and Venturi effect to reduce the pressure of vacuum pump discharges end, owing to only using carrier gas, this module does not need extra power consumption, just can reduce the load of vacuum pump thus arrive energy-conservation object.
This pressure-reduction module comprises being linked in sequence in first of vacuum pump discharges end and is in charge of; One is installed on first and is in charge of the one-way valve flowing to atmospheric side when only making vacuum pump work be vented from vacuum pump; Be in charge of branch's second of bypass one-way valve that is used for out from first for one to be in charge of; One is installed on the second vacuum generator be in charge of, this vacuum generator accesses high pressure carrier gas from outside, produce hypotensive effect by Venturi effect, thus allow the exhaust pressure of vacuum pump reduce, allow air-flow flow to atmospheric side by vacuum generator when vacuum pump is in wait state.
The entrance that vacuum generator comprises carrier gas intake channel and passes through; Be connected to the gas outlet section that second is in charge of atmospheric pressure side; Connect the intermediate section of the cross section of entrance and outlet section.When carrier gas to flow to from entry end that the process of outlet section, cross section sharply diminishes, the flow velocity of carrier gas suddenly increases, and produces Venturi effect, thus produces pressure drop effect at intermediate section.
Accompanying drawing explanation
Fig. 1 is vacuum pumping device structure diagram of the present invention;
Fig. 2 is vacuum pumping device structural representation of the present invention;
Fig. 3 is vacuum pumping device vacuum generator connecting port of the present invention sketch;
Fig. 4 is vacuum pumping device pressure-reduction module schematic diagram of the present invention;
Fig. 5 is a kind of embodiment ERM model of pressure-reduction module of the present invention structural representation;
Fig. 6 is pressure-reduction module of the present invention another kind of embodiment e-SAVER model structural representation;
Fig. 7 is vacuum pumping device pressure-reduction module gas path figure of the present invention;
Fig. 8 is vacuum pumping device pressure-reduction module energy saving ratio figure of the present invention.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention will be further described.
The invention provides a kind of cost low, energy consumption is low, the vacuum pumping device of the large semicon industry (as SEMIPVLEDFPD etc.) that service life of vacuum pump is long.A kind of vacuum pumping device being used for large semicon industry (as SEMIPVLEDFPD etc.), comprise vacuum pump and the pressure-reduction module for reducing described vacuum pump load, described vacuum pump comprises the pump housing, pumping intake piping, Pyatyi rotor, drives the pump motor of rotor turns and connects the vacuum pipe of described vacuum pump and described pressure-reduction module.
The vacuum pumping device of the large semicon industry of the present invention (as SEMIPVLEDFPD etc.), as shown in Figure 1, the vacuum pumping device of a band pressure-reduction module 200 is connected to the process cavity 110 of manufacturing equipment or uploads-unload chamber 120, multistage vacuum pump 130, be used for reducing the pressure-reduction module 200 of vacuum pump 130 exhaust pressure, the connecting tube 151 uploading-unload chamber and vacuum pump 130 of Joining Technology equipment, connect the connecting tube 153 of vacuum pump 130 and pressure-reduction module 200, and be connected to the stop valve 140 uploaded-unload in the middle of chamber and vacuum pump 130 of manufacturing equipment.
Pressure-reduction module 200 is simply by the Flange joint of the exhaust duct 153 of vacuum pump 130, service pump unlike traditional approach needs extra pipeline and power consumption, the load of vacuum pump 130 can be reduced equally significantly, reach the effect significantly reducing vacuum pump 130 energy consumption.
As shown in Figure 2, vacuum pumping device of the present invention comprises vacuum pump 130 and pressure-reduction module 200.Vacuum pump 130 comprises the pump housing 131, pumping intake piping 133, pump 5 grades of rotor R 1, R2, R3, R4, R5, pump motor 132, and connecting tube 153. pressure-reduction module 200 connecting vacuum pump 130 and pressure-reduction module 200 comprises a vacuum generator 210, the first and is in charge of 232a232b, be positioned at first and be in charge of single-phase valve 220 in the middle of 232a232b, be in charge of 233a233b with second of one-way valve 220 parallel join, be positioned at second and be in charge of the middle vacuum generator 210 of 233a233b.
As shown in Figure 3, three segment interfaces of vacuum generator 210, comprise carrier gas inlet section 211, outlet section 212, connect the intermediate section 213 on the cross section of entrance 211 and outlet section 212.
As shown in Figure 4, the principle of pressure-reduction module of the present invention is: pressure-reduction module 200 comprises a vacuum generator 210, first is in charge of 232a232b, be in first and be in charge of the middle single-phase valve 220 of 232a232b, be in charge of 233a233b with second of one-way valve 220 parallel join, be in second and be in charge of the middle vacuum generator 210 of 233a233b; And three of periphery inlet tubes and flanges: carrier gas suction tude 235 and flange 235a, connect vacuum pump discharges side ducts 231 and flange 231a, and atmospheric side exhaust duct 234 and flange 234a.
Vacuum generator 210 comprises carrier gas inlet section 211, outlet section 212, connect the intermediate section 213 on the cross section of entrance 211 and outlet section 212, vacuum generator 210 comprises a Venturi tube, suddenly sharply reduce at the transitioning cross-sectional of entrance 211 and outlet section 212, when high pressure carrier gas flows through from entrance 211 cross section sharply diminished, gas flow rate suddenly increases, due to Venturi effect, the intermediate section 213 be connected on transitioning cross-sectional produces pressure to be reduced, pressure drop is delivered to second and is in charge of 233a, arrives the pipeline 231 connecting vacuum pump discharges end.
One-way valve 220 is installed on first and is in charge of between 232a and 232b, and when vacuum pump normally works, vacuum pump discharges pushes one-way valve open, allows the exhaust of vacuum pump flow to atmospheric side by means of only one-way valve 220; When vacuum pump 130 is in wait state, the exhaust of vacuum pump 130 flows to atmospheric side by being installed on the second vacuum generator 210 being in charge of 233a and 233b, due to the hypotensive effect of vacuum generator 210, the exhaust pressure of vacuum pump is significantly reduced, reduce vacuum pump load, reach energy-conservation object.
As shown in Figure 5; ERM model, pressure-reduction module 200 is packaged in a protection box 240, and box periphery comprises three inlet tubes and flange: carrier gas suction tude 235 and flange 235a; connect vacuum pump discharges side ducts 231 and flange 231a, and atmospheric side exhaust duct 234 and flange 234a.
As shown in Figure 6, e-SAVER model, it is the another kind of embodiment structural representation of pressure-reduction module of the present invention, described pressure-reduction module comprises vacuum generator, connect the carrier gas interface of vacuum generator, the vacuum pump side flange of the self-locking Flange joint of flat compact and atmospheric pressure side flange, arrange one-way valve in the middle of two flanges, the Interface design due to flat compact need not change existing vacuum pump discharges end pipeline.
As shown in Figure 7, specific works process of the present invention is as follows: when manufacturing equipment upload-unload chamber 120 need certain working vacuum to spend time, the stop valve 140 uploaded-unload in the middle of chamber 120 of vacuum pump 130 and manufacturing equipment is opened, vacuum pump starts the work of bleeding, now vaccum pump motor 132 rotor driven R1, R2, R3, R4, R5 High Rotation Speed compresses, the gas uploading-unload chamber of manufacturing equipment is sucked from the import 133 of vacuum pump 130 by stop valve 140 and connecting tube 151, by being discharged to the connecting tube 153 of vacuum pump 130 and this pressure-reduction module 200 after the pump housing 131, reach the vacuum pump discharges side entrance pipeline 231 of this pressure-reduction module, because exhaust pressure is larger, push open and be positioned at the one-way valve 220 that first is in charge of 232a and 232b centre, gas is discharged to the atmospheric exhaust side 234 of pressure-reduction module, discharge finally by 155 pipelines.
When the degree of vacuum uploading-unload chamber 120 of manufacturing equipment to fill N2 or Ar gas to discharge vacuum time, now stop valve 140 is closed, and now vacuum pump enters wait state, and pressure-reduction module 200 starts effect.First, carrier gas enters entrance 211 by inlet pipe 235, cross section subsequently through reducing suddenly, now flow rate of carrier gas suddenly increases, now flow velocity increases more, obtain pressure drop at transitioning cross-sectional more, thereupon more in the pressure drop of intermediate section 213, the pressure drop being delivered to vacuum pump inlet side ducts 231 is more.Carrier gas, by after transitioning cross-sectional, enters the outlet section 234 of atmospheric pressure side, discharges finally by 155 pipelines.Usual vacuum pump discharges pressure ratio 1013mabr is slightly large, and vacuum pump 130 exhaust pressure pressure can be dropped to below 100mabr by pressure-reduction module 200.
Chat as front, because the Mo-Co catalyst of the rotor R 1R2R3R4R5 of vacuum pump 130 increases progressively, in R5 section because compression ratio is maximum, account for vacuum pump maximum load, if the exhaust pressure of vacuum pump 130 is dropped to below 100mbar from close to barometric pressure by pressure-reduction module 200, then greatly can reduce the compression ratio of R5 section, namely the load of R5 section greatly be reduced, after usual installation pressure-reduction module 200, vacuum pump can be made in the lower power consumption of wait state more than at least 50%.Simultaneously extra benefit is the reduction due to vacuum pump total load, and the time of holding state is at least the over half of cumulative time, the also corresponding prolongation in working life of vacuum pump.
As shown in Figure 8, suppose that power consumption when not installing this pressure-reduction module 200 is 100%, if when then pressure-reduction module 200 is installed, power consumption can be reduced to original 47%, namely can save power consumption 53%.
Save even if contrast traditional power consumption adding service pump 3042%, the power consumption that this pressure-reduction module 200 can obtain 11% than service pump 30 more is saved.Consider that pressure-reduction module 200 does not need extra power consumption, the power consumption saving that in fact technology of pressure-reduction module contrast service pump 30 obtains can be more.
The data recorded on Alcatel vacuum pump A100L shown in Fig. 8, experimental condition is: the volume uploading-unload chamber 120 of manufacturing equipment is 70 liters, when without any (reference value) when energy saving device, A100L is 1629W at the average power consumption of wait state, if the pressure of the carrier gas used is 5kgf/cm2. install pressure-reduction module 200, then average power consumption drops to 766W, if with service pump 30, then average power consumption is 947W; So pressure-reduction module 200 can drop to the power consumption only having original 47%, service pump 30 can only drop to 58% of original power consumption and not consider the power consumption of service pump itself.So use pressure-reduction module 200 on A100L after, the stand-by power consumption of A100L has fallen more than 50%.
Due to the embodiment that this pressure-reduction module 200 is simple Flange joint, particularly flat compact-type, can use immediately after installation, obtain energy-conservation effect immediately.
Even if optimum implementation of the present invention elaborates in this patent, the present invention also may have some and change, the embodiment of amendment or equivalence, as the difference of the diameter of vacuum pipe, the pipe diameter that correspondingly different model of this pressure-reduction module is corresponding different, as NW25NW40NW50, correspondingly the present invention is not limited to the statement done at this.
Claims (7)
1. the vacuum pumping device for large semicon industry, it is characterized in that, comprise vacuum pump and the pressure-reduction module for reducing described vacuum pump load, described vacuum pump comprises the pump housing, pumping intake piping, Pyatyi rotor, drives the pump motor of rotor turns and connects the vacuum pipe of described vacuum pump and described pressure-reduction module.
2. the vacuum pumping device for large semicon industry of a claim 1, it is characterized in that, described pressure-reduction module comprises being linked in sequence and to be in charge of at first of described vacuum pump discharges end, be arranged on first be in charge of middle part only allow the one-way valve of the exhaust of vacuum pump from vacuum pump to atmospheric pressure side, be in charge of branch's second of bypass one-way valve that is used for out from first to be in charge of, be positioned at second and be in charge of middle vacuum generator, described vacuum generator utilizes external high pressure carrier gas to allow carrier gas flow into from outside, after flow to atmospheric pressure side, thus reduce vacuum pump discharges pressure.
3. the vacuum pumping device for large semicon industry of a claims 1 or 2; it is characterized in that; described pressure-reduction module is seal-installed in protection box; described protection box periphery comprises carrier gas suction tude and flange; connect vacuum pump discharges side ducts and flange, and atmospheric exhaust pipeline and flange.
4. the vacuum pumping device for large semicon industry of a claims 1 or 2, it is characterized in that, described pressure-reduction module comprises vacuum generator, carrier gas interface, the vacuum pump side flange of the self-locking Flange joint of flat compact and atmospheric pressure side flange, in the middle of two flanges, one-way valve is set, existing vacuum pump discharges end pipeline need not be changed.
5. the vacuum pumping device for large semicon industry according to claim 3 or 4, it is characterized in that, described vacuum generator comprises the inducer allowing outside carrier gas flow into, allow the outlet section that carrier gas is flowed out, connect the cross section of inducer and outlet section, and the intermediate section be connected on cross section, also comprise the second inlet tube be in charge of linked together with intermediate section.
6. the vacuum pumping device for large semicon industry according to claim 3 or 4, it is characterized in that, the connection inducer of described vacuum generator and the cross section of outlet section to be compared with outlet section cross section with inducer and are diminished suddenly, thus the flow velocity of carrier gas is increased in rain.
7. the vacuum pumping device for large semicon industry according to claims 1 or 2, is characterized in that, described vacuum pump is connected with the chamber of uploading-unload of manufacturing equipment by vacuum pipe, and described vacuum pipe arranges stop valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410265696.0A CN105201871A (en) | 2014-06-16 | 2014-06-16 | Vacuum pumping device for large semiconductor industry |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410265696.0A CN105201871A (en) | 2014-06-16 | 2014-06-16 | Vacuum pumping device for large semiconductor industry |
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| Publication Number | Publication Date |
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| CN105201871A true CN105201871A (en) | 2015-12-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410265696.0A Pending CN105201871A (en) | 2014-06-16 | 2014-06-16 | Vacuum pumping device for large semiconductor industry |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106813100A (en) * | 2016-12-13 | 2017-06-09 | 上海申克机械有限公司 | A kind of new vacuum treatment installation and method for the inflammable and explosive media environment of high pressure |
| CN113446269A (en) * | 2020-03-27 | 2021-09-28 | 信强(宁波)半导体设备制造有限公司 | Vacuum pump and energy saving device |
| CN113446270A (en) * | 2020-03-27 | 2021-09-28 | 信强(宁波)半导体设备制造有限公司 | Vacuum pump and energy saving device |
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| JPH09250475A (en) * | 1996-03-14 | 1997-09-22 | Chubu Corp:Kk | Vacuum pump |
| CN1541307A (en) * | 2001-09-06 | 2004-10-27 | ���ƹɷ�����˾ | Vacuum exhaust appts. and drive method of vacuum appts. |
| JP2009024577A (en) * | 2007-07-19 | 2009-02-05 | Miura Co Ltd | Method for judging abnormality in degree of vacuum and device thereof |
| CN103727043A (en) * | 2014-01-03 | 2014-04-16 | 顾发华 | Two-stage centrifugal compressor and method for providing air for static pressure gas bearings of two-stage centrifugal compressor |
| CN204099236U (en) * | 2014-06-16 | 2015-01-14 | 上海协微精密机械有限公司 | For the vacuum pumping device of large semicon industry |
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2014
- 2014-06-16 CN CN201410265696.0A patent/CN105201871A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09250475A (en) * | 1996-03-14 | 1997-09-22 | Chubu Corp:Kk | Vacuum pump |
| CN1541307A (en) * | 2001-09-06 | 2004-10-27 | ���ƹɷ�����˾ | Vacuum exhaust appts. and drive method of vacuum appts. |
| JP2009024577A (en) * | 2007-07-19 | 2009-02-05 | Miura Co Ltd | Method for judging abnormality in degree of vacuum and device thereof |
| CN103727043A (en) * | 2014-01-03 | 2014-04-16 | 顾发华 | Two-stage centrifugal compressor and method for providing air for static pressure gas bearings of two-stage centrifugal compressor |
| CN204099236U (en) * | 2014-06-16 | 2015-01-14 | 上海协微精密机械有限公司 | For the vacuum pumping device of large semicon industry |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106813100A (en) * | 2016-12-13 | 2017-06-09 | 上海申克机械有限公司 | A kind of new vacuum treatment installation and method for the inflammable and explosive media environment of high pressure |
| CN113446269A (en) * | 2020-03-27 | 2021-09-28 | 信强(宁波)半导体设备制造有限公司 | Vacuum pump and energy saving device |
| CN113446270A (en) * | 2020-03-27 | 2021-09-28 | 信强(宁波)半导体设备制造有限公司 | Vacuum pump and energy saving device |
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Application publication date: 20151230 |