CN105188267A - Method for mirroring production of FPC (Flexible Printed Circuit) single panel - Google Patents
Method for mirroring production of FPC (Flexible Printed Circuit) single panel Download PDFInfo
- Publication number
- CN105188267A CN105188267A CN201510571574.9A CN201510571574A CN105188267A CN 105188267 A CN105188267 A CN 105188267A CN 201510571574 A CN201510571574 A CN 201510571574A CN 105188267 A CN105188267 A CN 105188267A
- Authority
- CN
- China
- Prior art keywords
- rtr
- sided board
- surface treatment
- dry film
- circuit pack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a method for mirroring production of a FPC (Flexible Printed Circuit) single panel. The method comprises the following steps: (1), performing RTR (Reel-to-Reel) whole-reel lamination; (2), performing RTR surface treatment; (3), laminating a dry film; (4), performing RTR exposure; (5), performing RTR development; (6), performing RTR etching; (7), performing RTR stripping; (8), performing RTR target punching; (9), performing RTR surface treatment; (10), performing RTR cutting; (11), laminating a coverage film; (12), laminating; (13), performing surface treatment; (14), chemically plating gold; (15), performing screen printing; (16), performing O/S electrical testing; and (17), processing into a large sheet. Compared with the prior art, two single panels are combined through one-time whole reeling by utilizing micro-viscous glue; then, subsequent mirroring processes are carried out; therefore, the capacity in a unit time is greatly improved; and the production efficiency is increased.
Description
Technical field
The present invention relates to a kind of method that mirror image produces FPC single sided board.
Background technology
Flexible PCB is that the one made for base material with polyimides or polyester film has height reliability, excellent flexual printed circuit board (PCB), it has the features such as distribution density is high, lightweight, thickness is thin, bending property is good, is thus widely used in various field.
Flexible PCB generally comprises lamina and multi-layer sheet, existing lamina is generally whole production, then size is cut into spiral-plate according to the rules, even if adopt RTR (automated production of entire volume formula) operation, also can only be the RTR normal operation of single sided board, production efficiency be relatively low.
Therefore, be necessary to provide a kind of new production method to solve the problems referred to above.
Summary of the invention
A kind of mirror image that can enhance productivity is the object of the present invention is to provide to produce the method for FPC single sided board.
To achieve these goals, the technical solution adopted in the present invention is as follows:
Mirror image produces a method for FPC single sided board, comprises the following steps:
1) RTR entire volume laminating: two single sided boards are formed false double sided board by micro-mucous membrane specular bonding, described single sided board comprises substrate layer and copper foil layer, described substrate layer and described copper foil layer compound, in described false double sided board, the substrate layer of single sided board described in one of them and the substrate layer of single sided board described in another are by described micro-mucoadhesive;
2) RTR surface treatment: carry out chemical surface treatment to described copper foil layer, removes oxide and the pollutant on copper foil layer surface;
3) pressing dry film: dry film is pressed on described copper foil layer;
4) RTR exposure: utilize image transfer method, the form exposed described dry film by ultraviolet, is transferred to the circuit shape of needs on the dry film be exposed;
5) RTR development: chemically remove unexposed dry film, expose part copper layers of foil to be etched;
6) RTR etching: chemically etch away the described part copper layers of foil exposed in development step, the not etched part of described copper foil layer forms the circuit pack needed;
7) RTR striping: remove exposed dry film with highly basic, exposes described circuit pack;
8) RTR target punching: utilize target impact machine to carry out punching process to described false double sided board, forms location hole, hole in piece part, instrument connection and installing hole;
9) RTR surface treatment: chemical surface treatment is carried out to described circuit pack;
10) RTR cutting: the false double sided board of rolling is cut into individual false double sided board;
11) laminating coverlay: coverlay is attached on described circuit pack;
12) pressing: carry out hot-pressing processing to described coverlay and described circuit pack, makes described coverlay and described circuit pack compound;
13) surface treatment: again surface treatment is carried out to the exposed part of described circuit pack;
14) gold is changed: the part exposed to described circuit pack carries out chemical gilding process;
15) wire mark: with the two sides mirror image printing word of silk screen at described false double sided board;
16) O/S electrical measurement: open circuit and the short circuit connection of testing described circuit pack;
17) processing is opened greatly: utilize vacuum suction platform that described false double sided board is separated into two single sided boards.
Preferably, in step 2), step 9) and step 13) in, described surface treatment all adopts phosphate solution process.
Preferably, in step 5) in, adopt developer solution to remove unexposed dry film, described developer solution adopts K
2cO
3solution, the temperature of described developer solution is 35 DEG C, and concentration is 2.1%, sprays as 2.3kg/cm2.
Preferably, in step 6) in, adopt etching solution to etch described part copper layers of foil, described etching solution adopts acidic cupric chloride solutions, and the temperature of described etching solution is 56 DEG C, sprays as 3.3kg/cm2.
Preferably, in step 7) in, adopt temperature be 55 DEG C, concentration be 2.3% NaOH remove exposed dry film.
Compared with prior art, the beneficial effect that mirror image of the present invention produces the method for FPC single sided board is: the present invention first utilizes micro-viscose glue through an entire volume combination two major parts single sided board, carry out mirror image processing subsequent handling again, substantially increase the production capacity in the unit interval, improve production efficiency.
Embodiment
Below in conjunction with specific embodiment, the present invention is described further.
Mirror image produces a method for FPC single sided board, comprises the following steps:
1) RTR entire volume laminating: two single sided boards are formed false double sided board by micro-mucous membrane specular bonding, described micro-mucous membrane adopts Japanese SOMATACPS-8100DW, the vary stable of this colloid adhesion, the tolerance adaptability of liquid medicine is good, operation is without cull, thermal endurance is better, and glue-line is not siliceous, it is easier to peel off, described single sided board comprises substrate layer and copper foil layer, described substrate layer and described copper foil layer compound, in described false double sided board, the substrate layer of single sided board described in one of them and the substrate layer of single sided board described in another are by described micro-mucoadhesive,
2) RTR surface treatment: carry out chemical surface treatment to described copper foil layer, removes oxide and the pollutant on copper foil layer surface;
3) pressing dry film: dry film is pressed on described copper foil layer;
4) RTR exposure: utilize image transfer method, the form described dry film exposed by ultraviolet, the dry film polymerization reaction take place making to be exposed sclerosis, thus the circuit shape of needs is transferred on the dry film that is exposed;
5) RTR development: chemically remove unexposed dry film, expose part copper layers of foil to be etched;
6) RTR etching: chemically etch away the described part copper layers of foil exposed in development step, the not etched part of described copper foil layer forms the circuit pack needed;
7) RTR striping: remove exposed dry film with highly basic, exposes described circuit pack;
8) RTR target punching: utilize target impact machine to carry out punching process to described false double sided board, forms location hole, hole in piece part, instrument connection and installing hole;
9) RTR surface treatment: chemical surface treatment is carried out to described circuit pack;
10) RTR cutting: the false double sided board of rolling is cut into individual false double sided board;
11) laminating coverlay: coverlay is attached on described circuit pack, adopts 500 wide cut laminators and 10 writing brush core operations in the present embodiment, improve pad pasting efficiency and pad pasting effect;
12) pressing: carry out hot-pressing processing to described coverlay and described circuit pack, makes described coverlay and described circuit pack compound;
13) surface treatment: again surface treatment is carried out to the exposed part of described circuit pack;
14) gold is changed: the part exposed to described circuit pack carries out chemical gilding process;
15) wire mark: with silk screen at the two sides mirror image printing word of described false double sided board, the word of printing or symbol can be used for marking the installation site of electronic component;
16) O/S electrical measurement: open circuit and the short circuit connection of testing described circuit pack;
17) processing is opened greatly: utilize vacuum suction platform that described false double sided board is separated into two single sided boards.
In the present embodiment, in step 2), step 9) and step 13) in, described surface treatment all adopts phosphate solution process.In step 5) in, adopt developer solution to remove unexposed dry film, described developer solution adopts K
2cO
3solution, the temperature of described developer solution is 35 DEG C, and concentration is 2.1%, sprays as 2.3kg/cm2.In step 6) in, adopt etching solution to etch described part copper layers of foil, described etching solution adopts acidic cupric chloride solutions, and wherein, the main component of acidic cupric chloride solutions is: CuCl
2and HCL, reaction principle is Cu+CuCl
2→ Cu
2cl
2, Cu
2cl
2+ 4Cl
-→ 2 (CuCl
3)
2-, the temperature of described etching solution is 56 DEG C, sprays as 3.3kg/cm2.In step 7) in, adopt temperature be 55 DEG C, concentration be 2.3% NaOH remove exposed dry film.、
In the present invention; the composition of described dry film mainly comprises PE (polyethylene), photosensitive resist and PET (PETG); the component of described PE and PET is than being 1:1, and this proportioning mode can improve dry film to the protection of copper foil layer and buffer action.Photosensitive resist comprises bridging agent, initiator, monomer, adhesion promoter and colorant.Temperature when pasting dry film is 116 DEG C, and pressure is 36-37PSI, and speed is 1.3 ms/min.
In sum, the present invention utilizes micro-viscose glue through an entire volume combination two major parts single sided board, then carries out mirror image processing subsequent handling, compared to existing production process, within the same time, production capacity is improved 2 times, substantially increases production efficiency.
Schematically above be described the present invention and execution mode thereof, this description does not have restricted, and actual structure is not limited thereto.So, if those of ordinary skill in the art enlightens by it, when not departing from the invention aim, designing the frame mode similar to this technical scheme and embodiment without creationary, all should protection scope of the present invention be belonged to.
Claims (5)
1. mirror image produces a method for FPC single sided board, it is characterized in that, comprises the following steps:
1) RTR entire volume laminating: two single sided boards are formed false double sided board by micro-mucous membrane specular bonding, described single sided board comprises substrate layer and copper foil layer, described substrate layer and described copper foil layer compound, in described false double sided board, the substrate layer of single sided board described in one of them and the substrate layer of single sided board described in another are by described micro-mucoadhesive;
2) RTR surface treatment: carry out chemical surface treatment to described copper foil layer, removes oxide and the pollutant on copper foil layer surface;
3) pressing dry film: dry film is pressed on described copper foil layer;
4) RTR exposure: utilize image transfer method, the form exposed described dry film by ultraviolet, is transferred to the circuit shape of needs on the dry film be exposed;
5) RTR development: chemically remove unexposed dry film, expose part copper layers of foil to be etched;
6) RTR etching: chemically etch away the described part copper layers of foil exposed in development step, the not etched part of described copper foil layer forms the circuit pack needed;
7) RTR striping: remove exposed dry film with highly basic, exposes described circuit pack;
8) RTR target punching: utilize target impact machine to carry out punching process to described false double sided board, forms location hole, hole in piece part, instrument connection and installing hole;
9) RTR surface treatment: chemical surface treatment is carried out to described circuit pack;
10) RTR cutting: the false double sided board of rolling is cut into individual false double sided board;
11) laminating coverlay: coverlay is attached on described circuit pack;
12) pressing: carry out hot-pressing processing to described coverlay and described circuit pack, makes described coverlay and described circuit pack compound;
13) surface treatment: again surface treatment is carried out to the exposed part of described circuit pack;
14) gold is changed: the part exposed to described circuit pack carries out chemical gilding process;
15) wire mark: with the two sides mirror image printing word of silk screen at described false double sided board;
16) O/S electrical measurement: open circuit and the short circuit connection of testing described circuit pack;
17) processing is opened greatly: utilize vacuum suction platform that described false double sided board is separated into two single sided boards.
2. mirror image as claimed in claim 1 produces the method for FPC single sided board, it is characterized in that: in step 2), step 9) and step 13) in, described surface treatment all adopts phosphate solution process.
3. mirror image as claimed in claim 1 produces the method for FPC single sided board, it is characterized in that: in step 5) in, adopt developer solution to remove unexposed dry film, described developer solution adopts K
2cO
3solution, the temperature of described developer solution is 35 DEG C, and concentration is 2.1%, sprays as 2.3kg/cm
2.
4. utilize laser to window as claimed in claim 1 and make the method for FPC hollowed-out board, it is characterized in that, in step 6) in, etching solution is adopted to etch described part copper layers of foil, described etching solution adopts acidic cupric chloride solutions, and the temperature of described etching solution is 56 DEG C, sprays as 3.3kg/cm
2.
5. utilize laser to window as claimed in claim 1 and make the method for FPC hollowed-out board, it is characterized in that, in step 7) in, adopt temperature to be 55 DEG C, concentration be 2.3% NaOH remove exposed dry film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510571574.9A CN105188267A (en) | 2015-09-10 | 2015-09-10 | Method for mirroring production of FPC (Flexible Printed Circuit) single panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510571574.9A CN105188267A (en) | 2015-09-10 | 2015-09-10 | Method for mirroring production of FPC (Flexible Printed Circuit) single panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105188267A true CN105188267A (en) | 2015-12-23 |
Family
ID=54910037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510571574.9A Pending CN105188267A (en) | 2015-09-10 | 2015-09-10 | Method for mirroring production of FPC (Flexible Printed Circuit) single panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105188267A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107750095A (en) * | 2017-09-15 | 2018-03-02 | 深圳崇达多层线路板有限公司 | A kind of pad pasting preparation method of multihole lamina |
| CN110611992A (en) * | 2019-08-16 | 2019-12-24 | 珠海超群电子科技有限公司 | Efficient single-side FPC board processing method |
| CN110933846A (en) * | 2019-11-29 | 2020-03-27 | 盐城维信电子有限公司 | Manufacturing method for back-to-back process of coiled material flexible circuit board |
| CN114040575A (en) * | 2021-10-18 | 2022-02-11 | 盐城维信电子有限公司 | Processing method for back-to-back process of coiled flexible circuit board and circuit board product |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1220413A (en) * | 1997-11-07 | 1999-06-23 | 可隆株式会社 | Dry film photoresist |
| US20030207211A1 (en) * | 2002-05-01 | 2003-11-06 | Mektec Corporation | Process for massively producing tape type flexible printed circuits |
| CN1984534A (en) * | 2005-12-15 | 2007-06-20 | 比亚迪股份有限公司 | Production of flexible printing circuit board |
| CN101634809A (en) * | 2008-07-23 | 2010-01-27 | 比亚迪股份有限公司 | Method for exposing single-sided flexible circuit board |
| CN103731993A (en) * | 2014-01-17 | 2014-04-16 | 杨秀英 | Machining method for single-side flexible printed circuit board |
-
2015
- 2015-09-10 CN CN201510571574.9A patent/CN105188267A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1220413A (en) * | 1997-11-07 | 1999-06-23 | 可隆株式会社 | Dry film photoresist |
| US20030207211A1 (en) * | 2002-05-01 | 2003-11-06 | Mektec Corporation | Process for massively producing tape type flexible printed circuits |
| CN1984534A (en) * | 2005-12-15 | 2007-06-20 | 比亚迪股份有限公司 | Production of flexible printing circuit board |
| CN101634809A (en) * | 2008-07-23 | 2010-01-27 | 比亚迪股份有限公司 | Method for exposing single-sided flexible circuit board |
| CN103731993A (en) * | 2014-01-17 | 2014-04-16 | 杨秀英 | Machining method for single-side flexible printed circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107750095A (en) * | 2017-09-15 | 2018-03-02 | 深圳崇达多层线路板有限公司 | A kind of pad pasting preparation method of multihole lamina |
| CN110611992A (en) * | 2019-08-16 | 2019-12-24 | 珠海超群电子科技有限公司 | Efficient single-side FPC board processing method |
| CN110933846A (en) * | 2019-11-29 | 2020-03-27 | 盐城维信电子有限公司 | Manufacturing method for back-to-back process of coiled material flexible circuit board |
| CN114040575A (en) * | 2021-10-18 | 2022-02-11 | 盐城维信电子有限公司 | Processing method for back-to-back process of coiled flexible circuit board and circuit board product |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103687344B (en) | Circuit board manufacturing method | |
| CN101374386B (en) | Method for preparing printed circuit board | |
| KR101022873B1 (en) | Manufacturing method of printed circuit board | |
| CN105813403A (en) | Method of manufacturing multilayer rigid-flexible printed circuit board | |
| CN104582309A (en) | Rigid-flex circuit board and manufacturing method thereof | |
| JP2006073984A (en) | Resistor built-in printed circuit board and its manufacturing method | |
| TW201401464A (en) | Package substrate, method for manufacturing same, and package structure | |
| US8181339B2 (en) | Method of manufacturing a printed circuit board | |
| CN103249264A (en) | Method for manufacturing multi-layer circuit board with internal connecting finger | |
| CN105188267A (en) | Method for mirroring production of FPC (Flexible Printed Circuit) single panel | |
| TW200412205A (en) | Double-sided printed circuit board without via holes and method of fabricating the same | |
| JP2004335807A (en) | Manufacturing method of wiring circuit substrate | |
| JP2002299792A (en) | Method of manufacturing electronic component adopting wet etching, electronic component and suspension for hard disk | |
| CN102300413A (en) | Manufacturing method of circuit board with identification code | |
| CN107124830A (en) | A kind of preparation method of FPC soft boards circuit | |
| CN107592738A (en) | A kind of flexible circuit board and its manufacturing method, electronic equipment | |
| CN101460011A (en) | Circuit board manufacturing method and circuit board | |
| CN105208778B (en) | A kind of production method of chip production high density flexible printed circuit board | |
| CN105163503A (en) | Method for fabricating hollowed-out board of flexible printed circuit (FPC) by laser windowing | |
| CN103747614A (en) | Multi-sample-based spliced board and production process for same | |
| CN104735899A (en) | Flexible circuit board and manufacturing method thereof | |
| CN112996259B (en) | Manufacturing method of circuit boards with different copper thicknesses | |
| JP2009099831A (en) | Method of manufacturing wiring board | |
| CN103857176A (en) | Circuit board and manufacture method for the same | |
| CN102413646B (en) | Manufacturing method of circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151223 |