CN105187596A - Automatic temperature rise testing device and method - Google Patents
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Abstract
本发明适用于自动化检测领域，提供了一种自动温升测试装置，用于对一电子设备的各个工作模块进行温升测试，其包括微控制器及与微控制器电连接的温度传感器、热成像仪。温度传感器感测当前环境温度。热成像仪在微控制器的控制下每隔一预定时间对各个工作模块的工作温度进行一次测试。微控制器读取温度传感器所感测的当前环境温度，并判断当前环境温度是否是最佳测试温度，若是最佳测试温度，则读取热成像仪的测试数据，并根据测试数据制成各个工作模块的温度变化图。自动温升测试装置不需要人工参与，能自动进行温升测试，方便快捷且测试数据准确。本发明还涉及一种自动温升测试方法。
The present invention is applicable to the field of automatic detection, and provides an automatic temperature rise test device, which is used to test the temperature rise of each working module of an electronic device, which includes a microcontroller, a temperature sensor electrically connected to the microcontroller, a thermal imager. The temperature sensor senses the current ambient temperature. Under the control of the microcontroller, the thermal imager tests the working temperature of each working module every predetermined time. The microcontroller reads the current ambient temperature sensed by the temperature sensor, and judges whether the current ambient temperature is the best test temperature. If it is the best test temperature, it reads the test data of the thermal imager, and makes each work according to the test data. The temperature change diagram of the module. The automatic temperature rise test device does not require manual participation, and can automatically perform temperature rise tests, which is convenient and fast, and the test data is accurate. The invention also relates to an automatic temperature rise test method.
Description
技术领域technical field
本发明属于自动化检测领域，尤其涉及一种自动温升测试装置及方法。The invention belongs to the field of automatic detection, in particular to an automatic temperature rise testing device and method.
背景技术Background technique
手机热设计是手机研发阶段很重要的一个阶段。如果手机热设计不好，会使得手机在工作时温度过高。首先，过高的温度会导致手机的中央处理器(CentralProcessingUnit，CPU)降频工作，具体表现为手机在使用时卡顿、反应慢等；其次，过高的温度也会导致手机在使用过程中死机，影响用户体验；最后，手机电池爆炸等极端情况等也与手机过度发热有很大关系。Mobile phone thermal design is a very important stage in the mobile phone research and development stage. If the thermal design of the mobile phone is not good, the temperature of the mobile phone will be too high when it is working. First of all, too high temperature will cause the central processing unit (Central Processing Unit, CPU) of the mobile phone to down-frequency, which is specifically manifested as the mobile phone freezes and slow response when in use; secondly, too high temperature will also cause the mobile phone Crashes affect user experience; finally, extreme situations such as mobile phone battery explosion are also closely related to excessive heating of mobile phones.
目前研发阶段对于手机热的测试都是工程师手动测试。首先必须要在一个恒温的条件中选择测试模式(如游戏模式、极限模式等)，然后让手机运行45分钟或一个小时，工程师在此期间要用热成像仪定时观察手机的发热情况，如哪个时刻哪个工作模块的温度为多少，整机温度是多少，并且看整机最高温度热的来源等。这样在整个测试过程中都需要工程师全程值守并时刻保持数据纪录，极大地增加工程师的工作量，并且在手动记录过程中，由于手机的模块多、时间点不一致等原因很容易导致记录出现误差。At present, in the research and development stage, the testing of mobile phone heat is manual testing by engineers. First, you must select a test mode (such as game mode, extreme mode, etc.) in a constant temperature condition, and then let the phone run for 45 minutes or an hour. During this period, the engineer will use a thermal imager to regularly observe the heating of the phone. What is the temperature of which working module at any time, what is the temperature of the whole machine, and look at the source of the highest temperature of the whole machine. In this way, engineers are required to be on duty throughout the entire test process and keep data records at all times, which greatly increases the workload of engineers. In addition, during the manual recording process, due to many mobile phone modules and inconsistent time points, it is easy to cause recording errors.
发明内容Contents of the invention
本发明所要解决的技术问题在于提供一种自动温升测试装置，旨在方便快捷且测试数据准确。The technical problem to be solved by the present invention is to provide an automatic temperature rise test device, which is convenient and fast and has accurate test data.
本发明是这样实现的，一种自动温升测试装置，用于对一个电子设备的各个工作模块进行温升测试。该自动温升测试装置包括一个微控制器及与该微控制器电连接的一个温度传感器、一个热成像仪。该温度传感器用于感测当前环境温度。该热成像仪用于在该微控制器的控制下每隔一预定时间对该各个工作模块的工作温度进行一次测试。该微控制器用于读取该温度传感器所感测的当前环境温度，并判断该当前环境温度是否是最佳测试温度，若该当前环境温度是最佳测试温度，则读取该热成像仪的测试数据，并根据该测试数据制成该各个工作模块的温度变化图。The present invention is achieved in this way, an automatic temperature rise test device is used for temperature rise test of each working module of an electronic device. The automatic temperature rise testing device includes a microcontroller, a temperature sensor and a thermal imager electrically connected with the microcontroller. The temperature sensor is used to sense the current ambient temperature. The thermal imager is used to test the working temperature of each working module at intervals of a predetermined time under the control of the microcontroller. The microcontroller is used to read the current ambient temperature sensed by the temperature sensor, and judge whether the current ambient temperature is the best test temperature, if the current ambient temperature is the best test temperature, then read the test temperature of the thermal imager data, and make the temperature change diagram of each working module according to the test data.
本发明还提供了一种自动温升测试方法，用于对一个电子设备的各个工作模块进行温升测试。该自动温升测试方法包括如下步骤：感测当前环境温度；判断该当前环境温度是否是最佳测试温度；若该当前环境温度是最佳测试温度，则每隔一预定时间测试一次该各个工作模块的工作温度，并记录测试数据；及根据该测试数据制成该各个工作模块的温度变化图。The invention also provides an automatic temperature rise test method, which is used for temperature rise test of each working module of an electronic device. The automatic temperature rise test method includes the following steps: sensing the current ambient temperature; judging whether the current ambient temperature is the best test temperature; The operating temperature of the module, and record the test data; and make the temperature change diagram of each working module according to the test data.
本发明与现有技术相比，有益效果在于：该自动温升测试装置及方法不需要人工参与，能自动对电子设备进行温升测试，方便快捷且测试数据准确。Compared with the prior art, the present invention has the beneficial effects that: the automatic temperature rise test device and method can automatically perform temperature rise test on electronic equipment without manual participation, which is convenient and fast, and the test data is accurate.
附图说明Description of drawings
图1是本发明实施例提供的自动温升测试装置的功能模块图。Fig. 1 is a functional block diagram of an automatic temperature rise testing device provided by an embodiment of the present invention.
图2是图1的自动温升测试装置的温度变化图。Fig. 2 is a temperature change diagram of the automatic temperature rise testing device in Fig. 1 .
图3是本发明实施例提供的自动温升测试方法的流程图。Fig. 3 is a flowchart of an automatic temperature rise testing method provided by an embodiment of the present invention.
具体实施方式Detailed ways
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
如图1所示，本发明实施例提供的自动温升测试装置100，用于测试一个电子设备(比如手机)在工作过程中各个工作模块的温度变化情况。该自动温升测试装置100包括一个微控制器10及与该微控制器10电连接的一个温度传感器20、一个模式选择模块30及一个热成像仪40。As shown in FIG. 1 , the automatic temperature rise test device 100 provided by the embodiment of the present invention is used to test the temperature change of each working module of an electronic device (such as a mobile phone) during the working process. The automatic temperature rise testing device 100 includes a microcontroller 10 , a temperature sensor 20 electrically connected to the microcontroller 10 , a mode selection module 30 and a thermal imager 40 .
该温度传感器20用于感测当前环境温度。由于在该电子设备进行温升测试的过程中，当前环境温度过高或者过低都会影响到测试数据的准确性。最佳的当前环境温度是25摄氏度。The temperature sensor 20 is used to sense the current ambient temperature. During the temperature rise test of the electronic device, the accuracy of the test data will be affected if the current ambient temperature is too high or too low. The best current ambient temperature is 25 degrees Celsius.
该模式选择模块30用于选择该电子设备的测试模式。由于在温升测试中的测试模式有游戏模式和极限模式等，在不同测试模式下，该各个工作模块的工作状态不同，发热情况也不同。游戏模式是模仿用户在正常使用该电子设备的情况下，该各个工作模块的发热情况。极限模式是模仿该电子设备工作在最大功耗及最大发热状态下，该各个工作模块所能承受的最大发热情况。The mode selection module 30 is used for selecting the test mode of the electronic device. Since the test modes in the temperature rise test include game mode and limit mode, etc., in different test modes, the working states of the working modules are different, and the heat generation conditions are also different. The game mode is to simulate the heat generation of each working module when the user is using the electronic device normally. The extreme mode is to imitate the maximum heat generation that each working module can withstand when the electronic device is working at the maximum power consumption and maximum heat generation state.
该热成像仪40用于在该微控制器10的控制下每隔一预定时间对该各个工作模块在已选择的测试模式下的工作温度进行一次测试。该热成像仪40能够根据该各个工作模块在工作时产生的热量而发出的红外线的波长来计算该各个工作模块的温度。在本实施例中，该热成像仪40通过拍照的方式来确定各个工作模块的工作温度。The thermal imager 40 is used to test the working temperature of each working module in the selected test mode at a predetermined interval under the control of the microcontroller 10 . The thermal imager 40 can calculate the temperature of each working module according to the wavelength of infrared rays emitted by the heat generated by each working module during operation. In this embodiment, the thermal imager 40 determines the working temperature of each working module by taking pictures.
该微控制器10用于读取该温度传感器20所感测的当前环境温度，并判断该当前环境温度是否是最佳测试温度，若不是最佳测试温度，则控制该模式选择模块30及该热成像仪40停止工作；若是最佳测试温度，则读取该模式选择模块30的模式选择结果及该热成像仪40的测试数据，并根据该测试数据制成该各个工作模块在不同测试模式下的温度变化图。在本实施例中，该微控制器10通过一个串口通信模块与该热成像仪40相互通信。由于该电子设备在工作时所产生的热量随着时间的递增逐渐增加，因此该各个工作模块的温度变化图是通过曲线图的形式表现，以方便研发工程师通过该温度变化图能快速得知该各个工作模块的发热情况。如图2所示，该温度变化图的横轴为时间，纵轴为温度，该温度变化图中的多条曲线分别是该各个工作模块的温度变化曲线，比如曲线T1是第一工作模块的温度变化曲线，曲线T2是第二工作模块的温度变化曲线。The microcontroller 10 is used to read the current ambient temperature sensed by the temperature sensor 20, and judge whether the current ambient temperature is the optimum test temperature, if not, control the mode selection module 30 and the thermal Imager 40 stops working; If optimal test temperature, then read the mode selection result of this mode selection module 30 and the test data of this thermal imager 40, and make this each working module under different test modes according to this test data temperature change graph. In this embodiment, the microcontroller 10 communicates with the thermal imager 40 through a serial port communication module. Since the heat generated by the electronic equipment gradually increases with time, the temperature change diagram of each working module is displayed in the form of a graph, so that R&D engineers can quickly know the temperature change diagram through the temperature change diagram. The heat generation of each working module. As shown in Figure 2, the horizontal axis of the temperature change graph is time, and the vertical axis is temperature. The multiple curves in the temperature change graph are the temperature change curves of the various working modules, such as curve T1 is the temperature of the first working module. The temperature change curve, the curve T2 is the temperature change curve of the second working module.
该自动温升测试装置100的工作过程如下：该微控制器10通过该温度传感器20感测当前环境温度，并判断该当前环境温度是否是最佳测试温度(比如25摄氏度)，若不是最佳测试温度，则直接结束；若是最佳测试温度，则该微控制器10通过该模式选择模块20对该电子设备的测试模式进行选择，接着该微控制器10控制该热成像仪30每隔一预定时间测试一次该各个工作模块在已选择的测试模式下的工作温度，该微控制器10记录该热成像仪的测试数据并根据该测试数据制成该各个工作模块在不同测试模式下的温度变化图。The working process of the automatic temperature rise testing device 100 is as follows: the microcontroller 10 senses the current ambient temperature through the temperature sensor 20, and judges whether the current ambient temperature is the best test temperature (such as 25 degrees Celsius), if not the best If the test temperature is the best test temperature, then the microcontroller 10 selects the test mode of the electronic device through the mode selection module 20, and then the microcontroller 10 controls the thermal imager 30 every other Test the operating temperature of each working module once in the selected test mode at a predetermined time, and the microcontroller 10 records the test data of the thermal imager and makes the temperature of each working module under different test modes according to the test data Change graph.
如图3所示，本发明实施例提供的自动温升测试方法，用于对一电子设备进行温升测试。该自动温升测试方法包括如下步骤：As shown in FIG. 3 , the automatic temperature rise test method provided by the embodiment of the present invention is used to perform a temperature rise test on an electronic device. The automatic temperature rise test method comprises the steps:
S1：测试当前环境温度。S1: Test the current ambient temperature.
S2：判断该当前环境温度是否是最佳测试温度。在本实施例中，该最佳测试温度是25摄氏度。S2: judging whether the current ambient temperature is an optimal test temperature. In this embodiment, the optimal test temperature is 25 degrees Celsius.
S3：若该当前环境温度不是最佳测试温度，则直接结束。S3: If the current ambient temperature is not the optimum test temperature, end directly.
S4：若该当前环境温度是最佳测试温度，则选择该电子设备的测试模式。S4: If the current ambient temperature is an optimal test temperature, select a test mode of the electronic device.
S5：每隔一预定时间测试一次该各个工作模块在已选择的测试模式下的工作温度，并记录该测试数据。S5: Test the working temperature of each working module in the selected test mode every predetermined time, and record the test data.
S6：根据不同测试模式下的测试数据制成该各个工作模块在不同测试模式下的温度变化图。S6: According to the test data in different test modes, the temperature change diagrams of the various working modules in different test modes are prepared.
与现有技术相比较，本发明的自动温升测试装置，能够在不需要人工值守的情况下自动对电子设备进行温升测试并制成温度变化图，方便快捷且测试数据准确，能有效帮助工程师合理进行电子设备的热设计。Compared with the prior art, the automatic temperature rise testing device of the present invention can automatically test the temperature rise of electronic equipment and make a temperature change diagram without manual on-duty, which is convenient and fast, and the test data is accurate, which can effectively help Engineers rationally conduct thermal design of electronic equipment.
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. within range.
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