CN105150051A - Internal linkage type multi-cylinder self-adaptive polishing grinding head - Google Patents

Abstract

The invention discloses an integral linkage type multi-cylinder self-adaptive polishing grinding head and belongs to the technical field of optical cold machining. The integral linkage type multi-cylinder self-adaptive polishing grinding head aims to solve the problems that in the prior art, the stress of a grinding head is distributed unevenly, and the elastic coefficient of the grinding head cannot be adjusted. The integral linkage type multi-cylinder self-adaptive polishing grinding head comprises a flange base, a hatchway cover, an internal linkage type multi-cylinder structure and polishing grinding head subunits. The internal linkage type multi-cylinder structure comprises a plurality of sub-cylinders, the upper ends of the sub-cylinders are communicated with one another, and each sub-cylinder is matched with the corresponding polishing grinding head subunit. The flange base, the hatchway cover and the internal linkage type multi-cylinder structure are concentrically assembled by means of fastening bolts and sealed through O-shaped sealing rings. Through holes are formed in the flange base and the hatchway cover and communicated with any one sub-cylinder. According to the integral linkage type multi-cylinder self-adaptive polishing grinding head, the upper ends of the multiple sub-cylinders are communicated with one another, so that it can be sufficiently guaranteed that the air pressure in the sub-cylinders is consistent; the air pressure in the cylinders can be regulated according to requirements, so that the elastic coefficient of an air cavity is changed, and an effective scheme is provided for machining high-precision aspheric-surface optical parts.

Description

An inline multi-cylinder self-adaptive polishing grinding head

technical field

The invention belongs to the technical field of optical cold processing, and in particular relates to an inline multi-cylinder self-adaptive polishing grinding head.

Background technique

The use of aspherical lenses in the optical system can significantly simplify the system, improve image quality, and reduce the external size and weight of the system. Therefore, with the continuous development of science and technology, the manufacturing demand of aspheric optical parts has increased significantly, especially in the lithography objective optical system, the number of high-precision aspheric optical parts accounts for more than 50% of the total number of optical parts. Since the aspheric surface has a unique optical axis and the radius of curvature of each point on the aspheric surface is significantly different, the ordinary spherical surface polishing process cannot solve the problem of aspheric surface pre-polishing processing. At present, the small grinding head polishing process is mostly used for aspheric surface pre-polishing. However, the pre-polished aspheric surface of a small grinding head is likely to leave intermediate frequency errors in the form of processing tracks, so it is difficult to obtain aspheric processing results that meet the system requirements when the requirements for aspheric surface intermediate frequency errors are extremely strict, such as in high NA lithography objectives. In the optical system, high-precision aspheric optical parts usually have the characteristics of deviation greater than 1mm and gradient greater than 3°. The aspheric intermediate frequency index must be better than 0.5nmRMS, which significantly increases the difficulty of manufacturing. The pre-polishing of ordinary small grinding heads is difficult to meet the above processing need.

The Chinese patent with the publication number CN103072077A discloses a technical scheme called a dual-flexible self-adaptive polishing grinding head. The polishing grinding head described in the scheme uses a flexible layer as a deformable layer for the polishing mold to be bonded to the aspheric surface to realize An aspheric flexible self-adaptive polishing grinding head is developed. The limitation of this solution is that the elastic coefficient of the flexible layer cannot be adjusted after material selection is completed. In addition, the deformation scale of the flexible layer of this solution is uneven during processing, which easily leads to uneven stress distribution of the grinding head, making it difficult to improve the convergence efficiency of intermediate frequency errors.

Contents of the invention

The purpose of the present invention is to propose an inline multi-cylinder self-adaptive polishing grinding head with stronger adaptability and higher intermediate frequency error correction ability, so as to solve the problems of uneven stress distribution and non-adjustable elastic coefficient of the grinding head in the prior art The problem.

In order to achieve the above object, an inline multi-cylinder adaptive polishing grinding head of the present invention includes a flange base, an air compartment cover plate, an inline multi-cylinder structure and a polishing grinding head subunit;

The inline multi-cylinder structure includes a plurality of sub-cylinders whose upper ends communicate with each other, and each sub-cylinder cooperates with a polishing grinding head subunit;

The flange base, the air compartment cover plate and the inline multi-cylinder structure are assembled concentrically with fastening bolts and sealed by an O-ring. The flange base and the air compartment cover plate are coaxially provided with a through hole. The through hole communicates with any sub-cylinder.

The polishing grinding head subunit comprises a concentrically assembled sub-piston base, a sub-grinding base and a sub-grinding polishing mold, the sub-piston base and the sub-grinding base are connected by fastening bolts, and the sub-grinding polishing mold It is fixedly connected with the lower end surface of the sub-grinding head base.

The polishing mold of the sub-grinding head is bonded and fixed to the lower end surface of the base of the sub-grinding head.

The material of the polishing mold of the sub-grinding head is polyurethane or asphalt.

The inline multi-cylinder structure includes at least three sub-cylinders whose upper ends communicate with each other.

The inline multi-cylinder structure is a crescent-shaped columnar structure or a flat-section cylindrical structure.

The distribution of the sub-cylinders is multi-ring concentric distribution or orthogonal matrix distribution.

The beneficial effects of the present invention are as follows: the upper ends of multiple sub-cylinders in the inline multi-cylinder structure of the inline multi-cylinder self-adaptive polishing grinding head of the present invention communicate with each other, which can fully ensure the consistent air pressure inside the sub-cylinders. The sub-cylinder is filled with compressed air in use to obtain an air spring structure with adjustable elastic coefficient. The elastic coefficient of the air cavity can be changed by adjusting the air pressure in the cylinder as required, and an aspheric polishing grinding head with uniform pressure distribution, adjustable elastic coefficient and more flexible surface shape matching is obtained, which provides a tool for processing high-precision aspheric optical parts. an effective solution. Through the elastic expansion and contraction of the sub-grinding head, the fit between the grinding head and the aspheric surface can be improved, and the efficient surface processing of the aspheric surface can be realized.

Description of drawings

Fig. 1 is a structural representation of an inline multi-cylinder self-adaptive polishing grinding head of the present invention;

Fig. 2 is that the sub-cylinder distribution of the present invention is multi-ring concentric distribution;

Fig. 3 is that the sub-cylinder distribution of the present invention is an orthogonal matrix distribution;

Among them: 1. Flange base, 2. O-ring, 3. Air chamber cover, 4. Sub-cylinder, 5. Inline multi-cylinder structure, 6. Sub-piston base, 7. Sub-grinding base Seat, 8, sub-grinding head polishing die, 9, fastening bolt.

Detailed ways

Embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

Referring to accompanying drawing 1, a kind of inline type multi-cylinder self-adaptive polishing grinding head of the present invention comprises flange base 1, air compartment cover plate 3, inline type multi-cylinder structure 5 and polishing grinding head sub-unit;

The inline multi-cylinder structure 5 includes a plurality of sub-cylinders 4 whose upper ends communicate with each other, so as to achieve the purpose of consistent air pressure of each sub-cylinder 4, and each sub-cylinder 4 cooperates with a polishing grinding head subunit;

The flange base 1, the air compartment cover plate 3 and the inline multi-cylinder structure 5 are concentrically assembled using fastening bolts 9, and each mating surface is sealed by an O-ring 2, and the flange base 1 is connected to the air compartment The cover plate 3 is coaxially provided with a through hole, the through hole communicates with any one of the sub-cylinders 4 , and the through hole is coaxial with the flange base 1 .

The polishing grinding head subunit comprises a concentrically assembled sub-piston base 6, a sub-grinding base 7 and a sub-grinding polishing die 8, and the sub-piston base 6 and the sub-grinding base 7 are connected by fastening bolts 9, so The sub-grinding head polishing die 8 is fixedly connected with the lower end surface of the sub-grinding head base 7 .

Considering the convenience of processing and use, the flange base 1 is made of stainless steel, the air compartment cover 3 and the inline multi-cylinder structure 5 are made of duralumin; the sub-piston base 6 and the sub-grinding head base 7 are made of Made of duralumin material, the sub-piston base 6 and the sub-cylinder 4 adopt clearance fit H8/e8.

The polishing die 8 of the sub-grinding head is bonded and fixed to the lower end surface of the sub-grinding head base 7 .

The material of the polishing die 8 of the sub-grinding head is polyurethane or asphalt. Urethane materials can be used to obtain higher material removal efficiency and are used after the aspheric milling process as the first pre-polishing process. Bituminous materials can be used to obtain higher surface quality and are used as the second pre-polishing process.

The inline multi-cylinder structure 5 includes at least three sub-cylinders 4 whose upper ends communicate with each other. The number of sub-cylinders 4 depends on the deviation degree and gradient value of the processed aspheric surface. The larger the deviation degree and gradient value, the greater the number of sub-cylinders 4 . Usually, the number of sub-cylinders 4 is 3-100.

Referring to accompanying drawings 2 and 3, the inline multi-cylinder structure 5 is a meniscus-shaped columnar structure or a flat-section cylindrical structure, and the specific structure of the inline multi-cylinder structure 5 is determined according to the actual processing of the aspherical surface . The meniscus columnar structure specifically refers to: a cylinder whose upper surface is a concave spherical surface and whose lower surface is a convex spherical surface.

The distribution of the sub-cylinders 4 is multi-ring concentric distribution or orthogonal matrix distribution.

When assembling an inline multi-cylinder self-adaptive polishing grinding head of the present invention, firstly, all sub-grinding head polishing molds 8 are bonded to sub-grinding head bases 7, and then all sub-piston bases 6 are inserted into all sub-grinding head bases respectively. In the cylinder 4, use fastening screws to connect the sub-grinding head base 7 and the sub-piston base 6, use the O-ring 2 for sealing, and then fasten the air compartment cover plate 3 and the inline multi-cylinder structure 5 with The bolt 9 is connected and sealed with the O-ring 2 , and finally the flange base 1 is connected with the air compartment cover 3 with the fastening bolt 9 and sealed with the O-ring 2 to complete the assembly of the grinding head. The flange base 1 can customize the size of the matching part according to the interface size of the grinding head fixture of the equipment, so as to realize the connection between the grinding head and the processing equipment. The shape of the polishing mold needs to be corrected before the grinding head is used. When the polishing mold is made of polyurethane material, the electroplated diamond grinding wheel can be used to modify the shape. When the polishing mold material is asphalt, the asphalt can be softened with a heat gun, and then pressed into the aspheric surface to be processed take shape.

Claims (7)

1. an intraconnected multi cylinder self adaptation grinding head for polishing, is characterized in that, comprises flange pedestal (1), gas hatchway cover (3), intraconnected multi cylinder structure (5) and grinding head for polishing subelement;

Described intraconnected multi cylinder structure (5) comprises the sub-cylinder (4) that multiple upper end is interconnected, and every sub-cylinder (4) coordinates with a grinding head for polishing subelement;

Described flange pedestal (1), gas hatchway cover (3) and intraconnected multi cylinder structure (5) are used fastening bolt (9) concentric fits and are sealed by O RunddichtringO (2), described flange pedestal (1) and gas hatchway cover (3) coaxially have through hole, and described through hole is communicated with any one sub-cylinder (4).

2. a kind of intraconnected multi cylinder self adaptation grinding head for polishing according to claim 1, it is characterized in that, described grinding head for polishing subelement comprises the sub-piston base (6) of concentric fits, sub-bistrique pedestal (7) and sub-grinding head polishing mould (8), described sub-piston base (6) is connected by fastening bolt (9) with sub-bistrique pedestal (7), and described sub-grinding head polishing mould (8) is fixedly connected with described sub-bistrique pedestal (7) lower surface.

3. a kind of intraconnected multi cylinder self adaptation grinding head for polishing according to claim 2, is characterized in that, described sub-grinding head polishing mould (8) and described sub-bistrique pedestal (7) lower surface are adhesively fixed.

4. a kind of intraconnected multi cylinder self adaptation grinding head for polishing according to Claims 2 or 3, is characterized in that, the material of described sub-grinding head polishing mould (8) is polyurethane or pitch.

5. a kind of intraconnected multi cylinder self adaptation grinding head for polishing according to claim 1, it is characterized in that, described intraconnected multi cylinder structure (5) comprises the sub-cylinder (4) that at least three upper ends are interconnected.

6. a kind of intraconnected multi cylinder self adaptation grinding head for polishing according to claim 1 or 5, it is characterized in that, described intraconnected multi cylinder structure (5) is falcate column structure or plane section shape column structure.

7. a kind of intraconnected multi cylinder self adaptation grinding head for polishing according to claim 1, is characterized in that, many rings that is distributed as of described sub-cylinder (4) distribute with heart shaped distribution or orthogonal matrix shape.