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CN105140381B - Substrateless LED filament and its manufacturing method and substrateless LED filament lamp - Google Patents

Substrateless LED filament and its manufacturing method and substrateless LED filament lamp Download PDF

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Publication number
CN105140381B
CN105140381B CN201510594562.8A CN201510594562A CN105140381B CN 105140381 B CN105140381 B CN 105140381B CN 201510594562 A CN201510594562 A CN 201510594562A CN 105140381 B CN105140381 B CN 105140381B
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China
Prior art keywords
led
led filament
filament
substrateless
led chip
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CN201510594562.8A
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Chinese (zh)
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CN105140381A (en
Inventor
葛世潮
葛晓勤
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Haining Ruidison Optoelectronics Co ltd
Zhejiang Ledison Optoelectronics Co ltd
Original Assignee
ZHEJIANG LEDISON OPTOELECTRONICS CO Ltd
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Priority to CN201510594562.8A priority Critical patent/CN105140381B/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

A kind of no substrate LED filament and preparation method and without substrate LED filament lamp, the filament include: the LED chip of at least a string identical or not identical illuminant colours, electric lead-out wire, the electric connection line between chip between chip and electric lead-out wire；The first luminous bisque is coated on the welding ends of chip, electric connection line and electric lead-out wire, is constituted initially without substrate LED filament；Initially the another side without substrate LED filament is coated with the second luminous bisque and no substrate LED filament is made；No substrate LED filament can be adhesive on transparent high thermal conductivity tube outer surface with transparent adhesive tape or luminescent powder, constitute cylindricality without substrate LED filament light source, for manufacturing great power LED filament lamp.No substrate LED filament lamp includes: at least one vacuum sealing and the blister filled with heat radiation protection gas；At least one is installed without substrate LED filament light source in each blister, no substrate LED filament light source includes: initially without substrate LED filament, without substrate LED filament or cylindricality without substrate LED filament light source；LED driver and drive enclosure and electric connector etc.；For illuminating.

Description

Without substrate LED filament and its manufacturing method and without substrate LED filament lamp
Technical field
The present invention relates to a kind of LED filament lamp, in particular to a kind of no substrate LED filament and its manufacturing method and made with it Make without substrate LED filament lamp, for illuminating.
Background technique
The filament of the LED filament lamp of the prior art is all that a substrate is fixed at least a string of LED chips, with crystal-bonding adhesive On, there is electric connection line between chip, there is at least one layer of luminous bisque around chip and substrate, two end of substrate has to be electrically connected with chip Electric lead-out wire.
The LED chip is the chip of blue light-emitting or ultraviolet light；The luminous bisque is mixed by luminescent powder and transparent medium It forms；The luminescent powder is matched with LED chip issued light, to obtain the light of white light or other required colors.
The substrate of the LED filament is transparent or opaque substrate, such as glass, sapphire, crystalline ceramics, plastics, gold Category or the glass containing luminescent powder, plastics, ceramics etc..
The manufacturing process of the LED filament of the prior art is also more complicated, higher cost, is the cost of current LED filament lamp One of main composition.How simplifying the technique of LED filament, reducing its cost and manufacture the filament of higher output light flux is mesh One of the important topic of preceding LED filament lamp development.
Summary of the invention
It is an object of the invention to overcome above-mentioned deficiency, it is logical to provide a kind of simple, at low cost, the high output light of manufacturing process Amount, a kind of efficient no substrate LED filament and preparation method and with no substrate LED filament manufacture without substrate LED filament lamp.
Technical scheme is as follows:
No substrate LED filament provided by the invention, for initially without substrate LED filament or without substrate LED filament；
It is described initially to include: without substrate LED filament
LED chip string is constituted by least a string identical illuminant colours or not identical illuminant colour LED chip；
It is connected to the electric lead-out wire at LED chip string one end or two ends；
It is connected to the electric connection line between the LED chip between LED chip and electric lead-out wire；
The first luminous bisque with electric connection line one side coated on the LED chip string；
The no substrate LED filament is other than including the above-mentioned feature initially without substrate LED filament, then initially without base Plate LED filament is coated with the second luminous bisque without electric connection line on one side.
No substrate LED filament provided by the invention, further includes: before coating first shines bisque, be coated on the LED Layer of transparent reinforced glue on the welding foot of electric connection line between chip between LED chip and electric lead-out wire；Or coating In whole string LED chip include layer of transparent reinforced glue on welding foot；The transparent reinforced glue is high-intensitive silica gel, asphalt mixtures modified by epoxy resin Rouge, plastics or UV glue.
The first luminous bisque and the second luminous bisque are made by dispenser or injection molding, and the second luminous bisque can also be flat Face luminescent powder film.The first luminous bisque and the second luminous bisque are mixed by transparent medium and luminescent powder；It is described transparent Medium is silica gel, epoxy resin, UV glue or plastics；Described can be initially hard lamp without substrate LED filament and without substrate LED filament Silk or soft filament.
The LED chip be the LED chip of transparent substrate, substrate have optical reflection film LED chip or opaque substrate LED chip.
The manufacturing method of no substrate LED filament provided by the invention, manufactures for extension set, and preparation step includes:
A) prepare a piece of LED chip loading plate for being covered with low viscosity on one side and not solidifying glue surface 11；
B) LED chip of identical or not identical illuminant colour is arranged in not solidifying for loading plate in a cluster and forms 1- in glue surface 1000 string LED chip strings；One end or two ends of every string LED chip string are placed with electric lead-out wire；The LED core of every string LED chip string Piece quantity and spacing are set by LED filament requirement；
C) between the LED chip of every string LED chip string between LED chip and electric lead-out wire spot welding electric connection line；
E the first luminous bisque) is coated on the welding ends of LED chip, electric connection line and electric lead-out wire and is solidified；
F LED chip loading plate) is separated, is obtained initially without substrate LED filament；
G) initially without substrate LED filament without luminescent powder the second luminous bisque of laminated coating or paste luminescent powder film, Solidification；Obtain that illuminant colour is evenly distributed without substrate LED filament；
H) gained without substrate LED filament and is tested and classified.
The extension set manufacturing step further include: in step C) and step E) between step D), the step D) are as follows: be electrically connected On the point leg of wiring or transparent reinforced glue is coated on whole string LED chip string and is solidified；The transparent reinforced glue is UV glue, silica gel Or epoxy resin.
The loading plate base is made of metal, plastics, ceramics or glass；The glue surface that do not solidify is adhesive sticker, UV glue, no Add silica gel, the epoxy resin material of curing agent or catalyst.
The first luminous bisque, the second luminous bisque or luminescent powder film are mixed by transparent medium and luminescent powder； The transparent medium is silica gel, epoxy resin, UV glue or plastics.
The manufacturing method of no substrate LED filament provided by the invention, for full-automatic manufacture, preparation step includes:
A) prepare a roll of LED chip carrying belt；
The LED chip carrying belt is made of carrying tape base with the glue surface that do not solidify for being overlying on its surface, and the LED chip is held Not solidifying for carrier band is covered with isolation film in glue surface, the glue surface of each carrying belt in a roll of LED chip carrying belt is isolated；In LED core When piece carrying belt enters automatic production line, this isolation film is stripped；
B) not solidifying on chip bearing band is arranged successively in glue surface is equipped with electric lead-out wire and at least one LED chip LED chip string, while chip bearing belt is pressed preceding line direction in a stepwise manner and is moved forward, and one step of every forward movement just installs one LED chip string and its electric lead-out wire；In chip bearing belt stepwise movement forward, a LED chip string and its electricity Then a LED chip string and its electric lead-out wire are installed in and do not solidify in glue surface lead-out wire；Chip bearing belt is not solid as a result, Change and 2-10000 LED chip string is installed in glue surface；Connecting line is equipped between the electric lead-out wire of adjacent LED filament；
C) between the LED chip in every string LED chip string between LED chip and electric lead-out wire spot welding electric connection line；
E the first luminous bisque, and primary solidification) are coated on the welding ends of LED chip, electric connection line and electric lead-out wire；
F) LED chip carrying belt is separated, is obtained initially without substrate LED filament；
G) initially without substrate LED filament without luminescent powder the second luminous bisque of laminated coating or with transparent glue send out Light powder film, primary solidification；
H) cut off the connecting line between the electric lead-out wire of every string LED chip string, obtain that illuminant colour is evenly distributed without substrate LED filament；
I the above-mentioned primary solidification of a batch) is concentrated feeding high-temperature cabinet without substrate LED filament or initially without substrate LED filament Sufficiently solidification；Obtain initially without substrate LED filament 1 or illuminant colour be evenly distributed without substrate LED filament；
J it) is initially tested and is divided without substrate LED filament without what substrate LED filament or illuminant colour were evenly distributed to above-mentioned Class.
The full-automatic manufacturing step further include: step C) and step E) between step D), the step D) be electrically connected The point leg or whole filament of wiring include coating transparent reinforced glue, rear primary solidification on point leg；The primary solidification refers to Transparent reinforced glue is kept not flow；The transparent cured glue is UV glue, silica gel or epoxy resin；
The carrying tape base of the chip bearing belt is made of metal, plastics, ceramics or glass；The glue surface that do not solidify is not Dry glue, UV glue, the silica gel that curing agent or catalyst is not added, epoxy resin.
The present invention also provides a kind of no substrate LED filament lamps comprising:
At least one vacuum sealing and blister filled with heat radiation protection gas；The blister by bulb shell and stem sealing at Vacuum sealing blister, stem include pillar, electric lead-out wire and exhaust pipe；
At least one LED light source is installed on the stem of the blister；
One LED driver and drive enclosure；
One electric connector；
The blister, electric connector and drive enclosure link into an integrated entity structure；
The output of the electric lead-out wire of at least one LED light source and driver connects, the input of driver be electrically connected Device connection, electric connector is for connecting external power；It is characterized by:
Each LED light source of at least one LED light source is at least one initial without substrate LED filament or at least one Without substrate LED filament.
At least one described LED light source is at least one initially without substrate LED filament or at least one without substrate LED filament Cylindricality on a transparent high thermal conductivity tube outer surface, is constituted without substrate LED filament with transparent adhesive tape or luminescent powder glue LED light source；The transparent high thermal conductivity pipe is crystalline ceramics pipe, sapphire pipe, glass tube or plastic tube.
The blister for being equipped at least one LED light source is one or more LED light tube；The LED light tube Bulb shell is transparent bulb case, frosted blister or milky white blister.
In the present invention, initial LED filament can be used to manufacture without substrate LED filament lamp, but the illuminant colour meeting in two face of filament There is difference, if LED chip used is opaque chip or the chip for having back silver-plated reflecting layer, filament is laminated without luminescent powder Luminous colour temperature can be higher；If LED chip used is UV chip, the colour temperature of illuminant colour is substantially uniform.To obtain illuminant colour The filament being evenly distributed, initially without substrate LED filament without the laminated coating second layer of luminescent powder shine bisque, be made luminous Color be evenly distributed without substrate LED filament.
At least one initially without substrate LED filament or/and without substrate LED filament transparent adhesive tape or luminescent powder glue one LED light source of the cylindricality without substrate LED filament is constituted on a transparent high thermal conductivity tube outer surface；LED chip is directly attached to height and leads On heating rate pipe, thermal resistance is small between chip and high thermal conductivity pipe, and the surfaces externally and internally product of high thermal conductivity pipe is big, with LED filament bulb housing Interior heat dissipation gas-contact area is big, good heat dissipation, can be made into high-power, high light flux, high efficiency LED lamp silk lamp.
Of the invention eliminates the substrates such as sapphire and die bond process without substrate LED filament and without substrate LED filament lamp, tool Have that manufacturing process is simple, it is at low cost；It can be made into hard or soft LED filament, with the filament lamp for manufacturing different filament shapes； LED chip can also be placed directly against on transparent high thermal conductivity pipe, efficient high power high light flux LED filament lamp is made；It can be into One step improves the cost performance and manufacture more high light flux LED filament lamp of LED filament lamp；The full solid angle of the π of LED chip goes out light, hair Light efficiency is high；Its without substrate LED filament can extension set manufacture or full-automatic manufacture, it is at low cost, be suitble to the advantages that producing in enormous quantities.
Detailed description of the invention
Figure 1A is the radial section structural schematic diagram of one embodiment of initial no substrate LED filament of the invention.
Figure 1B is the axial cross section partial structural diagram of one embodiment of the initial no substrate LED filament of Figure 1A.
Fig. 2A is the radial section structure of the one embodiment for the uniform no substrate LED filament that illuminant colour of the invention is distributed Schematic diagram.
Fig. 2 B is the axial cross section partial structural diagram of one embodiment without substrate LED filament of Fig. 2A.
Fig. 3 is the schematic diagram of one embodiment of the extension set manufacturing method of no substrate LED filament of the invention.
Fig. 4 is the schematic diagram of one embodiment of the full-automatic manufacturing method of no substrate LED filament of the invention.
Fig. 5 is that initial no substrate LED filament of the invention is pasted on transparent high thermal conductivity pipe for manufacturing high-powered LED lamp The cross section structure schematic diagram of one embodiment of silk lamp.
Fig. 6 is the structural schematic diagram of the LED filament lamp one embodiment manufactured with no substrate LED filament of the invention.
Fig. 7 is the structural representation with one embodiment of the great power LED filament lamp of no substrate LED filament of the invention Figure.
Specific embodiment
The present invention is further described below in conjunction with accompanying drawings and embodiments.
Figure 1A and Figure 1B is one kind a --- reality initially without substrate LED filament 1 for no substrate LED filament of the invention The cross section structure schematic diagram of example is applied, wherein Figure 1A is filament radial cross section, and Figure 1B is filament one end axial direction partial cross section Schematic diagram.2 be LED chip, 3 electric connection line between chip 2 between chip and electric lead-out wire 4 in figure；5 be LED chip 2 With the first luminous bisque on the welding ends of the electric connection line of electric lead-out wire 4.
Initially it can be used to manufacture LED filament lamp without substrate LED filament 1；If LED chip used is the transparent of blue light-emitting Chip, there will be blue lights to be directly emitted；If LED chip used is opaque chip or has the LED chip of back silver-plated reflecting layer, The light sent out at the first nearly LED chip 2 of luminous bisque 5 has more blue light, i.e. colour temperature is higher；If LED chip used is UV chip, Then the colour temperature of issued light is substantially uniform.
Fig. 2A and Fig. 2 B is the section of one embodiment without substrate LED filament 6 that illuminant colour of the invention is evenly distributed Structural schematic diagram, wherein Fig. 2A is radial cross section, and Fig. 2 B is filament axial direction schematic partial cross-sectional view.Such as Fig. 2A and 2B institute Show, after the welding for completing electric connection line 3, one layer is coated on the pad of electric lead-out wire 3 to reinforce pad welding foot Transparent reinforced glue 7, which is high-intensitive silica gel, epoxy resin, UV glue or plastics；Transparent reinforced glue 7 can be applied only It overlays on and reinforces welding foot on welding foot, may also extend through whole LED filament, to enhance the intensity of whole LED filament simultaneously, such as Fig. 2 B It is shown；
As shown in Figure 2 A and 2B, the second luminous bisque 8 is coated with without 3 one side of electric connection line in LED chip 2；To To illuminant colour be evenly distributed without substrate LED filament 6.
First luminous bisque 5 and the second luminous bisque 8 are mixed by transparent medium and luminescent powder, can be by dispenser or note Molding is made；Second luminous bisque can also be flat luminous powder film；Transparent medium can be silica gel, the epoxy resin, modeling of varying strength Material or UV glue etc..
The transparent medium of the luminous bisque of varying strength and the content of transparent medium are selected, can be made into the hard of sufficient intensity Or soft initial no substrate LED filament 1 and without substrate LED filament 6, for manufacture different filament shapes without substrate LED light Silk lamp.
Without the transparent reinforced glue 7 of substrate LED filament shown in Fig. 2A, 2B, can also not have to.
Initial no substrate LED filament 1 of the invention and the manufacturing method without substrate LED filament 6 can there are many, such as: The preparation of extension set substep and full-automatic preparation described above.
Fig. 3 is the schematic diagram of one embodiment of the extension set manufacturing method of no substrate LED filament of the invention.Such as Fig. 3 institute Show, the box on the left side is the explanatory note of manufacturing step in figure, is structural schematic diagram on the right side of box.
The first step A of manufacture): prepare a piece of LED chip loading plate 9 for having low viscosity not solidification glue on one side, loading plate 9 wraps It includes loading plate base 10 and does not solidify glue surface 11.The loading plate base is made of metal, plastics, ceramics or glass；It is described not solidify Glue is adhesive sticker, UV glue, the silica gel that curing agent or catalyst is not added, epoxy resin etc.；
B 1-10000) is gone here and there the LED chip 2 of identical or not identical illuminant colour and its electric lead-out wire 4 is arranged in loading plate 9 Do not solidify in glue surface 11, i.e., have at least one LED filament on loading plate, the quantity of every serial core piece 2, chip chamber are away from pressing LED filament It is required that setting；
C) between chip 2 between chip and electric lead-out wire 4 spot welding electric connection line 3；Other components are identical as B) in figure, Its label does not repeat to mark (similarly hereinafter)；
D transparent reinforced glue 7) is coated on the point leg of connecting line 3 and is solidified, to reinforce the welding fastness of electric connection line 3, The transparent reinforced glue 7 can be applied only on the welding foot of electric connection line, may also extend through whole filament, as shown, to reinforce The intensity of whole filament；The transparent reinforced glue is UV glue, silica gel, epoxy resin or other glue；
E) the first luminous bisque 5 is coated on chip 2, electric connection line 3, the point welding end of electric lead-out wire 4 and transparent reinforced glue 7 And solidify；
F) chip bearing plate 9 is separated, is obtained initially without substrate LED filament 1；
G) in luminous arogel one side the second luminous bisque of coating of nothing or stickup luminescent powder film initially without substrate LED filament 1 8, solidification；Obtain that illuminant colour is evenly distributed without substrate LED filament 6；The first luminous bisque 5 and the second luminous bisque 8 by Transparent medium and luminescent powder are mixed, and the transparent medium is silica gel, epoxy resin, UV glue or plastics；
H it) tests, classify.
Fig. 4 is the schematic diagram of one embodiment of the full-automatic manufacturing method of no substrate LED filament of the invention.
It is the system construction drawing of the manufacturing method of a whole set of fully-automatic production, the extension set of basic step and Fig. 3 described in Fig. 4 Manufacturing method is identical, the main distinction be full automatic each step by a roll of chip bearing belt deliver tandem working, each step with Step-by-step system is carried out by arrow direction (preceding line direction 12) in figure is synchronous, such as the forward step of a LED filament, each step want phase Mutually cooperation；Its manufacturing step includes:
A) prepare a roll of LED chip carrying belt 9a；The LED chip carrying belt 9a is by carrying tape base 10 and is overlying on its surface Do not solidify glue surface 11 composition, not the solidifying for tape base 10 of carrying has isolation film 9b in glue surface 11, a roll of LED chip is isolated The glue surface of each carrying belt in carrying belt 9a；When LED chip carrying belt 9a enters automatic production line, this isolation film is stripped；
B) not solidifying to be arranged successively in glue surface 11 and be equipped with electric lead-out wire 4 and at least a string of LED in chip bearing belt 9a The LED chip string of chip 2, while chip bearing belt is pressed preceding line direction 12 stepwise and is moved forward, one step of every forward movement is just pacified Fill a LED chip string and its electric lead-out wire 4；In chip bearing belt stepwise movement forward, LED chip string is by a string It connects a string and is mounted on and do not solidify in glue surface 11；Not solidifying for chip bearing belt is equipped with 2-10000 LED as a result, in glue surface 11 Chip string and its electric lead-out wire 4；Connecting line 13 is equipped between the electric lead-out wire 4 of adjacent LED filament string；
C) between the LED chip in every string LED chip string between LED chip and electric lead-out wire 4 spot welding electric connection line 3；
E) LED chip 2, electric connection line 3, electric lead-out wire 4 point welding end on coat the first luminous bisque 5, and it is tentatively solid Change；
F) LED chip carrying belt 9a is separated, is obtained initially without substrate LED filament 1；
G it) is glued in luminous arogel one side the second luminous bisque 8 of coating of nothing initially without substrate LED filament 1 or with transparent adhesive tape 14 Paste luminescent powder film 8, primary solidification；
H the connecting line 13 between the electric lead-out wire 4 of every string LED chip string) is cut off, as shown in 15 in figure；Obtain illuminant colour Be evenly distributed without substrate LED filament 6；
I the above-mentioned primary solidification of a batch) is concentrated feeding high temperature without substrate LED filament 6 or initially without substrate LED filament 1 Case sufficiently solidifies；Obtain initially without substrate LED filament 1 or illuminant colour be evenly distributed without substrate LED filament 6；
J) to it is above-mentioned initially without substrate LED filament 1 or illuminant colour be evenly distributed without substrate LED filament 6 carry out test and Classification.
The no full-automatic manufacturing method of substrate LED filament provided by the invention, preparation step further include: step C) and step E the step D between)), the step D) it is to coat transparent reinforced glue 7 on the point leg or whole filament of electric connection line 3, after Primary solidification；The transparent cured glue is UV glue, quick-setting silica gel or epoxy resin；
Above-mentioned primary solidification, which refers to, keeps colloid or arogel not to flow.
Fig. 5 is that initial no substrate LED filament 1 of the invention is pasted on transparent high thermal conductivity pipe 16, constitutes cylindricality without substrate LED filament light source 17 is used to manufacture the cross section structure schematic diagram of one embodiment of great power LED filament lamp.As shown in figure 5, extremely Few one is initially pasted onto the outer surface of transparent high thermal conductivity pipe 16 without substrate LED filament 1 with transparent adhesive tape or luminous arogel 18 Plane 19 for installing filament or its cylindrical surface 19a, Fig. 5 show two examples initially without substrate LED filament 1 Son；To constitute LED light source 17 of the column type without substrate LED filament.
The LED chip 2 of the initial LED filament 1 is affixed directly on high thermal conductivity pipe 16, chip 2 and high thermal conductivity Thermal resistance is small between pipe 16, and the surfaces externally and internally product of high thermal conductivity pipe is big, and good heat dissipation can be made into high efficiency, high-power high-luminous flux LED Filament lamp.
The transparent high thermal conductivity pipe 16 can be crystalline ceramics pipe, sapphire pipe, glass tube or plastic tube.
Fig. 6 is with initial no substrate LED filament 1 of the invention or the LED filament lamp 20 manufactured without substrate LED filament 6 The structural schematic diagram of one embodiment.The present embodiment include one or more vacuum sealings without substrate LED filament lamp 20, it is interior LED light tube 22 filled with heat radiation protection gas 21；One LED driver 23 and its shell 24；One electric connector 25；Fig. 6 It show the example of two LED light tube 22；Each luminous tube 22 include bulb shell 26 and with its vacuum-packed stem 27, Stem 27 includes pillar 27a and electric lead-out wire 27b；At least one initially without substrate LED filament 1 or without substrate LED filament 6 (example that Fig. 6 show two filaments) is mounted and is fixed on the pillar 27a and electric lead-out wire 27b of stem 27, LED light Connecting line 28 of the upper end of silk (1 or 6) through being fixed on pillar 27a is connected with each other, i.e., two filaments (1 or 6) are serially connected (can be serially connected, is in parallel or series-parallel, Fig. 6 show concatenated example), through electric lead-out wire 27b and LED filament lamp 20 The output of driver 23 connects, and the input of driver 23 is connect through connecting line 29 with electric connector 25, the shell 24 of driver 23 LED light tube 22, driver 23 and electric connector 25 are connected with each other and are fixed and constitutes a LED filament lamp 20；Electric connector 25 for connecting external power, and connecting external power can lightening LED lamp silk lamp 20.
Bulb shell 26 can be transparent bulb case, frosted blister or milky white blister.
If LED filament lamp 20 is to have a LED light tube 22, the shape of blister 22 can be white for A type, candle type, spherical shape etc. One of vehement bulb housing shape.LED light tube 22 can be interconnected and fixed directly or through connector 24 and electric connector 25.
Fig. 7 is one embodiment of the great power LED filament lamp 30 with cylindricality of the invention without substrate LED filament light source 17 Structural schematic diagram.At least one initially without substrate LED filament 1 by with transparent adhesive tape or luminescent powder glue in transparent high thermal conductivity On the outer surface of pipe 16；Fig. 7 show the example that each LED light tube 22 has two filaments 1, and the upper end of two filaments is through electricity Connecting line 32 is connected with each other, i.e. two filaments are serially connected, are connected by electric lead-out wire 27b with the output of driver 23；It is high The lower end of thermal conductivity pipe 16 is fixed by electric lead-out wire 27b, and the upper end is fixed by the fixed spring 31 on the pillar 27a of stem.
The initially LED chip 2 without substrate LED filament 1 is affixed directly on high thermal conductivity pipe 16, chip 2 and height Thermal resistance is small between thermal conductivity pipe 16, and the surfaces externally and internally product of high thermal conductivity pipe is big, connects with the heat dissipation gas 21 in LED filament bulb housing Contacting surface product is big, good heat dissipation, while LED filament lamp is made of multiple LED lamp tubes, the air between fluorescent tube can free flow, favorably It radiates in fluorescent tube, thus can be made into high efficiency, high-power high-luminous flux LED filament lamp.
The high-power no substrate LED filament lamp 30 of the present embodiment may be made as single tube or multitube (i.e. single bubble shell or more blisters) LED filament lamp, Fig. 7 show the example of two LED light tube 22.
The meaning of other Icon datas in Fig. 7 is identical as in Fig. 6.
The unlimited each embodiment introduced in this article of the scope of protection of present invention, it is all to be wanted based on the present patent application right It asks various forms of transformation and replacement made by range and description, all belong to the range that the present invention covers.

Claims (7)

1.一种无基板LED灯丝的制造方法，其为分机制造，其制备步骤包括：1. A manufacturing method of a substrateless LED filament, which is manufactured by an extension machine, and its preparation steps include: A)准备一片一面覆有低粘度不固化胶面(11)的LED芯片承载板(9)；A) prepare a piece of LED chip carrier board (9) covered with a low-viscosity non-curing adhesive surface (11) on one side; B)将相同或不相同发光色的LED芯片(2)成串地排列在承载板(9)的不固化胶面(11)上形成1-1000串LED芯片串；每串LED芯片串的一端或二端排布有电引出线(4)；每串LED芯片串的LED芯片(2)数量和间距按LED灯丝要求设定；B) Arrange the LED chips (2) of the same or different luminescent colors in a string on the non-curing adhesive surface (11) of the carrier board (9) to form 1-1000 LED chip strings; one end of each LED chip string Or two ends are arranged with electrical lead wires (4); the number and spacing of the LED chips (2) of each LED chip string are set according to the requirements of the LED filament; C)在每串LED芯片串的LED芯片(2)之间和LED芯片与电引出线(4)之间点焊电连接线(3)；C) spot welding the electrical connection wires (3) between the LED chips (2) of each LED chip string and between the LED chips and the electrical lead wires (4); E)在LED芯片(2)、电引出线(4)、电连接线(3)及点焊脚上涂覆第一发光粉层(5)并固化；E) Coating and curing the first luminescent powder layer (5) on the LED chip (2), the electrical lead wires (4), the electrical connection wires (3) and the spot welding pins; F)分离LED芯片承载板(9)，得到初始无基板LED灯丝(1)；F) separating the LED chip carrier plate (9) to obtain an initial substrateless LED filament (1); G)在初始无基板LED灯丝(1)的无发光粉层一面涂覆第二发光粉层或粘贴发光粉膜(8)，固化；得到发光色分布均匀的无基板LED灯丝(6)；G) coating a second luminescent powder layer or pasting a luminescent powder film (8) on one side of the non-luminescent powder layer of the initial substrate-free LED filament (1), and curing; obtaining a substrate-free LED filament (6) with uniform luminescent color distribution; H)对所得初始无基板LED灯丝(1)和无基板LED灯丝(6)进行测试及分类。H) Testing and classifying the resulting initial substrateless LED filament (1) and substrateless LED filament (6). 2.根据权利要求1所述的无基板LED灯丝的制造方法，其步骤还包括：在步骤C)和步骤E)之间的步骤D)，所述步骤D)为：在电连接线(3)的点焊脚上或整串LED芯片串上涂覆透明加固胶(7)并固化；所述透明加固胶(7)为UV胶、硅胶或环氧树脂。2. The method for manufacturing a substrateless LED filament according to claim 1, further comprising: a step D) between the step C) and the step E), wherein the step D) is: in the electrical connection line (3) ) or the entire string of LED chips is coated with transparent reinforcement glue (7) and cured; the transparent reinforcement glue (7) is UV glue, silica gel or epoxy resin. 3.根据权利要求1所述的无基板LED灯丝的制造方法，其特征在于，所述承载板基(10)由金属、塑料、陶瓷或玻璃制成；所述不固化胶面(11)为不干胶、UV胶、不加固化剂或催化剂的硅胶、环氧树脂材质。3 . The manufacturing method of a substrateless LED filament according to claim 1 , wherein the carrier plate base ( 10 ) is made of metal, plastic, ceramic or glass; the non-curing glue surface ( 11 ) is 3 . Self-adhesive, UV adhesive, silica gel and epoxy resin without curing agent or catalyst. 4.根据权利要求1所述的无基板LED灯丝的制造方法，其特征在于，所述第一发光粉层(5)、第二发光粉层和发光粉膜(8)由透明介质和发光粉混合制成；所述透明介质为硅胶、环氧树脂、UV胶或塑料。4. The method for manufacturing a substrateless LED filament according to claim 1, wherein the first luminescent powder layer (5), the second luminescent powder layer and the luminescent powder film (8) are composed of a transparent medium and a luminescent powder Mixed and made; the transparent medium is silica gel, epoxy resin, UV glue or plastic. 5.一种无基板LED灯丝的制造方法，其为全自动制造，其制备步骤包括：5. A method for manufacturing a substrateless LED filament, which is fully automatic manufacturing, and the preparation steps include: A)准备一卷LED芯片承载带(9a)；A) Prepare a roll of LED chip carrier tape (9a); 所述LED芯片承载带(9a)由承载带基(10)和覆于其表面的不固化胶面(11)组成，所述LED芯片承载带的不固化胶面(11)上覆有隔离膜(9b)，以隔离一卷LED芯片承载带(9a)中各承载带的胶面；在LED芯片承载带(9a)进入全自动生产线时，此隔离膜被剥离；The LED chip carrier tape (9a) is composed of a carrier tape base (10) and a non-curing adhesive surface (11) covering the surface thereof, and the non-curing adhesive surface (11) of the LED chip carrier tape is covered with an isolation film (9b), to isolate the adhesive surface of each carrier tape in a roll of LED chip carrier tape (9a); when the LED chip carrier tape (9a) enters the fully automatic production line, the isolation film is peeled off; B)在芯片承载带(9a)上的不固化胶面(11)上依次排列安装有电引出线(4)和至少一串LED芯片(2)的LED芯片串，同时芯片承载带以步进方式按前行方向(12)向前移动，每向前移动一步便安装一条LED芯片串及其电引出线(4)；在芯片承载带步进地向前移动过程中，一条LED芯片串及其电引出线(4)接着一条LED芯片串及其电引出线(4)被安装在不固化胶面(11)上；由此，芯片承载带的不固化胶面(11)上安装2-10000条LED芯片串及其电引出线(4)；相邻LED灯丝的电引出线(4)之间设有连接线(13)；B) On the non-curing adhesive surface (11) on the chip carrier tape (9a), the LED chip strings with the electrical lead wires (4) and at least one string of LED chips (2) are arranged in sequence, and the chip carrier tape is arranged in a step-by-step manner. The method moves forward in the forward direction (12), and installs an LED chip string and its electrical lead wire (4) each time it moves forward; during the stepwise forward movement of the chip carrier tape, an LED chip string and Its electrical lead-out line (4) followed by a LED chip string and its electrical lead-out line (4) are mounted on the non-curing adhesive surface (11); 10,000 LED chip strings and their electrical lead wires (4); connecting wires (13) are provided between the electrical lead wires (4) of adjacent LED filaments; C)在每串LED芯片串中的LED芯片之间和LED芯片与电引出线(4)之间点焊电连接线(3)；C) spot welding the electrical connection wires (3) between the LED chips in each string of LED chips and between the LED chips and the electrical lead wires (4); E)在LED芯片(2)、电引出线(4)电连接线(3)焊接端上涂覆第一发光粉层(5)，并初步固化；E) coating the first luminescent powder layer (5) on the welding end of the LED chip (2), the electrical lead wire (4) and the electrical connection wire (3), and preliminarily curing; F)把LED芯片承载带(9a)分离，得到初始无基板LED灯丝(1)；F) separating the LED chip carrier tape (9a) to obtain an initial substrateless LED filament (1); G)在初始无基板LED灯丝(1)的无发光粉层一面涂覆第二发光粉层(8)或用透明胶(14)粘贴发光粉膜(8)，初步固化；G) Coating the second luminescent powder layer (8) on the non-luminescent powder layer side of the initial substrate-free LED filament (1) or pasting the luminescent powder film (8) with a transparent glue (14), and preliminarily curing; H)切断各串LED芯片串的电引出线(4)之间的连接线(13)，得到发光色分布均匀的无基板LED灯丝(6)；H) cutting off the connecting wires (13) between the electrical lead wires (4) of each LED chip string to obtain a substrateless LED filament (6) with uniform luminous color distribution; I)把一批上述初步固化的无基板LED灯丝(6)或初始无基板LED灯丝(1)集中送入高温箱充分固化；得到初始无基板LED灯丝(1)或发光色分布均匀的无基板LED灯丝(6)；1) send a batch of above-mentioned preliminarily solidified substrateless LED filaments (6) or initial substrateless LED filaments (1) into a high-temperature oven for full curing; obtain initial substrateless LED filaments (1) or a substrateless substrateless LED filament (1) with uniform luminous color distribution LED filament (6); J)对上述初始无基板LED灯丝(1)或发光色分布均匀的无基板LED灯丝(6)进行测试和分类。J) Testing and classifying the above-mentioned initial substrateless LED filament (1) or substrateless LED filament (6) with uniform emission color distribution. 6.根据权利要求5所述的无基板LED灯丝的制造方法，其特征在于，其制备步骤还包括：步骤C)和步骤E)之间的步骤D)，所述步骤D)为在电连接线(3)的点焊脚或整条灯丝包括点焊脚上涂覆透明加固胶(7)，后初步固化；所述初步固化是指保持透明加固胶不流动；所述透明固化胶为UV胶、硅胶或环氧树脂。6 . The method for manufacturing a substrateless LED filament according to claim 5 , wherein the preparation step further comprises: a step D) between the steps C) and E), and the step D) is to electrically connect The spot welding legs of the line (3) or the entire filament including the spot welding legs are coated with a transparent reinforcing glue (7), and then preliminarily cured; the preliminary curing refers to keeping the transparent reinforcing glue from flowing; the transparent curing glue is UV glue, silicone or epoxy. 7.根据权利要求5所述的无基板LED灯丝的制造方法，其特征在于，所述芯片承载带(9a)的承载带基(10)由金属、塑料、陶瓷或玻璃制成；所述不固化胶面(11)为不干胶、UV胶、不加固化剂或催化剂的硅胶、环氧树脂。7. The method for manufacturing a substrateless LED filament according to claim 5, wherein the carrier tape base (10) of the chip carrier tape (9a) is made of metal, plastic, ceramic or glass; The cured adhesive surface (11) is self-adhesive, UV adhesive, silica gel without curing agent or catalyst, and epoxy resin.
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