CN105140057A - Nitride enhanced copper-based electrical contact composite material - Google Patents
Nitride enhanced copper-based electrical contact composite material Download PDFInfo
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- CN105140057A CN105140057A CN201510383461.6A CN201510383461A CN105140057A CN 105140057 A CN105140057 A CN 105140057A CN 201510383461 A CN201510383461 A CN 201510383461A CN 105140057 A CN105140057 A CN 105140057A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract 12
- 229910052802 copper Inorganic materials 0.000 title claims abstract 12
- 239000010949 copper Substances 0.000 title claims abstract 12
- 239000002131 composite material Substances 0.000 title claims abstract 6
- 150000004767 nitrides Chemical class 0.000 title claims abstract 6
- 239000000463 material Substances 0.000 claims abstract 8
- 238000005245 sintering Methods 0.000 claims abstract 7
- 239000000843 powder Substances 0.000 claims abstract 6
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims abstract 6
- 229910052727 yttrium Inorganic materials 0.000 claims abstract 5
- 229910052797 bismuth Inorganic materials 0.000 claims abstract 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract 4
- 238000002360 preparation method Methods 0.000 claims abstract 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical group [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims abstract 3
- 239000012535 impurity Substances 0.000 claims abstract 3
- 239000000203 mixture Substances 0.000 claims abstract 3
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims abstract 3
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract 3
- 150000002910 rare earth metals Chemical class 0.000 claims abstract 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract 2
- 238000007731 hot pressing Methods 0.000 claims abstract 2
- GBAOZECSOKXKEL-UHFFFAOYSA-N copper yttrium Chemical compound [Cu].[Y] GBAOZECSOKXKEL-UHFFFAOYSA-N 0.000 claims 3
- 229910000946 Y alloy Inorganic materials 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- AJXBBNUQVRZRCZ-UHFFFAOYSA-N azanylidyneyttrium Chemical compound [Y]#N AJXBBNUQVRZRCZ-UHFFFAOYSA-N 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- 229910052593 corundum Inorganic materials 0.000 claims 1
- 239000010431 corundum Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000011812 mixed powder Substances 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 238000002679 ablation Methods 0.000 abstract 1
- 238000000889 atomisation Methods 0.000 abstract 1
- 239000011159 matrix material Substances 0.000 abstract 1
- 238000002156 mixing Methods 0.000 abstract 1
- 239000002994 raw material Substances 0.000 abstract 1
- 230000003014 reinforcing effect Effects 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/025—Composite material having copper as the basic material
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Powder Metallurgy (AREA)
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Abstract
本发明涉及一种氮化物增强铜基电接触复合材料,其组成配方用重量百分数表示为:0.5-4%氮化物,0.5-4%铋,0.1-0.6%稀土钇,0.5-2.5%氧化钇,其余为铜及其他不可避免的杂质;其中氮化物为氮化钛或氮化铝。本发明材料通过雾化制粉、配料、混合、真空热压烧结的制备方法制成。本发明的材料以铜为基体,主要原材料资源丰富,氮化物以增强相的形式均匀弥散分布于铜基材,提高了材料内部组织结构的细微化程度,材料不但具备良好的导电性导热性、抗熔焊性、抗电弧烧蚀性能,而且力学性能和耐磨性优良,能满足电触头等制件对材料的基本要求,可以应用于中低电负载的电源开关、继电器、直流接触器、空气开关等低压电器中。相比于银基电接触材料,性价比更具优势。The invention relates to a nitride-reinforced copper-based electrical contact composite material, the composition of which is represented by weight percent: 0.5-4% nitride, 0.5-4% bismuth, 0.1-0.6% rare earth yttrium, 0.5-2.5% yttrium oxide , and the rest are copper and other unavoidable impurities; among them, the nitride is titanium nitride or aluminum nitride. The material of the invention is made through the preparation methods of atomization powder making, batching, mixing, and vacuum hot pressing and sintering. The material of the present invention uses copper as the matrix, and the main raw material resources are abundant, and the nitride is uniformly dispersed and distributed on the copper base material in the form of a reinforcing phase, which improves the degree of miniaturization of the internal structure of the material, and the material not only has good electrical and thermal conductivity, Welding resistance, arc ablation resistance, and excellent mechanical properties and wear resistance, can meet the basic requirements for materials such as electrical contacts, and can be applied to power switches, relays, and DC contactors with medium and low electrical loads , Air switch and other low-voltage electrical appliances. Compared with silver-based electrical contact materials, the cost performance is more advantageous.
Description
技术领域 technical field
本发明涉及一种氮化物增强铜基电接触复合材料,特别涉及一种添加适量氮化物制备铜基电接触材料的方法,可以应用于中低电负载的电源开关、继电器、直流接触器、转换器等中低压电器中。 The invention relates to a nitride-reinforced copper-based electrical contact composite material, in particular to a method for preparing a copper-based electrical contact material by adding an appropriate amount of nitrides, which can be applied to power switches, relays, DC contactors, and converters with medium and low electrical loads. In low-voltage electrical appliances such as appliances.
背景技术 Background technique
弱电接触元件是仪器仪表的关键部件,对仪器仪表的寿命和工作可靠性起着重要作用,为了保证弱电触头工作可靠性,国内外普遍采用贵金属银及其合金材料制作。近年来,为了减少银金属的损耗,人们不断寻求新的节银、代银技术途径。铜的电和导热性质上与银最相近,所以,铜是作为导电材料,代替银的最合适元素,但是铜作为电接触材料的主要障碍在于铜基材料表面在大气环境条件下容易氧化,且其氧化物(CuO和Cu2O)具有很低的电导率,急剧增大了元件的接触电阻,使材料在使用中容易发热,直接影响电开关的工作可靠性和寿命,使铜及一般的铜合金难于作为接触材料应用。研究表明,电触头在开闭过程中产生的电熔焊和电弧侵蚀现象极其复杂,在电弧能量、接触压力和环境因素的综合作用下,触头表面发生加热、熔化、汽化、流动和凝固等物理冶金过程,导致触头表面产生熔融、软化、喷溅、流动和裂纹等现象。因此,要求触头材料除具有良好的物理性能外,还具有优良的力学性能及化学稳定性。但是金属铜比较银而言易氧化,且氧化产物电阻很大,如果纯铜用作电接触材料,会使接触电阻骤然上升,尤其在电接触器分断和闭合过程中,电熔焊和电弧侵蚀现象严重,触头材料寿命大大缩短。 Weak current contact elements are the key components of instruments and meters, which play an important role in the life and reliability of instruments and meters. In order to ensure the reliability of weak current contacts, precious metal silver and its alloy materials are widely used at home and abroad. In recent years, in order to reduce the loss of silver metal, people are constantly seeking new ways of saving and replacing silver. The electrical and thermal conductivity of copper is the closest to that of silver, so copper is the most suitable element to replace silver as a conductive material, but the main obstacle for copper as an electrical contact material is that the surface of copper-based materials is easily oxidized under atmospheric conditions, and Its oxides (CuO and Cu 2 O) have very low electrical conductivity, which sharply increases the contact resistance of the element, makes the material easy to generate heat during use, and directly affects the working reliability and life of the electric switch. Copper alloys are difficult to apply as contact materials. Studies have shown that the phenomenon of electrofusion welding and arc erosion generated during the opening and closing process of electrical contacts is extremely complex. Under the combined effects of arc energy, contact pressure and environmental factors, the contact surface is heated, melted, vaporized, flowed and solidified And other physical metallurgical processes, resulting in melting, softening, splashing, flow and cracks on the contact surface. Therefore, in addition to good physical properties, contact materials are required to have excellent mechanical properties and chemical stability. However, metal copper is easy to oxidize compared to silver, and the oxidation product has a large resistance. If pure copper is used as an electrical contact material, the contact resistance will rise suddenly, especially in the process of breaking and closing the electrical contactor, electrofusion welding and arc erosion The phenomenon is serious, and the life of the contact material is greatly shortened.
发明内容 Contents of the invention
本发明的目的在于提供一种价格低、导电率及导热率高、接触电阻低且稳定、抗熔焊性能佳、抗氧化性能及力学性能良好、并易制备的铜基电接触复合材料,以替代原材料价格高的银基电接触材料。本发明的另一目的在于提供上述材料的一种制备成型方法。 The purpose of the present invention is to provide a copper-based electrical contact composite material that is low in price, high in electrical conductivity and thermal conductivity, low and stable in contact resistance, good in welding resistance, good in oxidation resistance and mechanical properties, and easy to prepare. It can replace silver-based electrical contact materials with high raw material prices. Another object of the present invention is to provide a preparation and molding method of the above-mentioned material.
本发明是通过以下措施来实现的: The present invention is achieved through the following measures:
本发明的氮化物增强铜基电接触复合材料,其组成配方用重量百分数表示为:0.5-5%氮化物,0.5-4%铋,0.1-0.6%稀土钇,0.5-2.5%氧化钇,其余为铜及其他不可避免的杂质;其中氮化物为氮化钛或氮化铝。 The nitride-reinforced copper-based electrical contact composite material of the present invention has a formula expressed in weight percent: 0.5-5% nitride, 0.5-4% bismuth, 0.1-0.6% rare earth yttrium, 0.5-2.5% yttrium oxide, and the rest It is copper and other unavoidable impurities; among them, the nitride is titanium nitride or aluminum nitride.
本发明的氮化物增强铜基电接触复合材料,其优选组成为:1.5%氮化钛、2%铋、0.2%钇、1%氧化钇,其余为铜及其他不可避免的杂质。 The preferred composition of the nitride-reinforced copper-based electrical contact composite material of the present invention is: 1.5% titanium nitride, 2% bismuth, 0.2% yttrium, 1% yttrium oxide, and the rest is copper and other unavoidable impurities.
本发明的一种氮化物增强铜基电接触复合材料,其具体步骤为: A kind of nitride reinforced copper-based electrical contact composite material of the present invention, its specific steps are:
(1)首先,采用雾化法将稀土钇和铜制成钇含量为0.1-0.6%的钇-铜合金粉,按照所述成分配比,将粒度为100-300目的铜-钇合金粉、铋粉、氧化钇粉、氮化物粉末进行球磨混粉1-3小时,球磨机转速为每分钟150-300转。 (1) First, the rare earth yttrium and copper are made into yttrium-copper alloy powder with a yttrium content of 0.1-0.6% by the atomization method, and the copper-yttrium alloy powder with a particle size of 100-300 meshes is prepared according to the composition ratio. The bismuth powder, yttrium oxide powder, and nitride powder are mixed by ball milling for 1-3 hours, and the rotating speed of the ball mill is 150-300 revolutions per minute.
(2)将上述混合均匀的粉末进行真空热压烧结。压力为20-50MPa,烧结温度为750-950℃,在达到预定的温度时施加压力,保温时间为1-3小时,其中当采用的烧结温度较高时,保温时间则可以适当的缩短。当降温到300-500℃时卸压。升温速率为5-15℃/min,冷却到200℃后取样。整个烧结过程保持炉内真空度低于1×10-2Pa。 (2) Vacuum hot pressing and sintering the uniformly mixed powder. The pressure is 20-50MPa, the sintering temperature is 750-950°C, the pressure is applied when the predetermined temperature is reached, and the holding time is 1-3 hours. When the sintering temperature is higher, the holding time can be appropriately shortened. Release the pressure when the temperature drops to 300-500°C. The heating rate is 5-15°C/min, and samples are taken after cooling to 200°C. During the whole sintering process, keep the vacuum degree in the furnace lower than 1×10 -2 Pa.
本发明的制备方法中,球磨所用料球为刚玉球,球料比为15:1。 In the preparation method of the present invention, the balls used in the ball mill are corundum balls, and the ball-to-material ratio is 15:1.
本发明的铜基电接触复合材料主要应用于中低电负载的电源开关、继电器、直流接触器、空气开关等低压电器中。选用铜作为基体,铜与银比较,价格低廉,且资源较丰富,其导电导热性、抗熔焊性、电流蚀及摩擦特性均可与银媲美,能满足电接触材料基体的要求。考虑到触头材料力学、电接触性能等要求,采用了低沸点金属铋作为息弧组元;加入稀土元素改善抗氧化性能和综合性能;加入氧化钇提高材料的抗电弧烧蚀性能;加入氮化物(氮化钛或氮化铝)的主要目的在于:在烧结过程中氮化物能有效防止铜晶粒粗化,使基体晶粒细小,提高了材料内部组织结构的细微化程度,使得电接触材料在使用过程中不易熔焊,从而提高材料的抗熔焊性能和力学性能。 The copper-based electrical contact composite material of the invention is mainly used in low-voltage electrical appliances such as power switches, relays, DC contactors, and air switches with medium and low electrical loads. Copper is selected as the matrix. Compared with silver, copper is cheap and abundant in resources. Its electrical and thermal conductivity, welding resistance, current corrosion and friction characteristics are comparable to silver, which can meet the requirements of the electrical contact material matrix. Considering the requirements of contact material mechanics and electrical contact performance, low-boiling metal bismuth is used as the arc-stopping component; rare earth elements are added to improve oxidation resistance and comprehensive performance; yttrium oxide is added to improve the arc ablation resistance of the material; nitrogen is added The main purpose of the nitride (titanium nitride or aluminum nitride) is: during the sintering process, the nitride can effectively prevent the coarsening of the copper grains, make the matrix grains finer, improve the microstructure of the internal structure of the material, and make the electrical contact The material is not easy to weld during use, thereby improving the anti-welding performance and mechanical properties of the material.
采用本发明的方法制备的上述复合材料,材料的致密度高,材料具有优良的电性能和力学性能,材料抗熔焊性能和耐氧化性好,接触电阻稳定,导电性良好,抗电弧烧蚀性能优良,且制备工艺简单,可以一次成型,是一种特别适用于频繁开闭的中低压电器用接触材料。 The composite material prepared by the method of the present invention has high material density, excellent electrical and mechanical properties, good welding resistance and oxidation resistance, stable contact resistance, good electrical conductivity, and arc ablation resistance. It has excellent performance, simple preparation process, and can be molded at one time. It is a contact material especially suitable for frequent opening and closing of medium and low voltage electrical appliances.
具体实施方式 Detailed ways
实施例1: Example 1:
本实施例材料的组成重量配比为:2%铋、0.5%氮化钛、0.2%稀土钇、1%氧化钇、余量为铜。 The composition weight ratio of the material in this embodiment is: 2% bismuth, 0.5% titanium nitride, 0.2% rare earth yttrium, 1% yttrium oxide, and the balance is copper.
首先,按照组成配比,将稀土钇和铜制成钇含量为0.05%、粒度为100-300目的铜-钇合金粉,再加入粒度为200目的铋粉进行球磨混合,球磨时间为2小时,球磨所用料球为的刚玉球,球料比为15:1;然后加入0.5%的氮化钛和1%的氧化钇进行机械混粉;混合均匀后用真空热压炉烧结成型,压制压力为20MPa,烧结温度为800℃,在达到预定温度时施加压力,保温时间为2小时,然后降温到400℃时卸压。升温速率在400℃前为10℃/min,400℃后为5℃/min,冷却到200℃后取样。整个烧结过程保持炉内真空度低于1×10-2Pa。经以上工艺过程,制成铜基电接触复合材料或者制件。 First, according to the composition ratio, the rare earth yttrium and copper are made into copper-yttrium alloy powder with a yttrium content of 0.05% and a particle size of 100-300 mesh, and then adding bismuth powder with a particle size of 200 mesh for ball milling. The ball milling time is 2 hours. The balls used in the ball mill are corundum balls, the ball-to-material ratio is 15:1; then 0.5% titanium nitride and 1% yttrium oxide are added for mechanical powder mixing; after mixing evenly, they are sintered in a vacuum hot-press furnace, and the pressure is pressed The sintering temperature is 20MPa, the sintering temperature is 800°C, the pressure is applied when the predetermined temperature is reached, the holding time is 2 hours, and then the pressure is released when the temperature is lowered to 400°C. The heating rate was 10°C/min before 400°C, 5°C/min after 400°C, and samples were taken after cooling to 200°C. During the whole sintering process, keep the vacuum degree in the furnace lower than 1×10 -2 Pa. Through the above process, a copper-based electrical contact composite material or part is made.
本材料基本性能:致密度99.36%;电阻率3.08μΩ·cm;硬度48HB;400℃大气环境条件下氧化20h的氧化增重1.25mg/cm2(纯铜的为5mg/cm2)。 Basic properties of this material: Density 99.36%; Resistivity 3.08μΩ·cm; Hardness 48HB; Oxidation weight gain of 1.25mg/cm 2 (for pure copper 5mg/cm 2 ) oxidized for 20h under atmospheric conditions at 400°C.
实施例2: Example 2:
本实施例材料的组成重量配比为:2%铋、1.5%氮化钛、0.2%稀土钇、1%氧化钇、余量为铜。 The composition weight ratio of the material in this embodiment is: 2% bismuth, 1.5% titanium nitride, 0.2% rare earth yttrium, 1% yttrium oxide, and the balance is copper.
按照本组成配比和实施例1同样的制备工艺步骤和参数进行球磨、混粉、真空热压烧结。经以上工艺过程,制成铜基电接触复合材料或者制件。 Ball milling, powder mixing, and vacuum hot-press sintering were carried out according to the same preparation process steps and parameters as in Example 1. Through the above process, a copper-based electrical contact composite material or part is made.
本材料基本性能:致密度99.46%;电阻率2.97μΩ·cm;硬度57HB;400℃大气环境条件下氧化20h的氧化增重1.08mg/cm2。 The basic properties of this material: Density 99.46%; Resistivity 2.97μΩ·cm; Hardness 57HB; Oxidation weight gain 1.08mg/cm 2 under 400℃ atmospheric conditions for 20h.
实施例3: Example 3:
本实施例材料的组成重量配比为:4%铋、1.5%氮化钛、0.2%稀土钇、1%氧化钇、余量为铜。 The composition weight ratio of the material in this embodiment is: 4% bismuth, 1.5% titanium nitride, 0.2% rare earth yttrium, 1% yttrium oxide, and the balance is copper.
按照本组成配比和实施例1同样的制备工艺步骤和参数进行球磨,混粉,真空热压烧结。经以上工艺过程,制成铜基电接触复合材料或者制件。 Ball milling, powder mixing, and vacuum hot-press sintering were carried out according to the same preparation process steps and parameters as in Example 1. Through the above process, a copper-based electrical contact composite material or part is made.
本材料基本性能:致密度98.76%;电阻率3.75μΩ·cm;硬度60HB;400℃大气环境条件下氧化20h的氧化增重2.25mg/cm2。 The basic properties of this material: Density 98.76%; Resistivity 3.75μΩ·cm; Hardness 60HB; Oxidation weight gain 2.25mg/cm 2 under 400℃ atmospheric conditions for 20h.
实施例4: Example 4:
本实施例材料的组成重量配比为:2%铋、5%氮化钛、0.2%稀土钇、1%氧化钇、余量为铜。 The composition weight ratio of the material in this embodiment is: 2% bismuth, 5% titanium nitride, 0.2% rare earth yttrium, 1% yttrium oxide, and the balance is copper.
按照本组成配比和实施例1同样的制备工艺步骤和参数进行球磨,混粉,真空热压烧结。经以上工艺过程,制成铜基电接触复合材料或者制件。 Ball milling, powder mixing, and vacuum hot-press sintering were carried out according to the same preparation process steps and parameters as in Example 1. Through the above process, a copper-based electrical contact composite material or part is made.
本材料基本性能:致密度98.86%;电阻率3.32μΩ·cm;硬度61HB;400℃大气环境条件下氧化20h的氧化增重1.60mg/cm2。 Basic properties of this material: Density 98.86%; Resistivity 3.32μΩ·cm; Hardness 61HB; Oxidation weight gain 1.60mg/cm 2 under 400℃ atmospheric environment for 20h.
实施例5: Example 5:
本实施例材料的组成重量配比为:2%铋、0.5%氮化铝、0.2%稀土钇、1%氧化钇、余量为铜。 The composition weight ratio of the material in this embodiment is: 2% bismuth, 0.5% aluminum nitride, 0.2% rare earth yttrium, 1% yttrium oxide, and the balance is copper.
按照本组成配比和实施例1同样的制备工艺步骤和参数进行球磨,混粉,真空热压烧结。经以上工艺过程,制成铜基电接触复合材料或者制件。 Ball milling, powder mixing, and vacuum hot-press sintering were carried out according to the same preparation process steps and parameters as in Example 1. Through the above process, a copper-based electrical contact composite material or part is made.
本材料基本性能:致密度98.25%;电阻率3.13μΩ·cm;硬度49HB;400℃大气环境条件下氧化20h的氧化增重1.30mg/cm2。 Basic properties of this material: Density 98.25%; Resistivity 3.13μΩ·cm; Hardness 49HB; Oxidation weight gain of 1.30mg/cm 2 oxidized for 20h at 400℃ atmospheric environment.
实施例6: Embodiment 6:
本实施例材料的组成重量配比为:2%铋、1.5%氮化铝、0.2%稀土钇、1%氧化钇、余量为铜。 The composition weight ratio of the material in this embodiment is: 2% bismuth, 1.5% aluminum nitride, 0.2% rare earth yttrium, 1% yttrium oxide, and the balance is copper.
按照本组成配比和实施例1同样的制备工艺步骤和参数进行球磨,混粉,真空热压烧结。经以上工艺过程,制成铜基电接触复合材料或者制件。 Ball milling, powder mixing, and vacuum hot-press sintering were carried out according to the same preparation process steps and parameters as in Example 1. Through the above process, a copper-based electrical contact composite material or part is made.
本材料基本性能:致密度98.75%;电阻率3.35μΩ·cm;硬度56HB;400℃大气环境条件下氧化20h的氧化增重1.62mg/cm2。 Basic properties of this material: Density 98.75%; Resistivity 3.35μΩ·cm; Hardness 56HB; Oxidation weight gain of 1.62mg/cm 2 under 400℃ atmospheric conditions for 20h.
对比测试例: Comparative test example:
将本发明实施例1-6的复合材料与银-氧化锡电触头材料进行电接触强化测试,测试条件为:阻性交流电流40A,电压54V,起弧频率26次/分钟,试验次数20000次,实验结果如表1所示。由表1.中试样1、2、4对比可以看出:(1)随着氮化物量在0-5%范围内增加时,电强化试样表面的质量损失逐渐减少,即抗熔焊性能和抗电弧烧蚀能力逐步增强;(2)新制材料的质量损失均明显低于银-氧化锡电触头材料,且试样3(铋含量为4%)的质量损失最少,也验证了铋的添加有利于提高材料的抗熔焊性能。 Conduct an electrical contact strengthening test on the composite material of Examples 1-6 of the present invention and the silver-tin oxide electrical contact material. The test conditions are: resistive AC current 40A, voltage 54V, arcing frequency 26 times/min, test times 20000 times, the experimental results are shown in Table 1. From the comparison of samples 1, 2, and 4 in Table 1., it can be seen that: (1) As the amount of nitride increases in the range of 0-5%, the mass loss on the surface of the electro-strengthened sample gradually decreases, that is, the resistance to fusion welding The performance and arc ablation resistance are gradually enhanced; (2) The mass loss of the new material is significantly lower than that of the silver-tin oxide electrical contact material, and the mass loss of sample 3 (with a bismuth content of 4%) is the least, which also verifies The addition of bismuth is beneficial to improve the welding resistance of the material.
表1.各试样的电接触强化实验后的质量损失 Table 1. Mass loss after electrical contact strengthening experiment of each sample
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105551839A (en) * | 2016-02-26 | 2016-05-04 | 济南大学 | Copper-plated graphene/copper-based electrical contact material and preparation method thereof |
CN109280793A (en) * | 2018-10-15 | 2019-01-29 | 安徽银点电子科技有限公司 | A kind of copper-based electrical contact material of highly resistance arc erosion and preparation method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1667768A (en) * | 2005-02-23 | 2005-09-14 | 济南大学 | Copper-based electrical contact composite material and preparation method thereof |
JP2008212946A (en) * | 2007-02-28 | 2008-09-18 | Toshiba Corp | Manufacturing method of contact material for vacuum circuit breaker |
CN103352136A (en) * | 2013-07-07 | 2013-10-16 | 温州银泰合金材料有限公司 | Copper-based contact material and manufacturing process thereof |
-
2015
- 2015-07-03 CN CN201510383461.6A patent/CN105140057A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1667768A (en) * | 2005-02-23 | 2005-09-14 | 济南大学 | Copper-based electrical contact composite material and preparation method thereof |
JP2008212946A (en) * | 2007-02-28 | 2008-09-18 | Toshiba Corp | Manufacturing method of contact material for vacuum circuit breaker |
CN103352136A (en) * | 2013-07-07 | 2013-10-16 | 温州银泰合金材料有限公司 | Copper-based contact material and manufacturing process thereof |
Non-Patent Citations (1)
Title |
---|
刘德宝: "氮化物陶瓷颗粒增强铜基复合材料的干摩擦磨损性能研究", 《摩擦学学报》 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105551839A (en) * | 2016-02-26 | 2016-05-04 | 济南大学 | Copper-plated graphene/copper-based electrical contact material and preparation method thereof |
CN105551839B (en) * | 2016-02-26 | 2018-05-25 | 济南大学 | A kind of copper-plated graphite alkene/copper-based electrical contact material and preparation method thereof |
CN109280793A (en) * | 2018-10-15 | 2019-01-29 | 安徽银点电子科技有限公司 | A kind of copper-based electrical contact material of highly resistance arc erosion and preparation method thereof |
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