CN105111844A - Anti-peeling heat-dissipation paint and preparation method therefor - Google Patents
Anti-peeling heat-dissipation paint and preparation method therefor Download PDFInfo
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- CN105111844A CN105111844A CN201510496844.4A CN201510496844A CN105111844A CN 105111844 A CN105111844 A CN 105111844A CN 201510496844 A CN201510496844 A CN 201510496844A CN 105111844 A CN105111844 A CN 105111844A
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- 238000002360 preparation method Methods 0.000 title claims description 7
- 230000017525 heat dissipation Effects 0.000 title abstract 3
- 239000003973 paint Substances 0.000 title abstract 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims abstract description 39
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims abstract description 26
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 claims abstract description 13
- 239000000843 powder Substances 0.000 claims abstract description 13
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims abstract description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 11
- -1 sodium nitride Chemical class 0.000 claims abstract description 8
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 7
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000292 calcium oxide Substances 0.000 claims abstract description 7
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims abstract description 7
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims abstract description 7
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920001903 high density polyethylene Polymers 0.000 claims abstract description 7
- 239000004700 high-density polyethylene Substances 0.000 claims abstract description 7
- 229910052901 montmorillonite Inorganic materials 0.000 claims abstract description 7
- TVDSBUOJIPERQY-UHFFFAOYSA-N prop-2-yn-1-ol Chemical compound OCC#C TVDSBUOJIPERQY-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 239000011734 sodium Substances 0.000 claims abstract description 7
- 229910052708 sodium Inorganic materials 0.000 claims abstract description 7
- 235000010378 sodium ascorbate Nutrition 0.000 claims abstract description 7
- PPASLZSBLFJQEF-RKJRWTFHSA-M sodium ascorbate Substances [Na+].OC[C@@H](O)[C@H]1OC(=O)C(O)=C1[O-] PPASLZSBLFJQEF-RKJRWTFHSA-M 0.000 claims abstract description 7
- 229960005055 sodium ascorbate Drugs 0.000 claims abstract description 7
- PPASLZSBLFJQEF-RXSVEWSESA-M sodium-L-ascorbate Chemical compound [Na+].OC[C@H](O)[C@H]1OC(=O)C(O)=C1[O-] PPASLZSBLFJQEF-RXSVEWSESA-M 0.000 claims abstract description 7
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 7
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229920000147 Styrene maleic anhydride Polymers 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 22
- 238000003756 stirring Methods 0.000 claims description 15
- 238000001291 vacuum drying Methods 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 13
- 230000005855 radiation Effects 0.000 claims description 13
- PXIPVTKHYLBLMZ-UHFFFAOYSA-N Sodium azide Chemical compound [Na+].[N-]=[N+]=[N-] PXIPVTKHYLBLMZ-UHFFFAOYSA-N 0.000 claims description 12
- 239000005543 nano-size silicon particle Substances 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- 238000000498 ball milling Methods 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 9
- 238000000967 suction filtration Methods 0.000 claims description 9
- 239000002105 nanoparticle Substances 0.000 claims description 8
- 125000000304 alkynyl group Chemical group 0.000 claims description 7
- IMYZYCNQZDBZBQ-SJORKVTESA-N (9S,10R)-epoxyoctadecanoic acid Chemical compound CCCCCCCC[C@H]1O[C@H]1CCCCCCCC(O)=O IMYZYCNQZDBZBQ-SJORKVTESA-N 0.000 claims description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 241000209094 Oryza Species 0.000 claims description 6
- 235000007164 Oryza sativa Nutrition 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 235000009566 rice Nutrition 0.000 claims description 6
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 claims description 6
- 238000002444 silanisation Methods 0.000 claims description 6
- 229910021647 smectite Inorganic materials 0.000 claims description 6
- 230000018044 dehydration Effects 0.000 claims description 3
- 238000006297 dehydration reaction Methods 0.000 claims description 3
- 238000004821 distillation Methods 0.000 claims description 3
- 239000012153 distilled water Substances 0.000 claims description 3
- 239000012065 filter cake Substances 0.000 claims description 3
- 239000012467 final product Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 230000002045 lasting effect Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- IMQLKJBTEOYOSI-GPIVLXJGSA-N Inositol-hexakisphosphate Chemical compound OP(O)(=O)O[C@H]1[C@H](OP(O)(O)=O)[C@@H](OP(O)(O)=O)[C@H](OP(O)(O)=O)[C@H](OP(O)(O)=O)[C@@H]1OP(O)(O)=O IMQLKJBTEOYOSI-GPIVLXJGSA-N 0.000 abstract 1
- IMQLKJBTEOYOSI-UHFFFAOYSA-N Phytic acid Natural products OP(O)(=O)OC1C(OP(O)(O)=O)C(OP(O)(O)=O)C(OP(O)(O)=O)C(OP(O)(O)=O)C1OP(O)(O)=O IMQLKJBTEOYOSI-UHFFFAOYSA-N 0.000 abstract 1
- 229910000365 copper sulfate Inorganic materials 0.000 abstract 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract 1
- UMGXUWVIJIQANV-UHFFFAOYSA-M didecyl(dimethyl)azanium;bromide Chemical compound [Br-].CCCCCCCCCC[N+](C)(C)CCCCCCCCCC UMGXUWVIJIQANV-UHFFFAOYSA-M 0.000 abstract 1
- WIBFFTLQMKKBLZ-SEYXRHQNSA-N n-butyl oleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCCC WIBFFTLQMKKBLZ-SEYXRHQNSA-N 0.000 abstract 1
- 239000000467 phytic acid Substances 0.000 abstract 1
- 229940068041 phytic acid Drugs 0.000 abstract 1
- 235000002949 phytic acid Nutrition 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- WHKUVVPPKQRRBV-UHFFFAOYSA-N Trasan Chemical compound CC1=CC(Cl)=CC=C1OCC(O)=O WHKUVVPPKQRRBV-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 230000002421 anti-septic effect Effects 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Paints Or Removers (AREA)
Abstract
The present invention discloses anti-peeling heat-dissipation paint. The anti-peeling heat-dissipation paintconsists of the following raw materials in parts by weight: 0.6-1 part of didecyldimethylammonium bromide, 2-4 parts of epoxy butyl oleate, 1-2 parts of phytic acid, 2-3 parts of polyvinyl formal, 0.4-1 part of diethanolamine, 12-15 parts of styrene-maleic anhydride copolymer, 6-10 parts of propargyl alcohol, 90-100 parts of tetrahydrofuran, 4-7 parts of graphene, 16-20 parts of nano silica, 0.2-0.3 part of a silane coupling agent KH560, 700-800 parts of dimethylformamide, 4-5 parts of sodium nitride, 0.04-0.05 parts of aluminium trichloride, 1.6-2 parts of a 2-3% sodium ascorbate solution, 1.8-2 parts of a 2-3% copper sulfate solution, 120-130 parts of high-density polyethylene, 5-7 parts of montmorillonite powder, and 0.7-1 part of calcium oxide. The paint provided by the present invention is strong in adhesion with a base material, high in peeling resistance, not liable to come off and to be destroyed, and is lasting in protective effect.
Description
Technical field
The present invention relates to heat radiation coating technical field, particularly relate to a kind of antistripping heat radiation coating and preparation method thereof.
Background technology
Along with the fast development of modern science and technology, intensive and the miniaturization of the high frequency of electron device, high speed and unicircuit, the overall power density of unit volume electron device and thermal value are increased by a wide margin, thus makes the cooling problem of electron device become more and more outstanding.And the cooling power that the cooling system of routine can reach is subject to great challenge, especially in fields such as the energy, automobile, air-conditioning, agricultural, chemical industry, heating, aerospace, microelectronics, information, the technology such as enhancement of heat transfer, raising radiating efficiency are had higher requirement.And heat radiation coating is a kind of body surface radiating efficiency that improves, reduce the speciality coating of system temperature, heat radiation coating is coated with the radiating efficiency that can improve electron device on the electronic devices;
Nano silicon is because having in tridimensional network, and stability, reinforcing and thickening property is superior, low price, the feature such as easily to produce, is widely used in corrosion protection coating, to improve carrying and the antiseptic power of coating.The specific surface area of nano silicon is large, and specific surface energy is high, and easily occur in the coating reunite and form offspring, cause the performance of activeness and quietness to reduce, the hydroxyl on its surface also enhances this kind of phenomenon simultaneously.Therefore, improving the dispersiveness of nanosized SiO_2 in organic coating is problem demanding prompt solution.
Summary of the invention
The object of the invention is exactly the defect in order to make up prior art, provides a kind of antistripping heat radiation coating and preparation method thereof.
The present invention is achieved by the following technical solutions:
A kind of antistripping heat radiation coating, it is made up of the raw material of following weight parts:
Two decyl dimethyl brometo de amonio 0.6-1, epoxyoleic acid butyl ester 2-4, phytinic acid 1-2, polyvinyl formal 2-3, diethanolamine 0.4-1, styrene-maleic anhydride copolymer 12-15, propiolic alcohol 6-10, tetrahydrofuran (THF) 90-100, Graphene 4-7, nano silicon 16-20, silane coupling agent KH5600.2-0.3, dimethyl formamide 700-800, sodium nitride 4-5, aluminum chloride 0.04-0.05, 2-3% sodium ascorbate solution 1.6-2, 2-3% copper-bath 1.8-2, high density polyethylene(HDPE) 120-130, montmorillonite powder 5-7, calcium oxide 0.7-1.
A preparation method for described antistripping heat radiation coating, comprises the following steps:
(1) joined in 14-20 times of water by above-mentioned calcium oxide, stir, add phytinic acid, raised temperature is 60-70 DEG C, adds Graphene, and insulated and stirred is done to water, mixes, ball milling 30-40 minute with nano silicon;
(2) by styrene-maleic anhydride copolymer, propiolic alcohol, tetrahydrofuran (THF) mixing, insulated and stirred 10-16 hour at 50-60 DEG C, underpressure distillation, removing liquid, vacuum-drying, obtains alkynyl multipolymer;
(3) get above-mentioned ball milling particle, join in 20-30 toluene doubly, ultrasonic disperse 2-3 hour, adds silane coupling agent KH560, and raised temperature is 86-90 DEG C, insulated and stirred 10-12 hour, cooling, suction filtration, and vacuum-drying, obtains silanization nanoparticle;
(4) get the 46-50% of above-mentioned dimethyl formamide weight, add silanization nanoparticle, ultrasonic disperse 2-3 hour, add sodium nitride, aluminum chloride, stir 24-25 hour, suction filtration at 30-35 DEG C, washing, vacuum-drying, obtains Sodium Azide rice corpuscles;
(5) above-mentioned pair of decyl dimethyl brometo de amonio is joined in 18-20 times of water, stir, add polyvinyl formal, raised temperature is 80-90 DEG C, add above-mentioned epoxyoleic acid butyl ester, insulated and stirred 20-30 minute, adds montmorillonite powder, diethanolamine, stirs, dehydration, vacuum-drying, ball milling is even, obtains smectite powder;
(6) by above-mentioned Sodium Azide rice corpuscles, alkynyl multipolymer, smectite powder mixing, join in remaining dimethyl formamide, nitrogen bubble 30-40 minute, add 2-3% sodium ascorbate solution, 2-3% copper-bath successively, react 20-24 hour at being placed in 76-80 DEG C, suction filtration, filter cake is respectively washed 2-3 time with distilled water, dimethyl formamide, acetone successively, after vacuum-drying, obtain engrafted nanometer particle;
(7) mixed with each raw material of residue by above-mentioned engrafted nanometer particle, stir, be sent to twin screw extruder, melt extrude, cooling, pulverizes and sieves, to obtain final product.
Advantage of the present invention is:
(1) coating of the present invention has good shock resistance:
Graphene, nano silicon all have larger specific surface area, can strengthen Graphene, reactive force between nano silicon and polyvinyl resin, put forward heavily stressed transfer efficiency, and then improve its shock resistance;
(2) coating of the present invention has good erosion resistance;
Graphene, nano silicon in the medium-altitude dispersion of resin, can form fine and close film, corrosive medium is more difficult to be penetrated in coating by this interface, well improves corrosion resistance;
(3) coating of the present invention has good heat conduction and heat radiation:
First the present invention prepares the styrene-maleic anhydride copolymer containing multiple alkynyl on molecular chain, then modified Nano particle, its surface is made to introduce multiple azido-, finally utilize " click " chemical method at particle surface graftomer, polymer molecular chain has multiple point to be grafted to particle surface, molecular chain " is crouched down " at particle surface, thus it is coated what do not need to realize under the condition introducing number of polymers chain to particle, obtain grafting density high, the nanoparticle of good dispersity, strengthen its dispersiveness in resin matrix, the two-dimension plane structure of Graphene that is scattered here and there in resin and the tridimensional network of nano silicon can form stable heat conduction network, greatly improve the transmission of heat, play good heat conduction and heat radiation effect.
The cohesiveness of coating of the present invention and base material is strong, and peel strength is high, and difficult drop-off, damage, protected effect is lasting.
Embodiment
A kind of antistripping heat radiation coating, it is made up of the raw material of following weight parts:
Two decyl dimethyl brometo de amonio 0.6, epoxyoleic acid butyl ester 2, phytinic acid 1, polyvinyl formal 2, diethanolamine 0.4, Zelan 338 12, propiolic alcohol 6, tetrahydrofuran (THF) 90, Graphene 4, nano silicon 16, silane coupling agent KH5600.2, dimethyl formamide 700, sodium nitride 4, aluminum chloride 0.04,2% sodium ascorbate solution 1.6,2% copper-bath 1.8, high density polyethylene(HDPE) 120, montmorillonite powder 5, calcium oxide 0.7.
A preparation method for described antistripping heat radiation coating, comprises the following steps:
(1) joined in 14 times of water by above-mentioned calcium oxide, stir, add phytinic acid, raised temperature is 60 DEG C, adds Graphene, and insulated and stirred is done to water, mixes, ball milling 30 minutes with nano silicon;
(2) by Zelan 338, propiolic alcohol, tetrahydrofuran (THF) mixing, insulated and stirred 10 hours at 50 DEG C, underpressure distillation, removing liquid, vacuum-drying, obtains alkynyl multipolymer;
(3) get above-mentioned ball milling particle, join in the toluene of 20 times, ultrasonic disperse 2 hours, adds silane coupling agent KH560, and raised temperature is 86 DEG C, insulated and stirred 10 hours, cooling, suction filtration, and vacuum-drying, obtains silanization nanoparticle;
(4) get 46% of above-mentioned dimethyl formamide weight, add silanization nanoparticle, ultrasonic disperse 2 hours, adds sodium nitride, aluminum chloride, stirs 24 hours, suction filtration at 30 DEG C, washing, and vacuum-drying, obtains Sodium Azide rice corpuscles;
(5) above-mentioned pair of decyl dimethyl brometo de amonio is joined in 18 times of water, stir, add polyvinyl formal, raised temperature is 80 DEG C, add above-mentioned epoxyoleic acid butyl ester, insulated and stirred 20 minutes, adds montmorillonite powder, diethanolamine, stirs, dehydration, vacuum-drying, ball milling is even, obtains smectite powder;
(6) by above-mentioned Sodium Azide rice corpuscles, alkynyl multipolymer, smectite powder mixing, join in remaining dimethyl formamide, nitrogen bubble 30 minutes, add 2% sodium ascorbate solution, 2% copper-bath successively, react 20 hours at being placed in 76 DEG C, suction filtration, respectively washs 2 times with distilled water, dimethyl formamide, acetone successively by filter cake, after vacuum-drying, obtain engrafted nanometer particle;
(7) mixed with each raw material of residue by above-mentioned engrafted nanometer particle, stir, be sent to twin screw extruder, melt extrude, cooling, pulverizes and sieves, to obtain final product.
Performance test:
Appearance of film: flat smooth, without shrinkage cavity, free of pinholes;
Just recoiling test: pass through;
Pencil hardness test: 2H is without scuffing;
Sticking power and resistance to Neutral Salt Spray Corrosion grade are 2 grades;
Thermal conductivity is 0.482W/mK.
Claims (2)
1. an antistripping heat radiation coating, is characterized in that what it was made up of the raw material of following weight parts:
Two decyl dimethyl brometo de amonio 0.6-1, epoxyoleic acid butyl ester 2-4, phytinic acid 1-2, polyvinyl formal 2-3, diethanolamine 0.4-1, styrene-maleic anhydride copolymer 12-15, propiolic alcohol 6-10, tetrahydrofuran (THF) 90-100, Graphene 4-7, nano silicon 16-20, silane coupling agent KH5600.2-0.3, dimethyl formamide 700-800, sodium nitride 4-5, aluminum chloride 0.04-0.05, 2-3% sodium ascorbate solution 1.6-2, 2-3% copper-bath 1.8-2, high density polyethylene(HDPE) 120-130, montmorillonite powder 5-7, calcium oxide 0.7-1.
2. a preparation method for antistripping heat radiation coating as claimed in claim 1, is characterized in that comprising the following steps:
(1) joined in 14-20 times of water by above-mentioned calcium oxide, stir, add phytinic acid, raised temperature is 60-70 DEG C, adds Graphene, and insulated and stirred is done to water, mixes, ball milling 30-40 minute with nano silicon;
(2) by styrene-maleic anhydride copolymer, propiolic alcohol, tetrahydrofuran (THF) mixing, insulated and stirred 10-16 hour at 50-60 DEG C, underpressure distillation, removing liquid, vacuum-drying, obtains alkynyl multipolymer;
(3) get above-mentioned ball milling particle, join in 20-30 toluene doubly, ultrasonic disperse 2-3 hour, adds silane coupling agent KH560, and raised temperature is 86-90 DEG C, insulated and stirred 10-12 hour, cooling, suction filtration, and vacuum-drying, obtains silanization nanoparticle;
(4) get the 46-50% of above-mentioned dimethyl formamide weight, add silanization nanoparticle, ultrasonic disperse 2-3 hour, add sodium nitride, aluminum chloride, stir 24-25 hour, suction filtration at 30-35 DEG C, washing, vacuum-drying, obtains Sodium Azide rice corpuscles;
(5) above-mentioned pair of decyl dimethyl brometo de amonio is joined in 18-20 times of water, stir, add polyvinyl formal, raised temperature is 80-90 DEG C, add above-mentioned epoxyoleic acid butyl ester, insulated and stirred 20-30 minute, adds montmorillonite powder, diethanolamine, stirs, dehydration, vacuum-drying, ball milling is even, obtains smectite powder;
(6) by above-mentioned Sodium Azide rice corpuscles, alkynyl multipolymer, smectite powder mixing, join in remaining dimethyl formamide, nitrogen bubble 30-40 minute, add 2-3% sodium ascorbate solution, 2-3% copper-bath successively, react 20-24 hour at being placed in 76-80 DEG C, suction filtration, filter cake is respectively washed 2-3 time with distilled water, dimethyl formamide, acetone successively, after vacuum-drying, obtain engrafted nanometer particle;
(7) mixed with each raw material of residue by above-mentioned engrafted nanometer particle, stir, be sent to twin screw extruder, melt extrude, cooling, pulverizes and sieves, to obtain final product.
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| CN109174225A (en) * | 2018-09-14 | 2019-01-11 | 国网江西省电力有限公司电力科学研究院 | Generator stator cooling water water sample tests pipeline cooling device |
| CN113969518A (en) * | 2021-03-26 | 2022-01-25 | 浙江科技学院 | A kind of medical dialysis paper water-based coating heat sealant and coating method thereof |
| CN114634723A (en) * | 2020-12-16 | 2022-06-17 | 中国科学院上海硅酸盐研究所 | Silicon dioxide insulating film and preparation method thereof |
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Application publication date: 20151202 |