CN105099564A - Encapsulation structure and optical module - Google Patents
Encapsulation structure and optical module Download PDFInfo
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- CN105099564A CN105099564A CN201510333257.3A CN201510333257A CN105099564A CN 105099564 A CN105099564 A CN 105099564A CN 201510333257 A CN201510333257 A CN 201510333257A CN 105099564 A CN105099564 A CN 105099564A
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Abstract
The application discloses an encapsulation structure and an optical module. The encapsulation structure comprises a printed circuit board which is provided with a hollow accommodating part, a heat dissipation substrate which is arranged below the printed circuit board, a heat dissipation shell which is used for accommodating the heat dissipation substrate and the printed circuit board, and a power device which is directly arranged on the heat dissipation substrate through the accommodating part, wherein the heat dissipation substrate is connected with the heat dissipation shell in a heat-conducting way; the heat dissipation shell is defined with a bottom wall and side walls; the heat dissipation substrate comprises a first substrate which is connected with the bottom wall in a heat-conducting way, and second substrates which are connected with the side walls in a heat-conducting way; and the power device is connected with the heat dissipation substrate in a heat-conducting way. In the technical scheme of the application, the heat dissipation substrate is fixedly arranged together with the bottom wall and the side walls of the heat dissipation shell in a laminating way, so that the heat dissipation area between the heat dissipation substrate and the heat dissipation shell is increased, and the heat dissipation capabilities of the encapsulation structure and the optical module are enhanced greatly.
Description
Technical field
The invention belongs to optical communication device manufacturing technology field, be specifically related to a kind of encapsulating structure and apply the optical module of this encapsulating structure.
Background technology
Along with the develop rapidly of 4G communication and the day by day vigorous of cloud computing demand, the demand of market to high-speed optical module grows with each passing day.For 100G optical module, it has relative to the power consumption of 40G optical module and significantly rises, but if desired adopts the package dimension identical with 40G optical module, then the heat also corresponding sharp increase of generation in unit are.Under these circumstances, if good radiating effect can not be ensured, then can be affected for the performance of temperature sensitive electric light/electrooptical device in optical module, even lose efficacy.
In the packaged type of traditional 40G optical module, usually use COB(chiponboard) paster routing technique to reduce packaging cost.Because bare chip upper surface is used for beating gold thread, heat radiation can not be used for, therefore can only be dispelled the heat by the lower surface of PCB.And in order to ensure high speed signaling quality, around usual bare chip, be designed to routing pad, make cooling surface area limited.Further, filling out copper via hole heat-conducting mode because needs employing is intensive, the heat conduction produced by power device on pcb board is to the back side of pcb board, and bonding heat radiating metal block carries out heat dissipation.The defect brought further is thus: 1) tolerance capabilities of current technique requires that Via Design needs to ensure the weld-ring of monolateral at least more than the 3-4mil of boring, minimum boring 0.15mm, and the ratio that namely effectively heat radiation sectional area is long-pending with taking PCB surface is less than 1/4; 2) fill out copper and adopt copper slurry, and containing a certain proportion of adhesive in copper slurry, its conductive coefficient is less than fine copper, so can affect radiating effect.For these reasons, in the encapsulation of high-speed optical module, need to adopt more efficient radiator structure, to ensure the stable operation of device.
Summary of the invention
The application one embodiment provides a kind of encapsulating structure, and this encapsulating structure comprises:
Printed circuit board (PCB), it has the resettlement section that hollow is arranged;
Be arranged at the heat-radiating substrate below described printed circuit board (PCB);
Accommodate the radiating shell of described heat-radiating substrate and printed circuit board (PCB), described heat-radiating substrate is connected with described radiating shell heat conduction, the definition of described radiating shell has diapire and sidewall, and described heat-radiating substrate comprises to lead hot linked first substrate and leads hot linked second substrate with sidewall with diapire;
Directly be arranged at the power device on described heat-radiating substrate by described resettlement section, described power device is connected with described heat-radiating substrate heat conduction.
In one embodiment, described heat-radiating substrate protrudes and is provided with the installation portion with resettlement section mating shapes on printed circuit board (PCB), described power device is directly installed on described installation portion.
In one embodiment, described installation portion is arranged on first substrate, and described first substrate, second substrate and installation portion are formed in one setting.
In one embodiment, the one or both sides of described first substrate are provided with second substrate.
In one embodiment, the contact area of described heat-radiating substrate and radiating shell is more than or equal to described first substrate in radiating shell diapire and the second substrate projected area sum at radiating shell sidewall.
In one embodiment, described heat-radiating substrate is being provided with some protuberances towards radiating shell side, radiating shell is being provided with some depressed parts towards heat-radiating substrate side, heat-radiating substrate and radiating shell install after described protuberance and depressed part bonded to each other, the outer surface of described protuberance and the inner surface of depressed part are the combination of at least one in curved surface or plane and curved surface.
The application one embodiment also provides a kind of encapsulating structure, and described encapsulating structure comprises:
Printed circuit board (PCB), it has the resettlement section that hollow is arranged;
Be arranged at the heat-radiating substrate below described printed circuit board (PCB);
Be arranged at the heat eliminating medium below described heat-radiating substrate;
Accommodate the radiating shell of described heat eliminating medium, heat-radiating substrate and printed circuit board (PCB), described heat-radiating substrate, heat eliminating medium and radiating shell successively heat conduction are connected, described radiating shell definition has diapire and sidewall, described heat eliminating medium comprises to lead hot linked first medium and leads hot linked second medium with sidewall with diapire, described heat-radiating substrate comprises to lead hot linked first substrate and leads hot linked second substrate with second medium with first medium;
Directly be arranged at the power device on described heat-radiating substrate by described resettlement section, described power device is connected with described heat-radiating substrate heat conduction.
In one embodiment, the one or both sides of described first substrate are provided with second substrate, and the one or both sides of first medium are provided with second medium.
In one embodiment, described heat-radiating substrate is being provided with some protuberances towards radiating shell side, radiating shell is being provided with some depressed parts towards heat-radiating substrate side, heat eliminating medium is formed with the shape matched with described protuberance and depressed part, heat-radiating substrate, heat eliminating medium and radiating shell install after described protuberance and depressed part bonded to each other with heat eliminating medium respectively.
The application one embodiment also provides a kind of optical module applying above-mentioned encapsulating structure.
Compared with prior art, in the technical scheme of the application, the resettlement section that power device is arranged by hollow on printed circuit board (PCB), is directly fixed on the heat-radiating substrate of below, compared with starching mode with circuit board dense vias plug copper in prior art, the application's thermal conduction effect is better; Meanwhile, the diapire of heat-radiating substrate and radiating shell and sidewall are all fitted and are fixedly mounted, and add the area of dissipation between heat-radiating substrate and radiating shell, substantially increase the heat-sinking capability of encapsulating structure and optical module; Meanwhile, between heat-radiating substrate and radiating shell, arrange heat eliminating medium, the heat conduction on heat-radiating substrate on radiating shell, be ensure that the radiating effect of encapsulating structure and optical module by heat eliminating medium; Separately, on heat-radiating substrate and radiating shell, correspondence arranges protuberance and depressed part, while increase area of dissipation, raising radiating effect, can improve the installation stability of encapsulating structure further, ensure that the stable operation of device.
Accompanying drawing explanation
Fig. 1 is the detonation configuration schematic diagram of encapsulating structure in the application first execution mode;
Fig. 2 a is the perspective view of the heat-radiating substrate of encapsulating structure in the application first execution mode;
Fig. 2 b is the side structure schematic diagram of the heat-radiating substrate of encapsulating structure in the application first execution mode;
Fig. 3 is the cross-sectional view in the application first execution mode after encapsulating structure encapsulation;
Fig. 4 is the detonation configuration schematic diagram of encapsulating structure in the application second execution mode;
Fig. 5 a is the perspective view of the heat-radiating substrate of encapsulating structure in the application second execution mode;
Fig. 5 b is another view stereo structural representation of the heat-radiating substrate of encapsulating structure in the application second execution mode;
Fig. 5 c is the side structure schematic diagram of the heat-radiating substrate of encapsulating structure in the application second execution mode;
Fig. 6 is the detonation configuration schematic diagram of encapsulating structure in the application the 3rd execution mode;
Fig. 7 is the perspective view of the heat eliminating medium of encapsulating structure in the application the 3rd execution mode;
Fig. 8 is the perspective view of the heat-radiating substrate of encapsulating structure in the application the 3rd execution mode;
Fig. 9 is the cross-sectional view in the application the 3rd execution mode after encapsulating structure encapsulation.
Embodiment
Below with reference to embodiment shown in the drawings, the application is described in detail.But these execution modes do not limit the application, the structure that those of ordinary skill in the art makes according to these execution modes, method or conversion functionally are all included in the protection range of the application.
In each diagram of the application, for the ease of diagram, some size of structure or part can relative to other structure or partial enlargement, therefore, only for illustrating the basic structure of the theme of the application.
Used herein such as " on ", " top ", D score, the representation space relative position such as " below " term be describe a unit as shown in the drawings or the feature relation relative to another unit or feature for the object being convenient to illustrate.The term of relative space position can be intended to comprise equipment in the different azimuth used or in work except orientation shown in figure.Such as, if by the equipment upset in figure, be then described to be positioned at other unit or feature " below " or " under " unit will be positioned at other unit or feature " top ".Therefore, exemplary term " below " can include above and below these two kinds of orientation.Equipment can otherwise be directed (90-degree rotation or other towards), and correspondingly herein interpreted use with the description language of space correlation.
When element or layer be called as another parts or layer " on ", " be connected " with another parts or layer time, its can directly on these another parts or layer, be connected to this another parts or layer, or intermediary element or layer can be there is.On the contrary, when parts are called as " directly on another parts or layer ", " being connected directly between on another parts or layer ", intermediate member or layer can not be there is.
Further, although should be understood that first, second grade of term can be used to describe various element or structure in this article, these are described the restriction that object should not be subject to these terms.These terms are only for being distinguished from each other out these description objects.Such as, first substrate can be called as second substrate, and second substrate also can be called as first substrate similarly, and this does not deviate from the protection range of the application.
Shown in ginseng Fig. 1, introduce the first embodiment of the application's encapsulating structure 100.In the present embodiment, this encapsulating structure 100 comprises printed circuit board (PCB) 11, heat-radiating substrate 12, radiating shell 13 and power device 14.
Wherein, printed circuit board (PCB) 11 comprises flexible PCB and hard circuit board, is described in present embodiment for flexible PCB.Printed circuit board (PCB) 11 has the resettlement section 101 that a hollow is arranged, it is inner that heat-radiating substrate 12 can be fixedly installed in radiating shell 13, printed circuit board (PCB) 11 is fixedly installed on heat-radiating substrate 12, power device 14 is directly arranged on heat-radiating substrate 12 by resettlement section 101, thus realizes power device and be connected with the heat conduction of heat-radiating substrate.
In present embodiment, radiating shell 13 definition has diapire 131 and sidewall 132, and shown in composition graphs 2a, 2b, heat-radiating substrate 12 comprises to lead hot linked first substrate 121 and leads hot linked second substrate 122 with sidewall 132 with diapire 131.Wherein, first substrate 121 protrudes and is provided with the installation portion 1211 with resettlement section on printed circuit board (PCB) 101 mating shapes, power device 14 is directly installed on this installation portion 1211.
It should be noted that, the heat-radiating substrate 12 mentioned in each execution mode of the application is the good heat conductor of heat transfer efficiency, its material is metal (as metallic copper etc.) or other.Usually the mode that circuit board dense vias plug copper is starched is taked in prior art, pass through heat eliminating medium again, by heat conduction to heat-dissipating casing, the poor heat conductivity (conductive coefficient about 14W/mK) of this copper slurry, the performance of product will be affected, power device is directly pasted onto (conductive coefficient about 300W/mK) on the heat-radiating substrate of metal by the application, by the heat conduction on power device on heat-dissipating casing, greatly improves the heat-sinking capability of module.
" power device 14 " mentioned in the application can be such as photoelectricity/Electrical-to-opticaconversion conversion component, and drive the driving of those photoelectricity/Electrical-to-opticaconversion conversion component and the element required for amplifying circuit, and power device 14 can be monolithically integrated on a chip, and also not necessarily is the device be separated, certainly, also can be that the device of multiple separation is arranged on heat-radiating substrate 12.
Particularly, shown in ginseng Fig. 2 a, 2b, in present embodiment, the sidewall 132 of radiating shell is vertical with diapire 131 is arranged, heat-radiating substrate 12 is in inverted " п " shape, comprise a first substrate 121 corresponding with diapire 131 and be positioned at first substrate 121 both sides and the second substrate 122 vertical with first substrate 121, two second substrates 122 of both sides are for being symmetrical arranged.Shown in composition graphs 3, the mating shapes of heat-radiating substrate 12 and radiating shell 13, after installing, first substrate 121 fits with the diapire 131 of radiating shell 13, and the second substrate 122 of both sides fits with two sidewalls 132 respectively.Therefore, the heat on the first substrate 121 after installation can conduct on the diapire 131 of radiating shell, and the heat on second substrate 122 then can conduct on the sidewall 132 of radiating shell.
In addition, first substrate 121 protrudes and is provided with the installation portion 1211 with resettlement section on printed circuit board (PCB) 101 mating shapes, the height of installation portion 1211 can be greater than, be equal to or less than the degree of depth (being also the thickness of printed circuit board (PCB)) of resettlement section 101.As in present embodiment, the cross sectional shape of resettlement section 101 is rectangular, the cross sectional shape of installation portion 1211 is also rectangular, and the height of installation portion 1211 is substantially equal to the degree of depth of resettlement section 101, after printed circuit board (PCB) and heat-radiating substrate fixedly mount, installation portion 1211 on heat-radiating substrate 12 is arranged in the resettlement section 101 of printed circuit board (PCB), certain interval can be left so that both installations between installation portion 1211 and resettlement section 101, installation portion 1211 is roughly concordant with printed circuit board (PCB) 11, so can facilitate the installation of power device 14.Certainly the cross sectional shape of resettlement section 101 and installation portion 1221 also correspondence can be set to the rule or irregularly shaped such as circle, polygon in other embodiments, the height of installation portion 1221 also can be greater than or less than the degree of depth of resettlement section 101, no longer carries out enumerating being described herein.
Wherein, first substrate 121, second substrate 122 and installation portion 1211 can be manufactured separately and to be connected or this first substrate 121, second substrate 122 and installation portion 1211 are manufactured shaping integratedly.
In encapsulating structure general in prior art, heat-radiating substrate is plane, its diapire 131 only by radiating shell dispels the heat, and the encapsulating structure heat-radiating substrate in present embodiment is except dispelling the heat with the diapire 131 of radiating shell, also dispelled the heat by the sidewall 132 of radiating shell further.Heat-radiating substrate in present embodiment has higher conductive coefficient, and area of dissipation obviously increases, and substantially increases the heat-sinking capability of encapsulating structure.
Basis preferably can also be out of shape the execution mode to have: second substrate 122 is located at first substrate 121 both sides, but two second substrates 122 are asymmetric setting, the height as two second substrates 122 is different or thickness is different; Or the side of only having of first substrate 121 is provided with second substrate 122, heat-radiating substrate 12 is in inverted " Г " shape.The execution mode of this kind of distortion can increase the area of dissipation of heat-radiating substrate equally, within the protection range that also should belong to the application.
Shown in ginseng Fig. 4, introduce the second embodiment of the application's encapsulating structure 200.In the present embodiment, this encapsulating structure 200 comprises printed circuit board (PCB), heat-radiating substrate 22, radiating shell 23 and power device, and wherein printed circuit board (PCB) is identical with the first embodiment with power device, no longer repeats at this.
In above-mentioned first execution mode, the contact area of heat-radiating substrate and radiating shell equals first substrate in radiating shell diapire and the second substrate projected area sum at radiating shell sidewall, also namely the diapire contact area of first substrate and radiating shell is plane, and the sidewall contact area of second substrate and radiating shell is plane.And the contact area of heat-radiating substrate and radiating shell is greater than first substrate at radiating shell diapire and second substrate in the projected area sum of radiating shell sidewall in the present embodiment, is described below in conjunction with following embodiment.
Shown in composition graphs 5a-5c, in present embodiment, radiating shell 23 definition has diapire 231 and sidewall 232, and heat-radiating substrate 22 comprises to lead hot linked first substrate 221 and leads hot linked second substrate 222 with sidewall 232 with diapire 231.First substrate 221 is being provided with some protuberances 2212 towards radiating shell side, the diapire 231 of radiating shell is being provided with some depressed parts 2311 towards heat-radiating substrate side, and it is bonded to each other with depressed part 2311 that heat-radiating substrate 22 and radiating shell 23 install rear protuberance 2212.
In present embodiment, the contact area of first substrate and radiating shell diapire is greater than the projected area of first substrate at radiating shell diapire, protuberance 2212 on heat-radiating substrate contacts with the depressed part 2311 on radiating shell between part also for carrying out heat transfer, compared with the first execution mode, in present embodiment, there is between heat-radiating substrate and radiating shell larger area of dissipation, further increase the heat-sinking capability of encapsulating structure.
Particularly, in present embodiment, protuberance 2212 is set to round table-like, and its outer surface is that plane and cambered surface combine, and the inner surface of depressed part 2311 is corresponding with the outer surface shape of protuberance 2212.But the shape of protuberance 2212 and depressed part 2311 is not limited to the shape in present embodiment; the outer surface of protuberance 2212 and the inner surface of depressed part 2311 can be the combination etc. of the combination of curved surface (as spherical structure) or plane and plane or the combination of curved surface and curved surface or multiple plane and multiple curved surface, can to fit the scope being contained in depressed part 2311 and all belonging to the application and protect as long as meet protuberance 2212.
Separately, protuberance 2212 in the application on heat-radiating substrate and the depressed part 2311 on radiating shell are except increasing except area of dissipation, fixing effect can also be played, prevent heat-radiating substrate from radiating shell, producing relative displacement, ensure that the stability of encapsulating structure.
Basis preferably can also be out of shape the execution mode to have: arrange depressed part on the first substrate, and on the diapire of radiating shell, arrange protuberance, protuberance and depressed part installation bonded to each other; Or protuberance is set on second substrate, the sidewall of radiating shell arranges depressed part, protuberance and depressed part installation bonded to each other.The execution mode of above-mentioned distortion can increase the area of dissipation of heat-radiating substrate equally; therefore, if the contact area meeting heat-radiating substrate and radiating shell be greater than first substrate all should to work as at the encapsulating structure of the projected area sum of radiating shell sidewall at radiating shell diapire and second substrate belong to the application protection range within.
Shown in ginseng Fig. 6, introduce the 3rd embodiment of the application's encapsulating structure 300.In the present embodiment, this encapsulating structure 300 comprises printed circuit board (PCB) 31, heat-radiating substrate 32, heat eliminating medium 35, radiating shell 33 and power device 34.
Wherein, printed circuit board (PCB) 31 has the resettlement section 301 that a hollow is arranged, it is inner that heat-radiating substrate 32 and heat eliminating medium 35 are fixedly installed in radiating shell 33, printed circuit board (PCB) 31 is fixedly installed on heat-radiating substrate 32, power device 34 is directly arranged on heat-radiating substrate 32 by resettlement section 301, thus realizes power device and be connected with the heat conduction of heat-radiating substrate.
In present embodiment, radiating shell 33 definition has diapire 331 and sidewall 332.Shown in composition graphs 7, heat eliminating medium 35 comprises to lead hot linked first medium 351 and leads hot linked second medium 352 with sidewall 332 with diapire 331.Again shown in composition graphs 8, heat-radiating substrate 32 comprises to lead hot linked first substrate 321 and leads hot linked second substrate 322 with second medium 352 with first medium 351.Wherein, first substrate 321 protrudes and is provided with the installation portion 3211 with resettlement section on printed circuit board (PCB) 301 mating shapes, power device 34 is directly installed on this installation portion 3211.
Ginseng Figure 9 shows that the encapsulating structure schematic diagram after installing in present embodiment, power device 34 is directly connected with heat-radiating substrate 32 heat conduction, heat on power device 34 can be delivered on heat-radiating substrate 32, and the heat on heat-radiating substrate on first substrate 321 conducts on the diapire 331 of radiating shell by first medium 351, the heat on heat-radiating substrate on second substrate 322 is conducted on the sidewall 332 of radiating shell by second medium 352.In present embodiment by heat-radiating substrate and heat eliminating medium can effectively by the heat conduction on power device on heat-dissipating casing, greatly improve the heat-sinking capability of encapsulating structure.
It should be noted that, " heat eliminating medium ", " first medium " and " second medium " mentioned in present embodiment can be the single layer structure be made up of same material, also can be multilayer laminate, and such as multilayer is by the two media layer of alternately pressing.
Further, between radiating shell 33 and heat eliminating medium 35, can also thermal paste be such as set or be equipped with thermal paste and above-mentioned heat-radiating substrate 32 to realize better heat trnasfer; Further, owing to not relating to the improvement to optical module other parts structure or function herein, therefore at this, other parts of optical module and structure are also repeated no more.
Similarly, basis preferably can also be out of shape the execution mode to have: second substrate 322 and second medium 352 are located at first substrate 321 and first medium 351 both sides respectively, but two second substrates 322 and/or second medium 352 are asymmetric setting, the height as two second substrates 322 or two second mediums 352 is different or thickness is different; Or first substrate 321 only has side to be provided with second substrate 322, first medium 351 only has side to be provided with second medium 352, and heat-radiating substrate 32 and heat eliminating medium 35 are in inverted " Г " shape.The execution mode of this kind of distortion can increase the area of dissipation of heat-radiating substrate equally, within the protection range that also should belong to the application.
The application passes through above-described embodiment, there is following beneficial effect: the resettlement section that power device is arranged by hollow on printed circuit board (PCB), be directly fixed on the heat-radiating substrate of below, compared with starching mode with circuit board dense vias plug copper in prior art, the application's thermal conduction effect is better; Meanwhile, the diapire of heat-radiating substrate and radiating shell and sidewall are all fitted and are fixedly mounted, and add the area of dissipation between heat-radiating substrate and radiating shell, substantially increase the heat-sinking capability of encapsulating structure and optical module; Meanwhile, between heat-radiating substrate and radiating shell, arrange heat eliminating medium, the heat conduction on heat-radiating substrate on radiating shell, be ensure that the radiating effect of encapsulating structure and optical module by heat eliminating medium; Separately, on heat-radiating substrate and radiating shell, correspondence arranges protuberance and depressed part, while increase area of dissipation, raising radiating effect, can improve the installation stability of encapsulating structure further, ensure that the stable operation of device.
Be to be understood that, although this specification is described according to execution mode, but not each execution mode only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should by specification integrally, technical scheme in each execution mode also through appropriately combined, can form other execution modes that it will be appreciated by those skilled in the art that.
A series of detailed description listed is above only the illustrating of feasibility execution mode for the application; they are also not used to the protection range limiting the application, and the equivalent implementations that all the application's of disengaging skill spirit is done or change all should be included within the protection range of the application.
Claims (10)
1. an encapsulating structure, is characterized in that, described encapsulating structure comprises:
Printed circuit board (PCB), it has the resettlement section that hollow is arranged;
Be arranged at the heat-radiating substrate below described printed circuit board (PCB);
Accommodate the radiating shell of described heat-radiating substrate and printed circuit board (PCB), described heat-radiating substrate is connected with described radiating shell heat conduction, the definition of described radiating shell has diapire and sidewall, and described heat-radiating substrate comprises to lead hot linked first substrate and leads hot linked second substrate with sidewall with diapire;
Directly be arranged at the power device on described heat-radiating substrate by described resettlement section, described power device is connected with described heat-radiating substrate heat conduction.
2. encapsulating structure according to claim 1, is characterized in that, described heat-radiating substrate protrudes and is provided with the installation portion with resettlement section mating shapes on printed circuit board (PCB), described power device is directly installed on described installation portion.
3. encapsulating structure according to claim 2, is characterized in that, described installation portion is arranged on first substrate, and described first substrate, second substrate and installation portion are formed in one setting.
4. encapsulating structure according to claim 1, is characterized in that, the one or both sides of described first substrate are provided with second substrate.
5. encapsulating structure according to claim 1, is characterized in that, the contact area of described heat-radiating substrate and radiating shell is more than or equal to described first substrate in radiating shell diapire and the second substrate projected area sum at radiating shell sidewall.
6. encapsulating structure according to claim 5, it is characterized in that, described heat-radiating substrate is being provided with some protuberances towards radiating shell side, radiating shell is being provided with some depressed parts towards heat-radiating substrate side, heat-radiating substrate and radiating shell install after described protuberance and depressed part bonded to each other, the outer surface of described protuberance and the inner surface of depressed part are the combination of at least one in curved surface or plane and curved surface.
7. an encapsulating structure, is characterized in that, described encapsulating structure comprises:
Printed circuit board (PCB), it has the resettlement section that hollow is arranged;
Be arranged at the heat-radiating substrate below described printed circuit board (PCB);
Be arranged at the heat eliminating medium below described heat-radiating substrate;
Accommodate the radiating shell of described heat eliminating medium, heat-radiating substrate and printed circuit board (PCB), described heat-radiating substrate, heat eliminating medium and radiating shell successively heat conduction are connected, described radiating shell definition has diapire and sidewall, described heat eliminating medium comprises to lead hot linked first medium and leads hot linked second medium with sidewall with diapire, described heat-radiating substrate comprises to lead hot linked first substrate and leads hot linked second substrate with second medium with first medium;
Directly be arranged at the power device on described heat-radiating substrate by described resettlement section, described power device is connected with described heat-radiating substrate heat conduction.
8. encapsulating structure according to claim 7, is characterized in that, the one or both sides of described first substrate are provided with second substrate, and the one or both sides of first medium are provided with second medium.
9. encapsulating structure according to claim 7, it is characterized in that, described heat-radiating substrate is being provided with some protuberances towards radiating shell side, radiating shell is being provided with some depressed parts towards heat-radiating substrate side, heat eliminating medium is formed with the shape matched with described protuberance and depressed part, heat-radiating substrate, heat eliminating medium and radiating shell install after described protuberance and depressed part bonded to each other with heat eliminating medium respectively.
10. an optical module, is characterized in that, described optical module comprises the encapsulating structure as above described in any one claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510333257.3A CN105099564B (en) | 2015-06-16 | 2015-06-16 | Encapsulating structure and optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510333257.3A CN105099564B (en) | 2015-06-16 | 2015-06-16 | Encapsulating structure and optical module |
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| Publication Number | Publication Date |
|---|---|
| CN105099564A true CN105099564A (en) | 2015-11-25 |
| CN105099564B CN105099564B (en) | 2018-04-10 |
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| CN201510333257.3A Active CN105099564B (en) | 2015-06-16 | 2015-06-16 | Encapsulating structure and optical module |
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| CN114514803A (en) * | 2019-10-16 | 2022-05-17 | 大众汽车股份公司 | Electronic system with heat transfer device |
| CN115066144A (en) * | 2022-05-31 | 2022-09-16 | 华为数字能源技术有限公司 | Packaging structure and photovoltaic optimizer |
| CN115508957A (en) * | 2017-07-19 | 2022-12-23 | 苏州旭创科技有限公司 | Optical module |
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