CN105094227A - Electronic apparatus - Google Patents
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- CN105094227A CN105094227A CN201510402527.1A CN201510402527A CN105094227A CN 105094227 A CN105094227 A CN 105094227A CN 201510402527 A CN201510402527 A CN 201510402527A CN 105094227 A CN105094227 A CN 105094227A
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- electronic installation
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- recognition element
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- 239000000758 substrate Substances 0.000 claims description 70
- 238000009434 installation Methods 0.000 claims description 58
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- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 230000031700 light absorption Effects 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 abstract description 2
- 230000008054 signal transmission Effects 0.000 description 18
- 239000010409 thin film Substances 0.000 description 18
- 238000002604 ultrasonography Methods 0.000 description 9
- 230000035945 sensitivity Effects 0.000 description 7
- 229920000297 Rayon Polymers 0.000 description 3
- 239000004568 cement Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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- 239000012780 transparent material Substances 0.000 description 1
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Abstract
An electronic apparatus comprises a display module, wherein the display module comprises a display surface right facing to a user; a display area and a non-display area are defined on the display surface; the electronic apparatus also comprises an ultrasonic wave type fingerprint identification element that is set corresponding to the display area and is set at one side of the display module far away from the display area, and a shielding layer that is set between the ultrasonic wave type fingerprint identification element and the display module for shielding light. Compared with the existing technology, the ultrasonic wave type fingerprint identification element is set at the other side of the display module corresponding to the display area, thus space is not needed to be maintained in advance at a framework area outside the display area for the ultrasonic type fingerprint identification element; and framework area of the electronic apparatus won't be increased, thus facilitating to narrow framework or non-framework design.
Description
Technical field
The present invention relates to a kind of electronic installation.
Background technology
At present, the electronic installation such as smart mobile phone, panel computer often utilizes fingerprint Identification sensor to realize the functions such as data protection, authentication and programmed control.So, it is peripheral that existing fingerprint Identification sensor sets up the viewing area being placed in electronic installation, and electronic installation need place fingerprint Identification sensor by the frame region headspace beyond viewing area, causes the frame of electronic installation to increase, is unfavorable for narrow frame design.
Summary of the invention
In view of above content, be necessary to provide the electronic installation being beneficial to narrow frame design.
A kind of electronic installation, comprising:
One display module, this display module comprises one just to the display surface of user, and the definition of this display surface has a viewing area and a non-display area;
One Supersonic waves fingerprint recognition element, to should arrange and be arranged at the side of this display module away from this viewing area in viewing area; And
Shielding layer, is arranged between this Supersonic waves fingerprint recognition element and this display module with shading.
Compared to prior art, Supersonic waves fingerprint recognition element of the present invention, be arranged at the opposite side that this display module is corresponding with viewing area, therefore this Supersonic waves fingerprint recognition element is placed without the need to the frame region headspace beyond viewing area, the frame area of electronic installation can not be increased, be conducive to narrow frame or Rimless design.
Accompanying drawing explanation
The schematic appearance of the electronic installation that Fig. 1 provides for first embodiment of the invention.
Fig. 2 be in Fig. 1 electronic installation along the cross-sectional view of II-II line of cut.
The diagrammatic cross-section of the electronic installation that Fig. 3 provides for a change embodiment.
Fig. 4 changes the diagrammatic cross-section of the electronic installation that embodiment provides for another.
The schematic appearance of the electronic installation that Fig. 5 provides for second embodiment of the invention.
Fig. 6 be in Fig. 5 electronic installation along the cross-sectional view of VI-VI line of cut.
The schematic appearance of the electronic installation that Fig. 7 provides for the present invention the 3rd better embodiment.
Fig. 8 is for electronic installation in Fig. 7 is along the cross-sectional view of VIII-VIII line of cut.
Main element symbol description
| Electronic installation | 10，20，30 |
| Display module | 11，21，31 |
| Display surface | 110，210，310 |
| Viewing area | 111，211，311 |
| Non-display area | 112，212，312 |
| Supersonic waves fingerprint recognition element | 12，22，32 |
| Vicinal face | 124，224，324 |
| Substrate | 121，221，321 |
| Signal reception layer | 122，222，322 |
| First substrate | 1220，2220，3220 |
| First electrode layer | 1221，2221，3221 |
| First piezoelectric layer | 1222，2222，3222 |
| Signal transmit layer | 123，223，323 |
| Second substrate | 1230，2230，3230 |
| The second electrode lay | 1231，2231，3231 |
| Second piezoelectric layer | 1232，2232，3232 |
| 3rd electrode layer | 1233，2233，3233 |
| Shielding layer | 13，2220，33 |
| Part I | 131 |
| Part II | 132 |
| Adhesive linkage | 24，34 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
Referring to the schematic appearance of the electronic installation 10 that Fig. 1 and Fig. 2, Fig. 1 provide for first embodiment of the invention, Fig. 2 be in Fig. 1 electronic installation 10 along the cross-sectional view of II-II line of cut.The electronic installation 10 of present embodiment can be the portable sets such as smart mobile phone, personal digital assistant, panel computer, and the present embodiment is described for smart mobile phone.This electronic installation 10 comprises display module 11, Supersonic waves fingerprint recognition element 12 and shielding layer 13.Wherein, the side of this display module 11 comprises one towards the display surface 110 of user, and the definition of this display surface 110 has one for the viewing area 111 that shows image and the non-display area 112 (or claiming rim area) be enclosed in around this viewing area 111.This Supersonic waves fingerprint recognition element 12 is arranged at this display module 11 away from the side of this display surface 110 and correspondingly with this viewing area 111 arranges.This shielding layer 13 is arranged between this Supersonic waves fingerprint recognition element 12 and described display module 11, particularly, is be covered on this Supersonic waves fingerprint recognition element 12 with shading.This Supersonic waves fingerprint recognition element 12 to be communicated with this display module 11 conducting by a Signal transmissions module (not shown).
In addition, this electronic installation 10 also can comprise a sensing instructions unit (not shown), and particularly, this sensing instructions unit can be arranged in this display module 11 and to be electrically connected with described display module 11, when starting described sensing instructions unit, triggering described electronic installation 10 and carrying out fingerprint sensing.Described sensing instructions unit can be the application program be built in this display module 11, and the physical button also by being arranged at this non-display area 112 starts.In addition, this electronic installation 10 also can comprise one and be covered in protective seam (not shown) on described display surface 110, to play a part to protect described display surface 110.
Described Supersonic waves fingerprint recognition element 12 can be used for but be not limited to finger print information collection, authentication and unblock etc.Present embodiment is described for finger print information collection.Described Supersonic waves fingerprint recognition element 12 has a vicinal face 124 corresponding with described display surface 110, and this vicinal face 124 is the most near the face of this display module 11 in this ultrasonic fingerprint recognition element 12.Described Supersonic waves fingerprint recognition element 12 identifiable design is placed on the fingerprint in region corresponding with described vicinal face 124 on described viewing area 111, and the image information forming respective user fingerprint is sent to this Signal transmissions module, this Signal transmissions module exports the image information from described Supersonic waves fingerprint recognition element 12 received to this display module 11, and this viewing area 111 shows fingerprint image the most finally.
Further, described vicinal face 124 is overlapping with described viewing area 111 at least partly.The area of described vicinal face 124 can be selected according to actual conditions.When the area of described vicinal face 124 is more than or equal to described viewing area 111, fingerprint sensing all can be carried out in the optional position that finger is positioned over described viewing area 111.When the area of described vicinal face 124 is less than described viewing area 111, finger need be positioned over the described viewing area 111 corresponding with described vicinal face 124 and can carry out fingerprint sensing.In present embodiment, described vicinal face 124 area is greater than the area of described viewing area 111.Described display module 11 is OLED display panel.
Described Supersonic waves fingerprint recognition element 12 comprises substrate 121, Signal reception layer 122 and signal transmit layer 123.Described Signal reception layer 122 is arranged at the side of this substrate 121 this vicinal face 124 contiguous, and described signal transmit layer 123 is arranged at the side of this substrate 121 away from this vicinal face 124.
Described Signal reception layer 122 and described signal transmit layer 123 adhere on described substrate 121 liang of apparent surfaces respectively by viscose glue (not shown).Thin film transistor (TFT) (the thinfilmtransistor of multiple matrix arrangement is provided with in described substrate 121, TFT) (not shown), the plurality of thin film transistor (TFT) forms thin film transistor (TFT) array and this Signal reception layer 122 electrical couplings, is also electrically connected with described Signal transmissions module simultaneously.The above-said current signal received for receiving the electric signal from described Signal reception layer 122, and is changed into the image information of fingerprint by described thin film transistor (TFT) array.The region producing described electric signal forms described vicinal face 124.Described signal transmit layer 123 sends ultrasonic signal for continuing to described Signal reception layer 122.
Described Signal reception layer 122 comprises the first substrate 1220 and stacked the first electrode layer 1221 and the first piezoelectric layer 1222 be formed on this first substrate 1220.The side that this first substrate 1220 is provided with described first piezoelectric layer 1222 is attached at described substrate 121 surface.In the present embodiment, described shielding layer 13 is between described first substrate 1220 and described display module 11.Described signal transmit layer 123 comprises the second substrate 1230 and is stackedly formed at the second electrode lay 1231, second piezoelectric layer 1232 on this second substrate 1230 and the 3rd electrode layer 1233.The side that described second substrate 1230 is provided with described 3rd electrode layer 1233 is attached at described substrate 121 surface.First and second substrate 1220,1230 described can select light-proofness material or transparent material, and identical material can be selected also can to select different materials.In present embodiment, first and second substrate 1220,1230 described is transparent membrane, such as, and the resin films such as polyamide, polyphenylene sulfide, polyester.
In the present embodiment, described shielding layer 13 is the sticking light-proofness material of tool, such as, is added with the optical cement of black resin particle.The thickness of this shielding layer 13, between 1 ~ 10 μm, between acoustic impedance is auspicious between 1.5 ~ 4,000,000, has an impact to reduce or remit the sensing sensitivity of described shielding layer 13 to described Supersonic waves fingerprint recognition element 12.In present embodiment, the light absorption wavelength of preferred described shielding layer 13 is between 380 ~ 780nm.
Change in embodiments at other, as shown in Figure 3, the side of described shielding layer 13 this Supersonic waves fingerprint recognition element 12 coated further; Change in embodiment at another, as shown in Figure 4, this shielding layer 13 is further by wherein coated for whole described Supersonic waves fingerprint recognition element 12.Particularly, described shielding layer 13 comprises Part I 131 between described Supersonic waves fingerprint recognition element 12 and described display module 11 and coated described all the other Part II of each 132 of Supersonic waves fingerprint recognition element 12.Wherein, described Part I 131 all has light-proofness with described Part II 132.Be appreciated that described Part I 131 can select identical material with described Part II 132, also can select different materials.Described Part I 131 has viscosity.In addition, the thickness of described Part II 132 can be selected between 1 ~ 200 μm.Because first and second part 131,132 described in described shielding layer 13 is by coated for whole described Supersonic waves fingerprint recognition element 12, more effectively prevent the sensing sensitivity of extraneous light to described Supersonic waves fingerprint recognition element 12 from having an impact.
When using described electronic installation 10 to carry out fingerprint sensing, first described sensing instructions unit is started, described display module 11 is made to enter the pattern of sensing fingerprint, now, when finger is positioned over the described viewing area 111 corresponding with described vicinal face 124, the fingerprint image of this finger shows in described viewing area 111.Particularly, described Supersonic waves fingerprint recognition element 12 operationally, described the second electrode lay 1231 applies voltage with described 3rd electrode layer 1233 to described second piezoelectric layer 1232, and described second piezoelectric layer 1232 produces vibration thus sends ultrasound wave under the effect of voltage.When finger is placed on described Supersonic waves fingerprint recognition element 12, the described ultrasound wave of part being sent to finger is reflected onto described Signal reception layer 122, shape by the finger print upper valley and ridge affects, corresponding change is there is by the ultrasound wave reflected, cause the vibration of described first piezoelectric layer 1222 that corresponding change occurs, thus produce the electric signal of respective user fingerprint and be sent to described thin film transistor (TFT) array by described first electrode layer 1221.Described transform electrical signals is that the image information of fingerprint is sent to this Signal transmissions module by described thin film transistor (TFT) array, be sent to described display module 11 by this Signal transmissions module again, the most described display module 11 presents the fingerprint image of respective user finger.
Because described Supersonic waves fingerprint recognition element 12 is arranged at immediately below described viewing area 111, therefore without the need to placing this Supersonic waves fingerprint recognition element 12 at described non-display area 112 headspace, the frame area of described electronic installation 10 can not be increased, be conducive to narrow frame or the Rimless design of electronic installation 10.In addition, due to the existence of described shielding layer 13, the sensing sensitivity of light to this Supersonic waves fingerprint recognition element 12 reducing or remitting described display module 11 has an impact.
Referring to the schematic appearance of the electronic installation 20 that Fig. 5 and Fig. 6, Fig. 5 provide for second embodiment of the invention, Fig. 6 be in Fig. 5 electronic installation 20 along the cross-sectional view of VI-VI line of cut.The electronic installation 20 of present embodiment can be the portable sets such as smart mobile phone, personal digital assistant, panel computer, and the present embodiment is described for smart mobile phone.This electronic installation 20 comprises display module 21, Supersonic waves fingerprint recognition element 22 and adhesive linkage 24.Wherein, the side of this display module 21 comprises one towards the display surface 210 of user, and the definition of this display surface 210 has one for the viewing area 211 that shows image and the non-display area 212 (or claiming rim area) be enclosed in around this viewing area 211.This Supersonic waves fingerprint recognition element 22 is arranged at this display module 21 away from the side of this display surface 210 and correspondingly with this viewing area 211 arranges.This adhesive linkage 24 is for being bonded together this Supersonic waves fingerprint recognition unit and described display module 21, and this adhesive linkage 24 is optical cement.This Supersonic waves fingerprint recognition element 22 to be communicated with this display module 21 conducting by a Signal transmissions module (not shown).In addition, this electronic installation 20 also can comprise a sensing instructions unit (not shown), and particularly, this sensing instructions unit can be arranged in this display module 21 and to be electrically connected with described display module 21, when starting described sensing instructions unit, triggering described electronic installation 20 and carrying out fingerprint sensing.Described sensing instructions unit can be the application program be built in this display module 21, and the physical button also by being arranged at this non-display area 212 starts.In addition, this electronic installation 20 also can comprise one and be covered in protective seam (not shown) on described display surface 210, to play a part to protect described display surface 210.
Described Supersonic waves fingerprint recognition element 22 can be used for but be not limited to finger print information collection, authentication and unblock etc.Present embodiment is described for finger print information collection.Described Supersonic waves fingerprint recognition element 22 has a vicinal face 224 corresponding with described display surface 210, and this vicinal face 224 is the most near the face of this display module 21 in this ultrasonic fingerprint recognition element 22.Described Supersonic waves fingerprint recognition element 22 identifiable design is placed on the fingerprint in region corresponding with described vicinal face 224 on described viewing area 211, and the image information forming respective user fingerprint is sent to this Signal transmissions module, this Signal transmissions module exports the image information from described Supersonic waves fingerprint recognition element 22 received to this display module 21, and this viewing area 211 shows fingerprint image the most finally.Further, described vicinal face 224 is overlapping with described viewing area 211 at least partly.The area of described vicinal face 224 can be selected according to actual conditions.When the area of described vicinal face 224 is more than or equal to described viewing area 211, fingerprint sensing all can be carried out in the optional position that finger is positioned over described viewing area 211.When the area of described vicinal face 224 is less than described viewing area 211, finger need be positioned over above the described viewing area 211 corresponding with described vicinal face 224 and can carry out fingerprint sensing.In present embodiment, described vicinal face 224 area is greater than the area of described viewing area 211.Described display module 21 is OLED viewing area 211 plate.
Described Supersonic waves fingerprint recognition element 22 comprises substrate 221, Signal reception layer 222 and signal transmit layer 223.Described Signal reception layer 222 is arranged at the side of this substrate 221 this vicinal face 224 contiguous, and described signal transmit layer 223 is arranged at the side of this substrate 221 away from this vicinal face 224.
Described Signal reception layer 222 and described signal transmit layer 223 by viscose glue (not shown) adhere to respectively described substrate 221 two apparent surfaces.Thin film transistor (TFT) (the thinfilmtransistor of multiple matrix arrangement is provided with in described substrate 221, TFT) (not shown), the plurality of thin film transistor (TFT) forms thin film transistor (TFT) array and this Signal reception layer 222 electrical couplings, is also electrically connected with described Signal transmissions module simultaneously.The above-said current signal received for receiving the electric signal from described Signal reception layer 222, and is changed into the image information of fingerprint by described thin film transistor (TFT) array.The region producing described electric signal forms described vicinal face 224.Described signal transmit layer 223 sends ultrasonic signal for continuing to described Signal reception layer 222.
Described Signal reception layer 222 comprises the first substrate 2220 and stacked the first electrode layer 2221 and the first piezoelectric layer 2222 be formed on this first substrate 2220.The side that this first substrate 2220 is provided with described first piezoelectric layer 2222 is attached at described substrate 221 surface.In present embodiment, described adhesive linkage 24 is between described first substrate 2220 and described display module 21.Described signal transmit layer 223 comprises the second substrate 2230 and is stackedly formed at the second electrode lay 2231, second piezoelectric layer 2232 on this second substrate 2230 and the 3rd electrode layer 2233.The side that described second substrate 2230 is provided with described 3rd electrode layer 2233 is attached at described substrate 221 surface.
Described first substrate 2220 is light-proofness material, and described first substrate 2220 forms a shielding layer 2220, and for blocking the light from described display module 21, thus the sensing sensitivity of deduction and exemption light to this Supersonic waves fingerprint recognition element 22 has an impact.In present embodiment, described first substrate 2220 is ink material, but is not limited to this.The thickness of this first substrate 2220, between 1 ~ 10 μm, between acoustic impedance is auspicious between 1.5 ~ 4,000,000, has an impact to reduce or remit the sensing sensitivity of described first substrate 2220 to described Supersonic waves fingerprint recognition element 22.In present embodiment, preferably the light absorption wavelength of described first substrate 2220 is between 380 ~ 780nm.Wherein, described second substrate 2230 can select the material identical with described first substrate 2220, also can select different materials.
(not shown) in embodiments is changed, the side of described shielding layer 2220 coated Supersonic waves fingerprint recognition element 22 described in this further at other.Change in embodiment at another, described shielding layer 2220 is further by wherein coated for whole described Supersonic waves fingerprint recognition element 22.Particularly, described shielding layer 2220 comprises the part between described Supersonic waves fingerprint recognition element 22 and described display module 21, i.e. described first substrate 2220, and coated described all the other another part of each of Supersonic waves fingerprint recognition element 22.Wherein, these two parts can select identical material, also can select different materials, but these two parts all have light-proofness.The thickness being positioned at the part shielding layer 2220 of described Supersonic waves fingerprint recognition element 22 side can be selected between 1 ~ 200 μm.Be appreciated that when described second substrate 2230 also selects light-proofness material, described shielding layer 2220 only can comprise the part of the part of described first substrate 2220 and each side of coated described Supersonic waves fingerprint recognition element 22.When described second substrate 2230 selects non-light-proofness material, described shielding layer 2220 comprises the part of described first substrate 2220 and the part of coated described each side of Supersonic waves fingerprint recognition element 22 and the bottom surface away from vicinal face 224.When using described electronic installation 20 to carry out fingerprint sensing, first described sensing instructions unit is started, described display module 21 is made to enter the pattern of sensing fingerprint, now, when finger is positioned over the described viewing area 211 corresponding with described vicinal face 224, the fingerprint image of this finger shows in described viewing area 211.Particularly, described Supersonic waves fingerprint recognition element 22 operationally, described the second electrode lay 2231 applies voltage with described 3rd electrode layer 2233 to described second piezoelectric layer 2232, and described second piezoelectric layer 2232 produces vibration thus sends ultrasound wave under the effect of voltage.When finger is placed on described Supersonic waves fingerprint recognition element 22, the described ultrasound wave of part being sent to finger is reflected onto described Signal reception layer 222, shape by the finger print upper valley and ridge affects, corresponding change is there is by the ultrasound wave reflected, cause the vibration of described first piezoelectric layer 2222 that corresponding change occurs, thus produce the electric signal of respective user fingerprint and be sent to described thin film transistor (TFT) array by described first electrode layer 2221.Described transform electrical signals is that the image information of fingerprint is sent to this Signal transmissions module by described thin film transistor (TFT) array, be sent to described display module 21 by this Signal transmissions module again, the most described display module 21 presents the fingerprint image of respective user finger.
Because described Supersonic waves fingerprint recognition element 22 is arranged at immediately below described viewing area 211, therefore without the need to placing this Supersonic waves fingerprint recognition element 22 at described non-display area 212 headspace, the frame area of described electronic installation 20 can not be increased, be conducive to narrow frame or the Rimless design of electronic installation 20.
Referring to the schematic appearance of the electronic installation 30 that Fig. 7 and Fig. 8, Fig. 7 provide for third embodiment of the invention, Fig. 8 be in Fig. 7 electronic installation 30 along the cross-sectional view of V-V line of cut.The electronic installation 30 of present embodiment can be the portable sets such as smart mobile phone, personal digital assistant, panel computer, and the present embodiment is described for smart mobile phone.This electronic installation 30 comprises display module 31, Supersonic waves fingerprint recognition element 32 shielding layer 33 and adhesive linkage 34.Wherein, the side of this display module 31 comprises one towards the display surface 310 of user, and the definition of this display surface 310 has one for the viewing area 311 that shows image and the non-display area 312 (or claiming rim area) be enclosed in around this viewing area 311.This Supersonic waves fingerprint recognition element 32 is arranged at this display module 31 away from the side of this display surface 310 and correspondingly with this viewing area 311 arranges.This Supersonic waves fingerprint recognition element 32 to be communicated with this display module 31 conducting by a Signal transmissions module (not shown).This shielding layer 33 is covered on this Supersonic waves fingerprint recognition element 32, to block the light from described display module 31.This adhesive linkage 34 is positioned at this shielding layer 33 around, for this Supersonic waves fingerprint recognition unit and described display module 31 being bonded together.In addition, this electronic installation 30 also can comprise a sensing instructions unit (not shown), and particularly, this sensing instructions unit can be arranged in this display module 31 and to be electrically connected with described display module 31, when starting described sensing instructions unit, triggering described electronic installation 30 and carrying out fingerprint sensing.Described sensing instructions unit can be the application program be built in this display module 31, and the physical button also by being arranged at this non-display area 311 starts.In addition, this electronic installation 20 also can comprise one and be covered in protective seam (not shown) on described display surface 310, to play a part to protect described display surface 310.
Further, this shielding layer 33 is arranged between this Supersonic waves fingerprint recognition unit and described display module 31, and the position corresponding with described viewing area 311.Accordingly, this adhesive linkage 34 can be positioned at the region corresponding with described non-display area 311.This adhesive linkage 34 is optical cement layer.This shielding layer 33 can be selected but be not limited to black resin and ink etc.The thickness of this shielding layer 33, between 1 ~ 10 μm, between acoustic impedance is auspicious between 1.5 ~ 4,000,000, has an impact to reduce or remit the sensing sensitivity of described shielding layer 33 to described Supersonic waves fingerprint recognition element 32.In present embodiment, the light absorption wavelength of preferred described shielding layer 33 is between 380 ~ 780nm.In other embodiments, described shielding layer 33 comprises part between described Supersonic waves fingerprint recognition element 32 and described display module 31 and coated described all the other parts of each of Supersonic waves fingerprint recognition element 32.Wherein, these two parts can select identical material, also can select different materials, but all have light-proofness.The thickness being positioned at the part shielding layer 33 of described Supersonic waves fingerprint recognition element 32 side can be selected between 1 ~ 200 μm.
Described Supersonic waves fingerprint recognition element 32 can be used for but be not limited to finger print information collection, authentication and unblock etc.Present embodiment is described for finger print information collection.Described Supersonic waves fingerprint recognition element 32 has a vicinal face 324 corresponding with described display surface 310.Described Supersonic waves fingerprint recognition element 32 identifiable design is placed on the fingerprint in region corresponding with described vicinal face 324 on described viewing area 311, and the image information forming respective user fingerprint is sent to this Signal transmissions module, this Signal transmissions module exports the image information from described Supersonic waves fingerprint recognition element 32 received to this display module 31, and this viewing area 311 shows fingerprint image the most finally.
Further, described vicinal face 324 is overlapping with described viewing area 311 at least partly.The area of described vicinal face 324 can be selected according to actual conditions.When the area of described vicinal face 324 is more than or equal to described viewing area 311, fingerprint sensing all can be carried out in the optional position that finger is positioned over described viewing area 311.When the area of described vicinal face 324 is less than described viewing area 311, finger need be positioned over above the described viewing area 311 corresponding with described vicinal face 324 and can carry out fingerprint sensing.In present embodiment, the area of described vicinal face 324 is greater than the area of described viewing area 311.Described display module 31 is OLED viewing area 311 plate.
Described Supersonic waves fingerprint recognition element 32 comprises substrate 321, Signal reception layer 322 and signal transmit layer 323.Described Signal reception layer 322 is arranged at the side of this substrate 321 this vicinal face 324 contiguous, and described signal transmit layer 323 is arranged at the side of this substrate 321 away from this vicinal face 324.Described Signal reception layer 322 and described signal transmit layer 323 adhere to two apparent surfaces of described substrate 321 respectively by viscose glue (not shown).Thin film transistor (TFT) (the thinfilmtransistor of multiple matrix arrangement is provided with in described substrate 321, TFT) (not shown), the plurality of thin film transistor (TFT) forms thin film transistor (TFT) array and this Signal reception layer 322 electrical couplings, is also electrically connected with described Signal transmissions module simultaneously.The above-said current signal received for receiving the electric signal from described Signal reception layer 322, and is changed into the image information of fingerprint by described thin film transistor (TFT) array.The region producing described electric signal forms described vicinal face 324.Described signal transmit layer 323 sends ultrasonic signal for continuing to described Signal reception layer 322.
Described Signal reception layer 322 comprises the first substrate 3220 and stacked the first electrode layer 3221 and the first piezoelectric layer 3222 be formed on this first substrate 3220.The side that this first substrate 3220 is provided with described first piezoelectric layer 3222 is attached at described substrate 321 surface, and the side that this first substrate 3220 is provided with described first electrode layer 3221 is pasted to described substrate 321 surface.Therefore, described shielding layer 33 is actual is between described first substrate 3220 and described display module 31.Described signal transmit layer 323 comprises the second substrate 3230 and is stackedly formed at the second electrode lay 3231, second piezoelectric layer 3232 on this second substrate 3230 and the 3rd electrode layer 3233.The side that described second substrate 3230 is provided with described 3rd electrode layer 3233 is attached at the described bottom surface 3212 of described substrate 321.In present embodiment, first and second substrate 3220,3230 described is transparent membrane, such as, and the resin films such as polyamide, polyphenylene sulfide, polyester.
When using described electronic installation 30 to carry out fingerprint sensing, first described sensing instructions unit is started, described display module 31 is made to enter the pattern of sensing fingerprint, now, when finger is positioned on the described viewing area 311 corresponding with described vicinal face 324, the fingerprint image of this finger shows in described viewing area 311.Particularly, described Supersonic waves fingerprint recognition element 32 operationally, described the second electrode lay 3231 applies voltage with described 3rd electrode layer 3233 to described second piezoelectric layer 3232, and described second piezoelectric layer 3232 produces vibration thus sends ultrasound wave under the effect of voltage.When finger is placed on described Supersonic waves fingerprint recognition element 32, the described ultrasound wave of part being sent to finger is reflected onto described Signal reception layer 322, shape by the finger print upper valley and ridge affects, corresponding change is there is by the ultrasound wave reflected, cause the vibration of described first piezoelectric layer 3222 that corresponding change occurs, thus produce the electric signal of respective user fingerprint and be sent to described thin film transistor (TFT) array by described first electrode layer 3221.Described transform electrical signals is that the image information of fingerprint is sent to this Signal transmissions module by described thin film transistor (TFT) array, be sent to described display module 31 by this Signal transmissions module again, the most described display module 31 presents the fingerprint image of respective user finger.
Because described Supersonic waves fingerprint recognition element 32 is arranged at immediately below described viewing area 311, therefore without the need to placing this Supersonic waves fingerprint recognition element 32 at described non-display area 311 headspace, the frame area of described electronic installation 30 can not be increased, be conducive to narrow frame or the Rimless design of electronic installation 30.In addition, due to the existence of described shielding layer 33, the sensing sensitivity of light to this Supersonic waves fingerprint recognition element 32 can reducing or remitting described display module 31 has an impact.
Above embodiment is only in order to illustrate technical scheme of the present invention and unrestricted, although with reference to preferred embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that, can modify to technical scheme of the present invention or equivalent replacement, and not depart from the spirit and scope of technical solution of the present invention.
Claims (10)
1. an electronic installation, is characterized in that, comprising:
One display module, this display module comprises a display surface, and the definition of this display surface has a viewing area and a non-display area;
One Supersonic waves fingerprint recognition element, to should arrange and be arranged at the side of this display module away from this viewing area in viewing area; And
Shielding layer, is arranged between this Supersonic waves fingerprint recognition element and this display module with shading.
2. electronic installation as claimed in claim 1, it is characterized in that, this shielding layer has viscosity thus this Supersonic waves fingerprint recognition element and this display module is bonded together.
3. electronic installation as claimed in claim 1, it is characterized in that, this Supersonic waves fingerprint recognition element and this display module are bonded together by an adhesive linkage.
4. electronic installation as claimed in claim 1, it is characterized in that, the thickness of this shielding layer is between 1 ~ 10 μm.
5. electronic installation as claimed in claim 1, is characterized in that, between the acoustic impedance of this shielding layer is auspicious between 1.5 ~ 4,000,000.
6. electronic installation as claimed in claim 1, it is characterized in that, the light absorption wavelength of this shielding layer is between 380 ~ 780nm.
7. electronic installation as claimed in claim 1, it is characterized in that, the material of this shielding layer is black resin or ink.
8. electronic installation as claimed in claim 1, it is characterized in that, the area of the vicinal face of this Supersonic waves fingerprint recognition element and this display module is more than or equal to the area of this viewing area.
9. electronic installation as claimed in claim 1, it is characterized in that, this shielding layer is further by coated for this Supersonic waves fingerprint recognition element whole.
10. electronic installation as claimed in claim 1, it is characterized in that, this Supersonic waves fingerprint recognition element comprises substrate and is located at the Signal reception layer of this substrate this display module side contiguous, described Signal reception layer comprises the first substrate and is formed at the first electrode of this first substrate side, the side that this first substrate has described first electrode is attached at the side of described substrate, and described first substrate selects light-proofness material to form described shielding layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510402527.1A CN105094227A (en) | 2015-07-10 | 2015-07-10 | Electronic apparatus |
| TW105101608A TWI603179B (en) | 2015-07-10 | 2016-01-19 | Electrical device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510402527.1A CN105094227A (en) | 2015-07-10 | 2015-07-10 | Electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105094227A true CN105094227A (en) | 2015-11-25 |
Family
ID=54574883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510402527.1A Pending CN105094227A (en) | 2015-07-10 | 2015-07-10 | Electronic apparatus |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105094227A (en) |
| TW (1) | TWI603179B (en) |
Cited By (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105825199A (en) * | 2016-03-31 | 2016-08-03 | 麦克思商务咨询(深圳)有限公司 | Fingerprint identification element and electronic apparatus using the fingerprint identification element |
| CN105997146A (en) * | 2016-06-27 | 2016-10-12 | 麦克思商务咨询(深圳)有限公司 | Ultrasonic sensor |
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| US11126814B2 (en) | 2018-10-17 | 2021-09-21 | Qualcomm Incorporated | Ultrasonic fingerprint sensor with flexible substrate |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107092310B (en) * | 2017-04-27 | 2020-04-03 | Oppo广东移动通信有限公司 | Display screen, display device and mobile terminal |
| KR20190066795A (en) * | 2017-12-06 | 2019-06-14 | 삼성전자주식회사 | An electronic device in which a conductive member for bliocking noise generated in a display is disposed between the display and a ultrasonic sensor |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104123564A (en) * | 2014-07-23 | 2014-10-29 | 上海思立微电子科技有限公司 | Fingerprint identification device and assembly with coated film protective layer |
| CN104424420A (en) * | 2013-08-30 | 2015-03-18 | 业鑫科技顾问股份有限公司 | Electronic device |
| CN104680125A (en) * | 2014-11-24 | 2015-06-03 | 麦克思智慧资本股份有限公司 | Fingerprint identifying element and fingerprint identifying device |
| CN104699320A (en) * | 2015-04-01 | 2015-06-10 | 上海天马微电子有限公司 | Array substrate, color film substrate and touch display device |
| CN104751132A (en) * | 2015-03-06 | 2015-07-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, touch screen and electronic equipment |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9170668B2 (en) * | 2012-02-02 | 2015-10-27 | Qualcomm Incorporated | Ultrasonic touch sensor with a display monitor |
| WO2013119670A1 (en) * | 2012-02-06 | 2013-08-15 | Ultra-Scan Corporation | Biometric scanner having a protective conductive array |
| US9551783B2 (en) * | 2013-06-03 | 2017-01-24 | Qualcomm Incorporated | Display with backside ultrasonic sensor array |
| US9697409B2 (en) * | 2013-09-10 | 2017-07-04 | Apple Inc. | Biometric sensor stack structure |
-
2015
- 2015-07-10 CN CN201510402527.1A patent/CN105094227A/en active Pending
-
2016
- 2016-01-19 TW TW105101608A patent/TWI603179B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104424420A (en) * | 2013-08-30 | 2015-03-18 | 业鑫科技顾问股份有限公司 | Electronic device |
| CN104123564A (en) * | 2014-07-23 | 2014-10-29 | 上海思立微电子科技有限公司 | Fingerprint identification device and assembly with coated film protective layer |
| CN104680125A (en) * | 2014-11-24 | 2015-06-03 | 麦克思智慧资本股份有限公司 | Fingerprint identifying element and fingerprint identifying device |
| CN104751132A (en) * | 2015-03-06 | 2015-07-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, touch screen and electronic equipment |
| CN104699320A (en) * | 2015-04-01 | 2015-06-10 | 上海天马微电子有限公司 | Array substrate, color film substrate and touch display device |
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| TWI603179B (en) | 2017-10-21 |
| TW201709012A (en) | 2017-03-01 |
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