CN105058788A - Distributed type heating device applied to 3D printing and control method - Google Patents

Abstract

The invention discloses a distributed heating device applied to 3D printing and a control method thereof. The distributed heating device mainly includes a printing substrate, a bus-type temperature measuring unit, a heating resistor, and a controller. The printing substrate is used to place the printed model and perform grid subdivision. Each grid is composed of a bus-type temperature measurement unit and a heating resistor. The heating function of the printing substrate is controlled by the controller. The controller uses the control line to supply power to the heating resistor for heating. The bus temperature measurement unit is used to measure the temperature of the printing substrate in the grid. The detected temperature is sent to the controller through the bus, and the controller sends The actual temperature is compared with the set temperature to control whether the heating resistor continues to heat. The invention solves the problem of uneven heating of the existing 3D printers, can prevent problems such as warping and deformation of the model during the printing process, and can heat on demand according to the shape of the model to save energy. <!-- 2 -->

Description

A distributed heating device and control method applied to 3D printing

technical field

The invention belongs to the field of 3D printing advanced manufacturing, and relates to the field of a distributed heating device and a control method applied to 3D printing.

Background technique

In the initial preparation stage of model printing for 3D printers based on melt extrusion molding (FDM), in order to ensure that the model can be firmly attached to the substrate during the entire printing process and avoid displacement during the printing process, as well as the layers of the model To be firmly bonded together, the substrate needs to be heated precisely to control a constant temperature. However, most of the existing 3D printers use local heating technology, and the heating device is only installed in the center of the substrate. Because local heating will lead to uneven temperature distribution of the substrate, the model will be heated unevenly during the printing process, and the materials used in the FDM process are very sensitive to temperature. The temperature of each part is different during the printing process, which will easily cause the model to be not bonded firmly. Printing deformation, even edge warping, affects the overall printing accuracy of the model, or even printing failure, and this heating method has low energy efficiency and poor adaptability.

Contents of the invention

Purpose of the invention: In order to solve the problem that the uneven heating caused by the local heating of the existing FDM process 3D printer affects the printing accuracy.

Technical solution: A distributed heating device for 3D printing, including a printing substrate, a bus-type temperature measurement unit, a heating resistor and a controller, the bus-type temperature measurement unit is used to measure temperature, and the heating resistor is used to heat the substrate. The entire printing substrate area is subdivided into grids, and each grid constitutes a basic temperature detection and control unit. The temperature measurement unit bus connects the bus-type temperature measurement unit with the controller, and the control line of the heating resistor will heat The resistance is connected with the controller, and the controller is used to realize the independent monitoring and real-time control of the temperature of each grid unit through the bus. According to the size information of the first layer of the model to be printed, the controller heats the grid units covered by the size of the first layer of the model in the substrate on demand. For different models, only the size information of the first layer is needed, which can Adapt to different models.

Beneficial effect:

1. Using this grid-type distributed heating device and its control method, the substrate is evenly heated, realizing real-time control of the temperature of each part, and eliminating uneven temperature distribution;

2. Use the controller to control the temperature of each area of the substrate, heat on demand, improve energy utilization and save resources;

3. This kind of distributed heating is more applicable to different models. Heating according to the shape of the model can make all parts of the model heat up and cool down at the same speed, preventing the model from being deformed during the printing process.

Description of drawings

Fig. 1 is a schematic diagram of the basic composition of the distributed heating grid unit of the present invention;

Fig. 2 is a schematic diagram of grid division of the printing substrate of the present invention;

In the figure, 1. printing substrate, 2. bus temperature measuring unit, 3. heating resistor, 4. measuring unit bus control line, 5. heating resistor control line, 6 controller.

Detailed ways

The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

As shown in FIG. 1 , the distributed heating device of the present invention includes a printing substrate 1 , a bus temperature measurement unit 2 , a heating resistor 3 , a measurement unit bus control line 4 , a heating resistor control line 5 and a controller 6 . The printing substrate 1 is used to place the model to be printed; the bus temperature measurement unit 2 is used to measure the temperature and send the measured temperature to the controller through the bus 4 in digital form; the heating resistor 3 is used to heat the printing substrate 1; the control The controller 6 determines the grid that needs to control the temperature according to the size information of the first layer of the model, and compares the monitored temperature with the set temperature, and at the same time heats the heating resistor 3 through the heating resistor control line 5 .

During the use of the 3D printer of the FDM process, the controller determines the grid that needs to be heated according to the size information of the first layer of the model. The controller compares the temperature measured by the bus-type temperature measuring unit with the set temperature. If heating is required, the heating resistor is supplied with power through the control line 5, and the resistance heats up to form a temperature closed-loop control system to realize the control of the required grid. Unit thermostatically controlled.

In the present invention, the printing substrate 1 is gridded and subdivided by using grid-type distributed heating, and each grid unit is composed of a bus-type temperature measuring unit 2 and a heating resistor 3 . After the meshing process, the temperature of the temperature control part required to print the substrate 1 is evenly distributed, and can adapt to different model requirements. Utilizing the distributed heating device can prevent the deformation of the model due to uneven temperature, and can be heated on demand, with high energy utilization rate.

Claims (2)

1. the distributed heater being applied to 3D and printing, comprise printing substrate, bus type temperature measurement unit, heating resistor and controller to form, it is characterized in that: the printing substrate (1) of warm table has carried out gridding segmentation, each grid is all provided with bus type temperature measurement unit (2) and heating resistor (3), bus type temperature measurement unit (2) and controller (6) link together by temperature measuring unit bus (4), and heating resistor (3) and controller (6) link together by the control line (5) of heating resistor.

2. the control method being applied to the distributed heater that 3D prints according to claim 1, it is characterized in that, according to the ground floor dimension information of printer model, controller is determined to need to carry out temperature controlled grid cell, need the grid cell heated that temperature information is sent to controller by bus in print procedure, controller controls the temperature of each grid cell respectively according to the actual temperature of detection and the temperature of needs.