CN105044845B - A kind of fiber end face processing method - Google Patents
A kind of fiber end face processing method Download PDFInfo
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- CN105044845B CN105044845B CN201510521825.2A CN201510521825A CN105044845B CN 105044845 B CN105044845 B CN 105044845B CN 201510521825 A CN201510521825 A CN 201510521825A CN 105044845 B CN105044845 B CN 105044845B
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- reaction tank
- fiber
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- 239000000835 fiber Substances 0.000 title claims abstract description 58
- 238000003672 processing method Methods 0.000 title claims abstract description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 31
- 238000005530 etching Methods 0.000 claims abstract description 15
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 238000011161 development Methods 0.000 claims abstract description 8
- 238000001312 dry etching Methods 0.000 claims abstract description 8
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 36
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 238000001035 drying Methods 0.000 claims description 13
- 239000013307 optical fiber Substances 0.000 claims description 13
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 239000007789 gas Substances 0.000 claims description 7
- QKCGXXHCELUCKW-UHFFFAOYSA-N n-[4-[4-(dinaphthalen-2-ylamino)phenyl]phenyl]-n-naphthalen-2-ylnaphthalen-2-amine Chemical compound C1=CC=CC2=CC(N(C=3C=CC(=CC=3)C=3C=CC(=CC=3)N(C=3C=C4C=CC=CC4=CC=3)C=3C=C4C=CC=CC4=CC=3)C3=CC4=CC=CC=C4C=C3)=CC=C21 QKCGXXHCELUCKW-UHFFFAOYSA-N 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 6
- 238000010790 dilution Methods 0.000 claims description 2
- 239000012895 dilution Substances 0.000 claims description 2
- 150000007984 tetrahydrofuranes Chemical group 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 7
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 6
- 238000005406 washing Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 108090000623 proteins and genes Proteins 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000000018 DNA microarray Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- -1 diazonium naphthoquinone sulphonate class Chemical class 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000013308 plastic optical fiber Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/25—Preparing the ends of light guides for coupling, e.g. cutting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
- G03F7/2006—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light using coherent light; using polarised light
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
Abstract
The invention discloses a kind of fiber end face processing method, comprise the following steps: (1) cleans fiber end face, blow sheet and dry；(2) at fiber end face resist coating, uniform photoresist layer is formed；(3) fiber end face is dried；(4) carrying out laser to be automatically directed at, exposure forms reaction tank figure, development, cleans, and dries；(5) use dry etching that fiber end face is performed etching, obtain fiber end face reaction tank.Present invention process is simple, workable, and degree of accuracy is high.
Description
Technical field
The invention belongs to optical fiber processing technical field, be specifically related to a kind of fiber end face processing method.
Background technology
Optical fiber is fibre-optic writing a Chinese character in simplified form, and is a kind of fiber being made up of glass or plastics, can conduct instrument as light.Transmission principle is ' total reflection of light '.The kind of optical fiber is a lot, different according to purposes, required function and performance the most difference.But for cable television and the optical fiber communicated, its design and the principle manufactured are essentially identical, such as: be 1. lost little；2. there are certain bandwidth and dispersion little；3. wiring is easy；4. system it is prone to into；5. reliability is high；The most relatively simple to manufacture；The most inexpensive etc..A conclusion is mainly made in the classification of optical fiber from operation wavelength, index distribution, transmission mode, raw material and manufacture method, hereby various classification is exemplified below:
(1) operation wavelength: UV fiber, considerable optical fiber, near-infrared fibre-optical, infrared optical fiber (0.85 μm, 1.3 μm, 1.55 μm).
(2) index distribution: step (SI) type optical fiber, nearly step index fiber, gradual change (GI) type optical fiber, other (such as triangular form, W type, umbilicate type etc.).
(3) transmission mode: single-mode fiber (containing polarization-maintaining fiber, Polarization Holding Fibers), multimode fibre.
(4) raw material: silica fibre, multicomponent glass optical fiber, plastic optical fiber, composite material fiber (such as plastic envelope, liquid core etc.), infra-red material etc..Inorganic material (carbon etc.), metal material (copper, nickel etc.) and plastics etc. also can be divided into by lining material.
(5) manufacture method: preformed has vapor-phase axial deposition (VAD), chemical vapor deposition (CVD) etc., fiber elongation method has pipe law (Rod intube) and double crucible method etc..
In recent years, optical fiber is widely used in the fields such as communication, illumination, image transmitting and sensor, even excellent due to its light transmission, is gradually applied to biochip field.In order to realize function, make chip reach spendable physical arrangement, need chip is processed accurately.
Prior art needs photoresist is carried out spin coating, it is easy to cause whirl coating uneven, in addition it is also necessary to remove the step of edge bead, and because of technical limitations, it is impossible to enough process any required form, be unfavorable for popularization and application.
Summary of the invention
It is an object of the invention to a kind of fiber end face processing method, comprise the following steps:
(1) clean fiber end face, blow sheet and dry；
(2) at fiber end face resist coating, uniform photoresist layer is formed；
(3) fiber end face is dried；
(4) carrying out laser to be automatically directed at, exposure forms reaction tank figure, development, cleans, and dries；
(5) use dry etching that fiber end face is performed etching, obtain fiber end face reaction tank.
Described cleaning first uses triethanolamine, re-uses water and rinses.
Described optical fiber is silica fibre.
Described resist coating uses spray equipment, preferably high-pressure airless spraying device, and spouting velocity is at more than 100-110m/s, and the thickness obtaining photoresist is 1-1.5 μm.
Described photoresist is PAC(diazonium naphthoquinone sulphonate class Photoactive compounds), linear phenol-aldehyde resin and solvent composition；Described solvent is the mixture of oxolane and ethyl acetate.
Described photoresist in use, with solvent dilution 5 times.
The temperature dried in described step (1), (3) is 55-65 DEG C, and the time is 15-30 minute.Drying temperature in described step (4) and be 130-135 DEG C, the time is 10-15 minute.
Described exposure is projection exposure.
Described etching gas is Nitrogen trifluoride and oxygen.
The technique of the present invention is simple, workable, and Aligning degree is high, is suitable for large-scale industrial production, beneficially popularization and application.Drying course repeatedly is it can be avoided that interference between each step.High-pressure airless spraying device ensure that the photoresist drop of ejection is less, coating is uniformly, it is to avoid during spin coating, whirl coating is uneven and removes the step of edge bead.The chip that the present invention prepares can be applied to multiple field, such as prepare micro-fluidic chip, protein chip or gene chip.
Detailed description of the invention
Embodiment
1
(1) cleaning silica fibre end face, first use triethanolamine washing, re-use water and rinse, then 55 DEG C are blown sheet drying 30 minutes；
(2) use oxolane and ethyl acetate that photoresist is diluted 5 times, photoresist is the mixture of PAC, linear phenol-aldehyde resin, oxolane and ethyl acetate, use high-pressure airless spraying device at fiber end face resist coating, spouting velocity is 100m/s, the thickness obtaining photoresist is 1 μm, forms uniform photoresist layer；
(3) fiber end face carries out 65 DEG C dry 15 minutes；
(4) carrying out laser to be automatically directed at, carry out projection exposure, form reaction tank figure, development, clean, first use triethanolamine, re-use water and rinse, 135 DEG C of drying, the time is 10 minutes；
(5) using dry etching to perform etching fiber end face, etching gas is Nitrogen trifluoride and oxygen, obtains fiber end face reaction tank.
Embodiment
2
(1) cleaning silica fibre end face, first use triethanolamine washing, re-use water and rinse, then 55 DEG C are blown sheet drying 20 minutes；
(2) use oxolane and ethyl acetate that photoresist is diluted 5 times, photoresist is the mixture of PAC, linear phenol-aldehyde resin, oxolane and ethyl acetate, use high-pressure airless spraying device at fiber end face resist coating, spouting velocity is 110m/s, the thickness obtaining photoresist is 1.5 μm, forms uniform photoresist layer；
(3) fiber end face carries out 60 DEG C dry 25 minutes；
(4) carrying out laser to be automatically directed at, carry out projection exposure, form reaction tank figure, development, clean, first use triethanolamine, re-use water and rinse, 130 DEG C of drying, the time is 15 minutes；
(5) using dry etching to perform etching fiber end face, etching gas is Nitrogen trifluoride and oxygen, obtains fiber end face reaction tank.
Embodiment
3
(1) cleaning silica fibre end face, first use triethanolamine washing, re-use water and rinse, then 58 DEG C are blown sheet drying 22 minutes；
(2) use oxolane and ethyl acetate that photoresist is diluted 5 times, photoresist is the mixture of PAC, linear phenol-aldehyde resin, oxolane and ethyl acetate, use high-pressure airless spraying device at fiber end face resist coating, spouting velocity is 105m/s, the thickness obtaining photoresist is 1.2 μm, forms uniform photoresist layer；
(3) fiber end face carries out 60 DEG C dry 26 minutes；
(4) carrying out laser to be automatically directed at, carry out projection exposure, form reaction tank figure, development, clean, first use triethanolamine, re-use water and rinse, 132 DEG C of drying, the time is 10 minutes；
(5) using dry etching to perform etching fiber end face, etching gas is Nitrogen trifluoride and oxygen, obtains fiber end face reaction tank.
Embodiment
4
(1) cleaning silica fibre end face, first use triethanolamine washing, re-use water and rinse, then 62 DEG C are blown sheet drying 30 minutes；
(2) use oxolane and ethyl acetate that photoresist is diluted 5 times, photoresist is the mixture of PAC, linear phenol-aldehyde resin, oxolane and ethyl acetate, use high-pressure airless spraying device at fiber end face resist coating, spouting velocity is 102m/s, the thickness obtaining photoresist is 1.3 μm, forms uniform photoresist layer；
(3) fiber end face carries out 55 DEG C dry 18 minutes；
(4) carrying out laser to be automatically directed at, carry out projection exposure, form reaction tank figure, development, clean, first use triethanolamine, re-use water and rinse, 135 DEG C of drying, the time is 12 minutes；
(5) using dry etching to perform etching fiber end face, etching gas is Nitrogen trifluoride and oxygen, obtains fiber end face reaction tank.
Embodiment
5
(1) cleaning silica fibre end face, first use triethanolamine washing, re-use water and rinse, then 60 DEG C are blown sheet drying 16 minutes；
(2) use oxolane and ethyl acetate that photoresist is diluted 5 times, photoresist is the mixture of PAC, linear phenol-aldehyde resin, oxolane and ethyl acetate, using spray equipment at fiber end face resist coating, the thickness obtaining photoresist is 1.1 μm, forms uniform photoresist layer；
(3) fiber end face carries out 56 DEG C dry 19 minutes；
(4) carrying out laser to be automatically directed at, carry out projection exposure, form reaction tank figure, development, clean, first use triethanolamine, re-use water and rinse, 135 DEG C of drying, the time is 10 minutes；
(5) using dry etching to perform etching fiber end face, etching gas is Nitrogen trifluoride and oxygen, obtains fiber end face reaction tank.
Above-mentioned detailed description is illustrating for one of them possible embodiments of the present invention, and this embodiment is also not used to limit the scope of the claims of the present invention, and all equivalences done without departing from the present invention are implemented or change, are intended to be limited solely by the range of technical solution of the present invention.
Claims (1)
1. a fiber end face processing method, it is characterised in that comprise the following steps:
(1) clean fiber end face, blow sheet and dry；
(2) at fiber end face resist coating, uniform photoresist layer is formed；
(3) fiber end face is dried；
(4) carrying out laser to be automatically directed at, exposure forms reaction tank figure, development, cleans, and dries；
(5) use dry etching that fiber end face is performed etching, obtain fiber end face reaction tank;
Clean described in step (1) and (4) and first use triethanolamine, re-use water and rinse;
Described optical fiber is silica fibre;
Described resist coating uses high-pressure airless spraying device, and spouting velocity is at more than 100-110m/s, and the thickness obtaining photoresist is 1-1.5 μm;
Described photoresist is PAC, linear phenol-aldehyde resin and solvent composition；Described solvent is oxolane and ethyl acetate;
Described photoresist in use, with solvent dilution 5 times;
The temperature dried in described step (1), (3) is 55-65 DEG C, and the time is 15-30 minute；Drying temperature in described step (4) and be 130-135 DEG C, the time is 10-15 minute;
Described exposure is projection exposure;
Described etching gas is Nitrogen trifluoride and oxygen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510521825.2A CN105044845B (en) | 2015-08-24 | 2015-08-24 | A kind of fiber end face processing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510521825.2A CN105044845B (en) | 2015-08-24 | 2015-08-24 | A kind of fiber end face processing method |
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| Publication Number | Publication Date |
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| CN105044845A CN105044845A (en) | 2015-11-11 |
| CN105044845B true CN105044845B (en) | 2016-08-17 |
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| CN201510521825.2A Active CN105044845B (en) | 2015-08-24 | 2015-08-24 | A kind of fiber end face processing method |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106862759B (en) * | 2017-04-19 | 2018-11-13 | 中国科学技术大学 | A kind of processing unit (plant) and processing method of fiber end face |
| CN113511803A (en) * | 2021-07-20 | 2021-10-19 | 湖南智信微电子科技有限公司 | High-precision optical glass part processing method and protective liquid |
| CN114890377A (en) * | 2022-04-21 | 2022-08-12 | 南京理工大学 | Preparation method of optical fiber type step laser flying piece energy conversion element based on MEMS (micro-electromechanical systems) process |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5101457A (en) * | 1990-02-28 | 1992-03-31 | At&T Bell Laboratories | Optical fiber with an integral lens at its end portion |
| US5966485A (en) * | 1996-11-22 | 1999-10-12 | Siecor Corporation | Method of producing core protrusion relative to cladding in an optical fiber of a fiber optic connector |
| CN1139824C (en) * | 2002-06-03 | 2004-02-25 | 上海交通大学 | Fine processing method for end face of optical fibre |
| CN102062899B (en) * | 2010-11-10 | 2012-03-21 | 华中科技大学 | Optical fiber sensing head with nano grid structure |
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