CN105025694A - Electromagnetic wave absorbing material with protective layer and manufacturing method of electromagnetic wave absorbing material - Google Patents
Electromagnetic wave absorbing material with protective layer and manufacturing method of electromagnetic wave absorbing material Download PDFInfo
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- CN105025694A CN105025694A CN201510446993.XA CN201510446993A CN105025694A CN 105025694 A CN105025694 A CN 105025694A CN 201510446993 A CN201510446993 A CN 201510446993A CN 105025694 A CN105025694 A CN 105025694A
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- electromagnetic wave
- protective layer
- alloy
- absorbent material
- film
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- 239000011241 protective layer Substances 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000011358 absorbing material Substances 0.000 title abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 27
- 230000001681 protective effect Effects 0.000 claims abstract description 21
- 239000000843 powder Substances 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims abstract description 11
- 239000000696 magnetic material Substances 0.000 claims abstract description 8
- 239000011230 binding agent Substances 0.000 claims abstract description 7
- 229920006254 polymer film Polymers 0.000 claims abstract description 7
- 230000002745 absorbent Effects 0.000 claims description 16
- 239000002250 absorbent Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 14
- 229910000640 Fe alloy Inorganic materials 0.000 claims description 12
- 229910001021 Ferroalloy Inorganic materials 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 8
- 239000006096 absorbing agent Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 6
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 6
- QHCZEKMIMJAYOR-UHFFFAOYSA-N [Fe].[Zn].[Nb] Chemical compound [Fe].[Zn].[Nb] QHCZEKMIMJAYOR-UHFFFAOYSA-N 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 238000005229 chemical vapour deposition Methods 0.000 claims description 6
- 230000035699 permeability Effects 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910000604 Ferrochrome Inorganic materials 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- 229910000914 Mn alloy Inorganic materials 0.000 claims description 3
- 229910000676 Si alloy Inorganic materials 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- RFIJBZKUGCJPOE-UHFFFAOYSA-N [Fe].[Ni].[Zn] Chemical compound [Fe].[Ni].[Zn] RFIJBZKUGCJPOE-UHFFFAOYSA-N 0.000 claims description 3
- KLARSDUHONHPRF-UHFFFAOYSA-N [Li].[Mn] Chemical compound [Li].[Mn] KLARSDUHONHPRF-UHFFFAOYSA-N 0.000 claims description 3
- KSIIOJIEFUOLDP-UHFFFAOYSA-N [Si].[Fe].[Ni] Chemical compound [Si].[Fe].[Ni] KSIIOJIEFUOLDP-UHFFFAOYSA-N 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- ADCXHZZSUADYMI-UHFFFAOYSA-N cadmium lithium Chemical compound [Li].[Cd] ADCXHZZSUADYMI-UHFFFAOYSA-N 0.000 claims description 3
- RIVZIMVWRDTIOQ-UHFFFAOYSA-N cobalt iron Chemical compound [Fe].[Co].[Co].[Co] RIVZIMVWRDTIOQ-UHFFFAOYSA-N 0.000 claims description 3
- ZGDWHDKHJKZZIQ-UHFFFAOYSA-N cobalt nickel Chemical compound [Co].[Ni].[Ni].[Ni] ZGDWHDKHJKZZIQ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 229910001004 magnetic alloy Inorganic materials 0.000 claims description 3
- 229910001120 nichrome Inorganic materials 0.000 claims description 3
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 3
- -1 polyethylene terephthalate Polymers 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 229910000702 sendust Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910021484 silicon-nickel alloy Inorganic materials 0.000 claims description 3
- NDKWCCLKSWNDBG-UHFFFAOYSA-N zinc;dioxido(dioxo)chromium Chemical compound [Zn+2].[O-][Cr]([O-])(=O)=O NDKWCCLKSWNDBG-UHFFFAOYSA-N 0.000 claims description 3
- 238000005452 bending Methods 0.000 abstract description 13
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 238000007740 vapor deposition Methods 0.000 abstract 2
- 229920002521 macromolecule Polymers 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 7
- 238000012216 screening Methods 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses an electromagnetic wave absorbing material with a protective layer. The electromagnetic wave absorbing material comprises a wave-absorbing film layer, and a protective film layer coating the surface of the wave-absorbing film layer. The wave-absorbing film layer is an organic binding agent film mixed with soft magnetic material powder; the protective layer is a polymer film formed by vapor deposition. According to the invention, the macromolecule protective film layer coats the surface of the wave-absorbing film layer, so that the scratch resistance and the bending resistance of the wave-absorbing film are effectively improved. The protective film formed by vapor deposition can be thinned to 0.05 um at most, so that influence on the thickness of the device is prevented. The material can be conveniently attached to an electronic device, and can be bent to achieve better shielding effects to electromagnetic waves while meeting the shielding effectiveness requirement.
Description
Technical field
The present invention relates to a kind of electromagnetic wave absorbent material and the manufacture method thereof with protective layer.
Background technology
Along with the develop rapidly of electronic technology, have the day by day universal of the electronic product of various personalized entertainment function, also make electronic product be rapidly to the future developments such as intellectuality, integrated, lightening, multifunction.
But, due to the speed of transfer of data and the increase of frequency and circuit board integrated level, with the interference reducing adjacent component, more and more higher requirement is proposed to the environment improving electromagnetic interference.Smart machine operationally in addition, and the continuous emitting electromagnetic wave outward of meeting, maximum power can reach 2w, and this is very large on the impact of surrounding environment.Therefore, for avoiding its interference operationally each other and to surrounding environment, must limit some unnecessary radiation.Use and can to absorb and the absorbing material of loss magnetic energy can avoid the problem of this respect, as magnetic material and blend rubber being formed of proposing in patent EP0667643B1 inhales ripple rete.
Because absorbing material is the film material containing high filler loading capacity wave absorbing agent, therefore it is easy to fracture when bending, and loading is higher, is more easy to fracture.Particularly for suction ripple film material (being less than 0.1mm) that thickness is smaller, more easily there is breakage in use.And in absorbing material use procedure, in order to the interference protecting electronic device not to be subject to electromagnetic wave noise, need absorbing material bending to form lid to cover on device.If absorbing material ruptures, then can form gap thus affect electromagnetic shielding effect.
In the performance of routine, be at the side coating adhesive adhensive layer inhaling ripple film material and adhere to layer protecting film.But in this implementation method, adhesive layer and the protective film thickness of coating are greater than 15um usually.Because its gross thickness is very large, and without any electromagnet shield effect, because this reducing the overall anti-electromagnetic interference capability inhaling ripple film material.And in the application of smart mobile phone, very responsive to the thickness of material used, will directly affect the assembling of mobile phone.
Summary of the invention
The object of the present invention is to provide a kind of electromagnetic wave absorbent material and the manufacture method thereof with protective layer; polymer protection rete is enclosed at suction ripple film surface; effectively enhance the scraping and wiping resistance performance and resistance to bending performance of inhaling ripple film material; and the thinnest 0.05um that reaches of diaphragm formed by the method for vapour deposition; make it can not form impact to the thickness of equipment; can paste on the electronic devices easily; while meeting screening effectiveness requirement, can also be reached the more effective function of shielding of electromagnetic wave by bending.
For achieving the above object, the invention provides a kind of electromagnetic wave absorbent material with protective layer, comprise and inhale ripple rete, and be overlying on the protective film of inhaling ripple film surface; Described suction ripple rete is the organic adhesive agent film being mixed with soft magnetic material powder, and described protective layer is the polymer film formed by vapour deposition.
Preferably, described suction ripple rete is greater than 30 at the magnetic permeability of 1MHz frequency, and it consists of the wave absorbing agent of 50-95% and the organic binder bond of 50-5%.
Preferably, the material of described wave absorbing agent is soft magnetic alloy powder, comprise: nickel zinc-iron alloy, ambrose alloy ferroalloy, zinc chrome ferroalloy, MnZn ferroalloy, niobium zinc-iron alloy, sendust, nichrome, niobium zinc-iron alloy, iron-nickel alloy, ferroaluminium, ferrocobalt, ferrochrome, iron silicon nickel alloy, iron, silicon, aluminum and nickel alloy, magnesium manganeisen, cobalt-nickel alloy, lithium manganese alloy, lithium cadmium ferroalloy.
Preferably, the polymer in described polymer film comprises: polyimides, polyethylene terephthalate, Parylene.
Preferably, the thickness of described protective film is 0.05um-15um.
Preferably, the thickness of described suction ripple rete is 20um-1mm.
Preferably, the both side surface of described suction ripple rete is all covered with protective film.
The present invention also provides the above-mentioned manufacture method with the electromagnetic wave absorbent material of protective layer, comprises the steps:
Step 1, makes electro-magnetic wave absorption rete by the organic binder bond being mixed with soft magnetic material powder by extruding or applying;
Step 2, polymer is deposited on absorbing membranous layer surface by CVD (Chemical Vapor Deposition) method and forms protective film, protective film THICKNESS CONTROL is at 0.05um-15um.
Advantage of the present invention and beneficial effect are: provide a kind of electromagnetic wave absorbent material and the manufacture method thereof with protective layer; polymer protection rete is enclosed at suction ripple film surface; effectively enhance the scraping and wiping resistance performance and resistance to bending performance of inhaling ripple film material; and the thinnest 0.05um that reaches of diaphragm formed by the method for vapour deposition; make it can not form impact to the thickness of equipment; can paste on the electronic devices easily; while meeting screening effectiveness requirement, can also be reached the more effective function of shielding of electromagnetic wave by bending.
Accompanying drawing explanation
Fig. 1 is the structural representation of embodiment 1;
Fig. 2 is the structural representation of embodiment 2;
Fig. 3 is the schematic diagram of embodiment 3;
Fig. 4 is the structural representation of comparative example 1.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is further described.Following examples only for technical scheme of the present invention is clearly described, and can not limit the scope of the invention with this.
The invention provides a kind of electromagnetic wave absorbent material with protective layer, comprise and inhale ripple rete, and be overlying on the protective film of inhaling ripple film surface; Described suction ripple rete is the organic adhesive agent film being mixed with soft magnetic material powder, and described protective layer is the polymer film formed by vapour deposition.
Described suction ripple rete is greater than 30 at the magnetic permeability of 1MHz frequency, and it consists of the wave absorbing agent of 50-95% and the organic binder bond of 50-5%.
The material of described wave absorbing agent is soft magnetic alloy powder, comprise: nickel zinc-iron alloy, ambrose alloy ferroalloy, zinc chrome ferroalloy, MnZn ferroalloy, niobium zinc-iron alloy, sendust, nichrome, niobium zinc-iron alloy, iron-nickel alloy, ferroaluminium, ferrocobalt, ferrochrome, iron silicon nickel alloy, iron, silicon, aluminum and nickel alloy, magnesium manganeisen, cobalt-nickel alloy, lithium manganese alloy, lithium cadmium ferroalloy.
Polymer in described polymer film comprises: polyimides, polyethylene terephthalate, Parylene.
The thickness of described protective film is 0.05um-15um.
The thickness of described suction ripple rete is 20um-1mm.
The both side surface of described suction ripple rete is all covered with protective film.
The present invention also provides the above-mentioned manufacture method with the electromagnetic wave absorbent material of protective layer, comprises the steps:
Step 1, makes electro-magnetic wave absorption rete by the organic binder bond being mixed with soft magnetic material powder by extruding or applying;
Step 2, polymer is deposited on absorbing membranous layer surface by CVD (Chemical Vapor Deposition) method and forms protective film, protective film THICKNESS CONTROL is at 0.05um-15um.
The technical scheme that the present invention specifically implements is:
Embodiment 1
As shown in Figure 1, absorbing material comprises loose suction ripple rete 11, is the film containing the Fe-Ni Alloy Powder of 80% weight ratio and the polyvinyl chloride adhesive of 20% weight ratio; thickness is 0.3mm; magnetic permeability is 50 at 1MHz, and the polyimides protective film 12 in its side, and thickness is 5um.
Embodiment 2
As shown in Figure 2, absorbing material comprises loose suction ripple rete 11, is the film containing the Fe-Ni Alloy Powder of 80% weight ratio and the polyvinyl chloride adhesive of 20% weight ratio; thickness is 0.3mm; magnetic permeability is 50 at 1MHz, and the polyimides protective film 12 in its both sides, and thickness is 5um.
Embodiment 3
As shown in Figure 3, electronic component 13 is placed on wiring board 14, covers as the absorbing material in embodiment 1 above it.Absorbing material is in the bending of electronic component edge, and complete is coated on electronical elements surface.
Comparative example 1
As shown in Figure 4, absorbing material comprises loose suction ripple rete 11, and be the film containing the Fe-Ni Alloy Powder of 80% weight ratio and the polyvinyl chloride adhesive of 20% weight ratio, thickness is 0.3mm, and magnetic permeability is 50 at 1MHz.
Screening effectiveness is tested
Screening effectiveness (dB) is by Agilent E5061A vector network tester in accordance with ASTM-D-4935 testing standard, the test of DN1015 screening effectiveness testing apparatus, test result for embodiment 3 is known, and in the frequency range of 0-1GHz, electromagnetic shielding effectiveness is average 96dB.
Bending resistance is reckoned the actual amount after a discount and is tested
Bending resistance is reckoned the actual amount after a discount to test and is tested by the tester of resistance to bending in accordance with JIS-C5016 testing standard, for embodiment 1,2, and the test result of comparative example 1 is known, embodiment 1 and 2 is not fracture within 1000 bending cycles, and comparative example 1 ruptures when the 8th bending.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the technology of the present invention principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (8)
1. there is the electromagnetic wave absorbent material of protective layer, it is characterized in that, comprise and inhale ripple rete, and be overlying on the protective film of inhaling ripple film surface; Described suction ripple rete is the organic adhesive agent film being mixed with soft magnetic material powder, and described protective layer is the polymer film formed by vapour deposition.
2. the electromagnetic wave absorbent material with protective layer according to claim 1, is characterized in that, described suction ripple rete is greater than 30 at the magnetic permeability of 1MHz frequency, and it consists of the wave absorbing agent of 50-95% and the organic binder bond of 50-5%.
3. the electromagnetic wave absorbent material with protective layer according to claim 2; it is characterized in that; the material of described wave absorbing agent is soft magnetic alloy powder; comprise: nickel zinc-iron alloy, ambrose alloy ferroalloy, zinc chrome ferroalloy, MnZn ferroalloy, niobium zinc-iron alloy, sendust, nichrome, niobium zinc-iron alloy, iron-nickel alloy, ferroaluminium, ferrocobalt, ferrochrome, iron silicon nickel alloy, iron, silicon, aluminum and nickel alloy, magnesium manganeisen, cobalt-nickel alloy, lithium manganese alloy, lithium cadmium ferroalloy.
4. the electromagnetic wave absorbent material with protective layer according to claim 3, is characterized in that, the polymer in described polymer film comprises: polyimides, polyethylene terephthalate, Parylene.
5. the electromagnetic wave absorbent material with protective layer according to claim 4, is characterized in that, the thickness of described protective film is 0.05um-15um.
6. the electromagnetic wave absorbent material with protective layer according to claim 5, is characterized in that, the thickness of described suction ripple rete is 20um-1mm.
7. the electromagnetic wave absorbent material with protective layer according to claim 6, is characterized in that, the both side surface of described suction ripple rete is all covered with protective film.
8. the manufacture method with the electromagnetic wave absorbent material of protective layer according to any one of claim 1-7, is characterized in that, comprise the steps:
Step 1, makes electro-magnetic wave absorption rete by the organic binder bond being mixed with soft magnetic material powder by extruding or applying;
Step 2, polymer is deposited on absorbing membranous layer surface by CVD (Chemical Vapor Deposition) method and forms protective film, protective film THICKNESS CONTROL is at 0.05um-15um.
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109203621A (en) * | 2018-02-12 | 2019-01-15 | 苏州铂韬新材料科技有限公司 | A kind of double-sided polyimide film with electromagnetic wave absorption functions |
WO2019023848A1 (en) * | 2017-07-31 | 2019-02-07 | 深圳鹏汇功能材料有限公司 | Radio frequency identification device, shielding circuit board and shielding wave-absorbing plate |
CN110861359A (en) * | 2019-11-25 | 2020-03-06 | 苏州驭奇材料科技有限公司 | Composite heat dissipation wave absorption film |
CN111343782A (en) * | 2020-04-14 | 2020-06-26 | 京东方科技集团股份有限公司 | Flexible circuit board assembly, display assembly and display device |
CN112318983A (en) * | 2020-10-21 | 2021-02-05 | 西安现代控制技术研究所 | Cobalt-based amorphous composite material convenient to form |
CN114179449A (en) * | 2021-11-25 | 2022-03-15 | 广州金南磁性材料有限公司 | Wave-absorbing material for folding screen and preparation method and application thereof |
CN116110706A (en) * | 2023-02-23 | 2023-05-12 | 合肥工业大学 | A preparation method of a magnetic isolation sheet for improving crystal plane orientation and improving wireless charging efficiency |
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CN1413316A (en) * | 1999-10-22 | 2003-04-23 | 3M创新有限公司 | Display apparatus with corrosion-resistant light directing film |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2019023848A1 (en) * | 2017-07-31 | 2019-02-07 | 深圳鹏汇功能材料有限公司 | Radio frequency identification device, shielding circuit board and shielding wave-absorbing plate |
CN109203621A (en) * | 2018-02-12 | 2019-01-15 | 苏州铂韬新材料科技有限公司 | A kind of double-sided polyimide film with electromagnetic wave absorption functions |
CN110861359A (en) * | 2019-11-25 | 2020-03-06 | 苏州驭奇材料科技有限公司 | Composite heat dissipation wave absorption film |
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CN112318983A (en) * | 2020-10-21 | 2021-02-05 | 西安现代控制技术研究所 | Cobalt-based amorphous composite material convenient to form |
CN114179449A (en) * | 2021-11-25 | 2022-03-15 | 广州金南磁性材料有限公司 | Wave-absorbing material for folding screen and preparation method and application thereof |
CN116110706A (en) * | 2023-02-23 | 2023-05-12 | 合肥工业大学 | A preparation method of a magnetic isolation sheet for improving crystal plane orientation and improving wireless charging efficiency |
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Application publication date: 20151104 |