CN105023867A - Transportation device and cutting device of plate-like object - Google Patents

Abstract

The invention provides a conveying device and a cutting device for a plate-shaped object. The handling device (1-1) has a holding unit (10) for holding a plate-shaped object, and a moving unit (20) for moving the holding unit (10) from a predetermined position to the chuck table, and the holding unit (10) has: Connected to the support base part (11) of the mobile unit (20); the non-contact adsorption holder (12), which is arranged on the lower surface (11b) of the support base part (11), ejects air to generate a negative press, and absorb and hold the upper surface of the plate in a non-contact manner; the limiting unit (13), which is arranged on the outer peripheral area of the plate on the lower surface (11b) of the support base part (11), limits and holds The horizontal movement of the plate on the non-contact adsorption holder (12); and the warpage detection unit (14), which detects the warpage of the transported plate, and the warpage of the plate If it is less than a predetermined amount, it is sucked and conveyed by a non-contact suction holder (12).

Description

Plate handling device and cutting device

technical field

The present invention relates to a conveying device and a cutting device for a plate-shaped object.

Background technique

In order to obtain chips with high flexural strength, it is necessary to process semiconductor wafers by a processing method called dicing before (so-called DBG (Dicing Before Grinding: Dicing Before Grinding)). In the first dicing, half-cut is performed from the upper surface (device surface) side of the device on which the plate-shaped wafer (plate-shaped object) is formed, and then the lower surface (opposite side surface of the device surface) is ground and separated. for the chip. A cutting device (slicer) for half-cutting holds the device surface of a plate-shaped object with a non-contact suction holder (so-called Bernoulli suction cup), and transports the upper surface (device surface) by suction without damaging the device plate-shaped object (for example, refer to Patent Document 1).

Patent Document 1 Japanese Patent Application Laid-Open No. 2004-119784

However, for example, in the device called WL-CSP (Wafer Level Chip Size Package: Wafer Level Chip Size Package), the upper surface of the plate is coated with resin, the plate may be warped, or the corresponding The weight increases compared with a plate-like object that is not coated with resin on the upper surface, so it is difficult to achieve stable adsorption of the non-contact adsorption holder. Therefore, when transporting a warped or heavy plate-shaped object, a contact-type suction holder (so-called vacuum chuck) that contacts the upper surface of the plate-shaped object for suction and holding (since the upper surface of the plate-shaped object The surface is coated with resin so that the device will not be damaged even if the vacuum chuck touches it). Therefore, when using a cutting device to process two types of plate-shaped objects, the upper surface of which is not coated with resin and the upper surface of the plate-shaped object coated with resin, it is necessary to install a corresponding non-contact suction holder. Compared with the contact type adsorption holder, it takes a long time to switch (namely replace) each suction cup according to the plates of different processing objects (namely, replace) and thus is less efficient. In addition, when trying to transport a plate-shaped object with a warpage of more than a specified amount (a plate-shaped object that is difficult to achieve stable adsorption by a non-contact adsorption holder) using a non-contact suction holder, it takes time and is inefficient. .

Contents of the invention

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a conveying device and a cutting device for a plate-shaped object that can efficiently convey the plate-shaped object.

In order to solve the above-mentioned problems and achieve the purpose, the present invention provides a conveying device for a plate-shaped object, which has a holding unit for holding a plate-shaped object, and a moving unit for moving the holding unit from a predetermined position to a chuck table. That is, the holding unit has: a supporting base part, which is connected with the moving unit; a non-contact adsorption holder, which is arranged on the lower surface of the supporting base part, ejects air to generate negative pressure, and is non-contact. The upper surface of the plate is adsorbed and held by the method; the limiting unit is arranged on the outer peripheral area of the plate on the lower surface of the support base, and the level of the plate held on the non-contact adsorption holder The movement is restricted; and the warpage amount detection unit detects the warpage amount of the conveyed plate-shaped object, and when the warpage amount of the plate-shaped object is less than a predetermined amount, it is sucked by a non-contact adsorption holder and transport.

In addition, the above-mentioned transport device is preferably configured such that the holding unit further includes: a contact-type adsorption holder disposed on the lower surface of the support base portion, and contacts the upper surface of the plate-shaped object for adsorption and holding; and a selection unit that One of the contact suction holder and the non-contact suction holder is positioned at the active position close to the plate, and the other is positioned at the non-active position away from the plate.

In addition, the present invention also provides a cutting device, which has a chuck table for holding a plate-shaped object, and a cutting unit for cutting the plate-shaped object held on the chuck table with a cutting blade, and is characterized in that the cutting device It also has: a box loading table, which places a box for accommodating a plurality of plate-shaped objects; a cleaning unit, which holds and cleans the cut plate-shaped objects through the cleaning table; The cassettes on the mounting table are carried in and out; and the conveying unit conveys the plate-shaped object between the holding hand, the chuck table, and the cleaning table, and the conveying unit is a conveying device for the above-mentioned plate-shaped object.

According to the present invention, when the warpage amount of the plate-shaped object detected by the warpage amount detection unit is less than a predetermined amount, the plate-shaped object is sucked and conveyed by the non-contact suction holder, so it is not necessary to use the non-contact suction The retainer can work by trying to carry a plate-shaped object whose warpage exceeds the specified amount. Therefore, according to this invention, the effect that a plate-shaped object can be conveyed efficiently is acquired.

Description of drawings

FIG. 1 is a diagram showing a configuration example of a transport device according to a first embodiment.

2 is a cross-sectional view showing a state in which a warpage amount of a plate-shaped object is detected by a warpage amount detection unit of the conveyance device according to the first embodiment.

3 is a cross-sectional view showing a state in which a plate-shaped object is sucked and held by the non-contact suction holder of the conveyance device according to the first embodiment.

FIG. 4 is a flowchart showing an example of the operation of the transport device according to the first embodiment.

Fig. 5 is a diagram showing a configuration example of a transport device according to a second embodiment.

6 is a cross-sectional view showing a state in which a warpage amount of a plate-shaped object is detected by a warpage amount detection unit of a conveyance device according to a second embodiment.

7 is a cross-sectional view showing a state in which a plate-shaped object is sucked and held by a contact suction holder of a conveyance device according to a second embodiment.

FIG. 8 is a flowchart showing an example of the operation of the transport device according to the second embodiment.

FIG. 9 is a diagram showing a configuration example of a cutting device according to a third embodiment.

Label description

1-1, 1-2: transfer device (transfer device for plate-like object); 10: holding unit; 11: support base; 11b: lower surface; 12: non-contact adsorption holder; 13: restricting unit; 14: warping detection unit; 15: contact adsorption holder; 16: selection unit; 20: moving unit; 100: cutting device; 110: box loading table; 111: box; 120: chuck table; 130: cutting Unit; 131: cutting blade; 140: cleaning unit; 141: cleaning table; 150: holding hand; 160, 170: carrying unit; W: plate; Wa: upper surface.

Detailed ways

Hereinafter, modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the structural elements described below include those that can be easily conceived by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be appropriately combined. In addition, various omissions, substitutions, or changes in the structure can be made without departing from the gist of the present invention.

[First Embodiment]

FIG. 1 is a diagram showing a configuration example of a transport device according to a first embodiment. 2 is a cross-sectional view showing a state in which a warpage amount of a plate-shaped object is detected by a warpage amount detection unit of the conveyance device according to the first embodiment. 3 is a cross-sectional view showing a state in which a plate-shaped object is sucked and held by the non-contact suction holder of the conveyance device according to the first embodiment.

A conveying device 1 - 1 for a plate-shaped object shown in FIG. 1 (hereinafter simply referred to as "conveying device 1 - 1 ") is used to absorb and hold a plate-shaped object W in a non-contact manner, and to convey the plate-shaped object W. The conveyance device 1 - 1 is configured to include a holding unit 10 , a moving unit 20 , and a control unit 30 as shown in FIG. 1 .

Here, as shown in FIG. 3 , the plate-shaped object W is an object to be transported that is suction-held by the non-contact suction holder 12 described later without being in contact with the non-contact suction holder 12 . The plate-shaped object W is not particularly limited, and for example, a so-called WL-WL in which terminals and wirings constituting a semiconductor element are formed on the upper surface Wa, and a sealing resin for sealing these terminals and wirings is applied to the upper surface Wa. Various electronic components such as CSP (Wafer Level Chip Size Package), semiconductor devices and optical devices formed on the upper surface Wa of semiconductor wafers and optical device wafers, inorganic material substrates, ductile resin material substrates, liquid crystal display devices, etc. And other processing materials. In addition, the plate-like object W is formed in a plate shape that can be conveyed by the conveyance device 1 - 1 , and in the present embodiment, it is formed in a circular flat plate shape, that is, a disc shape. In addition, generally, the WL-CSP warps and bends gradually upward in the vertical direction as it goes from the center to the outer periphery due to the sealing resin coated on the upper surface Wa. That is, the center of the WL-CSP is convexly curved downward in the vertical direction, and the amount of warping gradually increases from the center to the outer periphery.

The holding unit 10 is used to hold the plate W. As shown in FIGS. 1 and 2 , the holding unit 10 has a support base portion 11 , a non-contact suction holder 12 , a restricting unit 13 , and a warpage amount detecting unit 14 .

The support base part 11 is moved by the moving unit 20 . The support base part 11 is connected to the mobile unit 20 . The support base portion 11 is formed in a disk shape parallel to a horizontal plane. An arm 21 , which will be described later, of the moving unit 20 is arranged on the upper surface 11 a in the vertical direction of the support base 11 . On the lower surface 11 b in the vertical direction of the support base portion 11 , a non-contact suction holder 12 , a restricting unit 13 and a warpage amount detecting unit 14 are arranged. As shown in FIG. 2 , the support base portion 11 is formed with a mounting hole 11 c at a position corresponding to the warpage amount detection unit 14 , and a mounting hole 11 d and an insertion hole 11 d are formed at a position corresponding to the non-contact adsorption holder 12 . A hole 11 e is formed with a fitting hole 11 f at a position corresponding to the restricting unit 13 .

The mounting hole 11c is a through hole through which the warpage detection unit 14 is inserted and mounted. The attachment hole 11 c is formed parallel to the vertical direction and penetrates through, and is formed in a size that allows the warpage amount detection unit 14 to pass therethrough. The attachment hole 11c is formed on the inner peripheral side of the insertion hole 11e in the support base portion 11 . Three attachment holes 11 c are formed at equal intervals in the circumferential direction of the support base portion 11 . The attachment hole 11 d is a through hole through which the fixing unit S for fixing the screw member or the like of the non-contact adsorption holder 12 is inserted. The attachment hole 11d is formed parallel to the vertical direction and penetrating, and is formed in such a size that the shaft portion Sa of the fixing unit S can be inserted therethrough and the head portion Sb of the fixing unit S cannot be inserted therethrough. Three mounting holes 11d are formed at equal intervals in the circumferential direction on a concentric circle centering on the insertion hole 11e. That is, the attachment hole 11d is formed around the insertion hole 11e. The insertion hole 11e is a through hole through which an air supply pipe 43 described later is inserted. The insertion hole 11 e is formed parallel to the vertical direction and penetrating, and is formed in a size that allows the air supply pipe 43 to pass therethrough. The insertion hole 11e is formed on the support base portion 11 at a position on the outer peripheral side of the attachment hole 11c. Three insertion holes 11 e are formed at equal intervals in the circumferential direction of the support base portion 11 . In addition, the insertion holes 11e are arranged in phases different from the arrangement of the attachment holes 11c. The fitting hole 11f is a through hole through which a support shaft portion 13c described later of the restricting unit 13 is inserted. The mounting hole 11f is formed parallel to the vertical direction and penetrating, and is formed in a size that allows the insertion of the support shaft portion 13c and prevents the insertion of the later-described flange portion 13b of the restricting unit 13 . The mounting hole 11f is formed on the support base portion 11 at a position closer to the outer peripheral side than the insertion hole 11e. Three mounting holes 11 f are formed at equal intervals in the circumferential direction of the support base portion 11 . In addition, the mounting holes 11f are arranged in phases different from the arrangement of the insertion holes 11e.

The non-contact adsorption holder 12 generates negative pressure by blowing out air, and adsorbs and holds the plate-shaped object W without contacting the upper surface Wa of the plate-shaped object W. The non-contact adsorption holder 12 is a so-called Bernoulli suction cup that adsorbs and holds the plate W by Bernoulli's principle. As shown in FIG. 2 , the non-contact adsorption holder 12 is fixed to the lower surface 11 b of the support base portion 11 by the fixing unit S. As shown in FIG. That is, the non-contact adsorption holder 12 is arranged on the lower surface 11 b of the support base portion 11 . Three non-contact adsorption holders 12 are arranged at equal intervals in the circumferential direction of the support base portion 11 . The non-contact suction holder 12 is formed in a flat cylindrical shape whose height in the vertical direction is smaller than the width in the horizontal direction. The vertical lower end surface (the surface opposite to the lower surface 11 b ) of the non-contact adsorption holder 12 is located below the vertical lower end portion 14 a of the warpage detection unit 14 . Furthermore, the non-contact suction holder 12 integrally has a mounting hole 12a, an air inflow portion 12b, an air flow path 12c, an air ejection port 12d, a guide portion 12e, and an elastic portion 12f.

The mounting hole 12a is a threaded hole that is screwed into the shaft portion Sa of the fixing unit S. As shown in FIG. The mounting hole 12 a is formed on a surface (upper end surface in the vertical direction) opposing the lower surface 11 b of the support base portion 11 . The air inflow part 12b communicates with the air passage part 33a of the air supply pipe 43, and the air supplied from the air supply source 40 shown in FIG. 1 flows in. The air inflow portion 12b is formed on a surface (upper end surface in the vertical direction) opposing the lower surface 11b of the support base portion 11 . The air inflow part 12b is provided in the center part of the upper end surface in a vertical direction. The air flow path 12c communicates with the air inflow portion 12b and the air discharge port 12d. The air ejection port 12d is an ejection port for ejecting the air flowing in from the air inflow portion 12b toward the upper surface Wa of the plate-shaped object W. As shown in FIG. The air ejection port 12d is formed on the surface (lower end surface in the vertical direction) facing the upper surface Wa of the plate-shaped object W. As shown in FIG. The air ejection port 12d is formed in a circular shape when viewed from the vertical direction, and is formed in a diameter as it goes from the air flow path 12c to the lower end surface in the vertical direction, that is, as it goes from the upper side in the vertical direction to the lower end surface. Gradually expand. 12 d of air ejection ports are provided in the center part of the lower end surface in the vertical direction. When the non-contact adsorption holder 12 adsorbs and holds the plate-shaped object W, the air ejection port 12d has a vertical lower end surface formed between the vertical lower end surface and the upper surface Wa as shown in FIG. 3 . The air is ejected radially to the outside (arrow d shown in the figure). As shown in FIG. 2 , the guide portion 12 e guides the air flowing into the air flow path 12 c from the air ejection port 12 d so as to be radially ejected to the outside. The vertical lower end surface of the guide portion 12e is formed flat and parallel to the lower surface 11b of the support base portion 11, and is formed in a disk shape smaller than the air ejection port 12d when viewed in the vertical direction. The lower end surface in the vertical direction of the guide portion 12 e is located above the lower end surface in the vertical direction of the non-contact adsorption holder 12 . The elastic portion 12 f constitutes a lower end surface in the vertical direction of the non-contact adsorption holder 12 . The elastic portion 12f has such elasticity that, for example, at the moment when the non-contact suction holder 12 suction-holds the plate-shaped object W, even if the plate-shaped object W comes into contact with the non-contact suction holder 12, it can suppress the deformation of the plate-shaped object W. Breakage and breakage of devices formed on the upper surface Wa.

The limiting unit 13 is used to limit the horizontal movement of the plate W held on the non-contact suction holder 12 . As shown in FIG. 2 , the restricting unit 13 is arranged on the lower surface 11 b of the support base portion 11 at a position overlapping the outer peripheral region of the plate W when viewed in the vertical direction. That is, the restricting unit 13 is disposed on the outer peripheral region of the plate W on the lower surface 11 b of the supporting base portion 11 . Three restricting units 13 are arranged at equal intervals in the circumferential direction of the support base portion 11 . Here, the outer peripheral region refers to a region including at least the outer periphery of the upper surface Wa of the plate W, and preferably also includes a part radially inner than the outer periphery (for example, a part where no device is formed). Furthermore, the restricting unit 13 has a block portion 13a, a flange portion 13b, and a support shaft portion 13c.

As shown in FIG. 3 , the block portion 13 a is a so-called friction pad that faces the upper surface Wa of the plate W held by the non-contact suction holder 12 and contacts the edge (outer periphery) of the plate W. The vertical lower end surface of the block part 13a is the opposing surface 13d which opposes the upper surface Wa of the plate-shaped object W. As shown in FIG. The opposing surface 13d is an inclined surface whose distance from the lower surface 11b of the support base portion 11 gradually decreases as it goes from the radially outer side of the support base portion 11 to the inside. The opposing surface 13d has a coefficient of friction such that when the plate W is sucked and held by the non-contact suction holder 12, for example, the movement of the plate W in the radial direction can be restricted, and the movement of the plate W in the circumferential direction can be restricted. . As shown in FIGS. 2 and 3 , the flange portion 13 b is larger than the diameter of the fitting hole 11 f of the support base portion 11 when viewed in the vertical direction. The flange portion 13b is integrally formed with the support shaft portion 13c. The flange portion 13b supports the support shaft portion 13c with respect to the support base portion 11 so that the support shaft portion 13c does not come off from the mounting hole 11f. The support shaft portion 13c extends downward in the vertical direction from the flange portion 13b, and is formed in a cylindrical shape smaller than the diameter of the fitting hole 11f. The support shaft portion 13c is inserted through the mounting hole 11f so as to be vertically movable. The block part 13a is inserted and fixed to the lower end part of the vertical direction of the support shaft part 13c. That is, the restriction unit 13 is supported by the support base portion 11 so as to be movable up and down.

The warping amount detection unit 14 is used to detect the warping amount of the plate-shaped object W being conveyed. As shown in FIG. 2 , the warpage detection unit 14 is inserted into the mounting hole 11 c and fixed to the lower surface 11 b of the support base portion 11 . The warping amount detection unit 14 is arranged on the inner side of the non-contact adsorption holder 12 in the radial direction of the support base part 11, and three warp detection units are arranged at equal intervals in the circumferential direction of the support base part 11. Curvature detection unit 14. The warping amount detection units 14 are arranged at equal intervals in the non-contact adsorption holder 12 in the circumferential direction of the support base portion 11 . The vertical lower end portion 14a of the warpage amount detection unit 14 is located above the vertical lower end surface of the non-contact adsorption holder 12 (ie, the lower end portion of the elastic portion 12f). For example, the warping amount detection unit 14 irradiates the upper surface Wa of the plate-shaped object W with a light source such as a laser light source or a SLD (Super Luminescent Diode: Super Luminescent Diode) light source (not shown) from the lower end portion 14a in the vertical direction. The light L is used to measure the distance D between the lower end portion 14a and the upper surface Wa in the vertical direction. The warping amount detection unit 14 is electrically connected to the control unit 30 , and outputs a signal (measurement signal) corresponding to the measured distance D to the control unit 30 . In the present embodiment, the warping amount detection unit 14 determines the distance between the upper surface in the vertical direction and the lower end portion 14a of a mounting table (not shown) on which the plate-shaped object W to be conveyed is placed at a predetermined position (reference In a state where the interval) is a predetermined interval, the interval D (measurement interval) between the upper surface Wa of the plate-shaped object W placed on the upper surface in the vertical direction of the mounting table and the lower end portion 14a is detected.

Here, the amount of warpage refers to the range from the center of the plate W to the outer periphery when the plate W is placed on the upper surface (parallel to the horizontal plane) of the mounting table or the like in the vertical direction. The amount by which the plate W is lifted upward in the vertical direction. The amount of warping exceeding a predetermined amount means the amount of warping that cannot allow the non-contact adsorption holder 12 to adsorb and hold the plate-shaped object W in a non-contact manner. In addition, the predetermined amount of warpage refers to the maximum value of warpage that can allow the non-contact suction holder 12 to suction-hold the plate-shaped object W in a non-contact manner. The reference interval refers to the interval used as a reference for detecting the amount of warpage of the plate-shaped object W, and is when a plate-shaped object W having a predetermined amount of warpage or more is placed on the upper surface of the mounting table in the vertical direction. , it is also possible to detect whether the distance D between the upper surface Wa of the plate-shaped object W and the lower end portion 14a is a predetermined predetermined distance by the warpage detection unit 14 .

As shown in FIG. 1 , the moving unit 20 moves the holding unit 10 from a predetermined position onto the chuck table by moving the holding unit 10 up and down parallel to the vertical direction and swiveling the holding unit 10 in the horizontal plane. Here, the moving unit 20 may complete the previous process (for example, the process of taking out the plate W, the process of detecting the amount of warpage, the process of cutting, the process of grinding, the process of grinding, The plate-shaped object W in the positioning process, etc.) is moved from the area of the previous process to the area where the subsequent process (eg, cleaning process, drying process, plate-shaped object storage process, etc.) is performed. That is, the moving unit 20 moves the plate-shaped object W from the position (carry-in position) where the plate-shaped object W is sucked and held by the holding unit 10 to a target position (carry-out position). In the present embodiment, the moving unit 20 moves the plate-shaped object W whose warpage amount is less than or equal to a predetermined amount after the warpage amount detection step of detecting the warpage amount of the plate-shaped object W from the mounting table (carry-in position). to the move-out position. Furthermore, the moving unit 20 is configured to have an arm portion 21 , a lift portion 22 , and a swivel portion 23 .

The arm portion 21 extends in the horizontal direction from the upper end side in the vertical direction of the elevating portion 22 . One end of the arm portion 21 is integrally provided with a connection portion 21 a attached to the upper surface 11 a of the support base portion 11 . The arm part 21 supports the support base part 11 and is supported by the lift part 22 . The connection part 21a is attached and fixed to the upper surface 11a of the support base part 11. As shown in FIG. The connecting portion 21 a is arranged at the center of the support base portion 11 . The raising and lowering unit 22 is, for example, an air piston or the like capable of moving up and down in the vertical direction (arrow a shown in the figure). An arm portion 21 is provided on the vertically upper end side of the lift portion 22 . The lifting unit 22 lifts up and down in the vertical direction to lift the holding unit 10 up and down. The lifting action of the lifting part 22 is controlled by the control unit 30 . The lifting unit 22 positions the holding unit 10 so that when detecting the warping amount of the plate-shaped object W, the distance between the upper surface in the vertical direction of the mounting table and the lower end portion 14a of the warping amount detecting unit 14 is a predetermined distance (that is, at the position of the reference interval). The swivel part 23 has a rotational drive source such as a motor, etc., and the holding unit 10 is swiveled around the swivel part 23 by rotating the elevating part 22 in the horizontal plane (arrow b shown in the figure). The swivel action of the swivel part 23 is controlled by the control unit 30 .

The control unit 30 is used to control the overall movement of the transport device 1-1. The control unit 30 is conceptually configured to have a warpage amount detection unit 31 and a warpage amount determination unit 32 in terms of functions. The control unit 30 opens the air control valve 42 of the air supply path 41 to supply the air from the air supply source 40 to the air when the warp amount determination unit 32 determines that the warp amount of the plate-shaped object W is equal to or less than a predetermined amount. The supply pipe 43 injects air from the air ejection port 12 d of the non-contact adsorption holder 12 . In addition, the control unit 30 stops processing the plate-shaped object when it is determined by the warpage amount determination unit 32 that the warpage amount of the plate-shaped object W is not less than a predetermined amount, that is, the warpage amount of the plate-shaped object W exceeds a predetermined amount. W's handling.

The warping amount detection unit 31 is used to detect the warping amount of the plate-shaped object W. As shown in FIG. The warping amount detecting unit 31 calculates the distance D (measurement interval) between the upper surface Wa of the plate-shaped object W and the lower end portion 14a of the warping amount detecting unit 14 based on the measurement signal output from the warping amount detecting unit 14 . The warping amount detecting unit 31 subtracts the plate-shaped object placed on the upper surface of the mounting table from the distance (reference distance) between the upper surface of the mounting table in the vertical direction and the lower end portion 14a of the warping amount detecting unit 14. The distance D (measurement interval) between the upper surface Wa of W and the lower end portion 14a and the thickness of the plate W (thickness in the direction perpendicular to the upper surface Wa) measured or input in advance, thereby detecting the warping of the plate W. curvature.

The warp amount determination unit 32 is used to determine whether the warp amount of the plate-shaped object W is equal to or less than a predetermined amount. The warping amount determination unit 32 compares the predetermined amount (predetermined warping amount) of the warping amount of the plate-shaped object W input in advance with the warping amount of the plate-shaped object W detected by the warping amount detecting unit 31 (detected warping amount). amount) to determine whether or not the amount of warpage of the plate-shaped object W is less than a predetermined amount. The warping amount determining unit 32 determines that the warping amount of the plate-shaped object W is not more than the predetermined amount when the detected warping amount is equal to or less than the predetermined warping amount. In addition, the predetermined amount of warpage of the plate-shaped object W may be, for example, a warpage obtained by an experiment using the conveyance device 1-1 or an actual machine, or may be a warpage input by a worker. quantity.

Here, the air supply source 40 is used to supply gas (air) to the non-contact adsorption holder 12 . As shown in FIG. 1 , the air supply source 40 includes an air supply passage 41 for supplying air, an air control valve 42 for controlling the supply amount of air, and an air supply pipe 43 connected to the non-contact adsorption holder 12 . The opening and closing action of the air control valve 42 is controlled by the control unit 30 . The air supply pipe 43 can follow the change of the position of the holding unit 10 when the position of the holding unit 10 is changed by the moving unit 20 , and is a flexible pipe such as a flexible pipe, for example. As shown in FIG. 2 , the air supply pipe 43 communicates the air passage portion 43a and the air inflow portion 12b by screwing the male thread formed on the outer periphery of the front end with the female thread formed in the air inflow portion 12b.

Next, the operation of the conveying device 1-1 configured as above will be described. FIG. 4 is a flowchart showing an example of the operation of the transport device according to the first embodiment. In addition, in the present embodiment, the reference distance between the upper surface in the vertical direction of the mounting table in the previous process and the lower end portion 14a of the warpage detection unit 14 is detected by the warpage detection unit 14 in advance. In addition, in this embodiment, the thickness of the plate-shaped object W is measured in advance, or the thickness of the plate-shaped object W is input by an operator.

The control unit 30 rotates the holding unit 10 through the turning portion 23 and moves the holding unit 10 to a predetermined position (carry-in position) in the previous process, for example, above the mounting table on which the plate-like object W was placed in the previous process. . Here, the holding unit 10 is positioned at a position where the distance between the upper surface of the mounting table and the lower end portion 14a of the warpage detection unit 14 is a reference distance (that is, a predetermined distance) in the vertical direction of the conveyance device 1-1. In addition, in the conveyance device 1 - 1 , the upper surface Wa of the plate-shaped object W faces the lower surface 11 b of the support base portion 11 , and the holding unit 10 overlaps the plate-shaped object W in the vertical direction.

Next, the control unit 30 detects the warpage amount of the plate-shaped object W by the warpage amount detection unit 14 (step S1 ). Here, in the transport device 1-1, three warpage detection units 14 are arranged at equal intervals in the circumferential direction of the support base portion 11, and measurement signals are output from the three warpage detection units 14 to control unit 30. In addition, in the control unit 30, based on the three measurement signals output from the warpage detection unit 14, the warpage detection unit 31 calculates the upper surface Wa of the three plate-shaped objects W and the warpage detection unit 14. The interval D of the lower end portion 14a. In addition, in the control unit 30, the warp amount detection unit 31 subtracts the calculated three intervals D and the measured or input thickness of the plate-shaped object from the previously detected reference interval to detect the plate-shaped object W. The 3 warpage amount (detection warpage amount).

Next, the control unit 30 determines whether or not the amount of warping is equal to or less than a predetermined amount (step S2). Here, the control unit 30 compares the maximum warpage amount among the three detected warpage amounts with a predetermined warpage amount by the warpage amount determination unit 32 .

Next, when the control unit 30 determines that the warpage amount of the plate-shaped object W is equal to or less than a predetermined amount (step S2: Yes), the plate-shaped object W is held by the non-contact suction holder 12 (step S3). Here, the conveying device 1-1 lowers the holding unit 10 through the lifting part 22, the holding unit 10 approaches the upper surface Wa of the plate-shaped object W, and the restricting unit 13 contacts the plate-shaped object W, thereby restricting the movement of the plate-shaped object W in the horizontal direction. move.

Furthermore, the conveyance device 1 - 1 further lowers the holding unit 10 by the elevating unit 22 , and the non-contact adsorption holder 12 approaches the upper surface Wa of the plate W while the restricting unit 13 is in contact with the outer periphery of the plate W. In addition, in the conveyance device 1-1, air is ejected radially from the air ejection port 12d (arrow d shown in FIG. Arrow shown e) Negative pressure. In addition, the conveyance device 1 - 1 pulls the plate W toward the non-contact adsorption holder 12 by the generated negative pressure. In addition, when the plate W is pulled toward the non-contact adsorption holder 12 by negative pressure, due to the air flowing between the lower end surface of the non-contact adsorption holder 12 and the upper surface Wa of the plate W, The air layer acts on the conveyance device 1 - 1 as a reaction force, thereby preventing the non-contact adsorption holder 12 from coming into contact with the upper surface Wa. Therefore, the conveyance device 1 - 1 sucks and holds the plate-shaped object W in a non-contact manner by the non-contact suction holder 12 .

Next, the control unit 30 moves the plate W onto the chuck table. Here, in the conveyance device 1-1, the lifting unit 22 raises the holding unit 10 to raise the plate-shaped object W, and the turning portion 23 turns the holding unit 10 so that the plate-shaped object W moves to the delivery position of the subsequent process. , For example, above the chuck table that holds the plate-shaped object W in a post-process. Moreover, in the conveyance apparatus 1-1, the plate-shaped object W is arrange|positioned facing a chuck table.

Next, the control unit 30 places the plate W on the chuck table. Here, in the transfer device 1 - 1 , the control unit 30 closes the air control valve 42 after the holding unit 10 is lowered by the elevating unit 22 so that the plate-shaped object W contacts the chuck table. In addition, in the conveyance device 1-1, the air supply from the air supply source 40 to the non-contact suction holder 12 is cut off, and the negative pressure below the guide part 12e disappears, and the non-contact suction holder 12 releases the pressure on the plate-shaped suction holder 12. Adsorption and holding of the object W, the plate-shaped object W is placed on the chuck table.

Moreover, when the control unit 30 determines that the amount of warpage of the plate-shaped object W is not equal to or less than a predetermined amount (step S2: No), it stops conveyance (step S4). In addition, in order to distinguish from plate-shaped objects W to be conveyed, plate-shaped objects W whose conveyance by the conveyance device 1 - 1 is suspended are returned to the lower stage side of the cassette by a loading/unloading unit not shown, or are stored in other cassettes.

As described above, according to the conveying device 1-1 of the plate-like object of the first embodiment, the distance D between the upper surface Wa of the plate-shaped object W and the lower end 14a of the warp amount detecting unit 14 is detected by the warpage detection unit 31 (also That is, the amount of warpage of the plate-shaped object), when the warpage amount determination unit 32 determines that the distance D is less than or equal to the predetermined amount, that is, when the warpage of the plate-shaped object is less than the predetermined amount, the The contact suction holder 12 suction-holds and conveys the plate-shaped object W in a non-contact manner. Therefore, according to the conveyance device 1 - 1 of the plate-shaped object of the first embodiment, it is not necessary to try to suction and hold the plate-shaped object W whose warpage exceeds a predetermined amount by the non-contact suction holder 12 . A conveying device 1-1 for running a plate-shaped object. That is, according to the conveying device 1 - 1 of the plate-shaped object of the first embodiment, it is possible to omit the need for absorbing and holding the plate-shaped object W (the plate-shaped object whose warping amount exceeds a predetermined amount) that is not preferable to use the non-contact suction holder 12 . Object W) time to try to carry. Therefore, according to the conveyance apparatus 1-1 of a plate-shaped object which concerns on 1st Embodiment, the effect that the plate-shaped object W can be conveyed efficiently is acquired.

[Second Embodiment]

Next, a conveyance device 1-2 of a plate-like object according to a second embodiment will be described with reference to the drawings. Fig. 5 is a diagram showing a configuration example of a transport device according to a second embodiment. 6 is a cross-sectional view showing a state in which a warpage amount of a plate-shaped object is detected by a warpage amount detection unit of a conveyance device according to a second embodiment. 7 is a cross-sectional view showing a state in which a plate-shaped object is sucked and held by a contact suction holder of a conveyance device according to a second embodiment.

The plate-shaped article conveyance device 1 - 2 of the second embodiment is different from the plate-shaped article conveyance device 1 - 1 of the above-mentioned first embodiment in that, according to the amount of warping of the plate-shaped article W, the selection unit 16 The non-contact suction holder 12 and the contact suction holder 15 are switched. In addition, redundant descriptions of configurations, functions, and effects common to those of the first embodiment described above will be omitted as much as possible (the same applies to other embodiments described below).

The conveying device 1-2 for a plate-like object shown in FIG. 5 (hereinafter simply referred to as "transporting device 1-2") sucks and holds the plate-shaped object W in a non-contact manner when the warpage amount of the plate-shaped object W is less than a predetermined amount. When the warpage of the plate-shaped object W exceeds a predetermined amount, the plate-shaped object W is sucked and held in a contact manner, and the plate-shaped object W is conveyed. The conveyance device 1 - 2 is configured to include a holding unit 10 , a moving unit 20 , and a control unit 30 as shown in FIG. 5 .

As shown in FIGS. 5 and 6 , the holding unit 10 has a support base portion 11, a non-contact suction holder 12, a restriction unit 13, and a warpage detection unit 14, and also has a contact suction holder 15 and a selection unit. 16.

The contact suction holder 15 contacts the upper surface Wa of the plate-shaped object W so as to suction-hold the plate-shaped object W. As shown in FIG. As shown in FIGS. 6 and 7 , the contact suction holder 15 is supported on the lower surface 11 b of the support base portion 11 by the selection unit 16 so as to be movable up and down parallel to the vertical direction. That is, the contact suction holder 15 is arranged on the lower surface 11 b of the support base portion 11 . Three contact suction holders 15 are arranged at equal intervals in the circumferential direction of the support base portion 11 , and are also arranged at equal intervals in the warpage detection unit 14 . In addition, the contact suction holder 15 is arranged on the support base portion 11 at a position closer to the center than the warpage detection unit 14 . That is, the contact suction holder 15 is arranged on the support base portion 11 at a position closer to the center than the non-contact suction holder 12 . The contact suction holder 15 integrally has a suction pad 15a and a connection portion 15b.

The suction pad 15a is formed in a conical trapezoidal shape whose diameter gradually expands downward from above in the vertical direction, that is, a so-called suction cup shape. The connection part 15b is detachably attached to the lower end part in the vertical direction of the shaft part 16d mentioned later of the selection unit 16 in a detachable manner. The connection part 15b communicates with the air passage part 16f mentioned later of the shaft part 16d, and communicates with the suction pad 15a, and also communicates with the air passage part 16f and the suction pad 15a. The coupling portion 15b is larger than the outer diameter of the shaft portion 16d , that is, the diameter of the insertion hole 11g of the support base portion 11 when viewed in the vertical direction. That is, the connection part 15b is formed in the size which cannot be inserted into the insertion hole 11g of the support base part 11. As shown in FIG.

The selection unit 16 supports the contact suction holder 15 on the support base portion 11 so as to be able to move up and down parallel to the vertical direction (that is, to be able to lift up and down). The selection unit 16 positions the contact suction holder 15 vertically above the non-contact suction holder 12 as shown in FIG. position, so that the non-contact adsorption holder 12 is positioned at the action position close to the upper surface Wa of the plate W, and the contact adsorption holder 15 is positioned at a non-contact position away from the upper surface Wa of the plate W. position of action. On the other hand, when the amount of warpage of the plate-shaped object W exceeds a predetermined amount, the selection unit 16 positions the contact suction holder 15 more vertically than the non-contact suction holder 12 as shown in FIG. 7 . direction, so that the contact adsorption holder 15 is positioned at the action position close to the upper surface Wa of the plate W, and the non-contact adsorption holder 12 is positioned away from the upper surface of the plate W. At the non-active position of Wa. That is, the selection unit 16 positions one of the non-contact suction holder 12 and the contact suction holder 15 at an active position close to the plate W, and positions the other at an inactive position away from the plate W. location. The selection unit 16 is configured to have a lift portion 16a and a support portion 16b.

The lift part 16a is supported by the support base part 11 so that it can move up and down parallel to the vertical direction. The elevating portion 16a integrally has a restricting portion 16c extending downward in the vertical direction from the restricting portion 16c, and has an externally threaded shaft portion 16d extending from the restricting portion 16c upward in the vertical direction. The connection part 16e to which the air adsorption piping 53 mentioned later shown in FIG. 5 is connected. In addition, the ascending and descending portion 16a is formed in a cylindrical shape having an air passage portion 16f communicating with the air adsorption passage 51 shown in FIG. 5 . The restricting portion 16c is formed in a hexagonal shape that is larger than the diameter of the insertion hole 11g of the supporting base portion 11 and smaller than the supporting portion 16b when viewed in the vertical direction. The shaft portion 16d is inserted through a later-described insertion hole 16g of the support portion 16b and an insertion hole 11g of the support base portion 11 so as to be movable up and down parallel to the vertical direction. The suction pad 15a is coupled to the lower end portion in the vertical direction of the shaft portion 16d via the coupling portion 15b.

The support portion 16b is formed in an annular shape having an insertion hole 16g penetrating in parallel in the vertical direction. The supporting portion 16b is larger than the hole diameter of the insertion hole 11g of the supporting base portion 11 and larger than the restricting portion 16c when viewed in the vertical direction. The support portion 16b is fixed to the upper surface 11a of the support base portion 11 at a position where the insertion hole 16g communicates with the insertion hole 11g of the support base portion 11 .

Here, the selection unit 16 moves the shaft portion 16d downward in the vertical direction and lowers the suction pad 15a by using, for example, an electromagnet as a driving force and an unillustrated actuator that can expand and contract in the vertical direction. , until the limiting portion 16c abuts against the supporting portion 16b. The telescoping action of the selection unit 16 is controlled by the control unit 30 . The selection unit 16 makes the restricting part 16c dock with the supporting part 16b through the actuator, so as shown in FIG. position of action). In addition, the selection unit 16 moves the shaft portion 16d upward in the vertical direction by the actuator, and raises the suction pad 15a until the connection portion 15b of the contact suction holder 15 abuts against the lower surface 11b of the support base portion 11. . The selection unit 16 makes the connection part 15b of the contact suction holder 15 abut against the lower surface 11b of the support base part 11 through the actuator, so as shown in FIG. position (that is, the contact adsorption holder 15 is positioned in the non-active position). That is, the selection unit 16 positions the contact type adsorption holder 15 at the active position, thereby positions the non-contact type adsorption retainer 12 at the inactive position, and positions the contact type adsorption retainer 15 at the inactive position, Thereby, the non-contact suction holder 12 is positioned at the active position.

The control unit 30 is used to control the overall movement of the conveying device 1-2. The control unit 30 conceptually includes a warpage amount detection unit 31 and a warpage amount determination unit 32 in terms of functions, and further includes a switching unit 33 . The control unit 30 closes the air control valve 47 of the air supply source 40 and opens the air control valve 42 when the warp amount determination unit 32 determines that the warp amount of the plate-shaped object W is equal to or less than a predetermined amount. The air from the air supply source 40 is injected into the air ejection port 12d of the holder 12 . In addition, the control unit 30 shuts off the air supply source 40 when it is determined by the warp amount determination unit 32 that the warp amount of the plate-shaped object W is not less than a predetermined amount, that is, the warp amount of the plate-shaped object W exceeds a predetermined amount. Open the air control valve 42 and open the air control valve 47 to make the negative pressure of the vacuum suction source 50 act on the suction cup 15a.

The switching portion 33 is used to switch the position of the contact suction holder 15 between an active position and a non-active position. The switching unit 33 switches the position of the contact suction holder 15 to the non-operating position through the selection unit 16 when the warping amount of the plate-shaped object W determined by the warping amount judging unit 32 is equal to or less than a predetermined amount (Fig. 6), and when the warpage of the plate W determined by the warpage determination unit 32 exceeds a predetermined amount, the selection unit 16 switches the position of the contact suction holder 15 to the active position. location (the location shown in Figure 7). That is, the switching unit 33 controls the telescopic operation of the selection unit 16 . In addition, in the present embodiment, the warpage amount of the plate-shaped object W exceeding a predetermined amount means that the non-contact adsorption holder 12 cannot allow the warpage amount of the plate-shaped object W to be adsorbed and held in a non-contact manner, and can The warping amount of the plate-shaped object W is allowed to be sucked and held by the contact suction holder 15 in a contact manner.

Here, as shown in FIG. 5 , the air supply source 40 is configured to have an air supply passage 41 , an air control valve 42 , and an air supply pipe 43 , and is configured to further include an air supply passage 44 for supplying air to the vacuum suction source 50 . An air distributor 45 that distributes air to the air supply passages 41 , 44 , an air control valve 46 that controls the air supply amount to the air distributor 45 , and an air control valve 47 that controls the air supply amount to the vacuum suction source 50 . The opening and closing operations of the air control valves 42 , 46 , 47 are controlled by the control unit 30 .

The vacuum suction source 50 is a so-called ejector that generates negative pressure by air supplied from the air supply passage 44 . The vacuum suction source 50 has an air suction passage 51 , a check valve 52 through which air is flowed backward, and an air suction pipe 53 connected to the contact suction holder 15 . The air suction pipe 53 is a flexible pipe like the air supply pipe 43 . The connection part 16e is inserted into the air suction pipe 53, and the outer periphery of the air suction pipe 53 where the connection part 16e is inserted is fastened with a band, so that the air suction channel 51 communicates with the air passage part 16f. That is, the air suction pipe 53 communicates with the suction pad 15a via the connection portion 16e.

Next, the operation of the conveying device 1-2 configured as above will be described. FIG. 8 is a flowchart showing an example of the operation of the transport device according to the second embodiment. Here, in the present embodiment, the plate-shaped object W whose warpage exceeds a predetermined amount is, for example, a plate-shaped object that can be sucked and held by the contact suction holder 15 such as WL-CSP.

The control unit 30 swivels the holding unit 10 through the swivel part 23 , and moves the holding unit 10 above the mounting table on which the plate-like object W was placed in the previous process, for example. Here, the holding unit 10 is positioned at a position where the distance between the upper surface of the mounting table and the lower end portion 14a of the warpage detection unit 14 is a reference distance (that is, a predetermined distance) in the vertical direction of the conveyance device 1-2.

Next, the control unit 30 detects the warpage amount of the plate-shaped object W by the warpage amount detection unit 14 (step S11 ). Next, the control unit 30 determines whether or not the amount of warping is equal to or less than a predetermined amount (step S12). Next, when the control unit 30 determines that the warpage amount of the plate-shaped object W is equal to or less than a predetermined amount (step S12: Yes), as shown in FIG. S13). Next, the control unit 30 holds the plate W by the non-contact suction holder 12 (step S14 ). Next, the control unit 30 moves the plate W to the chuck table, and then places the plate W on the chuck table.

In addition, when the control unit 30 determines that the amount of warping of the plate W is not equal to or less than the predetermined amount (step S12: No), as shown in FIG. ). Next, the control unit 30 holds the plate W by the contact suction holder 15 (step S16). Here, in the conveyance device 1-2, the contact suction holder 15 is provided on the support base portion 11 on the inner side of the non-contact suction holder 12, so the amount of warping of the plate W is smaller than that of the outer periphery. The inner peripheral side of the side is adsorbed and held by the suction pad 15a.

Next, the control unit 30 places the plate-shaped object W on the chuck table after moving the plate-shaped object W to the chuck table. Here, the transfer device 1 - 2 closes the air control valve 47 by the control unit 30 after the lifting unit 22 lowers the holding unit 10 so that the plate-shaped object W contacts the chuck table. In addition, in the transport device 1-2, the air supply from the air supply source 40 to the vacuum suction source 50 is cut off, the negative pressure acting on the contact suction holder 15 disappears, and the contact suction holder 15 releases the pressure on the plate-shaped object. W is adsorbed and held, and the plate-shaped object W is placed on the chuck table.

As above, according to the conveying device 1-2 of the plate-shaped object of the second embodiment, the flat plate-shaped objects (the plate-shaped objects with the amount of warping less than a predetermined amount (for example, general semiconductor wafers, etc.) in each cassette are alternately conveyed. )) and bent plates (plates whose warpage exceeds the specified amount (such as WL-CSP, etc.)), or when the two kinds of plates are mixed in the same box, the plate W The position of the contact suction holder 15 is switched between the active position and the non-active position by the selection unit 16, so that the plate-shaped object W can be conveyed without stagnation. Therefore, according to the conveyance apparatus 1-2 of a plate-shaped object which concerns on 2nd Embodiment, efficient conveyance of the plate-shaped object W can be realized, and it can cope with a wide variety of plate-shaped objects W.

In addition, according to the conveying device 1 - 2 of the plate-like object of the second embodiment, the selection unit 16 can switch between suction and holding by the non-contact suction holder 12 and suction and holding by the contact suction holder 15 . That is, according to the conveying device 1-2 of the plate-like object of the second embodiment, it is possible to switch the non-contact suction holder 12 and the contact suction holder 15 without performing an operation (replacement operation). Type adsorption holder 12 and contact type adsorption holder 15. Therefore, according to the conveyance apparatus 1 - 2 of the plate-shaped object of 2nd Embodiment, the efficiency at the time of exchanging (that is, switching) the non-contact type adsorption|suction holder 12 and the contact type adsorption|suction holder 15 can be improved.

[Third embodiment]

Next, a cutting device 100 according to a third embodiment will be described with reference to the drawings. FIG. 9 is a diagram showing a configuration example of a cutting device according to a third embodiment.

The cutting device 100 is a device for cutting a plate-shaped object W. As shown in FIG. As shown in FIG. 9 , cutting device 100 is configured to include cartridge mounting table 110 , chuck table 120 , cutting unit 130 , cleaning unit 140 , holding hand 150 , first conveying unit 160 , and second conveying unit 170 .

The cassette mounting table 110 is used to mount a cassette 111 for accommodating a plurality of plate-shaped objects. The cassette mounting table 110 is a so-called cassette lifter that supports the cassette 111 on the apparatus main body 101 so as to be vertically movable.

The chuck table 120 holds the plate W using the holding surface 120a. The chuck table 120 is supported on the X-axis moving base 121 . The holding surface 120a is an upper end surface in the vertical direction of the chuck table 120, and is formed flat with respect to the horizontal plane. The holding surface 120a communicates with an unillustrated vacuum suction source, and sucks and holds the plate-shaped object by the negative pressure of the vacuum suction source. The X-axis moving base 121 can relatively move in the X-axis direction (corresponding to the machining feed direction) with respect to the apparatus main body 101 by being configured as an X-axis moving unit including a pulse motor, a ball screw, and the like.

The cutting unit 130 cuts the plate W held on the chuck table 120 using the cutting blade 131 . The cutting unit 130 has a cutting blade 131 , a spindle 132 and a housing 133 . The cutting blade 131 is a circular cutting grindstone formed in an extremely thin disk shape. The main shaft 132 is detachably attached to the cutting blade 131 . The casing 133 has a driving source such as a motor, and supports the main shaft 132 so as to be rotatable around a rotation axis in the Y-axis direction. The casing 133 is supported by a Y-axis movement base 134 and a Z-axis movement base 135 . The Y-axis moving base 134 can relatively move in the Y-axis direction (with respect to the index feed direction) with respect to the apparatus main body 101 by being configured as a Y-axis moving unit including a pulse motor, a ball screw, and the like. The Y-axis movement base 134 is supported on the door-shaped support base 102 erected from the apparatus main body 101 , and supports the Z-axis movement base 135 . The Z-axis moving base 135 can move relative to the apparatus body 101 in the Z-axis direction (corresponding to the cutting feed direction) by being configured as a Z-axis moving unit including a pulse motor, a ball screw, and the like. The Z-axis moving base 135 is supported on the Y-axis moving base 134 , which supports the housing 133 .

The cleaning unit 140 holds and cleans the plate-shaped object W cut by the cutting unit 130 using the cleaning table 141 . The cleaning unit 140 has a cleaning table 141 that absorbs and holds the plate-shaped object W similarly to the chuck table 120, sprays cleaning water such as pure water on the plate-shaped object W during cleaning, and sprays air or the like on the plate-shaped object W during drying. unillustrated spray nozzles.

The holding hand 150 carries the plate W into and out of the cassette 111 placed on the cassette mounting table 110 . The holding hand 150 supports the lower surface Wb of the plate W so that the plate W is held. The holding hand 150 transfers the (exported) plate W pulled out from the box 111 to the first conveying unit 160, and picks up the plate W (cleaned and dried plate W) from the second conveying unit 170, and It is accommodated (carried in) in the box 111 .

The first conveying unit 160 constitutes a conveying unit that conveys the plate-shaped object W together with the second conveying unit 170 in the cutting device 100, and it works (cooperates) with the second conveying unit 170, so that 120 and the cleaning table 141 is a conveying device for conveying the plate-shaped object W. In this embodiment, the first transport unit 160 absorbs and holds the plate-shaped object W picked up from the holding hand 150 and transports it to the holding surface 120 a of the chuck table 120 . The first conveyance unit 160 is a conveyance device for a plate-shaped object including a holding unit 161 for holding the plate-shaped object W and a moving unit 162 for moving the holding unit 161 . That is, the first conveyance unit 160 is a conveyance device configured similarly to the conveyance device 1 - 1 of the first embodiment or the conveyance device 1 - 2 of the second embodiment.

The holding unit 161 is a holding unit configured similarly to the holding unit 10 of the conveyance device 1 - 1 of the first embodiment or the holding unit 10 of the conveyance device 1 - 2 of the second embodiment. When the holding unit 161 has the same configuration as the holding unit 10 of the conveying device 1-1 of the first embodiment, it includes the support base portion 11, the non-contact suction holder 12, the restricting unit 13, and the warpage detection unit 14, On the other hand, when configured in the same manner as the conveyance device 1 - 2 of the second embodiment, a contact suction holder 15 and a selection unit 16 are further provided. The holding unit 161 detects the lower end portion 14 a of the warping amount detecting unit 14 and the upper surface Wa of the plate W on the plate W pulled out from the cassette 111 and held on the holding hand 150 using the warpage detection unit 14 . The interval D. The moving unit 162 has a driving source such as a motor (not shown), and moves the holding unit 161 relative to the device main body 101 in the Y-axis direction and the Z-axis direction. The moving unit 162 is supported on a support base 103 standing upright from the device main body 101 , which supports the holding unit 161 . The moving unit 162 has an arm portion 162 a connected to the holding unit 161 . The arm portion 162 a extends vertically downward from the moving unit 162 . A connecting portion 21a attached to the upper surface 11a of the support base portion 11 is integrally provided at the lower end in the vertical direction of the arm portion 162a (see FIG. 1 or FIG. 5 ).

The second conveying unit 170 constitutes a conveying unit for conveying the plate-shaped object W together with the first conveying unit 160 in the cutting device 100, and it works (cooperates) with the first conveying unit 160 so that the holding hand 150 and the chuck table 120 and the cleaning table 141 is a conveying device for conveying the plate-shaped object W. In this embodiment, the second transfer unit 170 absorbs and holds the cut plate-shaped object W from the chuck table 120 and transports it to the cleaning table 141 , and absorbs and holds the cleaned and dried plate from the cleaning table 141 . The object W is transported to the holding hand 150. The second conveyance unit 170 is a conveyance device for a plate-shaped object including a holding unit 171 for holding the plate-shaped object W and a moving unit 172 for moving the holding unit 171 . That is, the second conveyance unit 170 is a conveyance device configured similarly to the conveyance device 1 - 1 of the first embodiment or the conveyance device 1 - 2 of the second embodiment.

The holding unit 171 is a holding unit configured similarly to the holding unit 10 of the conveying device 1 - 1 of the first embodiment or the holding unit 10 of the conveying device 1 - 2 of the second embodiment. When the holding unit 171 has the same configuration as the holding unit 10 of the transport device 1-1 of the first embodiment, it includes the support base portion 11, the non-contact suction holder 12, the limiting unit 13, and the warpage detection unit 14, On the other hand, when configured in the same manner as the conveyance device 1 - 2 of the second embodiment, the contact suction holder 15 and the selection unit 16 are further provided. The moving unit 172 has a driving source such as a motor (not shown), and moves the holding unit 171 relative to the apparatus main body 101 in the Y-axis direction and the Z-axis direction. The moving unit 172 is supported on the supporting base 103 , which supports the holding unit 171 . The moving unit 172 has an arm portion 172 a connected to the holding unit 171 . The arm portion 172a extends vertically downward from the moving unit 172 . A connecting portion 21a attached to the upper surface 11a of the support base portion 11 is integrally provided at the lower end in the vertical direction of the arm portion 172a (see FIG. 1 or FIG. 5 ). In addition, in the present embodiment, the holding unit 171 transports the flattened plate-shaped object W (for example, a plate-shaped object W whose warpage amount is less than or equal to a predetermined amount) cut by the cutting unit 130 , so warpage detection can be provided as necessary. Unit 14.

Next, the operation of the cutting device 100 configured as above will be described. In addition, in the present embodiment, the reference distance between the holding hand 150 and the warpage detection unit 14 is detected in advance by the warpage detection unit 14, and the thickness of the plate-shaped object W accommodated in the box 111 is measured, or the thickness of the plate-shaped object W stored in the box 111 is measured. The person inputs the thickness of the sheet W. In addition, in the present embodiment, the plate-shaped object W whose warpage exceeds a predetermined amount is, for example, a plate-shaped object that can be sucked and held by the contact-type suction holder 15 such as WL-CSP.

The cutting device 100 pulls out the plate-like object W from the cassette 111 by the holding hand 150 according to, for example, an operator's instruction input for cutting processing, and transfers it to the first conveying unit 160 . Here, in the cutting device 100, the distance D between the lower end portion 14a of the warpage detection unit 14 and the upper surface Wa of the plate-shaped object W is detected by the warpage amount detection unit 14. If the warpage amount of the plate-shaped object W The non-contact adsorption holder 12 absorbs and holds the plate W below a predetermined amount, and the contact type adsorption holder 15 absorbs and holds the plate W if the warpage of the plate W exceeds a predetermined amount.

In the cutting device 100 , the plate-shaped object W is placed on the chuck table 120 after the plate-shaped object W is conveyed to the chuck table 120 by the first conveying unit 160 . Here, the cutting device 100 suction-holds the plate-shaped object W on the chuck table 120 via the holding surface 120a.

The cutting device 100 jets cutting water to the cutting blade 131 , and cuts the cutting blade 131 into a predetermined cutting portion on the plate-shaped object W adsorbed and held on the chuck table 120 to perform cutting.

The cutting device 100 absorbs and holds the cut plate W from the chuck table 120 by the second conveying unit 170 , and after transporting the plate W to the cleaning station 141 , places the plate W on the cleaning table 141 . On stage 141. Here, in the cutting device 100 , if the plate-shaped object W that has been cut and flattened has weight and can contact the upper surface Wa, the plate-shaped object W is sucked and held by the contact suction holder 15 .

The cleaning unit 140 absorbs and holds the plate-shaped object W by the cleaning table 141 and rotates it at a high speed. After cleaning the plate-shaped object W by spraying washing water, it dries the plate-shaped object W by spraying air and stops the cleaning table. 141 spins.

The cutting device 100 absorbs and holds the cleaned and dried plate-shaped object W from the cleaning table 141 through the second conveying unit 170 , and transfers the plate-shaped object W to the holding hand 150 after conveying the plate-shaped object W to the holding hand 150 .

The cutting device 100 uses the holding hand 150 to store the transferred plate-shaped object W in the box 111, and ends the processing operation on the plate-shaped object W.

As described above, according to the cutting device 100 of the third embodiment, in addition to the effects of the conveying device 1 - 1 of the first embodiment and the effect of the conveying device 1 - 2 of the second embodiment, the first conveying unit 160 can Since the plate-shaped objects W with different warpage amounts are conveyed with the second conveying unit 170 , when the plate-shaped objects W with different warpage amounts are mixed, the effect of cutting the plate-shaped objects W can be obtained.

In addition, in the above-mentioned first and second embodiments, as a reference for detecting the amount of warpage of the plate-shaped object W, the distance between the upper surface in the vertical direction of the mounting table and the lower end portion 14a of the warpage amount detection unit 14 is set as a reference. The distance between them is used as a reference distance, but it is not limited to this, and for example, other conveyance units, boxes, etc. may be used as a reference structure.

In addition, in the above-mentioned second embodiment, the position of the contact suction holder 15 is positioned at the active position and the non-active position by the actuator of the selection unit 16, but an external thread may be formed on the outer periphery of the shaft portion 16d, An internal thread screwed with an external thread is formed in the insertion hole 16g, and the selector unit 16 is rotated around the vertical axis of the shaft portion 16d to position the contact adsorption holder 15 at the active position and the non-active position. In this case, the air adsorption duct 51 preferably has a rotation mechanism that follows the rotation of the shaft portion 16d so as not to be twisted as the shaft portion 16d rotates.

In addition, in the above-mentioned second and third embodiments, when the amount of warping of the plate-shaped object W exceeds a predetermined amount, the plate-shaped object W is sucked and held by the contact suction holder 15 and transported. When the amount of warping of the plate-shaped object W is allowed to be sucked and held by the contact suction holder 15, the conveyance of the plate-shaped object W may be stopped. In this case, it is preferable to return the plate-shaped object W whose warpage exceeds a predetermined amount to the lower stage of the box or store it in another box so that it can be easily distinguished from other plate-shaped objects W.

In addition, in the above-mentioned third embodiment, when the warping amount of the plate-shaped object W exceeds a predetermined amount, the plate-shaped object W is sucked and held by the contact suction holder 15 and transported, but for example, it is also possible to use The cutting process of the plate-shaped object W due to the amount of warpage of the cutting process by the cutting unit 130 is stopped. In this case, the cutting device 100 can be efficiently operated by stopping the unfavorable cutting process.

In addition, in the above-mentioned third embodiment, the processing device having the conveying device (conveying device 1-1 or 1-2) of the plate-shaped object is the cutting device 100 for performing cutting processing on the upper surface Wa of the plate-shaped object W, however Not limited thereto, for example, a so-called edge trimming slicer that cuts the edge (peripheral edge) of the plate W may be used, or may be configured to perform edge trimming by the cutting device 100 .

In addition, in the above-mentioned first to third embodiments 3, the warping of the plate-shaped object W is directed toward the outer peripheral side from the center side and the warpage is convex upward in the vertical direction, and for example, it may be from the The outer peripheral side is warped toward the center side and protrudes upward in the vertical direction.

In addition, in the above-mentioned first to third embodiments, the three warpage detection units 14 are arranged in the circumferential direction of the support base part 11, and as long as the detection means can detect the upper surface Wa of the plate-shaped object W in the circumferential direction It is not limited to the above-mentioned cases. For example, one warpage detection unit 14 may be provided on the support base part 11, and the support base part 11 may be rotated around the axis in the vertical direction, and The amount of warping of the plate W is detected. In this case, the amount of warpage in the circumferential direction of the upper surface Wa of the plate-shaped object W can be continuously detected. In addition, the warpage amount detection unit 14 may be provided on the outer peripheral side of the non-contact suction holder 12 . In this case, the amount of warping can be measured for the vicinity of the outer periphery of the plate-shaped object W having a large amount of warping.

Claims (3)

1. A conveying device for a plate-shaped object, the conveying device having: a holding unit for holding a plate-shaped object; and a moving unit for moving the holding unit from a predetermined position to a chuck table, wherein, The holding unit has: a support base portion coupled to the mobile unit; A non-contact adsorption holder is arranged on the lower surface of the support base, blows out air to generate a negative pressure, and the non-contact adsorption holder acts on the upper surface of the plate in a non-contact manner. Carry out adsorption and retention; a restricting unit disposed on the outer peripheral region of the plate on the lower surface of the support base portion, and restricts the horizontal movement of the plate held on the non-contact adsorption holder; as well as a warpage detection unit that detects the warpage of the conveyed plate, When the amount of warpage of the plate-shaped object is less than or equal to a predetermined amount, the conveying device absorbs and conveys the plate-shaped object by the non-contact adsorption holder. 2. The conveying device for a plate-shaped object according to claim 1, wherein: The holding unit also has: a contact-type adsorption holder, which is arranged on the lower surface of the support base part, and contacts the upper surface of the plate-shaped object to absorb and hold the plate-shaped object; and a selection unit that positions one of the contact suction holder and the non-contact suction holder at an active position close to the plate, and positions the other at an inactive position away from the plate . 3. A cutting device comprising: a chuck table for holding a plate; and a cutting unit for cutting the plate held on the chuck table with a cutting blade, wherein, The cutting device also has: a box loading table, which places a box containing a plurality of plate-shaped objects; a cleaning unit, which holds and cleans the plate-shaped objects after being cut by the cleaning table; the cassette on the cassette mounting table carries out loading and unloading of the plate-shaped object; and a conveying unit that conveys the plate-shaped object between the holding hand, the chuck table, and the cleaning table, The conveying unit is a conveying device for a plate-like object according to claim 1 or 2.