CN104975236A - Metal net and method for manufacturing metal net - Google Patents

Abstract

The present invention relates to a metal mesh, which comprises a substrate, and the substrate comprises at least 30% to 80% by weight of iron; 5% to 30% by weight of chromium; 2% to 8% by weight of nickel; 0.5% to 2% by weight of manganese; and 3% to 50% by weight of platinum. The thickness of the substrate is 0.1 to 5 microns, and the surface of the substrate comprises a plurality of pores, the pore diameters of the pores are 5 to 200 nanometers, and platinum is exposed on the pore walls of the pores. The present invention also relates to a method for manufacturing a metal mesh. The metal mesh of the present invention has both the corrosion resistance and oxidation resistance of stainless steel and good electrical conductivity.

Description

Metal mesh and method for manufacturing metal mesh

technical field

The invention relates to a metal mesh and a manufacturing method thereof, in particular to a metal mesh with nanoscale pores and a manufacturing method thereof.

Background technique

Metallurgy is a science that uses processing methods to make metal materials with certain properties. Metallurgy has a long history and has continued all the way to modern times. Extracting alloy materials with corrosion resistance, oxidation resistance and excellent electrical conductivity is an important research topic in modern industrial engineering.

Stainless steel in the alloy material can achieve the ability of anti-corrosion and anti-oxidation, but the conductivity of stainless steel is usually not as high as that of copper, aluminum and other metal materials. However, although metal materials such as copper and aluminum with good electrical conductivity are easy to obtain, they are also easy to oxidize. If gold or silver is used as a conductor, the cost is too high and it is not economical.

Contents of the invention

One aspect of the present disclosure is to provide a metal mesh, which has the ability of stainless steel to resist corrosion and oxidation, and has good electrical conductivity.

According to an embodiment of the present disclosure, a method for manufacturing a metal mesh includes the following steps: (a) providing a first alloy, the first alloy includes 60% to 80% by weight of iron, and 10% by weight ~30% chromium, 4%-8% by weight nickel, and 1%-2% by weight manganese; (b) providing platinum metal; (c) melting the platinum metal with the first alloy at a first temperature , and uniformly mix platinum metal with the first alloy to form a second alloy, wherein the second alloy contains 3% to 50% by weight of platinum; (d) dropping the second alloy from the first temperature to the second temperature (e) repeatedly applying the first pressure to the second alloy at the second temperature; (f) raising the temperature of the second alloy from the second temperature to a third temperature, the third temperature being between the second temperature and the first temperature , and maintained for a predetermined time; (h) cooling the second alloy from the third temperature to the second temperature, and repeatedly applying the first pressure to the second alloy; (i) repeating step (f) and step (h) in sequence A predetermined number of times, until the second alloy is thinned to a thickness of 0.5 cm by the first pressure applied repeatedly; (j) repeatedly applying the second pressure to the second alloy using a calender, followed by step (f); (k) The second alloy is cooled from a third temperature to a second temperature; and (1) repeating steps (j), (f) and (k) in sequence for a second predetermined number of times until the second alloy has a thickness of 0.1 microns to 5 microns, And the surface of the second alloy has pores with a diameter between 5 nanometers and 200 nanometers.

According to another embodiment of the present disclosure, there is provided a metal mesh, which includes a base material, and the base material includes at least 30% to 80% by weight of iron; 5% to 30% by weight of chromium; 2% to 8% nickel; 0.5% to 2% manganese by weight; and 3% to 50% platinum by weight. Wherein, the thickness of the substrate is 0.1-5 microns, and the surface of the substrate contains a plurality of pores with a diameter of 5-200 nanometers, wherein platinum is exposed on the walls of the pores.

To sum up, the metal mesh disclosed above is an alloy formed of stainless steel and platinum. The metal mesh made by the manufacturing method of the above embodiment may have a plurality of nanoscale pores on the surface, so that electron flow can flow in these The flow in the nanoscale pores can increase the conductivity of the metal mesh. Moreover, the metal mesh in the above embodiment also maintains the properties of anti-corrosion and anti-oxidation of stainless steel.

Description of drawings

In order to make the disclosure and its advantages more obvious and understandable, the descriptions of the accompanying drawings refer to the following:

FIG. 1 is a cross-sectional view of a metal mesh illustrating an embodiment of the present disclosure;

FIG. 2 is a front view illustrating a metal mesh according to an embodiment of the present disclosure;

3 is a cross-sectional view of a metal mesh illustrating another embodiment of the present disclosure;

4 is a flowchart illustrating a method of manufacturing a metal mesh according to an embodiment of the present disclosure;

Among them, the symbol description

10, 20: Metal mesh 100: Substrate

101, 201: Pore 102: Pore wall

103, 203: Surface 110: Iron

120: Chromium 130: Nickel

140: Manganese 150: Platinum

250: platinum metal layer L: thickness

W1, W2: Aperture S101～S112: Step process.

Detailed ways

A number of embodiments of the present invention will be disclosed in the following figures. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some known and commonly used structures and elements will be shown in a simple and schematic way in the drawings.

As used herein, "about," "approximately," or "approximately" is used to modify any quantity that may vary slightly, but which does not alter its essence. Unless otherwise specified in the embodiments, it means that the error range of the numerical value modified by "about", "approximately" or "approximately" is generally allowed within 20%, preferably within 10%. Within, and more preferably within five percent.

Among alloy materials, the selection of alloy, the way of processing and forming, and the application of heat treatment can determine the strength, ductility, electrical conductivity, toughness, hardness or corrosion resistance of the alloy itself. For example, the bonding ability between different metals in the alloy may affect the toughness of the alloy itself. The stronger the bonding ability, the lower the toughness. Therefore, it is sometimes necessary to use heat treatment in a timely manner to break the excessively strong bond between the metals. of bonding force. Heat treatment can include techniques such as annealing, precipitation hardening, quenching and tempering, which can adjust the ductility and toughness of the metal itself, and is a common step in the manufacturing process of modern alloy materials. The metal mesh and the manufacturing method of the metal mesh proposed in this disclosure may be creations of technical ideas utilizing the above natural laws. In the present disclosure, a stainless steel metal mesh with high electrical conductivity, corrosion resistance, oxidation resistance and good toughness can be forged by selecting appropriate alloy materials and metal materials, uniformly melted and mixed, and then heat treated.

Please refer to FIG. 1 to FIG. 2 first. FIG. 1 is a cross-sectional view of a metal mesh according to an embodiment of the disclosure, and FIG. 2 is an enlarged front view of a metal mesh according to an embodiment of the disclosure. As shown, the metal mesh 10 includes a substrate 100 . The base material 100 contains 30%-80% by weight of iron 110, 5%-30% by weight of chromium 120, 2%-8% by weight of nickel 130, 0.5%-2% by weight of Manganese 140 and platinum 150 with a weight percentage of 3% to 50%. It should be noted that the patterns marked by the symbols in the drawings do not represent the real arrangement or positional relationship of iron 110, chromium 120, nickel 130, manganese 140 and platinum 150, and these metal particles are invisible to the naked eye in actual conditions , the patterns indicated by the symbols in the figure are only roughly depicting the quantitative ratio relationship among iron 110 , chromium 120 , nickel 130 , manganese 140 and platinum 150 .

It is worth mentioning that, in this embodiment, the thickness L of the base material 100 of the metal mesh 10 may be 0.1-5 microns. If the thickness L of the substrate 100 is less than 0.1 μm, the substrate 100 is more likely to be damaged by unexpected external force, such as being scratched. If the thickness of the substrate 100 is greater than 5 microns, the elasticity is poor. In a preferred embodiment, the thickness L of the base material 100 of the metal mesh 10 may be 5 microns to maintain better elasticity and toughness.

Please refer to FIG. 1 and FIG. 2 together. In this embodiment, the surface 103 of the substrate 100 includes a plurality of pores 101, and the diameter W1 of the pores 101 can be from 5 nanometers to 200 nanometers. is exposed platinum 150. In other words, if the pores 101 are viewed from the front surface 103 of the substrate 100 , it can be seen that the metal platinum 150 protrudes from the pore walls 102 . In a preferred embodiment, the diameter W1 of the pores 101 can be 30 nm to 50 nm, and the substrate 100 can contain platinum 150 with a weight percentage of 3% to 4%, and the opening of the aperture W1 can be roughly square. , and the four corners are arc-shaped. In this way, the metal mesh 10 of this embodiment can make the base material 101 a good conductor due to the plurality of pores 101 on the surface 103 of the base material 100 . In a specific application, the base material 100 can be made by melting stainless steel and platinum 150, wherein the type of the stainless steel can be ST304 or ST516, but not limited thereto.

Next, please refer to FIG. 3 , which is a cross-sectional view of a metal mesh according to another embodiment of the disclosure. As shown in the figure, the metal mesh 20 of this embodiment can be directly stretched to thin the stainless steel substrate 200 to a thickness of about 5 μm, so that a plurality of pores 201 appear on the surface 203 of the stainless steel substrate 200 . In this embodiment, the average diameter W2 of the pores 201 is greater than 50 nanometers. Next, a platinum metal layer 250 is electroplated on the surface 203 of the substrate 200 . The conductivity of the original stainless steel substrate 200 is increased.

Next, please refer to FIG. 4 , which is a flowchart illustrating a method for manufacturing a metal mesh according to an embodiment of the present disclosure. As shown in the figure, first, step S101 is performed to provide a first alloy. The first alloy contains 60%-80% by weight of iron, 10%-30% by weight of chromium, 4%-8% by weight of nickel and 1%-2% by weight of manganese. In some embodiments, the first alloy may be stainless steel, but not limited thereto. In a specific application, the first alloy may be stainless steel of type ST340 or ST516, but not limited thereto.

Next, step S102 is performed to provide platinum metal. In one embodiment, platinum metal can be obtained by chemical refining. Next, in step S103 , the temperature is raised to a first temperature to melt the first alloy and metal platinum. And proceed to step S104, uniformly mixing the first alloy and metallic platinum to form a second alloy. In one embodiment, the first temperature is between 10,000 degrees and 20,000 degrees. At this temperature, both the first alloy and platinum are liquefied by high heat, and at this time, the first alloy and platinum can be uniformly mixed. In some embodiments, the second alloy may contain 3%-50% platinum. In a preferred embodiment, the second alloy contains 3%-4% platinum by weight.

Next, step S105 is performed to drop the second alloy from the first temperature to the second temperature. In one embodiment, the second alloy can be slowly lowered from the first temperature to the second temperature through an annealing process, so that various metals in the second alloy can recrystallize and grow. In one embodiment, the second temperature may be about 200-800 degrees. In a specific application, the more precise temperature range will vary with the metal composition in the second alloy. The range of the second temperature is mainly to allow the second alloy to have better ductility and toughness, so that the second alloy can be subjected to other cold working.

Next, step S106 is performed, repeatedly applying the first pressure to the second alloy at the second temperature. In one embodiment, the method of applying the second pressure may be machine beating, but not limited thereto. In specific applications, the method of applying the second pressure can also be replaced by manual tapping. The main purpose of applying the second pressure to the second alloy is to thin the second alloy. The thinning process should not be too hasty. If the second alloy is found to be thinning under visual conditions, step S108 is to be performed, and the first The two alloys are heated from the second temperature to the third temperature and maintained for a predetermined time. In one embodiment, the third temperature is between the second temperature and the first temperature. More specifically, the third temperature is about 900-1200 degrees. In practical application, the tempering procedure can be used to raise the temperature of the second alloy from the second temperature to the third temperature for 1-2 hours. The main purpose of tempering is to further stabilize the shape and size of the second alloy after thinning, and to rearrange the destroyed metal crystals.

Next, step S109 is performed to lower the temperature of the second alloy from the third temperature to the second temperature, and step S106 is performed to repeatedly apply the first pressure to the second alloy so that the second alloy can be further thinned. In this embodiment, steps S108 , S109 , and S106 need to be repeated sequentially, and after step S106 is performed, step S107 can be performed first to determine whether the second alloy has been thinned to a thickness of 0.5 cm. If the second alloy has not been thinned to a thickness of 0.5 cm, steps S108 , S109 and S106 need to be repeated. In a specific application, the first predetermined number of repetitions of steps S108 , S109 and S106 may be approximately 20-27 times. When the second alloy has been thinned to a thickness of 0.5 cm, step S110 may be performed, and a calender is used to repeatedly apply a second pressure to the second alloy.

The purpose of performing step S110 is to further thin the second alloy to a thickness below 5 microns. Therefore, after step S110 is performed, step S111 may be performed first to determine whether the second alloy is pressed to a thickness of 0.1-5 microns. If the second alloy has not been pressed to a thickness of 0.1-5 microns, step S108 and step S109 are performed in sequence. That is, in a specific embodiment, heat treatment procedures of tempering and annealing are required. And, steps S110 , S108 and S109 are repeated, so that the second alloy may be below the target thickness of at least 5 micrometers. Wherein, in an embodiment, the second predetermined number of repetitions may be approximately between 3 and 8 times. In other words, in one embodiment, the total contract between the first predetermined number of times and the second predetermined number of times is between 25-35 times. That is to say, in one embodiment, the second alloy needs to be annealed and tempered a total of 25-35 times. In a preferred embodiment, the second alloy is annealed and tempered about 30 times.

After step S111 is completed, if it is determined that the second alloy is pressed to a thickness of 1-5 microns, step S112 may be performed to determine whether the surface of the second alloy has pores with a diameter between 5 nanometers and 200 nanometers. If the second alloy has pores between 5 nanometers and 200 nanometers, the process of metal mesh can be ended; if the second alloy does not have pores between 5 nanometers and 200 nanometers, then return to step S108, and then proceed to step S109 and step S110 , so that the metal mesh can reach the expected nano-scale pores to complete the production of the metal mesh. In a preferred embodiment, the surface of the second alloy can have pores with a diameter of 30-50 nanometers, and under the SEM electron microscope, it can be observed that platinum is exposed on the pore walls of the pores. Good electrical conductivity.

In summary, the metal mesh formed by the above process can have the ability of stainless steel to resist corrosion and oxidation, and because the surface of the stainless steel metal mesh has multiple nanoscale pores, electrons can flow through these pores. Circulation can increase the conductivity of the metal mesh itself.

Although the present invention has been disclosed above in terms of implementation, it is not intended to limit the present invention. Any skilled person can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection shall prevail as defined by the appended claims.

Claims (10)

1. a manufacture method for wire netting, comprises following steps:

A () provides the first alloy, this first alloy comprise weight percent be 60% ~ 80% iron, weight percent be 10% ~ 30% chromium, weight percent be 4% ~ 8% nickel and weight percent be the manganese of 1% ~ 2%;

B () provides platinum;

C () be this platinum of melting and this first alloy at a first temperature, and this platinum of Homogeneous phase mixing and this first alloy, to form the second alloy, wherein comprise the platinum that weight percent is 3% ~ 50% in this second alloy;

D this second alloy is dropped to the second temperature from the first temperature by ();

E () repeats applying first pressure at the second temperature in this second alloy;

F (), by this second alloy from the second temperature to the 3rd temperature, the 3rd temperature between the second temperature and the first temperature, and maintains a scheduled time;

H this second alloy from the 3rd greenhouse cooling to the second temperature, and is repeated applying first pressure in this second alloy by ();

I () be repeating step (f) and step (h) first pre-determined number sequentially, until the first pressure that this second alloy is repeatedly applied is thinned to the thickness of 0.5 centimetre;

J () utilizes rolling press to repeat applying second pressure in this second alloy, then carry out step (f);

(k) by this second alloy from the 3rd greenhouse cooling to this second temperature; And

L () be repeating step (j), (f) and (k) second pre-determined number sequentially, until this second alloy has the thickness of 0.1 micron to 5 microns, and the surface of this second alloy has aperture is hole between 5 nanometers to 200 nanometers.

2. the manufacture method of wire netting as claimed in claim 1, wherein the summation of this first pre-determined number and this second pre-determined number is 25 ~ 35 times.

3. the manufacture method of wire netting as claimed in claim 2, wherein this first temperature is between 10,000 degree to 20,000 degree.

4. the manufacture method of wire netting as claimed in claim 3, wherein this second temperature is 200 ~ 800 degree.

5. the manufacture method of wire netting as claimed in claim 4, wherein the 3rd temperature is 900 ~ 1200 degree.

6. the manufacture method of wire netting as claimed in claim 1, wherein comprises the platinum that weight percent is 3% ~ 4% in this second alloy.

7. the manufacture method of wire netting as claimed in claim 1, wherein the surface of this second alloy has the hole that aperture is 30 ~ 50 nanometers.

8. a wire netting, comprises a base material, and this base material at least comprises:

Weight percent is the iron of 30% ~ 80%;

Weight percent is the chromium of 5% ~ 30%;

Weight percent is the nickel of 2% ~ 8%;

Weight percent is the manganese of 0.5% ~ 2%; And

Weight percent is the platinum of 3% ~ 50%;

Wherein, the thickness of this base material is 0.1 ~ 5 micron, and the surface of this base material includes multiple hole, and the aperture of those holes is 5 ~ 200 nanometers, and the hole wall of wherein this hole exposes platinum.

9. wire netting as claimed in claim 8, the aperture of wherein said hole is 30 ~ 50 nanometers, and the thickness of this base material is 5 microns.

10. wire netting as claimed in claim 9, wherein comprises the platinum that weight percent is 3% ~ 4% in this base material.