CN104971916A - Cleaning apparatus and cleaning method - Google Patents
Cleaning apparatus and cleaning method Download PDFInfo
- Publication number
- CN104971916A CN104971916A CN201510151490.XA CN201510151490A CN104971916A CN 104971916 A CN104971916 A CN 104971916A CN 201510151490 A CN201510151490 A CN 201510151490A CN 104971916 A CN104971916 A CN 104971916A
- Authority
- CN
- China
- Prior art keywords
- substrate
- cleaning
- nozzle
- cleaning fluid
- described substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 752
- 238000000034 method Methods 0.000 title claims description 15
- 239000000758 substrate Substances 0.000 claims abstract description 638
- 239000012530 fluid Substances 0.000 claims abstract description 297
- 238000007599 discharging Methods 0.000 claims abstract description 17
- 239000007788 liquid Substances 0.000 claims description 169
- 238000005096 rolling process Methods 0.000 claims description 148
- 239000007921 spray Substances 0.000 claims description 75
- 238000005507 spraying Methods 0.000 claims description 61
- 238000011144 upstream manufacturing Methods 0.000 claims description 37
- 230000007246 mechanism Effects 0.000 claims description 30
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 abstract description 8
- 238000011010 flushing procedure Methods 0.000 description 145
- 238000002347 injection Methods 0.000 description 16
- 239000007924 injection Substances 0.000 description 16
- 239000002245 particle Substances 0.000 description 16
- 238000000227 grinding Methods 0.000 description 13
- 238000001035 drying Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 12
- 229910021642 ultra pure water Inorganic materials 0.000 description 10
- 239000012498 ultrapure water Substances 0.000 description 10
- 230000001680 brushing effect Effects 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 101000873785 Homo sapiens mRNA-decapping enzyme 1A Proteins 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 102100035856 mRNA-decapping enzyme 1A Human genes 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 241000220317 Rosa Species 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 150000007530 organic bases Chemical class 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000010148 water-pollination Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention provides a cleaning apparatus which provides a surface of a substrate, such as rotary semiconductor wafer and the like, with cleaning solution, and simutaneously cleans the substrate. A cleaning degree is enhanced by the flowing of the cleaning solution in the whole radius of the substrate. The cleaning apparatus includes: a plurality of main shafts (51), which holds the substrate (W) and rotates the substrate (W) by utilizing a centre shaft of the substrate (W) as a rotating shaft; a single tube nozzle (41) for discharging cleaning solution (L) towards to the upper surface of the substrate (W), wherein, the single tube nozzle (41) enables the cleaning solution (L) to fall down near to the centre (O) of the substrate (W), the fell cleaning solution (L) is discharged from the upper surface of the substrate (W) to the centre of the substrate (W) in a mode of flowing. The solution fluid, fell on the upper surface of the substrate (W), of the cleaning solution (L) discharged from the single tube nozzle (41) passes through the centre (O) of the substrate (W).
Description
Technical field
The present invention relates to while the surface to substrates such as the semiconductor wafers rotated provides cleaning fluid while clean cleaning device and the cleaning method of substrate.
Background technology
In the manufacture process of the substrates such as semiconductor wafer, comprising the grinding step that the film of the metal be formed on substrate etc. is ground, after this grinding step, carrying out the cleaning for removing the finely ground particles as lapping rejects.Such as, inlay (damascene) that form wiring being formed at the wiring groove in the dielectric film of substrate surface with metal landfill connects up in formation process, is removed the unnecessary metal of substrate surface after forming mosaic wiring by cmp (CMP:Chemical MechanicalPolishing).On substrate surface after cmp, owing to there is the particle (defect (defect)) of the residue (slurry residues) of the slurry that CMP uses and metal grinding bits etc., thus need by cleaning removing they.
If the cleaning due to substrate surface is insufficient and remained residue thing at substrate surface, then can produces from the part remaining residue thing of substrate surface and reveal (leak), the reason etc. that becomes close property bad becomes problem in reliability.Therefore, the substrate surface exposing metal film, barrier film and dielectric film etc. with higher cleaning degree cleaning is needed.In recent years, becoming more meticulous along with semiconductor devices, the diameter of the particle that should remove diminishes, so also become strict to the requirement of cleaning.
As the cleaning way after the grinding in CMP device, there will be a known employ rolling cleaning part cleaning, employ the cleaning of the form of a stroke or a combination of strokes (pencil) cleaning part, employ the cleaning etc. of two-fluid spray nozzle.In these cleanings, substrate is rotated around its central shaft, provide liquid and flushing liquor (below, liquid and flushing (rinse) liquid to be called with being all together " cleaning fluid " to the surface (upper surface) of substrate simultaneously.)。In addition, in these cleanings, after carrying out the cleaning (liquid cleaning) making rolling cleaning part, form of a stroke or a combination of strokes cleaning part, two-fluid spray nozzle play a role and carry out, at least provide flushing liquor as cleaning fluid, carry out the cleaning (rinsing cleaning) carried out under not making rolling cleaning part, form of a stroke or a combination of strokes cleaning part, two-fluid spray nozzle play a role.
As the method surface of substrate being provided to cleaning fluid, there will be a known from single pipe nozzle discharge cleaning fluid and make cleaning fluid land in substrate surface method, from atomizing nozzle spray vaporific cleaning fluid and make cleaning fluid land in substrate surface method, discharge cleaning fluid from antipriming pipe nozzle (rod (bar) formula nozzle) and make cleaning fluid land in the method etc. of substrate surface.The cleaning fluid being provided to the surface of substrate is subject to rotating produced centrifugal force by substrate, and flows towards the periphery of substrate.In addition, the flowing of the cleaning fluid of land after substrate is not only by the impact of this centrifugal force, and the impact of cleaning fluid to the direction parallel with the surface of substrate when flowing in the surface of substrate by its inertia flowed before the surperficial land of substrate, when the surface of substrate tilts, by the impact of gravity, in addition, the contact angle on the surface of cleaning fluid and substrate also becomes the key factor of the flowing determining cleaning fluid.
When be liquid clean or rinse clean irrelevant, when a part for substrate has the position of the less position of the flowing of cleaning fluid or cleaning fluid precipitation, the particles such as slurry residues and/or metal grinding bits etc. are residual in the portion, thus cleaning becomes insufficient.Therefore, wish that cleaning fluid flows equably at the whole radius of substrate.
In addition, as prior art related to the present invention, there is following prior art document.
Prior art document
Patent document
Patent document 1 Japan Patent No. 4007766 publication
Patent document 2 Japanese Unexamined Patent Publication 11-47665 publication
Summary of the invention
Along with becoming more meticulous of semiconductor devices in recent years, the requirement of the cleaning degree in cleaning device is also uprised.But in existing cleaning device, the removing of small particle (such as, the particle of below 65nm) is extremely difficult.Especially, when the diameter of substrate is the 300mm to 450mm in the future of present main flow, insufficient cleaning such in a part for substrate becomes remarkable.
By making the substrate of horizontal horizontal rotate, substrate surface is carried out rinsing the situation of cleaning and the problem being not easy to remove finely ground particles is described as an example.In the flushing cleaning removing residual particles and residual liquor, discharge flushing liquor from single pipe nozzle when adopting and make flushing liquor land make in the method for substrate surface the flushing liquor land of discharging from single pipe nozzle when the immediate vicinity of substrate, obtain higher cleaning degree at immediate vicinity, but particle remains in the outside of the immediate vicinity of substrate.On the other hand, when the flushing liquor land making to discharge from single pipe nozzle are at a half of substrate radius, although obtain higher cleaning degree at landing positions, particle remains in the position beyond it.That is, when using single pipe nozzle to provide flushing liquor, although carry out flushing cleaning well at the periphery of landing positions, the developing result of stretching to other positions on substrate based on liquid is less.
In addition, when the flushing liquor of discharging from single pipe nozzle with high angle land in substrate surface time, when substrate surface is the surface of thin copper film or low-k film such fragility, be subject to the land of the flushing liquor because discharging from single pipe nozzle and the damage caused, defect is produced at landing positions (such as, immediate vicinity).
On the other hand, atomizing nozzle above outside substrate sprays vaporific cleaning fluid and makes cleaning fluid land in the method for substrate surface or/and discharge flushing liquor from antipriming pipe nozzle (bar type nozzle) and make flushing liquor land in the method for substrate surface, owing to being the discharge carried out based on horizontal rotating mechanism, so discharged particle and/or the residual liquor of removing towards substrate periphery by centrifugal force, but because land region is broader in the scope from center to periphery, so hinder the particle of removing or/and the movement towards periphery produced based on centrifugal force of residual liquor at the flushing liquor of these land region land, and push back to the inside.
In addition, at central part, because cleaning fluid is promptly moved to periphery by centrifugal force, so compared with the region that cleaning fluid is stretched by rotating beyond immediate vicinity, flush efficiency step-down.And, about the region land based on atomizing nozzle or antipriming pipe nozzle, before land, the quantitative change of the air that flushing liquor contacts is many, improve and be originally provided to the oxygen concentration of the flushing liquor (such as, ultra-pure water) in CMP device (such as with lower oxygen concentration (such as ,≤10ppb) from factory, 4.0ppm=4000ppb), the oxidations such as the copper on the surface of substrate are caused.
Above problem is not limited to the flushing cleaning illustrated in above-mentioned example, also can produce equally in liquid cleaning.
The present invention completes in view of the above problems, its object is to, while provide cleaning fluid while clean in the cleaning device of substrate to the surface of the substrates such as the semiconductor wafer rotated, by making cleaning fluid flow in the whole radius of substrate, cleaning degree is improved.
Cleaning device of the present invention has following structure: have: keep substrate and the substrate rotation mechanism making the central shaft of above-mentioned substrate make above-mentioned substrate as rotating shaft to rotate; Upper surface towards the above-mentioned substrate being held in above-mentioned substrate rotation mechanism discharges the 1st single pipe nozzle of the 1st cleaning fluid, above-mentioned 1st single pipe nozzle with above-mentioned 1st cleaning fluid land in the center of above-mentioned substrate nearby, above-mentioned 1st cleaning fluid of land discharges above-mentioned 1st cleaning fluid at the upper surface of above-mentioned substrate towards the mode of the center flow of above-mentioned substrate, and the above-mentioned 1st cleaning fluid liquid of the upper surface falling behind in above-mentioned substrate of discharging from above-mentioned 1st single pipe nozzle flows through the center of above-mentioned substrate.By this structure, due to the central part at substrate, by from the 1st single pipe nozzle discharge cleaning fluid at the inertia force with the flowing on substrate level direction, cleaning fluid is flowed, in the outside of the central part of substrate, by the centrifugal force of the rotation based on substrate, cleaning fluid cleaning fluid flowed, so can be made in the whole radius flowing of substrate towards the periphery of substrate.
In above-mentioned cleaning device, Ke Yishi, the discharge direction of above-mentioned 1st single pipe nozzle is less than 45 degree relative to the incidence angle of the upper surface of above-mentioned substrate.By this structure, can obtain fully from the 1st single pipe nozzle discharge cleaning fluid at the inertia force with the flowing substrate level direction.
In above-mentioned cleaning device, Ke Yishi, from above-mentioned 1st cleaning fluid to the landing positions of above-mentioned substrate to the distance at the center of above-mentioned substrate than radius 1/3rd little of above-mentioned substrate.By this structure, the liquid stream of the upper surface of the substrate after land can reliably by the center of substrate.
In above-mentioned cleaning device, can be, also have towards the atomizing nozzle of upper surface spraying the 2nd cleaning fluid of the above-mentioned substrate being held in above-mentioned substrate rotation mechanism, the spraying of the discharge based on above-mentioned 1st cleaning fluid of above-mentioned 1st single pipe nozzle and above-mentioned 2nd cleaning fluid based on above-mentioned atomizing nozzle can be carried out simultaneously.By this structure, cleaning fluid can be made more reliably in the whole radius flowing of substrate.
In above-mentioned cleaning device, Ke Yishi, the landing positions of above-mentioned 2nd cleaning fluid is positioned at the upstream side of the direction of rotation of above-mentioned substrate compared with the landing positions of above-mentioned 1st cleaning fluid.By this structure, landing positions based on the cleaning fluid of atomizing nozzle is positioned at the downstream of the 1st cleaning fluid at the center that have passed substrate, 1st cleaning fluid is discharged by the periphery of centrifugal force from substrate, in the position that the 1st cleaning fluid tails off, can provide the 2nd cleaning fluid by atomizing nozzle.
In above-mentioned cleaning device, Ke Yishi, in above-mentioned atomizing nozzle, spray amount is the center of the maximum maximum direction of spray amount close above-mentioned substrate from spraying off-centring.By this structure, more 2nd cleaning fluid can be provided by atomizing nozzle to the position near substrate center.
In above-mentioned cleaning device, Ke Yishi, above-mentioned atomizing nozzle is at above-mentioned 2nd cleaning fluid of the roughly length range internal spraying of the radius of above-mentioned substrate, and the maximum direction of above-mentioned spray amount can towards the center of above-mentioned substrate or immediate vicinity.By this structure, prevent or reduce following situation: the flowing of the 2nd cleaning fluid towards the center of substrate based on spraying is collided towards the flowing of the periphery of substrate based on centrifugal force with central part the 2nd cleaning fluid at substrate, cause the 2nd cleaning fluid to precipitate such situation at the central part of substrate, thus the 2nd cleaning fluid is from the central part Zhou Liudong toward the outside of substrate.
In above-mentioned cleaning device, can be, also there is the 2nd single pipe nozzle of discharging the 3rd cleaning fluid towards the upper surface of the above-mentioned substrate being held in above-mentioned substrate rotation mechanism, above-mentioned 2nd single pipe nozzle can exceed the center land of above-mentioned substrate with above-mentioned 3rd cleaning fluid, and discharge above-mentioned 3rd cleaning fluid from landing positions towards the mode of the periphery of above-mentioned substrate flowing, large to the distance at the center of above-mentioned substrate from the landing positions of above-mentioned 1st cleaning fluid to the distance ratio at the center of above-mentioned substrate from the landing positions of above-mentioned 3rd cleaning fluid, the landing positions of above-mentioned 3rd cleaning fluid also can be positioned at the downstream of the direction of rotation of above-mentioned substrate from the landing positions of above-mentioned 1st cleaning fluid.By this structure, not hinder the mode of the flowing on the surface of the substrate of the 1st cleaning fluid, the 3rd cleaning fluid can be provided with the 2nd single pipe nozzle on substrate.
Can be, above-mentioned cleaning device also has and linearly extends in the roughly length range of the diameter of above-mentioned substrate, while around the central shaft rotation parallel with above-mentioned substrate while the rolling cleaning part contacted with the upper surface slide of above-mentioned substrate, can be that above-mentioned 1st single pipe nozzle makes above-mentioned 1st cleaning fluid land be involved in side region in the rolling of above-mentioned rolling cleaning part.By this structure, can make to flow at the whole radius of substrate at the cleaning fluid needed in cleaning that rolls.
In above-mentioned cleaning device, Ke Yishi, the discharge direction of above-mentioned 1st single pipe nozzle and the bearing of trend angulation of above-mentioned rolling cleaning part are 90 degree ± 30 degree under overlooking.By this structure, the 1st cleaning fluid to enter under rolling cleaning part and enters to roll releases side region, is rotated and is provided to reverse cleaning region, so can improve the cleaning based on cleaning fluid oppositely providing region by substrate.
Can be that above-mentioned cleaning device also has the nozzle that the surface of above-mentioned rolling cleaning part releasing side region to the rolling being positioned at above-mentioned rolling cleaning part directly provides the 4th cleaning fluid.By this structure, because the 4th cleaning fluid is directly provided to rolling cleaning part, so rolling cleaning part slides in cleaning area and substrate with the state of impregnation the 4th cleaning fluid, the cleaning based on cleaning fluid can be improved.
Can be, above-mentioned cleaning device also has form of a stroke or a combination of strokes cleaning part, it is supported on the leading section of arm, around the central shaft rotation with above-mentioned substrate transverse and by the rotation of said arm from the center of above-mentioned substrate to peripheral extent, while contact while mobile with the upper surface slide of above-mentioned substrate, can be that above-mentioned 1st single pipe nozzle makes above-mentioned 1st cleaning fluid land in the upstream side of the direction of rotation of the above-mentioned substrate compared with the motion track of above-mentioned form of a stroke or a combination of strokes cleaning part.By this structure, the cleaning fluid needed in form of a stroke or a combination of strokes cleaning can be made to flow at the whole radius of substrate.
Can be that above-mentioned cleaning device also has: form of a stroke or a combination of strokes cleaning part or double-fluid spraying nozzle, it be supported on the leading section of arm, by the rotation of said arm from the center of above-mentioned substrate to peripheral extent in move; On arm, cleaning fluid provides nozzle, and it is located in said arm, and the upper surface to above-mentioned substrate near above-mentioned form of a stroke or a combination of strokes cleaning part or above-mentioned double-fluid spraying nozzle provides cleaning fluid.By this structure, fresh cleaning fluid can be provided to cleaning position.
In above-mentioned cleaning device, Ke Yishi, in said arm, cleaning fluid provides nozzle to provide the mode of cleaning fluid to tilt towards the cleaning position of the above-mentioned substrate based on above-mentioned form of a stroke or a combination of strokes cleaning part or above-mentioned double-fluid spraying nozzle.By this structure, cleaning fluid to the direction flowing towards cleaning position, can provide cleaning fluid to cleaning position.
In above-mentioned cleaning device, Ke Yishi, when the leading section of said arm is supported with above-mentioned form of a stroke or a combination of strokes cleaning part, in said arm, cleaning fluid provides nozzle to be located at the upstream side of the direction of rotation of above-mentioned substrate relative to above-mentioned form of a stroke or a combination of strokes cleaning part.By this structure, the cleaning fluid being provided to the upper surface of substrate is transferred by the rotation of substrate, is provided to the cleaning position that substrate and form of a stroke or a combination of strokes cleaning part slidingly contact.
In above-mentioned cleaning device, Ke Yishi, when the leading section of said arm is supported with above-mentioned double-fluid spraying nozzle, in said arm, cleaning fluid provides nozzle to be located at the downstream of the direction of rotation of above-mentioned substrate relative to above-mentioned double-fluid spraying nozzle.By this structure, owing to being provided to the rotation of cleaning fluid by substrate of the upper surface of substrate, to from the cleaning position of colliding from the injection stream of double-fluid spraying nozzle and the upper surface of substrate away from direction carry, so cleaning fluid does not form thicker layer in cleaning position, the reduction of the cleaning force based on bed course effect can be reduced.
In above-mentioned cleaning device, Ke Yishi, in said arm, cleaning fluid provides nozzle to be located at the position at the center near above-mentioned substrate compared with the cleaning position of the above-mentioned substrate based on above-mentioned form of a stroke or a combination of strokes cleaning part or above-mentioned double-fluid spraying nozzle.By this structure, the cleaning fluid that cleaning fluid provides nozzle to provide from arm, by the centrifugal force based on the rotation of substrate, after near cleaning position or cleaning position, swimmingly towards the flows outside of the radial direction of substrate, is discharged from the outer rim of substrate.
The cleaning device of alternate manner of the present invention has following structure: have: substrate rotation mechanism, and it keeps substrate and is made as rotating shaft by the central shaft of above-mentioned substrate above-mentioned substrate rotate; Atomizing nozzle, its upper surface towards the above-mentioned substrate being held in above-mentioned substrate rotation mechanism is fan sprayed the 2nd cleaning fluid, and in above-mentioned atomizing nozzle, spray amount becomes the maximum maximum direction of spray amount from spraying off-centring near the center of above-mentioned substrate.By this structure, more 2nd cleaning fluid can be provided to the position at the center near substrate by atomizing nozzle, in the outside compared with the central part of substrate, the 2nd cleaning fluid by the centrifugal force of substrate, the 2nd cleaning fluid flowed towards the periphery of substrate, so can flow from the central part of substrate to peripheral part.
The cleaning device of another mode of the present invention has following structure: have: substrate rotation mechanism, and it keeps substrate and is made as rotating shaft by the central shaft of above-mentioned substrate above-mentioned substrate rotate; 1st single pipe nozzle, its upper surface towards the above-mentioned substrate being held in above-mentioned substrate rotation mechanism discharges the 1st cleaning fluid; Atomizing nozzle, it is towards upper surface spraying the 2nd cleaning fluid of above-mentioned substrate being held in above-mentioned substrate rotation mechanism, carries out the spraying of discharge based on above-mentioned 1st cleaning fluid of above-mentioned 1st single pipe nozzle and above-mentioned 2nd cleaning fluid based on above-mentioned atomizing nozzle simultaneously.By this structure, owing to carrying out the discharge based on the cleaning fluid of single pipe nozzle and the spraying based on the cleaning fluid of atomizing nozzle simultaneously, so the mobility of the cleaning fluid of the whole radius at substrate can be improved, higher cleaning degree can be realized.
Cleaning method of the present invention is made by the central shaft of substrate above-mentioned substrate rotate, upper surface towards above-mentioned substrate discharges the cleaning method of the 1st cleaning fluid, there is following formation: in the center of above-mentioned substrate nearby, the liquid of the upper surface of the above-mentioned substrate after land flows through the center of above-mentioned substrate to above-mentioned 1st cleaning fluid land.By this formation, in the central part of substrate, cleaning fluid is flowed at the inertia force with the flowing substrate level direction by the cleaning fluid from the 1st single pipe nozzle discharge, in the outside of the central part of substrate, cleaning fluid by based on the centrifugal force of the rotation of substrate, flow in the periphery towards substrate, so cleaning fluid can be made to flow at the whole radius of substrate.
Invention effect
According to the present invention, at the central part of substrate, by from the 1st single pipe nozzle discharge cleaning fluid at the inertia force with the flowing on substrate level direction, cleaning fluid is flowed, in the outside of the central part of substrate, cleaning fluid by the centrifugal force of the rotation based on substrate, cleaning fluid flowed towards the periphery of substrate, so can be made in the whole radius flowing of substrate.
Accompanying drawing explanation
Fig. 1 is the top view that the entirety of the lining processor representing the cleaning device had in embodiments of the present invention is formed.
(a) of Fig. 2 is the top view of the position relationship representing substrate in the cleaning device of the 1st embodiment of the present invention and single pipe nozzle, and (b) of Fig. 2 is the front view of Fig. 2 (a).
(a) of Fig. 3 is the top view of the position relationship representing substrate in the cleaning device of the 2nd embodiment of the present invention and single pipe nozzle and atomizing nozzle, and (b) of Fig. 3 is the front view of Fig. 3 (a).
(a) of Fig. 4 is the top view of the position relationship representing substrate in the cleaning device of the 3rd embodiment of the present invention and two single pipe nozzle, and (b) of Fig. 4 is the front view of Fig. 4 (a).
Fig. 5 is the enlarged drawing of the immediate vicinity of substrate in Fig. 4 (a).
(a) of Fig. 6 is the top view of the position relationship representing substrate in the cleaning device of the 4th embodiment of the present invention and atomizing nozzle, and (b) of Fig. 6 is the front view of Fig. 6 (a).
Fig. 7 is the figure representing the position of the flushing liquor of fan stretching in atomizing nozzle and the relation of flow.
Fig. 8 is the top view of the position relationship of substrate in the cleaning device of the variation representing the 4th embodiment of the present invention and atomizing nozzle.
Fig. 9 is the stereogram of the summary of the rolling cleaning device represented in embodiments of the present invention.
Figure 10 is the top view of the cleaning device in the 5th embodiment of the present invention.
Figure 11 is the top view for illustration of the regional on substrate.
Figure 12 is the top view of existing rolling cleaning device.
Figure 13 is the A-A ' sectional view of Figure 12.
Figure 14 is the partial enlarged drawing of Figure 13.
Figure 15 is the B-B ' sectional view of Figure 12.
Figure 16 is the top view of the cleaning device represented in the 6th embodiment of the present invention.
(a) of Figure 17 represents the top view from the variation of liquid on the surface of substrate W of single pipe nozzle 63 discharge in the 6th embodiment of the present invention, and (b) of Figure 17 is the front view of Figure 17 (a).
Figure 18 is the top view of the rolling cleaning device in the 7th embodiment of the present invention.
Figure 19 is the A-A ' sectional view of Figure 18.
Figure 20 is the partial enlarged drawing of Figure 19.
Figure 21 is the B-B ' sectional view of Figure 18.
Figure 22 is the top view of the rolling cleaning device in the 7th embodiment of the present invention.
Figure 23 is the A-A ' sectional view of Figure 22.
Figure 24 is the stereogram of the summary of the form of a stroke or a combination of strokes cleaning device represented in embodiments of the present invention.
Figure 25 is the top view of the cleaning device in the 9th embodiment of the present invention.
Figure 26 is the top view of the cleaning device in the 10th embodiment of the present invention.
Figure 27 is the top view of the cleaning device in the 11st embodiment of the present invention.
Figure 28 is the figure of the length direction of the arm of the cleaning device observed from the side in the 11st embodiment of the present invention.
Figure 29 is the figure in the land region of the spraying based on atomizing nozzle represented in the 11st embodiment of the present invention.
Figure 30 is the top view of the cleaning device in the 12nd embodiment of the present invention.
Figure 31 is the partial enlarged drawing of the cleaning device in the 12nd embodiment of the present invention.
Figure 32 is the figure of the length direction of the arm of the cleaning device observed from the side in the 12nd embodiment of the present invention.
Figure 33 is the top view of the cleaning device in the variation of the 12nd embodiment of the present invention.
Figure 34 is the top view of the cleaning device in the 13rd embodiment of the present invention.
Figure 35 is the partial enlarged drawing of the cleaning device in the 13rd embodiment of the present invention.
Figure 36 is the figure of the length direction of the arm of the cleaning device observed from the side in the 13rd embodiment of the present invention.
Figure 37 is the top view of the cleaning device in the variation of the 13rd embodiment of the present invention.
Figure 38 is the top view of the cleaning device in the 14th embodiment of the present invention.
Figure 39 is the top view of the cleaning device in the variation of the 14th embodiment of the present invention.
Figure 40 is the side view of the cleaning device in the 15th embodiment of the present invention.
Figure 41 is the stereogram of the cleaning device of the 16th embodiment of the present invention.
Detailed description of the invention
Below, about the cleaning device of embodiments of the present invention, be described with reference to accompanying drawing.In addition, the embodiment below illustrated represents the example implementing situation of the present invention, does not limit the invention to the concrete structure of following explanation.When implementing of the present invention, the concrete structure corresponding to embodiment suitably can be adopted.
Fig. 1 is the integrally-built top view of the lining processor representing the cleaning device had in embodiments of the present invention.As shown in Figure 1, lining processor has: substantially rectangular housing 10; With mounting for storing the load port 12 of the cassette of substrates of the substrates such as multiple semiconductor wafers.Load port 12 and housing 10 are adjacent to configure.Opening box, SMIF (Standard Manufacturing Interface: SMIF) box or FOUP (Front Opening Unified Pod: front end open-type wafer transmits box) can be carried in load port 12.Cassette of substrates is accommodated in inside and covers with dividing plate and can keep the closed container with space outerpace mutually independently environment by SMIF box, FOUP.
Be accommodated with in the inside of housing 10: multiple (in this example being four) grinding unit 14a ~ 14d; The 1st cleaning unit 16 that substrate after grinding is cleaned and the 2nd cleaning unit 18; With the drying unit 20 making the substrate drying after cleaning.Grinding unit 14a ~ 14d arranges along the length direction of lining processor, and cleaning unit 16,18 and drying unit 20 also arrange along the length direction of lining processor.
Being loaded mouth 12, being positioned at the region that the grinding unit 14a of this load port 12 side and drying unit 20 surround and being configured with the 1st conveying mechanical arm 22, be configured with supply unit 24 abreast with grinding unit 14a ~ 14d.Substrate before 1st conveying mechanical arm 22 receives grinding from load port 12 is also handed off to supply unit 24, and the dried substrate that conveying receives from drying unit 20, and between each grinding unit 14a ~ 14d, carry out the handing-over of substrate.
Between the 1st cleaning unit 16 and the 2nd cleaning unit 18, be configured with the 2nd conveying mechanical arm 26 carrying out the handing-over of substrate between these the 1st cleaning unit 16 and the 2nd cleaning units 18, between the 2nd cleaning unit 18 and drying unit 20, be configured with the 3rd supply unit 28 carrying out the handing-over of substrate between these the 2nd cleaning unit 18 and drying unit 20.And, the control part 30 of the action of each machine controlling lining processor is configured with in the inside of housing 10.
In this embodiment, use rolling cleaning device as the 1st cleaning unit 16, it is under the existence of cleaning fluid, the rolling cleaning part that linearly extends and substrate contact is made in the roughly length range of the diameter of substrate, while around the central shaft rotation parallel with substrate while carry out brushing (scrub) cleaning to substrate surface, use form of a stroke or a combination of strokes cleaning device as the 2nd cleaning unit 18, it is under the existence of cleaning fluid, make lower end contact surface and the substrate contact of the columned form of a stroke or a combination of strokes cleaning part extended along vertical, make the rotation of form of a stroke or a combination of strokes cleaning part while carry out brushing cleaning towards single-way moving to substrate surface.In addition, use and rotate (spin) drying unit as drying unit 20, it, towards along the substrate horizontally rotated, sprays IPA steam from the atomizing nozzle of movement and makes substrate dry, and then making substrate with High Rotation Speed, making substrate dry by centrifugal force.
In addition, in this embodiment, use rolling cleaning device as the 1st cleaning unit 16, the form of a stroke or a combination of strokes cleaning device identical with the 2nd cleaning unit 18 also can be used as the 1st cleaning unit 16, or use the two-fluid cleaning system being cleaned substrate surface by two-fluid injection (jet).In addition, in this embodiment, although employ form of a stroke or a combination of strokes cleaning device as the 2nd cleaning unit 18, the rolling cleaning device identical with the 1st cleaning unit 16 also can be used as the 2nd cleaning unit 18, or use spray by two-fluid the two-fluid cleaning system cleaning substrate surface.The cleaning device of embodiments of the present invention can either be used for the 1st cleaning unit 16, the 2nd cleaning unit 18, also can be used in rolling cleaning device, form of a stroke or a combination of strokes cleaning device, two-fluid cleaning system.
Below, the embodiment as cleaning device of the present invention illustrates concrete application examples.First, as the 1st embodiment ~ the 4th embodiment, illustrate in the 1st cleaning unit 16 or the 2nd cleaning unit 18 flushing cleaning in of the present invention be suitable for.When rinsing cleaning, because the form of a stroke or a combination of strokes cleaning part in the rolling cleaning part in the 1st cleaning unit 16 and the 2nd cleaning unit is not had an effect, so be completely removed from the top of substrate.This is that particle in order to avoid being attached to the parts such as rolling cleaning part and form of a stroke or a combination of strokes cleaning part and liquid are fallen on substrate when rinsing cleaning and polluted substrate.
Substrate W is using surface as upper and be held in not shown substrate rotation mechanism.When substrate rotation mechanism keeps substrate W and rotates, its central shaft (by center O and the axle vertical with the surface of substrate W) rotates as rotating shaft by substrate W.
(the 1st embodiment)
(a) of Fig. 2 is the top view of the position relationship representing substrate in the cleaning device of the 1st embodiment and single pipe nozzle, and (b) of Fig. 2 is the front view of Fig. 2 (a).(a) and (b) of Fig. 2 represents that the cleaning fluid to horizontal substrate surface based on single pipe nozzle provides.There is provided the single pipe nozzle 41 of nozzle above substrate W as cleaning fluid, discharge flushing liquor L from the outside of the upper space of substrate W towards the surface (upper surface) of substrate W.That is, the surface of single pipe nozzle 41 couples of substrate W provides flushing liquor L from oblique upper.Flushing liquor L can be ultra-pure water (DIW), also can be the function water such as hydrogen water.
The flushing liquor L that the position of single pipe nozzle 41, discharge direction, bore and flow velocity are designed to discharge from single pipe nozzle 41 meets the following conditions.First, as shown in (a) of Fig. 2, be not set to the center O of substrate W from the landing positions A on the surface to substrate W of the flushing liquor of single pipe nozzle 41 discharge, but be set to the position only leaving distance Ra from the center O of substrate W.Under overlooking, to make the center O of substrate W the mode be positioned on the line that single pipe nozzle 41 and landing positions A are linked up determine single pipe nozzle 41 towards.That is, under overlooking, single pipe nozzle 41 discharges flushing liquor L towards the center O of substrate W, but its landing positions A is the position nearby only leaving distance Ra from the center O of substrate W.
As shown in (b) of Fig. 2, in main looking, to discharge and land are set as about 30 degree in angle (incidence angle) α between the liquid stream La and the surface of substrate W on the surface of substrate W from single pipe nozzle 41.This incidence angle α is not limited to 30 degree, but preferably less than 45 degree.Like this, because single pipe nozzle 41 provides flushing liquor from oblique upper to the surface of substrate W, so the liquid stream La of flushing liquor L has the flowing in the direction of the in-plane along substrate W, specifically have towards the fluidly land in the O direction, center of substrate W in the surface of substrate W.When like this, flushing liquor L, by the inertia of the flowing in the O direction, center towards substrate W of this liquid stream La, also flows along the direction towards the center O of substrate W after land.
Because substrate W rotates as described above, so land are subject to the centrifugal force that produced by this rotation and towards the flows outside of substrate W in the flushing liquor L on the surface of substrate W, as shown in Figure 2, in the present embodiment, because land are near the center O of substrate W, so in the position of so close center O, larger centrifugal force can not be produced, in addition, flow towards center O owing to having existed before land, so by this inertia, flushing liquor L is formed in and overlooks lower liquid bundle (liquidus) Lb to linearly advancing to consistent direction with the provider of single pipe nozzle 41 and flow on the surface of substrate W.Consequently, the flushing liquor L of land in the surface of substrate W is by the center O of substrate W.After flushing liquor L is by the center O of substrate W, the provider of single pipe nozzle 41 to inertia force die down gradually, along with towards periphery, centrifugal force becomes large, so the mode expanded gradually with the width towards periphery becomes the liquid stream Lc of perimembranous flowing toward the outside along the direction of rotation of substrate with describing curve, finally discharge from the peripheral part of substrate W.
The variation of flushing liquor L as described above on the surface of substrate W except based on except the position of single pipe nozzle 41, discharge direction, bore, flow velocity (bore × flow velocity is flow), landing positions, also based on surface characteristic (hydrophily or hydrophobicity), the rotary speed (size of centrifugal force) of substrate W.Preferred landing positions more leaves from the center O of substrate W, and the composition parallel with the surface of substrate W of liquid stream La is larger, therefore preferably reduces incidence angle α.In addition, when the rotary speed of substrate W is too fast, the inertia force in liquid stream Lb is less than centrifugal force and causes liquid stream Lb not by the center O of substrate, so preferably excessively do not rotate substrate W rapidly, preferred rotary speed is 1500rpm, is more preferably below 1000rpm.
In addition, under the surface of substrate W is hydrophobic situation, preferably makes landing positions near center O (reducing Ra), and incident angle is reduced.The water-wetness on the surface of substrate W is set to make contact angle be 0 ~ 70 degree.In addition, when the bore of single pipe nozzle 41 is 1 ~ 5mm, flow is set to 500 ~ 2000ml/min, and when the bore of single pipe nozzle 41 is 5 ~ 10mm, flow is set to more than 2000ml/min.In addition, when landing positions A is excessive apart from the distance Ra of the center O of substrate W, as described above, in order to make the liquid stream after land just must increase its flow velocity by the center O of substrate W, so preferably Ra is set to less than 1/3rd of radius R due to inertia force.
As described above, cleaning device according to the present embodiment, surface from from single pipe nozzle 41 to substrate W provides flushing liquor L, but not discharge from the top of substrate W with the center O of larger incidence angle (such as 90 degree) to substrate W, but from oblique upper with less incidence angle, towards O direction, center under overlooking, discharge in the mode nearby of land in center O, flushing liquor L after land flows in the mode of the center O by substrate W, so also carry out liquid displacement rapidly at the center O of the less substrate W of centrifugal force, flushing liquor L is prevented to be deposited on the central part of substrate W.In addition, when the surface of substrate W is the material layer of the softnesses such as copper, compared with the situation that incidence angle is larger, the damage suffered by surface can also be reduced.
(the 2nd embodiment)
(a) of Fig. 3 is the top view of the position relationship representing substrate in the cleaning device of the 2nd embodiment and single pipe nozzle and atomizing nozzle, and (b) of Fig. 3 is the front view of Fig. 3 (a).(a) and (b) of Fig. 3 represents that the cleaning fluid to horizontal substrate surface based on single pipe nozzle and atomizing nozzle provides.The single pipe nozzle 41 of nozzle is provided to be the structure identical with the 1st embodiment as cleaning fluid.In the present embodiment, the 1st embodiment is added further there is atomizing nozzle 42 to be used as cleaning fluid to provide nozzle.The discharge of the flushing liquor L1 carried out based on single pipe nozzle 41 is carried out with the spraying of the flushing liquor L2 carried out based on atomizing nozzle 42 simultaneously.
As shown in (b) of Fig. 3, atomizing nozzle 42 is above substrate W, and spray from the outside of the upper space of substrate W towards the surface (upper surface) of substrate W flushing liquor L2.That is, atomizing nozzle 42 provides flushing liquor L2 from the surface of oblique direction substrate W.Therefore, the flushing liquor La2 sprayed from atomizing nozzle 42 is sprayed in be summit with atomizing nozzle 42 coniform with expanding, and on the surface of substrate W, land are in the land region Lb2 of ellipse.
This land region Lb2 extends to center O from the periphery of substrate W, and is positioned at the upstream of the direction of rotation of substrate W compared with the landing positions of the flushing liquor L1 discharged with single pipe nozzle 41.In addition at this, using certain reference position as benchmark, the upstream/downstream of the direction of rotation of substrate W refer to from reference position along the direction of rotation of substrate W reverse/rotate forward position before 180 degree, when the example of Fig. 3, landing positions due to the flushing liquor L1 as reference position is positioned at the right side of the center O of substrate W, so the first half of the substrate W of (a) of Fig. 3 is the upstream of the landing positions from the flushing liquor L1 as reference position, the latter half of the substrate W of (a) of Fig. 3 is the downstream of the landing positions from the flushing liquor L1 as reference position.
As shown in (a) of Fig. 3, the spray direction of atomizing nozzle 42 (spraying and the direction of the center line of the cone shape flushing liquor La2 of land before substrate W from atomizing nozzle 42) 121 under overlooking roughly towards the center O of substrate W.As shown in (b) of Fig. 3, this spray direction 121 is larger than the incidence angle α of single pipe nozzle 41 with surperficial angulation (incidence angle) β of substrate W under main looking, and is about 45 degree.Due to small and lighter by the particle of flushing liquor La2 of spraying, so when incidence angle is lower relative to the surface of the substrate W of High Rotation Speed, flushing liquor La2 is flicked on the surface of substrate W or near surface, land rate is caused to reduce and provide efficiency to decline, so preferably spray direction 121 is comparatively large, also can be 90 degree.
As in the present embodiment, be able to from experiment it is clear that, in the flushing cleaning of cleaning device, when to carry out simultaneously based on single pipe nozzle 41 flushing liquor L1 provide and the providing of flushing liquor L2 based on atomizing nozzle 42 time, cleaning degree improves.Namely, central part about substrate W passes through the effect of the flushing liquor L1 based on single pipe nozzle 41 illustrated in the 1st embodiment, about periphery in the outer part compared with the central part of substrate W by the effect based on the flushing liquor L2 of atomizing nozzle 42, central part on the surface of substrate W and periphery all promote the flowing of flushing liquor, thus improve cleaning degree.Therefore, the land region La2 of atomizing nozzle 42 need not arrive the center O to substrate W.In addition, atomizing nozzle 42 is not limited to spray flushing liquor coniformly, also can be flushing liquor of fan spraying.
(the 3rd embodiment)
(a) of Fig. 4 is the top view of the position relationship representing substrate in the cleaning device of the 3rd embodiment and two single pipe nozzle, and (b) of Fig. 4 is the front view of Fig. 4 (a).(a) and (b) of Fig. 4 represents that the cleaning fluid to horizontal substrate surface based on two single pipe nozzle provides.1st single pipe nozzle 41 is formed identically with the 1st embodiment.In the present embodiment, also additional relative to the 1st embodiment have the 2nd single pipe nozzle 43.Discharge based on the flushing liquor L1 of single pipe nozzle 41 is carried out with the discharge of the flushing liquor L3 based on single pipe nozzle 43 simultaneously.As shown in (b) of Fig. 4, single pipe nozzle 43, above substrate W, discharges flushing liquor L3 from the outside of the upper space of substrate W towards the surface (upper surface) of substrate W.That is, single pipe nozzle 43 provides flushing liquor L3 from the surface of oblique direction substrate W.
The patten's design that the position of single pipe nozzle 43, discharge direction, bore and flow velocity meet the following conditions with the flushing liquor L3 discharged from single pipe nozzle 43.As shown in (a) of Fig. 4, single pipe nozzle 43, under overlooking, is located at the opposition side at the center of substrate W relative to single pipe nozzle 41.The flushing liquor of discharging from single pipe nozzle 43 is set in the downstream of the landing positions A of single pipe nozzle 41 to the landing positions B on the surface of substrate W.Thus, as shown in (a) of Fig. 4, from single pipe nozzle 43 discharge flushing liquor L3 land behind the surface of substrate W, do not mix with the flushing liquor L1 of single pipe nozzle 41, and flow with stretching towards periphery on the surface of substrate W as liquid stream Lb3 in the downstream of landing positions A.
Fig. 5 is the enlarged drawing of the vicinity of the center O of substrate W in Fig. 4 (a).As shown in (a) of Fig. 4 and Fig. 5, landing positions B, from single pipe nozzle 43, has been positioned beyond the position of the center O of substrate W, for only leaving the position of distance Rb from the center O of substrate W.Landing positions B (center) sets longer apart from the distance Ra of the center O of substrate W than landing positions A (center) apart from the distance Rb of the center O of substrate W.But, when distance Rb is elongated, can be narrowed by the scope of cleaning from the flushing liquor L3 of single pipe nozzle 43, so distance Rb is set to less than 1/4th of the radius R of substrate W.
In addition, about the flushing liquor L3 discharged from single pipe nozzle 43, the surface falling behind in substrate W is not needed linearly to flow.Therefore, about the flushing liquor L3 discharged from single pipe nozzle 43, to set its condition such as bore, flow velocity followed by the mode of centrifugal force Zhou Liudong toward the outside after land.But, the point that the surface about the substrate W when incidence angle is larger sustains damage, identical with the situation of single pipe nozzle 41, so about single pipe nozzle 43, also wish that its incidence angle is less.In the example in fig. 4, the incidence angle of single pipe nozzle 43 is also set to about 30 degree identically with single pipe nozzle 41.
As in the present embodiment, be able to from experiment it is clear that, in the flushing cleaning of cleaning device, when to carry out the providing of flushing liquor L1, L3 based on two single pipe nozzle 41, single pipe nozzle 43 simultaneously, cleaning degree improves.Namely, central part about substrate W passes through the effect of the flushing liquor L1 based on single pipe nozzle 41 illustrated in the 1st embodiment, about periphery in the outer part compared with the central part of substrate W by the effect based on the flushing liquor L3 of single pipe nozzle 43, central part on the surface of substrate W and periphery all promote the flowing of flushing liquor, thus cleaning degree improves.
(the 4th embodiment)
(a) of Fig. 6 is the top view of the position relationship representing substrate in the cleaning device of the 4th embodiment and atomizing nozzle, and (b) of Fig. 6 is the front view of Fig. 6 (a).(a) and (b) of Fig. 6 represents that the cleaning fluid to horizontal substrate surface based on atomizing nozzle provides.As shown in (a) and (b) of Fig. 6, atomizing nozzle 44 is above substrate W, and spray from the outside of the upper space of substrate W towards the surface (upper surface) of substrate W flushing liquor L4.That is, atomizing nozzle 44 provides flushing liquor L4 relative to the surface of substrate W from oblique upper.Flushing liquor La4 is sprayed from the atomizing nozzle 44 of present embodiment in fan-shaped with expanding, atomizing nozzle 44 is asymmetric fan-shaped atomizing nozzles, and this is become maximum direction from by the off-centring of flushing liquor La4 of spraying by flow (spray amount) in the flushing liquor La4 that sprays.
Fig. 7 is the figure representing the position of flushing liquor La4 fan expanded in atomizing nozzle 44 and the relation of flow.Common atomizing nozzle 44 is maximum at the center flow of the flushing liquor fan expanded, more to the symmetrical distribution that two edge flows are fewer, but the flushing liquor L4 sprayed from the atomizing nozzle 44 of present embodiment as shown in Figure 7, be maximum at the edge side flow of the flushing liquor La4 fan expanded, more to the unbalanced fan distribution that the edge flow of opposition side is fewer.
In the present embodiment, flow be maximum direction (direction that spray amount is maximum) 141 in the direction overlooking the lower center O near substrate W, and with land region Lb4 from the center of substrate W until the mode of periphery sets position and the angle of atomizing nozzle 44.Specifically, the direction 141 that spray amount is maximum under overlooking towards the center O of substrate W.In addition, as shown in (a) of Fig. 6, in the Lb4 of land region, include the center O of substrate W.Consequently, maximum at the center O flow (land amount) of land region Lb4, substrate W, more fewer to the edge flow (land amount) of substrate W.In addition, diagram is omitted about the flushing liquor L4 of land behind the surface of substrate W in (a) and (b) of Fig. 6.
If suppose the maximum direction 141 of spray amount under overlooking towards the center O of substrate W but land region Lb4 is excessively far away apart from the center O of substrate W, then as illustrated in above-mentioned background technology, the flushing liquor L4 that will be flowed towards the center O of substrate W by inertia force after land and will being collided, at the mobility step-down of this partial flushing liquid L4 by the flushing liquor L4 of the outside Zhou Liudong of centrifugal force near the center O of substrate W.On the other hand, about the atomizing nozzle 44 of present embodiment, not only by direction 141 maximum for spray amount center O towards substrate W under overlooking, and as described above, spray from oblique upper in the mode of the center O comprising substrate W the Lb4 of land region relative to the surface of substrate W, so the flushing liquor L4 of land is directly flowed to the direction left from center O by inertia force near the center O of substrate W, by centrifugal force Zhou Liudong toward the outside after leaving from center O, thus the collision of flushing liquor L4 as described above can not be produced, mobility does not also reduce.
Fig. 8 is the top view of the position relationship of substrate in the cleaning device of the variation representing the 4th embodiment and atomizing nozzle.In this embodiment, two asymmetric fan-shaped atomizing nozzles as described above are provided with.That is, cleaning device is except above-mentioned atomizing nozzle 44, also has mutually isostructural atomizing nozzle 45, utilizes this two atomizing nozzles 44,45 simultaneously.Two atomizing nozzles 44,45 be set as the maximum direction 141,151 of spray amount overlook lower to about 90 degree.By this variation, each atomizing nozzle 44,45 plays a role identically with the atomizing nozzle 44 of Fig. 6, can obtain effect same as described above.In addition, the angle between the direction 141,151 that the spray amount of atomizing nozzle 44,45 is maximum is not limited to 90 degree.
In addition, in above-mentioned 1st ~ 4 embodiments, the situation of flushing liquor is provided to describe embodiments of the present invention as an example by flushing cleaning, about the 1st embodiment, the 2nd embodiment, the 4th embodiment and variation thereof, also the liquids such as rolling cleaning and form of a stroke or a combination of strokes cleaning that are provided for of such cleaning fluid can be cleaned.Namely, at least to substrate liquid is provided and (also having the situation that flushing liquor is provided simultaneously) when use rolling cleaning part and/or the form of a stroke or a combination of strokes cleaning part brushing cleaning substrate, as illustrated in the 1st embodiment, the 2nd embodiment, the 4th embodiment and variation thereof, also provide liquid (and flushing liquor).
Below, as the 5th ~ 7th embodiment, applicable example of the present invention in rolling cleaning device is described, before the explanation of each embodiment, the general structure of rolling cleaning device is described.
Fig. 9 is the stereogram of the summary of the rolling cleaning device represented in embodiments of the present invention.As shown in Figure 9, rolling cleaning device 50 has: as many (being 4 in fig .9) rotating shafts 51 of substrate rotation mechanism, it can move freely in the horizontal direction, and to make the surface of substrate make substrate W horizontally rotate as the circumference of upper mode support substrate W; So that rotatable mode top rolling cleaning part (rolling sponge) 52 on not shown rolling support can be supported in; So that rotatable mode bottom rolling cleaning part (rolling sponge) 53 on not shown rolling support can be supported in.Top rolling cleaning part 52 and bottom rolling cleaning part 53 are cylindric and strip ground extends, and is made up of such as PVA.In addition, top rolling cleaning part 52 is elevated freely by the surface of this rolling support relative to substrate W, and bottom rolling cleaning part 53 is elevated freely by the back side of this rolling support relative to substrate W.
Top rolling cleaning part 52, by not shown driving mechanism, rotates as indicated by arrows f1 like that, and bottom rolling cleaning part 53, by not shown driving mechanism, rotates as indicated by arrows f2 like that.Be configured with two cleaning fluids and provide nozzle 54,55, it is positioned at and is supported by rotating shaft 51 and the top of the substrate W rotated, and the surface to substrate W provides cleaning fluid.Cleaning fluid provides nozzle 54 to be the nozzles providing flushing liquor (such as, ultra-pure water) to the surface of substrate W, and cleaning fluid provides nozzle 55 to be the nozzles providing liquid to the surface of substrate W.
Also push to the inside in the embeded slot that the circumferential lateral surface that rolling cleaning device 50 makes the circumference of substrate W be located at the block 51a on the top being located at main shaft 51 is formed and make block 51a rotate (rotation), thus substrate W is flatly rotated.In this embodiment, two block 51a in four block 51a give revolving force to substrate W, and other two block 51a carry out the action of the bearing of the rotation of bearing substrate W.In addition, also all block 51a and driving mechanism can be linked and give revolving force to substrate W.
Under the state making substrate W flatly rotate like this, nozzle 54 is provided to provide flushing liquor to the surface of substrate W from cleaning fluid, and provide nozzle 55 to provide liquid to the surface of substrate W from cleaning fluid, make top rolling cleaning part 52 rotate simultaneously while decline and with rotate in the surface contact of substrate W, thus, when there is cleaning fluid (flushing liquor and liquid), with the surface of top rolling cleaning part 52 brushing cleaning substrate W.The length setting of top rolling cleaning part 52 must be slightly longer than the diameter of substrate W.Then, top rolling cleaning part 52 is configured to, its central shaft (rotating shaft) O
rwith central shaft (i.e. pivot) O of substrate W
wroughly orthogonal, and extend in the length range of the diameter of substrate W.Thus, the whole surface of substrate W is side by side cleaned.
Below, the embodiment of the 5th ~ 7th is described, these embodiments and above-mentioned cleaning fluid provide the structure of nozzle different.
(the 5th embodiment)
Figure 10 is the top view of the cleaning device of the 5th embodiment of the present invention.In Fig. 10, main shaft eliminates diagram.In cleaning device, there is the single pipe nozzle 61 and the single pipe nozzle 63 of discharging as the liquid of cleaning fluid of discharging as the flushing liquor of cleaning fluid.Single pipe nozzle 61,63, above substrate W, discharges cleaning fluid from the outside of the upper space of substrate W towards the surface (upper surface) of substrate W.That is, single pipe nozzle 61,63 provides cleaning fluid from oblique upper to the surface of substrate W.Flushing liquor can be ultra-pure water (DIW), also can be the function water such as hydrogen water.The solution (acid liquid or alkalescent liquid) except electrolyte (solution near pH7) is used in liquid.As acid liquid, use the such as organic acid such as citric acid or oxalic acid, as alkalescent liquid, use such as organic base.
Single pipe nozzle 61,63 sets its position, discharge direction, bore and flow velocity with condition identical with the condition that the single pipe nozzle 41 about the 1st embodiment illustrates respectively.In addition, the mode nearby of cleaning area (brushing region) 521 that cleaning fluid contacts with substrate W in top rolling cleaning part 52 with land is discharged from single pipe nozzle 61,63.Single pipe nozzle 61,63 is all involved in side region (region of the right half part of substrate W as shown in Figure 10) to the rolling of substrate W described later provides cleaning fluid.Angle γ between the discharge direction 611,631 of single pipe nozzle 61,63 is set to about 90 degree under overlooking, and this angle γ is not limited to 90 degree.
In cleaning device, be also provided with spraying as the atomizing nozzle 62 of the flushing liquor of cleaning fluid and the spraying atomizing nozzle 64 as the liquid of cleaning fluid.These two atomizing nozzles 62,64 are also involved in side region to the rolling of substrate W provides cleaning fluid.Atomizing nozzle 62,64 overlooks lower being positioned at separately and single pipe nozzle 61,63 roughly the same positions, but with shown in (b) of such as Fig. 3 in the same manner, the incidence angle of atomizing nozzle 62,64 is larger than the incidence angle of single pipe nozzle 61,63, and atomizing nozzle 62,64 is from more top spray rinse.
These two atomizing nozzles 62,64 are the asymmetric fan-shaped atomizing nozzle illustrated in the 4th embodiment, its position, injection direction etc. and the atomizing nozzle 44 illustrated in the variation (Fig. 8) of the 4th embodiment, 45 identical.That is, the direction 621,641 that its spray amount is maximum under overlooking towards the center O of substrate W.Angle between the direction 621,641 that this spray amount is maximum is also set to about 90 degree, but is not limited thereto.The land region of atomizing nozzle 62,64 is the scopes from the cleaning area 521 near the center O of substrate W to the periphery of substrate W.
The single pipe nozzle 61 of flushing liquor and atomizing nozzle 62 is provided to provide cleaning fluid with the upstream side provided to the direction of rotation of substrate W compared with the single pipe nozzle 63 of liquid and atomizing nozzle 64.The rolling that this flushing liquor and liquid are all provided to substrate W is involved in side region, thus move to cleaning area 521 the latter half region substrate W surface on, become the state that liquid mixes with flushing liquor.
(the 6th embodiment)
Before explanation the 6th embodiment, the problem of the prior art solved with the cleaning device of the 6th embodiment is described.Figure 11 is the top view for illustration of each region on substrate.As shown in figure 11, by the pivot O by substrate W
wand with the rotating shaft O of top rolling cleaning part 52
rorthogonal straight line is set to X-axis, by the rotating shaft O along top rolling cleaning part 52
rstraight line be set to Y-axis.Top rolling cleaning part 52 main depending under be rotated in a clockwise direction (rotation), substrate W is rotated in a clockwise direction under overlooking.
Clip top rolling cleaning part 52, namely clip Y-axis and the surface of substrate W is divided into two region R to the left and right
i, R
o.In Figure 11 that top rolling cleaning part 52 deasil rotates, the single side regions on right side is defined as rolling and is involved in side region R
i, being defined as the single side regions in left side rolls releases side region R
o.That is, rolling is involved in side region R
ibe the single side regions (being right side in Figure 11) cleaning fluid is involved in by the rotation of top rolling cleaning part 52, roll and release side region R
oit is the single side regions (being left side in fig. 11) cleaning fluid released by the rotation of top rolling cleaning part 52.
And, rolling is involved in side region R
iside region R is released with rolling
orespectively using X-axis as border, be divided into upstream side region W relative to the direction of rotation of substrate W
uwith downstream side region W
d.Side region R is involved in rolling
iin, by the upstream side region W above X-axis
ibe defined as rolling and be involved in upstream side region R
i-W
u, by the downstream side region W below X-axis
dbe defined as rolling and be involved in downstream side region R
i-W
d.In the same manner, side region R is released in rolling
oin, by the upstream side region W below X-axis
ubeing defined as rolls releases upstream side region R
o-W
u, by the downstream side region W above X-axis
dbeing defined as rolls releases downstream side region R
o-W
d.
Figure 12 is the top view of existing rolling cleaning device, and Figure 13 is the A-A ' sectional view of Figure 12, and Figure 14 is the partial enlarged drawing of Figure 13, and Figure 15 is the B-B ' sectional view of Figure 12.In addition, in Figure 13,14, the diagram of atomizing nozzle 71,74 is omitted.As shown in figure 12, rolling cleaning device has four atomizing nozzles 71 ~ 74.Atomizing nozzle 71 ~ 74 is the nozzle of coniform ground spray rinse.
In addition, atomizing nozzle 71 ~ 74 is all involved in side region to the rolling of substrate W provides cleaning fluid.Atomizing nozzle 71,74 is sprayed as the flushing liquor of cleaning fluid, and atomizing nozzle 72,73 is sprayed as the liquid of cleaning fluid.Arrive to top rolling cleaning part 52 separately from the land region of the flushing liquor of atomizing nozzle 71,74 spraying, a part of flushing liquor is directly vaporific is sprayed onto top rolling member 52.
As shown in FIG. 12 and 13, in reverse (counter) cleaning area 521c, because top rolling cleaning part 52 and the moving direction of substrate W are rightabout, so both relative moving speeds (sliding speed) are larger.Therefore, the physical cleaning of reverse cleaning region 521c uprises.
On the other hand, the rolling of side region is provided to release downstream side region R as on-liquid
o-W
dliquid be the liquid that (forward) cleaning area 521f uses in the brushing based on top rolling cleaning part 52 is cleaned before the downside of cleaning area 521 before half rotates, and, because the periphery of the large multidirectional substrate W of liquid used in the brushing based on top rolling cleaning part 52 is cleaned at front cleaning area 521f is discharged, so become considerably less at reverse cleaning region 521c.In addition, the rolling of side region is being supplied to be involved in upstream side region R as liquid carrying
i-W
u, the cleaning fluid be provided near the 521c of reverse cleaning region is carried to the direction away from reverse cleaning region 521c by the rotation of substrate W, and is not supplied to reverse cleaning region 521c.
And be formed with multiple less projection (in fig. 14, illustrate only three projection 522a ~ 522c) on the surface of top rolling cleaning part 52, the rolling of top rolling cleaning part 52 is involved in side region R
ithe projection 522a of side as described above, is provided directly flushing liquor, is rinsed immersion stain, or is provided flushing liquor by the inside from top rolling cleaning part 52, is rinsed immersion stain.The projection 522a flooded when this flushing liquor is by the rotation of top rolling cleaning part 52, and when arriving reverse cleaning region 521c, as projection 522b, by substrate W conquassation, the flushing liquor of dipping is involved in side region R to rolling
iand the release side region R that rolls
ospill.
Like this, downstream side region R is released from rolling
o-W
dto be transferred by the rotation of substrate W and a small amount of cleaning fluid that will enter reverse cleaning region 521c is also extruded by this flushing liquor spilt, thus to be difficult to be provided to reverse cleaning region 521c.Therefore, do not provide the fresh cleaning fluid of enough amounts to reverse cleaning region 521c, liquid cleaning step-down.
On the other hand, as shown in figure 15, in forward cleaning area 521f, because the moving direction of top rolling cleaning part 52 with substrate W becomes forward, so both relative moving speeds (sliding speed) diminish.Therefore, the physical cleaning step-down of forward cleaning area 521f.On the other hand, the rolling of side region is being supplied to be involved in downstream side region R as liquid carrying
i-W
din, near forward cleaning area 521f, provide fresh cleaning fluid fully by atomizing nozzle 73, in addition, the cleaning fluid be provided near forward cleaning area 521f is provided to forward cleaning area 521f by the rotation of substrate W.Therefore, the liquid cleaning of forward cleaning area 521c uprises.
As described above, in existing rolling cleaning device, the physical cleaning of reverse cleaning region 521c is higher, but liquid cleaning is lower, and the liquid cleaning of forward cleaning area 521f is higher, but physical cleaning is lower.Therefore, object is in the present embodiment, the liquid cleaning in the 521c of reverse cleaning region is improved.
Figure 16 is the top view of the cleaning device represented in the 6th embodiment of the present invention.In the present embodiment, only the configuration of single pipe nozzle 63 is different from the 5th embodiment, and other structure is identical with the 5th embodiment.The single pipe nozzle 63 of discharging liquid is involved in side region to the rolling of substrate W identically with above-mentioned 5th embodiment provides liquid, and the discharge direction 631 of single pipe nozzle 63 is 90 degree with bearing of trend (rotating shaft) angulation of top rolling cleaning part 52 under overlooking.This angle is not limited to 90 degree, preferably in the scope of 90 degree ± 30 degree.That is, in the present embodiment, the direction 641 that the discharge direction of single pipe nozzle 63 of discharge liquid is maximum with the spray amount of the atomizing nozzle 64 of spray liquor is not roughly the same direction under overlooking.
(a) of Figure 17 represents the top view from the variation of liquid on the surface of substrate W of single pipe nozzle 63 discharge in present embodiment, and (b) of Figure 17 is the front view of Figure 17 (a).As shown in figure 17, the rolling of substrate W is involved in side region R
ibe by single pipe nozzle 61,63, and atomizing nozzle 62,64 provides the liquid carrying of cleaning fluid for side region, side region R is released in the rolling of substrate W
odo not provide the on-liquid of cleaning fluid to provide side region.
Single pipe nozzle 63 provides liquid with the surface relative to substrate W in the mode of lower incidence angle land near the center O of substrate W.The liquid of land in the surface of substrate W has the flowing to the direction parallel with the surface of substrate W, in addition, because centrifugal force is also more weak near the center O of substrate W, so liquid to enter under top rolling cleaning part 52 and from it through, and enter into on-liquid side region is provided, then, by the rotation of substrate W, provide side region to be provided to reverse cleaning region 521c from on-liquid.Thus, the fresh liquid reverse cleaning region 521c of the liquid of fresh (uncontaminated) not providing enough amount in prior art being provided to enough amounts is become.In order to realize entering of such liquid, as described above, the discharge direction 631 of single pipe nozzle 63 most preferably is 90 degree with bearing of trend (rotating shaft) angulation of top rolling cleaning part 52, at least preferred in the scope of 90 degree ± 30 degree.
(the 7th embodiment)
The object of the 7th embodiment of the present invention is also to solve the problem identical with the 6th embodiment.Figure 18 is the top view of the rolling cleaning device in the 7th embodiment of the present invention, and Figure 19 is the A-A ' sectional view of Figure 18, and Figure 20 is the partial enlarged drawing of Figure 19, and Figure 21 is the B-B ' sectional view of Figure 18.As shown in figure 18, rolling cleaning device has four atomizing nozzles 71 ~ 74.Atomizing nozzle 71 ~ 74 is the nozzle of coniform ground spray rinse.Atomizing nozzle 71 ~ 74 is all involved in side region to the rolling of substrate W provides cleaning fluid.Atomizing nozzle 71,74 is sprayed as the flushing liquor of cleaning fluid, and atomizing nozzle 72,73 is sprayed as the liquid of cleaning fluid.The land region of flushing liquor of spraying from atomizing nozzle 71,74 arrives to top rolling cleaning part 52 separately, a part of flushing liquor by Direct spraying to top rolling member 52.In addition, as atomizing nozzle 71 ~ 74, also can substitute the nozzle of coniform ground spray rinse, and adopt fan the spray nozzle of flushing liquor or flow (spray amount) for maximum direction is from by the asymmetric fan-shaped atomizing nozzle of the off-centring of flushing liquor of spraying.
The cleaning device of present embodiment also has the atomizing nozzle 66,67 of the rolling release side Direct spraying liquid releasing side direction top rolling cleaning part 52 from the rolling of substrate W.Atomizing nozzle 66,67 is fan-shaped atomizing nozzles.As shown in Figure 18, atomizing nozzle 66 releases downstream side region R in rolling
o-W
din, side spray liquid is released in the rolling to top rolling cleaning part 52, and atomizing nozzle 67 releases upstream side region R in rolling
o-W
uin, side spray liquid is released in the rolling to top rolling cleaning part 52.As shown in Figure 19,21, atomizing nozzle 66,67 is respectively to the middle section position spray liquor of the short transverse of top rolling member 52.In addition, side is released in the rolling to top rolling cleaning part 52 directly provides the nozzle of liquid to be not limited to atomizing nozzle, also can be jet rose or gap nozzle.
Above-mentioned also as shown in Figure 19, be provided to rolling from atomizing nozzle 72 and be involved in side upstream region R
i-W
uliquid do not arrive reverse cleaning region 521c by the rotation of substrate W, but with from reverse cleaning region 521c away from mode flow.
In addition, as described above, in existing cleaning device, to the raised pre-soaked flushing liquor of the rolling cleaning part 52 of arrival reverse cleaning region 521c, this projection in the 521c of reverse cleaning region by conquassation, the flushing liquor of dipping is discharged from projection, so from providing the rolling in region to release downstream side region R as non-liquid
o-W
dcleaning fluid be difficult to enter into reverse cleaning region 521c.
Cleaning device according to the present embodiment, in the 521c of reverse cleaning region by conquassation protrude through that rotation is released and shape is heaved, become the state of easy absorbing fluid.Then, as shown in Figure 19, provide fresh liquid by atomizing nozzle 66 to the raised of such state, this liquid impregnated in projection.When passing through to rotate, when being impregnated with the projection arrival reverse cleaning region 521c of liquid in top rolling cleaning part 52, as shown in Figure 20, projection is provided fresh liquid by conquassation to reverse cleaning region 521c herein.In addition, owing to also maintaining the fresh liquid provided by atomizing nozzle 66 between multiple projections of top rolling cleaning part 52, so this fresh liquid is also provided to reverse cleaning region 521c.
And then, as shown in Figure 19, in the liquid of being sprayed towards top rolling cleaning part 52 by atomizing nozzle 66, not absorbed by top rolling cleaning part 52 or the liquid that keeps falls from this to the surface of substrate W.This liquid fallen is delivered to reverse cleaning region 521c by the rotation of substrate W.Therefore, also the fresh liquid from atomizing nozzle 66 is provided by this liquid fallen to reverse cleaning region 521c.
In addition, as shown in figure 21, in forward cleaning area 521f, the liquid Direct spraying of spraying from atomizing nozzle 67 releases side to the rolling of top rolling cleaning part 52, is absorbed or the liquid that keeps is involved in side by the rotation of top rolling cleaning part 52 from rolling and is provided to forward cleaning area 521f by top rolling cleaning part 52.On the other hand, spray from atomizing nozzle 67 but do not absorbed by top rolling cleaning part 52 or to keep and the liquid fallen to the surface of substrate W is transported to reverse cleaning region 521c by the rotation of substrate W.
As described above, cleaning device according to the present embodiment, can provide the fresh liquid of enough amounts, and can improve the liquid cleaning in the 521c of reverse cleaning region to reverse cleaning region 521c.
In addition, in the 7th embodiment, provide liquid by atomizing nozzle 66 directly to top rolling cleaning part 52, but the present invention is not limited thereto, also directly can provide liquid by jet rose or gap nozzle to top rolling cleaning part 52.
(the 8th embodiment)
8th embodiment of the present invention also will solve the problem identical with the 7th embodiment as object.Figure 22 is the top view of the rolling cleaning device in the 8th embodiment of the present invention, and Figure 23 is the A-A ' sectional view of Figure 22.As shown in figure 22, rolling cleaning device has two atomizing nozzles 62,64.Atomizing nozzle 62,64 is involved in side region spray liquor to the rolling of substrate W.Atomizing nozzle 62,64 is the asymmetric fan-shaped atomizing nozzle illustrated in the 4th embodiment.The direction 621,641 that their spray amount is maximum is towards the center O of substrate W in overlooking.Angle between the direction 621,641 that this spray amount is maximum is about 90 degree, but is not limited thereto.
The land region of atomizing nozzle 62 is along reverse cleaning region 521c to the scope of the periphery of substrate W from the center O of substrate W.The land region of atomizing nozzle 64 is the center O scopes along forward cleaning area 521f to the periphery of substrate W from substrate W.The land region of atomizing nozzle 62,64 all overlaps with top rolling cleaning part 52, namely, as shown in figure 23, the liquid of spraying from atomizing nozzle 62,64 at least partially or the rolling all directly arriving tops rolling member 52 be involved in upstream side (right part).
Like this, increase towards the flow of the liquid of the center O of substrate W by also using asymmetric fan-shaped atomizing nozzle in the present embodiment, thus, the liquid being provided to the vicinity of the center O of substrate W is directly flowed to the direction left from center O by inertia force, by centrifugal force Zhou Liudong toward the outside after leaving from center O, so do not produce from the liquid flowed towards center O in the outer part compared with near the O of center and near the O of center by the mutual collision of the centrifugal force liquid of Zhou Liudong toward the outside, mobility does not reduce.
In addition, in the present embodiment, because at least partially or all liquids of blowing in future fog-type nozzle 62 are involved in upstream side spraying directly to the rolling of top rolling member 52, so can to this part raised between fresh liquid is provided fully, with reference to Figure 14, the problem in above-mentioned middle explanation can be solved.
Below, as the 9th and the 10th embodiment, applicable example of the present invention in form of a stroke or a combination of strokes cleaning device is described, before the explanation of each embodiment, the general structure of form of a stroke or a combination of strokes cleaning device is described.
Figure 24 is the stereogram of the summary of the form of a stroke or a combination of strokes cleaning device represented in embodiments of the present invention.As shown in figure 24, form of a stroke or a combination of strokes cleaning device 80 has: as substrate rotation mechanism many (being 4 in the drawings) main shaft 51, and uses the identical of the rolling cleaning device 50 that illustrates of Fig. 9; The pillar 56 extended along vertical that can be elevated; One end can be installed on the front end of pillar 56 rotatably, and the arm 57 extended in the horizontal direction; The columned form of a stroke or a combination of strokes cleaning part 58 (cylindric sponge) of the lower surface of the other end of arm 57 can be installed on rotatably.In addition, be configured with two cleaning fluids and provide nozzle 54,55, it is positioned at and is supported and the top of the substrate W rotated by main shaft 51, and provides cleaning fluid to the surface of substrate W.Cleaning fluid provides nozzle 54 to be the nozzles providing flushing liquor (such as, ultra-pure water) to the surface of substrate W, and cleaning fluid provides nozzle 55 to be the nozzles providing liquid to the surface of substrate W.
Form of a stroke or a combination of strokes cleaning part 58 is held in not shown holding member, and can be located at the lower surface of the leading section of arm 57 rotatably, is rotated (rotation) by its central shaft by not shown driving mechanism as rotating shaft.This rotating shaft is the axle vertical with substrate W.Form of a stroke or a combination of strokes cleaning part 58 is made up of such as PVA.When arm 57 rotates around pillar 56, the form of a stroke or a combination of strokes cleaning part 58 being installed on the leading section of arm 57 is described the track of arc-shaped and moves on substrate W.Leading section due to arm 57 extends to the center O of substrate W, so the motion track of form of a stroke or a combination of strokes cleaning part 58 is by the center O of substrate W.In addition, form of a stroke or a combination of strokes cleaning part 58 moves to the periphery of substrate W.Therefore, based on the rotation of arm 57 and the motion track of the form of a stroke or a combination of strokes cleaning part 58 produced becomes the arc-shaped of the length of arm 57 as radius, its moving range is the outer thoughtful center O exceeding substrate W from substrate W.
Under the state flatly rotated being made substrate W by substrate rotation mechanism, flushing liquor is provided to the surface of substrate W by providing nozzle 54 from cleaning fluid, and provide nozzle 55 to provide liquid to the surface of substrate W from cleaning fluid, simultaneously while make form of a stroke or a combination of strokes cleaning part 58 rotate (rotation), while make arm 57 rotate and make form of a stroke or a combination of strokes cleaning part 58 revolve round the sun, with the surface contact of the substrate W in rotation, thus, under the existence of cleaning fluid (flushing liquor and liquid), with the surface of form of a stroke or a combination of strokes cleaning part 58 brushing cleaning substrate W.
Below, the 9th and the 10th embodiment is described, the above-mentioned cleaning fluid of these embodiments provides the structure of nozzle different separately.
(the 9th embodiment)
Figure 25 is the top view of the cleaning device in the 9th embodiment of the present invention.In fig. 25, main shaft 51, pillar 56 and arm 57 omit diagram.In addition, the motion track of form of a stroke or a combination of strokes cleaning part 58 becomes the arc-shaped of arm 57 as radius as described above, but when arm 57 is fully long, and the track of form of a stroke or a combination of strokes cleaning part 58 can roughly considered as straight lines shape, so in fig. 25, represent the motion track of form of a stroke or a combination of strokes cleaning part 58 with straight line.In addition, in fig. 25, substrate W rotates in the counterclockwise.
In cleaning device, have: discharge the single pipe nozzle 81 as the flushing liquor of cleaning fluid; Discharge the single pipe nozzle 83 as the liquid of cleaning fluid.Single pipe nozzle 81,83, above substrate W, discharges cleaning fluid from the outside of the upper space of substrate W towards the surface (upper surface) of substrate W.That is, single pipe nozzle 81,83 provides cleaning fluid relative to the surface of substrate W from oblique upper.Flushing liquor both can be ultra-pure water (DIW), also can be the function water such as hydrogen water.The solution (acid liquid or alkalescent liquid) except electrolyte (solution near pH7) is used in liquid.As acid liquid, use the such as organic acid such as citric acid or oxalic acid, as alkalescent liquid, use such as organic base.
Single pipe nozzle 81,83 sets its position, discharge direction, bore and flow velocity with the condition identical with the condition that the single pipe nozzle 41 about the 1st embodiment illustrates separately.In addition, the mode nearby that single pipe nozzle 81 becomes the center O of substrate W towards the center O of substrate W, landing positions with its discharge direction under overlooking sets, and single pipe nozzle 81,83 all provides flushing liquor to the upstream side of the direction of rotation of substrate W compared with the motion track of form of a stroke or a combination of strokes cleaning part 58.That is, the mode that single pipe nozzle 81,83 becomes the upstream side of the track of form of a stroke or a combination of strokes cleaning part 58 with landing positions discharges flushing liquor.Angle σ between the discharge direction 811,831 of single pipe nozzle 81,83 is about 30 degree under overlooking, but this angle σ is not limited to 30 degree.
Spraying is also provided with as the atomizing nozzle 82 of the flushing liquor of cleaning fluid and the spraying atomizing nozzle 84 as the liquid of cleaning fluid in cleaning device.These atomizing nozzles 82,84 also provide liquid to the upstream side of the direction of rotation of substrate W compared with the motion track of form of a stroke or a combination of strokes cleaning part 58.The each leisure of atomizing nozzle 82,84 is overlooked down and is positioned at and single pipe nozzle 81,83 roughly the same positions, with shown in (b) of such as Fig. 3 in the same manner, the incidence angle of atomizing nozzle 82,84 is larger than the incidence angle of single pipe nozzle 81,83, and atomizing nozzle 82,84 is from more top spray rinse.
These two atomizing nozzles 82,84 are the asymmetric fan-shaped atomizing nozzle illustrated in the 4th embodiment, and its position, injection direction etc. are identical with the atomizing nozzle 44,45 illustrated in the variation (Fig. 8) of the 4th embodiment.That is, the direction 821,841 that its spray amount is maximum under overlooking towards the center O of substrate W.Angle between the direction 821,841 that this spray amount is maximum is also about 30 degree.The land region of atomizing nozzle 82,84 is the scopes from the cleaning area 521 near the center O of substrate W to the periphery of substrate W.
The single pipe nozzle 81 of flushing liquor and atomizing nozzle 82 is provided to provide cleaning fluid with the upstream side provided to the direction of rotation of substrate W compared with the single pipe nozzle 83 of liquid and atomizing nozzle 84.Especially, the land region of the atomizing nozzle 84 of spray liquor is set to the motion track along form of a stroke or a combination of strokes cleaning part 58, and this motion track tight before the position of (upstream).All be provided to the surface of substrate W by this flushing liquor and liquid, on the surface of the substrate W of the motion track by form of a stroke or a combination of strokes cleaning part 58, become the state that liquid mixes with flushing liquor.In addition, in the downstream of the direction of rotation of the substrate W compared with the motion track of form of a stroke or a combination of strokes cleaning part 58, the cleaning fluid that have passed the motion track of form of a stroke or a combination of strokes cleaning part 58, by the centrifugal force based on the rotation of substrate W, is discharged from the periphery of substrate W.
Cleaning device according to the present embodiment, can provide the fresh cleaning fluid of enough amounts to the position of carrying out brushing cleaning by form of a stroke or a combination of strokes cleaning part 58.
(the 10th embodiment)
Figure 26 is the top view of the cleaning device in the 10th embodiment of the present invention.In the present embodiment, single pipe nozzle 81,83 and the configuration of atomizing nozzle 82 only under overlooking different from the 9th embodiment, other structure is identical with the 9th embodiment.In the present embodiment, single pipe nozzle 81,83 is located at the upstream side of the direction of rotation of substrate W compared with atomizing nozzle 82,84.Single pipe nozzle 81,83 is identical with the 9th embodiment, its discharge direction 811,831 under overlooking towards the center O of substrate W.In addition, the direction 821 that the spray amount of atomizing nozzle 82 is maximum under overlooking towards the center O of substrate W.
In the present embodiment, when comparing with the 9th embodiment, angle between the discharge direction 811,831 of single pipe nozzle 81,83, and angle between the maximum direction 821,841 of the spray amount of atomizing nozzle 82,84 is less than the situation of the 9th embodiment separately.Therefore, can avoid or reduce the cleaning fluid of discharging from single pipe nozzle 81,83 and relatively hinder the flowing of cleaning fluid on the surface of substrate W, can avoid or reduce the cleaning fluid of spraying from atomizing nozzle 82,84 in the same manner and relatively hinder the flowing of cleaning fluid on the surface of substrate W.
In addition, in the 9th and the 10th embodiment, upstream side to the direction of rotation of the substrate W compared with form of a stroke or a combination of strokes cleaning part 58 provides cleaning fluid, but is not limited thereto, and also can provide cleaning fluid to the downstream of the direction of rotation of the substrate W compared with form of a stroke or a combination of strokes cleaning part 58.
(the 11st embodiment)
Figure 27 is the top view of the cleaning device in the 11st embodiment of the present invention, and Figure 28 is the figure of the length direction of view 57 from the side.In the cleaning device of present embodiment, form of a stroke or a combination of strokes cleaning part 58 is supported on the leading section of arm 57.Form of a stroke or a combination of strokes cleaning part 58 around the central shaft rotation vertical with substrate W, and is contacted with the upper surface slide of substrate W while mobile by the rotation of arm 57 in the scope of center to the periphery of substrate W, cleans the upper surface of substrate W thus.On the outside of the periphery of substrate W, be provided with using lower component with the configuration identical with the 9th embodiment (with reference to Figure 25): discharge the single pipe nozzle 81 as the flushing liquor of cleaning fluid; Spray as the atomizing nozzle 82 of the flushing liquor of cleaning fluid; Spray as the atomizing nozzle 84 of the liquid of cleaning fluid.
In the present embodiment, be also provided with on arm 57 for spraying as the atomizing nozzle 85 of the liquid of cleaning fluid.Like this, arm 57 will be fixed on, the cleaning fluid swung by the rotation of arm 57 provide nozzle to be called on arm, (On Arm) cleaning fluid provides nozzle.On arm, atomizing nozzle 85 is located near form of a stroke or a combination of strokes cleaning part 58.Specifically, atomizing nozzle 85 is adjacent to arrange at the upstream side of the rotation of substrate W and form of a stroke or a combination of strokes cleaning part 58 relative to form of a stroke or a combination of strokes cleaning part 58.
As shown in figure 28, the spray direction of atomizing nozzle 85 tilts a little towards form of a stroke or a combination of strokes cleaning part 58.Figure 29 is the figure representing the land region of spraying based on atomizing nozzle 85.As shown in figure 29, atomizing nozzle 85 is nozzles of fan shape ground spray rinse, and as described above, because its spray direction tilts a little towards form of a stroke or a combination of strokes cleaning part 58, so the cleaning fluid of spraying from atomizing nozzle 85 expands along the radial direction of form of a stroke or a combination of strokes cleaning part 58, and land are between atomizing nozzle 85 and form of a stroke or a combination of strokes cleaning part 58.
There is provided nozzle as cleaning fluid on arm, also can adopt single pipe nozzle, but when single pipe nozzle, when discharging cleaning fluid towards form of a stroke or a combination of strokes cleaning part 58, cleaning fluid becomes block, provides partly relative to form of a stroke or a combination of strokes cleaning part 58.When like this, cleaning fluid is flicked by form of a stroke or a combination of strokes cleaning part 58, causes the cleaning fluid of the lower surface (cleaning surface) of the form of a stroke or a combination of strokes cleaning part 58 be provided to as cleaning position to tail off.In contrast to this, when use atomizing nozzle 85 provides nozzle as the cleaning fluid arranged obliquely to the direction towards form of a stroke or a combination of strokes cleaning part 58 near form of a stroke or a combination of strokes cleaning part 58, because cleaning fluid is provided in the wider scope of the surrounding of form of a stroke or a combination of strokes cleaning part 58, so such problem alleviates.
In addition, in the present embodiment, atomizing nozzle 85 on arm is located at the upstream side of the direction of rotation of substrate W relative to form of a stroke or a combination of strokes cleaning part 58, towards form of a stroke or a combination of strokes cleaning part 58 spray rinse, thus the fresh cleaning fluid of land firm by spraying can be provided to form of a stroke or a combination of strokes cleaning part 58 and substrate W slidingly contact position (cleaning position).
In addition, in the present embodiment, not only provide nozzle from cleaning fluid arm, also the region comprising the center of substrate W from the lateral of substrate W provides cleaning fluid, this is to prevent following situation: when the atomizing nozzle 85 of form of a stroke or a combination of strokes cleaning part 58 and integratedly movement is positioned at the outer circumferential side of substrate W, by means of only atomizing nozzle 85 on arm, cleaning fluid is not provided to the central part of substrate W and the upper surface of substrate W can be caused dry.Therefore, form of a stroke or a combination of strokes cleaning part 58 arranges washer jet on arm, if provide cleaning fluid to the central part of substrate W all the time by least one washer jet be fixedly installed, then can prevent drying to the whole face of substrate W, be therefore preferred.
In addition, both can nozzle be provided to provide liquid from cleaning fluid arm like that by embodiment described above, provide flushing liquor and/or liquid from the outside of substrate W, and also can provide flushing liquor from washer jet arm, provide liquid and/or flushing liquor from the outside of substrate W.In addition, the providing of cleaning fluid from the outside of substrate W can, based on atomizing nozzle, can, based on single pipe nozzle, can also be also its both sides as embodiment described above.
In addition, preferred form of a stroke or a combination of strokes cleaning part 58 rotates in the side providing nozzle to provide cleaning fluid by cleaning fluid on arm (upstream side of the direction of rotation of substrate W) mode towards the outside movement of the radial direction of substrate, that is, towards (situation of Figure 28 be counterclockwise) rotate identical with substrate W of lower edge is overlooked.When for this direction of rotation, by atomizing nozzle 85 from the liquid that the upstream side of form of a stroke or a combination of strokes cleaning part 58 provides towards form of a stroke or a combination of strokes cleaning part 58, easily discharged towards substrate W periphery by the rotation of form of a stroke or a combination of strokes cleaning part 58 by the cleaning fluid flicked in the side of form of a stroke or a combination of strokes cleaning part 58.
(the 12nd embodiment)
Figure 30 is the top view of the cleaning device in the 12nd embodiment of the present invention, and Figure 31 is the partial enlarged drawing of Figure 30, and Figure 32 is the figure of the length direction of view 57 from the side.In the cleaning device of present embodiment, be supported with two-fluid in the leading section of arm 57 and spray (2FJ) nozzle 59.In addition, be also provided with in the present embodiment and spray as atomizing nozzle 86 on the arm of the liquid of cleaning fluid to arm 57.
In addition, the single pipe nozzle 81 of discharging as the flushing liquor of cleaning fluid is provided with in the outside of substrate W.Identically with above-mentioned embodiment, with flushing liquor land in the center of substrate W nearby, the flushing liquor of land discharges flushing liquor towards the mode of the center flow of substrate W to single pipe nozzle 81.
As shown in Figure 31 is clear and definite, atomizing nozzle 86 is located near 2FJ nozzle 59, near the center of substrate W compared with 2FJ nozzle 59, and is located at the upstream side of the direction of rotation of substrate W compared with 2FJ nozzle 59.Atomizing nozzle 86 is conical spray pattern (conespray) nozzles, coniform ground spray liquor.From atomizing nozzle 86 spray liquid relative to the position land (liquid) immediately below 2FJ nozzle 59 in the upstream side of the rotation relative to substrate W.
As shown in figure 32, atomizing nozzle 86 is arranged a little obliquely towards 2FJ nozzle 59.As described above, be located at the central side of substrate W due to atomizing nozzle 86 relative to 2FJ nozzle 59 and be located at the upstream side of the rotation relative to substrate W, so from atomizing nozzle 86 towards the outside of substrate W, and the downstream spray liquor of rotation relative to substrate W.
The meaning of liquid is provided to be described about arranging atomizing nozzle 86 near 2FJ nozzle 59.A meaning is: provide fresh liquid all the time by near the position of colliding to injection stream and the substrate W from 2FJ nozzle 59, thus the particle being risen (lift up) by liquid from the surface of substrate W is promptly removed by the flowing of injection stream, or by the physical action of injection stream, the particle departed from from substrate W surface can not be again attached to substrate W by the effect of liquid be removed.A meaning is also had to be the effect preventing substrate W charged.By liquid and gas and vapor permeation being generated injection stream in 2FJ nozzle 59, and blow to the surface of substrate W and clean the surface of substrate W, if but now use ultra-pure water (DIW) as liquid, then injection stream and substrate W surface collision and cause the surface of substrate W charged.Therefore, in order to avoid so charged, in prior art, carbon dioxide water is employed as the liquid for generating injection stream.But this carbon dioxide water is compared with ultra-pure water, and cost is high.
In the present embodiment, atomizing nozzle 86 is set near 2FJ nozzle 59, near the cleaning position that injection stream and substrate surface are collided, provides liquid.Liquid itself has electric conductivity, when adopting such liquid, even if the liquid sprayed from 2FJ nozzle 59 does not adopt carbon dioxide water and adopts the ultra-pure water (DIW) that such as cost compare is cheap, also can reduce or prevent that (because liquid has electric conductivity) substrate W's is charged.
In addition, in the present embodiment, atomizing nozzle 86 on arm is sprayed a little obliquely to the direction towards the cleaning position based on 2FJ nozzle 59, so the cleaning position also can collided to injection stream and substrate W provides liquid fully due to identical with the 11st embodiment.In addition, in the present embodiment, because atomizing nozzle 86 also tilts towards the outside of the radial direction of substrate W, so the liquid of spraying from atomizing nozzle 86 can be discharged towards the outer rim of substrate W swimmingly by the centrifugal force based on the rotation of substrate W.
Figure 33 is the top view of the cleaning device in the variation of the 12nd embodiment.In this variation, in the outside of substrate W, single pipe nozzle is not set, and is provided with atomizing nozzle 71.This atomizing nozzle 71 towards the center spraying flushing liquor of substrate W, and land region be set to from the center of substrate W nearby to center, the flushing liquor of land is towards the center flow of substrate W.
In addition, in the above-described embodiment, at the arranged outside single pipe nozzle 81 of substrate W, in this variation, at the arranged outside atomizing nozzle 71 of substrate W, but because the liquid sprayed from 2FJ nozzle 59 expands from eject position towards whole direction, so the liquid sprayed from 2FJ nozzle 59 when 2FJ nozzle 59 moves to the outer rim of substrate W also arrives the center of substrate W, even if not in the drying that the arranged outside cleaning fluid of substrate W provides nozzle also can prevent near the central authorities of substrate W.Therefore, in this case, the structure that nozzle is not provided at the arranged outside cleaning fluid of the periphery of substrate W separately outside atomizing nozzle 86 on arm can also be adopted.
(the 13rd embodiment)
Figure 34 is the top view of the cleaning device in the 13rd embodiment of the present invention, and Figure 35 is the partial enlarged drawing of Figure 34, and Figure 36 is the figure of the length direction of view 57 from the side.In the cleaning device of present embodiment, also identically with the 12nd embodiment, be provided with 2FJ nozzle 59 in the leading section of arm 57.In addition, in the present embodiment, also identically with the 12nd embodiment, arm 57 is provided with spraying as atomizing nozzle 87 on the arm of the liquid of cleaning fluid.
In addition, the single pipe nozzle 81 of discharging as the flushing liquor of cleaning fluid is provided with in the outside of substrate W.Identically with above-mentioned embodiment, with flushing liquor land in the center of substrate W nearby, the flushing liquor of land discharges flushing liquor towards the mode of the center flow of substrate W to single pipe nozzle 81.
As shown in Figure 35 is clear and definite, atomizing nozzle 87 is located near 2FJ nozzle 59, near the center of substrate W compared with 2FJ nozzle 59, and is located at the downstream of the direction of rotation of substrate W compared with 2FJ nozzle 59.Atomizing nozzle 87 is conical spray pattern nozzles, coniform ground spray liquor.From atomizing nozzle 87 spray liquid relative to the position land (liquid) immediately below 2FJ nozzle 50 in the downstream of the rotation relative to substrate W.
As shown in figure 36, atomizing nozzle 87 is arranged a little obliquely towards 2FJ nozzle 59.As described above, because atomizing nozzle 87 to be located at the central side of substrate W relative to 2FJ nozzle 59, and be located at the downstream of the rotation relative to substrate W, so from atomizing nozzle 87 towards the outside of substrate W, and the upstream side spray liquor of rotation relative to substrate W.
Liquid is provided by arranging atomizing nozzle 87 near 2FJ nozzle 59, also can reduce or prevent that substrate W's is charged when employing ultra-pure water (DIW) as the liquid jointly sprayed from 2FJ nozzle 59 and gas, this is identical with the 12nd embodiment.In the present embodiment, further, by atomizing nozzle 87 being located at compared with 2FJ nozzle 59 downstream of the direction of rotation of substrate W, and following favourable effect is obtained.
As described above, atomizing nozzle 87 is located near 2FJ nozzle 59, near the cleaning position that the gas sprayed from 2FJ nozzle 59 and the injection stream of liquid and the upper surface of substrate W are collided, liquid is provided from atomizing nozzle 87, if but the liquid layer provided from atomizing nozzle 87 at cleaning position becomes blocked up, then liquid layer becomes bed course (cushion), causes the cleaning of the upper surface of the substrate W carried out based on injection stream to become insufficient sometimes.
Therefore, in the present embodiment, be configured at the downstream of the direction of rotation of substrate W compared with the cleaning position of the injection stream based on 2FJ nozzle 59 based on the land region of atomizing nozzle 87.Thus, the liquid being provided to the upper surface of substrate W from atomizing nozzle 87 by the rotation of substrate W by from cleaning position to away from direction carry.Therefore, at cleaning position, liquid layer can not become blocked up, also can reduce or avoid insufficient cleaning that the bed course effect based on liquid layer causes.
In addition, in the present embodiment, also identically with the 12nd embodiment, because the outside of atomizing nozzle 87 towards the radial direction of substrate W tilts, so the outer rim of the liquid of spraying from atomizing nozzle 87 towards substrate W can be discharged swimmingly by the centrifugal force based on the rotation of substrate W.In addition, in the 12nd, the 13rd embodiment, arm 57 is provided with spraying as atomizing nozzle 86 or 87 on the arm of the liquid of cleaning fluid, but also can replaces atomizing nozzle and the single pipe nozzle providing liquid is set.
Figure 37 is the top view of the cleaning device in the variation of the 13rd embodiment.In this variation, in the outside of substrate W, single pipe nozzle is not set, but is provided with atomizing nozzle 71.This atomizing nozzle 71 is arranged to: towards the center spraying flushing liquor of substrate W, and land region from the center of substrate W nearby to center, the flushing liquor of land is towards the center flow of substrate W.Other structure is same as described above.
In addition, in the present embodiment, also identically with the 12nd embodiment, following structure can be set to: when the liquid sprayed from 2FJ nozzle 59 arrives the center to substrate W, arm does not provide nozzle at the arranged outside cleaning fluid of substrate W outside atomizing nozzle 87 separately.
(the 14th embodiment)
Figure 38 is the top view of the cleaning device in the 14th embodiment of the present invention.In the cleaning device of present embodiment, be provided with 2FJ nozzle 59 in the leading section of arm 57, but washer jet on arm is not set.The single pipe nozzle 83 of discharging as the liquid of cleaning fluid is provided with in the outside of substrate W.This single pipe nozzle 83 is identical with above-mentioned embodiment, and with liquid land in the center of substrate W nearby, the liquid of land discharges liquid towards the mode of the center flow of substrate W.Therefore, form the liquid stream of liquid at the immediate vicinity of substrate W, do not precipitate at the immediate vicinity liquid of substrate W.
Figure 39 is the top view of the cleaning device in the variation of the 14th embodiment of the present invention.In this variation, replace single pipe nozzle 83 and use spraying as the atomizing nozzle 73 of the liquid of cleaning fluid.This atomizing nozzle 73 is set to: towards the center spray liquor of substrate W, and land region from the center of substrate W nearby to center, the liquid of land is towards the center flow of substrate W.When employing such atomizing nozzle 73, also prevent and precipitate at the immediate vicinity liquid of substrate W.
(the 15th embodiment)
Figure 40 is the side view of the cleaning device in the 15th embodiment of the present invention.In the present embodiment, another side (leading section) that at one end can be supported on the arm 57 of pillar 56 is rotatably provided with 2FJ nozzle 59 '.This 2FJ nozzle 59 ' be not above-mentioned embodiment like that towards vertical, but to be obliquely installed towards the outside of the radial direction of substrate W.
Cleaning device according to the present embodiment, the liquid comprised due to injection stream has the flowing outside the radial direction of substrate W and collides with substrate W, so flow with the liquid of the upper surface collision rift of the substrate W outer rim towards substrate W, also interact with the centrifugal force of the rotation based on substrate W, discharge from the outer rim of substrate W swimmingly.
In addition, also identically with the 12nd or the 13rd embodiment, washer jet on arm can be together set with the 2FJ nozzle 59 ' of above-mentioned formation.In addition, in above-mentioned, describe when using 2FJ nozzle and arranging washer jet on arm, might not need to arrange the nozzle that cleaning fluid is provided from the outside of substrate W towards the center of substrate W, but as in the present embodiment, when 2FJ nozzle 59 ' towards the radial direction of substrate W outside tilt, because the flowing towards the center of substrate W of the liquid that sprays from 2FJ nozzle 59 ' dies down, so identically with above-mentioned embodiment, wish at arranged outside more than one atomizing nozzle 81 of substrate W and/or single pipe nozzle 71.
(the 16th embodiment)
Figure 41 is the stereogram of the cleaning device of the 16th embodiment of the present invention.The form of a stroke or a combination of strokes cleaning device 80 ' of present embodiment, has: as 4 main shafts 51 of substrate rotation mechanism identically with the form of a stroke or a combination of strokes cleaning device 80 illustrated with reference to Figure 24; The pillar 56 extended along vertical that can be elevated; One end can be installed on the leading section of pillar 56 rotatably, and the arm 57 extended in the horizontal direction; The columned form of a stroke or a combination of strokes cleaning part 58 of the lower surface of the other end of arm 57 can be installed on rotatably.
The form of a stroke or a combination of strokes cleaning device 80 ' of present embodiment is configured with to be positioned at and is supported by main shaft 51 and the top of the substrate W making it rotate, and providing cleaning fluid cleaning fluid to provide nozzle 88 to the surface of substrate W, this cleaning fluid provides the mouth that provides of nozzle 88 to become upper and lower two-stage.The cleaning fluid of present embodiment provides two of nozzle 88 atomizing nozzles providing mouth 5411,5412 to be fan shape ground spray rinse.
As shown in figure 41, the cleaning fluid providing mouth 5412 to provide from higher level is along the scanning area SA land of form of a stroke or a combination of strokes cleaning part 58 in the upstream side of scanning area SA.The cleaning fluid land providing mouth 5411 to provide from subordinate are positioned at upstream compared with the land region providing mouth 5412 with higher level and the region extended along the radial direction of substrate W.This subordinate provides the land region of mouth 5411 less than the center reaching substrate W, but arrives the periphery of substrate W.
In above-mentioned several embodiment, describing two cleaning fluids provides nozzle to be adjacent to the example arranged, when being adjacent to arrange a cleaning fluid and providing nozzle as these example, cleaning fluid each other easily sent interference in land before the upper surface of substrate W, was not easy for avoiding the adjustment of this interference.On the other hand, as in the present embodiment, there is upper and lower two-stage provide mouth cleaning fluid to provide nozzle by using, the degree of difficulty of such a adjustment can be avoided, provide cleaning fluid with the upper surface of mutually non-interfering mode from two to substrate W.
In addition, in the present embodiment, cleaning fluid provides two of nozzle 88 to provide mouth 5411,5412 all to play a role as the atomizing nozzle of fan shape ground spray rinse, but be not limited thereto, both can one be single pipe nozzle another be atomizing nozzle, can be also both single pipe nozzle.On above-mentioned arm, cleaning fluid provides nozzle to be all located at the lower surface of arm 57, but on arm, cleaning fluid provides nozzle also can be placed on the side of arm or the face of front.In addition, cleaning fluid provides nozzle 88 also can be have the multistage nozzles providing more than 3 grades of mouth of more than three.In addition, multiple cleaning fluids providing mouth to provide identical respectively of nozzle 88 both can be provided from cleaning fluid, mutually different cleaning fluid (such as, liquid and flushing liquor) also can be provided.
In addition, in the 1st ~ 16th embodiment, describe the cleaning device carrying out cleaning in CMP operation, but cleaning device of the present invention is also applicable to the imageing sensor manufacturing processes such as such as flat-plate panel manufacturing process, CMOS or CCD, MRAM magnetic film manufacturing process etc.
And in the 1st ~ 16th embodiment, make substrate W keep in the horizontal direction and rotate, but cleaning device of the present invention is not limited thereto, the surface of substrate W also can keep obliquely from horizontal direction and rotate.In addition, substrate rotation mechanism is also not limited to and forms based on many main shafts, also can be the chuck member of the peripheral part with multiple maintenance substrate, the structure that these chuck member rotate using the central shaft of substrate as rotating shaft, can also be the holding station (table) with staging substrates W, the structure that holding station rotates using the central shaft of substrate as rotating shaft.
Industrial applicibility
The present invention is at the central part of substrate, to the inertia force flowed in the direction with substrate level, cleaning fluid is flowed by the cleaning fluid of discharging from the 1st single pipe nozzle, in the outside of the central part of substrate, by the centrifugal force of the rotation based on substrate, cleaning fluid is flowed towards the periphery of substrate, so have the effect of the whole radius flowing that cleaning fluid can be made at substrate, provide cleaning fluid as the surface to substrates such as the semiconductor wafers rotated while the cleaning device etc. of cleaning substrate is useful.
Description of reference numerals
10: housing; 12: load port; 14a ~ 14d: grinding unit; 16: the 1 cleaning units; 18: the 2 cleaning units; 20: drying unit; 22: the 1 conveying mechanical arms; 24: supply unit; 26: the 2 conveying mechanical arms; 41,43: single pipe nozzle; 42,44,45: atomizing nozzle; 50: rolling cleaning device; 51: main shaft; 51a: block; 52: top rolling cleaning part (rolling sponge); 53: bottom rolling cleaning part (rolling sponge); 54,55: cleaning fluid provides nozzle; 56: pillar; 57: arm; 58: form of a stroke or a combination of strokes cleaning part; 59,59 ': double-fluid spraying nozzle; 61,63: single pipe nozzle; 62,64: atomizing nozzle; 66,67: atomizing nozzle; 71 ~ 74: atomizing nozzle; 80,80 ': form of a stroke or a combination of strokes cleaning device; 81,83: single pipe nozzle; 82,84: atomizing nozzle; 85,86,87: atomizing nozzle (on arm); 88: cleaning fluid provides nozzle (two-stage).
Claims (20)
1. a cleaning device, is characterized in that,
Have: keep substrate and with the central shaft of described substrate for rotating shaft and make the substrate rotation mechanism that described substrate rotates; Upper surface towards the described substrate kept by described substrate rotation mechanism discharges the 1st single pipe nozzle of the 1st cleaning fluid,
Described 1st single pipe nozzle to make described 1st cleaning fluid land in the center of described substrate nearby, and makes described 1st cleaning fluid of land discharge described 1st cleaning fluid at the upper surface of described substrate towards the mode of the center flow of described substrate,
The described 1st cleaning fluid liquid of the upper surface falling behind in described substrate of discharging from described 1st single pipe nozzle flows through the center of described substrate.
2. cleaning device according to claim 1, is characterized in that,
The discharge direction of described 1st single pipe nozzle is less than 45 degree relative to the incidence angle of the upper surface of described substrate.
3. cleaning device according to claim 1 and 2, is characterized in that,
From described 1st cleaning fluid at the landing positions of described substrate to the distance at the center of described substrate than radius 1/3rd little of described substrate.
4. cleaning device according to claim 1 and 2, is characterized in that,
Also there is atomizing nozzle, this atomizing nozzle towards the described substrate kept by described substrate rotation mechanism upper surface spraying the 2nd cleaning fluid,
The discharge of described 1st cleaning fluid undertaken by described 1st single pipe nozzle and the spraying of described 2nd cleaning fluid undertaken by described atomizing nozzle are carried out simultaneously.
5. cleaning device according to claim 4, is characterized in that,
The landing positions of described 2nd cleaning fluid is positioned at the upstream side of the direction of rotation of described substrate compared with the landing positions of described 1st cleaning fluid.
6. cleaning device according to claim 4, is characterized in that,
In described atomizing nozzle, spray amount is the center of the maximum maximum direction of spray amount close described substrate from spraying off-centring.
7. cleaning device according to claim 6, is characterized in that,
Described atomizing nozzle is the 2nd cleaning fluid described in the roughly length range internal spraying of the radius of described substrate, the center of the maximum direction of described spray amount towards described substrate or the immediate vicinity of described substrate.
8. cleaning device according to claim 1, is characterized in that,
Also have the 2nd single pipe nozzle, the 2nd single pipe nozzle discharges the 3rd cleaning fluid towards the upper surface of the described substrate kept by described substrate rotation mechanism,
Described 2nd single pipe nozzle exceedes the center of described substrate and land to make described 3rd cleaning fluid, and discharges described 3rd cleaning fluid from landing positions towards the mode of the periphery of described substrate flowing,
Distance from the landing positions of described 3rd cleaning fluid to the center of described substrate is larger than the distance from the landing positions of described 1st cleaning fluid to the center of described substrate, and the landing positions of described 3rd cleaning fluid is positioned at the downstream of the direction of rotation of described substrate relative to the landing positions of described 1st cleaning fluid.
9. cleaning device according to claim 1 and 2, is characterized in that,
Also have rolling cleaning part, this rolling cleaning part linearly extends in the roughly length range of the diameter of described substrate, around the central shaft rotation parallel with described substrate while contact with the upper surface slide of described substrate,
Described 1st single pipe nozzle makes described 1st cleaning fluid land be involved in side region in the rolling of described rolling cleaning part.
10. cleaning device according to claim 9, is characterized in that,
The discharge direction of described 1st single pipe nozzle and the bearing of trend angulation of described rolling cleaning part are 90 degree ± 30 degree under overlooking.
11. cleaning devices according to claim 9, is characterized in that,
Also have the nozzle providing the 4th cleaning fluid, the surface that this nozzle releases the described rolling cleaning part of side region to the rolling being positioned at described rolling cleaning part directly provides the 4th cleaning fluid.
12. cleaning devices according to any one of claim 1,2,8, is characterized in that,
Also there is form of a stroke or a combination of strokes cleaning part, this form of a stroke or a combination of strokes cleaning part is supported in the front end of arm, around the central shaft rotation with described substrate transverse, and contacted while mobile with the upper surface slide of described substrate in from the center of described substrate to peripheral extent by the rotation of described arm
Described 1st single pipe nozzle makes described 1st cleaning fluid land in the upstream side of the direction of rotation of the described substrate compared with the motion track of described form of a stroke or a combination of strokes cleaning part.
13. cleaning devices according to any one of claim 1,2,8, is characterized in that,
Also have:
Be supported in the front end of arm, the form of a stroke or a combination of strokes cleaning part of the movement in from the center of described substrate to peripheral extent by the rotation of described arm or double-fluid spraying nozzle; With
On arm, cleaning fluid provides nozzle, and on this arm, cleaning fluid provides nozzle to be located at described arm, and the upper surface to described substrate near described form of a stroke or a combination of strokes cleaning part or described double-fluid spraying nozzle provides cleaning fluid.
14. cleaning devices according to claim 13, is characterized in that,
On described arm, cleaning fluid provides nozzle to provide the mode of cleaning fluid to tilt towards what undertaken by described form of a stroke or a combination of strokes cleaning part or described double-fluid spraying nozzle to the cleaning position of described substrate.
15. cleaning devices according to claim 13, is characterized in that,
Form of a stroke or a combination of strokes cleaning part described in end bearing before described arm,
On described arm, cleaning fluid provides nozzle to be located at the upstream side of the direction of rotation of described substrate relative to described form of a stroke or a combination of strokes cleaning part.
16. cleaning devices according to claim 13, is characterized in that,
Double-fluid spraying nozzle described in end bearing before described arm,
On described arm, cleaning fluid provides nozzle to be located at the downstream of the direction of rotation of described substrate relative to described double-fluid spraying nozzle.
17. cleaning devices according to claim 13, is characterized in that,
On described arm cleaning fluid provide nozzle with undertaken by described form of a stroke or a combination of strokes cleaning part or described double-fluid spraying nozzle to the position being located at the center near described substrate compared with the cleaning position of described substrate.
18. 1 kinds of cleaning devices, is characterized in that,
Have: keep substrate and with the central shaft of described substrate for rotating shaft and make the substrate rotation mechanism that described substrate rotates; Upper surface towards the described substrate kept by described substrate rotation mechanism is fan sprayed the atomizing nozzle of the 2nd cleaning fluid,
In described atomizing nozzle, spray amount is the center of the maximum maximum direction of spray amount close described substrate from spraying off-centring.
19. 1 kinds of cleaning devices, is characterized in that,
Have: keep substrate and with the central shaft of described substrate for rotating shaft and make the substrate rotation mechanism that described substrate rotates; Upper surface towards the described substrate kept by described substrate rotation mechanism discharges the 1st single pipe nozzle of the 1st cleaning fluid; Towards the atomizing nozzle of upper surface spraying the 2nd cleaning fluid of the described substrate kept by described substrate rotation mechanism,
The discharge of described 1st cleaning fluid undertaken by described 1st single pipe nozzle and the spraying of described 2nd cleaning fluid undertaken by described atomizing nozzle are carried out simultaneously.
20. 1 kinds of cleaning methods, with the central shaft of substrate for rotating shaft and make described substrate rotate, and discharge the 1st cleaning fluid towards the upper surface of described substrate, it is characterized in that,
In the center of described substrate nearby, the liquid on the upper surface of the described substrate after land flows through the center of described substrate to described 1st cleaning fluid land.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010450792.8A CN111589752B (en) | 2014-04-01 | 2015-04-01 | Cleaning device |
| CN201811309797.8A CN109647769B (en) | 2014-04-01 | 2015-04-01 | Cleaning device |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014075712 | 2014-04-01 | ||
| JP2014-075712 | 2014-04-01 | ||
| JP2015042868A JP6600470B2 (en) | 2014-04-01 | 2015-03-04 | Cleaning device and cleaning method |
| JP2015-042868 | 2015-03-04 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811309797.8A Division CN109647769B (en) | 2014-04-01 | 2015-04-01 | Cleaning device |
| CN202010450792.8A Division CN111589752B (en) | 2014-04-01 | 2015-04-01 | Cleaning device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104971916A true CN104971916A (en) | 2015-10-14 |
| CN104971916B CN104971916B (en) | 2020-07-07 |
Family
ID=54269198
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010450792.8A Active CN111589752B (en) | 2014-04-01 | 2015-04-01 | Cleaning device |
| CN201510151490.XA Active CN104971916B (en) | 2014-04-01 | 2015-04-01 | Cleaning device and cleaning method |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010450792.8A Active CN111589752B (en) | 2014-04-01 | 2015-04-01 | Cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN111589752B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107527846A (en) * | 2017-09-28 | 2017-12-29 | 上海强华实业有限公司 | A kind of Rapid Cleaning groove for being used for 12 cun of wafers |
| CN108649006A (en) * | 2018-06-04 | 2018-10-12 | 中国科学院微电子研究所 | Wafer cleaning device and wafer cleaning method |
| CN111715584A (en) * | 2019-03-21 | 2020-09-29 | 三星电子株式会社 | Substrate cleaning apparatus and substrate processing system including the same |
| CN112657921A (en) * | 2020-12-23 | 2021-04-16 | 上海集成电路研发中心有限公司 | Cleaning device and cleaning method for deep hole and deep groove |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6815799B2 (en) * | 2016-09-13 | 2021-01-20 | 東京エレクトロン株式会社 | Substrate processing equipment and substrate processing method |
| JP2019220560A (en) * | 2018-06-19 | 2019-12-26 | キオクシア株式会社 | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
| CN118073239B (en) * | 2024-02-27 | 2024-12-20 | 无锡海浥半导体科技有限公司 | Method for cleaning silicon wafer using multi-nozzle progressive silicon wafer cleaning device |
Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4027686A (en) * | 1973-01-02 | 1977-06-07 | Texas Instruments Incorporated | Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water |
| JPH04287922A (en) * | 1991-01-22 | 1992-10-13 | Dainippon Screen Mfg Co Ltd | Rotation-system surface treatment method and rotation-system surface treatment device for application of said method |
| JPH1147665A (en) * | 1997-07-29 | 1999-02-23 | Dainippon Screen Mfg Co Ltd | Replacement mechanism of treating liquid and substrate treating device having this replacement mechanism |
| JP2000084811A (en) * | 1998-09-16 | 2000-03-28 | Tokyo Seimitsu Co Ltd | Wafer chamfering device |
| US20020007840A1 (en) * | 2000-07-21 | 2002-01-24 | Koji Atoh | Substrate cleaning apparatus, substrate cleaning method and substrate processing apparatus |
| JP2002151455A (en) * | 2000-08-31 | 2002-05-24 | Super Silicon Kenkyusho:Kk | Cleaning apparatus for semiconductor wafer |
| TW513760B (en) * | 2000-02-29 | 2002-12-11 | Tokyo Electron Ltd | Liquid processing apparatus and method |
| US20030015216A1 (en) * | 2001-07-16 | 2003-01-23 | Tom Nicolosi | Megasonic cleaner probe system with gasified fluid |
| JP2003109936A (en) * | 2001-09-28 | 2003-04-11 | Dainippon Screen Mfg Co Ltd | Substrate peripheral edge treatment device and method therefor |
| JP2005223149A (en) * | 2004-02-05 | 2005-08-18 | Fuji Electric Holdings Co Ltd | Wiping/cleaning unit, unit and method for inspecting smudge |
| CN1947227A (en) * | 2004-04-23 | 2007-04-11 | 东京毅力科创株式会社 | Substrate cleaning method, substrate cleaning equipment, computer program and program recording medium |
| JP2007173277A (en) * | 2005-12-19 | 2007-07-05 | Fujitsu Ltd | Spin cleaning apparatus and wafer cleaning method |
| CN101745865A (en) * | 2008-11-28 | 2010-06-23 | 细美事有限公司 | Substrate polishing apparatus and method of polishing substrate using the same |
| CN101877305A (en) * | 2005-04-19 | 2010-11-03 | 株式会社荏原制作所 | Substrate processing apparatus |
| JP2011066322A (en) * | 2009-09-18 | 2011-03-31 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus and method for processing substrate |
| CN102013389A (en) * | 2009-09-03 | 2011-04-13 | 芝浦机械电子装置股份有限公司 | Substrate processing apparatus and substrate processing method |
| CN102773240A (en) * | 2011-05-10 | 2012-11-14 | 南亚科技股份有限公司 | Wafer cleaning device after chemical mechanical polishing |
| TW201424936A (en) * | 2012-12-28 | 2014-07-01 | Ebara Corp | Substrate cleaning apparatus |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11102885A (en) * | 1997-09-29 | 1999-04-13 | Dainippon Screen Mfg Co Ltd | Substrate treatment device and method |
| JP3395696B2 (en) * | 1999-03-15 | 2003-04-14 | 日本電気株式会社 | Wafer processing apparatus and wafer processing method |
| US20030192570A1 (en) * | 2002-04-11 | 2003-10-16 | Applied Materials, Inc. | Method and apparatus for wafer cleaning |
| JP2005032948A (en) * | 2003-07-11 | 2005-02-03 | Sansha Electric Mfg Co Ltd | Method for cleaning semiconductor wafer and cleaning device |
| JP2005183937A (en) * | 2003-11-25 | 2005-07-07 | Nec Electronics Corp | Manufacturing method of semiconductor device and cleaning device for removing resist |
| JP2005327807A (en) * | 2004-05-12 | 2005-11-24 | Sony Corp | Sheet type washing apparatus and its washing method |
| JP4502854B2 (en) * | 2005-03-22 | 2010-07-14 | 株式会社高田工業所 | Substrate processing apparatus and processing method |
| JP2007273608A (en) * | 2006-03-30 | 2007-10-18 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus and substrate processing method |
| JP2008016660A (en) * | 2006-07-06 | 2008-01-24 | Dainippon Screen Mfg Co Ltd | Method for treating substrate and substrate treating apparatus |
| KR20080012626A (en) * | 2006-08-04 | 2008-02-12 | 삼성전자주식회사 | Fluid injection nozzle and fluid injection device having the same |
| CN202275804U (en) * | 2011-06-29 | 2012-06-13 | 彩虹（佛山）平板显示有限公司 | Rinsing bath spray nozzle of wet etching machine for manufacturing liquid crystal and organic light emitting diode (OLED) panels |
| CN102319686B (en) * | 2011-08-26 | 2015-04-08 | 上海华虹宏力半导体制造有限公司 | Wafer cleaning device and wafer cleaning method |
| JP5886224B2 (en) * | 2012-05-23 | 2016-03-16 | 株式会社荏原製作所 | Substrate cleaning method |
-
2015
- 2015-04-01 CN CN202010450792.8A patent/CN111589752B/en active Active
- 2015-04-01 CN CN201510151490.XA patent/CN104971916B/en active Active
Patent Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4027686A (en) * | 1973-01-02 | 1977-06-07 | Texas Instruments Incorporated | Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water |
| JPH04287922A (en) * | 1991-01-22 | 1992-10-13 | Dainippon Screen Mfg Co Ltd | Rotation-system surface treatment method and rotation-system surface treatment device for application of said method |
| JPH1147665A (en) * | 1997-07-29 | 1999-02-23 | Dainippon Screen Mfg Co Ltd | Replacement mechanism of treating liquid and substrate treating device having this replacement mechanism |
| JP2000084811A (en) * | 1998-09-16 | 2000-03-28 | Tokyo Seimitsu Co Ltd | Wafer chamfering device |
| TW513760B (en) * | 2000-02-29 | 2002-12-11 | Tokyo Electron Ltd | Liquid processing apparatus and method |
| US20020007840A1 (en) * | 2000-07-21 | 2002-01-24 | Koji Atoh | Substrate cleaning apparatus, substrate cleaning method and substrate processing apparatus |
| JP2002151455A (en) * | 2000-08-31 | 2002-05-24 | Super Silicon Kenkyusho:Kk | Cleaning apparatus for semiconductor wafer |
| US20030015216A1 (en) * | 2001-07-16 | 2003-01-23 | Tom Nicolosi | Megasonic cleaner probe system with gasified fluid |
| JP2003109936A (en) * | 2001-09-28 | 2003-04-11 | Dainippon Screen Mfg Co Ltd | Substrate peripheral edge treatment device and method therefor |
| JP2005223149A (en) * | 2004-02-05 | 2005-08-18 | Fuji Electric Holdings Co Ltd | Wiping/cleaning unit, unit and method for inspecting smudge |
| CN1947227A (en) * | 2004-04-23 | 2007-04-11 | 东京毅力科创株式会社 | Substrate cleaning method, substrate cleaning equipment, computer program and program recording medium |
| CN101877305A (en) * | 2005-04-19 | 2010-11-03 | 株式会社荏原制作所 | Substrate processing apparatus |
| JP2007173277A (en) * | 2005-12-19 | 2007-07-05 | Fujitsu Ltd | Spin cleaning apparatus and wafer cleaning method |
| CN101745865A (en) * | 2008-11-28 | 2010-06-23 | 细美事有限公司 | Substrate polishing apparatus and method of polishing substrate using the same |
| CN102013389A (en) * | 2009-09-03 | 2011-04-13 | 芝浦机械电子装置股份有限公司 | Substrate processing apparatus and substrate processing method |
| JP2011066322A (en) * | 2009-09-18 | 2011-03-31 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus and method for processing substrate |
| CN102773240A (en) * | 2011-05-10 | 2012-11-14 | 南亚科技股份有限公司 | Wafer cleaning device after chemical mechanical polishing |
| TW201424936A (en) * | 2012-12-28 | 2014-07-01 | Ebara Corp | Substrate cleaning apparatus |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107527846A (en) * | 2017-09-28 | 2017-12-29 | 上海强华实业有限公司 | A kind of Rapid Cleaning groove for being used for 12 cun of wafers |
| CN108649006A (en) * | 2018-06-04 | 2018-10-12 | 中国科学院微电子研究所 | Wafer cleaning device and wafer cleaning method |
| CN108649006B (en) * | 2018-06-04 | 2021-11-05 | 中国科学院微电子研究所 | Wafer cleaning device and wafer cleaning method |
| CN111715584A (en) * | 2019-03-21 | 2020-09-29 | 三星电子株式会社 | Substrate cleaning apparatus and substrate processing system including the same |
| CN111715584B (en) * | 2019-03-21 | 2023-10-31 | 三星电子株式会社 | Substrate cleaning apparatus and substrate processing system including the same |
| CN112657921A (en) * | 2020-12-23 | 2021-04-16 | 上海集成电路研发中心有限公司 | Cleaning device and cleaning method for deep hole and deep groove |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104971916B (en) | 2020-07-07 |
| CN111589752A (en) | 2020-08-28 |
| CN111589752B (en) | 2023-02-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102513280B1 (en) | Cleaning apparatus and wafer cleaning method | |
| CN104971916A (en) | Cleaning apparatus and cleaning method | |
| US20230405762A1 (en) | Substrate processing apparatus | |
| US20170263471A1 (en) | Substrate cleaning apparatus | |
| CN111446150B (en) | Substrate processing method and substrate processing apparatus | |
| CN101833250B (en) | Developing device and developing method | |
| KR20150004751A (en) | Substrate cleaning apparatus and substrate cleaning method | |
| WO2013133401A1 (en) | Substrate processing method and substrate processing apparatus | |
| US20140352608A1 (en) | Substrate processing apparatus | |
| JP6877221B2 (en) | Substrate cleaning equipment, substrate cleaning method and control method of substrate cleaning equipment | |
| TWI610359B (en) | Substrate cleaning apparatus and substrate cleaning method | |
| CN219233267U (en) | Wafer post-processing device | |
| JP6934918B2 (en) | Substrate cleaning equipment | |
| JP6431159B2 (en) | Substrate cleaning device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |