CN104971908B - Testing, sorting machine and its propulsion device, test pallet and test machine interface board - Google Patents
Testing, sorting machine and its propulsion device, test pallet and test machine interface board Download PDFInfo
- Publication number
- CN104971908B CN104971908B CN201510144784.XA CN201510144784A CN104971908B CN 104971908 B CN104971908 B CN 104971908B CN 201510144784 A CN201510144784 A CN 201510144784A CN 104971908 B CN104971908 B CN 104971908B
- Authority
- CN
- China
- Prior art keywords
- semiconductor element
- test
- insertion piece
- terminal
- propeller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 200
- 239000004065 semiconductor Substances 0.000 claims abstract description 149
- 238000005259 measurement Methods 0.000 claims abstract description 47
- 238000003780 insertion Methods 0.000 claims description 39
- 230000037431 insertion Effects 0.000 claims description 39
- 230000005611 electricity Effects 0.000 claims description 6
- 238000007689 inspection Methods 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims 4
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000013256 coordination polymer Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004153 renaturation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2644—Adaptations of individual semiconductor devices to facilitate the testing thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to a kind of testing, sorting machine and its propulsion devices, test pallet and test machine interface board.Testing, sorting machine according to the present invention has contact portion, the contact portion is in electrical contact with the surface of semiconductor element with the sheet resistance for measuring semiconductor element, test machine has measurement terminal with interface board, which can be electrically connected with contact portion and export the signal that can be used for measuring the sheet resistance of semiconductor element.Wherein, the contact portion of testing, sorting machine can also be provided in the accessory of propulsion device or test pallet etc.According to the present invention, since the sheet resistance of semiconductor element can also measure, the reliability of test can be improved.
Description
Technical field
The present invention relates to a kind of testing, sorting machine of test for being used in semiconductor element, as the accessory of testing, sorting machine
Propulsion device and test pallet and test machine interface board.
Background technique
The semiconductor element of manufacture is electrically connected to test machine by testing, sorting machine.In addition, testing, sorting machine is tied according to test
Fruit and semiconductor element is classified.About testing, sorting machine can refer to KR published patent 2012-0106320 (hereinafter,
Referred to as " the first citation ") etc..
In order to which semiconductor element is electrically connected to test machine, testing, sorting machine has test pallet and propulsion device.
Test pallet can bearing semiconductor element.Semiconductor element is placed in the insertion piece for being provided to test pallet.
As recorded in KR published patent 10-2011-0011462 (hereinafter referred to as " the second citation "), insertion piece, which has, to be used for
The locking devicen of the semiconductor element of fixed in position.Locking devicen (is named as " latching portion in the second citation by truck dead lever
Part ") and elastomeric element (" return spring " is named as in the second citation) composition.Truck dead lever is solid by forward and reverse rotation
Determine semiconductor element or release to fix.Elastomeric element is elastic towards the positive direction of the fixed semiconductor element of truck dead lever is applied
Power.It should be noted that when truck dead lever releases the fixation to semiconductor element, by means of special open system to fixed thick stick
The external force of bar application opposite direction.
Propulsion device pushes the semiconductor element for being carried on test pallet and semiconductor element is made to be electrically connected to test machine
Interface board.As recorded in the first citation, propulsion device by propeller (being named as in the first citation " propulsion unit "),
Propeller arranging plate (" arranging plate " is named as in the first citation) and moving source are constituted.Propeller is used for and interface board
Test jack is opposite and supports semiconductor element or pressurizes to semiconductor element.Propeller arranging plate is provided with propeller.It moves
Dynamic source is mobile to interface board for making propeller arranging plate, or moves propeller arranging plate in the opposite direction.
Interface board is usually with the combinations of states that separates with the main body of test machine in testing, sorting machine.As South Korea disclose it is practical
Recorded in novel No. 2009-0002814, interface board has the test jack that can be electrically connected with semiconductor element.Therefore, it obtains
The semiconductor element of support or the pressurization of propeller is electrically connected to test jack.
What reference Fig. 2 that the relationship of the test pallet, propulsion device and interface board can refer to the first citation was carried out
Explanation.
In addition, by extraneous electric effect maloperation may be occurred for semiconductor element.Such problems may be with
The closeness of electronic component increases and frequently occurs.In particular, recently due to need to realize electronic product multiplicity function,
The closeness of electronic component is higher.Therefore, shielding processing is carried out to the surface of semiconductor element.The surface of semiconductor element into
The shielded layer of row processing protects semiconductor element from derived from the extraneous adverse effect electrically acted on.That is, passing through the screen of ground connection
It covers layer and eliminates extraneous electrical effect.
A kind of method of production shielded layer is exactly the surface for utilizing relatively thin metal plate and covering semiconductor element.However,
Technique using metal plate covering semiconductor component surfaces is cumbersome, so that production efficiency be made to reduce.
Another method for making shielded layer is then that the surface of semiconductor element is coated using conductive material.This method
Simple process and productivity is good.However, the trouble for being difficult to confirm will be encountered if there is coating is bad.
Bad will not test the electrology characteristic of semiconductor element is coated to have an impact.Therefore, test passes but coat not
Good semiconductor element may be applied to electronic product.In the case, coating is bad may expand as electronic product certainly
Body it is bad.
Summary of the invention
It can confirm during checking the electrology characteristic of semiconductor element the purpose of the present invention is to provide one kind and partly lead
Whether the surface of volume elements part properly forms the technology of shielded layer.
A kind of testing, sorting machine propulsion device according to the present invention, comprising: propeller, with the interface for being provided to test machine
The test jack of plate is opposite and supports semiconductor element, so that semiconductor element is electrically connected to the test jack；Propeller
Arranging plate, for the propeller to be arranged；Moving source, for keeping the propeller arranging plate mobile to the interface board；Contact
Terminal is contacted with the surface for the semiconductor element for being electrically connected to the test jack by the propeller；And connection electricity
Road, for the contact terminal to be electrically connected to measurement terminal, which exports the surface for measuring semiconductor element
The signal of resistance.
The contact terminal and connection circuit may be disposed at the propeller.
The testing, sorting machine propulsion device can also include: connection terminal, for the contact terminal to be electrically connected
In test jack, wherein the contact terminal is electrically connected by the connection circuit with the connection terminal.
A kind of testing, sorting machine according to the present invention characterized by comprising test pallet can be used in placement and partly lead
Volume elements part, and scheduled closed path is circulated in by means of multiple transfer devices；Loading attachment, for filling semiconductor element
Carry (loading) Yu Suoshu test pallet；The test pallet is pushed to the interface board of test machine by propulsion device, so that by
Test machine is electrically connected in the semiconductor element that the loading attachment is loaded on the test pallet；And discharge mechanism,
(unloading) semiconductor element is unloaded from the test pallet of the semiconductor element loaded being completed, wherein described
Propulsion device is the testing, sorting machine propulsion device with the contact terminal and connection circuit.
A kind of test machine interface board according to the present invention, comprising: test jack is electrically connected to semiconductor element；Socket
Arranging plate, for the test jack to be arranged；And measurement terminal, export the letter for measuring the sheet resistance of semiconductor element
Number.
The measurement terminal may be disposed at the test jack.
The measurement terminal can also by with the test jack it is mutually independent in a manner of be set to the socket arranging plate.
The connecting pin that the surface of semiconductor element is contacted in the measurement terminal can be bent or revolve by means of external force
Turn, in the case, additionally it is possible to realize elastic recovery.
A kind of testing, sorting machine test pallet according to the present invention, comprising: insertion piece, semiconductor element can be disposed by having
The resettlement groove of part；Frame is set, and for the insertion piece to be arranged, the insertion piece includes: insertion piece main body, is formed with the peace
Set slot；Truck dead lever is fixed for the semiconductor element for being placed in the resettlement groove to be fixed on the resettlement groove or release, and
The surface of semiconductor element is electrically connected to measurement terminal, which exports the sheet resistance for measuring semiconductor element
Signal；And the direction that semiconductor element is fixed to the resettlement groove is applied elasticity by elastomeric element, Xiang Suoshu truck dead lever
Power, the truck dead lever include: fixing end, and the semiconductor element for being placed in the resettlement groove is fixed on the resettlement groove or solution
Except fixation, and it is contacted with when semiconductor element is fixed the surface of semiconductor element；And contact jaw, it is contacted with measurement end
Son, the measurement terminal export the signal for measuring the sheet resistance of semiconductor element.
A kind of testing, sorting machine according to the present invention characterized by comprising test pallet can dispose semiconductor element
Part, and scheduled closed path is circulated in by means of multiple transfer devices；Loading attachment loads semiconductor element
(loading) Yu Suoshu test pallet；The test pallet is pushed to the interface board of test machine by propulsion device, so that by means of
The loading attachment and the semiconductor element for being loaded on the test pallet is electrically connected to test machine；And discharge mechanism, it uses
(unloading) semiconductor element is unloaded in the test pallet being completed from the semiconductor element loaded, wherein institute
Stating test pallet is the testing, sorting machine test pallet with the truck dead lever for including the contact jaw.
According to the present invention, the screen of semiconductor component surfaces can be confirmed during checking the electrology characteristic of semiconductor element
Cover whether layer is appropriately formed.Therefore, it has the following technical effect that
First, the reliability of test can be improved.
Second, since the inspection of shielded layer executes together with the inspection of electrology characteristic, need not move through special inspection
Look into process.
Detailed description of the invention
Fig. 1 is the general view about testing, sorting machine and interface board according to the present invention.
Fig. 2 is about the general view applied in the test pallet of the testing, sorting machine of Fig. 1.
Fig. 3 and Fig. 4 is the schematic diagram of the characteristic about the first embodiment of the present invention.
Fig. 5 and Fig. 6 is the schematic diagram of the characteristic about the second embodiment of the present invention.
Fig. 7 and Fig. 8 is the schematic diagram of the characteristic about the third embodiment of the present invention.
Fig. 9 is about the figure applied in another variation of the connecting pin of the test jack of the interface board of Fig. 7.
Figure 10 and Figure 11 is the schematic diagram of the characteristic about the fourth embodiment of the present invention.
Figure 12 is the schematic configuration diagram about testing, sorting machine according to the present invention, measuring machine and interface board.
Figure 13 indicates that the contact terminal as contact portion is arranged at the example in other accessories of testing, sorting machine.
Symbol description
100: testing, sorting machine 110: test pallet
111: insertion piece
111a: truck dead lever 111b: elastomeric element
111c: insertion piece main body
S: resettlement groove HP: fixing end
CP: contact jaw 112: setting frame
120: loading attachment 150: propulsion device
151: propeller 152: propeller arranging plate
153: moving source 170: discharge mechanism
CT: contact terminal CC: connection circuit
200: interface board 210: test jack
220: socket arranging plate
MT: measurement terminal MTa: connecting pin
Specific embodiment
With reference to Detailed description of the invention preferred embodiment in accordance with the present invention.In order to illustrate it is brevity, as far as possible omit or reduce weight
Renaturation explanation.
<to the explanation of the essential structure of testing, sorting machine and interface board>
Fig. 1 is the general view to testing, sorting machine 100 and interface board 200 according to the present invention.
Testing, sorting machine 100 includes test pallet 110, loading attachment 120, equal hot cell (SOAKCHAMBER) 130, test
Room (TEST CHAMBER) 140, propulsion device 150 move back equal hot cell (DESOAK CHAMBER) 160, discharge mechanism 170 etc..
Test pallet 110 is along via " loaded " position (LOADING POSITION) LP, test position (TEST
POSITION) TP, unloading position (UNLOADING POSITION) UP closed path C and recycle.Such test pallet 110
Semiconductor element can be mounted with.As seen in the plan view of figure 2, test pallet 110 includes multiple insertion pieces 111 and setting frame
112.Multiple insertion pieces 111 are set to setting frame 112.Semiconductor element is placed in the resettlement groove S of insertion piece 111.Certainly,
It can be as recorded in background technique, insertion piece 111 has truck dead lever and elastomeric element.
Loading attachment 120 is by client's pallet CT1Semiconductor element load (loading) in the test support of " loaded " position LP
Disk 110.
Equal hot cell 130 is used for according to test condition and to the semiconductor element in the test pallet 110 of " loaded " position LP
Part is preheated or is pre-chilled.
Test cabinet 140 is used to come the semiconductor element in the test pallet 110 of test position TP to by equal hot cell 130
Part is tested.
The test pallet 110 being located in test cabinet 140 is pushed to the interface board 200 of test machine by propulsion device 150.Accordingly,
The semiconductor element for being carried on test pallet 110 is electrically connected to interface board 200.Certainly, as recorded in background technique,
Propulsion device 150 has propeller, propeller arranging plate and moving source 153.
Equal hot cell 160 is moved back for making the semiconductor element in the test pallet 110 from test cabinet 140 revert to room temperature.
Discharge mechanism 170 is used to unload (unloading) from the test pallet for moving back equal hot cell 160 and coming unloading position UP
Semiconductor element in 110.At this point, semiconductor element is classified respectively by test grade and is loaded by discharge mechanism 170
Client's pallet CT2、CT3、CT4。
Be formed in the shielded layer on the surface of semiconductor element it is bad whether can also by measure resistance confirm.That is,
Or actually can according to confirm below more than the sheet resistance standard value of semiconductor element standard value the bad of shielded layer with
It is no.
Therefore, testing, sorting machine 100 can also have the contact portion on the surface that can be in electrical contact with semiconductor element.It connects
Contact portion divides the sheet resistance for measuring semiconductor element.Such contact portion is also formed in test pallet to the property of can choose
110 or propulsion device 150 etc accessory in.
When testing, sorting machine 100 has the contact portion for measuring sheet resistance, the sort operation of discharge mechanism 170
It can diversification.For example, being judged as undesirable semiconductor element in electrology characteristic test can be classified in symbol in Fig. 1
For CT3Client's pallet, sheet resistance measurement in be judged as undesirable semiconductor element can be classified in symbol be CT4's
Client's pallet, being judged as undesirable semiconductor element in sheet resistance measurement and electrology characteristic test can be classified in symbol
Number be CT5Client's pallet.It is of course also possible to do not distinguish electrology characteristic test in it is bad whether and sheet resistance measurement in
It is bad whether, but only classify according to whether generally bad.
In addition, interface board 200 includes test jack 210 and socket arranging plate 220.
Test jack 210 has the multiple calibrating terminals for the leading-out terminal for being electrically connected to semiconductor element.
Socket arranging plate 220 is provided with test jack 210.
In addition, interface board 200 according to the present invention can also have measurement terminal.Measurement terminal output is partly led for measuring
The signal of the sheet resistance of volume elements part.Such measurement terminal can be to be equipped in the form of playing needle (pogo pin).
The specific embodiment of testing, sorting machine 100 and interface board 200 with essential structure as described above is said
It is bright.
<first embodiment>
Fig. 3 is the schematic diagram to the characteristic of first embodiment.
In the present embodiment, contact portion is set to the propeller 151 of propulsion device 150, and measurement terminal MT, which is set to, to be connect
The test jack 210 of oralia 200.
Propeller 151 is provided with contact terminal CT and connection circuit CC.Wherein, contact terminal CT and connection circuit CC be with
For in the contact portion of testing, sorting machine 100.
Contact terminal CT is contacted with the surface of semiconductor element D.Contact terminal CT can be to be equipped in the form of playing needle.
Connection circuit CC is used to for contact terminal CT being electrically connected to the measurement terminal MT of interface board 200.
Fig. 4 indicates that semiconductor element D is electrically connected to the state of test jack 210.
The leading-out terminal OT for being placed in the semiconductor element D of insertion piece 111 is electrically connected to the calibrating terminal of test jack 210
TT.In addition, the contact terminal CT for being set to propeller 151 is contacted with the surface of semiconductor element D, measurement terminal MT is contacted with company
Meet circuit CC.Then, the test of the electrology characteristic to semiconductor element and sheet resistance is realized together by means of test machine.
<second embodiment>
Fig. 5 is the schematic diagram to the characteristic of second embodiment.
In the present embodiment, the truck dead lever 111a of insertion piece 111 is utilized as contact portion.Here, truck dead lever
111a is the contact portion for being provided to testing, sorting machine 100.
Truck dead lever 111a is made of the metal of conductive material.Such truck dead lever 111a is on the basis of point of rotation LP
And there is fixing end HP and contact jaw CP in two sides.
Fixing end HP in the semiconductor element D of the resettlement groove S of insertion piece main body 111c or releases fixation for fixed in position.
Certainly, elastomeric element 111b applies elasticity to truck dead lever 111a towards the direction that semiconductor element D is fixed on to resettlement groove S
Power.In addition, fixing end HP is contacted with the surface of semiconductor element.
Contact jaw CP is prominent to the outside of resettlement groove S.Such contact jaw CP with measurement terminal MT for contacting.
Fig. 6 indicates that semiconductor element D is electrically connected to the state of test jack 210.That is, the measurement terminal MT of interface board 200
The surface of semiconductor element D can be connected to by truck dead lever 111a.
It should be noted that truck dead lever 111a can also be realized as follows: being only contacted with part and the contact of semiconductor element D
It is conductive material in the part of measurement terminal MT, and there is wiring for connecting two sides.That is, as long as truck dead lever can be made
The surface of semiconductor element D is electrically connected by 111a with measurement terminal MT.
<3rd embodiment>
Fig. 7 is the schematic diagram to the characteristic of 3rd embodiment.
This embodiment is characterized in that the measurement terminal MT of interface board 200.
Measurement terminal MT has connecting pin MTa in end.Opposite direction remains inclined to two connecting pin MTa towards each other
State.
Fig. 8 shows the states that semiconductor element D is electrically connected to test jack 210.
In the present embodiment, insertion piece 111 is mobile to 210 side of test jack by means of propeller 151 and to connecting pin
MTa applies external force.Then, connecting pin MTa is directly connected in the surface of semiconductor element D.
The situation of connecting pin MTa elastic recovery after bending is assumed in the present embodiment.However, it is also possible to such as Fig. 9 institute
Show, the connecting pin MTa for being configured to measurement terminal MT is rotated by means of external force, realizes elasticity followed by return spring RS
It restores.
<fourth embodiment>
Figure 10 is the schematic diagram to the characteristic of fourth embodiment.
In the present embodiment, also there is the connection terminal LT for the propeller arranging plate 152 for being set to propulsion device 150.Even
Connecting terminal LT is electrically connected by connection circuit CC with the contact terminal CT for being set to propeller 151.In addition, measurement terminal MT is set
It is placed in the socket arranging plate 220 of interface board 200.Here, connection terminal LT and measurement terminal MT are located at mutual corresponding position.In
It is that measurement terminal MT is arranged to mutually indepedent with test jack 210.It is, of course, preferable to ground, multiple connection terminal LT or multiple surveys
Amount terminal MT is constituted respectively with a socket binding.
Figure 11 indicates that semiconductor element D is electrically connected to the state of test jack 210.
The contact terminal CT for being set to propeller 151 is contacted with the surface of semiconductor element D, and measurement terminal MT is connected to
Connecting terminal LT.Certainly, contact terminal CT and connection terminal LT is connected by connecting circuit CC.
In the present embodiment, contact terminal CT, connection circuit CC and connection terminal LT, which become, is provided to testing, sorting machine
100 contact portion.
In each embodiment, contact fault, contact terminal CT and measurement terminal MT can for example be adopted in order to prevent
With Kelvin probe (Kelvin probe) structure.
In addition, the first embodiment, second embodiment and fourth embodiment may be selectively applied to test point
Select machine 100.
It should be noted that the electrology characteristic test and semiconductor element to semiconductor element is executed together in the embodiment shown
The situation of the sheet resistance measurement of part is illustrated.However, also executing semiconductor to the property of can choose according to the utilization of equipment
The sheet resistance measurement of element and the electrology characteristic of semiconductor element are tested.That is, can both use the electricity of parallel semiconductor element
Learn characteristic test and sheet resistance measurement operational mode, can also using only selection semiconductor element an electrology characteristic test and
Sheet resistance measurement one of and execute operational mode.
In addition, each embodiment assumes that test machine exports electrology characteristic test signal and sheet resistance together
The measurement situation of signal.
However, the measuring machine different from test machine (TESTER) is equipped with according to performance with being also shown in Fig.12
(RTA).Measuring machine exports the signal for measuring the sheet resistance of semiconductor element.In such an example, it is disclosed in first
The contact portion of the testing, sorting machine 100 of embodiment, second embodiment, fourth embodiment is related to measuring machine (RTA).Therefore,
Interface board 200 does not have measurement terminal.
Also, each embodiment is only formed in the example of test pallet 110 or propulsion device 150 to contact portion
It is illustrated.However, contact portion also can be set in other accessories of testing, sorting machine 100 according to performance.When
So, contact portion can also be made to be separately formed independently of the existing component of testing, sorting machine 100.For example, as shown in figure 13, it can
So that the pick-up P for being provided to loading attachment or discharge mechanism has contact terminal CT.Wherein, pick-up P is to be picked up by vacuum
It takes and grasps semiconductor element D or release the element of grasping.In the embodiment shown in fig. 13, the electricity of semiconductor element D is special
Property test and sheet resistance measurement be not performed simultaneously, but independently executed across time interval.
As described above, embodiment completion in conjunction with the accompanying drawings illustrates of the invention.However, the implementation
Example is the preferred embodiment of the present invention.It is thus impossible to be construed as limited to the embodiment described.
Claims (6)
1. a kind of testing, sorting machine propulsion device characterized by comprising
Propeller, the test jack with the interface board for being provided to test machine is opposite and supports the insertion piece for being placed in test pallet
Semiconductor element, so that semiconductor element is electrically connected to the test jack, the test pallet is by setting frame and inserts
Enter part composition, and is recycled along closed path；
Propeller arranging plate, for the propeller to be arranged；
Moving source, for keeping the propeller arranging plate mobile to the interface board；
Contact terminal is set to the propeller, and is contacted with by the propeller and is electrically connected to the test jack
The surface of semiconductor element；And
Circuit is connected, the propeller is set to, for the contact terminal to be electrically connected to the survey for being set to the interface board
The measurement terminal of socket is tried, which exports the signal for measuring the resistance of the shielded layer of semiconductor component surfaces,
The insertion piece includes: insertion piece main body, is formed with the resettlement groove for disposing semiconductor element；Truck dead lever is used for
The semiconductor element for being placed in the resettlement groove is fixed on the resettlement groove；And elastomeric element, Xiang Suoshu truck dead lever will
The direction that semiconductor element is fixed to the resettlement groove applies elastic force,
In the state that semiconductor element is fixed on the resettlement groove by the truck dead lever, the insertion piece is arranged in
Between the propeller and the test jack,
The contact terminal is electrically connected by the insertion piece with the connection circuit,
The leading-out terminal for being placed in the semiconductor element of the insertion piece is electrically connected to the calibrating terminal of the test jack, the survey
Amount terminal is electrically connected to the connection circuit, to test the electrology characteristic and surface electricity of semiconductor element simultaneously by test machine
Resistance, therefore can judge whether electrology characteristic is bad and whether formation of shielded layer is bad.
2. a kind of testing, sorting machine propulsion device characterized by comprising
Propeller, the test jack with the interface board for being provided to test machine is opposite and supports the insertion piece for being placed in test pallet
Semiconductor element, so that semiconductor element is electrically connected to the test jack, the test pallet is by setting frame and inserts
Enter part composition, and is recycled along closed path；
Propeller arranging plate, for the propeller to be arranged；
Moving source, for keeping the propeller arranging plate mobile to the interface board；
Contact terminal is set to the propeller, and is contacted with by the propeller and is electrically connected to the test jack
The surface of semiconductor element；And
Connection terminal, for the contact terminal to be electrically connected to the measurement terminal of the interface board, the measurement terminal output
For measuring the signal of the resistance of the shielded layer of semiconductor component surfaces；
Circuit is connected, is electrically connected the contact terminal and the connection terminal, and be set to the propeller arranging plate,
The insertion piece includes: insertion piece main body, is formed with the resettlement groove for disposing semiconductor element；Truck dead lever is used for
The semiconductor element for being placed in the resettlement groove is fixed on the resettlement groove；And elastomeric element, Xiang Suoshu truck dead lever will
The direction that semiconductor element is fixed to the resettlement groove applies elastic force,
In the state that semiconductor element is fixed on the resettlement groove by the truck dead lever, the insertion piece is arranged in
Between the propeller and the test jack,
The leading-out terminal for being placed in the semiconductor element of the insertion piece is electrically connected to the calibrating terminal of the test jack, the survey
Amount terminal is contacted with the connection terminal, to test the electrology characteristic and surface electricity of semiconductor element simultaneously by test machine
Resistance, therefore can judge whether electrology characteristic is bad and whether formation of shielded layer is bad.
3. a kind of testing, sorting machine characterized by comprising
Test pallet can be used in disposing semiconductor element, and be circulated in scheduled closure road by means of multiple transfer devices
Diameter, and be made of setting frame and insertion piece；
Loading attachment, for semiconductor element to be loaded into the test pallet；
The test pallet is pushed to the interface board of test machine by propulsion device, so as to be loaded by means of the loading attachment
Test machine is electrically connected in the semiconductor element of the test pallet；And
Discharge mechanism unloads semiconductor element from the test pallet of the semiconductor element loaded being completed,
Wherein, the propulsion device is the testing, sorting machine propulsion device as described in any one in claims 1 or 2.
4. a kind of test machine interface board characterized by comprising
Test jack is electrically connected to the semiconductor element for being formed with shielded layer；
Socket arranging plate, for the test jack to be arranged；And
Measurement terminal, output are formed with the signal of the sheet resistance of the semiconductor element of shielded layer on surface for measuring,
So as to carry out electrology characteristic inspection to the semiconductor element for being formed with shielded layer and to the shielded layer
Sheet resistance measurement,
The semiconductor element in the state of being placed in the insertion piece of test pallet, make the leading-out terminal of semiconductor element with
The test jack electrical connection, the test pallet is made of setting frame and insertion piece, and is recycled along closed path,
The insertion piece includes: insertion piece main body, is formed with the resettlement groove for disposing semiconductor element；Truck dead lever is used for
The semiconductor element for being placed in the resettlement groove is fixed on the resettlement groove；And elastomeric element, Xiang Suoshu truck dead lever will
The direction that semiconductor element is fixed to the resettlement groove applies elastic force,
The measurement terminal is electrically connected to the shielded layer by the propeller of propulsion device or the insertion piece of test pallet, from
And makes the semiconductor element for being placed in the insertion piece by test machine while testing the electrology characteristic and surface electricity of semiconductor element
Resistance, therefore can judge whether electrology characteristic is bad and whether formation of shielded layer is bad,
The measurement terminal is set to the test jack.
5. a kind of testing, sorting machine test pallet characterized by comprising
Insertion piece has the resettlement groove that can dispose semiconductor element；
Frame is set, for the insertion piece to be arranged,
The insertion piece includes:
Insertion piece main body is formed with the resettlement groove；
Truck dead lever is fixed for the semiconductor element for being placed in the resettlement groove to be fixed on the resettlement groove or release, and
The surface of semiconductor element is electrically connected to measurement terminal, which exports the sheet resistance for measuring semiconductor element
Signal；And
The direction that semiconductor element is fixed to the resettlement groove is applied elastic force by elastomeric element, Xiang Suoshu truck dead lever,
The truck dead lever includes:
The semiconductor element for being placed in the resettlement groove is fixed on the resettlement groove or released and fixed, and partly led by fixing end
Volume elements part is contacted with the surface of semiconductor element when being fixed；And
Contact jaw is contacted with measurement terminal, which exports the resistance for measuring the shielded layer of semiconductor component surfaces
Signal,
The leading-out terminal for being placed in the semiconductor element of the insertion piece is electrically connected to the calibrating terminal of the test jack, the survey
Terminal and the contact end in contact are measured, thus test the electrology characteristic and sheet resistance of semiconductor element simultaneously by test machine,
Therefore can judge whether electrology characteristic is bad and whether formation of shielded layer is bad.
6. a kind of testing, sorting machine characterized by comprising
Test pallet can dispose semiconductor element, and be circulated in scheduled closed path by means of multiple transfer devices；
Semiconductor element is loaded into the test pallet by loading attachment；
The test pallet is pushed to the interface board of test machine by propulsion device, so as to be loaded by means of the loading attachment
Test machine is electrically connected in the semiconductor element of the test pallet；And
Discharge mechanism, for unloading semiconductor element from the test pallet of the semiconductor element loaded being completed,
Wherein, the test pallet is testing, sorting machine test pallet as claimed in claim 5.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140042815A KR102102830B1 (en) | 2014-04-10 | 2014-04-10 | Test handler, pushing device and test tray for testhandler, interface board for tester |
| KR10-2014-0042815 | 2014-04-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104971908A CN104971908A (en) | 2015-10-14 |
| CN104971908B true CN104971908B (en) | 2019-04-19 |
Family
ID=54269190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510144784.XA Active CN104971908B (en) | 2014-04-10 | 2015-03-30 | Testing, sorting machine and its propulsion device, test pallet and test machine interface board |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102102830B1 (en) |
| CN (1) | CN104971908B (en) |
| TW (1) | TWI549219B (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102470315B1 (en) * | 2016-01-29 | 2022-11-25 | (주)테크윙 | Insert for test handler |
| KR102473315B1 (en) * | 2016-02-19 | 2022-12-02 | (주)테크윙 | Pushing apparatus of handler for testing electronic devices |
| KR102664951B1 (en) * | 2016-09-09 | 2024-05-10 | (주)테크윙 | Handler for testing electronic devices |
| CN107931154B (en) * | 2016-10-13 | 2019-07-26 | 泰克元有限公司 | Electronic component test sorting machine and its taught point method of adjustment |
| TWI631066B (en) * | 2016-12-23 | 2018-08-01 | 典泰科技股份有限公司 | Bundling mechanism for strapping Tray disc fixing strap |
| CN108325863B (en) * | 2018-01-19 | 2019-10-18 | 温州职业技术学院 | Sorting device of comprehensive test equipment for semiconductor refrigeration chips |
| CN109013402B (en) * | 2018-09-26 | 2020-08-07 | 通富微电子股份有限公司 | Semiconductor test system, test sorting machine and test machine |
| KR102642193B1 (en) | 2018-10-24 | 2024-03-05 | 삼성전자주식회사 | Device and method for testing semiconductor device and test handler |
| KR102760368B1 (en) * | 2018-12-11 | 2025-02-03 | (주)테크윙 | Handler for testing electronic components |
| KR102185035B1 (en) * | 2019-07-02 | 2020-12-01 | 세메스 주식회사 | Semiconductor package test apparatus |
| JP6685526B1 (en) * | 2019-10-11 | 2020-04-22 | ハイソル株式会社 | Prober device and measuring jig |
| KR102738205B1 (en) * | 2020-03-13 | 2024-12-03 | 삼성전자주식회사 | Circuit testing device |
| KR102144806B1 (en) * | 2020-04-24 | 2020-08-14 | 티씨에스 주식회사 | Socket for electronic component testing apparatus |
| KR20210156053A (en) * | 2020-06-17 | 2021-12-24 | (주)테크윙 | Handling system for testing electronic component |
| CN116273994B (en) * | 2023-05-26 | 2023-07-21 | 北京京瀚禹电子工程技术有限公司 | Electrical equipment aging test equipment with intelligent feeding and sorting functions |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5325052A (en) * | 1990-11-30 | 1994-06-28 | Tokyo Electron Yamanashi Limited | Probe apparatus |
| CN101344571A (en) * | 2007-07-10 | 2009-01-14 | 三星电子株式会社 | Socket and test equipment and method using the same |
| CN103185858A (en) * | 2011-12-27 | 2013-07-03 | 泰克元有限公司 | Test sorting machine |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4018254B2 (en) * | 1998-08-20 | 2007-12-05 | 株式会社アドバンテスト | Testing method for electronic components |
| US6946866B2 (en) * | 2003-05-30 | 2005-09-20 | Lsi Logic Corporation | Measurement of package interconnect impedance using tester and supporting tester |
| JP4767147B2 (en) * | 2005-11-16 | 2011-09-07 | パナソニック株式会社 | Inspection apparatus and inspection method |
| JP2008076308A (en) * | 2006-09-22 | 2008-04-03 | Advantest Corp | Interface device for electronic component test equipment |
| KR101532952B1 (en) * | 2010-06-23 | 2015-07-01 | (주)테크윙 | Method for unloading semiconductor device in testhandler |
-
2014
- 2014-04-10 KR KR1020140042815A patent/KR102102830B1/en active Active
-
2015
- 2015-03-30 CN CN201510144784.XA patent/CN104971908B/en active Active
- 2015-04-01 TW TW104110738A patent/TWI549219B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5325052A (en) * | 1990-11-30 | 1994-06-28 | Tokyo Electron Yamanashi Limited | Probe apparatus |
| CN101344571A (en) * | 2007-07-10 | 2009-01-14 | 三星电子株式会社 | Socket and test equipment and method using the same |
| CN103185858A (en) * | 2011-12-27 | 2013-07-03 | 泰克元有限公司 | Test sorting machine |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201539637A (en) | 2015-10-16 |
| KR20150117732A (en) | 2015-10-21 |
| KR102102830B1 (en) | 2020-04-23 |
| TWI549219B (en) | 2016-09-11 |
| CN104971908A (en) | 2015-10-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104971908B (en) | Testing, sorting machine and its propulsion device, test pallet and test machine interface board | |
| US7800391B2 (en) | Apparatus for testing a chip and methods of making and using the same | |
| KR20220126247A (en) | Carrier based high volume system level testing of devices with pop structures | |
| WO2006039395A3 (en) | Method for testing semiconductor devices and an apparatus therefor | |
| WO2011082180A3 (en) | Test systems and methods for testing electronic devices | |
| GB2413642A (en) | Electrical circuit testing device | |
| US20130113513A1 (en) | Test apparatus of semiconductor package and methods of testing the semiconductor package using the same | |
| US20140070828A1 (en) | Method and apparatus for massively parallel multi-wafer test | |
| US8922233B2 (en) | Apparatus for testing a semiconductor device and method of testing a semiconductor device | |
| US20070205753A1 (en) | Test handler automatic contactor cleaner methods and surrogate cleaning device | |
| CN104889077A (en) | Sorting machine for test of semiconductor member and testing support method of the sorting machine | |
| WO2004008163A3 (en) | Assembly for connecting a test device to an object to be tested | |
| KR102496532B1 (en) | Test apparatus for semiconductor package | |
| KR101954293B1 (en) | Test extend gender to test solid state disk | |
| CN100474577C (en) | Substrate and electrical testing method thereof | |
| US7330025B1 (en) | Touchdown counter for integrated circuit testers | |
| CN101452030A (en) | Testing device with switch element on socket substrate | |
| US9837747B2 (en) | Burn-in socket for packaged integrated circuits | |
| CN101471738B (en) | Test fixture | |
| TW200841026A (en) | A detecting device | |
| KR102287237B1 (en) | Insert assembly for receiving semiconductor device and test tray including the same | |
| JP2006332612A5 (en) | ||
| KR101388246B1 (en) | Semiconductor device test socket capable of testing wafer level package | |
| CN206531926U (en) | Testing device | |
| US20110254579A1 (en) | Semiconductor test method and semiconductor test system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |