CN104968164B - A kind of rigid-flexible combination PCB plate production method - Google Patents
A kind of rigid-flexible combination PCB plate production method Download PDFInfo
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- CN104968164B CN104968164B CN201510383829.9A CN201510383829A CN104968164B CN 104968164 B CN104968164 B CN 104968164B CN 201510383829 A CN201510383829 A CN 201510383829A CN 104968164 B CN104968164 B CN 104968164B
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- rigid
- alkali
- carried out
- acid
- resistance
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052802 copper Inorganic materials 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims abstract description 22
- 239000002253 acid Substances 0.000 claims abstract description 17
- 239000003292 glue Substances 0.000 claims abstract description 17
- 238000007747 plating Methods 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000007639 printing Methods 0.000 claims abstract description 7
- 239000000853 adhesive Substances 0.000 claims abstract description 5
- 230000001070 adhesive effect Effects 0.000 claims abstract description 5
- 238000012545 processing Methods 0.000 claims abstract description 5
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 8
- 238000011161 development Methods 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 5
- 239000003814 drug Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 abstract description 3
- 238000004590 computer program Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 241001232787 Epiphragma Species 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 231100000241 scar Toxicity 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention discloses a kind of rigid-flexible combination PCB plate production method, including step：A, the silk screen film is made, the region of oil level is more unilateral small 1mm than the slot that opens a window under silk screen；B, acid and alkali-resistance peelable glue printing is carried out, by windowing slot filling covering；C, baking processing is carried out, by the peelable adhesive curing of acid and alkali-resistance；D, heavy copper plating is carried out, tears acid and alkali-resistance peelable glue after the completion of plating.The present invention carries out peelable glue filling as a result of screen printing technique to windowing position, instead of manual rubberizing before, improves production efficiency so very big, reduces labor intensity；For different sizes, flexible region of different shapes can all carry out printing filling, without considering the match condition of gummed paper and flexible region geomery, so improving versatility.
Description
Technical field
The present invention relates to circuit board making technical field more particularly to a kind of rigid-flexible combination PCB plate production methods.
Background technology
The structure of rigid-flexible combination PCB is generally divided into two kinds, and one kind is flexible region in outermost layer, during another kind is for flexible region
Between.
In PCB manufacturing process, rigid plate with flex plate need to be made respectively, rigid-flex board is then passed through into adhesive sheet pressure again
It is combined, the flexure region in order to allow needs is exposed, and is generally made of following two modes（Using flex plate outer layer as
Example）：
Fenestration：It using numerically-controlled machine tool, is controlled by computer program, rigid plate correspondence need to be exposed into flex plate with gong knife
Region is cut away, and then presses together rigid plate and flex plate.
Take off lid method：It using numerically-controlled machine tool, is controlled by computer program, first by rigid-flexible combination boundary position, in rigid plate
The slot of cutting certain depth in advance, then presses together rigid plate and flex plate, routinely PCB rigid plates flow is fabricated into
Molding procedure, then rigid plate correspondence need to be exposed into the position of flex plate will lid on numerically-controlled machine tool by computer program using gong knife
Son is taken off.
The shortcomings that prior art is：
When using when the 1st, fenestration has pad exposing generally be directed to soft board region, but being exposed due to flexure region, in PCB
Flexible region is vulnerable to the attack of liquid medicine during wet process electroless copper plating, electro-coppering, and flexible region can also be deposited electric plated with copper,
Influence PCB soft board qualities；
2nd, fenestration produces, in order to avoid flexible region is common by liquid medicine attack and electric plated with copper, industry in plating
Method is：Red gummed paper is sticked in flexure region before plating, protects flexible region, but be the defects of the method：(1) efficiency is low, needs artificial
One piece of one piece of patch, and each flexible region must carry out manual rubberizing, production efficiency is very big with hand labor intensity；(2) each machine
Kind structure is different, the cause not of uniform size of flexible region, therefore each item number has to tailor and the matched red glue in flexible region by hand
Paper.
3rd, soft board position landless type plates are generally only used for using lid mode is taken off, by flexible region in PCB manufacturing process
Domain protects, and flow again takes protection cap off after completing, and exposes flexible region.
Therefore, the prior art has yet to be improved and developed.
Invention content
In view of above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a kind of rigid-flexible combination PCB plate production method,
Aim to solve the problem that the problem of existing rigid-flexible combination PCB plate production method efficiency is low, quality has much room for improvement.
Technical scheme is as follows：
A kind of rigid-flexible combination PCB plate production method, wherein, including step：
A, the silk screen film is made, the region of oil level is more unilateral small 1mm than the slot that opens a window under silk screen；
B, acid and alkali-resistance peelable glue printing is carried out, by windowing slot filling covering；
C, baking processing is carried out, by the peelable adhesive curing of acid and alkali-resistance；
D, heavy copper plating is carried out, tears acid and alkali-resistance peelable glue after the completion of plating.
The rigid-flexible combination PCB plate production method, wherein, the raw material in acid and alkali-resistance peelable glue is epoxy resin and chloroethene
Alkene copolymer.
The rigid-flexible combination PCB plate production method, wherein, in the step C, solidification temperature is 150 DEG C.
The rigid-flexible combination PCB plate production method, wherein, in the step C, hardening time is 30 minutes.
Advantageous effect：The present invention carries out peelable glue filling as a result of screen printing technique to windowing position, instead of before
Manual rubberizing, improve production efficiency so very big, reduce labor intensity；It is of different shapes to scratch for different sizes
Property area can all carry out printing filling, without considering the match condition of gummed paper and flexible region geomery, so improving versatility.
Description of the drawings
Fig. 1 is structure diagram when production method using the present invention makes rigid-flexible combination pcb board state.
Fig. 2 is structure diagram when production method using the present invention makes another state of rigid-flexible combination pcb board.
Specific embodiment
The present invention provides a kind of rigid-flexible combination PCB plate production method, to make the purpose of the present invention, technical solution and effect more
Add clear, clear and definite, the present invention is described in more detail below.It should be appreciated that specific embodiment described herein is only used
To explain the present invention, it is not intended to limit the present invention.
A kind of rigid-flexible combination PCB plate production method provided by the present invention, including step：
S101, the silk screen film is made, the region of oil level is more unilateral small 1mm than the slot that opens a window under silk screen；
S102, acid and alkali-resistance peelable glue printing is carried out, by windowing slot filling covering；
S103, baking processing is carried out, by the peelable adhesive curing of acid and alkali-resistance；
S104, heavy copper plating is carried out, tears acid and alkali-resistance peelable glue after the completion of plating.
Wherein in step S101, windowing slot refers to the flexible region of rigid-flexible combination pcb board, and the region of oil level is then under silk screen
It is more unilateral small 1mm than the windowing slot.
It in step s 102, will windowing slot filling covering using acid and alkali-resistance peelable glue.In acid and alkali-resistance peelable glue therein
Raw material is epoxy resin and vinyl chloride copolymer.Wherein, by mass percentage, epoxy resin accounts for 30%, and vinyl chloride copolymer accounts for
70%。
Further, in the step S103, solidification temperature is 150 DEG C.
Further, in the step S103, hardening time is 30 minutes.Under above-mentioned condition, solidification effect is preferable, acid and alkali-resistance
Peelable glue can be fitted tightly on rigid-flexible combination pcb board, while can conveniently be torn again after subsequent processing is carried out.
Finally carry out heavy copper electroplating processes：Can be specifically to carry out heavy copper, plate electricity, outer-layer circuit, graphic plating, erosion successively
Quarter, welding resistance etc..
Heavy copper refers to rigid-flexible combination pcb board carrying out copper-coating, one layer of thin copper layer of deposition；Heavy copper thickness can be 0.3 ~
0.7 μm, such as 0.5 μm.
Plate electricity refers to thicken by the thin copper layer that electric plating of whole board method makes heavy copper get on；
Then last layer light-sensitive surface is pasted on the rigid-flexible combination pcb board of the electricity of plate, contraposition exposure is carried out, reuses sodium carbonate
Unexposed photosensitive film development is fallen to form line pattern by liquid medicine；This step specifically includes：Nog plate, pad pasting, wet film coating, contraposition
Exposure, development.
After nog plate drying, sticking dry film, with ultraviolet exposure, the dry film side after exposure is hard, and meeting weak base cannot dissolve, and meet
Highly basic can dissolve, and unexposed portion is met weak base and can just be dissolved, thus can will be in pattern transfer to copper face.
Nog plate speed is 2.5 ~ 3.2mm/min（Such as 3 mm/min）, wear scar width is 8 ~ 14mm（Such as 12 mm/min）, mill
Plate post-baking temperature is 80 ~ 90 DEG C（Such as 85 DEG C）.
Pad pasting speed is 1.5m/min, and pad pasting pressure is 5kg/cm2, pad pasting temperature is 110 DEG C, and die temperature is 40 ~ 60
℃（Such as 50 DEG C）.
Wet film is coated with：Main control ink viscosity, coating speed, coating thickness etc., coating duration is that the first face is 5 ~ 10
Minute, the second face 10 ~ 20 minutes.
Exposure：Main control aligning accuracy, exposure energy, exposure light ruler（6 ~ 8 grades of epiphragmas）, residence time etc..
Development：Developing powder is 1.5 ~ 2.2m/min, and development temperature is 30 DEG C, and developer pressure is 1.4 ~ 2kg/cm2, development
Liquid is sodium carbonate liquid medicine（Sodium carbonate mass percent is 0.85 ~ 1.3%, such as 1%）.
In conclusion the present invention as a result of screen printing technique to windowing position when the filling of row peelable glue, instead of before
Manual rubberizing, has the following advantages：1st, it is very big to improve production efficiency, reduce labor intensity；2nd, for different rulers
Very little, flexible region of different shapes can all carry out printing filling, without considering further that the matching of gummed paper and flexible region geomery, institute
To improve versatility.
It should be understood that the application of the present invention is not limited to the above, it for those of ordinary skills, can
To be improved or converted according to the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Protect range.
Claims (1)
1. a kind of rigid-flexible combination PCB plate production method, which is characterized in that including step：
A, the silk screen film is made, the region of oil level is more unilateral small 1mm than the slot that opens a window under silk screen；
B, acid and alkali-resistance peelable glue printing is carried out, by windowing slot filling covering；
C, baking processing is carried out, by the peelable adhesive curing of acid and alkali-resistance；
D, heavy copper plating is carried out, tears acid and alkali-resistance peelable glue after the completion of plating；
Raw material in acid and alkali-resistance peelable glue is epoxy resin and vinyl chloride copolymer, and by mass percentage, epoxy resin accounts for
30%, vinyl chloride copolymer accounts for 70%；
In the step C, solidification temperature is 150 DEG C；
In the step C, hardening time is 30 minutes；
Heavy copper electroplating processes sink copper, plate electricity, outer-layer circuit, graphic plating, etching, welding resistance including step, and heavy copper refers to will be rigid-flexible
Copper-coating is carried out with reference to pcb board, deposits one layer of thin copper layer；Heavy copper thickness is 0.3 ~ 0.7 μm, and plate electricity refers to pass through electric plating of whole board
The thin copper layer that method makes heavy copper get on thickeies, and outer-layer circuit is the patch last layer light-sensitive surface on the rigid-flexible combination pcb board of the electricity of plate,
Contraposition exposure is carried out, sodium carbonate liquid medicine is reused and falls to be formed by unexposed photosensitive film development.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510383829.9A CN104968164B (en) | 2015-07-03 | 2015-07-03 | A kind of rigid-flexible combination PCB plate production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510383829.9A CN104968164B (en) | 2015-07-03 | 2015-07-03 | A kind of rigid-flexible combination PCB plate production method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104968164A CN104968164A (en) | 2015-10-07 |
| CN104968164B true CN104968164B (en) | 2018-07-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201510383829.9A Active CN104968164B (en) | 2015-07-03 | 2015-07-03 | A kind of rigid-flexible combination PCB plate production method |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106535507A (en) * | 2016-11-02 | 2017-03-22 | 江苏弘信华印电路科技有限公司 | Novel de-cap method of rigid-flex board |
| CN106659002A (en) * | 2017-01-07 | 2017-05-10 | 江西凯强实业有限公司 | Manufacturing process for rigid-flexible combined board for mobile phone camera |
| CN107072060A (en) * | 2017-05-25 | 2017-08-18 | 江门崇达电路技术有限公司 | A kind of method for solving thin plate circuit dog tooth |
| CN107708339A (en) * | 2017-09-26 | 2018-02-16 | 深圳明阳电路科技股份有限公司 | A kind of rigid-flex combined board window of flex preparation method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102970828A (en) * | 2012-11-30 | 2013-03-13 | 成都航天通信设备有限责任公司 | Method for manufacturing rigidity-flexibility combined printing circuit board |
| CN103369852A (en) * | 2013-05-08 | 2013-10-23 | 无锡江南计算技术研究所 | Manufacturing method for metallization blind slot-contained gold-plating plate surface pattern |
| CN103384444A (en) * | 2013-07-30 | 2013-11-06 | 博敏电子股份有限公司 | Rigid-flex printed circuit board capable of protecting inner layer windowing area and production method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0750455A (en) * | 1993-08-06 | 1995-02-21 | Mitsui Toatsu Chem Inc | Rigid flex printed wiring board and manufacturing method thereof |
| TWI304313B (en) * | 2006-05-25 | 2008-12-11 | Advanced Semiconductor Eng | Method for manufacturing a circuit board without incoming line |
-
2015
- 2015-07-03 CN CN201510383829.9A patent/CN104968164B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102970828A (en) * | 2012-11-30 | 2013-03-13 | 成都航天通信设备有限责任公司 | Method for manufacturing rigidity-flexibility combined printing circuit board |
| CN103369852A (en) * | 2013-05-08 | 2013-10-23 | 无锡江南计算技术研究所 | Manufacturing method for metallization blind slot-contained gold-plating plate surface pattern |
| CN103384444A (en) * | 2013-07-30 | 2013-11-06 | 博敏电子股份有限公司 | Rigid-flex printed circuit board capable of protecting inner layer windowing area and production method thereof |
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| CN104968164A (en) | 2015-10-07 |
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| CB03 | Change of inventor or designer information |
Inventor after: Wang Jun Inventor after: Fu Fengqi Inventor after: Xie Lunkui Inventor after: Liu Bin Inventor after: Zhang Chuanchao Inventor before: Wang Jun Inventor before: Xie Lunkui Inventor before: Liu Bin Inventor before: Zhang Chuanchao |
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