CN104955290A - Electronic module with two stacked printed circuit board elements, in particular for a transmission controller - Google Patents
Electronic module with two stacked printed circuit board elements, in particular for a transmission controller Download PDFInfo
- Publication number
- CN104955290A CN104955290A CN201510126224.1A CN201510126224A CN104955290A CN 104955290 A CN104955290 A CN 104955290A CN 201510126224 A CN201510126224 A CN 201510126224A CN 104955290 A CN104955290 A CN 104955290A
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- China
- Prior art keywords
- circuit board
- printed circuit
- board component
- electronic module
- frame element
- Prior art date
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- 230000005540 biological transmission Effects 0.000 title abstract description 12
- 239000000758 substrate Substances 0.000 claims description 7
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
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- 230000004308 accommodation Effects 0.000 abstract 1
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- 229910000679 solder Inorganic materials 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 6
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- 238000001816 cooling Methods 0.000 description 4
- 229920001169 thermoplastic Polymers 0.000 description 4
- 239000004416 thermosoftening plastic Substances 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
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- 238000010438 heat treatment Methods 0.000 description 2
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- 239000003921 oil Substances 0.000 description 2
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- 230000003628 erosive effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000010721 machine oil Substances 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
- F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
- F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention relates to an electronic module (1), which can be designed, for example, as a transmission control module for a motor vehicle. The first printed circuit board element (3), the frame element (5) and the cover element (7) enclose a receiving space (11) in a gas-tight manner. A first electronic component (9) is arranged on the first printed circuit board element (3), which are accommodated in the accommodation chamber (11) and protected. The electronic module (1) also has a second printed circuit board element (13) which has at least one further second electronic component (15) arranged thereon. The second printed circuit board element (13) is spaced apart from the first printed circuit board element (3) at least in some regions and is electrically connected to the first printed circuit board element (3), wherein at least a second electronic component (15) arranged on the second printed circuit board element (13) is arranged in the receiving space (11). The entire circuit can thus be arranged in a smaller installation space and the service life of the electronic module (1) is increased.
Description
Technical field
The present invention relates to a kind of electronic module, especially may be used for as it the actuator controller in automobile.
Prior art
Electronic module is usually used for design circuit, can implement different functions by means of this circuit.This circuit can be such as a part for controller at this.Especially in auto manufacturing, electronic module is used for providing motor vehicle controller.In the case, in an electronic module usually on a printed circuit board (PCB), also referred to as circuit board or PCB, arrange multiple electronic devices and components, they are electrically connected to each other suitably by means of conductor line.
Especially for the actuator controller in automobile, can advantageously, in certain region, arrange corresponding electronic module, it suffers Korrosionsmedium in this region.The electronic module of actuator controller such as can be arranged on vehicle transmission in-house in, especially the transmission oil of chemical corrosivity, foul or metal fillings may contact with electronic module herein.Because the some parts, conductor line etc. that are at least arranged on the parts on electronic module are responsive relative to this Korrosionsmedium or particle, therefore may need to protect them by the shell of tight seal.
Advise in DE102012213917A1, one for the electronic module of actuator controller at least a printed circuit board (PCB) is used for a part for this shell, wherein for the electronic devices and components of design circuit and conductor line be arranged in printed circuit board component on the surface that accommodating chamber points to and this accommodating chamber by means of outer cover or frame element and if desired by means of cap member hermetically relative to such as Korrosionsmedium sealing.
Summary of the invention
According to the embodiment of the present invention, advise a kind of electronic module, it improves the electronic module described in beginning especially in an advantageous manner.Especially can reduce the structure space of electronic module and/or extend the life-span of this electronic module.
Advise a kind of electronic module according to one aspect of the present invention, it has the first printed circuit board component, and it is with at least one the first electronic device, frame element and cap member disposed thereon.First printed circuit board component, frame element and cap member surround an accommodating chamber in this gas-tight seal.The feature of electronic module is, it has the second printed circuit board component, it is with at least one the second electronic device disposed thereon, wherein, second printed circuit board component at least in subregion with the first printed circuit board component separately and to be electrically connected with the first printed circuit board component and wherein, the second electric device is disposed in accommodating chamber in addition.
About the idea of the execution mode of the electronic module of advising herein, except other side, can be regarded as based on design described below and understanding:
Having realized that may need very large structure space for the electronic module containing complicated circuit.A large amount of electronic devices and components may to be needed in this electronic module to be arranged on a printed circuit board component and these electronic devices and components are such as connected with each other by means of conductor line.Routinely, all electronic devices and components are arranged on the surface of an only printed circuit board component in the case, and therefore this printed circuit board component must have enough large area.
Present suggestion, arranges at least two printed circuit board components in an electronic module, and these two printed circuit board components can mounting electronic device.These two printed circuit board components can be arranged spaced reciprocally, are namely in planes different up and down.First printed circuit board component of this printed circuit board component should surround together with cap member with frame element at this tight seal should accommodating chamber, therefore can hold the electronic device be arranged on this printed circuit board component by protecting field in accommodating chamber.In other words, this first printed circuit board component forms a part for shell, and wherein, remaining shell is formed by frame element and cap member and housing integration surrounds accommodating chamber tight seal except other side.Second printed circuit board component is also additionally set except this first printed circuit board component for electronic module; also arranging electronic device thereon, they to be also arranged in accommodating chamber and the therefore impact of the protected Korrosionsmedium from such as environment due to its tight sealing.
On the whole, hold the structure space of a this electronic module significantly can be less than conventional electrical module situation under structure space, because the electronic device be arranged on wherein no longer needs all to be arranged in the independent plane of on the first printed circuit board component one,, but can be arranged in along in the different plane of two printed circuit board components instead.In other words, electronic device not only can be arranged in a face, and can arrange with spatially distributing.
To reduce structure space advantage supplement, also can realize, first printed circuit board component can have less foundation area compared with conventional electrical module and the mechanical stress therefore such as limited by thermal expansion smaller can be produced than in conventional electrical module, and this mechanical stress is associated to the size of relevant parts substantially.Such as printed circuit board component, frame element and cap member can be made from a variety of materials, and it shows different when temperature change.Because the electronic module of advising herein compared with conventional electrical module has less size in the area of the first printed circuit board component, the thermal stress therefore limiting ground generation thus can be kept very little.
In addition, by being assembled into whole electronic module by multiple printed circuit board component, these printed circuit board components can be stacking in different planes, can realize a kind of structure of simple modular, wherein, single printed circuit board element can add or change by modular.
According to an execution mode, the second printed circuit board component is at least supported on frame element on the subregion at its edge.Frame element can meet two functions thus; namely; play a part on the one hand a part for the shell surrounding accommodating chamber and keep the second printed circuit board component in this wise on the other hand, the second electronic device namely arranged on its surface be accommodated in accommodating chamber inner and therefore on outward direction tight seal ground protected.Second printed circuit board component directly can to abut in the subregion at its edge or its whole edge on the region of the correspondence of frame element or indirectly at this, namely other parts are such as crossed, be connected in this wise with frame element, put in place by its maintenance.
Second printed circuit board component can be arranged abreast with the first printed circuit board component, such as, under several millimeter, spacing between such as 0.5mm and 20mm.Alternatively, the second printed circuit board component can be arranged obliquely relative to the first printed circuit board component.The subregion at the such as edge of the second printed circuit board component can keep at intervals with the first printed circuit board component, such as by being supported on frame element, and another subregion can directly lean on the first printed circuit board component or than other subregion closer to the first printed circuit board component.By this way, among other aspects, the electrical contact between the first and second printed circuit board components can be simplified.
According to an embodiment of the invention, first printed circuit board component thermosets forms and can construct a micro-structural an interface in the first printed circuit board component, adjoins at this interface first printed circuit board component and frame element.
Printed circuit board component can be manufactured by thermosets simply on the basis of a substrate, wherein, conductor line can over the substrate on its surface or between layer in formed.But observe in the printed circuit board (PCB) of this routine, it may be difficult that the thermosets of printed circuit board (PCB) is such as reliably connected with the thermoplastic of lid or frame element tight seal.But have realized that, the connection of this tight seal can realize, if construct micro-structural in thermoset printing circuit board component, the thermoplastic of such as framework to flow in this micro-structural and is therefore engaged to after solidification wherein under the state by heating viscous.Micro-structural can be included in micrometer range or minimum unevenness even in nanometer range and the depression be included on the surface of printed circuit board component or hole.This micro-structural such as can produce by adopting high-octane laser illumination.But, also it is contemplated that other possibility is to produce micro-structural, such as, by machining or etch.
According to an execution mode, the difference of the first printed circuit board component and the second printed circuit board component is their substrate type aspect.Such as a printed circuit board component can have coarse-texture, and on the contrary, the second printed circuit board component can have a kind of substrate, and this substrate has small structure, and such as form is fine rule-HDI(High Density Interconnect high density interconnect).Alternatively, a printed circuit board component with substrate can be designed for enforcement logical circuit, and another printed circuit board component can be arranged for implementing a kind of Power Electronic Circuit on the contrary.Therefore such as can be used for total function of the electronic module of controller by means of different printed circuit board component clusterings and such as be combined in the accommodating chamber of an only electronic module.
According to an execution mode, the first printed circuit board component, the second printed circuit board component or this two printed circuit board components can be all flat.In other words, two printed circuit board components can be designed to conventional printed circuit board (PCB) or PCB.At least the first printed circuit board component, also comprise the second printed circuit board component if desired, a part for the shell surrounding accommodating chamber can be formed in the case.
According to an embodiment of the invention, the second printed circuit board component can not only with the first printed circuit board component but also at least also arrange at intervals with cap member in subregion.In other words, although the second printed circuit board component can be arranged in accommodating chamber, whether directly abut against on cap member in the mode in face.Instead, the second printed circuit board component such as can and the several millimeter in cap member interval, such as, between 0.5mm and 10mm, with cap member plane parallel arrange or also can arrange obliquely with cap member.
According to an embodiment of the invention, the second printed circuit board component can at least remain on clampingly between frame element and cap member on the subregion at its edge.In other words, the geometry of the second printed circuit board component and the geometry of frame element can suitably so be mated, namely cap member leans on the second printed circuit board component on the second printed circuit board component such as leans on frame element a step and on opposite surface, and therefore under the assembled state of electronic module, the second printed circuit board component is maintained between frame element and cap member.Under this fixed form, other fixing of the second printed circuit board component can be cancelled if desired, such as, by bonding or welding fixing.
According to another embodiment of the invention, the second printed circuit board component can form cap member at least partially.In other words, in this embodiment, the second printed circuit board component is not additionally arrange for cap member as independent parts, but partly or even fully forms cap member.Therefore, second printed circuit board component itself can be tight seal surround the part of the shell of accommodating chamber, wherein, the second electronic device be arranged on the second printed circuit board component is arranged in differing on a surface of the second printed circuit board component in this wise, and namely they are charged in accommodating chamber.Cap member can be formed by the second printed circuit board component completely at this, and wherein in this design, the second printed circuit board component should be fixed on frame element similarly with the first printed circuit board component tight seal.In this design, such as, two printed circuit board component tight seals can be arranged on frame element by means of being arranged on one of them micro-structural, especially when two printed circuit board components are made up of thermosets.Alternatively, the second printed circuit board component can not be individually formed cap member, and such as can arrange an additional lid frame element, and it can on the one hand with the second printed circuit board component be connected with frame element on the other hand.
According to an execution mode, electronic module can have the 3rd printed circuit board component in addition, and it and the first and/or second printed circuit board component traversed by ground are arranged.Such as the first and second printed circuit board components can mutually be arranged and especially can form the part surrounding the shell holding district in part plane parallel ground, and the 3rd printed circuit board component is at them transversely, that is such as perpendicular to these hypothesis be the printed circuit board component of horizontal-extending arrange.3rd printed circuit board component can arrange the 3rd other electronic device.Therefore can more effectively utilize accommodating chamber to arrange components and parts.
According to another embodiment of the invention, on the first and/or second printed circuit board component, can arrange an electronic device in a fringe region, it is fixed on frame element.Fixing on frame element of electronic devices and components this is for those otherwise should the components and parts be stabilized in another manner on printed circuit board component be especially favourable, such as, because they must give prominence to far to locate or they are very heavy from printed circuit board component.Especially can be favourable, a printed circuit board component arrange wire rod components and parts such as electric capacity wherein and be additionally supported on or be fixed on frame element.Be fixed in the region that electronic devices and components now such as can be become by the suitable complementary structure inserting framework.
According to of the present invention should execution mode, the first printed circuit board component and the second printed circuit board component can be coupled together by bonding connection, cable and/or the fexible film (FPC-flexible print circuit) being provided with conductor line.This electrical connection can be formed simply when assembling electronic module.Such as metal wire, cable or the fexible film being furnished with conductor line can be arranged on the suitable interface (junction) on the first and second printed circuit board components, such as, by colligation, soldering, hard solder, bonding etc.This electrical connection now such as such as can be applied to another surface of this printed circuit board component from a surface of one of them printed circuit board component.This electrical connection can fully extend in accommodating chamber inside in the case.The second printed circuit board component advantageously should be made in this case not to be the first printed circuit board component covered completely in accommodating chamber, therefore to retain region freely, the electrical connection that can distribute in that region between two printed circuit board components.Such as the second printed circuit board component can be less than the foundation area of the first printed circuit board component in accommodating chamber inside, therefore reserve part face, they are not covered and the electrical connection that can be arranged at these part face places on the first printed circuit board component by the second printed circuit board component.Alternatively, such as suitable space can be set in the second printed circuit board component, can electrical connection be laid through these spaces.
Alternatively or addedly, in an embodiment of the invention, the contact element that the first and second printed circuit board components are suitable for blind dress by one or more is connected conductively.This contact element being suitable for blind dress is such as flexible contact plug, and they to be arranged on one of them printed circuit board component and to lean in the elastic ends on the counterpart at another printed circuit board component place.Other the example being suitable for the contact element of blind dress is board to board connector or pressure pin.By means of this contact element being suitable for blind dress, electronic module can be assembled in a straightforward manner, wherein, between the first and second printed circuit board components be connected electrically in assembling time from outside can not or inaccessible region formed.
The execution mode of the electronic module be designed to as suggested is specially adapted to provide a kind of actuator controller, and it can be arranged in the inside of the automotive transmission being such as filled with speed changer machine oil.The electronic device implementing transmission mechanism function can be arranged in the case in accommodating chamber inside and therefore to be surrounded and the protected erosion from corrosivity transmission oil by tight seal.Because multiple printed circuit board component is disposed in different planes, therefore can realize the very little physical dimension of transmission mechanism control device in the case, therefore this transmission mechanism control device also can be contained in narrow transmission mechanism shell.
It should be noted that, be described for different execution mode of the present invention herein according to the possible feature and advantage of electronic module of the present invention.Professional will appreciate that these features can combine in an appropriate manner or change, to realize other execution mode of the present invention.
Accompanying drawing explanation
Describe embodiments of the present invention referring to accompanying drawing, wherein, it is limitation of the present invention that this explanation and accompanying drawing should not be interpreted as.
Fig. 1 shows one according to electronic module of the present invention, and it has at inner the second printed circuit board component supported separately of accommodating chamber.
Fig. 2 shows one according to electronic module of the present invention, and it has at second printed circuit board component of supported on both sides on frame element
Fig. 3 shows another according to electronic module of the present invention, and it has in second printed circuit board component of supported on both sides on frame element and the different example for blind dress contact element.
Fig. 4 shows one according to electronic module of the present invention, and it has the first and second printed circuit board components be mutually in tilted layout.
Fig. 5 shows one according to electronic module of the present invention, and it has the second printed circuit board component be supported on individually in accommodating chamber.
Fig. 6 shows one according to printed circuit board component of the present invention, and it has the second printed circuit board component remained on clampingly between cap member and frame element.
Fig. 7 shows one according to electronic module of the present invention, and it has the passive cooling (portion) be attached in cap member.
Fig. 8 shows one according to electronic module of the present invention, and wherein, the second printed circuit board component forms a part for cap member.
Fig. 9 shows another according to electronic module of the present invention, and wherein, the second printed circuit board component forms a part for cap member.
Figure 10 shows one according to electronic module of the present invention, and it has vertically arranged 3rd printed circuit board component.
Figure 11 shows the vertical view in an accommodating chamber according to electronic module of the present invention, has the electronic device be fixed on frame element.
Figure 12 shows the end view that is fixed on the device on frame element.
These figure are only schematic diagram and proportionally do not illustrate.Identical Reference numeral represents identical in various figures or acts on identical feature.
Embodiment
Fig. 1 shows the execution mode of an electronic module 1, and it has the first printed circuit board component 3, frame element 5 and cap member 7.First printed circuit board component 3 arranges multiple first electronic device 9.
First printed circuit board component 3, frame element 5 surround an accommodating chamber 11 in the mode of tight seal together with cap member 7.On the first printed circuit board component 3 be made up of thermosets, produce micro-structural 21 in the region adjacent with frame element 5 by means of laser, it extends along the whole circumference of frame element 5 annular in a top view for this reason.The thermoplastic of frame element 5 when assembling electronic module 1 temporarily by heating with can be squeezed in the depression of this micro-structural 21 under viscous state, therefore it between frame element 5 and the first printed circuit board component 3, form firmly machinery after the hardening with the connection of tight seal.The cap member 7 be such as also made up of thermoplastic material can be connected by Plastic Welding 23 tight seal along a circumference with frame element 5.
Electronic module 1 comprises the second printed circuit board component 13 in addition.The second electronic device 15 is arranged two of the second printed circuit board component 13 opposite surfaces.Second printed circuit board component 13 in this embodiment not only and the first printed circuit board component 3 but also and cap member 7 separately and to arrange and in accommodating chamber 11 inside between these two in parallel therewith.
Not only arrange conductor line at the first printed circuit board component 3 place but also on the surface of the second printed circuit board component 13, the first and second different whereby electronic devices 9,15 are connected to each other.In the example shown, the conductor line of the first printed circuit board component 3 and the conductor line of the second printed circuit board component 13 are electrically connected via bonding wire connecting portion 17.
Second printed circuit board component 13 it edge be mechanically supported on the subregion shown in Fig. 1 left side frame element 5 towards accommodating chamber 11 point to convex shoulder 19 on.Another subregion shown in figure the right at the edge of the second printed circuit board component is supported in the supporting construction 25 of a local, and this supporting construction can be a part for frame element 5.Second printed circuit board component 13 is such as not only fixed at frame element 5 but also at supporting construction 25 place by means of hot pressing (holding back close) or latch 27 in the case.
Because the second printed circuit board component 13 has less foundation area than the first printed circuit board component 3 in frame element 5 and therefore not exclusively covers the first printed circuit board component there, the bonding wire connecting portion 17 therefore between the second printed circuit board component 13 and the first printed circuit board component 3 can be extended by the subregion that of accommodating chamber 11 is adjacent.
Shown in figure 2 in execution mode, the second printed circuit board component 13 is supported on convex shoulder 19 two opposite edges, and this convex shoulder projects upwards from frame element 5 towards accommodating chamber 11 side, and is fixed by hot pressing or stop-motion body 27 again.Additional local support structure is not set.First and second printed circuit board components 3, the electrical contact between 13 realizes through the recess 29 in the second printed circuit board component 13 in the case.Such as at the first and second printed circuit board components 3, the flexible membrane (FPC) of cable or conduction can be set between 13 as electrical connecting element.
In the execution mode shown in Fig. 3 (a), the second printed circuit board component support and be fixed on frame element 5 around inwardly outstanding convex shoulder 19 on.The local support structure of adding is not needed yet.Electrical contact between the first and second printed circuit board components 13 can be carried out abreast with the installation of the second printed circuit board component 13 on the convex shoulder 19 of frame element 5.For at two printed circuit board components 3, between 13 required be connected electrically in this can use that such as form is the elastic connecting contact pin 33 shown in Fig. 3 (a), fill suitable contact element 31 to blind.Alternatively, as shown in Fig. 3 (b), also can use board to board connector 35 or, as shown in Fig. 3 (c), pressure pin 27 is as the contact element 31 being suitable for blind dress.
In execution mode shown in Figure 4, the second printed circuit board component 13 and the first printed circuit board component 3 are not abreast but arrange obliquely.In the case, the second printed circuit board component 13 contacts the first printed circuit board component 3 along the subregion at its edge and is fixed at intervals on frame element 5 with the first printed circuit board component 3 again at one of edge opposite subregion place.At two printed circuit board components 3, electrically connecting between 13 such as can be realized by brazing 39.A miniature crest can soak from outside via the plated-through-hole 41 the first printed circuit board component in the case, wherein, solder can soak/contact by plated-through-hole 41 projection and subsequently the contact pad (contact solder joint) on the second printed circuit board component 13.After originally liquid solder solidification, two printed circuit board components 3,13 are electrically connected to each other and plated-through-hole 41 is hermetically sealed in the first printed circuit board component 3.On the inner side that second printed circuit board component 13 such as can be fixed on frame element 5 by hot pressing (filling) or clamping hooked and additional anchor point can addedly be responsible for maintenance reliably.As the replacement scheme of the electrical connection that the solder introduced by means of plated-through-hole 41 realizes, the second printed circuit board component 13 such as also directly can be connected with the conductor line on printed circuit board component 3 in accommodating chamber 11 by means of welding (brazing), weldering bridge or bonding connection (bonding wire connection).
Fig. 5 illustrates a kind of execution mode of electronic module 1, wherein, its height of frame element 5(in order to better can adhesiveness kept by low) inside in less second frame element 45 is set in accommodating chamber, fix the second printed circuit board component 13 thereon.Second frame element 45 can form an open type or closed profile at this.Second frame element 45 can be fixed on the first printed circuit board component 3 via micro-structural 46 with the first frame element 5 if desired similarly.At the first and second printed circuit board components 3, the electrical connection between 13 can be realized by bonding connection 17 as shown in Figure.The same with at other execution modes all in this embodiment if desired, the interior room 47 of accommodating chamber 11 and especially the second frame element 45 can be gel filled partially or entirely, such as can distribute or discharge the used heat of the device 9,15 wherein held better.
The execution mode of electronic module 1 shown in Figure 6 and the difference of previously described execution mode are especially, the second printed circuit board component 13 directly abuts on cap member 7.Such as the second printed circuit board component 13 can be clogged 49 with the cap member 7 such as formed by plastics by means of heat and be connected securely.Alternatively or addedly, the second printed circuit board component 13 can be clamped between the convex shoulder 19 of frame element 5 and cap member 7.First and second printed circuit board components 3, electrical connections between 13 is as passed through the PCB(printed circuit board (PCB) of partially flexible) bar realization, this PCB bar is flipped out and is connected with the pad (solder joint) on the first printed circuit board component 3 by flexible tongue from the plane of the second printed circuit board component 13.Be suitable as contact element and also have other very different elements, they such as can be connect by blind.
Execution mode shown in Figure 7 relates to a kind of modification of electronic module 1, and wherein, the cap member 7 be partly made of metal via can discharge the heat of the second printed circuit board component 13 mounted thereto well.Therefore this execution mode is applicable to arrange the power component with higher loses heat especially well.Cap member 7 comprises metallic plate 51 at this, and it can be flat or can also to arrange cooling structure such as form be cooling ribs 53 in order to improve cooling capacity further.To be connected by the part cap member 57 sprayed around ground in that metallic plate 51 such as can construct around ground on side via one with the first printed circuit board component 3 similarly, local micro-structural 55 and after this operation then, be therefore formed in the good bond between metallic plate 51 and part cap member 57 and the connection sealed.Next such as by means of thermal conductive adhesive, the printed circuit board component 13 having assembled electronic device 15 can be bonded on the inner side of this component.
An execution mode of electronic module 1 shown in Figure 8, wherein the second printed circuit board component 13 forms cap member 7 at least partially.For this reason the second printed circuit board component 13 around ground partly by micro-structural.Micro-structural 61 sprays around ground the part frame element 57 be made up of thermoplastics.This part frame element can unilaterally (as the left side illustrates in fig. 8) or around ground (as in fig. 8 the right illustrate) implement.Can assembly and checkout second printed circuit board component 13 after this job step.First printed circuit board component 3 also can prepare and then be assembled together with affiliated frame element 5 concurrently therewith.Then can carry out general assembly, wherein, two printed circuit board components 3,13 are such as mutually electrically connected by flexible connection 63, engage and are finally such as mutually coupled together hermetically by plastics laser welding.Among other things, in order to improve the stability of cap member 7, the second printed circuit board component 13 such as can by thicker PCB manufacture or arrange one support 65, it can such as in interior welds on the second printed circuit board component 13.
When shown in Figure 8 electronic module 1, the second printed circuit board component 13 not only arranges sensing element 67,69 on an inner surface towards accommodating chamber 11 but also on an outer surface.Such as can the magnetic field of Detect change by means of this sensing element.The magnetic field of this change such as can produce by means of the sensing wheel 71 being assembled with magnet in vehicle transmission mechanism, therefore electronic module 1 advantageously can be designed to actuator controller, wherein can detect the rotating speed of geartrain components among other things.
An execution mode of electronic module 1 shown in Figure 9, electrical connection wherein between the first printed circuit board component 3 and the second printed circuit board component 13 is not carried out in accommodating chamber 11, but two printed circuit board component 3,13 mutual electrical contacts on a lateral surface.This such as can realize via the shielded FPC75 of flexibility own.The contact point of the exposure in the case only on two printed circuit board components also should protectedly not be subject to the adverse effect of the Korrosionsmedium in vehicle transmission mechanism or avoid dirty, such as, by coating paint layer 73.
In execution mode shown in Figure 10, the whole circuit of electronic module 1 is divided into three printed circuit board components 3,13,77.3rd printed circuit board component 77 is in the case transverse to especially arranging perpendicular to two other printed circuit board component 3,13 ground and being supported in the illustrated example on the inner face of frame element 5.It is coupled together by the region 79 of partially flexible and brazing 81 and the first printed circuit board component 3 in the case.Alternatively or addedly, such as can via plated-through-hole 83 make first and the 3rd printed circuit board component 3,77 be electrically connected to each other, the miniature crest of solder can be introduced by this plated-through-hole.
Vertical view and the end view of a subregion in the accommodating chamber 11 of electronic module are shown in figs. 11 and 12.Electronic device 85 heavier in this case such as wire members such as capacitor is installed on the first printed circuit board component 3.In order to support this heavier electronic device 85, frame element 5 constructs the contained structure 87 be complementally configured to therewith, device 85 such as form fit to be assembled in this contained structure and therefore can be kept with connecting.
Claims (14)
1. electronic module (1), has
First printed circuit board component (3), it has at least one first electronic device (9) disposed thereon; With
Frame element (5);
Cap member (7);
Wherein, the first printed circuit board component (3), frame element (5) and cap member (7) surround an accommodating chamber (11) together tight seal;
Wherein, at least one electronic device (9) is arranged in accommodating chamber (11),
It is characterized in that,
Electronic module (1) has the second printed circuit board component (13), and it has at least one second electronic device (15) disposed thereon,
Wherein, the second printed circuit board component (13) be at least electrically connected separately and with the first printed circuit board component (3) with the first printed circuit board component (3) in subregion and
Wherein, the second electronic device (15) is arranged in accommodating chamber (11).
2. according to the electronic module of claim 1, wherein, the second printed circuit board component (13) is at least supported on frame element (5) on the subregion at its edge.
3. according to the electronic module of claim 1 or 2, wherein, the first printed circuit board component (3) is formed with thermosets and the interface adjoined at the first printed circuit board component (3) and frame element (5) in the first printed circuit board component (3) constructs a micro-structural (21).
4. according to the electronic module of one of aforementioned claim, wherein, the first printed circuit board component (3) and the second printed circuit board component (13) are different on their substrate type.
5. according to the electronic module of one of aforementioned claim, wherein, the first printed circuit board component (3) and/or the second printed circuit board component (13) are flat.
6. according to the electronic module of one of aforementioned claim, wherein, the second printed circuit board component (13) at least in subregion with cap member (7) separately.
7. according to the electronic module of one of aforementioned claim, wherein, the second printed circuit board component (13) at least remains on clampingly between frame element (5) and cap member (7) on the subregion at its edge.
8. according to the electronic module of one of claim 1 to 5, wherein, the second printed circuit board component (13) at least forms a part for cap member (70).
9. according to the electronic module of one of aforementioned claim, have the 3rd printed circuit board component (77) in addition, it is arranged transverse to the first printed circuit board component (3) and/or the second printed circuit board component (13).
10. according to the electronic module of one of aforementioned claim, wherein, be in fringe region at the first printed circuit board component (3) and/or the second printed circuit board component (13) and arrange an electronic device (85), it is fixed on frame element (5).
11. according to the electronic module of one of aforementioned claim, and wherein, the first printed circuit board component (3) is connected by bonding connection, cable and/or flexible membrane conductively with the second printed circuit board component (13).
12. according to the electronic module of one of aforementioned claim, and wherein, the first printed circuit board component (3) is connected by a kind of contact element (31) being suitable for blind assembling conductively with the second printed circuit board component (13).
13. according to the electronic module of one of aforementioned claim, and wherein, the second printed circuit board component (13) not exclusively covers the first printed circuit board component (3) in accommodating chamber (11).
14. actuator controllers, have the electronic module (1) according to one of claim 1 to 13.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014205385.4 | 2014-03-24 | ||
| DE102014205385.4A DE102014205385A1 (en) | 2014-03-24 | 2014-03-24 | Electronic module, in particular for transmission control unit, with two printed circuit board elements stacked one above the other |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104955290A true CN104955290A (en) | 2015-09-30 |
Family
ID=54053656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510126224.1A Pending CN104955290A (en) | 2014-03-24 | 2015-03-23 | Electronic module with two stacked printed circuit board elements, in particular for a transmission controller |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN104955290A (en) |
| DE (1) | DE102014205385A1 (en) |
| FR (1) | FR3018989A1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106358407A (en) * | 2016-12-02 | 2017-01-25 | 极导电子科技无锡有限公司 | Electric vehicle controller |
| CN109210439A (en) * | 2018-10-25 | 2019-01-15 | 湖州明朔光电科技有限公司 | AI wisdom lamp cap |
| CN110383960A (en) * | 2017-03-15 | 2019-10-25 | 罗伯特·博世有限公司 | Electronic control module and method for manufacturing electronic control module |
| CN112425272A (en) * | 2018-07-26 | 2021-02-26 | 三菱电机株式会社 | Printed circuit board |
| CN113727006A (en) * | 2016-07-05 | 2021-11-30 | 韩华泰科株式会社 | Monitoring camera system |
| TWI771461B (en) * | 2018-02-19 | 2022-07-21 | 南韓商三星電機股份有限公司 | Printed circuit board |
| CN115916604A (en) * | 2020-09-14 | 2023-04-04 | 舍弗勒技术股份两合公司 | Control unit with contact concept for ground connection |
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| DE102015219571A1 (en) | 2015-10-09 | 2017-04-13 | Conti Temic Microelectronic Gmbh | Sensor dome assembly |
| DE102015223550A1 (en) | 2015-11-27 | 2017-06-01 | Robert Bosch Gmbh | Electronic module and method for manufacturing an electronic module with a fluid-tight housing |
| JP6249037B2 (en) * | 2016-03-29 | 2017-12-20 | マツダ株式会社 | Automatic transmission and manufacturing method of automatic transmission |
| DE102016215411A1 (en) * | 2016-08-17 | 2018-02-22 | Conti Temic Microelectronic Gmbh | Frame for an electronic circuit board and electronic circuit board |
| DE102017209179A1 (en) * | 2017-05-31 | 2018-12-06 | Conti Temic Microelectronic Gmbh | electronics assembly |
| DE202017105514U1 (en) * | 2017-09-12 | 2018-12-14 | Tridonic Gmbh & Co Kg | Housing for an electrical operating device for bulbs |
| EP3495897B1 (en) | 2017-12-08 | 2020-08-12 | ETA SA Manufacture Horlogère Suisse | Timepiece comprising an electric motor secured to an attachment plate |
| FR3103887A1 (en) * | 2019-11-29 | 2021-06-04 | Valeo Systemes Thermiques | Electric heating device for a heat transfer liquid for a motor vehicle |
| DE102020214775A1 (en) | 2020-11-25 | 2022-05-25 | Continental Teves Ag & Co. Ohg | Electronic control device, method and braking system |
| DE102023110445B4 (en) | 2023-04-25 | 2025-04-17 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Electronic switching unit and motor vehicle |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113727006A (en) * | 2016-07-05 | 2021-11-30 | 韩华泰科株式会社 | Monitoring camera system |
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| CN112425272A (en) * | 2018-07-26 | 2021-02-26 | 三菱电机株式会社 | Printed circuit board |
| CN112425272B (en) * | 2018-07-26 | 2024-03-01 | 三菱电机株式会社 | Printed circuit board with improved heat dissipation |
| CN109210439A (en) * | 2018-10-25 | 2019-01-15 | 湖州明朔光电科技有限公司 | AI wisdom lamp cap |
| CN115916604A (en) * | 2020-09-14 | 2023-04-04 | 舍弗勒技术股份两合公司 | Control unit with contact concept for ground connection |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102014205385A1 (en) | 2015-09-24 |
| FR3018989A1 (en) | 2015-09-25 |
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Application publication date: 20150930 |