[go: up one dir, main page]

CN104936429B - Pin insertion device and method for determining defective pin insertion - Google Patents

Pin insertion device and method for determining defective pin insertion Download PDF

Info

Publication number
CN104936429B
CN104936429B CN201510077029.4A CN201510077029A CN104936429B CN 104936429 B CN104936429 B CN 104936429B CN 201510077029 A CN201510077029 A CN 201510077029A CN 104936429 B CN104936429 B CN 104936429B
Authority
CN
China
Prior art keywords
pin
mentioned
cylinder
pin insertion
bad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510077029.4A
Other languages
Chinese (zh)
Other versions
CN104936429A (en
Inventor
矶崎诚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of CN104936429A publication Critical patent/CN104936429A/en
Application granted granted Critical
Publication of CN104936429B publication Critical patent/CN104936429B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

提供能够正确地判定利用销插入装置实现的销插入状态的良好与否的销插入装置和销插入不良判定方法。销插入装置用于将销(2)压入到被固定于基板(3)的中空的筒体(1),具备:销插入头(14),其将销(2)保持并插入到筒体(1);振动传感器(25),其安装于销插入头(14),检测在销插入头(14)向筒体(1)插入销(2)的过程中的振动能量;以及插入不良判定部(40),其基于由振动传感器(25)检测出的振动能量检测值和判定阈值来判定销(2)对筒体(1)的插入不良。

Provided are a pin insertion device and a method for determining defective pin insertion that can accurately determine whether the state of pin insertion by the pin insertion device is good or not. A pin insertion device for press-fitting a pin (2) into a hollow cylindrical body (1) fixed to a base plate (3), and includes a pin insertion head (14) that holds and inserts the pin (2) into the cylindrical body (1); a vibration sensor (25) mounted on the pin insertion head (14) to detect vibration energy in the process of inserting the pin (2) into the cylinder (1) by the pin insertion head (14); and judgment of poor insertion A part (40) for determining poor insertion of the pin (2) into the cylindrical body (1) based on the vibration energy detection value detected by the vibration sensor (25) and the determination threshold value.

Description

It sells insertion apparatus and pin is inserted into bad determination method
Technical field
It is inserted the present invention relates to a kind of for pressing the pin into the pin insertion apparatus for being fixed on the hollow cylinder of substrate and pin Enter bad determination method.
Background technique
In the insulate electrical substrate for being for example used in power semiconductor module, in the connection that will be used to carry out external connection In the case that pin is configured at insulate electrical substrate, by the flange of a side of the cylindric connecting element at both ends with flange part Portion is welded to insulate electrical substrate, enters connecting pin (referring for example to patent from the flange part side pressure of another party using pin insertion apparatus Document 1).
Patent document 1: No. 2009/0194884 specification of U.S. Patent Application Publication No.
Summary of the invention
Problems to be solved by the invention
In addition, connecting pin is pressed into welding using pin insertion apparatus in the previous example documented by above patent document 1 In the connecting element of insulate electrical substrate, therefore, when connecting element is welded to insulate electrical substrate, solder attachment is in connection The inside of element or dust is attached to and keeps in internal situation or pin insertion apparatus in the manufacturing process of connecting element In the case where generating positional shift between connecting pin and connecting element, the connecting pin that is carried out using pin insertion apparatus it is chimeric by It hinders and can not be smoothly pressed into.
However, there are following an open questions: can not differentiate that the chimeric of connecting pin carried out using pin insertion apparatus is It is no to be hindered, it can confirm by visual observation in the case where connecting pin is broken off, still, be bent or connect in connecting pin It sells in inclined situation, can confirm by visual observation if bending, inclination are big, if but bending, tilting and small being difficult to pass through Visually confirm, thus can not correctly not determine pin insert state it is good whether.
Therefore, the present invention is to be conceived to an open question of above-mentioned previous example and complete, and its purpose is to provide one Kind can correctly determine the pin insert state realized using pin insertion apparatus it is good whether pin insertion apparatus and pin insertion Bad determination method.
The solution to the problem
In order to achieve the above object, a mode of pin insertion apparatus according to the present invention is for pressing the pin into quilt Be fixed on the pin insertion apparatus of the hollow cylinder of substrate, which has: pin insertion head keeps above-mentioned pin simultaneously It is inserted into above-mentioned cylinder;Vibrating sensor, is installed on pin insertion head, and detection is inserted into above-mentioned pin insertion head to above-mentioned cylinder Vibrational energy during above-mentioned pin;And the bad determination unit of insertion, based on the vibration detected by the vibrating sensor Energy detection value and decision threshold determine that above-mentioned pin is bad to the insertion of above-mentioned cylinder.In addition, involved by the above-mentioned present invention And pin insertion apparatus a mode in, it is desirable to aforesaid substrate is by having the insulated electro of insulating substrate and wired circuit Base board is constituted, above-mentioned cylinder is made of the electric conductivity cylinder with canister portion and flange part, the flange part above-mentioned cylinder with To radially projecting at the end of the side of above-mentioned wired circuit connection, above-mentioned pin is made of conductive metal.
In a mode of above-mentioned pin insertion apparatus according to the present invention, it is desirable to above-mentioned vibrating sensor By strain transducer (strain sensor), piezoelectric transducer (piezo sensor), acoustic emission sensor (Acoustic Emission sensor) any of constitute.
In a mode of above-mentioned pin insertion apparatus according to the present invention, also can be set to: above-mentioned insertion is bad Determination unit is entered the vibrational energy detected value detected by above-mentioned vibrating sensor, calculates the square of the vibrational energy detected value Root is judged to being inserted into bad when the peak value of calculated root mean square has been more than above-mentioned decision threshold.
In a mode of above-mentioned pin insertion apparatus according to the present invention, also can be set to: above-mentioned insertion is bad Determination unit has flame storage unit, the flame storage unit storage be judged to being inserted into undesirable cylinder identification information and The maximum value of above-mentioned root mean square.
In addition, also can be set in a mode of above-mentioned pin insertion apparatus according to the present invention: having driving The pin of above-mentioned pin insertion head is inserted into control unit, and the above-mentioned bad determination unit of insertion is inserted into when being judged to being inserted into bad to above-mentioned pin Control unit sends the decline stop signal for stopping the decline of above-mentioned pin insertion head, above-mentioned pin insertion control unit receive it is above-mentioned When declining stop signal, stop the decline of above-mentioned pin insertion head.
In addition, the mode that pin according to the present invention is inserted into bad determination method has following steps: detection is being incited somebody to action Electric conductivity pin is pressed into the vibrational energy generated when the electric conductivity cylinder for being fixed in insulate electrical substrate;And based on detecting Vibrational energy detected value and pre-determined decision threshold determine insertion of the above-mentioned electric conductivity pin to above-mentioned electric conductivity cylinder State it is good whether.
It is desirable that, carrying out the detection of above-mentioned vibrational energy using acoustic emission sensor.
The effect of invention
According to the present invention, when pressing the pin into the cylinder for being fixed in substrate, detection is transmitted to the pin insertion of retaining pin Head vibrational energy come determine pin insert state it is good whether, therefore can correctly judge the good of pin insert state and It is no.
Detailed description of the invention
Fig. 1 is to indicate to be equipped with to be using the figure of the insulate electrical substrate of connector drum of the invention, (a) of Fig. 1 Top view, (b) of Fig. 1 are side views.
Fig. 2 is the figure for indicating to be fixed on the connector drum of insulate electrical substrate, and (a) of Fig. 2 is cross-sectional view, and (b) of Fig. 2 is Top view.
Fig. 3 is the perspective view for illustrating that the Sketch of pin insertion apparatus of an embodiment of the invention.
Fig. 4 is the cross-sectional view for indicating acoustic emission sensor.
Fig. 5 is to indicate that pin is inserted into the block diagram of bad determination unit.
Fig. 6 is the figure for indicating the detection signal waveform of acoustic emission sensor.
Fig. 7 is the cross-sectional view for indicating pin insert state.
Fig. 8 is the cross-sectional view for indicating pin insertion defective mode.
Fig. 9 is the cross-sectional view for indicating the failure welding state of electric conductivity cylinder.
Figure 10 is the waveform diagram for indicating to generate rms signal when pin is inserted into bad.
Figure 11 is the explanatory diagram for indicating the relationship between the defective mode of electric conductivity conductor and signal detection peak value.
Description of symbols
1: connector drum;1a: cylindrical portion;1b, 1c: flange part;1d: notch;2: connecting pin;3: insulate electrical substrate; 4: wired circuit;5: solder;11: pin insertion apparatus;12: base station;13:XY platform;14: pin insertion head;15: supporting part;16: up and down Direction mobile mechanism;17: reel;18: threadlike body;19: guiding elements;20: clamping section;20a, 20b: half clamping body;20c: into Move back mechanism;25: sound emission (AE) sensor;26: shielding box;27: by wave plate;28,30: silver-colored evaporation film;29: piezoelectric element;31: External output line;32: connector;33: analog signal pre-processes circuit;33a:AE preamplifier;33b: bandpass filter; 34:A-D conversion circuit;35: determination unit;35a: signal processing circuit;35b: decision circuit whether pin insertion is good;35c: bad Information storage part;35d: display unit;36: pin insertion control unit;37: stroke sensor (stroke sensor);40: insertion is not Good determination unit.
Specific embodiment
In the following, illustrating pin insertion apparatus according to the present invention in conjunction with attached drawing.
Firstly, explanation can apply conductive connector drum 1 of the invention and be pressed into the connector drum 1 Conductive connecting pin 2.
Connector drum 1 is for example formed by copper.As shown in Fig. 2, the connector drum 1 is by hollow cylindrical portion 1a and in the circle Radially extended the flange part 1b and 1c that two ends of canister portion 1a are formed are constituted.In flange part 1b and 1c, in peripheral side Being formed with makes the solder inwardly outer notch 1d flowed.Moreover, as shown in (a) of Fig. 1 and (b) of Fig. 1, so that connector drum 1 The cylindrical portion 1a mode vertical relative to the upper surface of insulate electrical substrate 3, by using the welding of solder 5 by connecting cylinder The flange part 1c of one side of body 1 is fixed on the wired circuit 4 for being formed in insulate electrical substrate 3.
As shown in (b) of (b) of Fig. 1, (a) of Fig. 2 and Fig. 2, it is rectangular by copper wires structure that connecting pin 2, which is by section, At threadlike body cut into specific length and be formed as the threadlike body section cornerwise length be greater than connection conductor 1 circle Made of the quadrangular shape of the internal diameter of canister portion 1a, the connecting pin 2 long enough compared with the length of connector drum 1.
Then, using pin insertion apparatus 11 shown in Fig. 3, connecting pin 2 is inserted into from top is fixed on insulated electro roadbed The connector drum 1 of plate 3, and be fitted in the cylindrical portion 1a of connector drum 1.
As shown in figure 3, pin insertion apparatus 11 is configured with insulate electrical substrate XY platform 13 on base station 12, which can Make to configure the insulate electrical substrate 3 on XY platform 13 to move in the horizontal direction.
Supporting part 15 more is configured with by inboard position than XY platform 13 on base station 12.Configured with upper at supporting part 15 Lower direction mobile mechanism 16, the up and down direction mobile mechanism 16 will be inserted into head 14 with the relatively configured pin of insulate electrical substrate 3 It is supported in a manner of it can move along the vertical direction.In the back side of supporting part 15, it can rotatably carry and be wound with threadiness The reel (reel) 17 of body 18, threadlike body 18 are fed into pin via the guiding elements 19 for the front-surface side for being configured at supporting part 15 It is inserted into head 14.
Pin insertion head 14 has the clamping section 20 for keeping threadlike body 18 and driving and reversing mechanism 20c.Clamping section 20, which has, to be divided One and half clamping body 20a and 20b.The half clamping body 20a of one side is fixed on pin insertion head 14, the half clamping body 20b of another party It can movably be supported by driving and reversing mechanism 20c.
Driving and reversing mechanism 20c has following state and keeping half clamping body 20b mobile: being clamped by half clamping body 20a and half Body 20b holds the clamped condition of threadlike body 18 (connecting pin 2);And the release shape of the holding of release threadlike body 18 (connecting pin 2) State.
Though also, do not illustrated, it is next configured with threadlike body 18 is cut into specific length at pin insertion head 14 As the cutting element of connecting pin 2, the threadiness is cut off using the cutting element when threadlike body 18 is inserted into connector drum 1 Body 18.Can also threadlike body 18 is cut into specific length make threadlike body 18 become connecting pin 2 after be inserted into connector drum 1。
Acoustic emission sensor (hereinafter referred merely to as AE sensor) 25 is configured at half clamping body 20a of clamping section 20, it should AE sensor 25 is used as detecting the vibrating sensor of the vibrational energy generated when being fitting to connection pin 2 to connector drum 1.
The AE sensor 25 detects AE (sound emission) wave.AE wave is to be based on to accumulate when material deforms or destroys in inside Elastic energy as sound wave (elastic wave, AE wave) release the phenomenon that and release.The AE wave mainly has as ultrasonic wave area Tens of kHz~number MHz radio-frequency component of the frequency in domain.
Here, as shown in figure 4, being configured in AE sensor 25: the box-like by one side open of aluminum or stainless steel Shielding box 26;By wave plate 27, the opening end face of the shielding box 26 is covered, is formed by insulants such as aluminium oxide;And piezoelectricity (PZT) element 29 are mounted on the inner face side towards shielding box 26 by wave plate 27 across silver-colored evaporation film 28, wherein in shape It is connected with external output line 31 at the same silver-colored evaporation film 30 of the side opposite with silver-colored evaporation film 28 of the piezoelectric element 29, The outside output line 31 is connect with connector 32.
Then, the signal routing to extend out from the connector 32 of AE sensor 25 is bad with insertion as shown in Figure 7 Determination unit 40 connects.As shown in figure 5, the bad determination unit 40 of the insertion has: analog signal pre-processes circuit 33, is entered AE The AE signal of sensor 25;A/D conversion circuit 34 converts the analog signal exported from analog signal pretreatment circuit 33 For digital signal;And determination unit 35, the digital signal being converted to is analyzed.Analog signal pre-process circuit 33 by AE preamplifier 33a and bandpass filter 33b is constituted, which believes the AE exported from AE sensor 25 Number amplification, bandpass filter 33b from the amplified signal amplified by AE preamplifier 33a extract AE wave frequency rate at Point.
Decision circuit 35b, flame storage unit whether determination unit 35 has signal processing circuit 35a, pin insertion well 35c and display unit 35d.Signal processing circuit 35a is entered the amplified AE wave number word letter inputted from A-D conversion circuit 34 Number, the AE wave digital signal will be carried out to sentence whether rms signal obtained from root mean square (RMS) processing is output to pin insertion well Determine circuit 35b.
Whether pin insertion is good decision circuit 35b by the rms signal exported from signal processing circuit 35a with it is preset Decision threshold be compared to carry out pin insert state it is good whether determine, be less than pin in rms signal and be inserted into bad decision threshold It is judged as that pin insert state is good when value, in the case where rms signal has been more than that pin is inserted into bad decision threshold, is judged as that pin is inserted It is bad to enter state.It then, will under determining that result is inserted into undesirable situation for pin in decision circuit 35b whether pin insertion is good The identification information of the maximum value of rms signal and the connector drum for currently carrying out pin insertion stores flame in couples and deposits Storage portion 35c, and they are shown on display unit 35d.At the same time, sentence in decision circuit 35b whether pin insertion is good Break and be inserted into undesirable situation for pin, i.e. in the case that the value of rms signal has been more than decision threshold, is sent out to pin insertion control unit 36 Send the decline stop signal for stopping the decline of pin insertion head 14.Then, pin insertion control unit 36 is receiving decline stopping letter Number when, make pin insertion head 14 decline stop.It is inserted into from the stroke sensor 37 of the descending stroke of test pin insertion head 14 to pin 36 input travel of control unit detects signal.Pin insertion control unit 36 carries out following control: the mobile control of insulate electrical substrate, control XY platform 13 keeps insulate electrical substrate mobile so that connector drum 1 be located at the threadlike body 18 that is clamped by pin insertion head 14 just under Side;And pin insertion control, drive up and down direction mobile mechanism 16 and driving and reversing mechanism 20c carry out pin insertion head 14 on move down Dynamic and threadlike body 18 holding and release.
Then, illustrate the movement of above embodiment.
Firstly, as shown in figure 3, the insulate electrical substrate 3 for being welded with connector drum 1 to be placed on to the XY of pin insertion apparatus 11 It is on platform 13 and fixed.In pin insertion apparatus 11, the threadlike body 18 on reel 17 is fed into via guiding elements 19 Pin insertion head 14.The front end of the threadlike body 18 is with the prominent specific length of the degree not abutted with connector drum 1 by half clamping body 20a and 20b is held.
In this state, when pin insertion apparatus 11 starts movement, XY platform 13 is controlled, so that first will be inserted into The center of the cylindrical portion 1a of the connector drum 1 of threadlike body 18 (connecting pin 2) is located in the threadlike body 18 held by clamping section 20 Front end underface.At this point, utilizing the plane for the photographic device (not shown) shooting connector drum 1 for being configured at pin insertion head 14 Thus image is correctly attached the positioning of cylinder 1.
Then, when the positioning of connector drum 1 is completed, as shown in fig. 7, up and down direction mobile mechanism 16 is worked and is sold Head 14 is inserted into decline.The threadlike body 18 (connecting pin 2) clamped by clamping section 20 is inserted into the company for being fixed on insulate electrical substrate 3 The inside of the cylindrical portion 1a of connect cylinder body 1.At this point, since cornerwise length in the section of connecting pin 2 is greater than the circle of connector drum 1 The internal diameter of canister portion 1a, therefore threadlike body 18 (connecting pin 2) is pressed into connector drum 1.
When being pressed into threadlike body 18 (connecting pin 2), AE sensor 25 measures the (connection of threadlike body 18 by means of clamping section 20 Pin 2) vibration, from AE sensor 25 export AE signal.The AE signal is amplified by AE preamplifier 33a, and is filtered by band logical Wave device 33b extracts the analog signal of supersonic zone shown in (a) of Fig. 6.The analog signal is converted by A-D conversion circuit 34 For the signal processing circuit 35a for being input to determination unit 35 after digital signal.
In signal processing circuit 35a, root mean square processing is carried out to digital signal to be converted to shown in (b) of Fig. 6 Rms signal.The value of rms signal is compared by decision circuit 35b with decision threshold whether pin insertion is good, is in rms signal It is judged as that pin insert state is good when below decision threshold.When the kilter of the pin insert state is persistently and as connecting pin 2 The front end of threadlike body 18 when being pressed into specified position in connector drum 1, stroke sensor 37 shown in fig. 5 becomes out (ON) state, the ON signal are provided to pin insertion control unit 36.Then, pin insertion control unit 36 is receiving stroke sensor When 37 ON signal, holding of the clamping section 20 to electric conductivity connecting pin 2 is released.Up and down direction mobile mechanism 16 is worked and is sold It is inserted into head 14 to rise, when rising to specified position, threadlike body 18 is held by clamping section 20 again.At this point, by clamping section 20 Hold the position of the ratio cutting predetermined position specific length against the top of threadlike body 18.Then, pin insertion control unit 36 makes (not shown) Cutting part works to cut off threadlike body 18, becomes connecting pin 2.
Movement more than repeating, whole connector drum of the Lai Zhihang threadlike body 18 (connecting pin 2) in insulate electrical substrate 3 1 indentation.Then, the completed insulate electrical substrate 3 of operation is taken out from XY platform 13, new insulate electrical substrate 3 is placed in XY Platform 13 executes above-mentioned pin insert action.In addition, since connector drum 1 is by the wired circuit 4 of insulate electrical substrate 3 The solder 5 of coating is welded in insulate electrical substrate 3, therefore generates solder such as Fig. 9 during soldering sometimes (a)~(c) shown in be attached to like that connector drum 1 cylindrical portion 1a inner peripheral surface failure welding.
That is, there are following situations etc. for the concrete example of the failure welding: when being welded to connect cylinder 1 to insulate electrical substrate 3, As shown in (a) of Fig. 9, until solder 5 is attached to the upper end side of the inner peripheral surface of cylindrical portion 1a;As shown in (b) of Fig. 9, on solder 5 It is raised to the centre of the inner peripheral surface of cylindrical portion 1a;As shown in (c) of Fig. 9, solder 5 is attached to one of the inner peripheral surface of cylindrical portion 1a Point.When the inner peripheral surface generation failure welding like this in the cylindrical portion 1a of connector drum 1, connecting pin 2 is being pressed into connection During cylinder 1 and its front end reach before solder attachment portion, as shown in Figure 10, the RMS letter exported from signal processing circuit 35a Number level changed below decision threshold Sth.Therefore, it is judged as that pin is inserted into decision circuit 35b whether pin insertion is good Normally, continue to be pressed into the threadlike body 18 as connecting pin 2 to connector drum 1.
However, when reaching solder attachment portion as the front end of the threadlike body 18 of connecting pin 2 as shown in Figure 8, to even The indentation of outbound 2 generates obstacle, and therefore, as shown in Figure 10, the maximum value for becoming rms signal is more than the degree of decision threshold Sth Big rms signal.Therefore, decision circuit 35b exports bad detection letter to pin insertion control unit 36 whether good from pin insertion Number.The decline for selling the pin insertion head 14 of insertion apparatus 11 as a result, is stopped.It then, will be more than the rms signal of decision threshold Sth Maximum value and be currently pressed into threadlike body 18 connector drum 1 intrinsic identification information storage to flame storage unit 35c.Then, these information are shown on display unit 35d.
As described above, stop indentation before the threadlike body 18 for being pressed into connector drum 1 is substantially bent or fractures, because This is reliably prevented from causes to damage or impact insulate electrical substrate 3 to pin insertion apparatus 11.
Then, the insulate electrical substrate 3 for stopping insertion connecting pin 2 is unloaded from XY platform 13, by new insulate electrical substrate 3 It is placed in XY platform 13, thus again proceeds with pin insertion process.
Moreover, be inserted into undesirable insulate electrical substrate 3 for producing pin, by the intrinsic of flame and connector drum 1 Identification information stored together to flame storage unit 35c, and be shown on display device 35d, therefore production can be specified The connector drum 1 of failure welding has been given birth to confirm failure welding state.
In this way, unloading the connection for having the insulate electrical substrate 3 for the connector drum 1 for producing failure welding state Cylinder 1 welds new electric conductivity cylinder 1 by manually, later, such as using manual pin insertion machine to remaining electric conductivity cylinder Body 1 is pressed into connecting pin 2, and thus, it is possible to terminate pin insertion process.
At this point, AE sensor 25 is also installed at clamping section for manual pin insertion machine (not shown), analog signal is pre- Processing circuit 33, A-D conversion circuit 34 and determination unit 35 are connected to the connector 32 of the AE sensor 25, thus, it is possible to it is upper The pin insertion apparatus 11 stated similarly judges that pin insertion is bad.
Moreover, in the above-described embodiment, applying AE sensor 25 as vibrating sensor, therefore test pin insertion is not Good responsiveness is fast, can promptly carry out pin insert state it is good whether determine.
In addition, also storing rms signal when being inserted into connecting pin to each connector drum 1 in the case of pin is inserted into good Maximum value, thus, it is possible to carry out the evaluation of pin insert state.
Incidentally, by connector drum 1 it is good whether state carry out the image that shoots of X-ray and to the connection The result that the peak value that cylinder 1 has been pressed into the rms signal in the state of connecting pin 2 is compared has obtained result shown in Figure 11. That is, confirming following situations: in connector drum 1A~1C more than the adhesion amount of the solder of inner peripheral surface, the peak value of rms signal is super Decision threshold Sth has been crossed, for the connector drum 1D~1F few for the adhesion amount of the solder of inner peripheral surface, the maximum of rms signal It is worth sufficiently small compared with decision threshold Sth.Thus, it is possible to correctly carry out pin insert state according to the maximum value of rms signal It is good whether judgement.
In addition, illustrating to cut off threadlike body 18 in pin insertion apparatus 11 in the above-described embodiment to form connecting pin 2 The case where, but not limited to this, the vibration feeder etc. for keeping the connecting pin 2 being initially switched off in advance also can be set, by connecting pin 2 By root it is supplied to clamping section 20.
In addition, the canister portion cross sectional shape of connector drum 1 and the cross sectional shape of connecting pin 2 be not limited to it is cylinder-shaped and rectangular, It can make the rectangular canister portion of the canister portion of connector drum 1, keep the cross sectional shape of connecting pin 2 round, or make the cylinder of connector drum 1 Portion is triangle, the cross sectional shape quadrangle for making connecting pin 2 etc., as long as being formed to be pressed into connecting pin to connector drum 1 2, it will be able to be set as the combination of arbitrary shape.
In addition, illustrating that 3 side of insulate electrical substrate of pin insertion apparatus 11 carries out XY movement, pin in the above-described embodiment Insertion head 14 situation about moving along the vertical direction, but it is mobile and by insulate electrical substrate that pin insertion head 14 can also be made to carry out XY 3 sides are fixed, and the two can also be made to carry out XY mobile, or a side is made to move in X direction, move another party along Y-direction.
In addition, above structure is not limited to as pin insertion apparatus 11, as long as can connecting pin be held and is pressed into The structure of connector drum 1, it will be able to apply arbitrary structure.
In addition, be not limited to connector drum as cylinder, can with whether conductive independently apply arbitrary cylinder Body, can be using the present invention in the case where being pressed into conductive or pin without electric conductivity to the cylinder.
In addition, it is not limited to AE sensor as vibrating sensor, it can be using energy such as piezoelectric transducer, strain transducers Enough probing pins are inserted into undesirable arbitrary sensor.
Also, illustrate solder attachment in the feelings of the failure welding of the inner peripheral surface of connector drum 1 in the above-described embodiment Condition, but not limited to this, can judge that the pin insertion in following situation etc. is bad: be attached in the inner peripheral surface of connector drum 1 Protrusion, insertion prevent object, and perhaps the cylindrical portion deformation of connector drum 1 or connector drum 1 are obliquely fixed on insulated electro roadbed Plate 3.

Claims (8)

1. a kind of pin insertion apparatus, for pressing the pin into the hollow cylinder for being fixed in substrate, the spy of the pin insertion apparatus Sign is have:
Pin insertion head, above-mentioned pin is kept and is inserted into above-mentioned cylinder;
Vibrating sensor is installed on pin insertion head, detects the mistake for being inserted into above-mentioned pin to above-mentioned cylinder in above-mentioned pin insertion head Vibrational energy in journey;And
It is inserted into bad determination unit, during above-mentioned pin is inserted into head and is inserted into above-mentioned pin to above-mentioned cylinder, based on by the vibration The vibrational energy detected value and decision threshold that sensor detects determine the above-mentioned pin to the good of the insert state of above-mentioned cylinder Whether,
Wherein, during above-mentioned pin is inserted into head and is inserted into above-mentioned pin to above-mentioned cylinder, when being determined as that insert state is bad, make Must stop insertion of the pin to above-mentioned cylinder, the kilter for being determined as insert state continue when, continue up state cylinder insert Enter above-mentioned pin, until the front end of above-mentioned pin is pressed into specified position in above-mentioned cylinder.
2. pin insertion apparatus according to claim 1, which is characterized in that
Aforesaid substrate is made of the insulate electrical substrate for having insulating substrate and wired circuit,
Above-mentioned cylinder is made of the electric conductivity cylinder with canister portion and flange part, and the flange part is in above-mentioned cylinder and above-mentioned wiring To radially projecting at the end of the side of circuit connection,
Above-mentioned pin is made of conductive metal.
3. pin insertion apparatus according to claim 1 or 2, which is characterized in that
Above-mentioned vibrating sensor is made of any of strain transducer, piezoelectric transducer, acoustic emission sensor.
4. pin insertion apparatus according to claim 1, which is characterized in that
The above-mentioned bad determination unit of insertion is entered the vibrational energy detected value detected by above-mentioned vibrating sensor, calculates the vibration The root mean square of energy detection value is judged to being inserted into bad when the peak value of calculated root mean square has been more than above-mentioned decision threshold.
5. pin insertion apparatus according to claim 4, which is characterized in that
The above-mentioned bad determination unit of insertion has flame storage unit, which is judged to being inserted into undesirable The maximum value of the identification information of cylinder and above-mentioned root mean square.
6. pin insertion apparatus according to claim 4 or 5, which is characterized in that
Have the pin insertion control unit for driving above-mentioned pin insertion head,
The above-mentioned bad determination unit of insertion makes above-mentioned pin insertion head when being judged to being inserted into bad, to the insertion control unit transmission of above-mentioned pin Decline stop decline stop signal,
Above-mentioned pin insertion control unit stops the decline of above-mentioned pin insertion head when receiving above-mentioned decline stop signal.
7. a kind of pin is inserted into bad determination method, which is characterized in that have following steps:
Detect the vibrational energy generated when pressing the pin into the cylinder for being fixed in substrate;And
During being inserted into above-mentioned pin to above-mentioned cylinder, based on the vibrational energy detected value detected and pre-determined judgement Threshold value come determine above-mentioned pin to the insert state of above-mentioned cylinder it is good whether,
Wherein, during being inserted into above-mentioned pin to above-mentioned cylinder, when being determined as that insert state is bad, so that stopping the pin pair The insertion of above-mentioned cylinder continues up when the kilter for being determined as insert state continues and states the above-mentioned pin of cylinder insertion, until Until the front end of above-mentioned pin is pressed into specified position in above-mentioned cylinder.
8. pin according to claim 7 is inserted into bad determination method, which is characterized in that
The detection of above-mentioned vibrational energy is carried out using acoustic emission sensor.
CN201510077029.4A 2014-03-20 2015-02-12 Pin insertion device and method for determining defective pin insertion Active CN104936429B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014057392A JP6323098B2 (en) 2014-03-20 2014-03-20 Pin insertion device and pin insertion failure determination method
JP2014-057392 2014-03-20

Publications (2)

Publication Number Publication Date
CN104936429A CN104936429A (en) 2015-09-23
CN104936429B true CN104936429B (en) 2019-04-19

Family

ID=54123298

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510077029.4A Active CN104936429B (en) 2014-03-20 2015-02-12 Pin insertion device and method for determining defective pin insertion

Country Status (2)

Country Link
JP (1) JP6323098B2 (en)
CN (1) CN104936429B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10109974B2 (en) * 2016-01-29 2018-10-23 The Boeing Company Vibrating pallet system for automated wire insertion
CN107220136A (en) * 2016-03-21 2017-09-29 塞米西斯科株式会社 Key seat, the pin of inside cavity damage detection means and its method
DE102017206217A1 (en) 2017-04-11 2018-10-11 Robert Bosch Gmbh Electrical contact arrangement
JP7107120B2 (en) 2018-09-14 2022-07-27 富士電機株式会社 Semiconductor device, method for manufacturing semiconductor device
CN111355111B (en) * 2020-04-10 2021-03-12 吴天琪 Connector contact pin test equipment
IT202000023641A1 (en) 2020-10-07 2022-04-07 St Microelectronics Srl ELEMENT FOR CLAMPING PINS OF CONNECTION OF SEMICONDUCTRIC LEADS, PARTICULARLY FOR POWER MODULES FOR AUTOMOTIVE APPLICATIONS, AND METHOD OF ASSEMBLY

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1389962A (en) * 1995-11-14 2003-01-08 富士通株式会社 Plug inserting-pulling-out device and plug-retaining method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61202500A (en) * 1985-03-05 1986-09-08 株式会社日立製作所 Abnormal insertion detection method
JP3404957B2 (en) * 1995-01-17 2003-05-12 安藤電気株式会社 Press-fit control method for connector press-fitting device
DE102008005547B4 (en) * 2008-01-23 2013-08-29 Infineon Technologies Ag Power semiconductor module and circuit arrangement with a power semiconductor module
KR101044126B1 (en) * 2008-04-21 2011-06-28 주식회사 선일기연 Pin defect insertion detection method of a PCB and its detecting jig device
JP5751583B2 (en) * 2011-06-09 2015-07-22 富士機械製造株式会社 Substrate transport device, electronic component mounting machine, substrate transport method, electronic component mounting method
JP5887901B2 (en) * 2011-12-14 2016-03-16 富士電機株式会社 Semiconductor device and manufacturing method of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1389962A (en) * 1995-11-14 2003-01-08 富士通株式会社 Plug inserting-pulling-out device and plug-retaining method

Also Published As

Publication number Publication date
JP6323098B2 (en) 2018-05-16
JP2015179646A (en) 2015-10-08
CN104936429A (en) 2015-09-23

Similar Documents

Publication Publication Date Title
CN104936429B (en) Pin insertion device and method for determining defective pin insertion
US8181527B2 (en) Method and apparatus for pass/fail determination of bonding and bonding apparatus
US20140173887A1 (en) Process for Nondestructive Evaluation of the Quality of a Crimped Wire Connector
KR102242248B1 (en) Welding inspection device and inspection method for secondary battery
TWI539541B (en) Threading device and wire method
US9899348B2 (en) Wire bonding apparatus and method of manufacturing semiconductor device
CN107124904B (en) Wire bonding device
JP6109072B2 (en) Probe unit
WO2018110417A1 (en) Wire bonding device and wire bonding method
US6250163B1 (en) EMATS for spot weld examination
US6667625B1 (en) Method and apparatus for detecting wire in an ultrasonic bonding tool
JP5144997B2 (en) Contact probe unit and manufacturing method thereof
US8231046B2 (en) Wire bonding apparatus and wire bonding method
JPWO2010113250A1 (en) Bonding quality inspection apparatus and bonding quality inspection method
CN104708194A (en) Clamp force and alignment checking device
CN1310071A (en) Piezoelectric sensors for measuring welding parameters
KR20060102558A (en) Conductor welding method
KR20130036104A (en) Method of live inspecting welding state on ultrasonic welding
JP2009288145A (en) Evaluation method and evaluating device of thin film adhesion strength
WO2018088273A1 (en) Method of manufacturing ctod test piece, and plastic strain adjusting jig
JP2018074577A (en) Method and apparatus for detection of broken piezoelectric material of ultrasonic transducer of ultrasonic stack
US9208807B2 (en) Motor polarity testing of a dual stage actuated disk drive head suspension
CN216144737U (en) Device for detecting weld joint quality of tailor-welded blank by utilizing electromagnetic ultrasonic
JP2005271029A (en) Ultrasonic welding equipment
Yost et al. Process for Nondestructive Evaluation of the Quality of a Crimped Wire Connector

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant