CN104936377A - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN104936377A CN104936377A CN201510317574.6A CN201510317574A CN104936377A CN 104936377 A CN104936377 A CN 104936377A CN 201510317574 A CN201510317574 A CN 201510317574A CN 104936377 A CN104936377 A CN 104936377A
- Authority
- CN
- China
- Prior art keywords
- parts
- circuit board
- components
- printed circuit
- height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a printed circuit board. The printed circuit board comprises a plurality of first class bonding pads, and a plurality of second class bonding pads. The first class bonding pads are used for electrically connecting with a plurality of components which are to be mounted and plugged. The components and the first class bonding pads are in one-to-one correspondence. The second class bonding pads are used for electrically connecting with parts of a predetermined shape. The second class bonding pads are relatively arranged in the middle positions of the plurality of first class bonding pads. The parts are higher than the components. As the parts fixed on the surface of a circuit board are higher than other components, the parts can protect components around the parts in transportation so as to prevent the components from falling off the circuit board. The production efficiency is improved while no extra operation procedure is increased, and the labor cost is lowered.
Description
Technical field
The present invention relates to printed circuit board technology field, particularly relate to a kind of printed circuit board preventing components and parts from dropping from printed circuit board.
Background technology
Components and parts in transportation on printed circuit board are easily touched down, and the mode of spreading glue around components and parts that is typically employed in is fixed, or employing is protected components and parts in the mode of component surface covered with protective film.
Above-mentioned two kinds of protection fixed forms all need additionally to increase operational sequence, not only add cost of labor, and reduce production efficiency.
Summary of the invention
For deficiency of the prior art, now provide a kind of printed circuit board being intended to realize to enhance productivity while not increasing operation bidirectional operation.
Concrete technical scheme is as follows:
A kind of printed circuit board, comprising:
A plurality of first kind pad, in order to be electrically connected with a plurality of components and parts of to be mounted or grafting, described components and parts and described first kind pad one_to_one corresponding;
Equations of The Second Kind pad, in order to be electrically connected with the parts of reservation shape, the centre position of what described Equations of The Second Kind pad was relative be positioned at a plurality of described first kind pad;
The height of described parts is higher than the height of described components and parts.
Preferably, the cross section of described parts is U-shaped.
Preferably, described Equations of The Second Kind pad is multiple.
Preferably, the width of described parts is greater than the width of described components and parts.
Preferably, described grounding components.
Preferably, the difference in height between described parts and described components and parts is between 0.3mm ~ 0.5mm.
Preferably, the height of described parts is between 0.6mm ~ 0.9mm.
Preferably, described parts are mounted on described Equations of The Second Kind bond pad surface.
The beneficial effect of technique scheme:
In the technical program, owing to being fixed on the components and parts of component height higher than other of circuit board surface in printed circuit board, therefore can play the effect of protection in transportation to the components and parts around parts, prevent components and parts from coming off from circuit board.Thus reach in the object without the need to improve production efficiency while increasing operation bidirectional operation, and reduce human cost.
Accompanying drawing explanation
Fig. 1 is the structure chart of a kind of embodiment of printed circuit board of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite of not making creative work, all belongs to the scope of protection of the invention.
It should be noted that, when not conflicting, the embodiment in the present invention and the feature in embodiment can combine mutually.
Below in conjunction with the drawings and specific embodiments, the invention will be further described, but not as limiting to the invention.
As shown in Figure 1, a kind of printed circuit board, comprising:
A plurality of first kind pad, in order to be electrically connected with a plurality of components and parts of to be mounted or grafting, components and parts and first kind pad one_to_one corresponding;
Equations of The Second Kind pad, in order to be electrically connected with the parts of reservation shape, the centre position of what Equations of The Second Kind pad was relative be positioned at a plurality of first kind pad;
The height of parts is higher than the height of components and parts.
In the present embodiment, owing to being fixed on the components and parts of component height higher than other of circuit board surface in surface-pasted process, therefore can play the effect of protection in transportation to the components and parts around parts, prevent components and parts from coming off from circuit board.Thus reach in the object without the need to improve production efficiency while increasing operation bidirectional operation, and reduce human cost.
In a preferred embodiment, the cross section of parts is U-shaped.
Adopt the U-shaped parts of cross section can save the materials of parts in the present embodiment, the shape of parts can adjust accordingly according to actual conditions, also can be cuboid or other shapes.
In a preferred embodiment, Equations of The Second Kind pad is multiple.
In the present embodiment, can arrange the number of Equations of The Second Kind pad according to the size of printed circuit board, large-sized printed circuit board can arrange multiple Equations of The Second Kind pad to mount multiple parts, thus plays a protective role to other components and parts on printed circuit board.
As shown in Figure 1, in a preferred embodiment, the width of parts is greater than the width of each components and parts.
In Fig. 1: device a, device b, device c represent the components and parts of the dispersion on printed circuit board respectively;
Parts d represents the parts that cross section is U-shaped;
The height of device a is H1, and the height of device b is H2, and the height of device c is H4, and the height of parts d is H3;
The width of device a is L1, and the width of device b is L2, and the width of device c is L4, and the width of device d is L3;
Wherein, H3>H1 and H3>H2 and H3>H4, L3>L1 and L3>L2 and L3>L4.
In actual applications, parts can be arranged at the center of printed circuit board, because the height of parts is higher than the height of other components and parts, therefore can plays the effect of protection in transportation to the components and parts around parts, prevent components and parts from coming off from circuit board.
In a preferred embodiment, grounding components.
In the present embodiment, parts and Equations of The Second Kind pad are electrically connected and ground connection, even if touched down under transport or other situations, also can not impact remaining components and parts on printed circuit board.
In a preferred embodiment, the difference in height between parts and components and parts is between 0.3mm ~ 0.5mm.
In a preferred embodiment, the height of parts is between 0.6mm ~ 0.9mm.
In the present embodiment; take height as the components and parts of 0.5mm be example; drop in transportation to prevent the components and parts on printed circuit board; can in surface-pasted process, the parts highly for 0.8mm be mounted on printed circuit board, thus other components and parts around parts are played a protective role.
In a preferred embodiment, parts are mounted on Equations of The Second Kind bond pad surface.
In the present embodiment, height is mounted on the Equations of The Second Kind pad on printed circuit board surface higher than the parts of the preset shape of the height of the components and parts of to be mounted or grafting, drops from printed circuit board surface in transportation to prevent components and parts.
The foregoing is only preferred embodiment of the present invention; not thereby embodiments of the present invention and protection range is limited; to those skilled in the art; should recognize and all should be included in the scheme that equivalent replacement done by all utilizations specification of the present invention and diagramatic content and apparent change obtain in protection scope of the present invention.
Claims (8)
1. a printed circuit board, is characterized in that, comprising:
A plurality of first kind pad, in order to be electrically connected with a plurality of components and parts of to be mounted or grafting, described components and parts and described first kind pad one_to_one corresponding;
Equations of The Second Kind pad, in order to be electrically connected with the parts of reservation shape, the centre position of what described Equations of The Second Kind pad was relative be positioned at a plurality of described first kind pad;
The height of described parts is higher than the height of described components and parts.
2. printed circuit board as claimed in claim 1, it is characterized in that, the cross section of described parts is U-shaped.
3. printed circuit board as claimed in claim 1, it is characterized in that, described Equations of The Second Kind pad is multiple.
4. printed circuit board as claimed in claim 1, it is characterized in that, the width of described parts is greater than the width of described components and parts.
5. printed circuit board as claimed in claim 1, is characterized in that, described grounding components.
6. printed circuit board as claimed in claim 1, it is characterized in that, the difference in height between described parts and described components and parts is between 0.3mm ~ 0.5mm.
7. printed circuit board as claimed in claim 1, it is characterized in that, the height of described parts is between 0.6mm ~ 0.9mm.
8. printed circuit board as claimed in claim 1, it is characterized in that, described parts are mounted on described Equations of The Second Kind bond pad surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510317574.6A CN104936377A (en) | 2015-06-10 | 2015-06-10 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510317574.6A CN104936377A (en) | 2015-06-10 | 2015-06-10 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104936377A true CN104936377A (en) | 2015-09-23 |
Family
ID=54123253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510317574.6A Pending CN104936377A (en) | 2015-06-10 | 2015-06-10 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104936377A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101257766A (en) * | 2007-02-26 | 2008-09-03 | 日本电气株式会社 | Printed circuit board and method of producing the same |
| CN103794701A (en) * | 2014-01-26 | 2014-05-14 | 晶科电子（广州）有限公司 | LED support and LED device thereof |
| US20150001699A1 (en) * | 2013-07-01 | 2015-01-01 | Renesas Electronics Corporation | Semiconductor device |
-
2015
- 2015-06-10 CN CN201510317574.6A patent/CN104936377A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101257766A (en) * | 2007-02-26 | 2008-09-03 | 日本电气株式会社 | Printed circuit board and method of producing the same |
| US20150001699A1 (en) * | 2013-07-01 | 2015-01-01 | Renesas Electronics Corporation | Semiconductor device |
| CN103794701A (en) * | 2014-01-26 | 2014-05-14 | 晶科电子（广州）有限公司 | LED support and LED device thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150923 |