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CN104935207B - Macro-micro-displacement combined piezoelectric ceramic stack actuator - Google Patents

Macro-micro-displacement combined piezoelectric ceramic stack actuator Download PDF

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CN104935207B
CN104935207B CN201510345943.2A CN201510345943A CN104935207B CN 104935207 B CN104935207 B CN 104935207B CN 201510345943 A CN201510345943 A CN 201510345943A CN 104935207 B CN104935207 B CN 104935207B
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piezoelectric ceramic
ceramic stack
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displacement
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CN104935207A (en
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刘延芳
齐乃明
张宁波
武海生
邹丹
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Harbin Institute of Technology Shenzhen
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Abstract

The invention discloses a macro-micro-displacement combined piezoelectric ceramic stack actuator, and belongs to the technical field of macro-micro-displacement driving. The actuator aims at solving the problem that the existing displacement driving device adopting a piezoelectric ceramic stack cannot give consideration to large stroke and high-accuracy displacement resolution. A micro piezoelectric ceramic stack and a macro piezoelectric ceramic stack of the actuator are arranged in a stacking manner; the micro piezoelectric ceramic stack is connected with a first driving power supply by a micro piezoelectric ceramic stack anode and a micro piezoelectric ceramic stack cathode; the macro piezoelectric ceramic stack is connected with a second driving power supply by a macro piezoelectric ceramic stack anode and a macro piezoelectric ceramic stack cathode; a large stroke requirement is realized by the macro piezoelectric ceramic stack; a high displacement resolution requirement is realized by the micro piezoelectric ceramic stack; and the ceramic sheet layer number and the maximum driving voltage of the macro piezoelectric ceramic stack and the micro piezoelectric ceramic stack are reasonably designed. According to the actuator, the large stroke of the actuator can be realized, and the high-accuracy displacement resolution of the actuator can be ensured.

Description

宏微位移组合压电陶瓷堆叠作动器Combination of Macro and Micro Displacement Piezoelectric Ceramic Stack Actuator

技术领域technical field

本发明涉及宏微位移组合压电陶瓷堆叠作动器,属于宏微位移驱动技术领域。The invention relates to a macro-micro displacement combined piezoelectric ceramic stack actuator, which belongs to the technical field of macro-micro displacement driving.

背景技术Background technique

压电陶瓷被广泛应用于传感和驱动领域,压电陶瓷堆叠是压电陶瓷最为广泛应用形式之一。单片压电陶瓷在施加电压后产生的位移极其微小,压电陶瓷堆叠通过将许多层陶瓷片堆叠在一起,来实现较大的位移。通常压电陶瓷堆叠的行程在几个到几十个微米之间,为了实现这样的行程,堆叠陶瓷片的层数要达到数百层。堆叠的陶瓷片在引电极时,采用并联连接的方式,在施加外界驱动电压时,所有的陶瓷片的驱动电压是相同的。因此,压电陶瓷堆叠所实现位移分辨率取决于所施加的电压的分辨率和堆叠的层数。电压分辨率越高,压电陶瓷堆叠能分辨的最小位移越小;堆叠的层数越多,所能分辨的最小位移越大。为了保证压电陶瓷行程的需求,堆叠的层数不能太小,因此,通常通过提高电压分辨率的方法来提高压电陶瓷堆叠的位移分辨精度。采用数字计算机控制时,电压分辨率的精度取决于模数转换的精度和最大施加的电压,所述模数转换的精度即DA转换的位数。减小最大施加的电压可以实现分辨更小的电压,然而也会减小压电陶瓷堆叠的行程。因此,在应用中一般通过提高DA转换的精度及增加DA转换的位数来提高压电陶瓷堆叠的位移分辨率。然而DA转换的位数并不能无限制提高,在提高到一定程度后,如16位DA转换,每提高一位都会付出巨大的成本。另一方面,由于实际应用环境中噪声等影响,当最小能分辨的电压小到一定程度时,如几个毫伏,电压的分辨精度与噪声处在同一级别,一味提高电压分辨率而不考虑噪声并不能提高电压的精度,而噪声的抑制又相当复杂和困难。由于上述的困难和矛盾,在压电陶瓷堆叠的应用中,不得不在行程和位移分辨精度上进行折中。Piezoelectric ceramics are widely used in sensing and driving fields, and piezoelectric ceramic stacking is one of the most widely used forms of piezoelectric ceramics. The displacement of a single piezoelectric ceramic is extremely small after applying a voltage, and the piezoelectric ceramic stack achieves a large displacement by stacking many layers of ceramic sheets together. Usually, the stroke of the piezoelectric ceramic stack is between a few to tens of microns. In order to realize such a stroke, the number of layers of stacked ceramic sheets must reach hundreds of layers. The stacked ceramic sheets are connected in parallel when leading to electrodes, and when an external driving voltage is applied, the driving voltage of all the ceramic sheets is the same. Therefore, the displacement resolution achieved by the piezoelectric ceramic stack depends on the resolution of the applied voltage and the number of stacked layers. The higher the voltage resolution, the smaller the minimum displacement that can be resolved by the piezoelectric ceramic stack; the more layers in the stack, the greater the minimum displacement that can be resolved. In order to ensure the stroke requirements of piezoelectric ceramics, the number of stacked layers should not be too small. Therefore, the displacement resolution accuracy of piezoelectric ceramic stacks is usually improved by improving the voltage resolution. When digital computer control is adopted, the accuracy of voltage resolution depends on the accuracy of analog-to-digital conversion and the maximum applied voltage. The accuracy of analog-to-digital conversion is the number of digits converted by DA. Reducing the maximum applied voltage allows resolution of smaller voltages, but also reduces the travel of the piezo stack. Therefore, in the application, the displacement resolution of the piezoelectric ceramic stack is generally improved by improving the precision of the DA conversion and increasing the number of bits of the DA conversion. However, the number of bits of DA conversion cannot be increased without limit. After increasing to a certain extent, such as 16-bit DA conversion, every increase of one bit will pay a huge cost. On the other hand, due to the influence of noise in the actual application environment, when the minimum resolvable voltage is small to a certain extent, such as a few millivolts, the resolution accuracy of the voltage is at the same level as the noise. Noise does not improve voltage accuracy, and noise suppression is quite complex and difficult. Due to the above-mentioned difficulties and contradictions, in the application of the piezoelectric ceramic stack, a compromise has to be made on the travel and displacement resolution accuracy.

随着微位移技术的发展,特别是医疗、生物、微电子等高新技术不断深度和推广,对于既能实现较大位移、又能保持高精度分辨率的微位移驱动装置提出了迫切需求。With the development of micro-displacement technology, especially the continuous deepening and promotion of high-tech such as medical treatment, biology, and microelectronics, there is an urgent need for micro-displacement driving devices that can achieve large displacements while maintaining high-precision resolution.

发明内容Contents of the invention

本发明目的是为了解决现有采用压电陶瓷堆叠的位移驱动装置不能兼顾大行程和高精度位移分辨率的问题,提供了一种宏微位移组合压电陶瓷堆叠作动器。The purpose of the present invention is to solve the problem that the existing displacement driving device using piezoelectric ceramic stacks cannot take into account both large stroke and high-precision displacement resolution, and provides a macro-micro displacement combined piezoelectric ceramic stack actuator.

本发明所述宏微位移组合压电陶瓷堆叠作动器,它包括微压电陶瓷堆叠、宏压电陶瓷堆叠、微压电陶瓷堆叠正电极、宏压电陶瓷堆叠正电极、微压电陶瓷堆叠负电极和宏压电陶瓷堆叠负电极,The macro-micro-displacement combined piezoelectric ceramic stack actuator of the present invention includes a micro-piezoelectric ceramic stack, a macro piezoelectric ceramic stack, a micro-piezoelectric ceramic stack positive electrode, a macro piezoelectric ceramic stack positive electrode, and a micro-piezoelectric ceramic stack Stacked negative electrodes and macro piezoelectric ceramic stacked negative electrodes,

微压电陶瓷堆叠与宏压电陶瓷堆叠相堆叠设置,微压电陶瓷堆叠通过微压电陶瓷堆叠正电极和微压电陶瓷堆叠负电极与第一驱动电源连接,宏压电陶瓷堆叠通过宏压电陶瓷堆叠正电极和宏压电陶瓷堆叠负电极与第二驱动电源连接;The micro piezoelectric ceramic stack is stacked with the macro piezoelectric ceramic stack, the micro piezoelectric ceramic stack is connected to the first driving power supply through the micro piezoelectric ceramic stack positive electrode and the micro piezoelectric ceramic stack negative electrode, and the macro piezoelectric ceramic stack is connected to the first driving power supply through the macro piezoelectric ceramic stack The positive electrode of the piezoelectric ceramic stack and the negative electrode of the macro piezoelectric ceramic stack are connected to the second driving power supply;

微压电陶瓷堆叠的压电陶瓷片层数为n1,第一驱动电源的最大驱动电压为V1;微压电陶瓷堆叠实现的行程S1为:The number of piezoelectric ceramic sheets in the micro piezoelectric ceramic stack is n 1 , and the maximum driving voltage of the first driving power supply is V 1 ; the stroke S 1 realized by the micro piezoelectric ceramic stack is:

S1=n1d33V1S 1 =n 1 d 33 V 1 ;

式中d33为压电陶瓷片的压电常数;In the formula, d33 is the piezoelectric constant of the piezoelectric ceramic sheet;

微压电陶瓷堆叠所达到的位移分辨率δ1为:The displacement resolution δ 1 achieved by the micro piezoelectric ceramic stack is:

式中m是驱动电压的DA转换位数;In the formula, m is the DA conversion digit of the driving voltage;

宏压电陶瓷堆叠的压电陶瓷片层数为n2,第二驱动电源的最大驱动电压为V2;宏压电陶瓷堆叠实现的行程S2为:The number of piezoelectric ceramic sheets in the macro piezoelectric ceramic stack is n 2 , and the maximum driving voltage of the second driving power supply is V 2 ; the stroke S 2 realized by the macro piezoelectric ceramic stack is:

S2=n2d33V2S 2 =n 2 d 33 V 2 ;

宏压电陶瓷堆叠所达到的位移分辨率δ2为:The displacement resolution δ 2 achieved by the macro piezoelectric ceramic stack is:

使微压电陶瓷堆叠的行程S1与宏压电陶瓷堆叠的位移分辨率δ2满足以下关系:Make the stroke S 1 of the micro piezoelectric ceramic stack and the displacement resolution δ 2 of the macro piezoelectric ceramic stack satisfy the following relationship:

S1≥δ2S 1 ≥ δ 2 ,

即: which is:

设定所述作动器的期望位移为Sd,则宏压电陶瓷堆叠的期望位移为:Set the expected displacement of the actuator as S d , then the expected displacement of the macro piezoelectric ceramic stack for:

式中表示向零取整; In the formula Indicates rounding to zero;

微压电陶瓷堆叠的期望位移为:Expected Displacement of Micro Piezo Stacks for:

使经计算获得最大驱动电压为V1和最大驱动电压为V2Make Through calculation, the maximum driving voltage is V 1 and the maximum driving voltage is V 2 .

所有所述压电陶瓷片的材质为压电陶瓷材料PZT-554。All the piezoelectric ceramic sheets are made of piezoelectric ceramic material PZT-554.

本发明的优点:本发明所述宏微位移组合压电陶瓷堆叠作动器,能够在一般的AD转换精度下实现超高分辨率的微位移,它的微压电陶瓷堆叠和宏压电陶瓷堆叠分别通过将数百层陶瓷片通过粘结等工艺堆叠在一起,来实现较大的行程。由于在DA转换精度一定的情况下,压电陶瓷堆叠作动器的位移分辨率与最大的驱动电压和堆叠的层数成反比,因此本发明通过宏压电陶瓷堆叠实现大的行程,微压电陶瓷堆叠实现超高精度分辨率,通过对宏微压电陶瓷堆叠的层数和最大施加电压的选择,使得宏压电陶瓷堆叠实现的最小位移不大于微压电陶瓷堆叠的行程,从而保证了作动器的位移分辨率为微压电陶瓷堆叠的分辨率,而整个作动器的行程为宏微压电陶瓷堆叠的行程之和,由此,即保障了作动器的大行程,又保障了其高精度位移分辨率。The advantages of the present invention: the macro-micro-displacement combined piezoelectric ceramic stack actuator of the present invention can realize ultra-high-resolution micro-displacement under the general AD conversion accuracy, and its micro-piezoelectric ceramic stack and macro-piezoelectric ceramic stack Larger strokes are achieved by stacking hundreds of layers of ceramic sheets together through processes such as bonding. Since the displacement resolution of the piezoelectric ceramic stack actuator is inversely proportional to the maximum driving voltage and the number of stacked layers when the DA conversion accuracy is constant, the present invention achieves a large stroke through the macro piezoelectric ceramic stack, micro pressure The electric ceramic stack realizes ultra-high-precision resolution. By selecting the number of layers of the macro-micro piezoelectric ceramic stack and the maximum applied voltage, the minimum displacement achieved by the macro piezoelectric ceramic stack is not greater than the stroke of the micro piezoelectric ceramic stack, thereby ensuring The displacement resolution of the actuator is the resolution of the stack of micro piezoelectric ceramics, and the stroke of the entire actuator is the sum of the strokes of the stack of macro and micro piezoelectric ceramics, thus ensuring the large stroke of the actuator, It also guarantees its high-precision displacement resolution.

本发明解决了普通压电陶瓷堆叠在实现大行程和高的位移分辨率之间的矛盾。通过宏压电陶瓷堆叠实现大行程要求,微压电陶瓷堆叠实现高的位移分辨率要求,合理设计宏微压电陶瓷堆叠的陶瓷片层数和最大驱动电压。它在不增加DA转换精度要求和噪声处理难度的条件下,同时实现了大行程和高位移分辨率,降低了压电陶瓷堆叠应用的局限性,扩展了其应用范围,同时降低了成本。The invention solves the contradiction between common piezoelectric ceramics stacking to achieve large stroke and high displacement resolution. Large stroke requirements are achieved through macro piezoelectric ceramic stacking, high displacement resolution requirements are achieved through micro piezoelectric ceramic stacking, and the number of ceramic sheets and maximum driving voltage of macro and micro piezoelectric ceramic stacking are reasonably designed. It achieves large travel and high displacement resolution without increasing the DA conversion accuracy requirements and noise processing difficulty, reduces the limitations of piezoelectric ceramic stack applications, expands its application range, and reduces costs.

附图说明Description of drawings

图1是本发明所述宏微位移组合压电陶瓷堆叠作动器的结构示意图;Fig. 1 is a structural schematic diagram of a macro-micro-displacement combined piezoelectric ceramic stack actuator according to the present invention;

图2是本发明所述宏微位移组合压电陶瓷堆叠作动器的位移输出流程图。Fig. 2 is a flow chart of the displacement output of the macro-micro-displacement combined piezoelectric ceramic stack actuator of the present invention.

具体实施方式detailed description

具体实施方式一:下面结合图1说明本实施方式,本实施方式所述宏微位移组合压电陶瓷堆叠作动器,它包括微压电陶瓷堆叠1、宏压电陶瓷堆叠2、微压电陶瓷堆叠正电极3、宏压电陶瓷堆叠正电极4、微压电陶瓷堆叠负电极5和宏压电陶瓷堆叠负电极6,Specific Embodiment 1: The present embodiment will be described below in conjunction with FIG. 1 . The macro-micro displacement combined piezoelectric ceramic stack actuator in this embodiment includes a micro piezoelectric ceramic stack 1, a macro piezoelectric ceramic stack 2, and a micro piezoelectric ceramic stack. Ceramic stack positive electrode 3, macro piezoelectric ceramic stack positive electrode 4, micro piezoelectric ceramic stack negative electrode 5 and macro piezoelectric ceramic stack negative electrode 6,

微压电陶瓷堆叠1与宏压电陶瓷堆叠2相堆叠设置,微压电陶瓷堆叠1通过微压电陶瓷堆叠正电极3和微压电陶瓷堆叠负电极5与第一驱动电源连接,宏压电陶瓷堆叠2通过宏压电陶瓷堆叠正电极4和宏压电陶瓷堆叠负电极6与第二驱动电源连接;The micro piezoelectric ceramic stack 1 and the macro piezoelectric ceramic stack 2 are stacked, and the micro piezoelectric ceramic stack 1 is connected to the first driving power supply through the micro piezoelectric ceramic stack positive electrode 3 and the micro piezoelectric ceramic stack negative electrode 5. The electric ceramic stack 2 is connected to the second driving power supply through the macro piezoelectric ceramic stack positive electrode 4 and the macro piezoelectric ceramic stack negative electrode 6;

微压电陶瓷堆叠1的压电陶瓷片层数为n1,第一驱动电源的最大驱动电压为V1;微压电陶瓷堆叠1实现的行程S1为:The number of piezoelectric ceramic sheets in the micro piezoelectric ceramic stack 1 is n 1 , and the maximum driving voltage of the first driving power supply is V 1 ; the stroke S 1 realized by the micro piezoelectric ceramic stack 1 is:

S1=n1d33V1S 1 =n 1 d 33 V 1 ;

式中d33为压电陶瓷片的压电常数;In the formula, d33 is the piezoelectric constant of the piezoelectric ceramic sheet;

微压电陶瓷堆叠1所达到的位移分辨率δ1为:The displacement resolution δ 1 achieved by the micro piezoelectric ceramic stack 1 is:

式中m是驱动电压的DA转换位数;In the formula, m is the DA conversion digit of the driving voltage;

宏压电陶瓷堆叠2的压电陶瓷片层数为n2,第二驱动电源的最大驱动电压为V2;宏压电陶瓷堆叠2实现的行程S2为:The number of piezoelectric ceramic sheets in the macro piezoelectric ceramic stack 2 is n 2 , and the maximum driving voltage of the second driving power supply is V 2 ; the stroke S 2 realized by the macro piezoelectric ceramic stack 2 is:

S2=n2d33V2S 2 =n 2 d 33 V 2 ;

宏压电陶瓷堆叠2所达到的位移分辨率δ2为:The displacement resolution δ 2 achieved by the macro piezoelectric ceramic stack 2 is:

使微压电陶瓷堆叠1的行程S1与宏压电陶瓷堆叠2的位移分辨率δ2满足以下关系:Make the stroke S1 of the micro piezoelectric ceramic stack 1 and the displacement resolution δ2 of the macro piezoelectric ceramic stack 2 satisfy the following relationship:

S1≥δ2S 1 ≥ δ 2 ,

即: which is:

本实施方式中,根据实际的使用需要,微压电陶瓷堆叠负电极5和宏压电陶瓷堆叠负电极6可以短接。In this embodiment, according to actual needs, the micro piezoelectric ceramic stack negative electrode 5 and the macro piezoelectric ceramic stack negative electrode 6 can be short-circuited.

具体实施方式二:下面结合图2说明本实施方式,本实施方式对实施方式一作进一步说明,设定所述作动器的期望位移为Sd,则宏压电陶瓷堆叠2的期望位移为:Specific Embodiment 2: The present embodiment will be described below in conjunction with FIG. 2 . This embodiment will further describe Embodiment 1. If the desired displacement of the actuator is set as S d , then the desired displacement of the macro piezoelectric ceramic stack 2 for:

式中表示向零取整; In the formula Indicates rounding to zero;

微压电陶瓷堆叠1的期望位移为:Expected Displacement of Micro Piezo Stack 1 for:

使经计算获得最大驱动电压为V1和最大驱动电压为V2Make Through calculation, the maximum driving voltage is V 1 and the maximum driving voltage is V 2 .

使是采用上述分配时,自然满足的条件,由此使即期望位移不超过行程。Make is the condition that is naturally satisfied when the above distribution is adopted, so that That is, the expected displacement does not exceed the stroke.

本实施方式中微压电陶瓷堆叠1期望位移的获得方式,满足微压电陶瓷堆叠1的行程约束。此时,宏微位移组合压电陶瓷堆叠作动器的位移分辨率δ为微压电陶瓷堆叠1的位移分辨率,即:δ=δ1In this embodiment, the expected displacement of the micro piezoelectric ceramic stack 1 The acquisition method satisfies the travel constraint of the micro piezoelectric ceramic stack 1 . At this time, the displacement resolution δ of the combined macro-micro displacement piezoelectric ceramic stack actuator is the displacement resolution of the micro piezoelectric ceramic stack 1 , ie: δ=δ 1 .

具体实施方式三:下面结合图1和图2说明本实施方式,本实施方式对实施方式一或二作进一步说明,所有所述压电陶瓷片的材质为压电陶瓷材料PZT-554。Embodiment 3: The present embodiment will be described below with reference to FIG. 1 and FIG. 2 . This embodiment will further describe Embodiment 1 or 2. All the piezoelectric ceramic sheets are made of piezoelectric ceramic material PZT-554.

本实施方式中,驱动电压的DA转换位数m可以取值为8,所述压电陶瓷材料PZT-554的压电常数d33=810×10-12m/V。In this embodiment, the DA conversion number m of the driving voltage can be 8, and the piezoelectric constant d 33 of the piezoelectric ceramic material PZT-554 is 810×10 −12 m/V.

本发明的具体实施例:Specific embodiments of the present invention:

取V1=10V,n1=15,计算获得S1=121.5nm,δ1=0.48nm。Assuming V 1 =10V, n 1 =15, S 1 =121.5nm and δ 1 =0.48nm are calculated.

V2=150V,n2=255,计算获得S2=30982.5nm,δ2=121.50nm。V 2 =150V, n 2 =255, calculated to obtain S 2 =30982.5nm, δ 2 =121.50nm.

计算获得作动器的总行程S为:S=31104nm。由于S1≥δ2,为满足位移连续性,计算获得宏微压电陶瓷堆叠作动器的位移分辨率δ=δ1=0.48nm。The calculated total stroke S of the actuator is: S=31104nm. Since S 1 ≥ δ 2 , in order to satisfy the displacement continuity, the displacement resolution of the macro-micro piezoelectric ceramic stack actuator is calculated to be δ=δ 1 =0.48nm.

为了说明本发明的优越性,采用同样的总压电陶瓷片层数n=270、DA转换精度m=8和最大驱动电压V=150V的普通压电陶瓷堆叠作动器作为对比,其行程和位移分辨率分别为S=32805nm和δ=128.65nm。对比分析可见,本发明以位移损失5.2%的代价获得了268倍位移分辨率的提高。In order to illustrate the superiority of the present invention, the common piezoelectric ceramic stack actuator with the same total number of piezoelectric ceramic sheets n=270, DA conversion accuracy m=8 and maximum driving voltage V=150V is used as a comparison, and its stroke and The displacement resolutions are S = 32805 nm and δ = 128.65 nm, respectively. It can be seen from comparative analysis that the present invention obtains a 268-fold increase in displacement resolution at the cost of a displacement loss of 5.2%.

参考图2,以期望位移Sd=27551nm为例说明本发明所述宏微位移组合压电陶瓷堆叠作动器的工作方式。Referring to FIG. 2 , the working mode of the macro-micro-displacement combined piezoelectric ceramic stack actuator of the present invention is illustrated by taking the desired displacement S d =27551nm as an example.

根据期望位移的公式,计算获得进而计算获得再根据上述期望位移,分别计算获得最大驱动电压V1和最大驱动电压V2。驱动电压的计算取决于位移控制算法,可以根据理论公式或者通过实验拟合的曲线或公式获得。计算获得的驱动电压经过DA转换变成模拟信号分别施加在对应的驱动电压通道上,经过功率放大后施加到微压电陶瓷堆叠1和宏压电陶瓷堆叠2上,从而驱动宏微位移组合压电陶瓷堆叠作动器实现期望的位移。Displacement according to expectations formula, calculated to obtain And then calculated to get Then, according to the above-mentioned expected displacement, the maximum driving voltage V 1 and the maximum driving voltage V 2 are respectively calculated and obtained. The calculation of the driving voltage depends on the displacement control algorithm, and can be obtained according to a theoretical formula or a curve or formula fitted through experiments. The calculated driving voltage is transformed into an analog signal by DA conversion and applied to the corresponding driving voltage channel, and then applied to the micro piezoelectric ceramic stack 1 and the macro piezoelectric ceramic stack 2 after power amplification, thereby driving the combined macro and micro displacement piezoelectric Ceramic stack actuators achieve the desired displacement.

Claims (2)

1.一种宏微位移组合压电陶瓷堆叠作动器,其特征在于,它包括微压电陶瓷堆叠(1)、宏压电陶瓷堆叠(2)、微压电陶瓷堆叠正电极(3)、宏压电陶瓷堆叠正电极(4)、微压电陶瓷堆叠负电极(5)和宏压电陶瓷堆叠负电极(6),1. A macro and micro displacement combined piezoelectric ceramic stack actuator, characterized in that it comprises a micro piezoelectric ceramic stack (1), a macro piezoelectric ceramic stack (2), and a micro piezoelectric ceramic stack positive electrode (3) , a macro piezoelectric ceramic stack positive electrode (4), a micro piezoelectric ceramic stack negative electrode (5) and a macro piezoelectric ceramic stack negative electrode (6), 微压电陶瓷堆叠(1)与宏压电陶瓷堆叠(2)相堆叠设置,微压电陶瓷堆叠(1)通过微压电陶瓷堆叠正电极(3)和微压电陶瓷堆叠负电极(5)与第一驱动电源连接,宏压电陶瓷堆叠(2)通过宏压电陶瓷堆叠正电极(4)和宏压电陶瓷堆叠负电极(6)与第二驱动电源连接;The micro piezoelectric ceramic stack (1) is stacked with the macro piezoelectric ceramic stack (2), and the micro piezoelectric ceramic stack (1) uses the micro piezoelectric ceramic stack positive electrode (3) and the micro piezoelectric ceramic stack negative electrode (5 ) is connected to the first driving power supply, and the macro piezoelectric ceramic stack (2) is connected to the second driving power supply through the macro piezoelectric ceramic stack positive electrode (4) and the macro piezoelectric ceramic stack negative electrode (6); 微压电陶瓷堆叠(1)的压电陶瓷片层数为n1,第一驱动电源的最大驱动电压为V1;微压电陶瓷堆叠(1)实现的行程S1为:The number of layers of piezoelectric ceramic sheets in the micro piezoelectric ceramic stack (1) is n 1 , and the maximum driving voltage of the first driving power supply is V 1 ; the stroke S 1 realized by the micro piezoelectric ceramic stack (1) is: S1=n1d33V1S 1 =n 1 d 33 V 1 ; 式中d33为压电陶瓷片的压电常数;In the formula, d33 is the piezoelectric constant of the piezoelectric ceramic sheet; 微压电陶瓷堆叠(1)所达到的位移分辨率δ1为:The displacement resolution δ 1 achieved by the micro piezoelectric ceramic stack (1) is: δδ 11 == nno 11 dd 3333 VV 11 22 mm -- 11 ,, 式中m是驱动电压的DA转换位数;In the formula, m is the DA conversion digit of the driving voltage; 宏压电陶瓷堆叠(2)的压电陶瓷片层数为n2,第二驱动电源的最大驱动电压为V2;宏压电陶瓷堆叠(2)实现的行程S2为:The number of layers of piezoelectric ceramic sheets in the macro piezoelectric ceramic stack (2) is n 2 , and the maximum driving voltage of the second driving power supply is V 2 ; the stroke S 2 realized by the macro piezoelectric ceramic stack (2) is: S2=n2d33V2S 2 =n 2 d 33 V 2 ; 宏压电陶瓷堆叠(2)所达到的位移分辨率δ2为:The displacement resolution δ 2 achieved by the macro piezoelectric ceramic stack (2) is: δδ 22 == nno 22 dd 3333 VV 22 22 mm -- 11 ;; 使微压电陶瓷堆叠(1)的行程S1与宏压电陶瓷堆叠(2)的位移分辨率δ2满足以下关系:Make the stroke S1 of the micro piezoelectric ceramic stack ( 1 ) and the displacement resolution δ2 of the macro piezoelectric ceramic stack ( 2 ) satisfy the following relationship: S1≥δ2S 1 ≥ δ 2 , 即: n 2 V 2 n 1 V 1 ≤ 2 m - 1. which is: no 2 V 2 no 1 V 1 ≤ 2 m - 1. 2.根据权利要求1所述的宏微位移组合压电陶瓷堆叠作动器,其特征在于,2. The macro-micro-displacement combined piezoelectric ceramic stack actuator according to claim 1, characterized in that, 设定所述作动器的期望位移为Sd,则宏压电陶瓷堆叠(2)的期望位移为:Set the expected displacement of the actuator as S d , then the expected displacement of the macro piezoelectric ceramic stack (2) for: 式中表示向零取整; In the formula Indicates rounding to zero; 微压电陶瓷堆叠(1)的期望位移为:Expected Displacement of Micro Piezoelectric Ceramic Stack(1) for: SS 11 dd == SS dd -- SS 22 dd ;; 使经计算获得最大驱动电压为V1和最大驱动电压为V2Make Through calculation, the maximum driving voltage is V 1 and the maximum driving voltage is V 2 .
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