CN104910632B - A kind of cryogenic vulcanization heat-conducting silicon rubber and preparation method thereof - Google Patents

Abstract

The invention belongs to the technical field of silicone rubber, and discloses a low-temperature vulcanized heat-conducting silicone rubber and a preparation method thereof. The silicone rubber contains the following components in parts by weight: 100 parts of vinyl silicone raw rubber, 20-40 parts of diluent, 123-208 parts of modified thermally conductive filler, 30-40 parts of white carbon black, 1-3 parts of hydrogen-containing silicone oil 0.1-0.3 parts of platinum catalyst and 0.01-0.2 parts of inhibitor. The preparation method is as follows: blending vinyl silicon raw rubber, modified thermal conductive filler, white carbon black and diluent to obtain component A; adding component A to the drum of the double-roll mill, adding the compound containing Hydrogen silicone oil, platinum catalyst and inhibitor are then mixed, and the mixed rubber is thinly passed to obtain low-temperature vulcanized heat-conducting silicone rubber. The present invention adopts a special process to modify the thermally conductive filler, and the added amount of the modified thermally conductive filler is optimized, so that the thermally conductive silicone rubber of the present invention has good thermal conductivity and mechanical properties.

Description

A kind of low-temperature vulcanized heat-conducting silicone rubber and preparation method thereof

technical field

The invention belongs to the technical field of silicone rubber, and in particular relates to a low-temperature vulcanized heat-conducting silicone rubber and a preparation method thereof.

Background technique

With the development of science and technology, people's demand and requirements for electronic products are getting higher and higher, and electronic products are developing in the direction of integration, miniaturization, high performance, energy saving, environmental protection and safety. With the high integration of electronic products, the heat generated per unit volume continues to increase, and heat dissipation will inevitably become a factor that limits its development. Therefore, the development of high thermal conductivity and heat dissipation materials with appropriate viscosity, strong adaptability and low price has become a common concern in the fields of electronic appliances and materials.

Filling various inorganic heat-conducting powders into high-molecular polymers can make high-heat-conducting composite materials. The potting and encapsulation materials currently used are mainly synthetic polymer materials, among which epoxy resin, polyurethane and rubber are the most widely used. Silicone rubber is a special synthetic rubber with silicon-oxygen bonds as the main chain, while ordinary rubber has a structure of carbon-carbon bonds as the main chain. Due to the particularity of its structure, it has low temperature resistance, high temperature resistance, and High voltage, radiation resistance, ozone aging resistance, physiological inertia, weather resistance, high air permeability, and excellent chemical inertness to lubricating oil and other media; in addition, it also has a wide temperature range (-50 ° C ~ 300 ° C) specialty. Thermally conductive silicone rubber can maintain elasticity in a wide range for a long time, does not absorb or release heat during vulcanization, has good insulation properties, and is resistant to acid and alkali corrosion. It is the preferred material for packaging and heat dissipation of electronic products. In addition, the heat-conducting silicone rubber can not only complete the heat transfer between the heat-generating part and the heat-dissipating part, but also play the role of shock absorption, which can meet the design requirements of miniaturization and ultra-thinning of equipment, and is extremely manufacturable and usable.

When the content of thermally conductive silicone rubber is low, the thermal conductivity of the existing thermally conductive silicone rubber is low, which cannot meet the requirements of ideal heat dissipation; when the content of thermally conductive silicone rubber is high, the comprehensive mechanical properties of thermally conductive silicone rubber The performance is significantly reduced, the processing performance is deteriorated, and the elasticity is reduced, which cannot meet the requirements of filling gaps and shock absorption. Therefore, it is of great significance to develop a low-temperature vulcanized thermally conductive silicone rubber with high thermal conductivity under the condition of low thermally conductive filler filling.

Inorganic fillers have poor compatibility with organic polymers, so it is necessary to treat the surface of inorganic thermally conductive fillers to better disperse them in silicone rubber. There have been many reports on the modification of inorganic fillers, but the modification effect of fillers in the prior art is not good, and some of the reported modification methods require the use of a large amount of solvents. For example, the patent CN 101659790B discloses a method for preparing a carbon-coated aluminum composite nanofiller heat-conducting silicone rubber composite material, which requires the use of ethanol to dilute the silane coupling agent. This invention requires the use of a large amount of ethanol and a subsequent drying process of 10 hours. Patent CN101284925B discloses the preparation method of silicone rubber/EPDM combined with thermally conductive silicone rubber, directly adding silane coupling agent to the mixed rubber, and the thermal conductivity of the prepared thermally conductive silicone rubber is 0.15～0.8W/(m·K ), with a low thermal conductivity.

Contents of the invention

In order to solve the above shortcomings and deficiencies of the prior art, the primary purpose of the present invention is to provide a low-temperature vulcanized heat-conducting silicone rubber.

Another object of the present invention is to provide a method for preparing the above-mentioned low-temperature vulcanized thermally conductive silicone rubber.

The object of the invention is achieved through the following technical solutions:

A low-temperature vulcanized heat-conducting silicone rubber, comprising the following components by weight:

The vinyl silicon rubber is one or both of methyl vinyl silicon rubber and methylphenyl vinyl silicon rubber; the vinyl group in the vinyl silicon rubber is located in the main chain of the molecule Both ends or side chains of

The molar content of vinyl group in the vinyl silicon raw rubber is 0.05%-0.5%, and the viscosity is 250cps-30000cps at 25°C.

The diluent is at least one of methyl silicone oil, ethyl silicone oil, phenyl silicone oil and vinyl silicone oil; the vinyl silicone oil is preferably vinyl-terminated silicone oil.

The modified thermally conductive filler refers to at least one of zinc oxide, boron nitride, aluminum nitride, aluminum oxide and silicon carbide modified by a silane coupling agent; the particle size of the modified thermally conductive filler is preferably 1 ~100 μm.

The modified thermally conductive filler refers to a modified thermally conductive filler prepared by the following method: 120 to 200 parts of thermally conductive fillers such as zinc oxide, boron nitride, aluminum nitride, aluminum oxide or silicon carbide and 3 to 8 parts of silane Add the coupling agent into the high-pressure reactor, evacuate to a vacuum degree of 0.05MPa-0.1MPa; heat to 200-250°C and stir for 1-3 hours to obtain a modified thermally conductive filler.

The silane coupling agent is preferably γ-aminopropyltriethoxysilane (KH-550), 3-(2,3-epoxypropoxy)propyltrimethoxysilane (KH-560), 3- At least one of methacryloxypropylmethyldimethoxysilane (KH-572) and γ-mercaptopropyltrimethoxysilane (KH-590); the stirring speed range of the stirring reaction is 60～100r/min.

The white carbon black is preferably fumed silica.

The hydrogen-containing silicone oil is preferably a methyl hydrogen-containing silicone oil with a mass fraction of hydrogen of 0.2% to 1.5% and a viscosity of 50 to 500 cps at 25°C.

The platinum catalyst is preferably an alcohol solution of chloroplatinic acid, a vinyl silicon oxygen chelate of chloroplatinic acid, a platinum catalyst supported by carbon or a platinum catalyst supported by aluminum oxide.

The inhibitor is preferably 2-methyl-3-butynyl-2 alcohol, ethynyl cyclohexanol, methyl butynyl alcohol, 3-methyl-1-hexynyl-3-alcohol, 3,5 -Dimethyl-1-hexynyl-3-ol, 1-ethynyl-1-cyclohexanol, methyltris(methylbutynyloxy)silane and phenyltris(methylbutynyloxy) at least one of silanes.

The preparation method of the above-mentioned low-temperature vulcanized heat-conducting silicone rubber comprises the following steps:

(1) blending vinyl silicone raw rubber, modified thermally conductive filler, white carbon black and diluent to obtain component A;

(2) Add component A to the drum of the two-roll mill, add hydrogen-containing silicone oil, platinum catalyst and inhibitor after covering the rolls, and then mix, and pass through the mixed rubber to obtain low-temperature vulcanization Thermally conductive silicone rubber.

Preferably, the blending described in step (1) is to add vinyl silica gel, modified thermally conductive filler, white carbon black and diluent into a vacuum kneader at a temperature of 100-150°C and a vacuum degree of 0.06-0.1 MPa, dehydration and blending for 30-70 minutes.

Preferably, the kneading in step (2) refers to kneading for 10 to 30 minutes; the thin pass refers to 5-8 times of thin pass.

The preparation method of the present invention and the resulting product have the following advantages and beneficial effects:

(1) The present invention uses a silane coupling agent to modify the thermally conductive filler at 200-250°C, so that the condensed state coupling agent becomes a gaseous coupling agent molecule, and under the action of stirring, the gaseous coupling agent molecule and the thermally conductive filler are fully contact, resulting in a good modification effect; the prepared heat-conducting silicone rubber has a viscosity of 35,000-87,000 cps before vulcanization, and has good processing performance, and the thermal conductivity of the vulcanized silicone rubber is 1.68-2.78 (W/m k);

(2) The amount of the modified heat-conducting filler of the present invention is 123-208 parts/100 parts of vinyl silicone raw rubber, and the elastic film amount of the heat-conducting silicone rubber after vulcanization is 6.0-8.5Mpa, indicating that the heat-conducting silicone rubber after vulcanization has good elasticity;

(3) The low-temperature vulcanized heat-conducting silicone rubber prepared by the present invention can be completely vulcanized by heating at 80-100° C. for 120-150 minutes.

detailed description

The present invention will be further described in detail below in conjunction with examples, but the embodiments of the present invention are not limited thereto.

Example 1

(1) Preparation of modified thermally conductive filler: Add 150 parts by mass of aluminum nitride with a particle size of 5 μm and 5 parts by mass of silane coupling agent KH-550 into a stainless steel reaction kettle, and vacuumize to a degree of 0.1 MPa. Close all the inlets and outlets on the high-pressure reactor, heat the mixed material and stir at a low speed, the speed is 100r/min, the heating temperature is 220°C, and the time is 3 hours to obtain a modified thermally conductive filler;

(2) In terms of parts by mass, 100 parts of methyl vinyl silicon raw rubber with a vinyl molar content of 0.3% and a viscosity of 10000 cps at 25 ° C, 155 parts of modified thermally conductive fillers obtained in step (1), 30 parts White carbon black (fumed silicon dioxide), 30 parts of vinyl-terminated silicone oil with a vinyl molar content of 5% and a viscosity of 500 cps at 25°C were added to a vacuum kneader at a temperature of 120°C and a vacuum of 0.06MPa for dehydration. Component A was obtained after blending for 60 minutes;

(3) In terms of parts by mass, component A is added to the cylinder of the two-roll mill, and after wrapping, add 2 parts of methyl hydrogen-containing silicone oil with a hydrogen content of 1wt% and a viscosity of 340cps, 0.1 part of platinum The catalyst (0.5% ethanol solution of chloroplatinic acid) and 0.05 part of methyl butynol were kneaded for 30 minutes, and the kneaded rubber was passed through 8 times to obtain low-temperature vulcanized heat-conducting silicone rubber.

Example 2

(1) Preparation of modified thermally conductive filler: Add 120 parts by mass of alumina with a particle size of 5 μm and 3 parts by mass of silane coupling agent KH-550 into a stainless steel reaction kettle, and vacuumize to a degree of 0.1 MPa. Close all the inlets and outlets on the high-pressure reactor, heat the mixed material and stir at a low speed, the speed is 100r/min, the heating temperature is 220°C, and the time is 3 hours to obtain a modified thermally conductive filler;

(2) In terms of parts by mass, 100 parts of methyl vinyl silicon raw rubber with a vinyl molar content of 0.3% and a viscosity of 10000cps at 25°C, 123 parts of modified thermally conductive fillers obtained in step (1), and 30 parts White carbon black (fumed silicon dioxide), 30 parts of vinyl-terminated silicone oil with a vinyl molar content of 5% and a viscosity of 500 cps at 25°C were added to a vacuum kneader at a temperature of 120°C and a vacuum of 0.06MPa for dehydration. Component A was obtained after blending for 60 minutes;

(3) In terms of parts by mass, component A is added to the cylinder of the two-roll mill, and after wrapping, add 2 parts of methyl hydrogen-containing silicone oil with a hydrogen content of 1wt% and a viscosity of 340cps, 0.1 part of platinum The catalyst (0.5% ethanol solution of chloroplatinic acid) and 0.05 part of methyl butynol were kneaded for 30 minutes, and the kneaded rubber was passed through 8 times to obtain low-temperature vulcanized heat-conducting silicone rubber.

Example 3

(1) Preparation of modified thermally conductive filler: Add 200 parts by mass of aluminum nitride with a particle size of 5 μm and 8 parts by mass of silane coupling agent KH-550 into a stainless steel reaction kettle, and vacuumize to a degree of 0.1 MPa. Close all the inlets and outlets on the high-pressure reactor, heat the mixed material and stir at a low speed, the speed is 100r/min, the heating temperature is 220°C, and the time is 3 hours to obtain a modified thermally conductive filler;

(2) In terms of parts by mass, 100 parts of methyl vinyl silicon raw rubber with a vinyl molar content of 0.3% and a viscosity of 10000 cps at 25°C, 208 parts of modified thermally conductive fillers obtained in step (1), and 30 parts White carbon black (fumed silicon dioxide), 30 parts of vinyl-terminated silicone oil with a vinyl molar content of 5% and a viscosity of 500 cps at 25°C were added to a vacuum kneader at a temperature of 120°C and a vacuum of 0.06MPa for dehydration. Component A was obtained after blending for 60 minutes;

(3) In terms of parts by mass, component A is added to the cylinder of the two-roll mill, and after wrapping, add 2 parts of methyl hydrogen-containing silicone oil with a hydrogen content of 1wt% and a viscosity of 340cps, 0.1 part of platinum The catalyst (0.5% ethanol solution of chloroplatinic acid) and 0.05 part of methyl butynol were kneaded for 30 minutes, and the kneaded rubber was passed through 8 times to obtain low-temperature vulcanized heat-conducting silicone rubber.

Example 4

(1) Preparation of modified thermally conductive filler: Add 150 parts by mass of aluminum nitride with a particle size of 5 μm and 5 parts by mass of silane coupling agent KH-550 into a stainless steel reaction kettle, and vacuumize to a degree of 0.1 MPa. Close all the inlets and outlets on the high-pressure reactor, heat the mixed material and stir at a low speed, the speed is 100r/min, the heating temperature is 220°C, and the time is 3 hours to obtain a modified thermally conductive filler;

(2) In terms of parts by mass, 100 parts of methyl vinyl silicon raw rubber with a vinyl molar content of 0.3% and a viscosity of 10000 cps at 25 ° C, 155 parts of modified thermally conductive fillers obtained in step (1), 30 parts White carbon black (fumed silicon dioxide), 30 parts of vinyl-terminated silicone oil with a vinyl molar content of 5% and a viscosity of 500 cps at 25°C were added to a vacuum kneader at a temperature of 120°C and a vacuum of 0.06MPa for dehydration. Component A was obtained after blending for 60 minutes;

(3) In terms of parts by mass, component A is added to the cylinder of the two-roller mill, and 2 parts of hydrogen-containing silicone oil, 0.1 part of platinum, and 2 parts of hydrogen-containing silicone oil with a viscosity of 200 cps are added after wrapping The catalyst (0.5% ethanol solution of chloroplatinic acid) and 0.05 part of methyl butynol were kneaded for 30 minutes, and the kneaded rubber was passed through 8 times to obtain low-temperature vulcanized heat-conducting silicone rubber.

Example 5

(1) Preparation of modified thermally conductive filler: Add 150 parts by mass of aluminum nitride with a particle size of 5 μm and 5 parts by mass of silane coupling agent KH-560 into a stainless steel reaction kettle, and vacuumize to a degree of 0.05 MPa. Close all the inlets and outlets on the high-pressure reactor, heat the mixed material and stir at a low speed, the speed is 60r/min, the heating temperature is 200°C, and the time is 3 hours to obtain a modified thermally conductive filler;

(2) In terms of parts by mass, 100 parts of methyl vinyl silicon raw rubber with a vinyl molar content of 0.05% and a viscosity of 30000 cps at 25 ° C, 155 parts of modified thermally conductive fillers obtained in step (1), 40 parts White carbon black (fumed silicon dioxide), 40 parts of vinyl-terminated silicone oil with a vinyl molar content of 5%, and a viscosity of 500 cps at 25°C are added to a vacuum kneader at a temperature of 150°C and a vacuum of 0.06MPa, and dehydrated Component A was obtained after blending for 30 minutes;

(3) In terms of parts by mass, component A is added to the cylinder of the two-roller mill, and 3 parts of hydrogen-containing silicone oil, 0.3 parts of platinum, and 3 parts of hydrogen-containing silicone oil with a viscosity of 1 wt% and a viscosity of 340 cps are added after wrapping Catalyst (0.5% ethanol solution of chloroplatinic acid) and 0.1 part of methyl tris (methyl butynyloxy) silane were kneaded for 30 minutes, and the kneaded rubber was passed through 5 times to obtain low-temperature vulcanization Thermally conductive silicone rubber.

Comparative example 1

(1) In terms of parts by mass, 100 parts of methyl vinyl silicon raw rubber with a vinyl molar content of 0.3% and a viscosity of 10000 cps at 25 ° C, 150 parts of aluminum nitride with a particle size of 5 μm, and 30 parts of white carbon Black (fumed silica), 30 parts of vinyl-terminated silicone oil with a vinyl molar content of 5% and a viscosity of 500 cps at 25°C were added to a vacuum kneader at a temperature of 120°C and a vacuum degree of 0.06MPa, dehydration and blending Component A was obtained after 60 minutes;

(2) In terms of parts by mass, component A is added to the cylinder of the two-roller mill, and 2 parts of hydrogen-containing silicone oil, 0.1 part of platinum, 0.1 part of platinum, and 2 parts of hydrogen-containing silicone oil with a hydrogen content of 1 wt % and a viscosity of 340 cps are added after wrapping The catalyst (0.5% ethanol solution of chloroplatinic acid) and 0.05 part of methyl butynol were kneaded for 30 minutes, and the kneaded rubber was passed through 8 times to obtain low-temperature vulcanized heat-conducting silicone rubber.

Comparative example 2

(1) In terms of parts by mass, 100 parts of methyl vinyl silicon raw rubber with a vinyl molar content of 0.3% and a viscosity of 10,000 cps at 25°C, 150 parts of aluminum nitride with a particle size of 5 μm, and 5 parts of silane Joint agent KH-550, 30 parts of white carbon black (fumed silica), 30 parts of vinyl-terminated silicone oil with a vinyl molar content of 5%, and a viscosity of 500 cps at 25 ° C were added to the vacuum kneader at a temperature of 120 ℃, vacuum degree 0.06MPa, dehydration and blending for 60 minutes to obtain component A;

(2) In terms of parts by mass, component A is added to the cylinder of the two-roller mill, and 2 parts of hydrogen-containing silicone oil, 0.1 part of platinum, 0.1 part of platinum, and 2 parts of hydrogen-containing silicone oil with a hydrogen content of 1 wt % and a viscosity of 340 cps are added after wrapping The catalyst (0.5% ethanol solution of chloroplatinic acid) and 0.05 part of methyl butynol were kneaded for 30 minutes, and the kneaded rubber was passed through 8 times to obtain low-temperature vulcanized heat-conducting silicone rubber.

Comparative example 3

(1) Preparation of modified thermally conductive filler: Add 150 parts by mass of aluminum nitride with a particle size of 5 μm and 5 parts by mass of silane coupling agent KH-550 into a stainless steel reaction kettle, and vacuumize to a degree of 0.1 MPa. Close all the inlets and outlets on the high-pressure reactor, heat the mixed material and stir at a low speed, the speed is 100r/min, the heating temperature is 220°C, and the time is 3 hours to obtain a modified thermally conductive filler;

(2) In terms of parts by mass, 100 parts of methyl vinyl silicon raw rubber with a vinyl molar content of 0.3% and a viscosity of 10000 cps at 25 ° C, 155 parts of modified thermally conductive fillers obtained in step (1), 30 parts Vinyl-terminated silicone oil with a vinyl molar content of 5% and a viscosity of 500 cps at 25°C was added to a vacuum kneader at a temperature of 120°C and a vacuum of 0.06MPa, and dehydration and blending for 60 minutes to obtain component A;

(3) In terms of parts by mass, component A is added to the cylinder of the two-roll mill, and after wrapping, add 2 parts of methyl hydrogen-containing silicone oil with a hydrogen content of 1wt% and a viscosity of 340cps, 0.1 part of platinum The catalyst (0.5% ethanol solution of chloroplatinic acid) and 0.05 part of methyl butynol were kneaded for 30 minutes, and the kneaded rubber was passed through 8 times to obtain low-temperature vulcanized heat-conducting silicone rubber.

The silicone rubbers prepared in Examples 1-5 and Comparative Examples 1-3 were heated at 80° C. for 120 minutes to obtain vulcanized silicone rubbers. The performance parameters of the obtained silicone rubbers before and after vulcanization are shown in Table 1.

Table 1 embodiment and the thermal conductive silicone rubber material performance test result of comparative example

From Example 1 and Comparative Examples 1 and 2 in Table 1, it can be seen that the thermally conductive silicone rubber prepared by using the thermally conductive filler modification method provided by the present invention to modify the thermally conductive filler has a relatively high thermal conductivity. When the amount of the modified heat-conducting filler is 123-208 parts/100 parts vinyl silicone raw rubber, the elastic film content of the heat-conducting silicone rubber after vulcanization is 6.0-8.5Mpa, indicating that the heat-conducting silicone rubber after vulcanization has good elasticity. Before vulcanization, the viscosity is 35000~87000cps, which has good processability. From the results of Comparative Example 1 and Comparative Example 3, it can be known that a small amount of white carbon black plays an important role in the tensile strength of the thermally conductive silicone rubber during the preparation of the thermally conductive silicone rubber. This is because the hydroxyl groups on the surface of the silica form a physical or chemical combination with the silicone rubber, forming a molecular adsorption layer of silicone rubber on the surface of the silica, forming a three-dimensional network structure between the fumed silica particles and the silicone rubber molecules. Play a reinforcing role, improve the tensile strength.

The above-mentioned embodiment is a preferred embodiment of the present invention, but the embodiment of the present invention is not limited by the above-mentioned embodiment, and any other changes, modifications, substitutions, combinations, Simplifications should be equivalent replacement methods, and all are included in the protection scope of the present invention.

Claims (9)

1. A low-temperature vulcanized heat-conducting silicone rubber, characterized in that: the silicone rubber comprises the following components by weight: The modified thermally conductive filler refers to a modified thermally conductive filler prepared by the following method: 120 to 200 parts of thermally conductive fillers such as zinc oxide, boron nitride, aluminum nitride, aluminum oxide or silicon carbide and 3 to 8 parts of silane The coupling agent is added to the high-pressure reactor, and the vacuum is evacuated to a vacuum degree of 0.05MPa-0.1MPa; heated to 200-250°C and stirred for 1-3 hours to obtain a modified thermally conductive filler; the silane coupling agent refers to γ - Aminopropyltriethoxysilane, 3-(2,3-glycidoxy)propyltrimethoxysilane, 3-methacryloyloxypropylmethyldimethoxysilane and γ-mercaptopropane At least one of the base trimethoxysilane. 2. A low-temperature vulcanized heat-conducting silicone rubber according to claim 1, characterized in that: said vinyl silicon rubber is one of methyl vinyl silicon rubber and methyl phenyl vinyl silicon rubber. One or two kinds; the vinyl group in the vinyl silicone raw rubber is located at the two ends of the molecular main chain or the side chain. 3. A low-temperature vulcanized heat-conducting silicone rubber according to claim 1, characterized in that: the molar content of vinyl in the vinyl silicone raw rubber is 0.05% to 0.5%, and the viscosity is 250cps to 30000cps at 25°C . 4. A low-temperature vulcanized heat-conducting silicone rubber according to claim 1, characterized in that: the diluent is at least one of methyl silicone oil, ethyl silicone oil, phenyl silicone oil and vinyl silicone oil; The particle size of the modified thermally conductive filler is 1-100 μm. 5. A low-temperature vulcanized heat-conducting silicone rubber according to claim 1, characterized in that: the stirring speed range of the stirring reaction is 60-100 r/min. 6. A low-temperature vulcanized heat-conducting silicone rubber according to claim 1, characterized in that: said white carbon black refers to fumed silica; said hydrogen-containing silicone oil refers to hydrogen-containing silicone oil with a mass fraction of 0.2%. ~1.5%, methyl hydrogen silicone oil with a viscosity of 50~500cps at 25°C. 7. A kind of low-temperature vulcanization heat-conducting silicone rubber according to claim 1, characterized in that: described platinum catalyst refers to the alcohol solution of chloroplatinic acid, the vinyl silicon oxygen chelate of chloroplatinic acid, carbon as The platinum catalyst of carrier or the platinum catalyst with aluminum oxide as carrier; Described inhibitor refers to 2-methyl-3-butynyl-2 alcohol, ethynyl cyclohexanol, methyl butynyl alcohol, 3 -Methyl-1-hexynyl-3-ol, 3,5-dimethyl-1-hexynyl-3-ol, 1-ethynyl-1-cyclohexanol, methyltri(methylbutyl at least one of alkynyloxy)silane and phenyltris(methylbutynyloxy)silane. 8. A method for preparing a low-temperature vulcanized heat-conducting silicone rubber according to any one of claims 1 to 7, characterized in that it comprises the following steps: (1) blending vinyl silicone raw rubber, modified thermally conductive filler, white carbon black and diluent to obtain component A; (2) Add component A to the drum of the two-roll mill, add hydrogen-containing silicone oil, platinum catalyst and inhibitor after covering the rolls, and then mix, and pass through the mixed rubber to obtain low-temperature vulcanization Thermally conductive silicone rubber. 9. the preparation method of a kind of low-temperature vulcanized heat-conducting silicone rubber according to claim 8, is characterized in that: the blending described in step (1) is vinyl silicon raw rubber, modified heat-conducting filler, white carbon black and diluent into a vacuum kneader at a temperature of 100-150° C., a vacuum of 0.06-0.1 MPa, and dehydration and blending for 30-70 minutes; the mixing described in step (2) refers to mixing for 10-30 minutes; The thin pass refers to 5-8 times of thin pass.