CN104900406B - Bonding multilayer ceramic capacitor and preparation method thereof - Google Patents

Abstract

The present invention provides a bondable multilayer ceramic capacitor with high reliability and high capacitance and a preparation method thereof. The bondable multilayer ceramic capacitor includes: a plurality of ceramic dielectric layers; A plurality of first and second internal electrodes on a ceramic dielectric layer; and a first type and a second type of vertical vias vertically passing through the plurality of ceramic dielectric layers, the first type of vertical vias and the first type of vertical vias The main electrodes of the first internal electrodes are connected, and the second type of vertical vias are connected to the main electrodes of the second internal electrodes; the first type of vertical vias leads to the bottom of the capacitor, connected to the bottom external electrode, and the second type of vertical via leads to the top of the capacitor to be connected to the top external electrode.

Description

Bondable multilayer ceramic capacitor and method of making same

technical field

The present invention relates to a multilayer ceramic capacitor. More specifically, the present invention relates to a bondable multilayer ceramic capacitor with high reliability and high capacity density and a method for preparing the bondable multilayer ceramic capacitor.

Background technique

Traditional three-dimensional discrete passive components are prepared by insertion, welding, surface mount, etc. As the electronics industry develops towards miniaturization, micro-assembly processes gradually replace insertion, welding, surface mount, and other processes. The key to the micro-assembly process is the bonding of components. Bondable passive component technology can meet the needs of reducing the number of components, compressing the size of the circuit board, increasing the function of the circuit board, and reducing the overall cost of the product. In electronic equipment, capacitors are one of the three main passive components, and bondable multilayer ceramic capacitors occupy an important position in the electronic field.

A number of patents on bondable capacitors have been published at home and abroad, basically the so-called single-layer ceramic capacitors (Single Layer Capacitor, SLC) with a single-layer structure. metal electrodes. Although single-layer ceramic capacitors can meet the gold wire bonding requirements of micro-assembly, the capacity density is small, and large-capacity capacitors (such as capacity greater than 0.01µF) are still impossible to prepare. For example, US Patent US2003016485, Chinese Patent CN1396606A, and 200410075380.1 are all patents disclosing the preparation of single-layer ceramic capacitors.

In order to overcome the problem of low capacity density of single-layer ceramic capacitors, one solution is to process multi-layer ceramic capacitors into a bondable structure. A variety of bondable multilayer ceramic capacitors have been developed at home and abroad. Compared with traditional multilayer ceramic capacitors, bondable multilayer ceramic capacitors mainly place their external electrodes on the upper and lower sides of the capacitor, so that one electrode can be mounted on the electric board and the other electrode can be bonded and assembled. This structure is mainly realized through the following methods.

One is to improve on the traditional two-terminal multilayer ceramic capacitor, such as turning the capacitor sideways, so that the two sides that originally contained the electrodes become the upper and lower sides, or the external electrodes on both sides of the capacitor continue to extend to the upper and lower sides respectively, the United States Patent Application Publication No. US7791896B1 discloses multilayer ceramic capacitors of these two structures. The former has a small internal electrode area, which may lead to low capacitance; the latter needs to be made into thin sheets, which are prone to cracking during the manufacturing process and thereafter, resulting in failure.

The second is to improve the internal electrode structure, change the internal electrode structure by various methods, and directly connect it with the external electrodes on the upper and lower sides. For example: U.S. Patent Application Publication No. US7230815B1 discloses a bondable multilayer ceramic capacitor of this structure. The first and second internal electrodes in the capacitor contain two lead-out electrodes respectively, and are respectively connected to them by these lead-out electrodes. Connect to upper and lower external electrodes. Capacitors of this structure may cause block deformation during lamination or compression, causing cutting defects, and are also prone to chipping or cracking when mounted inside the circuit board. Chinese Patent Application Publication No. CN 1832070 filed by Samsung Electro-Mechanics Co., Ltd. shows a highly reliable bondable multilayer chip capacitor that utilizes vias to connect internal electrodes to external electrodes with relatively little chipping , However, in the lamination process, it is difficult to fully align the via holes, so it is easy to form poor electrode contact, and it is not easy to make a small-sized capacitor.

Contents of the invention

In view of the above problems, the technical problem to be solved by the present invention is to provide a bondable multilayer ceramic capacitor with high reliability and high capacitance and a method for preparing the bondable multilayer ceramic capacitor.

According to an aspect of the present invention, there is provided a bondable multilayer ceramic capacitor, comprising: a plurality of ceramic dielectric layers; a plurality of first and second inner inner layers alternately formed on the plurality of ceramic dielectric layers; electrodes; and first and second types of vertical vias vertically passing through the plurality of ceramic dielectric layers, the first type of vertical vias is connected to the main electrode of the first internal electrode, and the The second type of vertical via hole is connected to the main electrode of the second internal electrode; the first type of vertical via hole leads to the bottom of the capacitor and is connected to the bottom external electrode, and the second type of vertical via hole Vias lead to the top of the capacitor to connect with the top external electrodes.

According to the bondable multilayer ceramic capacitor of the present invention, the external electrodes are located at upper and lower positions of the multilayer ceramic capacitor, the capacitor is allowed to be mounted inside the substrate, can withstand less chipping, and can be made into a small-sized capacitor.

In the present invention, it is also possible that the first internal electrode includes a main electrode and a secondary electrode, and the main electrode is separated from the secondary electrode by a predetermined distance; the second internal electrode includes a main electrode and a secondary electrode, and the main electrode is separated from the secondary electrode. The sub electrodes are separated by a predetermined distance.

According to the present invention, the primary and secondary electrodes of the first and second internal electrodes are not in contact with each other.

In the present invention, it may also be that the connection between the first type and the second type of vertical via holes and the first and second internal electrodes is through point-to-surface contact.

In the aspect of the present invention, it may also be that each of the first and second internal electrodes has two or more through holes of the first type and the second type respectively; wherein, the first via holes pass through The first type of via holes in the first and second internal electrodes; the second type of vertical via holes passing through the second type of via holes in the first and second internal electrodes; the first type of vertical via holes in the first and second internal electrodes; The vertical via holes of the first type and the second type are respectively in contact with the inner circumferences of the through holes of the first type and the second type.

In the present invention, it may also be that the connection between the first type and the second type via holes and the first and second internal electrodes is through point-to-surface contact.

In the present invention, it may also be that the first type of vertical via hole is in contact with the electrode surface of the main electrode of the first internal electrode, and is in contact with the electrode surface of the secondary electrode of the second internal electrode; and the second type of vertical via hole In contact with the electrode surface of the main electrode of the second internal electrode, and in contact with the electrode surface of the secondary electrode of the first internal electrode. This structure makes the main electrode of the first internal electrode only connected to the first type of vertical via hole, and the main electrode of the second internal electrode is only connected to the second type of vertical via hole.

In the present invention, it is also possible that the bondable multilayer ceramic capacitor may further include: an upper external electrode, namely a top electrode, formed on the top of the capacitor; and a lower external electrode, namely a bottom electrode, formed on the capacitor , wherein a first type of vertical via connects the main electrode of the first internal electrode with the lower external electrode, and a second type of vertical via connects the main electrode of the second internal electrode with the upper external electrode . The upper external electrode and the lower external electrode are metal layers that can be bonded to gold wire, gold ribbon, aluminum wire or copper wire.

In the present invention, it is also possible that the part of the first type of vertical via hole leading to the lower external electrode is connected to the conductive layer on the circuit substrate, and the part of the second type of vertical via hole leading to the upper external electrode can be in the micro-assembly For bonding or connection to the upper conductive layer of the embedded printed circuit board.

According to an embodiment of the present invention, the ratio of the thickness to the length and width of the bondable multilayer ceramic capacitor should be large enough to ensure the reliability of the capacitor.

Another aspect of the present invention provides a method for preparing a bondable multilayer ceramic capacitor, the method comprising: preparing a ceramic green tape with a casting slurry whose solvent is an alcohol-ester mixed solvent, slicing, punching holes, and preparing the second Type I, Type II ceramic green sheets and Type III external electrode ceramic green sheets; by forming two or more vertical via holes of the first type and the second type on the first type ceramic green sheets, and A main electrode and a secondary electrode are formed on the green sheet to form a first internal electrode, the main electrode and the secondary electrode are separated by a predetermined distance, and the first type and the second type of vertical via holes are respectively used to lead out the main electrode and the secondary electrode of the first internal electrode; The second inner electrode is constituted by forming two or more vertical via holes of the first type and the second type on the second type ceramic green sheet, and forming a main electrode and an auxiliary electrode on the second type ceramic green sheet, and the main electrode and the auxiliary electrode are formed on the second type ceramic green sheet. The electrodes are separated by a predetermined distance, and the first type and the second type of vertical via holes are respectively used to lead out the secondary electrode and the main electrode of the second internal electrode; by forming two or more first type or second type on the third ceramic green sheet The through hole is used to connect the first type of via hole or the second type of vertical via hole of the internal electrode; by alternately stacking the first type of ceramic green sheets and the second type of ceramic green sheets, and overlapping the first type of ceramic green sheets on the top layer and the bottom layer Three ceramic green sheets are formed to form a ceramic body and sintered into a ceramic plate. Upper and lower external electrodes are formed on the bottom and top of the ceramic board, respectively connected to the first type and the second type of vertical via holes.

In the present invention, it is also possible that a plurality of through holes of the first type and the second type filled with electrodes are respectively overlapped to form the vertical via holes of the first type and the second type.

According to the present invention, the mutual connection between the electrodes is through point-to-surface alignment, and compared with point-to-point alignment, the connection between electrodes can be increased. At the same time, two or more first and second via holes can also It can improve the connectivity between electrodes, make the multilayer ceramic capacitor less prone to open circuit, improve the reliability of the capacitor, and can be prepared into a small-sized capacitor. In addition, the surface electrodes in the bondable multilayer ceramic capacitor of the present invention can form a small capacitance with adjacent internal electrodes, which can increase the capacitance of a single capacitor.

The features and advantages of the above and other aspects of the present invention will become more apparent from the following detailed description in conjunction with the accompanying drawings.

Description of drawings

FIG. 1 schematically shows a cross-sectional view of a bondable multilayer ceramic capacitor passing through a via hole in the x direction and the y direction according to an embodiment of the present invention;

2a to 2b show schematic perspective views of the structure of the first and second internal electrodes of the bondable multilayer ceramic capacitor according to this embodiment of the present invention;

3a to 3b show schematic perspective views of the structure of the upper and lower external electrodes on the top and bottom of the bondable multilayer ceramic capacitor according to this embodiment of the present invention.

detailed description

Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. More specifically, the present invention can be implemented in many different forms and is not limited by the embodiments described herein. Throughout the specification, the same or equivalent elements are marked with the same reference numerals.

Fig. 1 schematically shows a cross-sectional view of a bondable multilayer ceramic capacitor passing through a via hole in the x direction and y direction according to an embodiment of the present invention; Fig. 2a to Fig. 2b schematically show 1 is a perspective view of the structure of the first and second internal electrodes of the bondable multilayer ceramic capacitor; and FIGS. 3a to 3b are schematic diagrams showing the top and bottom of the bondable multilayer ceramic capacitor A perspective view of the structure of the upper and lower external electrodes.

According to this embodiment of the present invention, the x direction refers to the length direction of the ceramic body, and the y direction refers to the width direction of the ceramic body, and the z direction (thickness direction of the ceramic body) refers to stacking internal electrodes in such a direction, and a A dielectric layer is interposed between adjacent stacked internal electrodes.

Referring to Fig. 1, Fig. 2a-Fig. 2b, and Fig. 3a-Fig. Type one and type two vertical vias 113 and 114 , and upper and lower external electrodes 101 and 102 are formed on the top and bottom of capacitor 100 , respectively.

The shape and size of the capacitor 100 are not particularly limited, and a high-capacity bondable multilayer ceramic capacitor can be fabricated.

The capacitor 100 has a plurality of dielectric layers stacked (refer to reference numerals 41, 42, 51 and 52 in FIGS. 1, 2a-2b, and 3a-3b), and the stacked dielectric layers are sintered to form capacitor body. Dielectric layers 41, 42, 51 and 52 can be formed by sintering ceramic green sheets including ceramic powder, alcohol-ester mixed solvent and organic binder. The present invention can use ceramic powder with temperature characteristics such as X7R or X8R.

As shown in FIG. 1, first internal electrodes 103 and second internal electrodes 104 are formed on the dielectric layers 41 and 42, respectively, and are stacked alternately, thereby forming a capacitor body. The first internal electrode 103 and the second internal electrode 104 have opposite polarities.

According to this embodiment of the present invention, the first internal electrode 103 and the second internal electrode 104 may include a conductive metal, and the conductive metal may be a silver-palladium electrode, a nickel electrode, or the like.

As shown in FIG. 2a, the first internal electrode 103 includes a main electrode 103a and a secondary electrode 103b, and as shown in FIG. 2b, the second internal electrode 104 includes a main electrode 104a and a secondary electrode 104b. In addition, the first and second types of vertical vias 113 and 114 extend vertically in the capacitor body 105 . The first type of vertical via hole 113 is connected to the main electrode 103a of the first internal electrode 103 and the secondary electrode 104b of the second internal electrode 104, and the second type of vertical via hole 114 is connected to the secondary electrode 103b of the first internal electrode 103 and the second The main electrodes 104a of the internal electrodes 104 are connected.

Both the first type and the second type of vertical vias 113 and 114 can conduct electricity, and the conductive metal can be silver palladium electrodes. The first type of vertical vias 113 leads to the bottom of the capacitor 100 and is connected to the lower external electrode 102 , and the second type of vertical vias 114 leads to the bottom of the capacitor 100 and is connected to the upper external electrode 101 .

2a to 2b are perspective views schematically illustrating structures of first and second internal electrodes of the bondable multilayer ceramic capacitor of FIG. 1 . 2a to 2b, the first internal electrode 103 and the second internal electrode 104 are respectively formed on the dielectric layer 41 and 42, and the first internal electrode 103 and the second internal electrode 104 each have two first type vertical vias 113 and the second type of vertical vias 114 .

As shown in FIG. 2 a , the shaded part is the first internal electrode 103 . The first internal electrode 103 is divided into two parts of different sizes. The larger part is the main electrode 103a, and the other part is the secondary electrode 103b. The secondary electrode 103b is separated from the main electrode 103a by a predetermined distance. The first type of vertical via hole 113 is connected to the secondary electrode 103b of the first internal electrode 103, and the second type of vertical via hole 114 is connected to the main electrode 103a of the first internal electrode 103, so that on the first internal electrode 103, the second type of vertical via hole 114 Not connected to the first type of vertical via hole 113 .

As shown in FIG. 2 b , the shaded part is the second internal electrode 104 . The second internal electrode 104 is divided into two parts of different sizes. The larger part is the main electrode 104a, and the other part is the secondary electrode 104b. The secondary electrode 104b is separated from the main electrode 104a by a predetermined distance. The first type of vertical via hole 113 is connected to the main electrode 104a of the second internal electrode 104, and the second type of vertical via hole 114 is connected to the secondary electrode 104b of the second internal electrode 104, so that on the second internal electrode 104, the second type of vertical via hole 114 is not connected with The first type of vertical vias 113 are connected.

The first internal electrodes 103 and the second internal electrodes 104 may be formed on the dielectric layer by screen printing.

3a to 3b are perspective views schematically showing the structure of the upper and lower external electrodes of the bondable multilayer ceramic capacitor in FIG. 1 , and the shaded parts are the external electrodes. Upper and lower external electrodes 101 and 102 are formed on the dielectric layers 51 and 52 .

As shown in FIG. 3 a , the upper external electrode 101 is connected to the second type of vertical via hole 114 and not connected to the first type of vertical via hole 113 .

As shown in FIG. 3 b , the lower external electrode 102 is connected to the vertical via hole 113 of the first type, and is not connected to the vertical via hole 114 of the second type.

The upper and lower external electrodes 101 and 102 may include conductive metals, and the conductive metals may be silver palladium electrodes, gold electrodes and other metals that can meet the bonding requirements.

Another aspect of the present invention provides a method for preparing the above-mentioned embedded bondable multilayer ceramic capacitor.

The ceramic green belt is prepared by casting slurry mixed with ceramic powder, alcohol-ester mixed solvent and organic binder. The ceramic powder can include barium titanate (BaTiO ₃ ) or calcium titanate ( CaTiO ₃ ) and other ceramic dielectric materials.

The ceramic green tape is sliced, and the ceramic green sheet is punched by a mechanical method or a laser method to prepare the first type, the second type ceramic green sheet and the third type external electrode ceramic green sheet.

Electrodes are formed on ceramic green sheets by methods such as screen printing, electroplating, physical vapor deposition, and chemical vapor deposition, and the electrode materials can include one or more of conductive metal materials such as silver-palladium electrodes, nickel electrodes, copper electrodes, and gold electrodes. combination of species.

The main electrode and the auxiliary electrode are formed on the first type of ceramic green sheet to form the first internal electrode 103, the main electrode and the auxiliary electrode are separated by a predetermined distance, and the first type and the second type of vertical via holes are respectively used to lead out the first internal electrode 103 The main electrode 103a and the auxiliary electrode 103b; the main electrode and the auxiliary electrode are formed on the second type of ceramic green sheet to form the second internal electrode 104, the main electrode and the auxiliary electrode are separated by a predetermined distance, the first type and the second type of vertical via holes They are respectively used to lead out the secondary electrode 104b and the main electrode 104a of the second internal electrode.

A ceramic green body is formed by alternately stacking the first-type ceramic green sheets and the second-type ceramic green sheets, and overlapping the third ceramic green sheets on the top layer and the bottom layer, and is sintered into a ceramic plate. Upper and lower external electrodes are formed on the bottom and top of the ceramic board, respectively connected to the first type and the second type of vertical via holes.

A plurality of through holes of the first type and the second type filled with electrodes overlap to form the vertical via holes of the first type and the second type respectively.

Examples are further given below to describe the present invention in detail. It should also be understood that the following examples are only used to further illustrate the present invention, and cannot be interpreted as limiting the protection scope of the present invention. Those skilled in the art make according to the above-mentioned content of the present invention Some non-essential improvements and adjustments all belong to the protection scope of the present invention.

As Embodiment 1, the following steps may be included.

(1) According to the ratio of each phase in the casting slurry system, weigh commercial barium titanate (BaTiO ₃ ) ceramic powder with X7R temperature characteristics, add alcohol-ester mixed solvent, dispersant, binder and The plasticizer is subjected to one-time ball milling, vacuum defoaming, and tape casting to obtain the low-temperature co-fired ceramic green tape material of the embedded multilayer ceramic capacitor.

(2) The rolled LTCC raw tape prepared by the preparation method of the present invention has smooth surface and uniform thickness.

(3) Cut the prepared rolled LTCC green tape material into single-layer LTCC green sheets of the same size, and punch holes to prepare the first type of ceramic green sheet, the second type of ceramic green sheet, and the third type of external electrode ceramics Raw film.

(4) According to the design patterns in Figure 2a-Figure 2b and Figure 3a-Figure 3b, prepare the hole-filling screen and the internal electrode screen. The ceramic green sheet is firstly filled with holes by screen printing, and electrode patterns are printed.

(5) Positioning and lamination of ceramic green sheets.

(6) Print the upper and lower electrodes on the ceramic green sheet. Formed by hot isostatic pressing and then cut into individual capacitors. Put the composite board of ceramic green sheets into a muffle furnace, discharge the plastic, and sinter to obtain a bondable multilayer ceramic capacitor.

As Embodiment 2, the following steps may be included.

(1) The slurry preparation, casting, punching, screen printing, and stacking processes in the preparation process of the bondable multilayer ceramic capacitor are the same as the first five steps in Example 1.

(2) The ceramic green sheet is formed by hot isostatic pressing, and cut into large pieces of ceramic green bodies, each of which contains multiple multilayer ceramic capacitor green bodies. Put the large piece of ceramic body into the muffle furnace, discharge the plastic, sinter and calm down.

(3) Metallize the surface of the sintered large ceramic sintered body and cut it to obtain a bondable multilayer ceramic capacitor.

The invention adopts low-temperature co-firing ceramics (LTCC) technology to prepare bondable multilayer ceramic capacitors, and the product has high controllability, good repeatability, low cost and is suitable for large-scale production. The prepared bondable multilayer ceramic capacitor has a small size capacitor with top-bottom electrode structure, which can be used in micro-assembly bonding process, and can also be used as an embedded capacitor in a multilayer printed circuit board (PCB), thereby reducing The space occupied on the circuit board. The ratio of thickness to length and width of a bondable multilayer ceramic capacitor should be large enough that it will not chip even if the printed circuit board is flexed. In addition, the surface electrodes in the bondable multilayer ceramic capacitor can form a small capacitor with adjacent internal electrodes, which can increase the capacitance of a single capacitor.

The present invention can be embodied in various forms without departing from the essential characteristics of the present invention, so the embodiments in the present invention are for illustration rather than limitation, because the scope of the present invention is defined by the claims rather than by the description , and all changes within the range defined in the claims, or within the range equivalent to the range defined in the claims, should be construed as being included in the claims.

Claims (7)

1. A bondable multilayer ceramic capacitor comprising: a plurality of ceramic dielectric layers; a plurality of first and second internal electrodes alternately formed on the plurality of ceramic dielectric layers; and first and second types of electrodes vertically passing through the plurality of ceramic dielectric layers Two types of vertical vias, the first type of vertical vias are connected to the main electrode of the first internal electrode, and the second type of vertical vias are connected to the main electrode of the second internal electrode; The first type of vertical vias leads to the bottom of the capacitor and is connected to the bottom external electrodes, and the second type of vertical vias leads to the top of the capacitor and is connected to the top external electrodes; The first internal electrode includes a primary electrode and a secondary electrode, the primary electrode is separated from the secondary electrode by a predetermined distance; the second internal electrode includes a primary electrode and a secondary electrode, the primary electrode is separated from the secondary electrode by a predetermined distance; The first type of vertical via hole is in contact with the electrode surface of the secondary electrode of the second internal electrode while being in contact with the electrode surface of the main electrode of the first internal electrode; The second type of vertical via hole is in contact with the electrode surface of the main electrode of the second internal electrode while in contact with the electrode surface of the secondary electrode of the first internal electrode. 2. The bondable multilayer ceramic capacitor according to claim 1, each of said first and second internal electrodes having two or more first and second type via holes, respectively; Wherein, the first-type vertical via holes pass through the first-type through-holes in the first and second internal electrodes; the second-type vertical via holes pass through the first-type through-holes in the first and second internal electrodes The second type of through hole; the first type and the second type of vertical via hole are respectively in contact with the inner circumference of the first type and the second type of through hole. 3. The bondable multilayer ceramic capacitor according to claim 1, the connection of the first and second types of vertical vias to the first and second internal electrodes is through point-to-surface contact. 4. The bondable multilayer ceramic capacitor of claim 1, further comprising: an upper external electrode formed on the top of the capacitor; and a lower external electrode formed on the bottom of the capacitor, wherein the first type of vertical via connects the first internal electrode to the lower external electrode , the second type of vertical vias connects the second internal electrode with the upper external electrode; the upper external electrode and the lower external electrode can be bonded to gold wire, gold tape, aluminum wire or copper wire metal layer. 5. A method for preparing a bondable multilayer ceramic capacitor, comprising: The first internal electrode is constituted by forming two or more first-type and second-type through-holes on a first-type ceramic green sheet, and forming a main electrode and a sub-electrode on said first-type ceramic green sheet, the main electrode Separated from the secondary electrode by a predetermined distance, the first type and second type of through holes are respectively used to lead out the main electrode and the secondary electrode of the first internal electrode; The second internal electrode is constituted by forming two or more first-type and second-type through-holes on a second-type ceramic green sheet, and forming a main electrode and a sub-electrode on the second-type ceramic green sheet, the main electrode Separated from the secondary electrode by a predetermined distance, the first type and second type of through holes are respectively used to lead out the secondary electrode and the main electrode of the second internal electrode; Type 1 or Type 2 vertical via holes for connecting internal electrodes by forming two or more Type 1 or Type 2 through holes on ceramic green sheets for Type 3 external electrodes; Alternately stacking the first type of ceramic green sheets and the second type of ceramic green sheets, and overlapping the third type of external electrode ceramic green sheets on the top layer and the bottom layer, thereby forming a ceramic green body, and sintering it into a ceramic plate; forming upper and lower external electrodes on the bottom and top of the ceramic board, respectively connected to the first type and second type of vertical vias, bringing the first type of vertical via into contact with the electrode surface of the secondary electrode of the second internal electrode while contacting the electrode surface of the primary electrode of the first internal electrode; The second type of vertical via hole is brought into contact with the electrode surface of the main electrode of the second inner electrode while in contact with the electrode surface of the sub electrode of the first inner electrode. 6 . The manufacturing method according to claim 5 , wherein a plurality of through holes of the first type and the second type filled with electrodes overlap each other to form the vertical via holes of the first type and the second type. 7 . 7. The bondable multilayer ceramic capacitor according to any one of claims 1 to 4 is used as an embedded capacitor in a multilayer printed circuit board.