CN104885587B - Electromagnetic wave absorption board and its manufacture method and the electronic equipment for including it - Google Patents
Electromagnetic wave absorption board and its manufacture method and the electronic equipment for including it Download PDFInfo
- Publication number
- CN104885587B CN104885587B CN201380066913.7A CN201380066913A CN104885587B CN 104885587 B CN104885587 B CN 104885587B CN 201380066913 A CN201380066913 A CN 201380066913A CN 104885587 B CN104885587 B CN 104885587B
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- Prior art keywords
- electromagnetic wave
- wave absorption
- absorption board
- band
- magnetic sheet
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Classifications
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0075—Magnetic shielding materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/16—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of sheets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/208—Magnetic, paramagnetic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/702—Amorphous
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/704—Crystalline
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2804—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2848—Three or more layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/32—Composite [nonstructural laminate] of inorganic material having metal-compound-containing layer and having defined magnetic layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention relates to a kind of electromagnetic wave absorption board and its manufacture method and the electronic equipment for including it, the electromagnetic wave absorption board is film and has outstanding electromagnetic wave absorptivity while cheap.The electromagnetic wave absorption board of the present invention includes：At least one layer of thin plate magnetic sheet, it is separated into multiple fine；Diaphragm, it is adhered to the one side of the amorphous band；And two-sided tape, it is adhered to the another side of the amorphous band.
Description
Technical field
The present invention relates to a kind of electromagnetic wave absorption board and its manufacture method, especially, be related to a kind of electromagnetic wave absorption board and its
Manufacture method and electronic equipment (ELECTROMAGNETIC WAVE ABSORBING SHEET, the METHOD FOR for including it
MANUFACTURING SAME, AND ELECTRONIC DEVICE COMPRISING SAME), the electromagnetic wave absorption board is
Film and it is cheap while there is outstanding electromagnetic wave absorptivity.
Background technology
Recently, about digital electric equipment for the high speed of the circuit signal processing speed of electronic installation, multifunction,
Miniaturization and the further speeding up of requirement of the slimming of product form.It is installed on various partly the leading of printed circuit board (PCB) (PCB)
The gradual high speed of data processing speed of volume elements part, so as to be installed on the active component and passive element of printed circuit board (PCB) (PCB)
Part packing density gradually step up.
Element as described above drastically changes due to high speed signal and with voltage, electric current, thus produces irritability and makes an uproar
Sound and the generating source for turning into high frequency noise.Part as active component and passive element is located at and the print on printed circuit
The very near position of brush electric wire, so as to due to the electricity between small size digital electronic equipment internal element or between element and electric wire
Son combine and cause crosstalk (cross talk) problem, or to device external emitting electromagnetic ripple and cause to other equipment generation
EMI (the Electro Magnetic Interference of influence：Electromagnetic wave obstacle or Electromagnetic Interference) problem.
In addition, situation about being revealed for a long time to human body from electromagnetic wave caused by electronic equipment, will cause glaucoma, life to human body
Growing ability decline etc. influences.
The electromagnetic wave shielding (Electro Magnetic Shielding) proposed as the countermeasure for the EMI is
Finger does not make to be radiated to outside shell from electromagnetic wave noise caused by electronic equipment internal, and also absorbs or block from outside intrusion
Electromagnetic wave noise.
There is the digital electric equipment of excess room for device interior, take following EMI to solve method：By filter
(filter) circuit for producing irritability noise is connected to, so as to abate the noise or zoom out the distance between circuit, or utilizes electricity
Magnetic wave shielding material is shielded (shield) and is grounded (grounding) etc..
But for small size digital electronic equipment, when electronic unit is arranged on printed circuit board (PCB) in a manner of highdensity
(PCB) on, solves method thereby using the noise mentioned above using filter etc., methods described not only needs installation empty
Between, and to realize that miniaturization, slimming also need to consider from design procedure, therefore it is not suitable as the product for short life
Urgent noise solve method.
Because the reasons why described, recently in order to suppress in the circuit substrate of small size digital electronic equipment due to active parts
And caused irritability electromagnetic wave noise, use the thick soft magnetism composite magnetic of about more than 0.2mm comparison in input/output terminal
Body plate (sheet), the active parts are dominant noise source.
The permeability of described composite magnetic body plate material includes real part magnetic permeability component and imaginary part permeability
Composition, and the suppression efficiency of noise is as the imaginary part permeability in the electromagnetic wave noise frequency band of desired suppression is bigger or multiple
The thickness of conjunction magnetic is thicker, then inhibition is bigger.
In addition, the trend of the size of digital electric equipment is more to minimize, therefore it is required that described composite magnetic body
The inhibition of electromagnetic wave also outstanding product while thickness is thinner.In addition, the trend toward miniaturization with electronic equipment, it is desirable to
The slimming of the solution noise composite magnetic body plate used in above-mentioned quasi-microwave frequency band.
The situation of composite magnetic body plate, it utilizes the effect for causing noise to reduce by magnetic loss, in order to realize slimming,
So as to make it that imaginary part permeability is bigger.Problems be present in current magnetic material：Lower than about 10~100MHz
Frequency band or the frequency band higher than its, thickness of thin and conduction noise rejection effect can not be met simultaneously.
The noise suppression film and its manufacture method of composite construction are proposed in Korean registered patent 10-0755775, its
Increase electromagnetic wave while in order to realize that thickness is about 25 to 100 μm slim and reduce effect, it is polymer-based in vivo in insulating properties,
The resistive element powder of tabular and the soft-magnetic body powder of tabular are mutual backwards, to embody shape anisotropy, and according to resistance
Loss reduces effect with magnetic loss and with electromagnetic wave, and the electromagnetic wave being greatly lifted in more than 1GHz frequency subtracts
Small effect.
The Korean registered patent 10-0755775, structure are carbon dust and the conduct of the tabular as resistive element powder
Iron-silicon-aluminum soft magnet (sendust) powder of the tabular of soft-magnetic body powder insulating properties it is polymer-based in vivo mutually backwards, therefore
It is limited to reduce thickness, and when compared with other kinds of magnetic sheet, permeability is relatively low, and imaginary part permeability is also low,
Thus permeability is low for being used as electromagnetic wave absorb, and because of the soft magnetic powder using high price, the price of plate is also on
Rise.
In addition, the situation of described macromolecule (Polymer) magnetic sheet containing soft magnetic powder, in order to improve low magnetic conduction
Rate and when increasing the thickness of plate, with the increase of thickness, problems be present：Master Cost, which more improves and is difficult to reply, to be become
The trend of thin terminal.Further, the noise suppression film is used gradually with more than 0.2mm thick film conventionalization so as to exist
Presence limitation on way.
In addition, Korean Patent Laid 10-2011-92833 it is also proposed it is soft containing iron (Fe) base nano-crystal grains
The electromagnetic wave absorption board of Magnaglo and carbon (Co) base electric conductor powder, and Fe base nano-crystal grains soft magnetic powders are as non-
Peritectic alloy, using Fe-Si-B-Nb-Cu based alloys, this alloy is carried out 45 minutes~90 points at a temperature of 350 DEG C~500 DEG C
Clock conditioning treatment, it is 270 mesh to break the particle size of pulverized powder so as to be carried out once and second-time breakage to powder
(mesh) below, there is the crystal grain of the nanosized of screening using Fe base nano-crystal grains soft magnetic powders, the powder.
But the electromagnetic wave absorption board is one kind of macromolecule plate, the macromolecule plate will be by that will have nanosized
The Fe base nano-crystal grains soft magnetic powders of crystal grain mixed with adhesive (binder), so as to be fabricated to 0.5mm thickness, institute
State macromolecule plate and problems be present：Thickness is thick, and with mixed adhesive, the permeability of plate is low.
Proposed in Korean Patent Laid 10-2005-37015 with shielding low frequency magnetic field function metal and
Polymer composite, the complex is using as the permalloy of metal alloy (permalloy), iron-silicon-aluminum soft magnet
(sendust) one among alloy and rapidly solidified alloy is used as main component, and to be powdered, laminar or fibrous
Among a certain form, the metal alloy has shielding low frequency magnetic field function, and the complex includes：Soft high score
Sub- material, its matrix (matrix) as dispersed metal alloy；Additive, it is used to make metal alloy and soft polymer thing
Matter is compound.But the one kind of the plate proposed in the Korean Patent Laid 10-2005-37015 as macromolecule plate,
So as to there is the problem of permeability is low.
The electromagnetism of the metal foil band using high permeability is proposed in Korean Patent Laid 10-2003-86122
Wave screen covers material manufacturing method, and it comprises the following steps：Will be from Ni-Fe-Mo, Fe-Si and mu-metal
(mumetal) relative permeability selected among for more than 1000 metal or alloy, according to rapid solidification method using thickness as 1
μm to less than 900 μm, the scope that width is 1mm to 90mm manufactures metal foil band, and by metal foil band 700~1300
DEG C temperature range, annealed (annealing) under hydrogen or vacuum atmosphere, and at least one side of metal foil band
Form adhesion layer.
In addition, the electromagnetic shielding material manufacture method also comprises the following steps：In at least one side of metal foil band
The film layer of Cu, Ni, Ag, Al, Au, Sn or the combination of its metal is formed by electroplating golden either vacuum evaporation.
But the electromagnetism wave screen manufactured according to the manufacture method of the Korean Patent Laid 10-2003-86122
Material use is covered and is reflected by metal foil band and metal film the method for most of electromagnetic wave to shield electromagnetic wave, the metal
Film to metal foil band by carrying out gold-plated or vacuum evaporation to be formed, and the method that presence can not utilize electromagnetic wave absorption
The problem of to realize shielding.As a result, when electronic equipment internal uses the electromagnetic shielding material, problems with is produced：By
Other neighbouring circuit elements are impacted in the electromagnetic wave reflected from electromagnetic shielding material.
In addition, electric conductivity foaming board fabrication method, institute are disclosed in Korean Patent Laid 10-2009-123776
State the material that electric conductivity foamed board can act as electromagnetic wave shielding pad (gasket).
The electromagnetic wave shielding pad electric conductivity foamed board includes：Foamed board, it is according to coupling agent (coupling
Agent) and with polarized；Nickel (nickel) Gold plated Layer, it utilizes electroless plating gold mode, withExtremelyThickness
Degree is formed on the foamed board；And copper Gold plated Layer, it is 1.3 to 5.0A/dm2Current density condition under, utilize electrolysis
Gold-plated mode, formed as 0.02 to 0.08 Ω/side (square) and plated in the nickel using 0.5~3.0 μm of thickness, sheet resistance value
In layer gold.
But the Korean Patent Laid 10-2009-123776 utilizations will be most of by nickel and copper Gold plated Layer
The method of reflection of electromagnetic wave shields electromagnetic wave, and presence can not realize asking for shielding using the method for electromagnetic wave absorption
Topic.As a result, the situation of the electric conductivity foamed board is used in electronic equipment internal, produces problems with：Due to anti-from foamed board
The electromagnetic wave of injection and other neighbouring circuit elements are impacted.
Electromagnetic wave shielding plate is disclosed in Korean Patent Laid 10-2009-78620, it includes：Backing material plate, its
Formed by synthetic resin film；Metal vapor deposition layer, its spraying plating (Sputtering) is on the surface of backing material plate, and metal vapor deposition layer bag
Include the more than one composition selected in the group being made up of copper (Cu), nickel (Ni), zinc (Zn), aluminium (Al) and manganese (Mn).
But the electromagnetic wave shielding plate and KR published patent of the Korean Patent Laid 10-2009-78620
Publication 10-2009-123776 produces the problem of identical：Due to the electromagnetic wave that is reflected from metal vapor deposition layer and to neighbouring its
He impacts circuit element.
Because backing material plate is formed by synthetic resin film, the thickness of barricade is thickening, mancarried electronic aid thus be present
Integral thickness increase the problem of.As a result, it is known that in the case that the thickness of plate is more than 0.5mm, it is impossible to suitable for usually requiring that
Compactization portable terminal.
In addition, when conductive metal to be vaporized on to the surface of synthetic resin film, the separation of conductive metal layer occurs, so as to
The problem of electromagnetic wave shielding performance reduction be present.
The content of the invention
Therefore, the present invention proposes that its object is to provide a kind of electromagnetism in order to solve above-mentioned problem of the prior art
Ripple baffle and its manufacture method and include its electronic equipment, the electromagnetic wave absorption board is with the band to non-crystaline amorphous metal
Carry out thin slice (flake) processing and be separated into multiple fine, in the imaginary part of more than 400MHz electromagnetic wave noise frequency band
Permeability raises, so as to which electromagnetic wave absorptivity is outstanding.
It is another object of the present invention to provide a kind of electromagnetic wave absorption board and its manufacture method, the electromagnetic wave inhales
Plate is received as film and manufacturing process is simple and productivity is high, so as to which manufacturing expense is cheap.
Another purpose again of the present invention be to provide a kind of electromagnetic wave absorption board and its manufacture method, the electromagnetic wave
Baffle to thin plate magnetic sheet with by carrying out thin slice processing to reduce surface area, so as to solve by vortex flow (Eddy
Current heating problem caused by), the vortex flow are generated by AC magnetic field.
It is another object of the present invention to provide a kind of electromagnetic wave absorption board and its manufacture method, the electromagnetic wave inhales
The thickness for receiving plate is fabricated to less than 300 μm, so as to also cause shadow to compactization even if suitable for mancarried electronic aid
Ring.
In order to reach the purpose, the present invention provides a kind of electromagnetic wave absorption board, it is characterised in that including：It is at least one layer of
Thin plate magnetic sheet, it is separated into multiple fine；Diaphragm, it is adhered to the one side of the thin plate magnetic sheet；It is and two-sided
Adhesive tape, it is adhered to the another side of the thin plate magnetic sheet.
Preferably, in the electromagnetic wave absorption board, the imaginary part permeability of thin plate magnetic sheet is more than 50 in 300MHz.
Preferably, the thin plate magnetic sheet is formed by amorphous band, and the amorphous band is by iron (Fe) base noncrystal alloy, copper
(Co) base noncrystal alloy or nano-crystal grains alloy are formed.
Preferably, the thin plate magnetic sheet is formed by the amorphous band for being laminated for one to four layer, and in the stacking
Inserted with adhesion layer or two-sided tape between amorphous band.
In this case, preferably, the one side that is arranged on diaphragm is filled with the gap between the multiple fine
A part for second adhesion layer of the first adhesion layer and two-sided tape, so as to prevent moisture to be impregnated with.
Moreover it is preferred that the thickness forming range of the amorphous band is 15 to 35 μm, and the multiple fine shape
As tens of μm to 3mm of size.
Furthermore it is preferred that the thickness of the baffle is formed as 30 μm to 300 μm, and in 400MHz to 10GHz frequency
Used in band, the power loss in 1GHz to 8GHz frequency band is more than 60%, and the power loss is defined as power loss
(Ploss) and input electric power (Pin) the ratio between (Ploss/Pin)。
According to another feature of the invention, the present invention provides a kind of manufacture method of electromagnetic wave absorption board, and it is included such as
Lower step：The diaphragm formed with the first adhesion layer is adhered in the one side of thin plate magnetic sheet, and it is viscous in another side adhesion
With the two-sided tape of release (release) film, so as to form plywood；Thin slice processing is carried out to the plywood, and by institute
State thin plate magnetic sheet and be divided into multiple fine；Laminated (Laminate) processing is carried out to the plywood for carrying out thin slice processing,
So that plywood planarization and slimming.
As described above, according to the electromagnetic wave absorption board of the present invention, with the band progress thin slice processing to non-crystaline amorphous metal
Multiple fine are separated into, thus the imaginary part permeability in more than 400MHz electromagnetic wave noise frequency band is high, so as to electricity
Electro-magnetic wave absorption rate is outstanding.
As a result, electromagnetic wave absorption board of the invention absorbs the electromagnetic wave as caused by the various parts of electronic equipment, so as to
Miscellaneous part is impacted with blocking.
In addition, the electromagnetic wave absorption board of the present invention is the film that thickness is less than 300 μm, and manufacturing process is simple, so as to
Productivity is high, and manufacturing expense is cheap.
In addition, the electromagnetic wave absorption board of the present invention, more to be separated into by carrying out thin slice processing to the band of non-crystaline amorphous metal
Individual fine, so that counter magnetic field increases, and then make leading for plate with magnetic hystersis loss (hysteresis loss) is eliminated
The isotropism of magnetic rate improves, and reduces strip surface product, thus increases counter magnetic field without producing magnetic saturation, and pass through diminution
Lost caused by vortex flow (Eddy Current) and minimize heating.
Brief description of the drawings
Fig. 1 is the sectional view for the electromagnetic wave absorption board for representing the preferable first embodiment according to the present invention.
Fig. 2 is the sectional view for the electromagnetic wave absorption board for representing the preferable second embodiment according to the present invention.
Fig. 3 is the artwork for illustrating the manufacturing process of the electromagnetic wave absorption board according to the present invention.
Fig. 4 and Fig. 5 is to represent the sectional view that thin slice technique is carried out to plywood according to the present invention respectively.
Fig. 6 is the technique sectional view for representing the state that thin slice processing is carried out to plywood according to the present invention.
Fig. 7 and Fig. 8 is to represent the plywood progress lamination process to having carried out thin slice processing according to the present invention respectively
Technique sectional view.
Fig. 9 is represented according to the first embodiment of the present invention to laminate state after electromagnetic wave absorption board progress thin slice processing
Sectional view.
Figure 10 a and Figure 10 b are that the electromagnetic wave absorption board progress to not carrying out lamination process after progress thin slice processing is wet respectively
Spend the enlarged drawing of test, and after carrying out humidity measurement to carrying out laminated electromagnetic wave absorption board after thin slice processing according to the present invention
Enlarged drawing.
Figure 11 a to Figure 11 e be respectively represent the present invention with the nano-crystal grains strip material plate for electromagnetic wave absorption board
Heat treatment temperature change and permeability change chart.
Figure 12 is represented according to the present invention with the heat treatment of the nano-crystal grains strip material plate for electromagnetic wave absorption board
Temperature change and power loss (electromagnetic wave absorptivity) change chart.
Figure 13 a to Figure 13 c are represented respectively at the heat with the Fe base strip material plates for electromagnetic wave absorption board of the present invention
Manage the chart of temperature change and permeability change.
Figure 14 be represent the present invention with the Fe base strip material plates for electromagnetic wave absorption board heat treatment temperature change and
The chart of power loss change.
Figure 15 is to represent to carry out the power loss between the electromagnetic wave absorption board and comparative example baffle according to the present invention
The chart compared.
Figure 16 is the method for illustrating to measure the electromagnetic wave absorptivity of the electromagnetic wave absorption board according to the present invention
Explanation figure.
Embodiment
For above-mentioned objects, features and advantages, will be apparent from referring to the drawings by following detailed descriptions, thus easily
The people with general knowledge implements the technological thought of the present invention in the technical field belonging to the present invention.
In addition, when illustrating of the invention, illustrate that be judged as may not in known technology related to the present invention
The situation of idea of the invention is necessarily obscured, by description is omitted.
Fig. 1 is the sectional view for the electromagnetic wave absorption board for representing the preferable first embodiment according to the present invention, and Fig. 2 is to represent
According to the sectional view of the electromagnetic wave absorption board of the preferable second embodiment of the present invention, Fig. 3 is for illustrating according to the present invention
The artwork of the manufacturing process of electromagnetic wave absorption board.
With reference to figure 1, included according to the electromagnetic wave absorption board 10 of the preferable first embodiment of the present invention：One layer or multilayer
Thin plate magnetic sheet 2, after being heat-treated to the band of non-crystaline amorphous metal or nano-crystal grains alloy carry out thin slice processing,
So as to be separated into multiple fine 20 and/or form crack (crack)；Diaphragm 1, it is adhered to the thin plate magnetic sheet
2 top；Two-sided tape 3, it is adhered to the bottom of the thin plate magnetic sheet 2；Mould release membrance (release film) 4, it is adhered to
In the bottom of the two-sided tape 3.
The thin plate magnetic sheet 2, it is, for example, possible to use the thin plate formed by non-crystaline amorphous metal or nano-crystal grains alloy
Band.
The non-crystaline amorphous metal can use Fe bases or Co base noncrystal alloys, it is contemplated that during Master Cost, it is preferred to use
Fe base noncrystal alloys.
In the present invention, Fe-Si-B alloys can be used as Fe base noncrystal alloys, Fe-Si-B-Co can be used as needed
Alloy, and can use Co-Fe-Ni-Si-B or Co-Fe-Cr-Si-B alloys as Co base noncrystal alloys.
Preferably, in Fe-Si-B alloys Fe be 70-90atomic%, Si and B and be 10-30atomic%.The gold such as Fe
The content of category is higher, then saturation induction density is higher, but when the content of Fe elements is excessive, it is difficult to amorphous is formed, it is therefore, excellent
Selection of land, Fe content is 70-90atomic% in the present invention.In addition, Si and B's and in 10-30atomic% scope, is closed
The amorphous formation ability of gold is fitst water.In order to prevent corrosion from occurring in the basic composition, 20atomic% can also be added
Within the corrosion resistance element such as Cr, Co, and other a small amount of metallic elements can be included as needed, so as to special with other
Property.
The Fe-Si-B alloys, it is, for example, possible to use crystallized temperature is 508 DEG C and Curie temperature (Tc) is 399 DEG C
Fe-Si-B alloys.But the crystallized temperature can with Si and B content or in addition to triad alloying component and
Addition other metallic elements and its content and produce variation.
Furthermore it is preferred that nano-crystal grains alloy uses the alloy for meeting following mathematical expressions 1.
Mathematical expression 1
Fe100-c-d-e-f-g-hAcDdEeSifBgZh
In the mathematical expression 1, A represents at least one element for being selected among Cu and Au, D represent from Ti, Zr, Hf, V,
At least one element selected among Nb, Ta, Cr, Mo, W, Ni, Co and rare earth element, E represent from Mn, Al, Ga, Ge, In,
At least one element selected among Sn and platinum group metal element, Z represent at least one element selected among C, N and P, c, d,
E, f, g and h for meet respectively 0.01≤c of relational expression≤8at%, 0.01≤d≤10at%, 0≤e≤10at%, 10≤f≤
25at%, 3≤g≤12at%, 15≤f+g+h≤35at% number, the area of the alloy structure than more than 20% by grain
Below footpath 50nm fine structure composition.
About above-mentioned mathematical expression 1, element A is used for the corrosion resistance for improving alloy, prevents the coarsening of crystalline particle
Meanwhile improve the magnetic characteristic of iron loss or the permeability of alloy etc..The content of element A is too low, then is difficult to obtain suppression crystal grain
The effect of coarsening.On the contrary, the content of element A is excessive, then magnetic characteristic dilution.It is therefore preferred that the content of element A is 0.01
To 8at% scope.D elements the effective element such as reduce for the equalization for crystal grain diameter and magnetic variation shape.Preferably,
Scope of the content of D elements 0.01 to 10at%.
E elements are to the soft magnetic characteristic of alloy and the effective element of the improvement of corrosion resistance.Preferably, the content of E elements
For below 10at%.Si and B is to facilitate the element that the amorphous (amorphous) of alloy is changed when manufacturing magnetic sheet.Preferably, Si
Scope of the content 10 to 25at%, B content is 3 to 12at% scope.In addition, facilitate conjunction as beyond Si and B
Z elements can also be included in alloy by the decrystallized element of gold.Now, it is preferable that total content of Si, B and Z element is 15
To 35at% scope.Fine crystal structure is preferably formed to realize following structure：The crystal grain that particle diameter is 5 to 30nm is closing
Exist in golden structure with scope of the area than 50 to 90%.
In addition, the nano-crystal grains alloy for the thin plate magnetic sheet 2, it is, for example, possible to use Fe-Si-B-Cu-Nb is closed
Gold, now, it is preferable that Fe 73-80at%, Si and B's and be 15-26%, Cu and Nb's and be 1-5at%.Described group
The non-crystaline amorphous metal that can make to be made as band (ribbon) form into scope is by heat treatment described later and easily with the knot of nanometer shape
Grained deposits go out.
The diaphragm 1, it is, for example, possible to use the polyethylene terephthalate of 1 to 50 μ m thick
It is (Polyethylene Terephthalate, PET) film, polyimides (Polyimide) film, polyester (polyester) film, poly-
Diphenyl sulfide (Polyphenylene sulfide, PPS) film, polypropylene (polypropylene, PP) film and poly terephthalic acid
The resin film 11 of the fluororesin basement membrane of ester (Polyterephthalate, PTFE) equally etc., and it is viscous by the first adhesion layer 12
Invest the one side of thin plate magnetic sheet 2.
In addition, two-sided tape 3, for example, PET (Polyethylene Terephthalate) film is used as into base material 32 and made
The two-sided tape of two sides is formed at second and third adhesion layer 31,33, and in the outer of second and third adhesion layer 31,33
Side is stained with mould release membrance 4.The mould release membrance 4 is integrally formed when manufacturing two-sided tape 3, and is adhered to electricity in baffle 10
Peel off and eliminate during sub- equipment.
Two-sided tape 3 can be applicable the type of base material as described above, no base material can also be applied and only by adhering to
Layer formed without type of substrate.
Described first to the 3rd adhesion layer 12,31,33, it is, for example, possible to use acrylic acid (acrylic) base adhesive, when
Other kinds of adhesive so can also be applied.
For the thin plate magnetic sheet 2 of the electromagnetic wave absorption board 10, it is, for example, possible to use every thickness is 10 to 35 μm
Thin plate magnetic sheet.Now, it is preferable that in view of processing (handling) work after being heat-treated for thin plate magnetic sheet 2
Skill, then the thickness of thin plate magnetic sheet 2 be set as 25 to 30 μm.The thickness of band is thinner, when being handled after the heat treatment i.e.
Make slight impact that the fracture phenomena of band can also occur.
Preferably, multiple fine 20 of amorphous band 2a have tens of μm~below 3mm size.
In addition, diaphragm 1 can be with diaphragm of the use range at 10-30 μm, it is preferable that thickness is 20 μm.Two-sided tape 3
The two-sided tape that thickness is 10,20,30 μm can be used, it is preferable that thickness is 10 μm.But the present invention is not limited to this,
Diaphragm 1 and two-sided tape 3 can also use 50 μm -100 μm of thick diaphragm as needed.
The electromagnetic wave absorption board 10 of the first embodiment shown in Fig. 1 uses a thin plate magnetic sheet 2, but in order to improve
Electromagnetic wave absorptivity, as shown in Fig. 2 two to four stackings of thin plate magnetic sheet 22,24 can also be used.By two to four
Open the stacking of thin plate magnetic sheet 22,24 and carry out in use, inserting adhesion layer or double faced adhesive tape between the thin plate magnetic sheet of stacking
Band, so as to prevent that fine of the magnetic sheet when carrying out thin slice processing is disperseed.
With reference to figure 2, according to the electromagnetic wave magnetic sheet 10a of the preferable second embodiment of the present invention, diaphragm 1 is adhered to two
The one side of the thin plate magnetic sheet 22,24 of Rotating fields, inserted with the 4th adhesion layer between the plate of the thin plate magnetic sheet 22,24
3a, and two-sided tape 3b and mould release membrance 4 are stained with another side.4th adhesion layer 3a can also use two-sided tape.
The thin plate magnetic sheet 22,24 is identical with first embodiment, using to non-crystaline amorphous metal or nano-crystal grains alloy
Band be heat-treated after carry out thin slice processing, so as to be separated into multiple fine 20 and/or formed crack it is thin
Plate magnetic sheet.
It is 30 to 300 μm according to the thickness of the electromagnetic wave absorption board of the present invention, it is preferable that it is set as 40 to 150 μm, and
Service band is 400MHz to 10GHz.Now, when the thickness of baffle is more than 500 μm, it is impossible to suitable for pursuing filming trend
Portable terminal etc..
Hereinafter, with reference to figure 3, the manufacture method of electromagnetic wave absorption board 10 according to an embodiment of the invention is illustrated.
First, using according to the manufacture of the rapid solidification method (RSP) of melt spinning (melt spinning) by non-crystaline amorphous metal or
S11 after the amorphous band 2a that person's nano-crystal grains alloy is formed, for ease of the post processing being heat-treated, so as to it is preferred with
Certain length is cut (cutting) and is laminated for plate shape state S12.
In the case that amorphous band 2a is non-crystaline amorphous metal, to Fe base amorphous bands, for example, to being formed by Fe-Si-B alloys
Less than 30 μm of extremely thin type amorphous band, manufactured by using the rapid solidification method (RSP) according to melt spinning, and
In order to obtain desired permeability, so as to be carried out 30 minutes within the temperature range of 300 DEG C to 600 DEG C to the amorphous band of stacking
To 2 hours without magnetic-field heat treatment S13.
Now, even if the amorphous band 2a of heat-treating atmosphere Fe contents are higher, but it is also in the temperature not aoxidized
In the range of carry out, carried out therefore without in atmosphere furnace, even being heat-treated in an atmosphere.In addition, even in oxic gas
Be heat-treated in atmosphere or blanket of nitrogen, as long as identical temperature conditionss, then the permeability of amorphous band do not have substantial
Difference.
When above-mentioned heat treatment temperature is less than 300 DEG C, problems be present：Due to the internal stress occurred during manufacture magnetic sheet
Elimination (stress relief) can not fully achieve, so as to can not eliminate permeability etc. magnetic characteristic it is unequal, thus need
To be heat-treated for a long time.During more than 600 DEG C, problems be present：It is rapid real inside magnetic sheet due to Overheating Treatment
Now crystallize, thus permeability significantly reduces, it is impossible to desired permeability occur.Generally, following tendency is shown：If heat treatment
Temperature is low, then needs to be heat-treated for a long time, if on the contrary, heat treatment temperature is high, shorten processing time.
In addition, when amorphous band 2a is formed by nano-crystal grains alloy, to Fe base amorphous bands, for example, to by Fe-Si-
Less than 30 μm of the extremely thin type amorphous band that B-Cu-Nb alloys are formed, is entered using the rapid solidification method (RSP) according to melt spinning
Row manufacture, and in order to obtain desired permeability, so as to the strip material plate of stacking within the temperature range of 300 DEG C to 700 DEG C
30 minutes to 2 hours are carried out without magnetic-field heat treatment, is consequently formed the nano-crystal grains strip material plate S13 formed with nano-crystal grains.
Now, Fe content is more than 70at% in heat-treating atmosphere, therefore is heat-treated in an atmosphere, then forms oxygen
Change, consider it is non-preferable mode from the side of time, thus preferably mode is carried out in blanket of nitrogen.But even in
Be heat-treated in oxidizing atmosphere, as long as identical temperature conditionss, then the permeability of plate there is no substantial difference.
Now, when heat treatment temperature is less than 300 DEG C, problems be present：Nano-crystal grains nonfully, so that can not
Desired permeability is obtained, and needs to be heat-treated for a long time.During more than 700 DEG C, magnetic conduction due to Overheating Treatment be present
The problem of rate significantly reduces.Preferably, heat treatment temperature is low, then length of required processing time, on the contrary, heat treatment temperature is high, then
Shorten processing time.
In addition, the amorphous band 2a of the present invention using thickness in the amorphous band of 15~35 μ ms, and amorphous band
The increase proportional to the thickness of band of 2a permeability.
In addition, being heat-treated to the amorphous band, then fragility strengthens, so as to implement thin slice processing in subsequent technique
When be easily achieved thin slice.
Thereafter, the amorphous band 2a of Overheating Treatment is carried out using the multilayer of one or two to four layers, adheres to and protect in side
Cuticula 1, implement thin slice processing in the state of double-face adhensive tape 3 in opposite side, the two-sided tape 3 is stained with mould release membrance
4S14.Adhesion layer or two-sided tape are inserted between the thin plate magnetic sheet of stacking.
With regard to the thin slice processing for, for example, according to by plywood 100 by first and second sheet handling device 110,
120 and amorphous band 2a is separated into multiple fine 20, the plywood 100 is by diaphragm 1, amorphous band 2a and double faced adhesive tape
Band 3 and mould release membrance 4 are stacked gradually and formed.Now, multiple fine 20 of separation are according to being adhered to the first and the of two sides
Two adhesion layers 12,31 and maintain separation state.
As shown in Figure 4, it becomes possible to for the first chip device 110 used, for example, metal rolls can be included
(roller) 112 and rubber rollers 114, the metal rolls 112 form multiple concavo-convex 116 outside, the rubber rollers 114
Set across a certain distance with the phase of metal rolls 112, and as shown in figure 5, the second sheet handling device 120 can include metal
Roller 122 and rubber rollers 124, the metal rolls 122 are provided with spherical ball (ball) 126, the rubber rollers outside
Son 124 is set across a certain distance with the phase of metal rolls 122.
In this way, make plywood 100 by first and second sheet handling device 110,120, then as shown in fig. 6, amorphous ribbon
Material 2a is separated into multiple fine 20, while occurs gap 20a between fine 20.
Multiple fine 20 of amorphous band 2a are formed as size in tens of μm~3mm scopes, thus increase counter magnetic field, from
And the isotropism of the permeability for plate is improved while eliminating magnetic hystersis loss (hysteresis loss).
In addition, amorphous band 2a reduces the surface area of band due to thin slice processing, due to that can eliminate due to vortex flow
Heating problem caused by (Eddy Current), the vortex flow are generated by AC magnetic field.
There is gap 20a in the plywood 200 for carrying out thin slice processing, between fine 20 if moisture is to the gap
20a is impregnated with, then amorphous band is oxidized, and is reduced so as to the degraded appearance and shielding properties of amorphous band.
In addition, the plywood 200 for carrying out thin slice processing may become not on the surface of plate when carrying out thin slice processing
Equalization, and need to realize the stabilisation for the band for carrying out thin slice processing.
Therefore, carried out thin slice processing plywood 200 in order to prevent moisture between fine 20 gap 20a soak
Thoroughly, implement to be used to realize planarization, slimming and stabilized lamination process while so that adhesive being inserted into gap 20a
S15。
For being used to carry out the lamination process device 400,500 of the lamination process, as shown in fig. 7, roller can be applicable
Formula suppresses the device of (rollpress) type, and the device of the rod formula compacting type includes：First impression roller 201, it causes
The plywood 200 for carrying out thin slice processing passes through；And second impression roller 220, it is separated by necessarily with the first impression roller 210
Spacing and set, as shown in figure 8, can use hydraulic pressure (Hydraulic press) type device, the dress of the hydraulic type
Put including：Bottom pressure-producing part 240；Top pressure-producing part 250, it is arranged on bottom in a manner of it can be moved towards vertical direction
The upside of pressure-producing part 240.
At normal temperatures or after being heated to 50 to 80 DEG C of temperature, make it logical the plywood 200 for carrying out thin slice processing
Cross lamination process device 400,500, then while the first adhesion layer 12 of pressurization diaphragm 1, a part for the first adhesion layer 12
Adhesive flow into gap 20a, and pressurize two-sided tape 30 while, a part of adhesive of the second adhesion layer 31 flows into seam
Gap 20a, so as to sealing off gap 20a.
Here, it what can be deformed if pressurizeing at normal temperatures can be used to glue the first adhesion layer 12 and the second adhesion layer 31
Attached dose, or the thermoplasticity adhesive deformed if heating can be used.
And, it is preferable that the thickness of the first adhesion layer 12 and the second adhesion layer 31 is arranged to the thickness ratio with amorphous band
For more than 50%, so as to adequately fill up the gap 20a between multiple fine.
Moreover it is preferred that the spacing between the first impression roller 210 and the second impression roller 220, and top pressurization part
When part is decline state, the spacing between top pressure-producing part 250 and bottom pressure-producing part 240 is arranged to secondary screen shield plate 200
Less than the 50% of thickness, so that the adhesive of the first adhesion layer 12 and the second adhesion layer 31 flows into gap 20a.
In the present invention, can be used plywood 100,200 is suppressed and thin slice processing any device.
As shown in figure 9, the lamination process is completed, then according to the electromagnetic wave absorption board 10 of the present invention, in amorphous band 2a
It is separated into the state of multiple fine 20, the first adhesion layer 12 and the second adhesion layer 31 locally fill fine 20 respectively
Between gap 20a, so as to prevent amorphous band 2a oxidation structure.
Finally, to carrying out the laminated electromagnetic wave absorption board 10 for needed for the place of electronic equipment and purposes
Size and shape carries out punching press (stamping) processing, so as to realize commercialization S16.
(humidity measurement)
Pin obtain in above-mentioned according to the electromagnetic wave absorption board 10 of the present invention and carry out after thin slice processing without laminated
The plywood of technique, 120 hours humidity measurements are carried out in the state of 85 DEG C of temperature, humidity 85%.
As a result, as shown in Figure 10 a, in the case of the plywood 200 for only carrying out thin slice processing, it is known that amorphous band exists
When being separated into the state of multiple fine, moisture is impregnated with the gap between fine, so that amorphous band is oxidized and outward appearance
Change is produced, and as shown in fig. lob, it is known that do not changed according to the outward appearance of electromagnetic wave absorption board 10 of the present invention.
Hereinafter, further illustrated by embodiments of the invention.But following embodiments is only the present invention's
Example, the scope of the present invention are not limited to this.
(embodiment 1 to 7)
Using rapid solidification method (RSP) 20 μ m thicks of manufacture according to melt spinning by Fe73.5Cu1Nb3Si13.5B9Alloy
After the amorphous band of formation, cut with plate shape state, and respectively 320 DEG C, 350 DEG C, 400 DEG C, 450 DEG C, 500 DEG C, 510
DEG C, 600 DEG C of N21 hour is carried out in atmosphere without magnetic-field heat treatment, so as to obtain amorphous band plate, the amorphous band plate is inserted
Enter to the diaphragm of 10 μ m thicks using PET base material and (mould release membrance removes using the two-sided tape of 10 μ m thicks of PET base material
Between outside), so as to prepare the plywood that thickness is 45 μm, and filled using Fig. 4 sheet handling device and Fig. 7 lamination process
Put and implement thin slice and lamination process, final sample (ARS1-320, ARS1- for manufacturing the embodiment 1 to 7 that thickness is 40 μm
350、ARS1-400、ARS1-450、ARS1-500、ARS1-510、ARS-600)。
The change according to frequency (frequency) is tried to achieve using obtained embodiment 2 to 5 and the sample of embodiment 7 as object
Permeability (Permeability) numerical value of change, and the chart being shown as in Figure 11 a to Figure 11 e.
In addition, with the sample of obtained embodiment 1 to 7 (ARS1-320, ARS1-350, ARS1-400, ARS1-450,
ARS1-500, ARS1-510, ARS-600) it is object, utilize the micro-strip collimation method (Micro-stripline shown in Figure 16
Method power loss (power loss)) is measured, so as to which obtained chart be shown in fig. 12.
As shown in following mathematical expressions 2, the electromagnetic wave absorptivity of electromagnetic wave absorption board can be defined as power loss (power
Loss), and power loss is by power loss (Ploss) and input electric power (Pin) ratio (Ploss/Pin) obtained numerical value.
Mathematical expression 2
Here, S11Represent reflectance factor (reflection), S21Represent transmission coefficient (transmission).
In order to measure reflectance factor (reflection) S11With transmission coefficient (transmission) S21And by embodiment 1
Sample to 7 is arranged on substrate, and the Cu microstrip lines of 50 Ω impedances (impedance) are respectively arranged at the defeated of the substrate
Enter end and output end, and the input of microstrip line and output end are being connected to network analyser (Network Analyzer)
In the state of, apply input signal to the input of microstrip line, and measure the reflectance factor obtained from input and output end
(reflection)S11With transmission coefficient (transmission) S2, so as to try to achieve power loss according to mathematical expression 2.
First, with reference to figure 11a to Figure 11 e, it is known that sample (ARS1-350, ARS1- of embodiment 2 to 5 and embodiment 7
400th, ARS1-450, ARS1-500, ARS-600) in more than 400MHz electromagnetic wave noise frequency band show as imaginary part magnetic conduction
Rate μ " is high and electromagnetic wave absorptivity is outstanding.Particularly, what is shown in Figure 11 d carries out the embodiment of heat treatment in 1 hour at 500 DEG C
4 situation, there is about 500 or so permeability, now, imaginary part magnetic permeability mu in 1MHz " about 200 are shown as in 2MHz,
And peak.
In addition, the sample of embodiment 2 to 5 and embodiment 7 is in 300MHz imaginary parts magnetic permeability mu " performance more than 70, it is known that
With very outstanding electromaganic wave absorbing property.
Generally, magnetic permeability mu is represented with μ=μ '-i μ, and imaginary part magnetic permeability mu " is used as loss factor (loss
Factor), so as to which electromagnetic wave absorption board is preferably that imaginary part magnetic permeability mu is " larger.Real part magnetic permeability mu ' it is to represent magnetic
The factor of property.
With reference to power loss (power loss) chart changed according to frequency shown in figure 12, according to the reality of the present invention
Apply the sample (ARS1-320, ARS1-350, ARS1-400, ARS1-450, ARS1-500, ARS1-510, ARS-600) of example 1 to 7
25% to 37% power loss is shown in 400MHz to 1GHz electromagnetic wave noise frequency band, in 1GHz into 8GHz frequency bands
More than 60% power loss is shown, so as to show high electromagnetic wave absorptivity.
(embodiment 8 to 11)
Using rapid solidification method (RSP) 25 μ m thicks of manufacture according to melt spinning by Fe67B14Si1Co18Alloy is formed
Amorphous band after, cut with plate shape state, and carry out 1 at a temperature of 454 DEG C, 456 DEG C, 457 DEG C, 459 DEG C respectively
Hour without magnetic-field heat treatment, so as to obtain amorphous band plate.By the amorphous band plate identically with the embodiment 1, prepare
Thickness is 45 μm of plywood, and implements thin slice and lamination process, the final sample for manufacturing the embodiment 8 to 11 that thickness is 40 μm
Product (ARS2-454, ARS2-456, ARS2-457, ARS2-459).
The magnetic conduction of the change according to frequency (frequency) is tried to achieve using the sample of obtained embodiment 8 to 10 as object
Rate score, and the chart being shown as in Figure 13 a to Figure 13 c.
In addition, using the obtained sample of embodiment 8 to 11 as object, the micro-strip line measurement power shown in Figure 16 is utilized
Chart is shown in Figure 14 obtained from loss.
Use is with Fe67B14Si1Co18The sample of the embodiment 8 to 10 for the amorphous band that alloy is formed compares with embodiment 1 to 7
Compared with and obtain similar permeability, in addition, the sample of embodiment 8 to 10 " is expressed as about 50 in 300MHz imaginary parts magnetic permeability mu
More than, so as to understand that there is very outstanding electromaganic wave absorbing property.
In addition, 30% to 40% power loss (power is shown in 400MHz to 1GHz electromagnetic wave noise frequency band
Loss), more than 52% power loss is shown into 8GHz frequency bands in 1GHz, so as to show high electromagnetic wave absorptivity.It is special
It is not that the sample (ARS2-454, ARS2-456, ARS2-457, ARS2-459) of embodiment 8 to 11 is in 1GHz to 10GHz frequency bands
In show more than 66% high power losses, therefore show high electromagnetic wave absorptivity.
By the use of the present invention by Fe73.5Cu1Nb3Si13.5B9The sample of the embodiment 6 for the amorphous band that alloy is formed
(ARS1-500) and use of the invention is by Fe67B14Si1Co18Sample (the ARS2- of the embodiment 9 for the amorphous band that alloy is formed
456) comparative example 1 and 2 is used as, by comparative example 1 and 2 and the electromagnetic wave absorption board (TODA) and iron silicon using TODA KOGYO companies
Aluminium soft magnetism (Sendust) (Fe-Si-Al) alloy powder and the electromagnetic wave absorption board (sendust) that makes are compared, to basis
Frequency and figure that the power loss that changes is measured represents in fig.15.
As shown in figure 15,6 (ARS1-500) and embodiment 9 (ARS2-456) and comparative example 1 according to an embodiment of the invention
(TODA) when and comparative example 2 (sendust) is compared, shown in all frequency bands more superior than comparative example 2 (sendust)
Power loss, and the power loss spy higher or equal than comparative example 1 (TODA) is shown in more than 400MHz frequency band
Property.
As described above, for the electromagnetic wave absorption board according to the present invention, as the band to non-crystaline amorphous metal carries out thin slice
Handle and be separated into multiple fine, thus imaginary part permeability is high, so as to 30 μm to 300 μm of thickness in 400MHz extremely
Outstanding electromagnetic wave absorptivity is shown in 10GHz electromagnetic wave noise frequency band.
In the above-mentioned explanation for embodiment, for thin plate magnetic sheet, although example goes out using cheap
Fe base amorphous bands, but the amorphous band formed by the same other kinds of alloy of Co base noncrystal alloys can also be used.
More than, it is of the invention although specific preferred embodiment by way of example of the invention is illustrated and illustrated
The above embodiments are not limited to, and technology can be led as belonging to the present invention in the range of the thought without departing from the present invention
The people with general knowledge carries out numerous variations and amendment in domain.
Possibility is utilized in industry
Block and shadow is caused to other elements present invention may apply to absorb the electromagnetic wave as caused by direct current (DC) magnetic field
Loud electromagnetic wave absorption board, the DC magnetic fields are by integrated circuit (IC) chip, the flat cable (flat for various electronic equipments
Cable), PCB circuits, battery pack (battery pack), radio frequency identification (RFID, Radio Frequency
Identification) and wireless near field communication (NFC, Near Field Communication) etc. antenna
Etc. (antenna) radiation noise (exchange (AC) magnetic field) or the magnet of loudspeaker (speaker) etc. produces.
Claims (15)
- A kind of 1. electromagnetic wave absorption board, it is characterised in that including：At least one layer of thin plate magnetic sheet, it is by the band of Fe base noncrystal alloys or the band shape of Fe base nano-crystal grains alloys Into being separated into multiple fine to reduce the loss of vortex flow；Diaphragm, it is adhered to the one side of the thin plate magnetic sheet by the first adhesion layer；AndTwo-sided tape, it is adhered to the another side of the thin plate magnetic sheet by the second adhesion layer,A part for first adhesion layer and second adhesion layer are filled with gap between the multiple fine A part,The imaginary part permeability of the thin plate magnetic sheet is more than 50 in 300MHz.
- 2. electromagnetic wave absorption board according to claim 1, it is characterised in thatIn the case that the thin plate magnetic sheet is formed by the band of Fe base noncrystal alloys, within the temperature range of 300 DEG C~600 DEG C Carry out without magnetic-field heat treatment.
- 3. electromagnetic wave absorption board according to claim 1, it is characterised in thatIn the case that the thin plate magnetic sheet is formed by the band of Fe base nano-crystal grains alloys, in 300 DEG C~700 DEG C of temperature In the range of carry out without magnetic-field heat treatment.
- 4. electromagnetic wave absorption board according to claim 1, it is characterised in thatThe thin plate magnetic sheet is formed by the band for being laminated for one to four layer of Fe base noncrystal alloys,And inserted with adhesion layer or two-sided tape between the band of the Fe base noncrystal alloys of the stacking.
- 5. electromagnetic wave absorption board according to claim 1, it is characterised in thatThe Fe base noncrystal alloys are formed by Fe-Si-B or Fe-Si-B-Co alloys,The Fe bases nano-crystal grains alloy is formed by Fe-Si-B-Cu-Nb alloys.
- 6. electromagnetic wave absorption board according to claim 1, it is characterised in thatThe thickness forming range of the band of the Fe base noncrystal alloys is 15 to 35 μm.
- 7. electromagnetic wave absorption board according to claim 1, it is characterised in thatThe thickness of the electromagnetic wave absorption board forms 30 μm to 300 μm, and is used in 400MHz to 10GHz frequency band.
- 8. electromagnetic wave absorption board according to claim 1, it is characterised in thatThe power loss of the electromagnetic wave absorption board is more than 60% in 1GHz to 8GHz frequency band, the power loss definition For power loss PlossWith input electric power PinThe ratio between Ploss/Pin。
- 9. a kind of mancarried electronic aid, it is characterised in that including the electromagnetism according to any one among claim 1 to 8 Ripple baffle.
- 10. a kind of manufacture method of electromagnetic wave absorption board, it is characterised in that comprise the following steps：In the side for the thin plate magnetic sheet that the band of the band by Fe base noncrystal alloys or Fe base nano-crystal grains alloys is formed Face adheres to the diaphragm formed with the first adhesion layer, and adheres to the two-sided tape formed with the second adhesion layer in another side, So as to form plywood；Thin slice processing is carried out to the plywood, and the thin plate magnetic sheet is divided into multiple fine, so as to reduce thin plate The eddy current losses of magnetic sheet；AndLamination process is carried out to the plywood for carrying out thin slice processing, so that while plywood planarization and slimming With the gap between a part for first adhesion layer and the multiple fine of the part filling of second adhesion layer.
- 11. the manufacture method of electromagnetic wave absorption board according to claim 10, it is characterised in thatAlso comprise the following steps：Before the plywood is formed, the thin plate magnetic sheet is heat-treated.
- 12. the manufacture method of electromagnetic wave absorption board according to claim 10, it is characterised in thatIn the case that the thin plate magnetic sheet is formed by the band of Fe base noncrystal alloys, within the temperature range of 300 DEG C~600 DEG C Carry out without magnetic-field heat treatment.
- 13. the manufacture method of electromagnetic wave absorption board according to claim 10, it is characterised in thatIn the case that the thin plate magnetic sheet is formed by the band of Fe base nano-crystal grains alloys, in 300 DEG C~700 DEG C of temperature In the range of carry out without magnetic-field heat treatment.
- 14. the manufacture method of electromagnetic wave absorption board according to claim 10, it is characterised in thatThe thin plate magnetic sheet is formed by the band for being laminated for one to four layer of Fe base noncrystal alloys,And inserted with adhesion layer or two-sided tape between the band of the Fe base noncrystal alloys of the stacking.
- 15. the manufacture method of electromagnetic wave absorption board according to claim 10, it is characterised in thatThe thickness of the electromagnetic wave absorption board is formed as 30 μm to 300 μm, and is used in 400MHz to 10GHz frequency band.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2012-0155203 | 2012-12-27 | ||
| KR1020120155203A KR101399022B1 (en) | 2012-12-27 | 2012-12-27 | Sheet for absorbing electromagnetic wave, manufacturing method thereof and electronic equipment including the same |
| PCT/KR2013/012307 WO2014104816A1 (en) | 2012-12-27 | 2013-12-27 | Electromagnetic wave absorbing sheet, method for manufacturing same, and electronic device comprising same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104885587A CN104885587A (en) | 2015-09-02 |
| CN104885587B true CN104885587B (en) | 2018-02-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380066913.7A Active CN104885587B (en) | 2012-12-27 | 2013-12-27 | Electromagnetic wave absorption board and its manufacture method and the electronic equipment for including it |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9832917B2 (en) |
| KR (1) | KR101399022B1 (en) |
| CN (1) | CN104885587B (en) |
| WO (1) | WO2014104816A1 (en) |
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| WO2013183913A1 (en) * | 2012-06-04 | 2013-12-12 | 주식회사 아모센스 | Magnetic field shielding sheet for digitizer, method for manufacturing same, and portable terminal device using same |
| EP2684689B1 (en) * | 2012-07-12 | 2018-03-07 | SKC Co., Ltd. | Flexible ceramic laminate sheet and preparation method thereof |
| KR101399024B1 (en) * | 2012-12-14 | 2014-05-27 | 주식회사 아모센스 | Magnetic shielding sheet, manufacturing method thereof, and portable terminal using the same |
| KR101703842B1 (en) * | 2013-03-05 | 2017-02-08 | 주식회사 아모센스 | Composite Sheet for Shielding Magnetic Field and Electromagnetic Wave and Antenna Module Using the Same |
| KR101443292B1 (en) * | 2013-05-28 | 2014-09-22 | 주식회사 아모센스 | Magnetic Shielding Sheet for Digitizer and Portable Terminal having the Same |
-
2012
- 2012-12-27 KR KR1020120155203A patent/KR101399022B1/en active Active
-
2013
- 2013-12-27 WO PCT/KR2013/012307 patent/WO2014104816A1/en active Application Filing
- 2013-12-27 US US14/652,960 patent/US9832917B2/en active Active
- 2013-12-27 CN CN201380066913.7A patent/CN104885587B/en active Active
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| CN1530974A (en) * | 2003-03-17 | 2004-09-22 | Tdk��ʽ���� | Producing method for laminated flexible magnetic member, and flexible magnetic sheet, thermal treating method for laminated flexible magnetic member |
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Also Published As
| Publication number | Publication date |
|---|---|
| US9832917B2 (en) | 2017-11-28 |
| US20150342099A1 (en) | 2015-11-26 |
| WO2014104816A1 (en) | 2014-07-03 |
| CN104885587A (en) | 2015-09-02 |
| KR101399022B1 (en) | 2014-05-27 |
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