CN104882275A - Power capacitor with heat radiation structure - Google Patents

Abstract

The invention discloses a power capacitor with a heat dissipation structure. The power capacitor body includes a power capacitor shell and a power capacitor chip. The power capacitor shell is provided with a heat dissipation structure. The heat dissipation structure includes a support body and a heat dissipation layer. The support body includes a first surface and a second surface, the heat dissipation layer is arranged on the first surface of the support body, the heat dissipation layer includes a heat dissipation groove, a heat dissipation groove support sheet and a heat dissipation groove sealing layer, and the heat dissipation groove Located in the supporting sheet of the heat dissipation groove, the sealing layer of the heat dissipation groove covers the heat dissipation groove. With the above scheme, the power capacitor shell is provided with a heat dissipation groove, and the heat dissipation liquid is provided in the heat dissipation groove, and the materials used between the layers of the entire power capacitor and the shell are all good conductors of heat, so that the heat can be ensured in a timely manner. Dissipated to ensure the heat dissipation effect of the power capacitor.

Description

A power capacitor with heat dissipation structure

technical field

The invention relates to the technical field of power capacitors, in particular to a power capacitor with a heat dissipation structure .

Background technique

Power capacitors are usually rolled with insulating paper as the dielectric, metallized polypropylene capacitor film as the electrode, and immersed in insulating oil. Its function is to improve the power factor of the power system, reduce the power loss of the transmission line, and improve the stability of the power system.

For example, Chinese patent CN01105202.3, the present invention relates to power capacitors used in power systems. The feature is that there are several air passages for heat dissipation in the longitudinal direction of the capacitor, that is, in the up and down direction. Said air channel can be formed by the shell of the capacitor being recessed toward the inside of the capacitor; it can also be realized by arranging several metal tubes in the capacitor, the metal tubes longitudinally pass through the entire height direction of the capacitor and protrude from the bottom and top of the capacitor, the metal tubes There is a protective net cover on the top. The advantage is that during the working process of the power capacitor, the air will pass through the air channel to convect to accelerate the heat dissipation of the power capacitor, and it can work at high temperature for a long time. The invention does not expand the volume of the capacitor, has a simple manufacturing process, and has remarkable cooling effect.

Another example is the Chinese patent CN201520002125.8. The present invention relates to a smart power capacitor with good heat dissipation, including a base, a capacitor, a circuit board fixing bracket and a circuit board assembly. The circuit board assembly includes a circuit board, and the capacitor is installed on the base. The board fixing bracket is erected on the top of the capacitor, and the circuit board assembly is fixedly installed on the circuit board fixing bracket. The top of the capacitor is covered with a cover, and the circuit board assembly is placed in the cover. A heat dissipation window area composed of a plurality of heat dissipation windows, the heat dissipation window area includes a first heat dissipation window area and a second heat dissipation window area, the first heat dissipation window area is located above the circuit board, and the second heat dissipation window area Located under the circuit board, the circuit board fixing bracket has hollow holes corresponding to the position of the circuit board. Compared with the prior art, the invention has the advantages of good heat dissipation performance and reliable operation.

The casing of the current power capacitor is generally formed by stretching aluminum or welding other metals. Because the shell is limited by the processing technology and shape, the surface heat dissipation effect is not ideal. Especially when used outdoors in summer, the temperature inside the capacitor cabinet is as high as 65°C, which is far beyond the normal operating temperature range, causing power capacitors to fail and cannot operate safely, seriously affecting the stability of the power grid. The traditional way to solve this problem is to increase the thickness of the capacitor film, or increase the heat dissipation of its shell, but this will increase the manufacturing cost of the capacitor.

Contents of the invention

Based on this, it is necessary to provide a power capacitor with a heat dissipation structure to solve technical problems such as how to ensure better heat dissipation of the power capacitor.

A technical solution of the present invention is: a power capacitor with a heat dissipation structure , the power capacitor body includes a power capacitor shell and a power capacitor chip, and it is characterized in that a heat dissipation structure is provided inside the power capacitor shell, the The heat dissipation structure includes a support body and a heat dissipation layer. The support body includes a first surface and a second surface. The heat dissipation layer is arranged on the first surface of the support body. The heat dissipation groove sealing layer, the heat dissipation groove is located in the heat dissipation groove support sheet, the heat dissipation groove sealing layer covers the heat dissipation groove, wherein the heat dissipation liquid is arranged in the heat dissipation groove, the support body, the heat dissipation groove support sheet and The heat sink seal is a good conductor of heat.

In one embodiment, the second surface of the support body is provided with a grid-shaped shielding layer, the grid-shaped shielding layer is made of metal material, the surface of the grid-shaped shielding layer is covered with heat-conducting adhesive, and the mesh-shaped shielding layer The lattice shielding layer faces the power capacitor chip.

In one embodiment, the heat dissipation grooves form a pattern , and the pattern is composed of several rectangular ring grooves, and each of the rectangular ring grooves is connected through a first through groove.

In one embodiment, the heat dissipation grooves form a pattern , and the pattern is composed of several hexagonal grooves, and each of the rectangular annular grooves is connected through a second through groove.

In one embodiment, the grids in the grid-shaped shielding layer are regular polygons, and the side length of the grids is less than 50 microns.

In one embodiment, the power capacitor housing includes an outer housing and an inner housing, the outer housing is connected to the heat dissipation structure through an outer thermally conductive adhesive, and the inner housing is connected to the heat dissipation structure through an inner thermally conductive adhesive.

In one embodiment, the depth of the cooling groove is 1mm-3mm.

In one of the embodiments, the power capacitor chip is connected to the inner casing through thermal conductive glue.

Beneficial effects of the present invention:

Using the above scheme, the present invention provides a power capacitor with a heat dissipation structure . The power capacitor housing is provided with a heat dissipation groove, and the heat dissipation liquid is provided in the heat dissipation groove, and the entire power capacitor is arranged between various layers and the shell. The materials used in the body are good conductors of heat, which can ensure that the heat is released in time and ensure the cooling effect of the power capacitor.

Description of drawings

Fig. 1 is a kind of schematic diagram of the section structure of electric capacitor with heat dissipation structure of the present invention;

Fig. 2 is a schematic cross-sectional structure diagram of a power capacitor heat dissipation structure with a heat dissipation structure and a shielding layer of the present invention;

Fig. 3 is a kind of structural representation of heat dissipation layer in the power capacitor with heat dissipation structure of the present invention ;

Fig. 4 is another structural representation of the heat dissipation layer in a power capacitor with a heat dissipation structure of the present invention ;

5 is a schematic cross-sectional structure diagram of a power capacitor housing with a heat dissipation structure according to the present invention;

FIG. 6 is a schematic structural diagram of a grid of a shielding layer in a power capacitor with a heat dissipation structure according to the present invention.

Detailed ways

In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings . Preferred embodiments of the invention are shown in the accompanying drawings . However, the present invention can be implemented in many different forms and is not limited to the embodiments described below. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "Back","Left","Right","Vertical","Horizontal","Top","Bottom","Inner","Outer","Clockwise","Counterclockwise","Axial" , "radial", "circumferential" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings , which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device or Elements must have certain orientations, be constructed and operate in certain orientations, and therefore should not be construed as limitations on the invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components or the interaction relationship between two components, unless otherwise specified limit. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the present invention, unless otherwise clearly specified and limited, the first feature may be in direct contact with the first feature or the first and second feature may be in direct contact with the second feature through an intermediary. touch. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

For example, a power capacitor with a heat dissipation structure , the power capacitor body includes a power capacitor housing and a power capacitor chip, wherein a heat dissipation structure is provided in the power capacitor housing, and the heat dissipation structure includes a support body and a power capacitor chip. The heat dissipation layer, the support body includes a first surface and a second surface, the heat dissipation layer is arranged on the first surface of the support body, and the heat dissipation layer includes a heat dissipation groove, a heat dissipation groove support sheet and a heat dissipation groove sealing layer, so The heat dissipation groove is located in the heat dissipation groove support sheet, and the heat dissipation groove sealing layer covers the heat dissipation groove, wherein a heat dissipation liquid is arranged in the heat dissipation groove, and the support body, the heat dissipation groove support sheet and the heat dissipation groove sealing layer are thermal good conductor.

Please refer to FIG. 1 and FIG. 2, a power capacitor with a heat dissipation structure , the power capacitor body 10 includes a power capacitor housing 100 and a power capacitor chip 101, and a heat dissipation structure 20 is arranged in the power capacitor housing 100, The heat dissipation structure 20 includes a support body 200 and a heat dissipation layer, the support body 200 includes a first surface and a second surface, the heat dissipation layer is arranged on the first surface of the support body 200, and the heat dissipation layer includes a heat dissipation groove 202, heat dissipation groove support sheet 204 and heat dissipation groove sealing layer 205, the heat dissipation groove 202 is located in the heat dissipation groove support sheet 204, the heat dissipation groove sealing layer 205 covers the heat dissipation groove 202, wherein, the heat dissipation groove 202 is provided with There is a heat dissipation liquid, the support body 200, the heat dissipation groove support sheet 204 and the heat dissipation groove sealing layer 205 are good conductors of heat; the good conductor of heat can be thermally conductive glue, and the depth of the heat dissipation groove 202 is 1mm~3mm . With the above scheme, the housing of this type of power capacitor is provided with a heat dissipation groove, and the heat dissipation liquid is provided in the heat dissipation groove, and the materials used between the layers of the entire power capacitor and the housing are all good conductors of heat, which can ensure The heat is released in time to ensure the cooling effect of the power capacitor.

Please refer to FIG. 2, in order to better prevent external signal interference, or to avoid the interference of the power capacitor itself to the outside world, for example, the second surface of the support body 200 is provided with a grid-like shielding layer 201, the grid The grid-shaped shielding layer 201 is made of metal material, the surface of the grid-shaped shielding layer 201 is covered with heat-conducting glue, and the grid-shaped shielding layer 201 faces the power capacitor chip 101 .

Please refer to FIG. 3 , in order to better dissipate the heat of the power capacitor in time, for example, the heat dissipation groove 202 forms a pattern , and the pattern is composed of several rectangular ring grooves 202a, and each rectangular ring groove 202a communicated through the first through groove 206 .

Please refer to Fig. 4, in order to further dissipate the heat of the power capacitor in time, for example, the heat dissipation groove 202 forms a pattern , the pattern is composed of several hexagonal grooves 202b, and each rectangular ring groove 202b communicates through the second through groove 207 .

Please refer to Fig. 2 in conjunction with Fig. 6, in order to better prevent external interference and less interference to the external world, for example, the grid in the grid-shaped shielding layer 201 is a regular polygon, and the grid side length is less than 50 microns.

Please refer to FIG. 5 , in order that the power capacitor itself can conduct heat well, for example, the power capacitor casing 100 includes an outer casing 100a and an inner casing 100b, and the outer casing 100a is connected to the heat dissipation structure through an outer thermally conductive adhesive 102 20, the inner casing 100b is connected to the heat dissipation structure 20 through the inner thermally conductive glue 103; the power capacitor chip 101 is connected to the inner casing 100b through the thermally conductive glue.

Using the above scheme, the present invention provides a power capacitor with a heat dissipation structure . The power capacitor housing is provided with a heat dissipation groove, and the heat dissipation liquid is provided in the heat dissipation groove, and the entire power capacitor is arranged between various layers and the shell. The materials used in the body are good conductors of heat, which can ensure that the heat is released in time and ensure the cooling effect of the power capacitor.

In order to make the above objects, features and advantages of the present invention more obvious and comprehensible, the specific implementation manners of the present invention are described in detail above in conjunction with the accompanying drawings . In the foregoing description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described above, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed above. Moreover, the various technical features of the above-mentioned embodiments can be combined arbitrarily. For the sake of concise description, all possible combinations of the various technical features in the above-mentioned embodiments are not described. However, as long as there is no combination of these technical features Any contradiction should be regarded as within the scope of the description in this specification.

The above-mentioned embodiments only express several implementation modes of the present invention, and the description thereof is relatively specific and detailed, but should not be construed as limiting the patent scope of the present invention. In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or characteristic is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without conflicting with each other. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (8)

1. the electric capacitor with radiator structure, described electric capacitor body (10) comprises electric capacitor housing (100) and electric capacitor chip (101), it is characterized in that, radiator structure (20) is provided with in described electric capacitor housing (100), described radiator structure (20) comprises supporter (200) and heat dissipating layer, described supporter (200) comprises first surface and second surface, described heat dissipating layer is located at the first surface of described supporter (200), described heat dissipating layer comprises radiating groove (202), radiating groove support chip (204) and radiating groove sealant (205), described radiating groove (202) is positioned at radiating groove support chip (204), described radiating groove sealant (205) covers described radiating groove (202), wherein, described radiating groove is provided with radiator liquid in (202), described supporter (200), radiating groove support chip (204) and radiating groove sealant (205) are the good conductor of heat.

2. a kind of electric capacitor with radiator structure according to claim 1, it is characterized in that, the second surface of described supporter (200) is provided with latticed screen (201), described latticed screen (201) is metal material, described latticed screen (201) surface coverage heat-conducting glue, and described latticed screen (201) is towards electric capacitor chip (101).

3. a kind of electric capacitor with radiator structure according to claim 1, it is characterized in that, described radiating groove (202) composition pattern, described pattern is made up of some rectangle annular grooves (202a), and described each rectangle annular groove (202a) is communicated with by the first groove (206).

4. a kind of electric capacitor with radiator structure according to claim 2, it is characterized in that, described radiating groove (202) composition pattern, described pattern is made up of some hexagon grooves (202b), and described each rectangle annular groove (202b) is communicated with by the second groove (207).

5. a kind of electric capacitor with radiator structure according to claim 4, is characterized in that, the grid in described latticed screen (201) is regular polygon, and the grid length of side is less than 50 microns.

6. a kind of electric capacitor with radiator structure according to claim 1, it is characterized in that, described electric capacitor housing (100) comprises shell body (100a) and inner housing (100b), described shell body (100a) is connected with radiator structure (20) by outer heat-conducting glue (102), and described inner housing (100b) is connected with radiator structure (20) by interior heat-conducting glue (103).

7. a kind of electric capacitor with radiator structure according to claim 1, is characterized in that, described radiating groove (202) degree of depth is 1mm ~ 3mm.

8. a kind of electric capacitor with radiator structure according to claim 6, is characterized in that, described electric capacitor chip (101) is connected with inner housing (100b) by heat-conducting glue.