CN104852172B - A kind of electronic equipment and circuit board connection method - Google Patents
A kind of electronic equipment and circuit board connection method Download PDFInfo
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- CN104852172B CN104852172B CN201410056895.0A CN201410056895A CN104852172B CN 104852172 B CN104852172 B CN 104852172B CN 201410056895 A CN201410056895 A CN 201410056895A CN 104852172 B CN104852172 B CN 104852172B
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Abstract
The present invention discloses a kind of electronic equipment and circuit board connection method, and the electronic equipment includes first circuit board, second circuit board, tertiary circuit plate, the first anisotropic conductive film and the second anisotropic conductive film, and the first circuit board includes the first pin；The second circuit board includes second pin；The tertiary circuit plate is arranged between the first circuit board and the second circuit board, and the tertiary circuit plate is provided with the 3rd pin and the 4th corresponding with the 3rd Pin locations and opposite pin；First anisotropic conductive film is arranged between first pin and the 3rd pin, for being electrically connected first pin and the 3rd pin；And second anisotropic conductive film is arranged between the second pin and the 4th pin, for being electrically connected the second pin and the 4th pin.
Description
Technical field
The present invention relates to electronic technology field, more particularly to a kind of electronic equipment and circuit board connection method.
Background technology
Two or more circuit board is usually provided with electronic equipment, the circuit board can be printed circuit
Plate, or flexible PCB, or one is flexible PCB, one is printed circuit board (PCB).Set assembling the electronics
When standby, it usually needs be electrically connected two or more circuit board.
In the prior art, generally cause that described two or more than two circuit boards are electrically connected in the following manner
Connect.First, connector is set on circuit boards, then, the connector on two circuit boards is connected by winding displacement etc., to connect
Individual circuit board electrical connection.If a circuit board needs to be electrically connected with two circuit boards simultaneously, need at this
Connector is set on two different positions of circuit board, and a connector is electrically connected with another circuit board, so as to realize
One circuit board is connected with two circuit boards simultaneously.
But in present inventor during technical scheme is realized, at least find above-mentioned prior art
In the presence of following technical problem：
It is because when circuit board needs to connect from two circuit boards simultaneously, it is necessary to different at two of the circuit board
Connector is set on position, so that the size increase of the circuit board, is unfavorable for the development of electronics miniaturization.
The content of the invention
The application provides a kind of electronic equipment and circuit board connection method, and solve needs in a circuit board in the prior art
, it is necessary to set connector on two different positions of the circuit board when being connected from two circuit boards simultaneously so that the electricity
The size increase of road plate, it is unfavorable for the technical problem of the development of electronics miniaturization.
The application provides a kind of electronic equipment, and the electronic equipment includes first circuit board, second circuit board, tertiary circuit
Plate, the first anisotropic conductive film and the second anisotropic conductive film, the first circuit board include the first pin；Described second
Circuit board includes second pin；The tertiary circuit plate is arranged between the first circuit board and the second circuit board, institute
State tertiary circuit plate and be provided with the 3rd pin and the 4th corresponding with the 3rd Pin locations and opposite pin；Described first is different
Property conductive adhesive film in side's is arranged between first pin and the 3rd pin, for being electrically connected first pin and
Three pins；And second anisotropic conductive film is arranged between the second pin and the 4th pin, for electric
Connect the second pin and the 4th pin.
Preferably, the high temperature resistant temperature of first anisotropic conductive film and second anisotropic conductive film is not
Together.
Preferably, it is printed circuit board (PCB) or flexible PCB that the first circuit board is transparent, and the tertiary circuit plate is soft
Property circuit board, the high temperature resistant temperature of first anisotropic conductive film are more than second anisotropic conductive film.
Preferably, first anisotropic conductive film is made up of the exotic material of 140 degree -180 degree.
Preferably, second anisotropic conductive film is made up of the exotic material of 80 degree of -120 degree.
Preferably, the second circuit board is transparent printed circuit board (PCB) or flexible PCB, and the tertiary circuit plate is soft
Property circuit board, the high temperature resistant temperature of second anisotropic conductive film are more than first anisotropic conductive film.
Preferably, second anisotropic conductive film is made up of the exotic material of 140 degree -180 degree.
Preferably, first anisotropic conductive film is made up of the exotic material of 80 degree of -120 degree.
A kind of circuit board connection method, methods described include：
3rd pin of the first pin of first circuit board and tertiary circuit plate is oppositely arranged, by the of second circuit board
4th pin of two pins and tertiary circuit plate is oppositely arranged, and the 3rd pin is corresponding with the 4th Pin locations and opposite
It is arranged on the tertiary circuit plate；
First anisotropic conductive film is placed between first pin and the 3rd pin, described second
The second anisotropic conductive film is placed between pin and the 4th pin；
It is first circuit board described in hot pressing, first anisotropic conductive film, the tertiary circuit plate, described second different
Side's property conductive adhesive film and the second circuit board so that first pin is electrically connected with the 3rd pin, and described second
Pin is electrically connected with the 4th pin.
The application has the beneficial effect that：
Above-mentioned electronic equipment and circuit board connection method by the tertiary circuit plate set the 3rd pin and with institute
State the 4th corresponding and opposite pin of the 3rd Pin locations, and described the is electrically connected by first anisotropic conductive film
One pin and the 3rd pin, the second pin and the described 4th is electrically connected by second anisotropic conductive film and drawn
Pin, so as to avoid the 3rd pin and the 4th pin from needing to take different positions, solve in the prior art in an electricity
, it is necessary to set connector on two different positions of the circuit board road plate needs to connect from two circuit boards simultaneously when, make
The size increase of the circuit board is obtained, is unfavorable for the technical problem of the development of electronics miniaturization.
By being transparent printed circuit board (PCB) or flexible PCB by the first circuit board, the tertiary circuit plate is flexibility
Circuit board, enabling the side from first circuit board to tertiary circuit plate and second circuit board look up first pin,
Whether first anisotropic conductive film, the 3rd pin align, and the 4th pin, second anisotropic conductive adhesive paste
Whether film and the second pin align.
By being conductive more than second anisotropy by the high temperature resistant temperature setting of first anisotropic conductive film
Glued membrane so that when being heated from first circuit board to the direction of tertiary circuit plate and second circuit board, described first can be ensured
Anisotropic conductive film and the heating of the second anisotropic conductive film solidify binder, tend to remain on.
By being transparent printed circuit board (PCB) or flexible PCB by the second circuit board, the tertiary circuit plate is flexibility
Circuit board, enabling the side from second circuit board to tertiary circuit plate and first circuit board look up the second pin,
Whether second anisotropic conductive film and the 4th pin align, the 3rd pin, first anisotropic conductive film
Whether corresponded to first pin.
By being conductive more than first anisotropy by the high temperature resistant temperature setting of second anisotropic conductive film
Glued membrane so that when being heated from second circuit board to the direction of tertiary circuit plate and first circuit board, described first can be ensured
Anisotropic conductive film and the heating of the second anisotropic conductive film solidify binder, tend to remain on.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, embodiment will be described below
In the required accompanying drawing used be briefly described, it should be apparent that, drawings in the following description be only the present invention some
Embodiment.
Fig. 1 is the structural representation of the better embodiment electronic equipment of the application one；
Fig. 2 is the structural representation of another better embodiment electronic equipment of the application；
Fig. 3 is the flow chart of the another better embodiment circuit board connection method of the application.
Embodiment
The embodiment of the present application is solved in the prior art one by providing a kind of electronic equipment and circuit board connection method
Connected individual circuit board needs to connect from two circuit boards simultaneously when, it is necessary to be set on two different positions of the circuit board
Device so that the size increase of the circuit board, be unfavorable for the technical problem of the development of electronics miniaturization.
Technical scheme in the embodiment of the present application is in order to solve the above technical problems, general thought is as follows：
A kind of electronic equipment, the electronic equipment include first circuit board, second circuit board, tertiary circuit plate, first different
Side's property conductive adhesive film and the second anisotropic conductive film, the first circuit board include the first pin；The second circuit board bag
Include second pin；The tertiary circuit plate is arranged between the first circuit board and the second circuit board, the 3rd electricity
Road plate is provided with the 3rd pin and the 4th corresponding with the 3rd Pin locations and opposite pin；First anisotropy is conductive
Glued membrane is arranged between first pin and the 3rd pin, for being electrically connected first pin and the 3rd pin；
It is described for being electrically connected and second anisotropic conductive film is arranged between the second pin and the 4th pin
Second pin and the 4th pin.
A kind of circuit board connection method, methods described include：
3rd pin of the first pin of first circuit board and tertiary circuit plate is oppositely arranged, by the of second circuit board
4th pin of two pins and tertiary circuit plate is oppositely arranged, and the 3rd pin is corresponding with the 4th Pin locations and opposite
It is arranged on the tertiary circuit plate；
First anisotropic conductive film is placed between first pin and the 3rd pin, described second
The second anisotropic conductive film is placed between pin and the 4th pin；
It is first circuit board described in hot pressing, first anisotropic conductive film, the tertiary circuit plate, described second different
Side's property conductive adhesive film and the second circuit board so that first pin is electrically connected with the 3rd pin, and described second
Pin is electrically connected with the 4th pin.
In order to be better understood from above-mentioned technical proposal, below in conjunction with Figure of description and specific embodiment to upper
Technical scheme is stated to be described in detail.
Embodiment one
As shown in figure 1, the structural representation for the better embodiment electronic equipment 100 of the application one.The electronic equipment
100 can be any equipment including circuit board such as computer, mobile phone, TV, refrigerator, air-conditioning, server.The electronic equipment
100 include first circuit board 10, second circuit board 20, tertiary circuit plate 30, the first anisotropic conductive film 40 and the second different side
Property conductive adhesive film 50.
The first circuit board 10 includes the first pin 11.
The second circuit board 20 includes second pin 22.
The tertiary circuit plate 30 is arranged between the first circuit board 10 and the second circuit board 20, and the described 3rd
Circuit board 30 be provided with the 3rd pin 33 and with the position correspondence of the 3rd pin 33 and the 4th opposite pin 34.
Specifically, first pin 11, second pin 22, the 3rd pin 33 and the 4th pin 34 can be copper-plated draw
Pin, or gold-plated pin, can also be the pin aluminized.
First anisotropic conductive film 40 is arranged between first pin 11 and the 3rd pin 33, is used for
It is electrically connected the pin 33 of the first pin 11 and the 3rd.
Second anisotropic conductive film 50 is arranged between the second pin 22 and the 4th pin 34, is used for
It is electrically connected the second pin 22 and the 4th pin 34.
Anisotropic conductive film, English full name are Anisotropic Conductive Film, abbreviation ACF.Anisotropy is led
The characteristics of electric glue, is：Z axis electrically conducting direction and the resistance characteristic of XY insulating planars have obvious otherness.When Z axis is led
After energization resistance and the difference of X/Y plane insulating resistance value exceed certain ratio, good conductive anisotropy both can be described as.Different side
The conducting principle of property conducting resinl is：Electrode between the device for needing to be electrically connected using conducting particles connection, which makes, leads
It is logical, while and can avoids turning on short circuit between adjacent two electrode, and reach only in the purpose of Z-direction conducting.
Above-mentioned electronic equipment 100 is electrically connected first pin 11 and by first anisotropic conductive film 40
Three pins 33, to enable the first circuit board 10 and the tertiary circuit plate 30 to carry out data transmission；Pass through described
Two anisotropic conductive films 50 be electrically connected the second pin 22 and with the position correspondence of the 3rd pin 33 and opposite institute
The 4th pin 34 is stated, to enable the second circuit board 20 and the tertiary circuit plate 30 to carry out data transmission.
Above-mentioned electronic equipment 100 by the tertiary circuit plate 30 set the 3rd pin 33 and with the 3rd pin
33 position correspondences and the 4th opposite pin 34, and be electrically connected described first by first anisotropic conductive film 40 and draw
The pin 33 of pin 11 and the 3rd, the second pin 22 and the described 4th are electrically connected by second anisotropic conductive film 50
Pin 34, so as to avoid the 3rd pin 33 and the 4th pin 34 from needing to take different positions, solve in the prior art
When circuit board needs to connect from two circuit boards simultaneously, it is necessary to the company of setting on two different positions in the circuit board
Connect device so that the size increase of the circuit board, be unfavorable for the technical problem of the development of electronics miniaturization.
The pin 33 of the first pin 11 and the 3rd is being electrically connected using first anisotropic conductive film 40, it is described
When second anisotropic conductive film 50 is electrically connected the second pin 22 and four pin 34, it usually needs carry out heat
Pressure so that the conducting particles dielectric film rupture in the anisotropic conductive film, and mutually in the portion extrusion for having circuit one
Rise, form conducting, heating solidifies binder, tended to remain on.
Existing heating and pressurization are generally carried out from same direction, such as from first circuit board 11 to tertiary circuit plate 30 and the
The direction of two circuit boards 20 pushes and heated, or from second circuit board 20 to the side of tertiary circuit plate 30 and first circuit board 11
Pressure and heating upwards, it is therefore desirable to which first anisotropic conductive film 40 and second anisotropic conductive film 50 is resistance to
High-temperature temperature is different.In other embodiments, can be by described in if heating is using different directions while heated
First anisotropic conductive film 40 is identical with the high temperature resistant temperature of second anisotropic conductive film 50.
Specifically, compression aspect how is selected to turn into key issue.Select below compression aspect Main Basiss：Selection is easy to
Observe whether first pin 11, first anisotropic conductive film 40, the 3rd pin 33 align, and the 4th draws
The direction whether pin 34, second anisotropic conductive film 50 and the second pin 22 align is compression aspect.Therefore, when
When the compression aspect is from first circuit board 11 to the direction of tertiary circuit plate 30 and second circuit board 20, first circuit
Plate 10 is transparent printed circuit board (PCB) or flexible PCB, and the tertiary circuit plate 30 is flexible PCB.The second circuit board
20 can be flexible PCB, or printed circuit board (PCB).By being transparent printed circuit board (PCB) by the first circuit board 10
Or flexible PCB, the tertiary circuit plate 30 are flexible PCB, enabling from first circuit board 11 to tertiary circuit plate
30 and the side of second circuit board 20 look up first pin 11, first anisotropic conductive film 40, the described 3rd
Whether pin 33 aligns, and whether the 4th pin 34, second anisotropic conductive film 50 and the second pin 22 are right
Together.
Specifically, also it is from first circuit board 11 to tertiary circuit plate 30 and second circuit board 20 in the heating direction
During direction, the high temperature resistant temperature of first anisotropic conductive film 40 is more than second anisotropic conductive film 50.Pass through
It is more than second anisotropic conductive film 50 by the high temperature resistant temperature setting of first anisotropic conductive film 40 so that
When being heated from first circuit board 11 to the direction of tertiary circuit plate 30 and second circuit board 20, the described first different side can be ensured
Property the heating of conductive adhesive film 40 and second anisotropic conductive film 50 solidify binder, tend to remain on.
Specifically, in the present embodiment, first anisotropic conductive film 40 by 140 degree -180 degree high temperature resistant material
Material is made, and second anisotropic conductive film 50 is made up of the exotic material of 80 degree of -120 degree.
In other embodiments, when the compression aspect is from second circuit board 20 to the electricity of tertiary circuit plate 30 and first
During the direction of road plate 11, the second circuit board 20 is transparent printed circuit board (PCB) or flexible PCB, the tertiary circuit plate 30
For flexible PCB.The first circuit board 10 can be flexible PCB, or printed circuit board (PCB).By by described
Two circuit boards 20 are transparent printed circuit board (PCB) or flexible PCB, and the tertiary circuit plate 30 is flexible PCB, enabling
Side from second circuit board 20 to tertiary circuit plate 30 and first circuit board 11 looks up the second pin 22, described second
Whether the pin 34 of anisotropic conductive film 50 and the 4th aligns, the 3rd pin 33, first anisotropic conductive film 40
Whether corresponded to first pin 11.
Specifically, also it is from second circuit board 20 to tertiary circuit plate 30 and first circuit board 11 in the heating direction
During direction, the high temperature resistant temperature of second anisotropic conductive film 50 is more than first anisotropic conductive film 40.Pass through
It is more than first anisotropic conductive film 40 by the high temperature resistant temperature setting of second anisotropic conductive film 50 so that
When being heated from second circuit board 20 to the direction of tertiary circuit plate 30 and first circuit board 11, the described first different side can be ensured
Property the heating of conductive adhesive film 40 and second anisotropic conductive film 50 solidify binder, tend to remain on.
Specifically, in the present embodiment, second anisotropic conductive film 50 by 140 degree -180 degree high temperature resistant material
Material is made, and first anisotropic conductive film 40 is made up of the exotic material of 80 degree of -120 degree.
Above-mentioned electronic equipment 100 by the tertiary circuit plate 30 set the 3rd pin 33 and with the 3rd pin
33 position correspondences and the 4th opposite pin 34, and be electrically connected described first by first anisotropic conductive film 40 and draw
The pin 33 of pin 11 and the 3rd, the second pin 22 and the described 4th are electrically connected by second anisotropic conductive film 50
Pin 34, so as to avoid the 3rd pin 33 and the 4th pin 34 from needing to take different positions, solve in the prior art
When circuit board needs to connect from two circuit boards simultaneously, it is necessary to the company of setting on two different positions in the circuit board
Connect device so that the size increase of the circuit board, be unfavorable for the technical problem of the development of electronics miniaturization.
By being transparent printed circuit board (PCB) or flexible PCB by the first circuit board 10, the tertiary circuit plate 30 is
Flexible PCB, enabling the side from first circuit board 11 to tertiary circuit plate 30 and second circuit board 20 looks up described
Whether the first pin 11, first anisotropic conductive film 40, the 3rd pin 33 align, and the 4th pin 34, institute
State the second anisotropic conductive film 50 and whether the second pin 22 aligns.
By being to be led more than second anisotropy by the high temperature resistant temperature setting of first anisotropic conductive film 40
Electric glued membrane 50 so that when being heated from first circuit board 11 to the direction of tertiary circuit plate 30 and second circuit board 20, Neng Goubao
Demonstrate,proving the anisotropic conductive film 50 of the first anisotropic conductive film 40 and second heating solidifies binder, is held on shape
State.
By being transparent printed circuit board (PCB) or flexible PCB by the second circuit board 20, the tertiary circuit plate 30 is
Flexible PCB, enabling the side from second circuit board 20 to tertiary circuit plate 30 and first circuit board 11 looks up described
Whether second pin 22, the pin 34 of second anisotropic conductive film 50 and the 4th align, the 3rd pin 33, described
Whether one anisotropic conductive film 40 and first pin 11 correspond to.
By being to be led more than first anisotropy by the high temperature resistant temperature setting of second anisotropic conductive film 50
Electric glued membrane 40 so that when being heated from second circuit board 20 to the direction of tertiary circuit plate 30 and first circuit board 11, Neng Goubao
Demonstrate,proving the anisotropic conductive film 50 of the first anisotropic conductive film 40 and second heating solidifies binder, is held on shape
State.
Embodiment two
As shown in Fig. 2 the structural representation for another better embodiment electronic equipment 200 of the application；Electronic equipment 200
With differing only in for electronic equipment 100：The length of the anisotropic conductive film 50 of first anisotropic conductive film 40 and second
Degree is different, and the first circuit board 10 is different from the relative position of the tertiary circuit plate 30, the second circuit board 20 and institute
The relative position for stating tertiary circuit plate 30 is different.
Specifically, in the present embodiment, the anisotropic conductive film 50 of the first anisotropic conductive film 40 and second
Length be more than embodiment one in the anisotropic conductive film 50 of first anisotropic conductive film 40 and second length, because
The length increase of the anisotropic conductive film 50 of first anisotropic conductive film 40 and second so that the first circuit board
10th, the relative position between the second circuit board 20 and the tertiary circuit plate 30 can carry out equipment as needed, such as
The first circuit board 10, the second circuit board 20 and the 3rd electricity are carried out according to the space in the electronic equipment 200
Put the position of road plate 30.
Embodiment three
As shown in figure 3, the flow chart for the another better embodiment circuit board connection method of the application.The circuit board connects
The method of connecing comprises the following steps：
Step 310, the 3rd pin of the first pin of first circuit board and tertiary circuit plate is oppositely arranged, by the second electricity
The second pin of road plate and the 4th pin of tertiary circuit plate are oppositely arranged, the 3rd pin and the 4th Pin locations pair
Should and mutually privately it be arranged on the tertiary circuit plate；
Step 320, first anisotropic conductive film is placed between first pin and the 3rd pin,
The second anisotropic conductive film is placed between the second pin and the 4th pin；
Step 330, first circuit board, first anisotropic conductive film, the tertiary circuit plate, institute described in hot pressing
State the second anisotropic conductive film and the second circuit board so that first pin is electrically connected with the 3rd pin,
The second pin is electrically connected with the 4th pin.
It is first circuit board described in hot pressing, first anisotropic conductive film, the tertiary circuit plate, described second different
When side's property conductive adhesive film and the second circuit board, if the first circuit board, first anisotropic conductive film, described
Institute in relative position relation such as Fig. 1 between tertiary circuit plate, second anisotropic conductive film and the second circuit board
Show identical, then, can disposably press first pin 11, first anisotropic conductive film, the 3rd pin, institute
State the 4th pin, second anisotropic conductive film and the second pin so that first pin and the described 3rd draws
Pin can be electrically connected, and the 4th pin can be electrically connected with the second pin.
In the first circuit board, first anisotropic conductive film, the tertiary circuit plate, described second different
Relative position relation between side's property conductive adhesive film and the second circuit board is identical as shown in Figure 2, then, can be right in three times
The first circuit board, first anisotropic conductive film, the tertiary circuit plate, second anisotropic conductive film and
The second circuit board is pressed, i.e., first pin and first anisotropic conductive film is pressed, to institute
State the 3rd pin, first anisotropic conductive film is pressed and the 4th pin is pressed, and to described second
Pin and second anisotropic conductive film are pressed.
The connection method of foregoing circuit plate on the tertiary circuit plate 30 by setting the 3rd pin 33 and with the described 3rd
The position correspondence of pin 33 and the 4th opposite pin 34, and it is electrically connected described the by first anisotropic conductive film 40
One pin 11 and the 3rd pin 33, the second pin 22 and described is electrically connected by second anisotropic conductive film 50
4th pin 34, so as to avoid the 3rd pin 33 and the 4th pin 34 from needing to take different positions, solves existing skill
When circuit board needs to connect from two circuit boards simultaneously, it is necessary to be set on two different positions in the circuit board in art
Put connector so that the size increase of the circuit board, be unfavorable for the technical problem of the development of electronics miniaturization.
Although preferred embodiments of the present invention have been described, but those skilled in the art once know basic creation
Property concept, then can make other change and modification to these embodiments.So appended claims be intended to be construed to include it is excellent
Select embodiment and fall into having altered and changing for the scope of the invention.
Obviously, those skilled in the art can carry out the essence of various changes and modification without departing from the present invention to the present invention
God and scope.So, if these modifications and variations of the present invention belong to the scope of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to comprising including these changes and modification.
Claims (6)
1. a kind of electronic equipment, the electronic equipment includes：
First circuit board, including the first pin；
Second circuit board, including second pin；
Tertiary circuit plate, it is arranged between the first circuit board and the second circuit board, the tertiary circuit plate is provided with
3rd pin and the 4th corresponding with the 3rd Pin locations and opposite pin；
First anisotropic conductive film, it is arranged between first pin and the 3rd pin, it is described for being electrically connected
First pin and the 3rd pin；With
Second anisotropic conductive film, it is arranged between the second pin and the 4th pin, it is described for being electrically connected
Second pin and the 4th pin；The high temperature resistant of first anisotropic conductive film and second anisotropic conductive film
Temperature is different.
2. electronic equipment as claimed in claim 1, it is characterised in that the first circuit board is transparent printed circuit board (PCB) or soft
Property circuit board, the tertiary circuit plate is flexible PCB, and the high temperature resistant temperature of first anisotropic conductive film is more than institute
State the second anisotropic conductive film.
3. electronic equipment as claimed in claim 2, it is characterised in that first anisotropic conductive film is by 140 degree -180
The exotic material of degree is made.
4. electronic equipment as claimed in claim 2, it is characterised in that second anisotropic conductive film is by 80 degree of -120 degree
Exotic material be made.
5. the electronic equipment as described in claim any one of 2-4, it is characterised in that the second circuit board is transparent printing electricity
Road plate or flexible PCB.
6. a kind of circuit board connection method, methods described include：
3rd pin of the first pin of first circuit board and tertiary circuit plate is oppositely arranged, the second of second circuit board is drawn
4th pin of pin and tertiary circuit plate is oppositely arranged, and the 3rd pin is corresponding with the 4th Pin locations and is disposed opposite to each other
In on the tertiary circuit plate；
The first anisotropic conductive film is placed between first pin and the 3rd pin, in the second pin and institute
State and place the second anisotropic conductive film between the 4th pin；
First circuit board, first anisotropic conductive film, the tertiary circuit plate, second anisotropy described in hot pressing
Conductive adhesive film and the second circuit board so that first pin is electrically connected with the 3rd pin, the second pin
It is electrically connected with the 4th pin；The high temperature resistant of first anisotropic conductive film and second anisotropic conductive film
Temperature is different.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410056895.0A CN104852172B (en) | 2014-02-19 | 2014-02-19 | A kind of electronic equipment and circuit board connection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410056895.0A CN104852172B (en) | 2014-02-19 | 2014-02-19 | A kind of electronic equipment and circuit board connection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104852172A CN104852172A (en) | 2015-08-19 |
| CN104852172B true CN104852172B (en) | 2017-12-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410056895.0A Active CN104852172B (en) | 2014-02-19 | 2014-02-19 | A kind of electronic equipment and circuit board connection method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104852172B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106909005A (en) * | 2017-04-18 | 2017-06-30 | 武汉华星光电技术有限公司 | Reduce the method and narrow frame liquid crystal display device in outer pin pressing region |
| CN109152208B (en) * | 2018-08-28 | 2024-04-12 | 福建华佳彩有限公司 | Flexible circuit board structure, display screen and electronic equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5574382A (en) * | 1991-09-17 | 1996-11-12 | Japan Synthetic Rubber Co., Ltd. | Inspection electrode unit for printed wiring board |
| US6297652B1 (en) * | 1999-02-24 | 2001-10-02 | Jsr Corporation | Electric resistance measuring apparatus and method for circuit board |
| CN101455131A (en) * | 2006-05-22 | 2009-06-10 | 日本电气株式会社 | Circuit board device, wiring board connecting method, and circuit board module device |
| CN102648667A (en) * | 2009-09-15 | 2012-08-22 | R&D电路股份有限公司 | Embedded components in interposer boards for improved power gain and loss in interconnect configurations |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4555362B2 (en) * | 2008-06-02 | 2010-09-29 | 株式会社アドバンテスト | Probe, electronic component testing apparatus, and probe manufacturing method |
-
2014
- 2014-02-19 CN CN201410056895.0A patent/CN104852172B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5574382A (en) * | 1991-09-17 | 1996-11-12 | Japan Synthetic Rubber Co., Ltd. | Inspection electrode unit for printed wiring board |
| US6297652B1 (en) * | 1999-02-24 | 2001-10-02 | Jsr Corporation | Electric resistance measuring apparatus and method for circuit board |
| CN101455131A (en) * | 2006-05-22 | 2009-06-10 | 日本电气株式会社 | Circuit board device, wiring board connecting method, and circuit board module device |
| CN102648667A (en) * | 2009-09-15 | 2012-08-22 | R&D电路股份有限公司 | Embedded components in interposer boards for improved power gain and loss in interconnect configurations |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104852172A (en) | 2015-08-19 |
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