CN104837297B - A kind of circuit board and electronic equipment - Google Patents
A kind of circuit board and electronic equipment Download PDFInfo
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- CN104837297B CN104837297B CN201510278868.2A CN201510278868A CN104837297B CN 104837297 B CN104837297 B CN 104837297B CN 201510278868 A CN201510278868 A CN 201510278868A CN 104837297 B CN104837297 B CN 104837297B
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- 239000002184 metal Substances 0.000 claims description 6
- 238000013461 design Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
技术领域technical field
本发明涉及电路板技术领域，特别是指一种电路板及电子设备。The invention relates to the technical field of circuit boards, in particular to a circuit board and electronic equipment.
背景技术Background technique
目前，电子设备PCB板(印刷电路板)上电子器件固定方式为SMT(表面组装)贴片或自带弹片与PCB板上馈点接触，以实现对器件的工作控制。At present, the electronic devices on the PCB board (printed circuit board) of electronic equipment are fixed by SMT (surface mount) patch or self-contained shrapnel in contact with the feed point on the PCB board, so as to realize the working control of the device.
但是，此种PCB板电子器件固定方式，Z向最小总高度为各器件Z向高度之和加上SMT浮锡高度。当器件Z向高度不能减小时，组装出的电子设备Z向总厚度也不能减小。因此，无法满足极致超薄机身设计。However, in this way of fixing electronic devices on the PCB, the minimum total height in the Z direction is the sum of the heights in the Z direction of each device plus the height of the SMT floating tin. When the height of the device in the Z direction cannot be reduced, the total thickness of the assembled electronic device in the Z direction cannot be reduced either. Therefore, the ultimate ultra-thin body design cannot be satisfied.
发明内容Contents of the invention
本发明要解决的技术问题是提供一种电路板及电子设备，解决现有技术中电子设备Z向总厚度无法满足极致超薄机身设计的问题。The technical problem to be solved by the present invention is to provide a circuit board and electronic equipment to solve the problem in the prior art that the total thickness of the electronic equipment in the Z direction cannot meet the design of the ultra-thin body.
为了解决上述技术问题，本发明实施例提供一种电路板，应用于电子设备，包括：In order to solve the above technical problems, an embodiment of the present invention provides a circuit board applied to electronic equipment, including:
印刷电路板和设置于所述印刷电路板上的电子器件；A printed circuit board and electronic devices disposed on said printed circuit board;
其中，所述印刷电路板上设有预设深度的开槽，所述电子器件的至少一部分置于所述开槽内。Wherein, a slot with a preset depth is provided on the printed circuit board, and at least a part of the electronic device is placed in the slot.
本发明还提供了一种电子设备，包括：上述的电路板。The present invention also provides an electronic device, comprising: the above-mentioned circuit board.
本发明的上述技术方案的有益效果如下：The beneficial effects of above-mentioned technical scheme of the present invention are as follows:
上述方案中，所述电路板通过将电子器件设置在印刷电路板的开槽中，减少了Z向的总厚度，进而使得采用该电路板的电子设备在Z向上的总厚度能够满足极致超薄机身设计。In the above solution, the circuit board reduces the total thickness in the Z direction by placing the electronic devices in the slots of the printed circuit board, so that the total thickness in the Z direction of the electronic equipment using the circuit board can meet the requirements of extreme ultra-thin fuselage design.
附图说明Description of drawings
图1为本发明实施例一中印刷电路板与电子器件配合示意图；Fig. 1 is a schematic diagram of cooperation between a printed circuit board and an electronic device in Embodiment 1 of the present invention;
图2为本发明实施例二中电路板俯视示意图；2 is a schematic top view of the circuit board in Embodiment 2 of the present invention;
图3为图2沿A-A方向的剖面示意图；Fig. 3 is a schematic cross-sectional view along the A-A direction of Fig. 2;
图4为本发明实施例二中电路板正视示意图；4 is a schematic front view of the circuit board in Embodiment 2 of the present invention;
图5为本发明实施例三中印刷电路板、电子器件以及可导电支架配合示意图；Fig. 5 is a schematic diagram of the cooperation of a printed circuit board, an electronic device, and a conductive support in Embodiment 3 of the present invention;
图6为本发明实施例三中可导电支架结构示意图；FIG. 6 is a schematic structural diagram of a conductive support in Embodiment 3 of the present invention;
图7为本发明实施例四中可导电支架结构示意图；7 is a schematic structural diagram of a conductive support in Embodiment 4 of the present invention;
图8为本发明实施例四中电路板仰视示意图；8 is a schematic bottom view of the circuit board in Embodiment 4 of the present invention;
图9为本发明实施例五中可导电支架结构示意图；FIG. 9 is a schematic structural diagram of a conductive support in Embodiment 5 of the present invention;
图10为本发明实施例六中电路板俯视示意图；10 is a schematic top view of the circuit board in Embodiment 6 of the present invention;
图11为图10沿B-B方向的剖面示意图；Figure 11 is a schematic cross-sectional view along the B-B direction of Figure 10;
图12为本发明实施例七中电路板俯视示意图；12 is a schematic top view of the circuit board in Embodiment 7 of the present invention;
图13为图12沿C-C方向的剖面示意图；Figure 13 is a schematic cross-sectional view of Figure 12 along the C-C direction;
图14为本发明实施例八中印刷电路板与电子器件配合示意图；Fig. 14 is a schematic diagram of cooperation between a printed circuit board and an electronic device in Embodiment 8 of the present invention;
图15为本发明实施例八中发声结构与发声通孔配合示意图。Fig. 15 is a schematic diagram of cooperation between the sounding structure and the sounding through hole in the eighth embodiment of the present invention.
具体实施方式Detailed ways
为使本发明要解决的技术问题、技术方案和优点更加清楚，下面将结合附图及具体实施例进行详细描述。In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.
本发明针对现有的技术中电子设备Z向总厚度无法满足极致超薄机身设计的问题，提供一种电路板，应用于电子设备，包括：Aiming at the problem that the total thickness of electronic equipment in the Z direction cannot satisfy the design of the ultra-thin body in the existing technology, the present invention provides a circuit board, which is applied to electronic equipment, including:
印刷电路板和设置于所述印刷电路板上的电子器件；A printed circuit board and electronic devices disposed on said printed circuit board;
其中，所述印刷电路板上设有预设深度的开槽，所述电子器件的至少一部分置于所述开槽内。Wherein, a slot with a preset depth is provided on the printed circuit board, and at least a part of the electronic device is placed in the slot.
本发明实施例提供的所述电路板通过将电子器件设置在印刷电路板的开槽中，减少了Z向的总厚度，进而使得采用该电路板的电子设备在Z向上的总厚度能够满足极致超薄机身设计。The circuit board provided by the embodiment of the present invention reduces the total thickness in the Z direction by arranging electronic devices in the slots of the printed circuit board, so that the total thickness of the electronic device using the circuit board in the Z direction can meet the ultimate Ultra-thin body design.
实施例一Embodiment one
实施例一所提供的电路板的结构示意图如图1所示，其包括印刷电路板1和设置于所述印刷电路板1上的电子器件2；其中，所述印刷电路板1上设有预设深度的开槽3。该实施例一中，所述开槽3在所述印刷电路板1的第一表面4和与所述第一表面4相对的第二表面7上形成为贯穿的通孔，所述电子器件2的第一部分5设置在所述开槽3内，第二部分6突出于所述印刷电路板1的第一表面。The structural diagram of the circuit board provided by Embodiment 1 is shown in Figure 1, which includes a printed circuit board 1 and electronic devices 2 arranged on the printed circuit board 1; wherein, the printed circuit board 1 is provided with preset Set the depth of the groove 3. In the first embodiment, the slot 3 is formed as a through hole on the first surface 4 of the printed circuit board 1 and the second surface 7 opposite to the first surface 4, and the electronic device 2 The first part 5 is disposed in the slot 3 , and the second part 6 protrudes from the first surface of the printed circuit board 1 .
其中，电子器件2可以只包括第一部分5和第二部分6，也可以还包括第三部分8；进一步的，如图1所示，所述电子器件的第三部分8突出于所述印刷电路板的第二表面7。Wherein, the electronic device 2 may only include the first part 5 and the second part 6, and may also include a third part 8; further, as shown in FIG. 1, the third part 8 of the electronic device protrudes from the printed circuit The second surface 7 of the plate.
实施例二Embodiment two
为了实现通信的功能，如图1至图4所示，实施例二在实施例一的结构基础之上，所述电子器件2通过所述开槽3露出的第一侧面9上设置有可导电连接部10，所述电路板还包括可导电支架11，所述可导电支架11包括与所述可导电连接部10电连接的第一结构12和与所述印刷电路板1电连接的第二结构13。In order to realize the function of communication, as shown in Fig. 1 to Fig. 4, the second embodiment is based on the structure of the first embodiment, the first side 9 of the electronic device 2 exposed through the slot 3 is provided with a conductive The connecting part 10, the circuit board also includes a conductive support 11, and the conductive support 11 includes a first structure 12 electrically connected to the conductive connecting part 10 and a second structure 12 electrically connected to the printed circuit board 1 structure13.
其中，所述可导电支架的材质优选为金属，但不限于金属，导电性能良好，有一定结构强度的材质即可；所述可导电连接部与所述第一结构可为接触相连，也可为焊接相连。Wherein, the material of the conductive bracket is preferably metal, but not limited to metal, a material with good electrical conductivity and a certain structural strength is sufficient; the conductive connection part and the first structure may be connected by contact or Connected for welding.
需要说明的是，所述电子器件的外表面采用绝缘材质，但是所述可导电连接部穿透所述电子器件的外表面，进而与所述电子器件的内部电连接，来实现信息的传输。It should be noted that the outer surface of the electronic device is made of insulating material, but the conductive connection part penetrates the outer surface of the electronic device and is further electrically connected with the interior of the electronic device to realize information transmission.
实施例三Embodiment Three
具体的，如图4和图5所示，实施例三在实施例二的结构基础之上，所述第一结构12形成为平板状，与所述第一侧面9相对设置；所述第二结构13包括设置在所述第一结构12相对两侧边缘的第一支板14和第二支板15，所述第一支板14和所述第二支板15分别与所述第一结构12成预设角度，远离所述第一结构12的顶端边缘固定于所述印刷电路板1上，且与所述印刷电路板1电连接。所述预设角度可选为90度。Specifically, as shown in Fig. 4 and Fig. 5, the third embodiment is based on the structure of the second embodiment, the first structure 12 is formed in a flat plate shape, and is arranged opposite to the first side 9; the second The structure 13 includes a first support plate 14 and a second support plate 15 arranged on opposite side edges of the first structure 12, and the first support plate 14 and the second support plate 15 are respectively connected to the first structure. 12 is at a preset angle, and the top edge away from the first structure 12 is fixed on the printed circuit board 1 and is electrically connected to the printed circuit board 1 . The preset angle may be 90 degrees.
其中，如图6所示，所述第一结构12包括依次相连构成封闭图案的第一侧边缘、第二侧边缘、第三侧边缘和第四侧边缘，所述第一支板14与第一侧边缘相连，所述第二支板15与第三侧边缘相连；所述第二结构13还可以包括第三支板16和第四支板17，所述第三支板16与第二侧边缘相连，所述第四支板17与第四侧边缘相连，且第一支板14、第三支板16、第二支板15和第四支板17依次固定相连；如图4和图6所示，所述可导电支架11由所述第一结构12和第二结构13形成为一具有容置空间和豁口的半封闭结构，所述电子器件2置于所述容置空间内。所述电子器件2的形状尺寸与所述开槽的形状尺寸以及容置空间的形状尺寸相适应。Wherein, as shown in FIG. 6 , the first structure 12 includes a first side edge, a second side edge, a third side edge and a fourth side edge that are sequentially connected to form a closed pattern, and the first supporting plate 14 and the second One side edge is connected, and the second support plate 15 is connected to the third side edge; the second structure 13 may also include a third support plate 16 and a fourth support plate 17, and the third support plate 16 is connected to the second support plate 15. The side edges are connected, and the fourth support plate 17 is connected to the fourth side edge, and the first support plate 14, the third support plate 16, the second support plate 15 and the fourth support plate 17 are fixedly connected in sequence; as shown in Figure 4 and As shown in FIG. 6, the conductive bracket 11 is formed by the first structure 12 and the second structure 13 into a semi-closed structure with an accommodation space and a gap, and the electronic device 2 is placed in the accommodation space . The shape and size of the electronic device 2 are adapted to the shape and size of the slot and the shape and size of the accommodating space.
实施例四Embodiment four
更为具体的，如图7和图8所示，实施例四在实施例三的结构基础之上，所述第一支板14和所述第二支板15分别远离所述第一结构12的顶端边缘形成为弯折的插脚18，所述印刷电路板1上设有插脚孔19，所述插脚18与所述插脚孔19插接相连(再与所述印刷电路板焊接相连)。所述插脚的弯折角度可选为90度。More specifically, as shown in FIG. 7 and FIG. 8 , the fourth embodiment is based on the structure of the third embodiment, and the first support plate 14 and the second support plate 15 are respectively far away from the first structure 12 The top edge of the top end is formed as a bent pin 18, and the printed circuit board 1 is provided with a pin hole 19, and the pin 18 is plugged and connected to the pin hole 19 (and then connected to the printed circuit board by welding). The bending angle of the pins can be selected as 90 degrees.
实施例五Embodiment five
更为具体的，如图5和图9所示，实施例五在实施例三的结构基础之上，所述第一支板14和所述第二支板15分别远离所述第一结构12的顶端边缘形成为板状支脚结构20，所述板状支脚结构20与所述印刷电路板1的表面固定相连，可采用贴片焊接相连的方式。More specifically, as shown in FIG. 5 and FIG. 9 , the fifth embodiment is based on the structure of the third embodiment, and the first support plate 14 and the second support plate 15 are respectively far away from the first structure 12 The top edge of the printed circuit board 1 is formed as a plate-shaped leg structure 20, and the plate-shaped leg structure 20 is fixedly connected with the surface of the printed circuit board 1, and can be connected by patch welding.
实施例六Embodiment six
进一步的，为了实现缓冲以及定位的目的，如图10和图11所示，实施例六在实施例一的结构基础之上，所述电子器件还包括：与所述第一侧面9相对的第二侧面21，所述第二侧面21上设有弹性结构件22，所述弹性结构件22与所述电子设备上的绝缘器件23固定相连。Further, in order to achieve the purpose of buffering and positioning, as shown in Figure 10 and Figure 11, Embodiment 6 is based on the structure of Embodiment 1, and the electronic device further includes: a first side opposite to the first side 9 Two sides 21, the second side 21 is provided with an elastic structural member 22, and the elastic structural member 22 is fixedly connected with the insulating device 23 on the electronic device.
具体的，所述弹性结构件22与所述绝缘器件23可挤压接触相连。所述弹性结构件的材质可为泡棉等绝缘材质，也可为导电材质，富有弹性即可。Specifically, the elastic structural member 22 is connected to the insulating device 23 in compressible contact. The material of the elastic structural member can be an insulating material such as foam, or a conductive material, as long as it is elastic.
考虑到应用市场的实际发展情况，本发明的实施例中，所述可导电连接部优先选择为金属弹片或金属馈点。Considering the actual development of the application market, in the embodiment of the present invention, the conductive connection part is preferably selected as a metal shrapnel or a metal feed point.
实施例七Embodiment seven
更进一步的，对应于电声类电子器件，如图12和图13所示，实施例七在实施例一的结构基础之上，所述第二侧面21上还设有发声结构24，所述绝缘器件23上设有发声通孔25，所述发声结构24与所述发声通孔25相对设置。所述发声通孔的大小、形状、方向以及位置不作限定，与所述发声结构的大小、形状、方向以及位置相适应即可。Furthermore, corresponding to electro-acoustic electronic devices, as shown in Figure 12 and Figure 13, Embodiment 7 is based on the structure of Embodiment 1, and the second side 21 is also provided with a sound-emitting structure 24. The insulating device 23 is provided with a sounding through hole 25 , and the sounding structure 24 is arranged opposite to the sounding through hole 25 . The size, shape, direction, and position of the sound-emitting through hole are not limited, and it only needs to be adapted to the size, shape, direction, and position of the sound-emitting structure.
上述实施例一、实施例二、实施例三、实施例四/实施例五、实施例六以及实施例七可任意组合构成实际使用所需结构，在此对上述实施例的组合形式不作限定。Embodiment 1, Embodiment 2, Embodiment 3, Embodiment 4/Embodiment 5, Embodiment 6 and Embodiment 7 can be arbitrarily combined to form the structure required for actual use, and the combination forms of the above embodiments are not limited here.
实施例八Embodiment Eight
实施例八所提供的电路板的结构示意图如图14所示，其包括印刷电路板1和设置于所述印刷电路板1上的电子器件2；其中，所述印刷电路板1上设有预设深度的开槽3。该实施例二中，所述开槽3在所述印刷电路板1的第一表面4形成为盲孔，所述电子器件2的第一部分5设置在所述开槽3内，第二部分6突出于所述第一表面4。The structure diagram of the circuit board provided by the eighth embodiment is shown in Figure 14, which includes a printed circuit board 1 and electronic devices 2 arranged on the printed circuit board 1; wherein, the printed circuit board 1 is provided with preset Set the depth of the groove 3. In the second embodiment, the slot 3 is formed as a blind hole on the first surface 4 of the printed circuit board 1, the first part 5 of the electronic device 2 is arranged in the slot 3, and the second part 6 protruding from the first surface 4.
实施例一至实施例七的部分所述实现实施例均可适用于该实施例八中，也能达到相同的技术效果。Part of the implementation embodiments described in Embodiment 1 to Embodiment 7 can all be applied to this Embodiment 8, and can also achieve the same technical effect.
除了，如图14所示，所述电子器件上的弹性结构件22(设置于与所述第一侧面9相对的第二侧面21上)在该实施例八中是与所述印刷电路板1固定相连，与实施例六不同；如图15所示，在所述第二侧面21上设置有发声结构24时，所述印刷电路板1上设有发声通孔25，所述发声结构24与所述发声通孔25相对设置，与实施例七不同。Except, as shown in FIG. 14 , the elastic structural member 22 on the electronic device (disposed on the second side 21 opposite to the first side 9 ) is connected with the printed circuit board 1 in the eighth embodiment. Fixedly connected, different from Embodiment 6; as shown in Figure 15, when the sounding structure 24 is provided on the second side 21, the printed circuit board 1 is provided with a sounding through hole 25, and the sounding structure 24 is connected to the The sound-emitting through holes 25 are oppositely arranged, which is different from the seventh embodiment.
由于实施例一至实施例七中导电支架的结构形式以及设置方式等其他实现实施例均可等同地应用于该实施例八的电路板结构中，所以在此不再赘述。Since other implementation embodiments such as the structural forms and arrangement methods of the conductive support in Embodiment 1 to Embodiment 7 can be equally applied to the circuit board structure of Embodiment 8, details are not repeated here.
综上可知，本发明实施例采用一种PCB板开槽的电子器件固定方式，可以将Z向尺寸较高的电子器件沉入PCB板开槽中，进而减小PCB板组合件Z向总厚度，从而实现机身极致超薄设计。In summary, the embodiment of the present invention adopts a PCB board slotted electronic device fixing method, which can sink electronic devices with a higher Z-direction size into the PCB board slot, thereby reducing the total Z-direction thickness of the PCB board assembly , so as to realize the ultra-thin design of the fuselage.
本发明实施例还提供了一种电子设备，包括：上述的电路板。An embodiment of the present invention also provides an electronic device, including: the above-mentioned circuit board.
其中，上述电路板的所述实现实施例均适用于该电子设备的实施例中，也能达到相同的技术效果。Wherein, the implementation embodiments of the above circuit board are all applicable to the embodiments of the electronic device, and can also achieve the same technical effect.
以上所述的是本发明的优选实施方式，应当指出对于本技术领域的普通人员来说，在不脱离本发明所述原理前提下，还可以作出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。What has been described above is a preferred embodiment of the present invention. It should be pointed out that for those skilled in the art, some improvements and modifications can also be made without departing from the principle of the present invention. These improvements and modifications should also be considered as Be the protection scope of the present invention.
Claims (9)
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| CN201510278868.2A CN104837297B (en) | 2015-05-27 | 2015-05-27 | A kind of circuit board and electronic equipment |
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| CN201510278868.2A CN104837297B (en) | 2015-05-27 | 2015-05-27 | A kind of circuit board and electronic equipment |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201213334Y (en) * | 2008-06-27 | 2009-03-25 | 青岛海信电器股份有限公司 | Circuit board and electronic product |
| CN102458035A (en) * | 2010-10-20 | 2012-05-16 | 上海嘉捷通电路科技有限公司 | Structure of slotting printed board |
| CN202394755U (en) * | 2011-12-27 | 2012-08-22 | 东莞宇龙通信科技有限公司 | Button structure and mobile terminal with the button structure |
| CN103517557A (en) * | 2012-06-19 | 2014-01-15 | 深南电路有限公司 | Method for processing groove on printed circuit board, printed circuit board and electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100982795B1 (en) * | 2008-07-10 | 2010-09-16 | 삼성전기주식회사 | Manufacturing method of printed circuit board having electro component |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201213334Y (en) * | 2008-06-27 | 2009-03-25 | 青岛海信电器股份有限公司 | Circuit board and electronic product |
| CN102458035A (en) * | 2010-10-20 | 2012-05-16 | 上海嘉捷通电路科技有限公司 | Structure of slotting printed board |
| CN202394755U (en) * | 2011-12-27 | 2012-08-22 | 东莞宇龙通信科技有限公司 | Button structure and mobile terminal with the button structure |
| CN103517557A (en) * | 2012-06-19 | 2014-01-15 | 深南电路有限公司 | Method for processing groove on printed circuit board, printed circuit board and electronic device |
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