CN104827778B - Backlight liquid crystal module marking method and device - Google Patents
Backlight liquid crystal module marking method and device Download PDFInfo
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- CN104827778B CN104827778B CN201510154662.9A CN201510154662A CN104827778B CN 104827778 B CN104827778 B CN 104827778B CN 201510154662 A CN201510154662 A CN 201510154662A CN 104827778 B CN104827778 B CN 104827778B
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 29
- 230000001681 protective effect Effects 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000012528 membrane Substances 0.000 abstract description 4
- 238000002679 ablation Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000003763 carbonization Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003760 hair shine Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000006552 photochemical reaction Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
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- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of backlight liquid crystal module marking method and device, said method comprising the steps of: step S1: the parameter of laser instrument and marking control system is initialized, and the mark lettering mark preset by marking control system input；Step S2: adjusting laser instrument and produce laser beam, described laser beam through X-axis galvanometer and the reflection of Y-axis galvanometer and is assembled by collecting lens, the laser beam of described convergence penetrates the transparent protective film of backlight liquid crystal module and irradiates the surface being positioned backlight liquid crystal module；Step S3: control laser beam or backlight liquid crystal module by described marking control system and move, thus go out default mark lettering mark at the printout surface of backlight liquid crystal module.Backlight liquid crystal module marking method of the present invention and device eliminate and change membrane process, not only increase production efficiency and yields, it is ensured that the outward appearance of product and quality, and have saved Material Cost and human cost.
Description
Technical Field
The invention relates to the technical field of liquid crystal display, in particular to a marking method and device for a backlight liquid crystal module.
Background
Liquid crystal display module or backlight unit require very high to the cleanliness factor of environment in the manufacture process, have the process of printing mark in the production process, and current method is to undercut the PET membrane assigned position of backlight unit earlier, tears backlight unit's protection film again, trades and pastes the PET membrane of undercutting, spouts the fat liquoring on the position of undercutting of PET membrane at last to form printing mark. However, this method has the following disadvantages: firstly, bad bubbles, dirt, scratches and the like can be generated in the process of replacing and pasting the PET film, so that the appearance and the quality of a product are influenced; second one
The ink spraying easily causes the surface of a product to be dirty, so that the liquid crystal display module or the backlight module is scrapped, and the ink spraying mode is low in efficiency.
Disclosure of Invention
The invention provides a marking method and device for a backlight liquid crystal module, which can improve the production efficiency and the yield, ensure the appearance and the quality of products and save the material cost and the labor cost.
In order to achieve the purpose, the invention adopts the following technical scheme:
a marking method for a backlight liquid crystal module comprises the following steps:
step S1: initializing parameters of a laser and a marking control system, and inputting a preset marking printed label through the marking control system;
step S2: adjusting a laser to generate a laser beam, wherein the laser beam is reflected by an X-axis vibrating mirror and a Y-axis vibrating mirror and converged by a condensing lens, and the converged laser beam penetrates through a transparent protective film of the backlight liquid crystal module to irradiate and be positioned on the surface of the backlight liquid crystal module;
step S3: through mark control system control laser beam or the liquid crystal module in a poor light removal of marking to print out the mark printing mark of predetermineeing on liquid crystal module in a poor light's surface.
Further, in the marking method for the backlight liquid crystal module, the wavelength of the laser beam is preferably 355nm, and the output power of the laser is preferably 51% -55% of rated power.
Further, in the marking method of the backlight liquid crystal module, the laser frequency of the laser is preferably 30 KHz-200 KHz, and the scribing speed of the laser beam is preferably 100-4500 mm/s.
Further, in the marking method for the backlight liquid crystal module, the laser frequency of the laser is preferably 200KHz, and the scribing speed of the laser beam is preferably 2600 mm/s.
In addition, the invention also provides a marking device for the liquid crystal backlight module, which is used for marking and printing marks on the surface of the backlight liquid crystal module with the transparent protective film, and the device comprises: locate laser instrument, the mirror subassembly that shakes, focus lens group and mark control system in backlight liquid crystal module top, mark control system through control the laser instrument produces the laser beam, after the reflection of mirror subassembly that shakes, shines in backlight liquid crystal module's surface by the transparent protection film that focus lens group transmitted and pierce through backlight liquid crystal module, control system removes through control backlight liquid crystal module or laser instrument to print out the mark printing mark of predetermineeing marking on backlight liquid crystal module's surface.
Further, in the marking device for the backlight liquid crystal module, the wavelength of the laser beam is preferably 355nm, and the output power of the laser is preferably 51% -55% of rated power.
Further, in the marking device for the backlight liquid crystal module, the laser frequency of the laser is preferably 30 KHz-200 KHz, and the scribing speed of the laser beam is preferably 100-4500 mm/s.
Further, in the marking device for the backlight liquid crystal module, the laser frequency of the laser is preferably 200KHz, and the scribing speed of the laser beam is preferably 2600 mm/s.
Furthermore, in the marking device for the backlight liquid crystal module, the galvanometer component at least comprises an X-axis galvanometer and a Y-axis galvanometer which are matched with each other, and the marking control system controls incidence and deflection angles of the X-axis galvanometer and the Y-axis galvanometer relative to laser beams so as to enable the laser beams to vertically enter the focusing lens group.
The method and the device for marking the backlight liquid crystal module save the film changing process, not only improve the production efficiency and the yield, ensure the appearance and the quality of products, but also save the material cost and the labor cost.
Drawings
FIG. 1 is a schematic flow chart of a marking method for a backlight liquid crystal module according to the present invention;
fig. 2 is a schematic structural diagram of a marking device for a backlight liquid crystal module according to a preferred embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Laser is a powerful beam of light that is excited when "rays" are stimulated by an external stimulus to increase energy, with infrared light and visible light having thermal energy and ultraviolet light having additional optical energy. Light of this type strikes the surface of the workpiece, causing three phenomena, reflection, absorption and penetration. The main function of laser marking or drilling is to quickly remove the substrate material to be processed, which is mainly by photothermal ablation and photochemical ablation or so-called ablation.
1. Photo-thermal ablation: refers to the principle that the material being processed absorbs high energy laser light, heats to melt in a very short time and is evaporated. The process method has the advantage that under the action of high energy on the substrate material, the formed hole wall has black-fired carbonized residues.
2. Photochemical ablation: it is the result of the action of high photon energy (over 2eV electron volts) in the uv region and high energy photons with laser wavelengths over 400 nm. The high-energy photons can destroy long molecular chains of the organic material to form smaller particles, the energy of the high-energy photons is larger than that of original molecules, the high-energy photons can escape from the original molecules to the utmost extent, and under the pinching and sucking condition of external force, the substrate material is quickly removed to form micropores. Therefore, the process method does not contain hot firing, and the carbonization phenomenon can not be generated.
The ultraviolet light acts on the surface of the metal, the metal is inorganic matter, most of the products generated by photochemical reaction are metal oxide, the metal oxide can remain in the gaps or the edges of the gaps etched by the laser when the laser energy is small, the metal oxide can be re-condensed after being gasified when the laser energy is large, and the metal oxide becomes fine dust particles and scatters, so that the metal is concave after being hit by the ultraviolet laser.
When ultraviolet light acts on organic matters in nonmetal, laser energy is absorbed by materials, chemical bonds of the materials are broken and recombined, new organic matters are generated and attached to the surface of raw materials, when the laser energy is enhanced, the broken chemical bonds are increased, and when the energy is strong enough, carbonization of the organic materials is realized. The laser with small energy can only generate new organic matters, but the organic matters in the metal are denatured when photochemical reaction occurs, namely molecular chains are broken and recombined to become new organic matters, and the volume of the new organic matters is larger than that of the raw materials, so that the bulge phenomenon is generated.
Referring to fig. 1 and 2, the marking method of the backlight liquid crystal module according to the present invention, which marks the liquid crystal display or the backlight module by the laser directly penetrating through the protective film, includes the steps of:
step S1: initializing parameters of a laser and a marking control system, and inputting a preset marking printed label through the marking control system;
step S2: adjusting a laser to generate a laser beam, wherein the laser beam is reflected by an X-axis vibrating mirror and a Y-axis vibrating mirror and converged by a condensing lens, and the converged laser beam penetrates through a transparent protective film of the backlight liquid crystal module to irradiate and be positioned on the surface of the backlight liquid crystal module;
step S3: through mark control system control laser beam or the liquid crystal module in a poor light removal of marking to print out the mark printing mark of predetermineeing on liquid crystal module in a poor light's surface.
The wavelength of the laser beam is preferably 355nm, and the output power of the laser is preferably 51% -55% of rated power; the laser frequency of the laser is preferably 30 KHz-200 KHz, and the scribing speed of the laser beam is preferably 100-4500 mm/s. In the embodiment, the laser frequency of the laser is preferably 200KHz, and the scribing speed of the laser beam is preferably 2600 mm/s.
In the invention, the laser beam is irradiated on the surface of the liquid crystal display or backlight module, the energy of the laser is absorbed by the liquid crystal display or backlight module, so that the surface of the liquid crystal display or backlight module can leave marks, the laser moves along a set track, the marks left on the surface of the liquid crystal display or backlight module are marking contents, the color of the marks is the natural color of a product material, and if the material of the product absorbs the energy of the laser, the material undergoes chemical reaction to denaturize the material, so that the color of the marks left by the laser changes. The protective film is a transparent object, so that the protective film cannot absorb the energy of laser and cannot generate chemical reaction, and no trace is left when the protective film is printed on the transparent object.
The depth of the laser scribing on the surface of the product is controlled by the amount of laser energy, which is influenced by a number of factors, roughly classified into two categories in summary: one is an external factor and the other is an internal factor.
External factors: whether the product is placed at the focus position and marked, the laser energy of focus position is strongest, and the laser energy of skew focus position can weaken, and this factor is uncontrollable, so the position of requiring the mark of beating is levelly and smoothly, and the distance that the product was marked the head to the laser is accurate.
Internal factors: the pen parameters set by the machine, the laser frequency, the laser power and the scribing speed in the pen parameters influence the energy of the laser, and the pen parameters can be controlled.
In the invention, the larger the laser power (50-95%) is, the stronger the light emission is; the higher the laser frequency (30 KHz to 200 KHz) is, the finer the marked line is; the smaller the numerical value, the more obvious the granular feeling of the marking line is;
the larger the scribing speed (100 to 4500) value, the shorter the marking time, and the lighter the font effect.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a marking device for a backlight liquid crystal module according to a preferred embodiment of the invention. Liquid crystal module beats mark device in a poor light for 2 surfaces of liquid crystal module in a poor light that have transparent protection film 1 mark printing marks, the device includes: locate 2 tops of liquid crystal module in a poor light laser instrument 10, the mirror subassembly 20 that shakes, focus lens group 30 and mark control system (not shown), mark control system through control laser instrument 10 produces the laser beam, after the reflection of mirror subassembly 20 that shakes, shines in liquid crystal module 2's surface in a poor light by the transparent protection film that focus lens group 30 transmission and pierce through liquid crystal module in a poor light 20, control system removes through control liquid crystal module 2 or laser instrument 10 in a poor light to print out the mark printing mark of predetermineeing on liquid crystal module 2's surface in a poor light.
The galvanometer assembly 20 at least comprises an X-axis galvanometer 201 and a Y-axis galvanometer 202 which are matched with each other, and the marking control system controls the incidence and deflection angles of the X-axis galvanometer 201 and the Y-axis galvanometer 202 relative to the laser beam, so that the laser beam is vertically incident to the focusing lens assembly 30.
The wavelength of the laser beam is preferably 355nm, and the output power of the laser is preferably 51-55% of rated power; the laser frequency of the laser is preferably 30 KHz-200 KHz, and the scribing speed of the laser beam is preferably 100-4500 mm/s. In the embodiment, the laser frequency of the laser is preferably 200KHz, and the scribing speed of the laser beam is preferably 2600 mm/s.
Compared with the prior art, the method and the device for marking the backlight liquid crystal module save a film changing process, improve the production efficiency and the yield, ensure the appearance and the quality of products, and save the material cost and the labor cost.
The description and applications of the invention herein are illustrative and are not intended to limit the scope of the invention to the embodiments described above. Variations and modifications of the embodiments disclosed herein are possible, and alternative and equivalent various components of the embodiments will be apparent to those skilled in the art. It will be clear to those skilled in the art that the present invention may be embodied in other forms, structures, arrangements, proportions, and with other components, materials, and parts, without departing from the spirit or essential characteristics thereof. Other variations and modifications of the embodiments disclosed herein may be made without departing from the scope and spirit of the invention.
Claims (2)
1. A marking method for a backlight liquid crystal module is characterized by comprising the following steps:
step S1: initializing parameters of a laser and a marking control system, and inputting a preset marking printed label through the marking control system;
step S2: adjusting a laser to generate a laser beam, wherein the laser beam is reflected by an X-axis vibrating mirror and a Y-axis vibrating mirror and converged by a condensing lens, and the converged laser beam penetrates through a transparent protective film of the backlight liquid crystal module to irradiate and be positioned on the surface of the backlight liquid crystal module;
step S3: the marking control system controls the laser beam or the backlight liquid crystal module to move, so that a preset marking and printing mark is printed on the surface of the backlight liquid crystal module; wherein,
the wavelength of the laser beam is 355nm, and the output power of the laser is 51-55% of rated power; the laser frequency of the laser is 30 KHz-200 KHz, and the scribing speed of the laser beam is 100-4500 mm/s.
2. The marking method of the backlight liquid crystal module as claimed in claim 1, wherein the laser frequency of the laser is 200KHz, and the scribing speed of the laser beam is 2600 mm/s.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510154662.9A CN104827778B (en) | 2015-04-03 | 2015-04-03 | Backlight liquid crystal module marking method and device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510154662.9A CN104827778B (en) | 2015-04-03 | 2015-04-03 | Backlight liquid crystal module marking method and device |
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| Publication Number | Publication Date |
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| CN104827778A CN104827778A (en) | 2015-08-12 |
| CN104827778B true CN104827778B (en) | 2016-10-19 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106984903A (en) * | 2017-03-30 | 2017-07-28 | 胡金钱 | Laser machine equipment, the method for official seal of putting on record and the official seal docketing system of official seal |
| CN107042682A (en) * | 2017-03-30 | 2017-08-15 | 胡金钱 | A kind of equipment for laser machining official seal |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5837962A (en) * | 1996-07-15 | 1998-11-17 | Overbeck; James W. | Faster laser marker employing acousto-optic deflection |
| CN1508630A (en) * | 2002-12-16 | 2004-06-30 | 东丽工程株式会社 | Method and apparatus for laser marking identification code |
| CN101216663A (en) * | 2008-01-17 | 2008-07-09 | 陈林森 | Backlight module accurate light guide thin film core production method |
| CN201300588Y (en) * | 2008-11-28 | 2009-09-02 | 华南理工大学 | High-speed galvanometric scanner type online laser coding machine for metal parts |
| CN202138073U (en) * | 2011-07-22 | 2012-02-08 | 北京京东方光电科技有限公司 | Marking device, marking equipment and system for producing liquid crystal display |
| CN102514385A (en) * | 2011-11-29 | 2012-06-27 | 深圳市华星光电技术有限公司 | Identification code printing method and identification code printing device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003136260A (en) * | 2001-10-31 | 2003-05-14 | Sunx Ltd | Laser marking device |
| JP2006201692A (en) * | 2005-01-24 | 2006-08-03 | Sony Corp | Device for forming stereoscopic pattern, and method for forming stereoscopic pattern |
| JP2007301610A (en) * | 2006-05-12 | 2007-11-22 | Y E Data Inc | Laser beam machining method and laser beam machining apparatus |
| JP2009044034A (en) * | 2007-08-10 | 2009-02-26 | Canon Inc | Exposure apparatus, and method of manufacturing device |
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2015
- 2015-04-03 CN CN201510154662.9A patent/CN104827778B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5837962A (en) * | 1996-07-15 | 1998-11-17 | Overbeck; James W. | Faster laser marker employing acousto-optic deflection |
| CN1508630A (en) * | 2002-12-16 | 2004-06-30 | 东丽工程株式会社 | Method and apparatus for laser marking identification code |
| CN101216663A (en) * | 2008-01-17 | 2008-07-09 | 陈林森 | Backlight module accurate light guide thin film core production method |
| CN201300588Y (en) * | 2008-11-28 | 2009-09-02 | 华南理工大学 | High-speed galvanometric scanner type online laser coding machine for metal parts |
| CN202138073U (en) * | 2011-07-22 | 2012-02-08 | 北京京东方光电科技有限公司 | Marking device, marking equipment and system for producing liquid crystal display |
| CN102514385A (en) * | 2011-11-29 | 2012-06-27 | 深圳市华星光电技术有限公司 | Identification code printing method and identification code printing device |
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