CN104804682B - Temporary bonding glue for wafer backgrinding, preparation method of temporary bonding glue and bonding and de-bonding methods - Google Patents
Temporary bonding glue for wafer backgrinding, preparation method of temporary bonding glue and bonding and de-bonding methods Download PDFInfo
- Publication number
- CN104804682B CN104804682B CN201510179451.0A CN201510179451A CN104804682B CN 104804682 B CN104804682 B CN 104804682B CN 201510179451 A CN201510179451 A CN 201510179451A CN 104804682 B CN104804682 B CN 104804682B
- Authority
- CN
- China
- Prior art keywords
- ephemeral key
- key rubber
- rubber alloy
- bonding
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G12/00—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C08G12/02—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes
- C08G12/04—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
- C08G12/06—Amines
- C08G12/08—Amines aromatic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C09J161/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses temporary bonding glue for wafer backgrinding, a preparation method of the temporary bonding glue and bonding and de-bonding methods. The temporary bonding glue comprises base resin for producing the adhesive effect, wherein the base resin can be depolymerized into a low molecular compound and/or a linear low polymer under the action of strong acid, so that an adhesive layer formed by the bonding glue has an obvious depolymerization reaction under the sufficient impregnation of acid liquor, that is, the structure of a three-dimensional polymer is damaged, the adhesive layer loses efficacy by means of the generated low molecular compound or linear low polymer, and the de-bonding efficiency is improved. Besides, the decomposition temperature of the high polymer is higher than 270 DEG C, so that the thermal stability of the adhesive layer is high; the corrosion resistance of the bonding glue is high, and the preparation cost is more economical.
Description
Technical field
The present invention relates to the technical field of adhesive, more particularly to wafer thinning ephemeral key rubber alloy, its preparation method, key
Close and solution bonding method.
Background technology
In recent years, computer, communication, automotive electronics and other consumer products propose higher wanting to microelectronics Packaging
Ask, i.e., it is smaller, thinner, multi-functional with it is inexpensive.To meet the miniature requirement of these products, semi-conductor industry is needed thin crystalline substance
Circle is thinned to less than 100 μm.The features such as ultra-thin thin wafer has flexible and fragility, easy warpage and rises and falls, therefore generally first
Device wafers are bonded on thicker carrier with interim bonding material, by back it is thinning, formed reroute layer and internal mutual
After even making, then being input into outside energy (light, electricity, heat and external force) makes tack coat fail, and afterwards divides device wafers from carrier
Leave and, this process is the interim bonding technology of wafer.Wherein, the ephemeral key rubber alloy for immobilising device wafer is ephemeral key
Close technique successfully crucial.
Chinese patent CN104204126A discloses a kind of adhesive composition for wafer film processed, said composition
Comprising acrylic polymer and photosensitive gas-forming agent, the usable ultraviolet light of adhesive layer that said composition is formed carries out Xie Jian
Close.Chinese patent CN104130727A discloses a kind of pressure-sensitive ephemeral key rubber alloy, and its raw material includes 30~70 parts of solvent, basic tree
30~50 parts of fat, 5~30 parts of microcapsule particle, wherein base resin be cycloolefin polymer particle, solvent be cyclododecene,
Bicyclo hexene, limonene, equal dimethylbenzene, cyclopentanone, hexahydrotoluene, methyl ethyl ketone, dipentene, cyclooctane, butylcyclohexyl
The mixture of one or more in alkane, cycloheptane and hexamethylene, microcapsule particle structure is by the kernel of macromolecular compound
Outer layer covers with natural or synthesis macromolecular compound continuous wall or foreign minister are constituted, also including tackifier, low-molecular-weight
One or more mixtures in cyclic olefine copolymer, plasticizer, antioxidant.Chinese patent CN102203917A discloses one kind
For the composition of temporary wafer bonding, said composition is by free tackifier, low-molecular-weight cyclic olefine copolymer, plasticizer, anti-
Oxygen agent is constituted, and wherein tackifier are selected from by many mushroom olefine resins, R mushrooms more than olefine resin, phenylethene modified mushroom olefine resin, polymerization
The cruel resin of rosin resin, rosin, alicyclic hydrocarbon resin, C5Aliphatic hydrocarbon resin, hydrogenated hydrocarbon resins, low-molecular-weight cyclic olefine copolymer
For weight average molecular weight is less than about 50000 dalton.It is above-mentioned in the prior art, using ephemeral key rubber alloy formed adhesive layer solution be bonded
Less efficient, solution bonding need to be by expensive corollary equipment, additionally, the heat endurance of adhesive layer is low, corrosion resistance is poor.
The content of the invention
In view of this, one aspect of the present invention provides a kind of ephemeral key rubber alloy with solution key efficiency high.
The thinning ephemeral key rubber alloy of a kind of wafer, comprising the base resin for producing adhesive effect, the base resin
It is the high polymer that linear oligomer and/or low molecular compound can be depolymerized under strong acid effect.
Base resin is the high polymer of acid degradation, so may be such that the adhesive layer that bonding glue is formed is sufficiently impregnated using acid solution
Lower there is obvious the destructurized of reaction, i.e. three-dimensional polymer that depolymerize, the low molecular compound of generation and/or linearly low
Aggressiveness causes that adhesive layer fails, and reaches the purpose of solution bonding.Term " low molecular compound " refers to point for " macromolecule "
Son amount is less than 1000." linear oligomer " refers to non-polymer, and its molecular weight is more than 1000 including multiple monomer molecule structures
Polymer.Any restriction, such as sulfuric acid, hydrochloric acid, nitric acid etc., acid of the preferably pH less than 2 are not done in the present invention to strong acid.
The heat decomposition temperature of base resin is more than 270 DEG C, it is ensured that the adhesive linkage that ephemeral key rubber alloy is formed has preferable
Heat endurance.
There is the present invention acid degradation high polymer to be not particularly limited, and instantiation has：The body of acetal or ketal diepoxide
System (specifically can refer to document " Buchwalter*and Laura L.Kosbar, Cleavable epoxy resins:Design
For disassembly of a thermoset, Journal of Polymer Science Part A:Polymer
Chemistry Volume 34,Issue 2,pages 249260,30January 1996”)；Or bisphenol-A with contain first
In the phenolic resin of phenol, the body of epoxy ethyl ethylene oxidic ester and cyclohexanedimethanol vinylglycidyl ester composition is added
System, after solidification can containing acid THF in degraded (specifically can refer to document " Hashimoto, T., Meiji, H., Urushisaki,
M.,Sakaguchi,T.,Kawabe,K.,Tsuchida,C.and Kondo,K.(2012),Degradable and
chemically recyclable epoxy resins containing acetal linkages:Synthesis,
properties,and application for carbon fiber-reinforced plastics.J.Polym.Sci.A
Polym.Chem.,50:3674–368”).The present invention is preferably the network polymers with fatty aldehyde polycondensation reaction for diamines.
Its molecular structure is made up of main body the repeat unit of hexa-atomic carbon azacyclo-, its repeat unitWherein R1It is C1~4Aliphatic group or aryl radical, R2It is C1~4Aliphatic hydrocarbon
Base or aryl radical.
Above-mentioned diamine compound contains two compounds of amino in referring to molecule.The temperature of above-mentioned polycondensation reaction is preferably 50
~80 DEG C.Diamine compound is preferably 1 with the mol ratio of fatty aldehyde:2~1:3, polycondensation reaction using it is known based on primary amine with
The classical reactions of the Mannich of aldehyde.Specific synthetic route is as follows：
For example, the polymer being synthesized using formaldehyde and 4,4- diaminodiphenyl ether, its glass transition temperature (Tg)
It is 32 DEG C, now R1It is diphenyl ether, R2It is hydrogen atom；The polymer that acetaldehyde and 4,4- diaminodiphenyl ether are synthesized, 250
At DEG C, without obvious glass transition, this constantly R1It is diphenyl ether, R2It is methyl；Propionic aldehyde reacts with 4,4- diaminodiphenyl ethers and closes
Into polymer, at 250 DEG C, without obvious glass transition, now R1It is diphenyl ether, R2It is ethyl；Work as R2Group is fragrance
During alkyl, primary amine can be carried out with the reaction of aldehyde, but can not form the hexatomic ring network structure of stabilization, therefore be obtained during heat cure
Less than obvious solid gum, bond properties is poor.With R2The carbon atom number of group increases, derivatized polymers winding aggravation,
Polymer rigid strengthens, TgRaise.And glass transition does not occur in processing temperature proves the thermally-stabilised of the ephemeral key rubber alloy
Property is excellent.And R2When group is aryl radical or isopropyl, because the steric hindrance of aromatic hydrocarbon and isopropyl is larger, cause cyclization
Stablize poor, therefore cannot get cross-linked network structure.It is preferred that R2Group is C1~3Straight chain fatty alkyl.
It is understood that bonding glue also includes solvent.Solvent can be used as the polycondensation reaction of above-mentioned diamines and fatty aldehyde
Solvent, thus reacts the base resin for obtaining and is dispersed in solvent.The boiling point of solvent is higher than 80 DEG C, and polarity is polymerized with accordingly
Thing is close.Solvent for example can for propylene glycol methyl ether acetate, dimethylacetylamide, propylene glycol monomethyl ether, ethyl lactate and
One kind in pyrrolidones or at least two.Solvent load is not specially limited, and preferably but is not limited to account for solvent and basic tree
The 50~70% of fat gross mass.
Further, also include, counted as 100 parts with base resin gross mass with solvent, 8~10 parts of tackifier, 0.05
~0.07 part of levelling agent, 0~1 part of antioxidant.
Tackifier are used to improve the viscosity of bonding glue, preferably plexiglass, poly-methyl methacrylate
Ester is good with base resin compatibility, and it is 10 that its molecular weight is preferably4~107.Levelling agent is typically using the esters of acrylic acid of fluorine richness
Levelling agent.In antioxidant, primary antioxidant is polynary hindered phenol type antioxidant, and auxiliary antioxidant is phosphite ester kind antioxidant, it
Be favorably improved bonding glue heat endurance.
One preferably formula is to be counted as 100 parts with base resin and solvent gross mass, comprising 8~12 parts of 4,4- diaminos
Yl diphenyl ether, 10~15 parts of acetaldehyde, 55~70 parts of solvents, 0.05~0.07 part of FC-4430 types levelling agent, 0.8~1.2 part of antioxygen
1076,8~10 parts of polymethyl methacrylate tackifier of agent；Preferably, its raw material includes 10 parts of 4,4- diaminodiphenyl ethers,
10.9 parts of acetaldehyde, 68.05 parts of DMAc and 0.05 part of FC-4430 type levelling agents, 10 parts of polymethyl methacrylate tackifier, 1 part
1076 antioxidants.
Another aspect of the invention provides a kind of preparation method of ephemeral key rubber alloy, and heat endurance is can obtain by the preparation method
The strong ephemeral key rubber alloy of high, corrosion resistance.
A kind of preparation method of such as above-mentioned ephemeral key rubber alloy, there is provided base resin；According to base resin and solvent quality ratio
It is (30~50)：(50~70) solvent is matched；By the solvent and, counted as 100 parts with base resin gross mass with solvent, 8~
10 parts of tackifier, 0.05~0.07 part of levelling agent, 0~1 part of antioxidant mix to form mixed liquor；By mixed liquor through cooling and
Degassing process, obtains ephemeral key rubber alloy.
There is provided base resin specific method be, according to mass parts by 30~50 parts of reaction monomers gross masses (i.e. diamines and
Both fatty aldehydes quality sum), 50~70 parts of solvents be stirred mixing in a heated condition, then cool down and filter more viscous
Thick transparency liquid (there is the poor system of some dissolubilities, therefore need to be filtered out) is base resin.By what is obtained
Base resin and 8~10 parts of thickeners, 0.05~0.07 part of levelling agent and 0~0.15 part of antioxidant are stirred mixing and deaerate
Treatment, obtains ephemeral key rubber alloy.
In above-mentioned preparation method, the mode of heating is the water-bath at 50~80 DEG C；The mode of stirring is 100~1000rpm
Mechanical agitation under rotating speed；The mode of degassing process is to carry out vacuum outgas using vacuum degassing machine.
Further aspect of the present invention provides a kind of method to thin wafer bonding, and the method is used by above-mentioned with preferably bonding
The ephemeral key rubber alloy of efficiency.
A kind of method being bonded to thinned wafer using above-mentioned ephemeral key rubber alloy, specially：There is provided is included by institute
State the first substrate of ephemeral key rubber alloy bonding and the laminates of the second substrate；And the heating ephemeral key rubber alloy is allowed to solidify shape
Into adhesive linkage.
In the method for above-mentioned bonding, the mode for heating ephemeral key rubber alloy can be the mode of baking.Roaster can directly be passed through
Part wafer is not coated with being bonded an other surface of glue.During bonding glue is heated, the solvent in bonding glue first volatilizees, then
Along with heating continuation, the polymer solidification temperature be 120~180 DEG C or so be thoroughly solidified into adhesive linkage, so carrying
There is bonding action with the surface of device wafers in wafer.
A kind of thin wafer to above method bonding carries out the method for solving bonding, including using the step of strong acid dissolution adhesive linkage
Suddenly.
It is at least one that strong acid is preferably selected from sulfuric acid solution, hydrochloric acid, nitric acid.The molar concentration of strong acid is using 0.5~6M.
Here " M " is the abbreviation of " mol/L ".
The thinning ephemeral key rubber alloy of wafer in the present invention, comprising the base resin for producing adhesive effect, base resin
It is the high polymer that low molecular compound and/or linear oligomer can be depolymerized under strong acid effect, will be so bonded what glue was formed
Adhesive layer is sufficiently impregnated down obvious the destructurized of reaction, i.e. three-dimensional polymer that depolymerize, generation using acid solution
Low molecular compound or linear oligomer cause that adhesive layer fails, reach raising solution bonding efficiency.In addition, the decomposition of high polymer
Temperature is more than 270 DEG C so that the heat endurance of adhesive layer is high.Additionally, bonding glue corrosion resistance of the invention is also relatively strong, prepare
Cost is relatively inexpensive.
Brief description of the drawings
Fig. 1 is the infrared spectrogram before and after the solidification of the ephemeral key rubber alloy of the embodiment of the present invention 1；
Fig. 2 is the acid degradation situation and acid degradation rate diagram of the ephemeral key rubber alloy of the embodiment of the present invention 2；
Fig. 3 is the ephemeral key rubber alloy coating dry film thermogravimetric change curve of the embodiment of the present invention 2；
Fig. 4 is the ephemeral key rubber alloy of the embodiment of the present invention 2 bonding gel coating dry film DSC curve figure.
Fig. 5 is the bonding and solution bonding process after ephemeral key rubber alloy bonding wafer of the present invention.
Specific embodiment
Below in conjunction with the accompanying drawings and embodiment further illustrates technical scheme.
Embodiment 1
4.4g acetaldehyde (99% solution), 4g 4,4- diamines diphenyl ether, 28gDMAc are added to band agitating device and configuration
In having a heat of solution container of water bath heating system.Bath temperature is controlled at 60~70 DEG C and starts mixer, and regulation rotating speed is 100
~1000rpm, takes out after stirring 15min after above-mentioned raw materials are stirred, and adds the FC-4430 type levelling agents of 20mg,
4g polymethyl methacrylates, stir.Vacuum outgas in vacuum degassing machine is placed in, finally sealed is preserved.
Embodiment 2
In this example, its raw material is specifically included：3g paraformaldehydes, 4g 4,4- diamines diphenyl ether, 28g solvent NMP, are added to
With agitating device and being configured with the heat of solution container of water bath heating system.Bath temperature is controlled at 60~70 DEG C and starts stirring
Machine, regulation rotating speed is 100~1000rpm, stirs 15min.Carry out being filtrated to get sticky filtrate after cooling.Added toward filtrate
The levelling agents of 17mg 4430, stir.Vacuum outgas in vacuum degassing machine is placed in, finally sealed is preserved.
Embodiment 3
In this example, raw material is specifically included：By 4.4g acetaldehyde (99% solution), 3.96g 4,4- diamines diphenyl-methane, 28g
NMP, 20mg FC-4430 type levelling agents, 4g polymethyl methacrylates；In addition, other are same as embodiment 1.
Embodiment 4
In this example, raw material is specifically included：By 4.4g acetaldehyde (99% solution), 2.16g p-phenylenediamine, 28g NMP, 18mg
FC-4430 type levelling agents, 4g polymethyl methacrylates；In addition, other are same as embodiment 1.
Fig. 1 for example 1 solidification before with solidification after infrared spectrogram.It is known that existing before solidification a large amount of from figure
(wave number is 3300cm to hydroxyl-1Position), hydroxyl peak disappears after solidification, so as to prove that the reaction occurs and forms cross-linked network.
To the test result of embodiment 1 and the corrosion resistance of embodiment 2 respectively if table 1 below and table 2 below are (in view of specific test
Method has been well known to those skilled in the art, and method is no longer described in detail at this)：
Table 1
Table 2
As shown in Figure 3,4, the thermogravimetric change of respectively embodiment 2 and DSC heat score-curve figures, can be seen that from the Fig. 1
From 280 DEG C, the coating dry film of ephemeral key rubber alloy just occurs decomposing weightless phenomenon, in 500 DEG C of weight-loss ratios be 80%, i.e., big portion
Decompose.And in fig. 2 it is possible to find out in the range of 250 DEG C, there is glass transition at 50 DEG C in sample, but in processing
In temperature range, in the absence of limited proportionality.As can be seen here, ephemeral key rubber alloy of the invention has preferable heat endurance.
Although the number range of involved each technological parameter can not possibly all embody in the above-described embodiments in the present invention,
As long as but those skilled in the art's envisioned any numerical value fallen into the above-mentioned number range completely can implement this
Invention, also includes any combination of occurrence in the range of some numerical value certainly.Herein, for the consideration of length, eliminate to
Go out the embodiment of occurrence in certain one or more number range, be not to be construed as protecting technical scheme requirement herein
The formula and processing range of shield lack the understanding that sufficient embodiment is supported.
Applicant states that the present invention illustrates detailed process equipment of the invention and technological process by above-described embodiment,
But the invention is not limited in above-mentioned detailed process equipment and technological process, that is, do not mean that the present invention has to rely on above-mentioned detailed
Process equipment and technological process could be implemented.Person of ordinary skill in the field it will be clearly understood that any improvement in the present invention,
Addition, the selection of concrete mode to the equivalence replacement and auxiliary element of each raw material of product of the present invention etc., all fall within of the invention
Within the scope of protection domain and disclosure.
Claims (20)
1. the thinning ephemeral key rubber alloy of a kind of wafer, it is characterised in that described comprising the base resin for producing adhesive effect
Base resin is the high polymer that low molecular compound and/or linear oligomer can be depolymerized under strong acid effect；
The high polymer is the network polymers that diamine compound carries out polycondensation reaction with fatty aldehyde, and its molecular structure is by leading
Body is made up of the repeat unit of hexa-atomic carbon azacyclo-, and its repeat unit structure is：
Wherein, R1It is C1~4Aliphatic group or aryl radical, R2It is C1~4Aliphatic group or aryl radical.
2. ephemeral key rubber alloy according to claim 1, it is characterised in that the strong acid is acid of the pH less than 2.
3. ephemeral key rubber alloy according to claim 1, it is characterised in that the decomposition temperature of the high polymer 270 DEG C with
On.
4. ephemeral key rubber alloy according to claim 1, it is characterised in that the temperature of the polycondensation reaction is 50~80 DEG C.
5. ephemeral key rubber alloy according to claim 1, it is characterised in that the mol ratio of the diamine compound and fatty aldehyde
It is 1:2~1:3.
6. ephemeral key rubber alloy according to claim 1, it is characterised in that the weight average molecular weight of the high polymer is 5 × 103
~5 × 106。
7. ephemeral key rubber alloy according to claim 1, it is characterised in that also comprising solvent, the boiling point of the solvent is higher than
80℃。
8. ephemeral key rubber alloy according to claim 7, it is characterised in that the solvent be propylene glycol methyl ether acetate,
One kind in dimethylacetylamide, propylene glycol monomethyl ether, ethyl lactate and pyrrolidones or at least two.
9. the ephemeral key rubber alloy according to claim 7 or 8, it is characterised in that the solvent load is to account for solvent with basis
The 50~70% of resin gross mass.
10. ephemeral key rubber alloy according to claim 7, it is characterised in that also include：With solvent and base resin gross mass
It is 100 parts of meters, 8~10 parts of tackifier, 0.05~0.07 part of levelling agent, 0~1 part of antioxidant.
11. ephemeral key rubber alloys according to claim 10, it is characterised in that the tackifier are poly-methyl methacrylate
Ester.
12. ephemeral key rubber alloys according to claim 10, it is characterised in that the levelling agent is the acrylate of fluorine richness
Class levelling agent.
13. ephemeral key rubber alloys according to claim 10, it is characterised in that the antioxidant is polynary hindered phenol type antioxygen
The mixture of agent antioxidant and phosphite ester kind antioxidant.
A kind of 14. preparation methods of ephemeral key rubber alloy as claimed in claim 1, it is characterised in that including：Base resin is provided；
It is (30~50) according to base resin and solvent quality ratio：(50~70) solvent is matched；By the solvent and, with solvent and basis
Resin gross mass is 100 parts of meters, and 8~10 parts of tackifier, 0.05~0.07 part of levelling agent, 0~1 part of antioxidant mix to be formed
Mixed liquor；By mixed liquor through cooling and degassing process, ephemeral key rubber alloy is obtained.
The method that ephemeral key rubber alloy described in a kind of 15. usage right requirements 1 is bonded to thinned wafer, it is characterised in that bag is provided
Include the laminates of the first substrate and the second substrate being bonded by the ephemeral key rubber alloy；And the heating ephemeral key rubber alloy makes
Solidify to form adhesive linkage.
16. methods according to claim 15, it is characterised in that the offer includes being bonded by the ephemeral key rubber alloy
The first substrate and the concrete mode of laminates of the second substrate be, by the ephemeral key rubber alloy under 400~1400rpm rotating speeds
Coat on the first substrate and the second substrate.
17. methods according to claim 15, it is characterised in that the solidification temperature is 120~180 DEG C.
A kind of 18. thinned wafers to using method as claimed in claim 15 bonding carry out the method for solving bonding, and its feature exists
In, including the step of use strong acid dissolution adhesive linkage.
19. methods according to claim 18, it is characterised in that the strong acid be selected from sulfuric acid solution, hydrochloric acid, nitric acid extremely
Few one kind.
20. methods according to claim 18, it is characterised in that the molar concentration of the strong acid is using 0.5~6M.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510179451.0A CN104804682B (en) | 2015-04-16 | 2015-04-16 | Temporary bonding glue for wafer backgrinding, preparation method of temporary bonding glue and bonding and de-bonding methods |
| PCT/CN2015/084685 WO2016165230A1 (en) | 2015-04-16 | 2015-07-21 | Temporary bonding glue for wafer backgrinding, preparation method of temporary bonding glue and bonding and de-bonding methods |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510179451.0A CN104804682B (en) | 2015-04-16 | 2015-04-16 | Temporary bonding glue for wafer backgrinding, preparation method of temporary bonding glue and bonding and de-bonding methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104804682A CN104804682A (en) | 2015-07-29 |
| CN104804682B true CN104804682B (en) | 2017-05-24 |
Family
ID=53689893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510179451.0A Active CN104804682B (en) | 2015-04-16 | 2015-04-16 | Temporary bonding glue for wafer backgrinding, preparation method of temporary bonding glue and bonding and de-bonding methods |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104804682B (en) |
| WO (1) | WO2016165230A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105552017A (en) * | 2015-12-28 | 2016-05-04 | 深圳先进技术研究院 | Slide structure used for temporary bonding, and bonding and de-bonding method |
| CN112980364A (en) * | 2021-02-05 | 2021-06-18 | 华南理工大学 | Temporary bonding glue with high thermal stability and low modulus, and preparation method and application thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5256641B2 (en) * | 2007-04-06 | 2013-08-07 | Ｊｓｒ株式会社 | Adhesive composition |
| KR101455046B1 (en) * | 2010-12-29 | 2014-10-28 | 스미토모 베이클라이트 가부시키가이샤 | Polymer compositions for temporary bonding |
| KR20120104450A (en) * | 2011-03-08 | 2012-09-21 | (주)엘지하우시스 | Pressure-sensitive adhesive composition for a film used for processing wafer |
| JP6031264B2 (en) * | 2012-06-13 | 2016-11-24 | 富士フイルム株式会社 | Temporary adhesive for manufacturing semiconductor device, adhesive support using the same, and method for manufacturing semiconductor device |
-
2015
- 2015-04-16 CN CN201510179451.0A patent/CN104804682B/en active Active
- 2015-07-21 WO PCT/CN2015/084685 patent/WO2016165230A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN104804682A (en) | 2015-07-29 |
| WO2016165230A1 (en) | 2016-10-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1083850C (en) | Microcapsule-type curing agent, method for producing the same, thermosetting resin composition, prepreg and fiber reinforced composite material | |
| CN101583648B (en) | Latent curing agent | |
| CN1833001A (en) | Curable flame retardant epoxy resin composition | |
| TWI717525B (en) | Thermosetting epoxy resin composition and method for producing the same | |
| JP2014520903A5 (en) | ||
| CN102471462A (en) | Aluminum chelate-based latent curing agents and process for preparation thereof | |
| KR20170049465A (en) | Aluminum chelate-based latent curing agent, method for producing same, and thermosetting epoxy resin composition | |
| CN104804682B (en) | Temporary bonding glue for wafer backgrinding, preparation method of temporary bonding glue and bonding and de-bonding methods | |
| CN107743512A (en) | Adhesive tape with interim fixed adhesive | |
| JP6702534B2 (en) | Epoxy resin composition | |
| KR102316658B1 (en) | Latent curing agent, manufacturing method thereof, and thermosetting epoxy resin composition | |
| CN103173138B (en) | Adhesive composition | |
| JP7218604B2 (en) | Curable resin composition containing epoxy group-containing polyorganosiloxane and cured product thereof | |
| CN104559852B (en) | A kind of ephemeral key rubber alloy for the processing of thin wafer and preparation method thereof | |
| JP2912193B2 (en) | Microcapsule curing agent or curing accelerator, epoxy resin composition containing the same, curing method and cured epoxy resin | |
| US7135535B2 (en) | Siloxane resins with oxetane functionality | |
| TW201033278A (en) | Phase separated curable compositions | |
| JP3031897B2 (en) | Epoxy resin cured product and curing method for obtaining the same | |
| JPWO2006085421A1 (en) | Oxetane compound and curable composition containing the same | |
| JP2000281759A (en) | Latent epoxy hardener and one-component epoxy resin composition containing the same | |
| JP6816846B2 (en) | Composition, cured product, method for producing cured product, method for producing coating film and method for producing composition | |
| WO2019011982A1 (en) | Resin composition | |
| JP2017088732A (en) | Adhesive composition for the lamination of semiconductors | |
| JP2012041404A (en) | Fiber composite and method of producing the same | |
| CN118715261A (en) | Color stable epoxy composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20161208 Address after: 518101 Baoan District, Shenzhen, Xin'an, the streets of the District of the left side of the road on the road No. 68 convergence Innovation Park, building, room 511, room 2, A Applicant after: Shenzhen chemical semiconductor material Co., Ltd. Address before: 1068 No. 518055 Guangdong city in Shenzhen Province, Nanshan District City Xili University School Avenue Applicant before: Shenzhen Advanced Technology Research Inst. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |