CN104797075B - Arch PCB and its design method - Google Patents
Arch PCB and its design method Download PDFInfo
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- CN104797075B CN104797075B CN201410023599.0A CN201410023599A CN104797075B CN 104797075 B CN104797075 B CN 104797075B CN 201410023599 A CN201410023599 A CN 201410023599A CN 104797075 B CN104797075 B CN 104797075B
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- 238000013461 design Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 25
- 230000000694 effects Effects 0.000 abstract description 7
- 238000005452 bending Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
- Structure Of Printed Boards (AREA)
- Complex Calculations (AREA)
Abstract
The invention discloses the design methods of arch PCB a kind of, comprising: calculates the first radius and the second radius of arch PCB；The quantity and arch radius of the arch of the arch PCB are obtained according to first radius and second radius.The invention also discloses a kind of arch PCB.Plane PCB is formed by bending arch by the present invention, makes the volume-diminished of the said three-dimensional body formed between electronic component and arch PCB；To achieve the effect that beautify the arrangement of PCB appearance and electronic component, while the volume of PCB is reduced, improves user experience, space needed for reducing electronic equipment storage.
Description
Technical field
The present invention relates to PCB design field more particularly to arch PCB and its design methods.
Background technique
Since reform and opening-up, due to China human resources, market, in terms of preferential policy, attracted Europe
Factory is built up in China by the manufacturing extensive transfer of U.S., a large amount of electronic product and manufacturer, and has thus been driven and included
PCB(printed circuit board: Printed circuit board) including related industry development.It is counted according to Chinese CPCA, 2006
Year, China's PCB actual production reached 1.30 hundred million square metres, and the output value reaches 12,100,000,000 dollars, accounted for the 24.90% of the World PCB gross output value,
Become the first in the world more than Japan.Currently, PCB develops to double-deck and oar from single layer, and still keep respectively to develop
It is dynamic to manufacture development to the following PCB both at home and abroad since constantly to high-precision, high density and high reliability direction are developed for gesture
To discussion it is almost the same, i.e., to high density, high-precision, fine pore, thin wire is highly reliable, multiple stratification, high-speed transfer, light weight,
Slim direction is developed.Currently, since the complexity of electronic product is high, PCB problem in urgent need to solve is: how to pass through
Develop to PCB light and thin type direction, so that electronic product not continuous enlargement in volume while keeping supporting sophisticated functions.
Above content is only used to facilitate the understanding of the technical scheme, and is not represented and is recognized that above content is existing skill
Art.
Summary of the invention
The main purpose of the present invention is to provide arch PCB and its design methods, it is intended to by plane PCB Curved arching
Shape makes the volume-diminished of the said three-dimensional body formed between electronic component and arch PCB；To reach beautification PCB appearance and electricity
The effect of the arrangement of sub- component, while the volume of PCB is reduced, user experience is improved, electronic equipment storage institute is reduced
The space needed.
To achieve the above object, the design method of arch PCB provided by the invention, comprising:
Calculate the first radius and the second radius of arch PCB；
The quantity and arch radius of the arch of the arch PCB are obtained according to first radius and second radius.
Preferably, according between the height of electronic component to be installed, the arch PCB and the electronic component
Reserved gap obtains first radius；
Second radius is obtained according to arch PCB length.
Preferably, the quantity of the arch that the arch PCB is obtained according to first radius and second radius
And arch radius includes: when first radius is equal to second radius, the arch is a semi arch, and the arch
Shape radius is equal to first radius.
Preferably, the quantity of the arch that the arch PCB is obtained according to first radius and second radius
And arch radius further include: when first radius is greater than second radius, judge whether first radius is approximately equal to
Second radius:
It, will be between the arch PCB and the electronic component if first radius is approximately equal to second radius
Reserved gap fine tuning, and after making first radius be equal to second radius, the arch is a semicircle
Arc, and the arch radius is equal to first radius；
If first radius is not approximately equal to second radius, the arch is a minor arc, and the arch
Radius is greater than first radius.
Preferably, first radius is approximately equal to second radius specifically:
By the reserved gap fine tuning between the arch PCB and the electronic component, when first radius is equal to
Fine tuning amplitude when second radius is less than 10mm.
Preferably, the quantity of the arch that the arch PCB is obtained according to first radius and second radius
And arch radius further include: when first radius is less than second radius, judge second radius divided by described the
Whether can be rounded after Radius with its quotient:
It is if can be rounded with its quotient, the reserved gap between the arch PCB and the electronic component is micro-
Adjust, and make first radius be equal to second radius divided by the quotient after, the arch be and the quotient mesh phase
Same semi arch, and the arch radius is equal to first radius；
If cannot be rounded with its quotient, the arch be with the same number of minor arc of the quotient, and the arch radius is big
In first radius.
Preferably, second radius can be rounded divided by first radius with its quotient later specifically:
By the reserved gap fine tuning between the arch PCB and the electronic component, when first radius is equal to
Fine tuning amplitude when second radius is divided by the quotient is less than 10mm.
Preferably, the quantity of the arch that the arch PCB is obtained according to first radius and second radius
And arch radius includes: later to be bent plane PCB for arch PCB according to the quantity and arch radius of the arch.
Preferably, according to the quantity of the arch and arch radius by plane PCB bend for arch PCB include: make it is described
Arch seamless connection or seamed connection.
The present invention further provides a kind of arch PCB, are designed using the design method of the arch PCB.
The design method of arch PCB of the present invention includes: the first radius and the second radius for calculating arch PCB；According to described
First radius and second radius obtain the quantity and arch radius of the arch of the arch PCB.The present invention is curved by plane PCB
It is curved arched, make the volume-diminished of the said three-dimensional body formed between electronic component and arch PCB；To reach outside beautification PCB
The effect of sight and the arrangement of electronic component, while the volume of PCB is reduced, user experience is improved, reduces electronics and sets
Space needed for standby storage.
Detailed description of the invention
Fig. 1 is the flowage structure schematic diagram of the design method first embodiment of arch PCB of the present invention；
Fig. 2 is the flowage structure schematic diagram of the design method second embodiment of arch PCB of the present invention；
Fig. 3 is the structural schematic diagram of mono- embodiment of plane PCB before being bent into arch PCB of the present invention；
Fig. 4 is the structural schematic diagram of arch PCB first embodiment of the present invention；
Fig. 5 is the structural schematic diagram of arch PCB second embodiment of the present invention；
Fig. 6 is the structural schematic diagram of arch PCB 3rd embodiment of the present invention.
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific embodiment
Technical solution of the present invention is further illustrated with reference to the accompanying drawings and specific embodiments of the specification.It should be appreciated that this
Locate described specific embodiment to be only used to explain the present invention, be not intended to limit the present invention.
The present invention provides the design method of arch PCB a kind of.
Referring to Fig.1, Fig. 1 is the flowage structure schematic diagram of the design method first embodiment of arch PCB of the present invention；The present invention
It is mainly used for the arch PCB how plane PCB is formed by bending meet demand by design, the design method of arch PCB includes:
Step S100 calculates the first radius r and the second radius R of arch PCB；Preferably, referring to Fig. 3 and Fig. 4, Fig. 3
For the structural schematic diagram for being bent into mono- embodiment of plane PCB before arch PCB of the present invention；Fig. 4 is that arch PCB first of the present invention is real
Apply the structural schematic diagram of example；The length of the plane PCB is L, width W；The height of electronic component to be installed is H, arch
PCB is with a thickness of T, in the present embodiment, according to the height H of electronic component to be installed, the arch PCB and the electronics member device
Reserved gap I between part obtains the first radius r；And r=H+ Δ H, in above-mentioned formula Δ H include but is not limited to be institute
The reserved gap I between arch PCB and the electronic component is stated, the thickness T of the arch PCB can also be added,
That is, in an alternative embodiment of the invention, height H, the arch PCB of the first radius r by electronic component to be installed
Thickness T and the arch PCB and the electronic component between reserved gap I calculate, and the sum of for above three,
Namely r=H+T+I.In the present embodiment, the second radius R is obtained according to arch PCB length L；The second radius R is by arch
(since the arch PCB is formed by bending by the plane PCB, arch PCB length is equal to the plane to PCB length herein
The length L of PCB) it calculates, and be arch PCB length divided by pi namely R=L/ π.
Step S200 obtains the quantity N of the arch of the arch PCB according to the first radius r and the second radius R
And arch radius A.
The present embodiment obtains the quantity N of the arch of the arch PCB according to the first radius r and the second radius R
And after arch radius A, plane PCB is formed by bending arch, makes the body of the said three-dimensional body formed between electronic component and arch PCB
Product reduces；To achieve the effect that beautify the arrangement of PCB appearance and electronic component, while the volume of PCB is reduced, improved
User experience, space needed for reducing electronic equipment storage.
It is the flowage structure schematic diagram of the design method second embodiment of arch PCB of the present invention referring to Fig. 2, Fig. 2；The step
The quantity N and arch half of the arch of the arch PCB are obtained in rapid S200 according to the first radius r and the second radius R
Diameter A includes: step S201, judges whether the first radius r is equal to the second radius R:
When the first radius r is equal to the second radius R, that is, S202 is entered step when r=R, it is optimal at this time
Embodiment is that design the arch be a semi arch, and the arch radius A is equal to the first radius r namely A=r=R.
When the first radius r and be not equal to the second radius R when, that is, entering step 203 when r ≠ R, judge institute
State whether the first radius r is greater than the second radius R:
When the first radius r is greater than the second radius R, that is, enter step 204 when r > R, described the is judged
Whether Radius r is approximately equal to the second radius R: if the first radius r is approximately equal to the second radius R, that is, r ≈ R
When, the first radius r is greater than the second radius R and the first radius r and the second radius R and is closer to, then into
Enter step 205, the reserved gap I between the arch PCB and the electronic component is finely tuned, and makes described the
After Radius r is equal to the second radius R, the arch can be used as optimal consideration and be designed as a semi arch, and the arch
Shape radius A is equal to the first radius r, at this point, A=r=R；Certainly, if the arch can also be set if actual conditions need
It is calculated as a minor arc, at this point, A > r.
If the first radius r is not approximately equal to the second radius R, that is, the first radius r is greater than described second
Radius R and the first radius r be greater than the second radius R it is more when, if continuing the arch being bent into one and half at this time
If circular arc, it is larger to occupy volume, therefore 206 can be entered step in the present embodiment, the arch is a minor arc, and the arch
Shape radius A is greater than the first radius r, at this point, A > r.Certainly, if actual conditions need and the case where not considering its volume
Under, the reserved gap I between the arch PCB adjustable at this time and the electronic component simultaneously makes described first
Radius r is equal to the second radius R, and is a semi arch by the arch design, at this point, A=r=R.
Preferably, the first radius r described in above-described embodiment is approximately equal to the second radius R specifically: by the arch
Reserved gap I fine tuning between shape PCB and the electronic component, when the first radius r is equal to the second radius R
Fine tuning amplitude be less than 10mm.That is, when the reserved gap I between the arch PCB and the electronic component finely tunes width
Degree be less than 10mm when, so that it may so that the first radius r be equal to the second radius R, then illustrate the second radius R divided by
It can be rounded after the first radius r with its quotient.But in the present invention, the fine tuning amplitude is not limited to be less than 10mm,
Or greater than 0mm any number, if can achieve the effect that so that the electronic component rational deployment on arch PCB i.e.
Can, for example, the fine tuning amplitude may be less than 8mm, 9mm, 12mm etc..
When the first radius r is less than the second radius R, that is, enter step 207 when r < R, described the is judged
Whether two radius R after the first radius r with its quotient divided by that can be rounded, at this point, due to R/r=N+ remainder:
If can be rounded with its quotient, that is, when remainder is smaller, R/r ≈ N enters step 208 at this time, by the arch PCB
Reserved gap I fine tuning between the electronic component, and the first radius r is made to be equal to second radius
After R is divided by the quotient, that is, when R/r=N, the arch is and the same number of semi arch of the quotient, and the arch half
Diameter A is equal to the first radius r, at this point, R/N=r=A；Certainly, if the arch can also design if actual conditions need
For less than N number of semi arch or minor arc, at this point, A > R/N；Alternatively, may be designed in N number of minor arc, equally there is A > R/N at this time.
If cannot be rounded with its quotient, that is, then entering step 209 when remainder is larger, the arch is and the quotient
The identical minor arc of mesh, that is, R/r=N, but the arch radius A is greater than the first radius r, that is, A > r.Certainly, if it is real
Border situation needs and in the case where not considering its volume, the arch PCB adjustable at this time and the electronic component it
Between the reserved gap I and make the first radius r be equal to the second radius R divided by the quotient, and by the arch
Shape is designed as N number of semi arch, at this point, still have R/r=N,；It is either less than N number of semi arch or bad by the arch design
Arc, at this point, A > R/N.
Preferably, the second radius R can be rounded tool divided by after the first radius r with its quotient in the present embodiment
Body are as follows: finely tune the reserved gap I between the arch PCB and the electronic component, when the first radius r is equal to institute
Fine tuning amplitude of the second radius R divided by the quotient when is stated less than 10mm, that is, when the arch PCB and the electronic component
Between reserved gap I fine tuning amplitude when being less than 10mm, so that it may so that the first radius r is equal to the second radius R,
Then illustrate that the second radius R can be rounded divided by the first radius r with its quotient later.But in the present invention, the fine tuning
Amplitude is not limited to be less than 10mm, or any number greater than 0mm, as long as the electricity so that on arch PCB can be reached
The effect of sub- component rational deployment, for example, the fine tuning amplitude may be less than 8mm, 9mm, 12mm etc..
Further, as shown in Figures 4 to 6, Fig. 5 is the structural schematic diagram of arch PCB second embodiment of the present invention；Fig. 6
For the structural schematic diagram of arch PCB 3rd embodiment of the present invention；It is described to be obtained according to the first radius r and the second radius R
It out include: the quantity N and arch radius A according to the arch after the quantity N and arch radius A of the arch of the arch PCB
Plane PCB is bent as arch PCB.It is the cross sectional shape of the arch PCB formed after bending in fig. 4 to fig. 6, and as in Fig. 5
Shown, it includes: to make the arch that the quantity N and arch radius A according to the arch, which bends plane PCB for arch PCB,
Seamless connection or seamed connection；That is, can be mutually linked as shown in Fig. 4 right part between arch on the arch PCB close
Seamless connection, the state are perfect condition；And in the case where condition does not allow, it can also be spaced as needed as shown in Figure 5
Certain gap K, at this time when calculating the second radius R, the length L of the plane PCB needs to subtract among the arch
Had the gap K, that is, R=[L- (N-1) K]/π.Certainly, in other embodiments, interval K can not also be identical, counts at this time
When calculating the second radius R, using R=[L-(K0+K1+...+KN-1)]/π.
The present invention further provides a kind of arch PCB, are designed using the design method of the arch PCB.According to
The height and arrangement mode of electronic component, it may be considered that identical height section concentrates arrangement mode, as shown in fig. 6, of the invention
The combination that can be designed that the arch PCB of Length discrepancy radius and be made by various difference arch PCB.
The present embodiment obtains the quantity N of the arch of the arch PCB according to the first radius r and the second radius R
And after arch radius A, plane PCB is formed by bending arch, makes the body of the said three-dimensional body formed between electronic component and arch PCB
Product reduces；To achieve the effect that beautify the arrangement of PCB appearance and electronic component, while the volume of PCB is reduced, improved
User experience, space needed for reducing electronic equipment storage；It is long shared by PCB under the premise of not changing PCB occupancy height
Degree obviously becomes smaller, and whole occupied space can be obviously reduced.It can be with root according to the design method of this arch PCB of the present invention
According to the height of electronic component, the arch PCB of Length discrepancy radius is designed, and then designs the smaller electronic product of volume, and
These electronic products can possess appearance more small and exquisite out under the theory of arch PCB, not only reduced volume but also increased aesthetic feeling.
The above description is only a preferred embodiment of the present invention, is not intended to limit its scope of the patents, all to utilize the present invention
Equivalent structure or equivalent flow shift made by specification and accompanying drawing content is directly or indirectly used in other relevant technology necks
Domain is included within the scope of the present invention.
Claims (8)
1. a kind of design method of arch PCB characterized by comprising
According to the reserved gap between the height of electronic component to be installed, the arch PCB and the electronic component
Obtain the first radius；
The second radius is obtained according to arch PCB length；
The quantity and arch radius of the arch of the arch PCB are obtained according to first radius and second radius；
When first radius be greater than second radius when, arch quantity be one, and according to first radius with it is described
The difference of second radius determines arch radius；
It is true divided by the quotient of first radius according to second radius when first radius is less than second radius
Determine arch quantity and arch radius.
2. the design method of arch PCB as described in claim 1, which is characterized in that described according to first radius and institute
State the second radius obtain the arch PCB arch quantity and arch radius include: when first radius is equal to described the
When two radiuses, the arch is a semi arch, and the arch radius is equal to first radius.
3. the design method of arch PCB as described in claim 1, which is characterized in that described when first radius is greater than institute
When stating the second radius, arch quantity is one, and determines arch half according to the difference of first radius and second radius
After the step of diameter, further includes: judge whether first radius is approximately equal to second radius；
It, will be pre- between the arch PCB and the electronic component if first radius is approximately equal to second radius
The gap fine tuning stayed, and make first radius equal to after second radius, the arch is a semi arch, and
The arch radius is equal to first radius；
If first radius is not approximately equal to second radius, the arch is a minor arc, and the arch radius
Greater than first radius.
4. the design method of arch PCB as claimed in claim 3, which is characterized in that by first radius adjustment to equal than
Fine tuning amplitude when second radius is less than 10mm.
5. the design method of arch PCB as described in claim 1, which is characterized in that described when first radius is less than institute
When stating the second radius, arch quantity and arch radius are determined divided by the quotient of first radius according to second radius
After step, further includes: judge whether second radius can be rounded divided by first radius with its quotient later；
If can be rounded with its quotient, the reserved gap between the arch PCB and the electronic component is finely tuned, and
So that after first radius is equal to second radius divided by the quotient, the arch is and the quotient the same number of half
Circular arc, and the arch radius is equal to first radius；
If cannot be rounded with its quotient, the arch be with the same number of minor arc of the quotient, and the arch radius be greater than institute
State the first radius.
6. the design method of arch PCB as claimed in claim 5, which is characterized in that by first radius adjustment to equal than
Fine tuning amplitude when second radius is divided by the quotient is less than 10mm.
7. the design method of arch PCB as described in claim 1, which is characterized in that described according to first radius and institute
State the second radius obtain the arch PCB arch quantity and arch radius after include: according to the quantity of the arch and
Arch radius bends plane PCB for arch PCB.
8. the design method of arch PCB as claimed in claim 7, which is characterized in that according to the quantity and arch of the arch
It includes: to make the arch seamless connection or seamed connection that radius, which bends plane PCB for arch PCB,.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410023599.0A CN104797075B (en) | 2014-01-17 | 2014-01-17 | Arch PCB and its design method |
| JP2016546960A JP6608371B2 (en) | 2014-01-17 | 2014-06-06 | Arched PCB and design method thereof |
| KR1020167022211A KR102153774B1 (en) | 2014-01-17 | 2014-06-06 | Arched pcb and design method thereof |
| PCT/CN2014/079408 WO2015106528A1 (en) | 2014-01-17 | 2014-06-06 | Arched pcb and design method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410023599.0A CN104797075B (en) | 2014-01-17 | 2014-01-17 | Arch PCB and its design method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104797075A CN104797075A (en) | 2015-07-22 |
| CN104797075B true CN104797075B (en) | 2019-02-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410023599.0A Active CN104797075B (en) | 2014-01-17 | 2014-01-17 | Arch PCB and its design method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6608371B2 (en) |
| KR (1) | KR102153774B1 (en) |
| CN (1) | CN104797075B (en) |
| WO (1) | WO2015106528A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206559732U (en) * | 2017-01-24 | 2017-10-13 | 深圳视爵光旭电子有限公司 | A kind of device and LED modules for bent plate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1515013A (en) * | 2001-06-07 | 2004-07-21 | ��ʽ�����ٲ� | Metal dome sheet, its mfg. method, and metal dome system |
| CN101176389A (en) * | 2005-05-16 | 2008-05-07 | 泰瑞达公司 | Impedance controlled via structure |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0396062U (en) * | 1990-01-21 | 1991-10-01 | ||
| JP2001244667A (en) | 2000-02-25 | 2001-09-07 | Sony Corp | Electronic circuit device |
| SG157957A1 (en) * | 2003-01-29 | 2010-01-29 | Interplex Qlp Inc | Package for integrated circuit die |
| JP2006040265A (en) | 2004-06-25 | 2006-02-09 | Matsushita Electric Ind Co Ltd | Flexible substrate design support apparatus, method, and program |
| US20070139961A1 (en) * | 2005-12-19 | 2007-06-21 | Cheah Chun H | Method and apparatus employing a heat sink, a flexible printed circuit conformed to at least part of the heat sink, and a light source attached to the flexible printed circuit |
| JP2013074166A (en) * | 2011-09-28 | 2013-04-22 | Oki Electric Cable Co Ltd | Flexible printed board and manufacturing method of the same |
-
2014
- 2014-01-17 CN CN201410023599.0A patent/CN104797075B/en active Active
- 2014-06-06 WO PCT/CN2014/079408 patent/WO2015106528A1/en active Application Filing
- 2014-06-06 KR KR1020167022211A patent/KR102153774B1/en active Active
- 2014-06-06 JP JP2016546960A patent/JP6608371B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1515013A (en) * | 2001-06-07 | 2004-07-21 | ��ʽ�����ٲ� | Metal dome sheet, its mfg. method, and metal dome system |
| CN101176389A (en) * | 2005-05-16 | 2008-05-07 | 泰瑞达公司 | Impedance controlled via structure |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015106528A1 (en) | 2015-07-23 |
| JP2017507480A (en) | 2017-03-16 |
| JP6608371B2 (en) | 2019-11-20 |
| CN104797075A (en) | 2015-07-22 |
| KR102153774B1 (en) | 2020-09-09 |
| KR20160110461A (en) | 2016-09-21 |
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