CN104796588B - camera module - Google Patents

Abstract

A camera module includes a flexible circuit board, a ceramic substrate, electronic components, an image sensor, an optical filter and a lens module. The ceramic substrate has a top surface and a bottom surface opposite to the top surface, a plurality of first grooves spaced apart from each other are provided on the bottom surface, a second groove is provided in the middle of the top surface of the ceramic substrate, and a through hole is provided at the bottom of the second groove. The hole or the third groove, the plurality of first grooves surround the through hole or the third groove. The electronic components are housed in the first groove, and the first groove is opened on the bottom surface of the ceramic substrate for accommodation, so it can effectively prevent the electronic components from being hit by the glue needle when the glue is drawn on the production line, thereby effectively avoiding the generation of debris. Improve the imaging quality of the camera module.

Description

camera module

technical field

The invention relates to the technical field of cameras, in particular to a camera module.

Background technique

In recent years, with the development of multimedia technology, the application range of camera modules has become wider and wider, and has been widely used in electronic products such as mobile phones, computers, and miniature cameras.

A camera module usually includes a lens module, a base, an infrared cut filter, an image sensor (sensor), electronic components, and a circuit board. The electronic components generally include capacitors and resistors, which mainly serve as auxiliary supplementary voltages. In the traditional camera module structure, the image sensor and electronic components are placed on the circuit board and accommodated in the inner cavity of the base. When the size of the image sensor is large, the space for placing the electronic components is small, so the electronic components are placed close to the periphery of the circuit board, that is, the distance between the electronic components and the side wall of the inner cavity of the base is very close. When drawing glue on the production line, there is a risk that the glue needle will hit the electronic components. Once it hits the electronic components, a lot of debris will be generated. This kind of debris is difficult to remove, and in severe cases, it will affect the image quality.

Contents of the invention

Based on this, it is necessary to address the above problems and provide a camera module that can effectively avoid the striker phenomenon and eliminate debris.

A camera module, comprising:

A flexible circuit board has a mounting surface and a back surface opposite to the mounting surface;

The ceramic substrate is arranged on the flexible circuit board through an anisotropic conductive adhesive film, the ceramic substrate has a top surface and a bottom surface opposite to the top surface, and the bottom surface is provided with a plurality of first grooves spaced apart from each other, The middle part of the top surface of the ceramic substrate is provided with a second groove, and the bottom of the second groove is provided with a through hole or a third groove, and the plurality of first grooves surround the through hole or the third groove. groove;

an electronic component housed in the first groove and electrically connected to the flexible circuit board;

an image sensor, disposed in the through hole or at the bottom of the third groove, the image sensor is electrically connected to the flexible circuit board;

a filter disposed at the bottom of the second groove; and

The lens module is arranged on the top surface of the ceramic substrate.

In one embodiment, when a through hole is opened at the bottom of the second groove, the surface of the image sensor facing away from the photosensitive surface is adhered to the installation surface of the flexible circuit board through an adhesive layer.

In one of the embodiments, a step is formed on the side wall of the through hole, the photosensitive surface of the image sensor includes a photosensitive area and a non-photosensitive area arranged around the photosensitive area, and the non-photosensitive area is provided with multiple a first welding pad arranged at intervals, a second welding pad corresponding to the first welding pad is arranged on the step, and the two ends of the conductive wire are respectively connected to the first welding pad and the second welding pad The electrical connection between the image sensor and the flexible circuit board is realized, and the surface of the step is arranged flush with the photosensitive surface of the image sensor.

In one embodiment, when a third groove is formed at the bottom of the second groove, the surface of the image sensor facing away from the photosensitive surface is adhered to the bottom of the third groove through an adhesive layer.

In one embodiment, the image sensor includes a photosensitive area and a non-photosensitive area arranged around the photosensitive area, a plurality of first welding pads arranged at intervals are arranged on the non-photosensitive area, and the third groove The bottom of the image sensor is provided with a second welding pad corresponding to the first welding pad, and the two ends of the conductive wire are respectively connected to the first welding pad and the second welding pad to realize the connection between the image sensor and the second welding pad. The electrical connection of the flexible circuit board.

In one embodiment, the conductive wires are gold wires.

In one of the embodiments, the filter is an infrared cut filter.

In one embodiment, the flexible circuit board includes a body and an extension formed by extending one side of the body, the ceramic substrate is disposed on the body, and the extension end of the flexible circuit board is provided with a connector.

In one of the embodiments, the lens module includes a lens support element and a lens, and the lens is assembled in the lens support element.

In one embodiment, the lens supporting element is a plastic lens mount, a voice coil motor or a micro-electro-mechanical system.

The above-mentioned camera module has at least the following advantages:

Because the electronic components are accommodated in the first groove, and the first groove is opened on the bottom surface of the ceramic substrate for accommodation, it can effectively prevent the electronic components from being hit by the glue needle when the glue is drawn on the production line, thereby effectively avoiding the generation of debris , improving the imaging quality of the camera module. At the same time, compared with the traditional camera module, the above-mentioned camera module omits the base, and directly sinters the ceramic substrate into a structure with the first groove, the second groove and the third groove or through holes, The image sensor is arranged in the through hole or the bottom of the third groove, and the optical filter is arranged in the bottom of the second groove, so the total height of the camera module can be effectively reduced. In addition, the above-mentioned camera module can directly assemble the lens module to the top surface of the ceramic substrate after painting the glue on the top surface of the ceramic substrate, which saves the process of assembling after painting the glue once, and can effectively improve the flatness of the camera module. .

Description of drawings

Fig. 1 is a sectional view of a camera module in an embodiment;

Fig. 2 is a partial schematic diagram of another viewing angle of the camera module shown in Fig. 1;

Fig. 3 is a partial schematic diagram in another embodiment shown in Fig. 2;

FIG. 4 is a cross-sectional view of a camera module in another embodiment.

Detailed ways

In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Please refer to FIG. 1 , which is a camera module 100 in an embodiment. The camera module 100 includes a flexible circuit board 110 , a ceramic substrate 120 , an electronic component 130 , an image sensor 140 , a filter 150 , a lens module 160 and a connector 170 .

The flexible circuit board 110 has a mounting surface 111 and a back surface 112 opposite to the mounting surface 111 . In this embodiment, the ceramic substrate 120 , the electronic component 130 , the image sensor 140 , the optical filter 150 , the lens module 160 and the connector 170 are all located on the same side of the mounting surface 111 . The flexible circuit board 110 includes a body and an extension extending from one side of the body, the ceramic substrate 120 is disposed on the body, and the connector 170 is disposed on the extension.

The ceramic substrate 120 is disposed on the flexible circuit board 110 through an anisotropic conductive film 180 (Anisotropic Conductive Film; ACF). Please refer to FIG. 2 together. The ceramic substrate 120 has a top surface 120a and a bottom surface 120b opposite to the top surface 120a. The bottom surface 120b is provided with a plurality of first grooves 121 spaced apart from each other. The electronic components 130 are housed in the first grooves. In 121 , the lower surface of the electronic component 130 is directly electrically connected to the flexible circuit board 110 through the anisotropic conductive adhesive film 180 . The electronic components 130 are mainly capacitors and resistors, and a capacitor or resistor is accommodated in a first groove 121 of a corresponding size.

A second groove 122 is defined in the middle of the top surface 120 a of the ceramic substrate 120 , and the second groove 122 is used for accommodating the optical filter 150 . A through hole 123 is defined at the bottom of the second groove 122 , and the size of the through hole 123 is smaller than that of the second groove 122 . The plurality of first grooves 121 surround the through hole 123 . Specifically, in this embodiment, the plurality of first grooves 121 are arranged around the through hole 123 , so as to partially surround the through hole 123 . Please refer to FIG. 3 , in other embodiments, a plurality of first grooves 121 are disposed around the through hole 123 , so as to completely surround the through hole 123 .

The image sensor 140 is disposed in the through hole 123 , and the image sensor 140 is electrically connected to the flexible circuit board 110 . Specifically in this embodiment, the surface of the image sensor 140 facing away from the photosensitive surface is adhered to the installation surface 111 of the flexible circuit board 110 through the adhesive layer 190 . The photosensitive surface of the image sensor 140 includes a photosensitive area and a non-photosensitive area arranged around the photosensitive area, and a plurality of first welding pads arranged at intervals are arranged on the non-photosensitive area.

A step 1231 is formed on the sidewall of the through hole 123 , and the height of the step 1231 may be equal to the thickness of the image sensor 140 . A second welding pad corresponding to the first welding pad is provided on the step 1231 , and the image sensor 140 is electrically connected to the flexible circuit board 110 by connecting the two ends of the conductive wire 124 to the first welding pad and the second welding pad respectively. Specifically, the conductive wire 124 may be a gold wire. Of course, other metal wires with better electrical conductivity may also be used. Preferably, the mesa of the step 1231 is set flush with the photosensitive surface of the image sensor 140 , which reduces the distance for connecting conductive wires and reduces the cost.

Please refer to FIG. 1 again, the filter 150 is disposed at the bottom of the second groove 122 . Because the size of the second groove 122 is larger than the size of the through hole 123 , when the filter 150 is disposed at the bottom of the second groove 122 , the filter 150 covers the through hole 123 . The filter 150 may specifically be an infrared cut filter.

The lens module 160 is disposed on the top surface 120 a of the ceramic substrate 120 . Specifically, glue can be drawn on the top surface 120a of the ceramic substrate 120 by means of glue needle painting, and then the lens module 160 can be attached to the surface to complete the assembly. The lens module 160 includes a lens support component 161 and a lens 162 , and the lens 162 is assembled in the lens support component 161 . Specifically, the lens supporting element 161 can be a plastic lens mount, a voice coil motor or a micro-electro-mechanical system.

The aforementioned camera module 100 has at least the following advantages:

Because the electronic component 130 is accommodated in the first groove 121, and the first groove 121 is opened on the bottom surface 120b of the ceramic substrate 120 for accommodating, so the electronic component 130 can be effectively prevented from being hit by the glue needle when the glue is drawn on the production line. Therefore, debris can be effectively avoided, and the imaging quality of the camera module 100 can be improved. At the same time, compared with the traditional camera module 100, the above-mentioned camera module 100 omits the base, and directly sinters the ceramic substrate 120 into a structure having the first groove 121, the second groove 122 and the through hole 123. , the image sensor 140 is disposed in the through hole 123 , and the optical filter 150 is disposed at the bottom of the second groove 122 , so the overall height of the camera module 100 can be effectively reduced. In addition, the above-mentioned camera module 100 can directly assemble the lens module 160 on the top surface 120a of the ceramic substrate 120 after painting the glue on the top surface 120a of the ceramic substrate 120, which saves the process of assembling after painting the glue once, and can effectively Improve the flatness of the camera module 100 .

Please refer to FIG. 4 , which is a camera module 200 in another embodiment. In this embodiment, the camera module 200 includes a flexible circuit board 210 , a ceramic substrate 220 , an electronic component 230 , an image sensor 240 , a filter 250 , a lens module 260 and a connector 270 .

The flexible circuit board 210 has a mounting surface 211 and a back surface 212 opposite to the mounting surface 211 . In this embodiment, the ceramic substrate 220 , the electronic component 230 , the image sensor 240 , the optical filter 250 , the lens module 260 and the connector 270 are all located on the same side of the mounting surface 211 . The flexible circuit board 210 includes a body and an extension extending from one side of the body, the ceramic substrate 220 is disposed on the body, and the connector 270 is disposed on the extension.

The ceramic substrate 220 is disposed on the flexible circuit board 210 through the anisotropic conductive adhesive film 280 . The ceramic substrate 220 has a top surface 220a and a bottom surface 220b opposite to the top surface 220a. The bottom surface 220b is provided with a plurality of first grooves 221 spaced apart from each other. The electronic components 230 are accommodated in the first grooves 221. The electronic components 230 The lower surface is directly electrically connected to the flexible circuit board 210 through the anisotropic conductive adhesive film 280 . The electronic components 230 are mainly capacitors and resistors, and a capacitor or resistor is accommodated in a first groove 221 of a corresponding size.

A second groove 222 is defined in the middle of the top surface 220 a of the ceramic substrate 220 , and the second groove 222 is used for accommodating the optical filter 250 . A third groove 223 is defined at the bottom of the second groove 222 , and the size of the third groove 223 is smaller than that of the second groove 222 . The plurality of first grooves 221 surround the third groove 223 , specifically in this embodiment, the plurality of first grooves 221 are arranged around the third groove 223 , so as to partially surround the third groove 223 . In other embodiments, the plurality of first grooves 221 are disposed around the third groove 223 , so as to be completely surrounded by the third groove 223 .

The image sensor 240 is disposed at the bottom of the third groove 223 , and the image sensor 240 is electrically connected to the flexible circuit board 210 . Specifically in this embodiment, the surface of the image sensor 240 facing away from the photosensitive surface is adhered to the bottom of the third groove 223 through the adhesive layer 290 . The photosensitive surface of the image sensor 240 includes a photosensitive area and a non-photosensitive area arranged around the photosensitive area, and a plurality of first welding pads arranged at intervals are arranged on the non-photosensitive area.

The bottom of the third groove 223 surrounds the image sensor 240 and is provided with a second welding pad corresponding to the first welding pad, and the two ends of the conductive wire 224 are respectively connected with the first welding pad and the second welding pad to realize the connection between the image sensor 240 and the second welding pad. The electrical connection of the flexible circuit board 210 . Specifically, the conductive wire 224 may be a gold wire. Of course, other metal wires with better electrical conductivity may also be used.

The filter 250 is disposed at the bottom of the second groove 222 . Because the size of the second groove 222 is larger than the size of the through hole, when the filter 250 is disposed at the bottom of the second groove 222 , the filter 250 covers the through hole. The filter 250 may specifically be an infrared cut filter.

The lens module 260 is disposed on the top surface 220 a of the ceramic substrate 220 . Specifically, glue can be drawn on the top surface 220a of the ceramic substrate 220 by means of glue needle painting, and then the lens module 260 can be attached to the surface to complete the assembly. The lens module 260 includes a lens support component 261 and a lens 262 , and the lens 262 is assembled in the lens support component 261 . Specifically, the lens supporting element 261 can be a plastic lens mount, a voice coil motor or a micro-electro-mechanical system.

The aforementioned camera module 200 has at least the following advantages:

Because the electronic component 230 is accommodated in the first groove 221, and the first groove 221 is opened on the bottom surface 220b of the ceramic substrate 220 for accommodating, so the electronic component 230 can be effectively prevented from being hit by the glue needle when the glue is drawn on the production line. In this way, debris can be effectively avoided, and the imaging quality of the camera module 200 can be improved. At the same time, compared with the traditional camera module 200, the above-mentioned camera module 200 omits the base, and directly sinters the ceramic substrate 220 to have the first groove 221, the second groove 222 and the third through hole 223. According to the structure, the image sensor 240 is disposed at the bottom of the third groove 223 , and the optical filter 250 is disposed at the bottom of the second groove, so the total height of the camera module 200 can be effectively reduced. In addition, the above-mentioned camera module 200 can directly assemble the lens module 260 on the top surface 220a of the ceramic substrate 220 after painting the glue on the top surface 220a of the ceramic substrate 220, which saves a process of assembling after painting the glue, which can effectively Improve the flatness of the camera module 200.

The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the present invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (10)

1. A camera module, characterized in that, comprising: A flexible circuit board has a mounting surface and a back surface opposite to the mounting surface; The ceramic substrate is arranged on the flexible circuit board through an anisotropic conductive adhesive film, the ceramic substrate has a top surface and a bottom surface opposite to the top surface, and the bottom surface is provided with a plurality of first grooves spaced apart from each other, The middle part of the top surface of the ceramic substrate is provided with a second groove, and the bottom of the second groove is provided with a through hole or a third groove, and the plurality of first grooves surround the through hole or the third groove. a groove, the first groove is not connected to the second groove, the through hole and the third groove; The electronic component is accommodated in the first groove and electrically connected to the flexible circuit board, and the lower surface of the electronic component is directly electrically connected to the flexible circuit board through the anisotropic conductive adhesive film. The electronic components are housed in one of the first grooves; an image sensor, disposed in the through hole or at the bottom of the third groove, the image sensor is electrically connected to the flexible circuit board; a filter disposed at the bottom of the second groove; and The lens module is arranged on the top surface of the ceramic substrate. 2. The camera module according to claim 1, wherein when a through hole is opened at the bottom of the second groove, the surface of the image sensor facing away from the photosensitive surface is adhered to the surface of the image sensor through an adhesive layer. The mounting surface of the flexible circuit board described above. 3. The camera module according to claim 2, wherein a step is formed on the side wall of the through hole, and the photosensitive surface of the image sensor includes a photosensitive area and a non-photosensitive area arranged around the photosensitive area , the non-photosensitive area is provided with a plurality of first welding pads arranged at intervals, the second welding pad corresponding to the first welding pad is arranged on the step, and the two ends of the conductive wire are respectively connected to the The first welding pad is connected to the second welding pad to realize the electrical connection between the image sensor and the flexible circuit board, and the surface of the step is flush with the photosensitive surface of the image sensor. 4. The camera module according to claim 1, wherein when a third groove is opened at the bottom of the second groove, the surface of the image sensor facing away from the photosensitive surface is adhered by an adhesive layer at the bottom of the third groove. 5. The camera module according to claim 4, wherein the image sensor comprises a photosensitive area and a non-photosensitive area arranged around the photosensitive area, and the non-photosensitive area is provided with a plurality of spaced first A welding pad, the bottom of the third groove surrounds the image sensor and is provided with a second welding pad corresponding to the first welding pad, and the two ends of the conductive wire are respectively connected to the first welding pad and the second welding pad. The two pads are connected to realize the electrical connection between the image sensor and the flexible circuit board. 6. The camera module according to claim 3 or 5, wherein the conductive wires are gold wires. 7. The camera module according to claim 1, wherein the filter is an infrared cut filter. 8. The camera module according to claim 1, wherein the flexible circuit board includes a main body and an extension end formed by extending one side of the main body, the ceramic substrate is arranged on the main body, and the flexible circuit board The extended end of the circuit board is provided with a connector. 9. The camera module according to claim 1, wherein the lens module comprises a lens support element and a lens, and the lens is assembled in the lens support element. 10 . The camera module according to claim 9 , wherein the lens supporting element is a plastic lens mount, a voice coil motor or a micro-electro-mechanical system. 11 .