CN104767572B - Interstage testing device of wireless communication device - Google Patents

Abstract

The present invention provides an inter-stage test device for a wireless communication device. The wireless communication device has a component to be tested and a lower-level component. The component to be tested is electrically connected to the lower-level component through a signal line. The inter-stage test device is arranged on the signal line and electrically connects the component to be tested and the lower-level component. The inter-stage test device includes an upper plate, a lower plate, and an intermediate layer. The intermediate layer is arranged between the upper plate and the lower plate. The intermediate layer includes a first block and a second block. The first block is used to generate air impedance. The second block is used to generate an adjustable impedance. Thereby, the inter-stage test device can detect the condition of the component to be tested in the wireless communication device according to the air impedance and the adjustable impedance.

Description

Inter-stage test setup for wireless communication devices

technical field

The present invention provides an inter-stage test device, and in particular relates to an inter-stage test device for a wireless communication device, which is used for testing the status of components in the wireless communication device.

Background technique

Wireless communication (wireless communication) has become a design trend of mobile products in terms of current technology. Wireless communication components are generally set in a system chip (System on Chip, referred to as SoC), so that the system chip can miniaturize and modularize the circuit of the wireless communication component, and integrate the required functional components into a single chip. A wireless communication device is formed to meet the requirements of today's mobile products.

However, due to the large number of functional components in the wireless communication device, if a certain functional component in the wireless communication device is defective, it is not easy for a general detection instrument to detect which functional component is defective. In order to ensure the normal function of the wireless communication device, it is known that if the performance of the wireless communication device is found to be poor or a certain functional element is defective, the entire system chip is discarded, which is wasteful.

Contents of the invention

In view of this, the present invention provides an inter-stage testing device for a wireless communication device. The interstage testing device can detect the condition of the components in the wireless communication device, and replace the defective or damaged components when the interstage testing device detects them. In this way, the user only needs to replace defective or damaged components in the wireless communication device without discarding the entire wireless communication device, which can greatly reduce the manufacturing cost.

An embodiment of the present invention provides an inter-stage test device for a wireless communication device. The wireless communication device is provided with a component to be tested, an upper ground wire, a signal wire, a lower ground wire, and a lower element. The components to be tested are electrically connected to the lower components through the upper ground wire, the signal wire and the lower ground wire respectively. The interstage test device includes an upper board, a lower board, and an interposer. The first ground electrode of the lower plate is electrically connected to the first ground terminal of the component under test and the third ground terminal of the lower component through the upper ground wire. The lower board signal electrode of the lower board is electrically connected to the signal terminal to be tested of the component to be tested and the lower signal terminal of the lower level component through the signal line. And the second ground electrode of the lower board is electrically connected to the second ground terminal of the element under test and the fourth ground terminal of the lower element through the lower ground wire. The intermediary layer is arranged between the upper board and the lower board. The intermediary layer includes a first block and a second block, and the first block is adjacent to the second block. The first block has an air cavity, and the air cavity contacts the lower board to generate a fixed air resistance. The second block has an impedance adjustment cavity, and the impedance adjustment cavity contacts the lower board. Wherein, the impedance adjusting cavity has conductive glue, a grounding plate, a substrate layer, and a metal plate. The conductive glue is arranged on the lower plate to electrically connect the ground plate to the first ground electrode and the second ground electrode. A ground plane, a substrate layer, and a metal plate are sequentially stacked on the conductive glue. The substrate layer has a predetermined thickness, so as to generate adjusted impedance according to the predetermined thickness.

Based on the above, the inter-stage testing device of the wireless communication device provided by the embodiment of the present invention can detect the condition of the DUT in the wireless communication device according to the air impedance and the impedance ratio between the adjusted impedances.

In order to enable a further understanding of the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention, but these descriptions and accompanying drawings are only used to illustrate the present invention, rather than claiming the rights of the present invention Any limitations on the scope are required.

Description of drawings

FIG. 1A is a schematic diagram of a wireless communication device according to an embodiment of the present invention.

FIG. 1B is a schematic diagram of an interstage test device testing a DUT in a wireless communication device according to an embodiment of the present invention.

FIG. 2A is an exploded view of an interstage testing device according to an embodiment of the present invention.

FIG. 2B is an exploded view of an interposer according to an embodiment of the present invention.

FIG. 3A is an exploded view of an interstage test device according to another embodiment of the present invention.

Fig. 3B is a side view of an interstage test device according to another embodiment of the present invention.

FIG. 4A is an equivalent circuit diagram of an interstage test device in which the detection element is not electrically contacted according to another embodiment of the present invention.

FIG. 4B is an equivalent circuit diagram of an inter-stage testing device for electrical contact of a detection element according to another embodiment of the present invention.

【Symbol Description】

10: Wireless communication device

20: component under test

30: Subordinate component

38: Upper ground wire

40: signal line

42: Lower ground wire

50: Measuring device

55: Detection element

55a: Upper ground probe

55b: Signal probe

55c: Lower ground probe

100, 200: interstage test device

110, 210: upper board

120, 220: Interposer

122, 222: Conductive adhesive

123: convex part

124, 224: grounding plate

126, 226: substrate layer

128, 228: metal plate

130, 230: lower plate

ACT: air cavity

CL: Lower connecting column

CS: signal connection column

CU: upper connecting column

PG1: the first ground electrode

PG2: Second ground electrode

PG3: The third ground electrode

PG4: The fourth ground electrode

PLS: lower plate signal pole

PUS: upper board signal pole

R1, R11: the first block

R2, R22: the second block

TG1: the first ground terminal

TG2: the second ground terminal

TG3: the third ground terminal

TG4: The fourth ground terminal

TNS: Lower-level signal terminal

TTS: signal terminal to be tested

HL: Lower through hole

HS: signal through hole

HU: upper through hole

Z1: air resistance

Z2: Adjust impedance

ZCT: Impedance Tuning Chamber

Zt: test impedance

detailed description

Hereinafter, the present invention will be described in detail by illustrating various exemplary embodiments of the invention by drawing. However, inventive concepts may be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. Additionally, the same reference numbers may be used in the drawings to denote similar elements.

First, please refer to FIG. 1A and FIG. 1B . FIG. 1A is a schematic diagram of a wireless communication device according to an embodiment of the present invention. FIG. 1B is a schematic diagram of an interstage test device testing a DUT in a wireless communication device according to an embodiment of the present invention.

As shown in FIG. 1A and FIG. 1B , the wireless communication device 10 has a device under test 20 , a lower device 30 , an upper ground wire 38 , a signal wire 40 , and a lower ground wire 42 . The DUT 20 is electrically connected to the lower element 30 through the upper ground wire 38 , the signal wire 40 and the lower ground wire 42 respectively. In this embodiment, the device under test 20 is a certain element in the wireless communication device, and is electrically connected to a previous element (not shown in the drawing). The lower-level component 30 is the next-level component of the DUT 20 . If the user wants to detect the condition of the device under test 20, the user can set the interstage test device 100 of this embodiment between the device under test 20 and the lower device 30 (that is, set the interstage test device 100 on the upper ground line 38 , the signal line 40, and the lower ground line 42), as shown in FIG. 1B. Certainly, if the user wants to test the condition of the lower-level component 30 , the user can install the inter-level testing device 100 of this embodiment between the lower-level component 30 and its lower-level component. For the convenience of description, the inter-stage test device 100 is disposed between the DUT 20 and the lower-stage DUT 30 to detect the status of the DUT 20 for illustration.

Next, please refer to FIG. 2A , which is an exploded view of an interstage testing device according to an embodiment of the present invention. As shown in FIG. 2A , the DUT 20 is electrically connected to the lower element 30 through the upper ground wire 38 , the signal wire 40 , and the lower ground wire 42 respectively. The interstage test device 100 includes an upper board 110 , a middle layer 120 and a lower board 130 . The first ground electrode PG1 of the lower plate 130 is electrically connected to the first ground terminal TG1 of the device under test 20 and the third ground terminal TG3 of the lower device 30 through the upper ground wire 38 . The lower board signal pole PLS of the lower board 130 is electrically connected to the signal terminal TTS of the device under test 20 and the lower signal terminal TNS of the lower device 30 through the signal line 40 . The second ground electrode PG2 of the lower plate 130 is electrically connected to the second ground terminal TG2 of the device under test 20 and the fourth ground terminal TG4 of the lower device 30 through the lower ground wire 42 . The interposer 120 is disposed between the upper board 110 and the lower board 130 . The interstage test device 100 forms a two-port ground-signal-ground (Ground-Signal-Ground, GSG for short) interstage test structure. In this embodiment, the first ground electrode PG1, the signal electrode PLS of the lower board, and the second ground electrode PG2 can be disposed in the lower board 130 to be electrically connected to the upper ground wire 38, the signal wire 40, and the lower ground wire 42, respectively. , as shown in Figure 2A. Alternatively, the first ground electrode PG1, the lower board signal electrode PLS, and the second ground electrode PG2 may be disposed and exposed on the bottom of the lower board 130, so as to facilitate electrical contact with the upper ground wire 38, the signal wire 40, and the lower ground wire 42. (not depicted in Figure 2A). The setting relationship between the first ground electrode PG1, the lower plate signal electrode PLS, the second ground electrode PG2 and the upper ground wire 38, the signal wire 40, and the lower ground wire 42 can also be designed according to the actual situation, and the present invention does not intend to do so. make restrictions.

Therefore, the user can use an external test device to electrically connect the interstage test device 100 to measure the current status of the DUT 20 . For example, the external testing device is electrically connected to the first ground electrode PG1 , the lower-board signal electrode PLS, and the second ground electrode PG2 of the lower board 130 to measure whether the device under test 20 is flawed or damaged (not shown in FIG. 2A ). For another example, the upper board 110 has three contact poles, and the three contact poles are respectively electrically connected to the first ground electrode PG1, the lower board signal pole PLS, and the second ground electrode PG2, so that an external testing device can contact the upper board 110. Three contact electrodes are used to measure whether the device under test 20 is flawed or damaged (not shown in FIG. 2A ), and the present invention is not limited thereto. In addition, in this embodiment, the upper board 110 and the lower board 130 are printed circuit boards (printed circuit board, PCB for short). The intermediary layer 120 is made of insulating material, preferably plastic material, which is not limited in the present invention.

Next, please also refer to FIG. 2B , the intermediary layer 120 includes a first block R1 and a second block R2 , and the first block R1 is adjacent to the second block R2 . In this embodiment, the areas of the first block R1 and the second block R2 are equal, so as to avoid unnecessary stray capacitance from affecting the test result of the interstage test device 100 . And if the stray capacitance is too small to be ignored, the influence of the stray capacitance need not be considered, so that the areas of the first block R1 and the second block R2 do not need to be equal, and the present invention is not limited thereto.

The first block R1 has an air cavity ACT, and the air cavity ACT contacts the lower plate 130 to generate air resistance. In this embodiment, the air impedance is set to 50 ohms, so that the signals in the interstage test device 100 are less likely to affect each other. Of course, the air impedance can also be set to other fixed values, which is not limited in the present invention. The second block R2 has an impedance adjustment cavity ZCT, and the impedance adjustment cavity ZCT contacts the lower plate 130 . The impedance adjustment cavity ZCT has a conductive glue 122 , a ground plate 124 , a substrate layer 126 , and a metal plate 128 . The conductive glue 122 is disposed on the lower plate 130 for electrically connecting the ground plate 124 to the first ground electrode PG1 and the second ground electrode PG2 . On the conductive adhesive 122 , a ground plate 124 , a substrate layer 126 , and a metal plate 128 are sequentially stacked. The substrate layer 126 is a substrate with a predetermined thickness, so as to generate adjusted impedance according to the predetermined thickness. Therefore, the interstage test device 100 can form an equivalent impedance according to the fixed air impedance and the adjusted impedance.

In this embodiment, the conductive adhesive 122 is disposed around the second region R2 and not adjacent to the first region R1 , as shown in the shape of “ㄈ” in FIG. 2B . The grounding plate 124 and the conductive glue 122 have the same shape (that is, the grounding plate 124 and the conductive glue 122 are in the shape of “ㄈ”), and the conductive glue 222 electrically connects the grounding plate 124 to the first ground electrode PG1 and the second ground. pole PG2, but does not electrically connect the ground plate 124 to the signal pole PLS on the lower board, so as to reduce the impact of the ground plane 124 and the conductive glue 122 on the signal line 40 electrically connected to the signal pole PLS on the lower board. Certainly, the shapes of the grounding plate 124 and the conductive adhesive 122 may also be in other types, and the present invention is not limited thereto.

Here, the first ground electrode PG1 and the second ground electrode PG2 can be designed to be on a different plane from the lower plate signal electrode PLS on the lower plate 130, so that the ground plate 124 can be electrically connected to the first ground electrode PG1 and the second ground electrode PG2. , but not electrically connected to the lower board signal pole PLS. Or the shape of the conductive glue 122 can be set so as not to touch the signal pole PLS of the lower board (for example, the "ㄈ"-shaped convex part 123 of the conductive glue 122 is designed to exceed the range set by the lower board signal pole PLS of the lower board 130), The present invention is not limited thereto. The lower plate 130, the conductive adhesive 122, the ground plate 124, the substrate layer 126, the metal plate 128, the interposer 120, and the upper plate 210 can be bonded using a die-attach agent. The material and application method of the agent are discussed in detail, so I won’t repeat them here.

In addition, in this embodiment, the ground plate 124 and the metal plate 128 are arranged in parallel, so that a capacitance is formed among the ground plate 124 , the substrate layer 126 , and the metal plate 128 , and an adjusted impedance is generated accordingly. Since capacitance is inversely proportional to impedance. Therefore, if the predetermined thickness of the substrate layer 126 is thicker, the adjusted impedance will be larger. Likewise, if the predetermined thickness of the substrate layer 126 is thinner, the adjusted impedance will be smaller. Of course, adjusting the impedance can also be adjusted by changing the material of the substrate layer 126 . In this embodiment, the substrate layer 126 is made of glass fiber material (FR4 for short), and may also be made of other materials, and the present invention is not limited thereto.

Therefore, the user can design the predetermined thickness of the substrate layer 126 according to the operating frequency band of the device under test 20 to produce an adjusted impedance, so that the interstage test device 100 can form an operation conforming to the device under test 20 according to the fixed air impedance and the designed adjusted impedance. The equivalent impedance of the frequency band. Further, the user can measure the current status of the DUT 20 by using an external test device to electrically connect the interstage test device 100 .

Next, please refer to FIG. 3A and FIG. 3B at the same time. FIG. 3A is an exploded view of an interstage test device according to another embodiment of the present invention. Fig. 3B is a side view of an interstage test device according to another embodiment of the present invention. As shown in FIG. 3A and FIG. 3B , the interstage test device 200 includes an upper board 210 , an interposer 220 , a lower board 230 , an upper connecting column CU, a signal connecting column CS, and a lower connecting column CL. The structure and connection relationship of the upper board 210, the interposer 220, and the lower board 230 of the interstage test device 200 are substantially the same as those of the upper board 110, the interposer 120, and the lower board 130 of the interstage test device 100. .

The difference lies in that the upper board 210 has a third ground electrode PG3 , an upper board signal electrode PUS, and a fourth ground electrode PG4 . The lower board 230 has a first ground electrode PG1 , a lower board signal electrode PLS, and a second ground electrode PG2 . And the interposer 220 further has an upper through hole HU, a signal through hole HS, and a lower through hole HL to penetrate through the interposer 220 respectively. The third ground electrode PG3 is disposed correspondingly to the first ground electrode PG1 through the upper through hole HU, and the upper connection column CU is inserted into the upper through hole HU to electrically connect the third ground electrode PG3 and the first ground electrode PG1. The signal poles PUS on the upper board are arranged corresponding to the signal poles PLS on the lower board through the signal through holes HS, and the signal connection columns CS are inserted into the signal through holes HS to electrically connect the signal poles PUS on the upper board and the signal poles PLS on the lower board. The fourth ground electrode PG4 is disposed correspondingly to the second ground electrode PG2 through the lower through hole HL, and the lower connecting column CL is inserted into the lower through hole HL to electrically connect the fourth ground electrode PG4 and the second ground electrode PG2.

In this embodiment, the upper through hole HU, the signal through hole HS, and the lower through hole HL of the interposer 220 are disposed in the first block R11. The second region R22 of the interposer 220 is provided with a conductive glue 222 , a ground plate 224 , a substrate layer 226 , and a metal plate 228 . The corresponding relationship between the first block R11 and the second block R22 is substantially the same as the corresponding relationship between the first block R1 and the second block R2. In addition, the structures and connections of the conductive glue 222 , the ground plate 224 , the substrate layer 226 , and the metal plate 228 are also substantially the same as those of the conductive glue 122 , the ground plate 124 , the substrate layer 126 , and the metal plate 128 . Therefore, I will not repeat them here.

Next, the user can use the detection element 55 to electrically contact the third ground electrode PG3, the upper board signal electrode PUS, and the fourth ground electrode PG4 of the interstage test device 200, and electrically connect the detection element 55 to the measurement device 50, To further measure the current condition of the DUT 20 , as shown in FIG. 3B . In this embodiment, the detection element 55 can be a probe, and the detection element 55 has an upper ground probe 55a, a signal probe 55b, and a lower ground probe 55c (ie, one probe corresponds to three probes). The upper ground probe 55a electrically contacts the third ground electrode PG3. The signal probe 55b is electrically connected to the signal pole PUS on the upper board. The lower ground probe 55c is electrically connected to the fourth ground electrode PG4. The user can utilize the detection element 55 on the measurement device 50 to be electrically connected to the interstage test device 200 , and use the GSG interstage test structure to measure the condition of the DUT 20 . The detecting element 55 can also be changed according to the actual need to measure the item of the element under test 20 , which is not limited in the present invention.

In addition, if the inter-stage test device 200 does not have the upper connection column CU, the signal connection column CS, and the lower connection column CL. The third ground electrode PG3 is disposed corresponding to the first ground electrode PG1 through the upper through hole HU, but the third ground electrode PG3 is not electrically connected to the first ground electrode PG1. The signal pole PUS on the upper board is arranged corresponding to the signal pole PLS on the lower board through the signal through hole HS, but the signal pole PUS on the upper board is not electrically connected to the signal pole PLS on the lower board. And the fourth ground electrode PG4 is disposed corresponding to the second ground electrode PG2 through the lower through hole HL, but the fourth ground electrode PG4 is not electrically connected to the second ground electrode PG2 (not shown in FIGS. 3A-3B ).

The user can also use the upper ground probe 55 a to insert the upper through hole HU from the third ground electrode PG3 to the first ground electrode PG1 , so that the third ground electrode PG3 is electrically connected to the first ground electrode PG1 . The signal probe 55b is inserted into the signal through-hole HS from the signal pole PUS on the upper board to the signal pole PLS on the lower board, so that the signal pole PUS on the upper board is electrically connected to the signal pole PLS on the lower board, and the lower ground probe 55c is inserted into the lower ground probe 55c from the fourth ground pole PG4. The through hole HL is connected to the second ground electrode PG2, so that the fourth ground electrode PG4 is electrically connected to the second ground electrode PG2. In this way, the user can use the detection element 55 on the measuring device 50 to be electrically connected to the interstage test device 200, and use the GSG interstage test structure to measure the condition of the DUT 20 (not shown in FIGS. 3A-3B ). .

In order to illustrate how the user utilizes the interstage test device 200 to measure the condition of the device under test 20, the air impedance in the interstage test device 200 when the detection element 55 of the measurement device 50 is not electrically contacted with the interstage test device 200 is used below. And the adjusted impedance is designed to be 50 ohms; and when the detection element 55 of the measuring device 50 is electrically contacted with the interstage test device 200, the air impedance in the interstage test device 200 is designed to be 50 ohms and the adjusted impedance is designed to be 24 ohms for illustration. Therefore, the measurement device 50 can further measure the status of the DUT 20 operating in the 2.4Ghz/5Ghz ISM frequency band.

As shown in FIG. 4A and FIG. 4B , FIG. 4A is an equivalent circuit diagram of an interstage testing device in which the detection element is not electrically contacted according to another embodiment of the present invention. FIG. 4B is an equivalent circuit diagram of an inter-stage testing device for electrical contact of a detection element according to another embodiment of the present invention. When the user does not electrically contact the detection element 55 to the interstage test device 200, the equivalent circuit diagram of the interstage test device 200 electrically connects one end of the air impedance Z1 to one end of the adjustment impedance Z2, and the other end of the air impedance Z1 is electrically connected to the other end of the air impedance Z1. It is connected to the signal terminal TTS to be tested (that is, electrically connected to the element under test 20 ), and the other end of the adjusted impedance Z2 is electrically connected to the lower signal terminal TNS (that is, electrically connected to the lower element 30 ). Both the air impedance Z1 and the adjustment impedance Z2 are 50 ohms (that is, the equivalent impedance of the entire interstage test device 200 is 50 ohms), as shown in FIG. 4A .

And when the user electrically contacts the detection element 55 to the interstage test device 200 and provides a test impedance Zt of 50 ohms (that is, the same as the air impedance Z1), the upper ground probe 55a is electrically connected to the third ground electrode PG3 through the third ground electrode PG3. A ground electrode PG1, the signal probe 55b is electrically connected to the lower signal electrode PLS through the upper signal electrode PUS, and the lower ground probe 55c is electrically connected to the second ground electrode PG2 (not shown in FIG. 4B ) through the fourth ground electrode PG4.

At this time, the equivalent circuit diagram of the interstage test device 200 shows that one end of the air impedance Z1 is electrically connected to one end of the adjustment impedance Z2. The other end of the air impedance Z1 is electrically connected to the test signal terminal TTS (that is, electrically connected to the device under test 20 ) and one end of the test impedance Zt. The other end of the test impedance Zt is electrically connected to the signal pole PUS of the upper board, so as to be electrically connected to the external measuring device 50 through the detection element 55 . The other end of the adjustment impedance Z2 is grounded (that is, the connection between the adjustment impedance Z2 and the lower element 30 is equivalent to an open circuit). At this time, the air impedance is still 50 ohms, but the adjusted impedance will be changed from 50 ohms to 24 ohms (that is, the equivalent impedance of the entire interstage test device 200 is 24/50 ohms), as shown in FIG. 4B .

Then, the measurement device 50 can measure the current status of the signal output by the DUT 20 . For example, under normal conditions, the DUT 20 should output a signal of 15 dBm. If the measuring device 50 measures a signal of 15 dBm, it means that the device under test 20 is a normal operating device. And if the measuring device 50 measures a signal of 10 dBm, it means that the device under test 20 is a defective or damaged device. At this time, the user can replace the faulty DUT 20 with a normal DUT 20 .

To sum up, the inter-stage test device provided by the embodiment of the present invention can detect the condition of the components in the wireless communication device, and replace the defective or damaged components when the inter-stage test device detects them. In this way, the user only needs to replace defective or damaged components in the wireless communication device without discarding the entire wireless communication device, which can greatly reduce the manufacturing cost.

The above descriptions are only examples of the present invention, and are not intended to limit the patent scope of the present invention.

Claims (10)

1. test device between a kind of level of radio communication device, the radio communication device have an element under test, are grounded on one Line, once a holding wire, earth lead and subordinate's element, the element under test pass through the upper earth lead, the letter respectively Number line and the lower earth lead electrically connect subordinate's element, it is characterised in that between the level, test device is included：

One upper plate；

One lower plate, one first earthing pole of the lower plate electrically connect the one first of the element under test by the upper earth lead and connect One the 3rd earth terminal of ground terminal and subordinate's element, the pole of partitioned signal once of the lower plate electrically connect institute by the holding wire State a measured signal end of element under test and subordinate's signal end of subordinate's element, and one second earthing pole of the lower plate One the 4th earth terminal of one second earth terminal and subordinate's element of the element under test is electrically connected by the lower earth lead； And

One intermediary layer, is arranged between the upper plate and the lower plate, and the intermediary layer includes one first block and one second Block, adjacent to second block, first block has an air chamber to first block, and the air chamber with it is described To produce an air impedance, there is second block impedance to adjust chamber for lower plate contact, and the impedance adjust chamber with it is described Lower plate is contacted；

Wherein, the impedance has a conducting resinl, an earth plate, a substrate layer and a metallic plate, the conducting resinl in adjusting chamber It is arranged in the lower plate, the earth plate is electrically connected first earthing pole and second earthing pole, and institute State sequentially to fold on conducting resinl and be provided with the earth plate, the substrate layer and the metallic plate, the substrate layer is with a predetermined thickness Degree, adjusts impedance to produce one according to the predetermined thickness.

2. test device between the level of radio communication device according to claim 1, it is characterised in that the upper plate has 3rd earthing pole, a upper plate pickup electrode and one the 4th earthing pole, the intermediary layer also with perforation on, a signal perforation and Once perforation, the 3rd earthing pole are arranged in correspondence with first earthing pole by the upper perforation, the upper partitioned signal Pole is arranged in correspondence with the lower plate pickup electrode by the signal perforation, and the 4th earthing pole passes through the lower perforation and institute State the second earthing pole to be arranged in correspondence with.

3. test device between the level of radio communication device according to claim 1, it is characterised in that the conducting resinl is located at Around second block, and the conducting resinl is not disposed at the position of neighbouring first block.

4. test device between the level of radio communication device according to claim 3, it is characterised in that the shape of the earth plate Shape is identical with the shape of the conducting resinl.

5. test device between the level of radio communication device according to claim 2, it is characterised in that test dress between the level Put, the upper connecting pole inserts the upper perforation to electrically connect 3rd earthing pole and first earthing pole, the signal connecting pole insert the signal perforation to electrically connect on described Partitioned signal pole and the lower plate pickup electrode, the lower connecting pole insert the lower perforation with electrically connect the 4th earthing pole with And second earthing pole.

6. test device between the level of radio communication device according to claim 5, it is characterised in that test dress between the level Put also comprising a detecting element, the detecting element is with grounded probe on, a signal probe and once grounded probe, institute State grounded probe the 3rd earthing pole in electrical contact, the signal probe upper plate pickup electrode in electrical contact, it is described under Grounded probe the 4th earthing pole in electrical contact.

7. test device between the level of radio communication device according to claim 1, it is characterised in that the intermediary layer be by First block and second block composition, and the area phase of the area of first block and second block Deng.

8. test device between the level of radio communication device according to claim 1, it is characterised in that test dress between the level The equiva lent impedance put is formed according to the air impedance and the regulation impedance.

9. test device between the level of radio communication device according to claim 1, it is characterised in that the intermediary layer is Isolation material.

10. test device between the level of radio communication device according to claim 1, it is characterised in that the substrate layer is One glass fibre material.