CN104760144B - A kind of sapphire camera lens substrate preparation method - Google Patents
A kind of sapphire camera lens substrate preparation method Download PDFInfo
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- CN104760144B CN104760144B CN201510147827.XA CN201510147827A CN104760144B CN 104760144 B CN104760144 B CN 104760144B CN 201510147827 A CN201510147827 A CN 201510147827A CN 104760144 B CN104760144 B CN 104760144B
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- sapphire
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- substrate
- crystal bar
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- 239000000758 substrate Substances 0.000 title claims abstract description 41
- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 31
- 239000010980 sapphire Substances 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 235000012431 wafers Nutrition 0.000 claims abstract description 35
- 239000013078 crystal Substances 0.000 claims abstract description 31
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 19
- 239000010432 diamond Substances 0.000 claims abstract description 19
- 238000003698 laser cutting Methods 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 claims description 11
- 238000000227 grinding Methods 0.000 claims description 6
- 238000005498 polishing Methods 0.000 claims description 6
- 238000001914 filtration Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 6
- 239000002994 raw material Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 4
- 239000004576 sand Substances 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides a kind of sapphire camera lens substrate preparation method, including step：The geode that orientation is finished is processed into cylindrical crystal bar with diamond cylinder knife；Cylindrical crystal bar is cut into disk using diamond fretsaw；The wafer thickness is 0.3～0.7mm, 48～55mm of diameter；Sapphire wafers or cylinder are carried out appearance and size finishing by CNC boards；Sapphire wafers are cut conglobate camera substrate, a diameter of 5～7mm of camera substrate using the mode of laser cutting, thickness is 0.3～0.7mm；Or, sapphire cylinder is cut conglobate camera substrate using the mode of laser cutting.The application method improves operating efficiency and product yield.
Description
Technical field
The present invention relates to camera manufacture field, especially, is related to a kind of sapphire camera eyeglass preparation method.
Background technology
Camera includes visual window lens and for installing becket used by visual window lens etc..Current camera form mirror
Piece typically adopts clear glass as raw material, or increases coating on its surface to increase its abrasion resistant effect.Therefore, existing face
Plate generally existing hardness is low, not wear-resisting, easily scratches, and causes visual window lens to produce cut, has a strong impact on attractive in appearance, light transmittance and user
Experience taking pictures, in terms of photography.
Sapphire material is high due to its hardness, and light transmittance is high, possesses good physics, chemistry and optical property, with should
Good prospect for cam lens.But camera sizes of substrate is little, thickness of thin, rounded, traditional sapphire is sawed, line is cut
Cut and be only used for processing square substrate.If desired, during circular substrate, big square piece, then sawing sheet Cheng little Fang can only be first cut into using band saw
Piece, is then reprocessed into the method for sequin, wastes time and energy.Also, when less substrate is processed, clamping difficulty is big, Yi Fa
The bad operations such as raw chipping, and working (machining) efficiency is relatively low, operation is long.
Content of the invention
Present invention aim at provide a kind of operation simple sapphire camera lens substrate preparation method, to solve existing processing
Method efficiency is low, the technical problem that yield is low.
For achieving the above object, the invention provides a kind of sapphire camera lens substrate preparation method, including step：
A, draw rod：The geode that orientation is finished is processed into cylindrical crystal bar with diamond cylinder knife；The crystal orientation choosing of the crystal bar
C is selected as to a diameter of 48～55mm of the crystal bar；
B, cut Circular wafer：Cylindrical crystal bar is cut into disk using diamond fretsaw；The wafer thickness be 0.3～
0.7mm；
C, finishing：Sapphire wafers are carried out appearance and size finishing by CNC boards；
D, cut camera base material：Sapphire wafers are cut into circular platform type or cylinder using the mode of laser cutting
Camera substrate, a diameter of 5～7mm of camera substrate, thickness are 0.3～0.7mm.
Preferably, described cut camera base material step after, on sapphire substrate, additional darkening ring is anti-tampering, on darkening ring
Plating infrared filtering film.
Preferably, described cut camera base material step after, electroplate anti-oil film on sapphire substrate.
Preferably, the finishing step also includes：Circular wafer is surface-treated using grinding, polishing, to reach
To specified roughness requirements.
Preferably, described cut in camera base material step, wafer laser cutting removal amount be 3～5um, cutting speed is 8
～10mm/s.
Preferably, the cylinder knife internal diameter that draws used in rod step be 51～59mm, external diameter be 58～65mm, diamond sand
Grain is 70～80um, and the speed of mainshaft is 280～300rpm.
The invention has the advantages that：
Geode is first cut into pole by the present invention, is retained certain surplus, then is cut into disk, then with laser cutting sawing sheet
Big circular slice is cut directly into mode the circular camera substrate of required size, and efficiency high, yield are high, and utilization rate of raw materials is lifted
More than 30%.
Plating infrared filtering film and anti-soil film also can preferably lift photographic effect, bring more preferable experience sense to user
Receive, simultaneously because protecting to camera eyeglass without using other safeguard measures, not only tailored appearance is attractive in appearance, and save
Because of the expense produced by all kinds of safeguard measures, with obvious economic worth.
In addition to objects, features and advantages described above, the present invention also has other objects, features and advantages.
Below with reference to figure, the present invention is further detailed explanation.
Description of the drawings
The accompanying drawing for constituting the part of the application is used for providing a further understanding of the present invention, the schematic reality of the present invention
Apply example and its illustrate, for explaining the present invention, not constituting inappropriate limitation of the present invention.In the accompanying drawings：
Fig. 1 is that the preferred embodiment of the present invention draws rod step schematic diagram；
Fig. 2 is that the preferred embodiment of the present invention cuts Circular wafer step schematic diagram；
Fig. 3 is that the preferred embodiment of the present invention cuts camera base material step schematic diagram；
Wherein, 1, geode, 2, cylindrical crystal bar, 3, disk, 4, camera substrate, 5, anti-oil film, 6, infrared filtering film, 7,
Darkening ring.
Specific embodiment
Embodiments of the invention are described in detail below in conjunction with accompanying drawing, but the present invention can be limited according to claim
Multitude of different ways that is fixed and covering is implemented.
Referring to Fig. 1, Fig. 2 and Fig. 3, the present embodiment discloses a kind of camera visual window lens processing method, comprises the following steps that：
A, draw rod：The geode that orientation is finished is processed into cylindrical crystal bar with diamond cylinder knife；The crystal orientation choosing of the crystal bar
C is selected as to C is easier to process to material is relative in follow-up polishing process, it is to avoid warpage is produced in product processing；Crystal bar
A diameter of 48～55mm；
B, cut Circular wafer：Cylindrical crystal bar is cut into disk using diamond fretsaw；The wafer thickness be 0.3～
0.7mm, 48～55mm of diameter；
C, finishing：Sapphire wafers are carried out appearance and size finishing by CNC boards；Using grinding, polishing to circle
Shape chip is surface-treated, to reach specified roughness requirements；
D, cut camera base material：Sapphire wafers are cut into the camera base of truncated cone-shaped using the mode of laser cutting
Piece, a diameter of 5～7mm of camera substrate, thickness are 0.3～0.7mm；Wafer laser cutting removal amount is 3～5um, cuts
Speed is 8～10mm/s；
Or, also dependent on the camera for needing the mode using laser cutting that sapphire wafers are cut into cylindrical shape
Substrate.
After camera base material step is cut, it is anti-tampering to add darkening ring on sapphire substrate, electricity on darkening ring
Plating infrared filtering film, lifts photographic effect.
Anti- oil film is electroplated on sapphire substrate, and camera eyeglass is protected.
Present invention process operation simplifies, high working efficiency, and product yield is high.
1. operation simplifies
Traditional handicraft：Geode --->Disk or square wafer --->It is split into little square piece --->Process circular camera base
Piece；
Existing process：Geode --->Disk --->Laser is cut directly into circular camera substrate；
2. yield contrast：Traditional handicraft processing uses skive, easily produces and collapses scarce (generally 1～2%), and swashs
The mode of light cutting thoroughly can solve the problems, such as to collapse scarce without the need for crystal bar is clamped tension；
In addition to laser cutting is without the need for fixture clamping, easily scarce being mainly due to is collapsed in generation to be used herein as skive
The machining accuracy of laser knife itself is high compared with skive, and the line footpath of laser is micron order, and boart boart material is at least all several
More than ten microns.
3. utilization rate of raw materials lifts more than 30%, by taking the cylindrical camera substrate of cutting diameter 6mm as an example：
Traditional handicraft：Square piece of the required raw material size for length of side 7mm, utilization rate is 57.7%；
Existing process：Disk of the required raw material size for diameter 6.1mm, utilization rate is 96.8%.
Specific embodiment is shown in as follows：
Embodiment one,
1st, geode orientation is finished, and geode is processed into cylindrical crystal bar with diamond cylinder knife, and the crystal orientation of crystal bar is chosen as C
To；
The cylinder knife internal diameter for using is 59mm, and external diameter is 65mm, and diamond sand grains is 80um, and the speed of mainshaft is 300rpm；
2nd, cylindrical crystal bar is cut into disk using diamond fretsaw, wafer thickness is 0.3mm, diameter 55mm；
3rd, Circular wafer is surface-treated using grinding, polishing, to reach the requirement of roughness Ra≤5nm；
4th, using laser cutting by sapphire wafers cutting camera substrate coning, camera substrate a diameter of
5mm, thickness are 0.3mm；Wafer laser cutting removal amount is 5um, and cutting speed is 10mm/s.
Utilization rate of raw materials 96.1%, the time-consuming 109.96s of one disk of cutting, cuts out camera substrate 70PCS, and nothing collapses
Lack bad.
Embodiment two,
1st, geode orientation is finished, and geode is processed into cylindrical crystal bar with diamond cylinder knife, and the crystal orientation of crystal bar is chosen as C
To；
The cylinder knife internal diameter for using is 51mm, and external diameter is 58mm, and diamond sand grains is 70um, and the speed of mainshaft is 280rpm；
2nd, cylindrical crystal bar is cut into disk using diamond fretsaw, wafer thickness is 0.7mm, diameter 48mm；
3rd, Circular wafer is surface-treated using grinding, polishing, to reach the requirement of roughness Ra≤5nm；
4th, using laser cutting by sapphire wafers cut into cylinder camera substrate, camera substrate a diameter of
7mm, thickness are 0.7mm；Wafer laser cutting removal amount is 3um, and cutting speed is 8mm/s.
Utilization rate of raw materials 97.2%, the time-consuming 65.98s of one disk of cutting, cuts out camera substrate 24PCS, and nothing collapses
Lack bad.
Embodiment three,
1st, geode orientation is finished, and geode is processed into cylindrical crystal bar with diamond cylinder knife, and the crystal orientation of crystal bar is chosen as C
To；
The cylinder knife internal diameter for using is 55mm, and external diameter is 62mm, and diamond sand grains is 75um, and the speed of mainshaft is 290rpm；
2nd, cylindrical crystal bar is cut into disk using diamond fretsaw, wafer thickness is 0.5mm, diameter 52mm；
3rd, Circular wafer is surface-treated using grinding, polishing, to reach the requirement of roughness Ra≤5nm；
The 4th, sapphire wafers cut into the camera substrate of truncated cone-shaped using laser cutting, camera substrate a diameter of
7mm, thickness are 0.5mm；Wafer laser cutting removal amount is 4um, and cutting speed is 9mm/s.
Utilization rate of raw materials 95.7%, the time-consuming 73.3s of one disk of cutting, cuts out camera substrate 30PCS, scarce without collapsing
Bad.
The preferred embodiments of the present invention are the foregoing is only, the present invention is not limited to, for the skill of this area
For art personnel, the present invention can have various modifications and variations.All within the spirit and principles in the present invention, made any repair
Change, equivalent, improvement etc., should be included within the scope of the present invention.
Claims (4)
1. a kind of sapphire camera lens substrate preparation method, it is characterised in that including step：
A, draw rod：The geode that orientation is finished is processed into cylindrical crystal bar with diamond cylinder knife；The crystal orientation of the crystal bar is chosen as C
To a diameter of 48～55mm of the crystal bar；The cylinder knife internal diameter that draws used in rod step be 51～59mm, external diameter be 58～
65mm, diamond grit are 70～80um, and the speed of mainshaft is 280～300rpm；
B, cut Circular wafer：Cylindrical crystal bar is cut into disk using diamond fretsaw；The wafer thickness be 0.3～
0.7mm；
C, finishing：Sapphire wafers are carried out appearance and size finishing by CNC boards；
D, cut camera base material：Sapphire wafers are cut into the shooting of circular platform type or cylinder using the mode of laser cutting
Head substrate, a diameter of 5～7mm of camera substrate, thickness are 0.3～0.7mm, and wafer laser cutting removal amount is 3～5um,
Cutting speed is 8～10mm/s.
2. a kind of sapphire camera lens substrate preparation method according to claim 1, it is characterised in that described cut camera base
After material step, on sapphire substrate, additional darkening ring is anti-tampering, electroplates infrared filtering film on darkening ring.
3. a kind of sapphire camera lens substrate preparation method according to claim 1, it is characterised in that described cut camera base
After material step, anti-oil film is electroplated on sapphire substrate.
4. a kind of sapphire camera lens substrate preparation method according to claim 1, it is characterised in that the finishing step
Also include：Circular wafer is surface-treated using grinding, polishing, to reach specified roughness requirements.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510147827.XA CN104760144B (en) | 2015-03-31 | 2015-03-31 | A kind of sapphire camera lens substrate preparation method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510147827.XA CN104760144B (en) | 2015-03-31 | 2015-03-31 | A kind of sapphire camera lens substrate preparation method |
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| Publication Number | Publication Date |
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| CN104760144A CN104760144A (en) | 2015-07-08 |
| CN104760144B true CN104760144B (en) | 2017-03-15 |
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| CN110126106B (en) * | 2019-06-17 | 2021-09-24 | 浙江晶特光学科技有限公司 | Wafer processing method |
| CN114227173B (en) * | 2021-12-30 | 2023-06-27 | 中航工业南京伺服控制系统有限公司 | Technological method for improving processing efficiency of jet flow sheet |
| CN115415896A (en) * | 2022-08-19 | 2022-12-02 | 潘芳琳 | Wafer production process |
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| JP2004188475A (en) * | 2002-12-13 | 2004-07-08 | Disco Abrasive Syst Ltd | Laser processing method |
| JP4909657B2 (en) * | 2006-06-30 | 2012-04-04 | 株式会社ディスコ | Processing method of sapphire substrate |
| CN202952400U (en) * | 2012-05-09 | 2013-05-29 | 云南乾元光能产业有限公司 | High-efficient sapphire bar digging cutter |
| CN103640096B (en) * | 2013-11-26 | 2015-12-02 | 浙江上城科技有限公司 | A kind of processing method of sapphire wafer |
| CN103895114A (en) * | 2014-03-28 | 2014-07-02 | 合肥晶桥光电材料有限公司 | Sapphire screen processing technique |
| CN203876063U (en) * | 2014-05-27 | 2014-10-15 | 黄山市东晶光电科技有限公司 | Sapphire crystal ingot rod-drawing pressing structure |
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