CN104754915A - Heat radiation structure applied to mobile device - Google Patents

Abstract

The invention relates to a heat radiation structure applied to a mobile device, which comprises: the heat dissipation structure is arranged in the mobile device, and can generate excellent natural radiation convection heat dissipation for a closed space in the mobile device, so that the overall heat dissipation efficiency of the mobile device is greatly improved.

Description

Heat dissipation structure applied to mobile devices

technical field

The invention relates to a heat dissipation structure applied to a mobile device, in particular to a heat dissipation structure applied to a mobile device which can improve heat dissipation efficiency through natural radiation radiation in a closed space of the mobile device.

Background technique

Current mobile devices (such as thin notebooks, tablets, smart phones, etc.) with faster computing speed, the heat generated by the internal computing execution unit is also relatively greatly increased, and in order to be portable and convenient, this This type of device is becoming thinner and thinner; in addition, the mobile device can prevent foreign matter and moisture from entering the interior. Except for the earphone hole or the hole for the connector, this type of mobile device rarely has an open hole to communicate with the outside air. Convection is formed, so due to the congenital factor of thinning, the heat generated by the calculation execution unit and battery inside this type of mobile device cannot be quickly discharged to the outside, and because the interior of the mobile device is a closed space, it is difficult to generate convective heat dissipation. Furthermore, it is easy to generate heat accumulation or accumulation inside the mobile device, which seriously affects the working efficiency or heat dissipation of the mobile device.

Furthermore, due to the above-mentioned problems, it is also desirable to arrange passive heat dissipation elements such as hot plates, vapor chambers, radiators and other passive heat dissipation elements inside this type of mobile device to dissipate heat, but the internal space of the device is still limited due to the thinning of the mobile device. Restricted, but also based on the heat dissipation element of the setting, it must be reduced to an ultra-thin size and thickness, so that it can be installed in a limited internal space. If it is set to be ultra-thin, it will be reduced due to the above-mentioned requirements, which greatly reduces the overall heat conduction efficiency of the above-mentioned heat plate and vapor chamber, and cannot effectively improve the heat dissipation performance; therefore, when the power of the internal computing unit of the mobile device is too high, Existing hot plates and vapor chambers are unable to effectively dissipate heat or dissipate heat. Therefore, how to install effective heat dissipating elements in a narrow confined space is the primary technology for technical personnel in this field to improve.

Contents of the invention

Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat dissipation structure applied to a mobile device.

To achieve the above object, the present invention provides a heat dissipation structure applied to a mobile device, comprising: a heat conduction body having a heat dissipation side and a heat absorption side, and the heat dissipation side forms a radiation heat dissipation layer.

The heat-conducting body is composed of a copper plate and an aluminum plate, the heat-absorbing side is set on the opposite side of the copper plate and the aluminum plate, and the heat-dissipating side is set on The opposite side of the aluminum plate body is pasted with the aforementioned copper plate body.

The heat conduction body is a composite material composed of copper and aluminum.

The heat-conducting body is an aluminum plate body, and a copper plating layer is coated on the heat-absorbing side.

The heat-conducting body is a ceramic plate, and a copper plating layer is coated on the heat-absorbing side.

The radiation heat dissipation layer is either a porous structure or a nanostructure.

The radiation heat dissipation layer is formed by micro arc oxidation (Micro Arc Oxidation, MAO) or plasma electrolytic oxidation (Plasma Electrolytic Oxidation, PEO), anodic spark deposition (AnodicSpark Deposition, ASD), spark deposition anodic oxidation (Anodic Oxidation by SparkDeposition, ANOF ) any of which forms a porous structure on the heat dissipation side of the heat conduction body.

The radiation heat dissipation layer is a concavo-convex structure produced by bead peening.

The radiation heat dissipation layer is any one of a porous ceramic structure or a porous graphite structure.

The radiation heat dissipation layer is any one of black or sub-black or dark colors.

The copper plate body and the aluminum plate body are bonded to each other by any one of glue bonding or medium-free diffusion bonding.

The radiation heat dissipation layer is either a high-radiation ceramic structure or a high-hardness ceramic structure.

The present invention mainly provides a radiation heat dissipation layer on the heat dissipation side of the heat conduction body to provide the heat conduction body with natural radiation and convection heat dissipation in the closed accommodation space of the mobile device, thereby greatly increasing the overall heat dissipation performance of the mobile device.

Description of drawings

FIG. 1 is an exploded perspective view of a first embodiment of a heat dissipation structure applied to a mobile device of the present invention;

2 is a combined cross-sectional view of the first embodiment of the heat dissipation structure applied to the mobile device of the present invention;

3 is a combined cross-sectional view of the second embodiment of the heat dissipation structure applied to the mobile device of the present invention;

4 is a combined cross-sectional view of a third embodiment of the heat dissipation structure applied to a mobile device of the present invention;

FIG. 5 is a combined cross-sectional view of a fourth embodiment of a heat dissipation structure applied to a mobile device according to the present invention.

Symbol Description

Heat Dissipation Structure for Mobile Devices 1

Thermal body 11

Cooling side 111

Heat-absorbing side 112

Radiant cooling layer 113

Copper plate body 11a

Aluminum plate body 11b

Copper Plating 11c

Detailed ways

Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.

Please refer to Figures 1 and 2, which are three-dimensional exploded and combined sectional views of the first embodiment of the heat dissipation structure applied to mobile devices of the present invention. As shown in the figure, the heat dissipation structure 1 applied to mobile devices of the present invention includes: a Heat conduction body 11;

Wherein the heat conduction body 11 can be a metal material or alloy with high heat conduction efficiency and its composition or composite material; it has a heat dissipation side 111 and a heat absorption side 112, and the heat dissipation side 111 can be directly formed or coated A radiation heat dissipation layer 113 is provided; the heat conducting body 11 in this embodiment is selected to be composed of a copper plate body 11a and an aluminum material plate body 11b superimposed on each other, and the heat-absorbing side 112 is arranged on the copper plate body 11a One side of the material plate body 11a is the opposite side where the copper material plate body 11a and the aluminum material plate body 11b are attached to each other, and the heat dissipation side 111 is arranged on one side of the aluminum material plate body 11b, namely It is the opposite side of the aluminum plate body 11b and the aforementioned copper plate body 11a that are attached to each other. The copper plate body and the aluminum material plate body are combined with each other by either glue bonding or medium-free diffusion bonding.

The radiation heat dissipation layer 113 is any one of a porous structure or a nanostructure or a high-radiation ceramic structure or a high-hardness ceramic structure or a porous ceramic structure or a porous graphite structure, and is formed by evaporation or sputtering or electroplating or Either printing coating or baking varnish or nano-coating spraying or surface anodic oxidation etc. are formed on the heat dissipation side 111 of the heat-conducting body 11. In this preferred embodiment, the nano-structure is used for radiation Structural layer, through micro arc oxidation (Micro Arc Oxidation, MAO) or plasma electrolytic oxidation (Plasma Electrolytic Oxidation, PEO), anodic spark deposition (Anodic Spark Deposition, ASD), spark deposition anodic oxidation (Anodic Oxidation by Spark Deposition, ANOF ) any one of them is ceramicized (with surface hardening and enhanced radiation effect) on the heat dissipation side 111 of the heat conduction body 11, and in order to obtain better radiation benefits for the radiation heat dissipation layer 113, the radiation heat dissipation layer is set as Any one of black or sub-black or dark colors can greatly improve the effect of radiation heat dissipation. In this embodiment, black is used as an illustration but not limited to it. The characteristics of rapid conduction heat dissipation through ceramics and graphite are more effective. Contribute to the improvement of natural radiation cooling performance.

Please refer to FIG. 3, which is a combined cross-sectional view of the second embodiment of the heat dissipation structure applied to mobile devices of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here. , but the difference between this embodiment and the aforementioned first embodiment is that the heat-conducting body 11 is a composite material composed of copper and aluminum, and the structural strength and thermal conductivity of the heat-conducting body 11 are improved by selecting the composite material of copper and aluminum. effectiveness.

Please refer to FIG. 4, which is a combined cross-sectional view of the third embodiment of the heat dissipation structure applied to mobile devices of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here. , but the difference between this embodiment and the aforementioned first embodiment is that the heat-conducting body 11 is an aluminum plate body 11b, and a copper plating layer 11c is attached to the heat-absorbing side 112, so that the heat-conducting body 11 is made of aluminum As a base structure, the plate body 11b has advantages such as better structural strength and lower production cost, and a copper plating layer 11c made of copper is coated on the heat-absorbing side 112 to improve the heat-absorbing and heat-conducting efficiency of the heat-conducting body 11 .

Please refer to FIG. 5, which is a combined cross-sectional view of the fourth embodiment of the heat dissipation structure applied to mobile devices of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here. , but the difference between this embodiment and the aforementioned first embodiment is that the radiation heat dissipation layer 113 is a concavo-convex structure produced by bead peening, so as to increase the contact area of heat dissipation, and it is coated or coated on its surface A black pigment is attached to the surface of the radiation heat dissipation layer 113 .

The heat dissipation structure applied to the mobile device of the present invention is mainly intended to solve the problem of heat accumulation or heat accumulation in the mobile device, and to improve the lack of effective heat dissipation in the closed space inside the existing mobile device.

In the present invention, the heat-absorbing efficiency of the heat-conducting body is improved by partially pasting or partially attaching copper metal on the heat-absorbing side, and a black radiation heat-dissipating layer is arranged on the heat-dissipating side to increase its heat-dissipating contact area and improve the heat-radiating heat-dissipating efficiency.

The present invention uses thermal radiation conduction of heat as the application of heat dissipation, and both heat conduction and convection must rely on matter as a medium to transmit heat energy. Thermal radiation does not require a medium, that is, it can directly transmit heat energy, so in the confined space, heat can be transferred to the casing of the mobile device in the only small space left, and then exchange heat with the outside world through the casing.

Thermal radiation is the propagation of matter in the form of electromagnetic waves, but electromagnetic waves propagate at the speed of light and require a medium for propagation. Objects will continue to generate thermal radiation and absorb thermal radiation from the outside world. The ability of an object to emit heat is related to its surface temperature, color and roughness. Therefore, the radiation heat dissipation layer provided by the present invention is based on the relevant application principles to set up a natural heat dissipation radiation heat dissipation layer that can improve the surface heat dissipation area and heat dissipation efficiency. The intensity of heat radiation on the surface is not only related to temperature, but also related to the characteristics of its surface. For example, objects with a black surface are easy to absorb and emit heat radiation. Therefore, the radiation heat dissipation layer of the present invention is set to black or its surface is black. It can further improve its thermal radiation efficiency.

Although the present invention is disclosed above in terms of implementation, it is not intended to limit the present invention. Any person familiar with the art may make various modifications and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of protection of the invention should be determined by the claims.

Claims (12)

1. A heat dissipation structure applied to a mobile device, comprising: A heat conduction body has a heat dissipation side and a heat absorption side, and the heat dissipation side forms a radiation heat dissipation layer. 2. The heat dissipation structure applied to mobile devices as claimed in claim 1, wherein the heat conducting body is composed of a copper plate and an aluminum plate, and the heat-absorbing side is arranged between the copper plate and the aluminum plate The opposite side of the aluminum plate is bonded, and the heat dissipation side is arranged on the opposite side of the aluminum plate and the aforementioned copper plate. 3. The heat dissipation structure applied to a mobile device as claimed in claim 1, wherein the heat conduction body is a composite material composed of copper and aluminum. 4 . The heat dissipation structure applied to mobile devices as claimed in claim 1 , wherein the heat conducting body is an aluminum plate, and a copper plating layer is coated on the heat absorbing side. 5 . The heat dissipation structure applied to mobile devices according to claim 1 , wherein the heat conduction body is a ceramic plate, and a copper plating layer is coated on the heat absorbing side. 6 . 6. The heat dissipation structure applied to mobile devices as claimed in claim 1, wherein the radiation heat dissipation layer is any one of a porous structure or a nanostructure. 7. The heat dissipation structure applied to mobile devices as claimed in claim 1, wherein the radiation heat dissipation layer is used in the heat dissipation of the heat conduction body through micro-arc oxidation or plasma electrolytic oxidation, anodic spark deposition, and spark deposition anodic oxidation. The sides form a porous structure. 8. The heat dissipation structure applied to mobile devices according to claim 1, wherein the radiation heat dissipation layer is a concave-convex structure produced by bead peening. 9. The heat dissipation structure applied to a mobile device as claimed in claim 1, wherein the radiation heat dissipation layer is any one of a porous ceramic structure or a porous graphite structure. 10. The heat dissipation structure applied to mobile devices according to any one of claims 1 or 9, wherein the radiation heat dissipation layer is any of black or sub-black or dark colors. 11 . The heat dissipation structure applied to mobile devices according to claim 2 , wherein the copper board and the aluminum board are bonded to each other by any one of adhesive bonding or dielectricless diffusion bonding. 12 . 12. The heat dissipation structure applied to a mobile device as claimed in claim 1, wherein the radiation heat dissipation layer is any one of a high-radiation ceramic structure or a high-hardness ceramic structure.