CN104750259B - Cover structure, input device and cover structure manufacturing method - Google Patents
Cover structure, input device and cover structure manufacturing method Download PDFInfo
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- CN104750259B CN104750259B CN201310752353.2A CN201310752353A CN104750259B CN 104750259 B CN104750259 B CN 104750259B CN 201310752353 A CN201310752353 A CN 201310752353A CN 104750259 B CN104750259 B CN 104750259B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000012815 thermoplastic material Substances 0.000 claims abstract description 141
- 238000005253 cladding Methods 0.000 claims description 60
- 239000004744 fabric Substances 0.000 claims description 52
- 238000007731 hot pressing Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 17
- 229920002635 polyurethane Polymers 0.000 claims description 5
- 239000004814 polyurethane Substances 0.000 claims description 5
- 239000004677 Nylon Substances 0.000 claims description 4
- 239000010985 leather Substances 0.000 claims description 4
- 229920001778 nylon Polymers 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 238000005187 foaming Methods 0.000 claims 2
- 238000009940 knitting Methods 0.000 claims 2
- 238000000465 moulding Methods 0.000 claims 2
- 229920001169 thermoplastic Polymers 0.000 claims 2
- 239000004416 thermosoftening plastic Substances 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 9
- 239000010410 layer Substances 0.000 description 232
- 238000003825 pressing Methods 0.000 description 21
- 239000000758 substrate Substances 0.000 description 10
- 239000012790 adhesive layer Substances 0.000 description 8
- 239000011247 coating layer Substances 0.000 description 7
- 238000010030 laminating Methods 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 6
- 238000007906 compression Methods 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000001960 triggered effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000035807 sensation Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
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Abstract
本发明公开了一种覆盖结构,其包含底包覆层、顶包覆层以及热塑材料层。热塑材料层叠合于底包覆层与顶包覆层之间。热塑材料层包含相连的第一热塑材料层部分以及第二热塑材料层部分。第一热塑材料层部分具有第一厚度。第二热塑材料层部分具有第二厚度。第一厚度大于顶包覆层的厚度。第一厚度为第二厚度的4~7倍。本发明还公开了一种应用覆盖结构的输入装置以及一种覆盖结构制造方法。
The present invention discloses a covering structure, which comprises a bottom covering layer, a top covering layer and a thermoplastic material layer. The thermoplastic material layer is stacked between the bottom covering layer and the top covering layer. The thermoplastic material layer comprises a first thermoplastic material layer portion and a second thermoplastic material layer portion connected. The first thermoplastic material layer portion has a first thickness. The second thermoplastic material layer portion has a second thickness. The first thickness is greater than the thickness of the top covering layer. The first thickness is 4 to 7 times the second thickness. The present invention also discloses an input device using the covering structure and a method for manufacturing the covering structure.
Description
技术领域technical field
本发明涉及一种覆盖结构和应用覆盖结构的输入装置及覆盖结构制造方法。The invention relates to a covering structure, an input device using the covering structure and a manufacturing method of the covering structure.
背景技术Background technique
近年来虽然平板电脑渐广为流行,但就目前个人电脑的使用习惯而言,键盘(或鼠标)仍为重要的输入设备,用以输入文字、符号或数字。因此,目前有业者推出一种专门供平板电脑使用的薄型化触控键盘,并可作为平板电脑的保护盖。为了达到薄型化的外观,该触控键盘采用了压力感应电阻(Force Sensitive Resistor,FSR)作为感应输入信号的元件,并在其表面包覆覆盖层以供使用者的手指碰触。Although tablet PCs have become more and more popular in recent years, the keyboard (or mouse) is still an important input device for inputting characters, symbols or numbers in terms of current usage habits of personal computers. Therefore, at present, some operators have introduced a thin touch keyboard specially used for tablet computers, which can also be used as a protective cover for tablet computers. In order to achieve a thinner appearance, the touch keyboard uses a force sensitive resistor (Force Sensitive Resistor, FSR) as a component for sensing input signals, and covers the surface with a covering layer for the user's finger to touch.
但是,该触控键盘并无法提供使用者类似于传统键盘所能提供的按压手感,因此使用者并无法明确地通过按压时的触感,得知按键开关是否已经成功触发。而且,该触控键盘的覆盖层过于平坦,无法让使用者明显的区别是否按压于按键上。为了解决此问题,另有业者进一步在该触控键盘的覆盖层上对应每一按键的位置各设置一个按压垫片,以期能模拟出传统键盘所能提供的按压手感。然而,按压垫片所提供的按压手感不仅仍旧无法与传统键盘相提并论,且将按压垫片设置在覆盖层上时还必须面临对位精度的问题,因此其制造成本也会因额外设置的按压垫片而提高。However, the touch keyboard cannot provide the user with a pressing feeling similar to that provided by a traditional keyboard, so the user cannot clearly know whether the key switch has been successfully triggered through the tactile feeling when pressing. Moreover, the covering layer of the touch keyboard is too flat, and it is impossible for the user to clearly distinguish whether the button is pressed or not. In order to solve this problem, another company further arranges a pressing spacer on the covering layer of the touch keyboard corresponding to each key, in order to simulate the pressing feeling provided by the traditional keyboard. However, the pressing feeling provided by the pressing spacer is not only still not comparable to that of the traditional keyboard, but also must face the problem of alignment accuracy when the pressing spacer is arranged on the cover layer, so its manufacturing cost will also be affected by the additional pressing spacer. slice and improve.
另外,现有按压垫片在制造流程上,需先将胶体注入模具当中以形成对应按键的形状,当胶体硬化成形后,再将其粘附于片体上,整体工艺过程耗时且手续繁复。In addition, in the manufacturing process of the existing pressing pads, the glue needs to be injected into the mold to form the shape of the corresponding button. After the glue is hardened and formed, it is then adhered to the sheet body. The overall process is time-consuming and complicated. .
因此,提出一种具有较佳按压手感的输入装置,且输入装置的覆盖层制造成本低廉及制作流程快速,是目前业界亟欲投入研发资源进行研究的项目之一。Therefore, proposing an input device with a better pressing feel, and the covering layer of the input device is manufactured at a low cost and has a fast manufacturing process, which is one of the projects that the industry is eager to invest in R&D resources for research.
发明内容Contents of the invention
本发明提供一种覆盖结构,其包含底包覆层、顶包覆层以及热塑材料层。热塑材料层叠合于底包覆层与顶包覆层之间。热塑材料层包含相连的第一热塑材料层部分以及第二热塑材料层部分。第一热塑材料层部分具有第一厚度。第二热塑材料层部分具有第二厚度。第一厚度大于顶包覆层的厚度。第一厚度为第二厚度的4~7倍。The present invention provides a covering structure comprising a bottom covering layer, a top covering layer and a layer of thermoplastic material. The thermoplastic material layer is stacked between the bottom cladding layer and the top cladding layer. The layer of thermoplastic material comprises a connected portion of the first layer of thermoplastic material and a portion of the second layer of thermoplastic material. The first layer portion of thermoplastic material has a first thickness. The second layer portion of thermoplastic material has a second thickness. The first thickness is greater than the thickness of the top cladding layer. The first thickness is 4-7 times of the second thickness.
在本发明的一实施方式中,上述的底包覆层包含相连的第一布层部分以及第二布层部分。第一热塑材料层部分叠合于第一布层部分与顶包覆层之间。第二热塑材料层部分叠合于第二布层部分与顶包覆层之间。第一布层部分具有第三厚度。第二布层部分具有第四厚度。第三厚度为第四厚度的1.2~1.7倍。In one embodiment of the present invention, the above-mentioned bottom cladding layer includes a connected first cloth layer portion and a second cloth layer portion. The first layer of thermoplastic material is partially laminated between the first cloth layer portion and the top cover layer. The second thermoplastic material layer is partially laminated between the second cloth layer portion and the top cladding layer. The first layer portion has a third thickness. The second cloth layer portion has a fourth thickness. The third thickness is 1.2-1.7 times of the fourth thickness.
在本发明的一实施方式中,上述的第一厚度、第三厚度与顶包覆层的厚度的总和,为第二厚度、第四厚度与顶包覆层的厚度的总和的1.5~2.3倍。In one embodiment of the present invention, the sum of the first thickness, the third thickness and the thickness of the top cladding layer is 1.5 to 2.3 times the sum of the second thickness, the fourth thickness and the thickness of the top cladding layer .
在本发明的一实施方式中,上述的覆盖结构还包含胶层。胶层粘合于顶包覆层与热塑材料层之间。In one embodiment of the present invention, the above-mentioned covering structure further includes an adhesive layer. The adhesive layer is bonded between the top cladding layer and the thermoplastic material layer.
在本发明的一实施方式中,上述的底包覆层的材料包含尼龙,并且热塑材料层的材料包含聚氨酯。In one embodiment of the present invention, the material of the above-mentioned bottom coating layer includes nylon, and the material of the thermoplastic material layer includes polyurethane.
在本创作的一实施方式中,上述的底包覆层为针织布层,顶包覆层为皮革层,并且热塑材料层为发泡层。In one embodiment of the present invention, the above-mentioned bottom covering layer is a knitted fabric layer, the top covering layer is a leather layer, and the thermoplastic material layer is a foam layer.
本发明还提供一种输入装置,其包含键盘模块以及覆盖结构。键盘模块包含多个按键单元。覆盖结构包含底包覆层、顶包覆层以及热塑材料层。底包覆层覆盖贴附键盘模块。热塑材料层叠合于底包覆层与顶包覆层之间。热塑材料层包含多个第一热塑材料层部分以及第二热塑材料层部分。第二热塑材料层部分与第一热塑材料层部分相连。每一个第一热塑材料层部分分别对应于按键单元的区域。第二热塑材料层部分对应于按键单元以外的区域。每一个第一热塑材料层部分具有第一厚度。第二热塑材料层部分具有第二厚度。第一厚度大于顶包覆层的厚度。第一厚度为第二厚度的4~7倍。The invention also provides an input device, which includes a keyboard module and a covering structure. The keyboard module includes multiple key units. The cover structure includes a bottom cladding layer, a top cladding layer and a layer of thermoplastic material. The bottom cover covers the attached keyboard module. The thermoplastic material layer is stacked between the bottom cladding layer and the top cladding layer. The thermoplastic material layer includes a plurality of first thermoplastic material layer portions and second thermoplastic material layer portions. The second layer of thermoplastic material is partially connected to the first layer of thermoplastic material. Each part of the first thermoplastic material layer corresponds to the area of the key unit. The second thermoplastic material layer part corresponds to the area outside the key unit. Each first layer portion of thermoplastic material has a first thickness. The second layer portion of thermoplastic material has a second thickness. The first thickness is greater than the thickness of the top cladding layer. The first thickness is 4-7 times of the second thickness.
在本发明的一实施方式中,上述的底包覆层包含多个第一布层部分以及第二布层部分。第二布层部分与第一布层部分相连。每一个第一热塑材料层部分叠合于相对应的第一布层部分与顶包覆层之间。第二热塑材料层部分叠合于第二布层部分与顶包覆层之间。每一个第一布层部分具有第三厚度。第二布层部分具有第四厚度。第三厚度为第四厚度的1.2~1.7倍。In one embodiment of the present invention, the above-mentioned bottom cladding layer includes a plurality of first cloth layer parts and second cloth layer parts. The second layer portion is connected to the first layer portion. Each first thermoplastic material layer portion is laminated between the corresponding first cloth layer portion and the top cladding layer. The second thermoplastic material layer is partially laminated between the second cloth layer portion and the top cladding layer. Each first layer portion has a third thickness. The second cloth layer portion has a fourth thickness. The third thickness is 1.2-1.7 times of the fourth thickness.
在本发明的一实施方式中,上述的每一个按键单元为圆顶式支撑型按键。In one embodiment of the present invention, each of the above-mentioned key units is a dome-type support key.
在本发明的一实施方式中,上述的每一个按键单元为剪刀式支撑型按键。In one embodiment of the present invention, each of the above-mentioned key units is a scissor-type support key.
在本发明的一实施方式中,上述的键盘模块为压力感应电阻式键盘。In one embodiment of the present invention, the above-mentioned keyboard module is a pressure-sensing resistive keyboard.
本发明还提供一种覆盖结构制造方法,其包含:提供底包覆层;在底包覆层上叠合热塑材料层;热压热塑材料层,进而形成未热压的第一热塑材料层部分以及经热压的第二热塑材料层部分,其中第一热塑材料层部分具有第一厚度,第二热塑材料层部分具有第二厚度,并且第一厚度为第二厚度的4~7倍;以及在热塑材料层上叠合顶包覆层,其中第一厚度大于顶包覆层的厚度。The present invention also provides a method for manufacturing a covering structure, which includes: providing a bottom cladding layer; laminating a thermoplastic material layer on the bottom cladding layer; heat-pressing the thermoplastic material layer, and then forming a first thermoplastic material that has not been heat-pressed. The material layer portion and the heat-pressed second thermoplastic material layer portion, wherein the first thermoplastic material layer portion has a first thickness, the second thermoplastic material layer portion has a second thickness, and the first thickness is the second thickness 4 to 7 times; and laminating a top cladding layer on the thermoplastic material layer, wherein the first thickness is greater than the thickness of the top cladding layer.
在本发明的一实施方式中,上述提供底包覆层的步骤包含热压底包覆层,进而形成未热压的第一布层部分以及经热压的第二布层部分,其中第一热塑材料层部分叠合于第一布层部分与顶包覆层之间,第二热塑材料层部分叠合于第二布层部分与顶包覆层之间,第一布层部分具有第三厚度,第二布层部分具有第四厚度,并且第三厚度为第四厚度的1.2~1.7倍。In one embodiment of the present invention, the above-mentioned step of providing the bottom cladding layer includes heat-pressing the bottom cladding layer, thereby forming a non-heat-pressed first cloth layer part and a heat-pressed second cloth layer part, wherein the first The thermoplastic material layer is partially laminated between the first cloth layer part and the top cladding layer, the second thermoplastic material layer is partially laminated between the second cloth layer part and the top cladding layer, and the first cloth layer part has The third thickness, the second cloth layer part has a fourth thickness, and the third thickness is 1.2-1.7 times of the fourth thickness.
在本发明的一实施方式中,上述在该热塑材料层上叠合该顶包覆层的步骤还包含在热塑材料层上涂布胶层,致使叠合之后的顶包覆层与热塑材料层相互粘合。In one embodiment of the present invention, the above-mentioned step of laminating the top cladding layer on the thermoplastic material layer further includes coating an adhesive layer on the thermoplastic material layer, so that the laminated top cladding layer and the thermal The layers of plastic material are bonded to each other.
综上所述,本发明的覆盖结构是由底包覆层、顶包覆层与热塑材料层叠合而成,并且底包覆层与热塑材料层皆可通过热压而形成厚度不相同的区域。其中,底包覆层与热塑材料层热压幅度较小或未被热压的区域(覆盖结构在此区域的厚度较厚)可对应输入装置的按键单元的区域,而底包覆层与热塑材料层被热压的区域(覆盖结构在此区域的厚度较薄)可对应按键单元以外的区域。换言之,本发明的覆盖结构仅需通过简单的热压程序,即可在对应按键单元的区域形成结构明确的按压部,因此可解决现有设置按压垫片时所需面临的对位精度问题。另外,本发明的输入装置所采用的按键单元为圆顶式支撑型按键或剪刀式支撑型按键,因此使用者隔着覆盖结构按压按键单元时,可获得较佳的按压手感,并可明确地通过按压时的触感,得知按键单元所对应的开关是否已经成功触发。In summary, the covering structure of the present invention is composed of a bottom cladding layer, a top cladding layer, and a thermoplastic material layer, and both the bottom cladding layer and the thermoplastic material layer can be formed with different thicknesses by hot pressing. Area. Wherein, the area where the thermal compression range between the bottom coating layer and the thermoplastic material layer is small or not hot-pressed (the thickness of the covering structure in this area is relatively thick) can correspond to the area of the key unit of the input device, and the bottom coating layer and the thermoplastic material layer The heat-pressed area of the thermoplastic material layer (where the thickness of the covering structure is relatively thin) may correspond to the area outside the key unit. In other words, the covering structure of the present invention can form a pressing portion with a clear structure in the area corresponding to the key unit only through a simple hot pressing process, so it can solve the problem of alignment accuracy faced when the conventional pressing spacer is arranged. In addition, the key unit used in the input device of the present invention is a dome-type support key or a scissor-type support key, so when the user presses the key unit through the cover structure, a better pressing feel can be obtained, and it can clearly Whether the switch corresponding to the button unit has been successfully triggered can be known through the tactile sensation when pressed.
附图说明Description of drawings
图1A为本发明一实施方式的输入装置的立体分解图。FIG. 1A is an exploded perspective view of an input device according to an embodiment of the present invention.
图1B为图1A中的输入装置的立体组合图。FIG. 1B is a perspective assembled view of the input device in FIG. 1A .
图2为图1A中的覆盖结构的剖视图。FIG. 2 is a cross-sectional view of the covering structure in FIG. 1A .
图3为图1B中的输入装置的局部剖视图。FIG. 3 is a partial cross-sectional view of the input device in FIG. 1B .
图4A为图1A中的输入装置的局部剖视图,其中按键单元未被按压。FIG. 4A is a partial cross-sectional view of the input device in FIG. 1A , where the key unit is not pressed.
图4B为图4A的另一局部剖视图,其中按键单元已被按压。FIG. 4B is another partial cross-sectional view of FIG. 4A , where the key unit has been pressed.
图5为本发明另一实施方式的键盘模块与覆盖结构的局部剖视图。FIG. 5 is a partial cross-sectional view of a keyboard module and a cover structure according to another embodiment of the present invention.
图6为本发明另一实施方式的键盘模块与覆盖结构的局部剖视图。FIG. 6 is a partial cross-sectional view of a keyboard module and a cover structure according to another embodiment of the present invention.
图7为本发明一实施方式的覆盖结构制造方法的流程图。FIG. 7 is a flowchart of a manufacturing method of a covering structure according to an embodiment of the present invention.
具体实施方式Detailed ways
以下将以附图公开本发明的多个实施方式,为明确说明起见,许多具体的细节将在以下叙述中一并说明。然而,应了解到,这些具体的细节不应用以限制本发明。也就是说,在本发明部分实施方式中,这些具体的细节是非必要的。此外,为简化附图起见,一些现有惯用的结构与元件在附图中将以简单示意的方式表示。A number of implementations of the present invention will be disclosed below with the accompanying drawings. For the sake of clarity, many specific details will be described together in the following description. It should be understood, however, that these specific details should not be used to limit the invention. That is, in some embodiments of the invention, these specific details are not necessary. In addition, for the sake of simplification of the drawings, some conventional structures and elements will be shown in a simple and schematic manner in the drawings.
请参照图1A、图1B以及图2。图1A为本发明一实施方式的输入装置1的立体分解图。图1B为图1A中的输入装置1的立体组合图。图2为图1A中的覆盖结构12的剖视图。Please refer to FIG. 1A , FIG. 1B and FIG. 2 . FIG. 1A is an exploded perspective view of an input device 1 according to an embodiment of the present invention. FIG. 1B is a perspective assembled view of the input device 1 in FIG. 1A . FIG. 2 is a cross-sectional view of the covering structure 12 in FIG. 1A .
如图1A至图2所示,在本实施方式中,输入装置1包含键盘模块10以及覆盖结构12。输入装置1的键盘模块10包含多个按键单元102。输入装置1的覆盖结构12包含底包覆层120、顶包覆层122以及热塑材料层124。在本实施方式中,底包覆层120可为针织布层,顶包覆层122可为皮革层,热塑材料层124可为发泡层。覆盖结构12的底包覆层120覆盖并贴附键盘模块10。覆盖结构12的热塑材料层124叠合于底包覆层120与顶包覆层122之间。覆盖结构12的热塑材料层124包含多个第一热塑材料层部分124a(图2中仅示出一个)以及第二热塑材料层部分124b。热塑材料层124的第二热塑材料层部分124b与第一热塑材料层部分124a相连。热塑材料层124的每一个第一热塑材料层部分124a分别对应于按键单元102的区域。热塑材料层124的第二热塑材料层部分124b对应于按键单元102以外的区域。热塑材料层124的每一个第一热塑材料层部分124a具有第一厚度T1。第二热塑材料层部分124b具有第二厚度T2。第一厚度T1大于顶包覆层122的厚度。第一厚度T1为第二厚度T2的4~7倍。As shown in FIG. 1A to FIG. 2 , in this embodiment, the input device 1 includes a keyboard module 10 and a cover structure 12 . The keyboard module 10 of the input device 1 includes a plurality of key units 102 . The cover structure 12 of the input device 1 includes a bottom cover layer 120 , a top cover layer 122 and a thermoplastic material layer 124 . In this embodiment, the bottom covering layer 120 may be a knitted fabric layer, the top covering layer 122 may be a leather layer, and the thermoplastic material layer 124 may be a foam layer. The bottom covering layer 120 of the covering structure 12 covers and attaches the keyboard module 10 . The thermoplastic material layer 124 of the covering structure 12 is laminated between the bottom cladding layer 120 and the top cladding layer 122 . The thermoplastic material layer 124 of the covering structure 12 comprises a plurality of first thermoplastic material layer portions 124a (only one is shown in FIG. 2 ) and a second thermoplastic material layer portion 124b. The second thermoplastic material layer portion 124b of the thermoplastic material layer 124 is connected to the first thermoplastic material layer portion 124a. Each first thermoplastic material layer portion 124 a of the thermoplastic material layer 124 corresponds to an area of the key unit 102 respectively. The second thermoplastic material layer portion 124b of the thermoplastic material layer 124 corresponds to the area outside the key unit 102 . Each first thermoplastic material layer portion 124a of the thermoplastic material layer 124 has a first thickness T1. The second thermoplastic material layer portion 124b has a second thickness T2. The first thickness T1 is greater than the thickness of the top cladding layer 122 . The first thickness T1 is 4-7 times of the second thickness T2.
在本实施方式中,覆盖结构12的热塑材料层124可通过热压而形成具有第一厚度T1的第一热塑材料层部分124a与具有第二厚度T2的第二热塑材料层部分124b,其中第一热塑材料层部分124a为热压幅度较小或未被热压的部分,第二热塑材料层部分124b为被热压的部分。因此,热压幅度较小或未被热压且具有较大的第一厚度T1的第一热塑材料层部分124a,可对应于按键单元102的区域(即按键单元102的正上方)而作为覆盖结构12供使用者按压的部分,而被热压且具有较小的第二厚度T2的第二热塑材料层部分124b,可对应于按键单元102以外的区域而作为覆盖结构12防止脏污进入按键单元102之间的间隙的部分,上述热压幅度用以表示第一热塑材料层部分124a相对于第二热塑材料层部分124b所受热压程度的差异。In this embodiment, the thermoplastic material layer 124 of the covering structure 12 can be formed by hot pressing to form a first thermoplastic material layer portion 124a having a first thickness T1 and a second thermoplastic material layer portion 124b having a second thickness T2 , wherein the first thermoplastic material layer part 124a is a part that is not hot-pressed or not, and the second thermoplastic material layer part 124b is a part that is hot-pressed. Therefore, the first thermoplastic material layer portion 124a, which has a smaller heat-pressing range or has not been heat-pressed and has a larger first thickness T1, can correspond to the area of the key unit 102 (that is, directly above the key unit 102) as The part of the covering structure 12 that is pressed by the user, and the second thermoplastic material layer part 124b that is hot-pressed and has a smaller second thickness T2, can correspond to the area outside the key unit 102 and serve as the covering structure 12 to prevent dirt. For the portion entering the gap between the key units 102 , the above-mentioned thermal compression range is used to represent the difference in thermal compression degree of the first thermoplastic material layer portion 124 a relative to the second thermoplastic material layer portion 124 b.
如图2所示,在本实施方式中,覆盖结构12的底包覆层120包含多个第一布层部分120a以及第二布层部分120b。底包覆层120的第二布层部分120b与第一布层部分120a相连。热塑材料层124的每一个第一热塑材料层部分124a叠合于相对应的第一布层部分120a与顶包覆层122之间。热塑材料层124的第二热塑材料层部分124b叠合于底包覆层120的第二布层部分120b与顶包覆层122之间(也就是说,底包覆层120的第一布层部分120a分别对应于按键单元102的区域,而底包覆层120的第二布层部分120b对应于按键单元102以外的区域)。底包覆层120的每一个第一布层部分120a具有第三厚度T3。底包覆层120的第二布层部分120b具有第四厚度T4。第三厚度T3为第四厚度T4的1.2~1.7倍。As shown in FIG. 2 , in this embodiment, the bottom cladding layer 120 of the covering structure 12 includes a plurality of first cloth layer portions 120 a and second cloth layer portions 120 b. The second cloth layer portion 120b of the bottom cladding layer 120 is connected to the first cloth layer portion 120a. Each first thermoplastic material layer portion 124a of the thermoplastic material layer 124 is laminated between the corresponding first fabric layer portion 120a and the top cladding layer 122 . The second thermoplastic material layer portion 124b of the thermoplastic material layer 124 is laminated between the second cloth layer portion 120b of the bottom cladding layer 120 and the top cladding layer 122 (that is, the first layer of the bottom cladding layer 120 The cloth layer part 120a corresponds to the area of the key unit 102 respectively, and the second cloth layer part 120b of the bottom coating layer 120 corresponds to the area outside the key unit 102). Each first cloth layer portion 120a of the bottom cladding layer 120 has a third thickness T3. The second cloth layer portion 120b of the bottom cladding layer 120 has a fourth thickness T4. The third thickness T3 is 1.2˜1.7 times of the fourth thickness T4.
在本实施方式中,覆盖结构12的底包覆层120同样可通过热压而形成具有第三厚度T3的第一布层部分120a与具有第四厚度T4的第二布层部分120b,其中第一布层部分120a为热压幅度较小或未被热压的部分,第二布层部分120b为被热压的部分。因此,热压幅度较小或未被热压且具有较大的第三厚度T3的第一布层部分120a,可对应于按键单元102的区域(即按键单元102的正上方)而作为覆盖结构12供使用者按压的部分,而被热压且具有较小的第四厚度T4的第二布层部分120b,可对应于按键单元102以外的区域而作为覆盖结构12防止脏污进入按键单元102之间的间隙的部分。In this embodiment, the bottom cladding layer 120 of the covering structure 12 can also be formed by hot pressing to form the first cloth layer part 120a with the third thickness T3 and the second cloth layer part 120b with the fourth thickness T4, wherein the first cloth layer part 120b has the fourth thickness T4. The first cloth layer part 120a is a part that is not hot-pressed or not, and the second cloth layer part 120b is a part that is hot-pressed. Therefore, the first cloth layer portion 120a, which has a relatively small thermal compression range or has not been thermally compressed and has a relatively large third thickness T3, can be used as a covering structure corresponding to the area of the key unit 102 (ie directly above the key unit 102) 12 is the part for the user to press, and the second cloth layer part 120b that is hot-pressed and has a smaller fourth thickness T4 can correspond to the area other than the key unit 102 and serve as the covering structure 12 to prevent dirt from entering the key unit 102 part of the gap between.
在本实施方式中,第一热塑材料层部分124a的第一厚度T1、第一布层部分120a的第三厚度T3与顶包覆层122的厚度的总和,为第二热塑材料层部分124b的第二厚度T2、第二布层部分120b的第四厚度T4与顶包覆层122的厚度的总和的1.5~2.3倍。由此可知,本发明的覆盖结构12仅需通过简单的热压程序,即可在对应按键单元102的区域形成结构明确的按压部(因厚度较厚),因此可解决现有设置按压垫片时所需面临的对位精度问题。In this embodiment, the sum of the first thickness T1 of the first thermoplastic material layer part 124a, the third thickness T3 of the first cloth layer part 120a and the thickness of the top cladding layer 122 is the second thermoplastic material layer part The second thickness T2 of the layer 124 b , the fourth thickness T4 of the second cloth layer portion 120 b and the thickness of the top cladding layer 122 are 1.5 to 2.3 times the sum of them. It can be seen that the covering structure 12 of the present invention can form a pressing portion with a clear structure in the area corresponding to the key unit 102 (because of its thicker thickness) only through a simple hot pressing procedure, so it can solve the problem of the existing pressing pads. The problem of alignment accuracy that needs to be faced.
另外要说明的是,为了使顶包覆层122与热塑材料层124两者有更好的粘合效果,本实施方式的的覆盖结构12还包含胶层126(如图2所示),其粘合于顶包覆层122与热塑材料层124之间,从而使顶包覆层122与热塑材料层124两者可更稳固地粘合而不容易分离。In addition, it should be noted that, in order to make the top cladding layer 122 and the thermoplastic material layer 124 have a better bonding effect, the covering structure 12 of this embodiment further includes an adhesive layer 126 (as shown in FIG. 2 ), It is bonded between the top cladding layer 122 and the thermoplastic material layer 124 , so that the top cladding layer 122 and the thermoplastic material layer 124 can be more firmly bonded and not easily separated.
请参照图3、图4A以及图4B。图3为图1B中的输入装置1的局部剖视图。图4A为图1A中的输入装置1的局部剖视图,其中按键单元102未被按压。图4B为图4A的另一局部剖视图,其中按键单元102已被按压。为了使图面简化,图3中的覆盖结构12省略绘制图2中的胶层126。Please refer to FIG. 3 , FIG. 4A and FIG. 4B . FIG. 3 is a partial cross-sectional view of the input device 1 in FIG. 1B . FIG. 4A is a partial cross-sectional view of the input device 1 in FIG. 1A , where the key unit 102 is not pressed. FIG. 4B is another partial cross-sectional view of FIG. 4A , where the button unit 102 has been pressed. In order to simplify the drawing, the covering structure 12 in FIG. 3 omits the drawing of the adhesive layer 126 in FIG. 2 .
如图3至图4B所示,在本实施方式中,输入装置1的键盘模块10还包含基板100。基板100上设置有多个开关100a。每一个开关100a皆设置于相对应的按键单元102之下。每一个按键单元102为圆顶式支撑型按键,其包含相连的弹性件102a以及键帽102b,在本实施方式当中,弹性件102a可为金属弹性体(metal dome),实施时则不以此为限。每一个按键单元102的弹性件102a设置于基板100上,并位于相对应的键帽102b之下。As shown in FIGS. 3 to 4B , in this embodiment, the keyboard module 10 of the input device 1 further includes a substrate 100 . A plurality of switches 100a are provided on the substrate 100 . Each switch 100a is disposed under the corresponding key unit 102 . Each key unit 102 is a dome-type support key, which includes a connected elastic member 102a and a keycap 102b. In this embodiment, the elastic member 102a can be a metal dome, which is not used in practice. limit. The elastic member 102a of each key unit 102 is disposed on the substrate 100 and located under the corresponding keycap 102b.
根据上述结构配置,当使用者按压覆盖结构12上明显凸出的部位(即对应于第一热塑材料层部分124a与第一布层部分120a的部位)时,相对应的按键单元102的键帽102b会被朝下按压,而键帽102b内侧的触发块102b1又会挤压弹性件102a而变形,最后变形的弹性件102a即触发开关100a而产生按键单元102所对应的信号。另外,覆盖结构12的底部具有多个粘合区域128(如图4A与图4B所示),分别对应于按键单元102的键帽102b。配合图2可知,每一个粘合区域128位于相对应的第一布层部分120a与相对应的键帽102b之间。借此,即可使覆盖结构12与按键单元102稳固地相互固定,而不会产生水平位移。According to the above structural configuration, when the user presses the obviously protruding part of the covering structure 12 (that is, the part corresponding to the first thermoplastic material layer part 124a and the first cloth layer part 120a), the corresponding key of the key unit 102 will The cap 102b will be pressed downward, and the trigger block 102b1 inside the keycap 102b will press the elastic member 102a to deform, and finally the deformed elastic member 102a triggers the switch 100a to generate a signal corresponding to the key unit 102 . In addition, the bottom of the covering structure 12 has a plurality of bonding areas 128 (as shown in FIGS. 4A and 4B ), respectively corresponding to the key caps 102 b of the key unit 102 . As can be seen from FIG. 2 , each adhesive region 128 is located between the corresponding first cloth layer portion 120 a and the corresponding keycap 102 b. In this way, the covering structure 12 and the key unit 102 can be firmly fixed to each other without horizontal displacement.
要说明的是,覆盖结构12的底包覆层120、顶包覆层122以及热塑材料层124皆具有一定的延展性。为了在某一按键单元102被按压时不会造成相毗邻的按键单元102也被覆盖结构12拉扯发生误触的问题,每一个粘合区域128的面积可小于相对应的第一布层部分120a的面积与相对应的键帽102b的面积。也就是说,通过缩小粘合区域128的面积,即可增加覆盖结构12未粘合至键帽102b的面积。因此,覆盖结构12可自由延展的部位即增加,使得单位变形量并不会过大而发生上述拉扯相毗邻的按键单元102的问题。举例来说,每一个粘合区域128的面积为相对应的第一布层部分120a的面积与相对应的键帽102b的面积的1/8~1/9倍,但本发明并不以此为限。It should be noted that the bottom cladding layer 120 , the top cladding layer 122 and the thermoplastic material layer 124 of the covering structure 12 all have certain ductility. In order not to cause the adjacent key unit 102 to be pulled by the cover structure 12 when a certain key unit 102 is pressed and cause false touches, the area of each adhesive region 128 can be smaller than the corresponding first cloth layer part 120a The area of the corresponding keycap 102b. That is to say, by reducing the area of the bonding area 128 , the area of the covering structure 12 not bonded to the keycap 102 b can be increased. Therefore, the freely extensible parts of the covering structure 12 are increased, so that the unit deformation amount is not too large to cause the above-mentioned problem of pulling the adjacent key units 102 . For example, the area of each adhesive region 128 is 1/8-1/9 times the area of the corresponding first cloth layer part 120a and the area of the corresponding keycap 102b, but the present invention does not limit.
在本实施方式中,底包覆层120的材料包含尼龙,而热塑材料层124的材料包含聚氨酯,但本发明并不以此为限。In this embodiment, the material of the bottom coating layer 120 includes nylon, and the material of the thermoplastic material layer 124 includes polyurethane, but the invention is not limited thereto.
请参照图5,其为本发明另一实施方式的键盘模块30与覆盖结构1212的局部剖视图。为了使图面简化,图5中的覆盖结构1212省略绘制图2中的胶层126。Please refer to FIG. 5 , which is a partial cross-sectional view of the keyboard module 30 and the covering structure 1212 according to another embodiment of the present invention. In order to simplify the drawing, the covering structure 1212 in FIG. 5 omits the drawing of the adhesive layer 126 in FIG. 2 .
如图5所示,在本实施方式中,输入装置1的键盘模块30还包含基板100。基板100上设置有多个开关100a。每一个开关100a皆设置于相对应的按键单元302之下。每一个按键单元302为剪刀式支撑型按键,其包含剪刀式支撑结构302a、键帽302b以及弹性件302c。每一个按键单元302的剪刀式支撑结构302a枢设于基板100与键帽302b之间,从而引导键帽302b朝向或远离基板100移动。在本实施方式当中,弹性件302c可为橡胶弹性体(rubber dome),实施时则不以此为限。每一个按键单元302的弹性件302c设置于基板100与键帽302b之间,用以使被按压的键帽302b回复初始未被按压的位置。覆盖结构12覆盖且贴附于键盘模块30。覆盖结构12覆盖且贴附于键盘模块30。底包覆层120的第一布层部分120a与热塑材料层124的第一热塑材料层部分124a对应于按键单元302的区域,而底包覆层120的第二布层部分120b与热塑材料层124的第二热塑材料层部分124b对应于按键单元302以外的区域。As shown in FIG. 5 , in this embodiment, the keyboard module 30 of the input device 1 further includes a substrate 100 . A plurality of switches 100a are provided on the substrate 100 . Each switch 100a is disposed under the corresponding key unit 302 . Each key unit 302 is a scissors support type key, which includes a scissors support structure 302a, a keycap 302b and an elastic member 302c. The scissor-like supporting structure 302 a of each key unit 302 is pivotally disposed between the substrate 100 and the keycap 302 b, so as to guide the keycap 302 b to move toward or away from the substrate 100 . In this embodiment, the elastic member 302c can be a rubber dome, but it is not limited thereto in practice. The elastic member 302c of each key unit 302 is disposed between the substrate 100 and the keycap 302b, and is used to return the pressed keycap 302b to an initial unpressed position. The covering structure 12 covers and attaches to the keyboard module 30 . The covering structure 12 covers and attaches to the keyboard module 30 . The first cloth layer part 120a of the bottom cover layer 120 and the first thermoplastic material layer part 124a of the thermoplastic material layer 124 correspond to the area of the key unit 302, while the second cloth layer part 120b of the bottom cover layer 120 is in contact with the heat The second thermoplastic material layer portion 124b of the plastic material layer 124 corresponds to the area outside the key unit 302 .
根据上述结构配置,当使用者按压覆盖结构12上明显凸出的部位(即对应于第一热塑材料层部分124a与第一布层部分120a的部位)时,相对应的按键单元302的键帽302b会被朝下按压,而键帽302b又会挤压弹性件102a而变形,最后变形的弹性件102a即触发开关100a而产生按键单元302所对应的信号。According to the above structural configuration, when the user presses the obviously protruding part of the covering structure 12 (that is, the part corresponding to the first thermoplastic material layer part 124a and the first cloth layer part 120a), the corresponding key of the key unit 302 will The cap 302b will be pressed downwards, and the keycap 302b will press the elastic member 102a to deform, and finally the deformed elastic member 102a triggers the switch 100a to generate a signal corresponding to the key unit 302 .
请参照图6,其为本发明另一实施方式的键盘模块50与覆盖结构12的局部剖视图。为了使图面简化,图6中的覆盖结构1212省略绘制图2中的胶层126。Please refer to FIG. 6 , which is a partial cross-sectional view of the keyboard module 50 and the cover structure 12 according to another embodiment of the present invention. In order to simplify the drawing, the covering structure 1212 in FIG. 6 omits the drawing of the adhesive layer 126 in FIG. 2 .
如图6所示,在本实施方式中,键盘模块50为压力感应电阻式键盘,且其包含压力感应电阻基板502。根据此结构配置,当使用者按压覆盖结构12上明显凸出的部位(即对应于第一热塑材料层部分124a与第一布层部分120a的部位)时,压力感应电阻基板502会根据覆盖结构12上明显凸出的部位所在的位置而产生相对应的信号。As shown in FIG. 6 , in this embodiment, the keyboard module 50 is a pressure-sensing resistive keyboard, and it includes a pressure-sensing resistor substrate 502 . According to this structural configuration, when the user presses the obviously protruding part of the covering structure 12 (that is, the part corresponding to the first thermoplastic material layer part 124a and the first cloth layer part 120a), the pressure-sensitive resistor substrate 502 will be pressed according to the covering structure. The corresponding signal is generated based on the position of the obviously protruding part on the structure 12 .
请参照图7,其为本发明一实施方式的覆盖结构12制造方法的流程图。Please refer to FIG. 7 , which is a flowchart of a method for manufacturing the covering structure 12 according to an embodiment of the present invention.
如图7所示,并配合参照图3与图4A和图4B,在本实施方式中,覆盖结构12制造方法包含步骤S100~S110。As shown in FIG. 7 , with reference to FIG. 3 and FIG. 4A and FIG. 4B , in this embodiment, the method for manufacturing the cover structure 12 includes steps S100 - S110 .
步骤S100:提供底包覆层120。Step S100 : providing a bottom cladding layer 120 .
步骤S102:热压底包覆层120,进而形成未热压的第一布层部分120a以及经热压的第二布层部分120b。Step S102 : hot pressing the bottom cladding layer 120 to form a non-hot pressed first cloth layer portion 120 a and a hot pressed second cloth layer portion 120 b.
在此要说明的是,在实际应用中,上述步骤S102亦可同时对第一布层部分120a进行热压,只是其热压幅度较第二布层部分120b小。It should be noted here that, in practical applications, the above step S102 can also perform hot pressing on the first cloth layer part 120a at the same time, but the hot pressing range is smaller than that of the second cloth layer part 120b.
步骤S104:在底包覆层120上叠合热塑材料层124。Step S104 : laminating the thermoplastic material layer 124 on the bottom cladding layer 120 .
步骤S106:热压热塑材料层124,进而形成未热压的第一热塑材料层部分124a以及经热压的第二热塑材料层部分124b。Step S106 : heat-press the thermoplastic material layer 124 to form a non-heat-pressed first thermoplastic material layer portion 124 a and a heat-pressed second thermoplastic material layer portion 124 b.
在此要说明的是,在实际应用中,上述步骤S106亦可同时对第一热塑材料层部分124a进行热压,只是其热压幅度较第二热塑材料层部分124b小。It should be noted here that, in practical applications, the above step S106 may also perform hot pressing on the first thermoplastic material layer part 124a at the same time, but the hot pressing range is smaller than that of the second thermoplastic material layer part 124b.
步骤S108:在热塑材料层124上涂布胶层126。Step S108 : coating the adhesive layer 126 on the thermoplastic material layer 124 .
步骤S110:在热塑材料层124上叠合顶包覆层122。Step S110 : laminating the top cladding layer 122 on the thermoplastic material layer 124 .
通过上述步骤S100~S110,即可使底包覆层120、热塑材料层124与顶包覆层122叠合而构成本发明的覆盖结构12。Through the above steps S100 - S110 , the bottom cladding layer 120 , the thermoplastic material layer 124 and the top cladding layer 122 can be laminated to form the covering structure 12 of the present invention.
由以上对于本发明的具体实施方式的详述,可以明显地看出,本发明的覆盖结构是由底包覆层、顶包覆层与热塑材料层叠合而成,并且底包覆层与热塑材料层皆可通过热压而形成厚度不相同的区域。其中,底包覆层与热塑材料层热压幅度较小或未被热压的区域(覆盖结构于此区域的厚度较厚)可对应输入装置的按键单元的区域,而底包覆层与热塑材料层被热压的区域(覆盖结构于此区域的厚度较薄)可对应按键单元以外的区域。换言之,本发明的覆盖结构仅需通过简单的热压程序,即可在对应按键单元的区域形成结构明确的按压部,因此可解决现有设置按压垫片时所需面临的对位精度问题。另外,本发明的输入装置所采用的按键单元为圆顶式支撑型按键或剪刀式支撑型按键,因此使用者隔着覆盖结构按压按键单元时,可获得较佳的按压手感,并可明确地通过按压时的触感,得知按键单元所对应的开关是否已经成功触发。From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that the covering structure of the present invention is formed by laminating the bottom cladding layer, the top cladding layer and the thermoplastic material layer, and the bottom cladding layer and the The thermoplastic material layers can be formed into regions with different thicknesses by hot pressing. Wherein, the bottom coating layer and the thermoplastic material layer have a small heat-compression range or the area that has not been heat-pressed (the thickness of the covering structure in this area is thicker) can correspond to the area of the key unit of the input device, and the bottom coating layer and the thermoplastic material layer The heat-pressed area of the thermoplastic material layer (where the thickness of the covering structure is relatively thin) may correspond to the area outside the key unit. In other words, the covering structure of the present invention can form a pressing portion with a clear structure in the area corresponding to the key unit only through a simple hot pressing process, so it can solve the problem of alignment accuracy faced when the conventional pressing spacer is arranged. In addition, the key unit used in the input device of the present invention is a dome-type support key or a scissor-type support key, so when the user presses the key unit through the cover structure, a better pressing feel can be obtained, and it can clearly Whether the switch corresponding to the button unit has been successfully triggered can be known through the tactile sensation when pressed.
虽然本发明已经以实施方式公开如上,然其并非用以限定本发明,任何本领域技术人员,在不脱离本发明的精神和范围内,当可作各种变动与润饰,因此本发明的保护范围当视权利要求书所界定者为准。Although the present invention has been disclosed above in terms of implementation, it is not intended to limit the present invention. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope should be determined by what is defined in the claims.
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CN201773735U (en) * | 2010-03-26 | 2011-03-23 | 信越聚合物株式会社 | Keypad and electronic equipment adopting the same |
CN103268834A (en) * | 2013-04-28 | 2013-08-28 | 梅特勒-托利多(常州)测量技术有限公司 | Silicone membrane integrated keyboard |
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