CN104730871A - Different-space different-size substrate alignment method - Google Patents

Abstract

A method for aligning different-space different-size substrates comprises the following steps: capturing actual local images of two substrates with different sizes; comparing the specific marks in the standard local characteristic regions of the two substrates, and obtaining the specific marks in the actual local characteristic regions of the two substrates; respectively establishing actual coordinate systems of the two substrates to synthesize a pair of assembly coordinate systems; comparing coordinate values of the specific marks of the two substrates in the two actual coordinate systems to obtain a first group of offsets, and comparing the sizes of the two substrates to obtain a size difference; correcting the coordinate value of the specific mark of one of the two substrates by using the first group of offset and the dimension difference; comparing the coordinate values of the specific marks of the two substrates to obtain a second group of offsets; the substrate is moved to a position compensated by the second set of offsets.

Description

Different space and different size substrate alignment method

technical field

The invention relates to a base material alignment method, especially a base material alignment method in different spaces and different sizes, which is suitable for the alignment of two substrates of different sizes with specific marks or specific shapes in different waiting spaces .

Background technique

The typical technical application of double-layer board alignment is the precise alignment of glass masks. In addition, the scope of application of double-layer board alignment technology is very wide, such as semiconductor industry, flat-panel display industry, printed circuit board industry, etc. all its fields of application. The precise alignment of the mask is the key technology of various exposure machines in the above-mentioned electronics industry. If the key technology can be mastered to reduce manufacturing costs, it will be of great help to improve international competitiveness.

U.S. Patent No. US7946669 discloses a plug-in alignment device, which mainly inserts two charge coupled devices (Charge Coupled Device; CCD) into the double-layer board at the same time, respectively captures the images of the upper and lower alignment marks, and then performs counterpoint. The two charge-coupled devices must first be calibrated in a single coordinate space, so the alignment device belongs to the spatial alignment of imaging in a single coordinate space.

Taiwan Patent Publication No. TWI288365 discloses an alignment device for double-layer boards that meets the requirements of high-precision alignment. It mainly places two charge-coupled devices on the top of the double-layer board, and captures two sets of non-overlapping upper and lower alignments at the same time. The marked composite image is then precisely aligned after spatial operations. The two charge-coupled devices must first be calibrated in a single coordinate space, so the alignment device also belongs to the spatial alignment of imaging in a single coordinate space.

In the prior art, alignment marks are synthesized into overlapping mark images to perform alignment calculations in a single coordinate space, which can only be performed on substrates of the same size.

However, in some high-tech industries, often due to the particularity of materials, it is often encountered that alignment objects of different sizes cannot be carried out in the same image capture unit when using image visual aids for lamination, combination or combination. Trouble with image alignment. For example, in the touch panel industry, because the touch panel has various and different-sized multi-layer bonding processes, it is sometimes impossible to use the overlapping alignment mark design.

Therefore, there is a need to provide a method for aligning substrates in different spaces and sizes to solve the aforementioned problems.

Contents of the invention

The purpose of the present invention is to provide an alignment method applicable to the alignment of two substrates of different sizes with specific marks or specific shapes in different waiting spaces.

In order to achieve the above object, the present invention provides a method for aligning substrates in different spaces and sizes, which includes the following steps: using the corrected two image capture units in the first waiting space and the corrected image capture unit in the second waiting space. The two image capture units respectively capture at least two actual partial images of the two substrates of different sizes in the first and second waiting spaces; shape, and obtain the specific marks or specific shapes in at least two actual local feature areas of the two substrates; respectively establish the actual coordinate systems of the two substrates to synthesize a pair of assembly coordinate systems; compare the two actual coordinate systems The coordinate values of the specific mark or specific shape of the two substrates are used to obtain the first set of offsets, and compared with the size of the two substrates to obtain the dimensional difference; using the first set of offsets and the dimensional difference, correct the The coordinate value of a specific mark or a specific shape of one of the two substrates; compare the corrected specific mark or the coordinate value of a specific shape of the two substrates in the two actual coordinate systems with the other of the two substrates The coordinate value of a specific mark or a specific shape of the substrate to obtain a second set of offsets; the substrate of the two substrates is moved to a position compensated by the second set of offsets; using a first predetermined amount of movement, the The substrate of the two substrates is moved from the first waiting space to the alignment assembly space; and using a second predetermined movement amount, the other substrate of the two substrates is moved from the second waiting space to the alignment assembly in space.

The above method for aligning substrates in different spaces and sizes also includes the following steps:

The spatial positions of the two image capture units in a first waiting space and the two image capture units in a second waiting space are pre-calibrated.

The above method for aligning substrates in different spaces and sizes also includes the following steps:

Using the calibrated two image capture units in the first waiting space and the calibrated two image capture units in the second waiting space, pre-define specific areas within the standard local feature regions of two substrates with different sizes. mark or specific shape.

The above method for aligning substrates in different spaces and sizes also includes the following steps:

It is confirmed whether the second set of offsets is smaller than the target value to be achieved.

The above method for aligning substrates in different spaces and sizes also includes the following steps:

The stacking and alignment assembly of the two substrates is completed in the alignment assembly space.

In the above method for aligning substrates in different spaces and sizes, the step of pre-calibrating the spatial positions of the two image capture units in a first waiting space and the two image capture units in a second waiting space includes the following steps :

Superimpose two calibration sheets so that the specific marks of these calibration sheets overlap;

The superimposed calibration sheets are placed above the first and second image capture units in the first waiting space, and the first and second image capture units are moved to capture images in the first waiting space. Specific marks on both ends of the first diagonal of the dotted line encircled area of the superimposed calibration sheets, so as to correct the positions of the first and second image capture units in the first waiting space;

Setting the stacked calibration sheets under the third and fourth image capture units in the second waiting space, moving the third and fourth image capture units to capture images in the second waiting space Specific marks on both ends of the second diagonal of the dotted line surrounding area of the superimposed calibration sheets, so as to correct the positions of the third and fourth image capture units in the second waiting space; and

The corrected first to fourth image capturing units will be fixed.

In the method for aligning substrates in different spaces and sizes, the specific mark on the substrate of the two substrates is a cross-shaped mark, and the specific mark on the other substrate of the two substrates is a cross-shaped tube mark.

In the above method for aligning substrates in different spaces and sizes, the specific shape of the substrate of the two substrates is a right-angled corner, and the specific shape of the other substrate of the two substrates is a right-angled corner.

In the above method for aligning substrates in different spaces and sizes, the second set of offsets is used to compensate the X and Y axes required for the visual differences of the image capture units in the first and second waiting spaces direction displacement and rotation angle.

The alignment method of the present invention is applicable to the alignment of two substrates of different sizes with specific marks or specific shapes in different waiting spaces. When the two substrates are located in different waiting spaces, the specific marks (or specific shapes) in the actual local characteristic regions of the two substrates are used to calculate the coordinate values of the coordinates (or specific shapes) of the specific marks of the second substrates. Correcting the coordinate value of a specific mark (or a specific shape) of one of the two substrates, so that the two substrates with different sizes can be simulated as the second substrates with the same size. Then, correct and compensate for the alignment deviation of different-sized substrates in different spaces, and continue with the post-process (such as lamination or assembly), without the need to establish a complex conversion relationship between the image coordinate system and the alignment coordinate system, so it can be effectively Reduce a large number of mathematical calculations and reduce equipment adjustment time, and increase the flexibility of the alignment and bonding process.

In order to make the above and other objects, features and advantages of the present invention more apparent, a detailed description will be given below in conjunction with the accompanying drawings.

Description of drawings

1a and 1b are flow charts of an alignment method for substrates of different sizes and sizes according to an embodiment of the present invention;

Figure 2a is a schematic plan view of two calibration sheets according to an embodiment of the present invention;

FIG. 2b is a perspective view of two calibration sheets and four image capture units according to an embodiment of the present invention;

FIG. 3 is a schematic perspective view of an alignment device for different-space and different-size substrates according to an embodiment of the present invention, which shows specific marks (or specific shapes) in the standard local feature areas of two substrates of different sizes;

Fig. 4a is a schematic plan view of a first standard partial image according to an embodiment of the present invention;

Fig. 4b is a schematic plan view of a second standard partial image according to an embodiment of the present invention;

5 is a schematic perspective view of an alignment device for substrates of different sizes and sizes according to an embodiment of the present invention, which shows at least two actual partial images of two substrates in different waiting spaces;

Fig. 6a is a schematic plan view of a first actual partial image according to an embodiment of the present invention;

Fig. 6b is a schematic plan view of a second actual partial image according to an embodiment of the present invention;

7a is a schematic plan view of an alignment assembly coordinate system according to an embodiment of the present invention, which shows specific mark coordinate values (X1, Y1), (X2, Y2) and specific mark coordinate values (X3, Y3), (X4, Y4);

Fig. 7b is a schematic plan view of an alignment assembly coordinate system according to an embodiment of the present invention, which shows specific shape coordinate values (X1, Y1), (X2, Y2) and specific shape coordinate values (X3, Y3), (X4, Y4);

Fig. 8a is a schematic plan view of an alignment assembly coordinate system according to an embodiment of the present invention, which shows that the specific mark coordinate values are corrected as (X1', Y1'), (X2', Y2') and the specific mark coordinate values (X3, Y3), (X4, Y4);

Fig. 8b is a schematic plan view of an alignment assembly coordinate system according to an embodiment of the present invention, which shows that the specific shape coordinate values are corrected to (X1', Y1'), (X2', Y2') and the specific shape coordinate values (X3, Y3), (X4, Y4);

9 is a schematic perspective view of an alignment device for substrates of different sizes and different sizes according to an embodiment of the present invention, which shows that the substrate is moved to a position compensated by the second set of offsets of the second substrate;

FIG. 10 is a schematic perspective view of an alignment device for different-space and different-size substrates according to an embodiment of the present invention, which shows that two substrates move from their respective waiting spaces to the alignment assembly space; and

11 is a schematic perspective view of an alignment device for substrates of different sizes and sizes according to an embodiment of the present invention, which shows that the two substrates are stacked and assembled in the alignment assembly space.

Among them, reference signs:

11 Calibration film 12 Calibration film

20 First Substrate 20’ First Substrate

21 touch panel

22a Specific markings 22a’ Specific markings

22b Specific shape 22b’ Specific shape

30 second substrate 30’ second substrate

31 LCD panel 31’ LCD panel

32a Specific Marking 32a’ Specific Marking

32b Specific shape 32b’ Specific shape

40 Three-axis moving mechanism 60 Carrying platform

70 rotating table

100 First waiting space 200 Second waiting space

300 alignment assembly space

510 The first standard local image 511 The first standard local feature area

520 The first standard local image 521 The first standard local feature area

810 The second standard local map 811 The second standard local feature area

820 The second standard local map 821 The second standard local feature area

910 The first actual local image 911 The first actual local feature area

920 The first actual local image 921 The first actual local feature area

930 Second Actual Partial Image 931 Second Actual Partial Feature Area

940 Second Actual Partial Image 941 Second Actual Partial Feature Area

CCD1 Image Capture Unit CCD2 Image Capture Unit

CCD3 Image Capture Unit CCD4 Image Capture Unit

S01～S13 steps

(X1, Y1), (X2, Y2) center coordinate value (X1’, Y1’), (X2’, Y2’) center coordinate value

(X3, Y3), (X4, Y4) center coordinates

△X1' the first predetermined movement amount △X2' the second predetermined movement amount

△X3, △Y3, △θ3 second set of offset △Z scheduled movement

Detailed ways

In order to make the above and other objects, features, and advantages of the present invention more comprehensible, preferred embodiments of the present invention will be exemplified below in detail with reference to the accompanying drawings. Furthermore, the directional terms mentioned in the present invention, such as "up", "down", "front", "rear", "left", "right", "inside", "outside" or "side", etc., It is only with reference to the direction of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.

1a and 1b are flowcharts of an alignment method for substrates with different dimensions and dimensions according to an embodiment of the present invention. The alignment method comprises the following steps: Step (S01), pre-calibrating the spatial positions of the two image capture units in the first waiting space and the two image capture units in the second waiting space; step (S02), using The corrected two image capture units in the first waiting space and the corrected two image capture units in the second waiting space predefine the specific marks in the standard local feature regions of the two substrates of different sizes (or a specific shape); Step (S03), using the corrected two image capture units in a first waiting space and the corrected two image capture units in a second waiting space to respectively capture the At least two actual partial images of the two substrates in the first and second waiting spaces; step (S04), respectively comparing the specific marks (or specific shapes) in the standard local feature regions of the two substrates, and obtaining the images of the two substrates Specific marks (or specific shapes) in at least two actual local feature areas; step (S05), respectively establishing the actual coordinate systems of the two substrates, to synthesize a pair of assembly coordinate systems; step (S06), comparing the two actual The coordinate values of the specific marks (or specific shapes) of the two substrates in the coordinate system to obtain the first set of offsets, and compare the size of the two substrates to obtain the size difference; step (S07), using the first set Offset and size difference, correcting the coordinate value of the specific mark (or specific shape) of one of the two substrates; (S08), comparing the corrected one of the two substrates in the two actual coordinate systems The coordinate value of a specific mark (or a specific shape) and the coordinate value of a specific mark (or a specific shape) of the other substrate of the two substrates to obtain a second set of offsets; step (S09), the one of the two substrates The substrate moves to the position compensated by the second set of offsets; step (S10), confirming whether the second set of offsets is less than the target value to be achieved; step (S11), using a first predetermined amount of movement, so that The substrate of the two substrates is moved from the first waiting space to the pair-position assembly space; step (S12), using a second predetermined movement amount, moving the other substrate of the two substrates from the second waiting space to the in the alignment assembly space; and step (S13), making the two substrates complete stacking alignment assembly in the alignment assembly space. The present invention will use Figures 1 to 11 to describe in detail the implementation details and principles of the above steps one by one.

1a, 2a and 2b, in step (S01), the spatial positions of the two image capture units in the first waiting space and the two image capture units in the second waiting space are pre-calibrated. In this embodiment, the two image capture units CCD1 and CCD2 in the first waiting space 100 and the two image capture units CCD3 in the second waiting space 200 are pre-calibrated with the stacked calibration sheets 11 and 12 , the spatial location of CCD4. For example, referring to Fig. 2a, two calibration sheets 11, 12 are stacked so that the specific marks on these calibration sheets 11, 12 overlap. The correction sheets 11, 12 can be transparent substrates, so as to facilitate the image capturing units CCD1, CCD2, CCD3, and CCD4 to capture images of specific marks. The calibration sheets 11 , 12 include a region surrounded by a dotted line, which is simulated as a small-sized first substrate. For example, the region surrounded by a dotted line is a rectangle with a first diagonal. The correction sheets 11 , 12 include a solid-line surrounding area, which simulates a large-sized second substrate, for example, the solid-line surrounding area is a rectangle, which has a second diagonal. The second diagonal is larger than the first diagonal. The superimposed correction sheets 11, 12 are placed above the two image capture units CCD1, CCD2 in the first waiting space 100, and the two image capture units CCD1, CCD2 are moved to capture the images in the first waiting space 100. Specific marks 22a at both ends of the first diagonal of the dotted line surrounding area of the stacked calibration sheets 11, 12 in the waiting space 100, so as to calibrate the two image capture units CCD1, CCD2 in the first waiting space 100 s position. Then, the superimposed correction sheets 11, 12 are placed under the two image capture units CCD3, CCD4 in the second waiting space 200, and the two image capture units CCD3, CCD4 are moved to capture the image in the second waiting space. In the space 200, the specific marks 32a on the two ends of the second diagonal of the dotted line surrounding the area of the stacked calibration sheets 11 and 12 are used to calibrate the two image capture units CCD3 and CCD4 in the second waiting space 200. Location. The corrected image capture units CCD1 , CCD2 , CCD3 , and CCD4 will be fixed.

Please refer to Fig. 1a, 3, 4a and 4b, in step (S02), utilize the corrected two image capture units in the first waiting space and the corrected two image capture units in the second waiting space , to predefine specific marks (or specific shapes) within standard local feature regions of two substrates of different sizes. In this embodiment, a set of three-axis moving mechanisms 40 are used to fix a first substrate 20 in the first waiting space 100 (but not limited thereto) in the form of vacuum suction nozzles or grippers. The three-axis moving mechanism 40 is used for moving the first substrate 20 to a position assembly space 300 with a first predetermined moving amount. Furthermore, at least one set of carrying platforms 60 and a transfer mechanism are preset, and the carrying platforms 60 are used to carry a second substrate 30 and fix the second substrate 30 in the transfer mechanism in the second waiting space 200 on (but not limited to) The transfer mechanism can be a rotary table 70 for horizontally rotating and moving the carrier table 60 and the second substrate 30 to the alignment assembly space 300 along the X/Y plane by a second predetermined moving amount. In other applications, the transfer mechanism can also be a sliding table for linearly moving the carrier table 60 and the second substrate 30 to the alignment assembly space 300 along the X/Y plane.

In this embodiment, the first substrate 20 can be selected from, for example: one of the single-layer circuit substrates constituting a multilayer printed circuit board, one of the glass substrates constituting a liquid crystal panel module, a display frame, a touch panel panel or a liquid crystal panel, a glass mask or a wafer, a chemical test paper or a protective film, but not limited thereto. The first substrate 20 takes a touch panel 21 as an example, and the touch panel 21 has several specific marks 22a (such as cross-shaped marks) or specific shapes 22b (such as right-angled corners). Furthermore, the second substrate 30 can be selected from another component correspondingly assembled with the above-mentioned first substrate 20 . The second substrate 30 takes a liquid crystal panel 31 as an example, the size of the liquid crystal panel 31 is larger than the size of the touch panel 21, and the liquid crystal panel 31 has several specific marks 32a (such as cross tube marks) or specific shapes 32b ( such as a right angle corner). The second substrate 30 (liquid crystal panel) can be assembled together with the first substrate 20 (such as the touch panel 20') to form a semi-finished product of a touch display.

The two image capture units CCD1 and CCD2 can be Charge Coupled Devices (CCD) or Complementary Metal Oxide Semiconductor (CMOS) type image capture units. In this embodiment, the first standard partial images 510 , 520 of the first substrate 20 are captured by the image capture units CCD1 , CCD2 of the charge-coupled device (CCD) type. For example, the corrected image capture units CCD1, CCD2 have been respectively arranged below the two ends of the diagonal line corresponding to the first substrate 20, so as to capture the first standard partial image 510, 520. Next, the first standard partial images 510, 520 will be transmitted to a near-end or far-end image processing device (not shown, such as a computer), and the image processing device will generate the first standard partial images 510, 520 In 520, a specific mark 22a (or a specific shape 22b) in the first standard local feature area 511, 521 is predefined respectively, and its shape feature data is stored.

Meanwhile, the two image capture units CCD3 and CCD4 can also be charge coupled device (CCD) or complementary metal oxide semiconductor (CMOS) type image capture units. In this embodiment, the second standard partial images 810 , 820 of the second substrate 30 are captured by the image capture units CCD3 , CCD4 of the charge-coupled device (CCD) type. For example, the calibrated image capture units CCD3 and CCD4 are respectively pre-set above the two ends of the diagonal line corresponding to the second substrate 30 so as to capture the second standard partial image 810 of the second substrate 30 , 820. Next, the second standard partial images 810, 820 will be sent to the same image processing device, and the image processing device will predefine the second standard partial feature regions 811, 821 respectively in the second standard partial images 810, 820. A specific mark 32a (or a specific shape 32b) inside, and store its shape feature data.

Steps (S01) and (S02) need to be completed before the official start of assembly. The purpose is to pre-calibrate the spatial positions of the four image capture units CCD1, CCD2, CCD3, and CCD4, and store the first standard The shape feature data of the specific mark 22a (or specific profile 22b) in the local feature area 511, 521 and the specific mark 32a (or specific profile 32b) in the second standard local feature area 811, 821, for the following steps (S03 ) will be used as a reference benchmark for image comparison in the future.

Please refer to Fig. 1a, 5, 6a and 6b, in step (S03), utilize the corrected two image capturing units in the first waiting space and the corrected two image capturing units in the second waiting space , capturing at least two actual partial images of the two substrates in the first and second waiting spaces, respectively. In this embodiment, a piece of the first substrate 20' (such as the touch panel 31') to be aligned is sucked or clamped and placed under the three-axis moving mechanism 40 and located in the first waiting space 100. At the same time, another second substrate 30' (such as a liquid crystal panel 31') to be aligned is placed on the carrying platform 60 of the rotating platform 70 in the second waiting space 200. The first waiting space 100 is at a distance from the second waiting space 200 , and there is an alignment assembly space 300 between them.

Next, use the two image capture units CCD1, CCD2 to capture two first actual partial images 910, 920 of the first substrate 20', for example, when assembling formally, use the same image as that used in step (S02). The two image capture units CCD1 and CCD2 capture two first actual partial images 910 and 920 of the first substrate 20 ′ to be aligned.

At the same time, the two image capture units CCD3 and CCD4 are also used to capture two second actual partial images 930 and 940 of the second substrate 30 ′, for example, when assembling formally, the same method as that used in step (S02) is used. The two image capture units CCD3, CCD4 capture two second actual partial images 930, 940 of the second substrate 30' to be aligned.

Please refer to FIGS. 1a, 4a and 4b, 6a and 6b again. In step (S04), compare the specific marks (or specific shapes) in the standard local feature regions of the two substrates respectively, and obtain at least two images of the two substrates. Specific marks (or specific shapes) within the actual local feature area. In this embodiment, the two first actual partial images 910, 920 will be sent to the same image processing device (such as a computer), and the image processing device will make each of the first actual partial images 910, 920 and the standard partial image The shape feature data of the specific mark 22a or the specific shape 22b of the feature area 511, 521 are compared to obtain the two first standard partial feature areas 511, 521 in the first actual partial image 910, 920. The specific mark 22a' (such as a cross-shaped mark) or the specific shape 22b' (such as a right-angled corner) of the actual local feature area 911, 921, and store its shape feature data for future use.

At the same time, the two second actual partial images 930, 940 will be sent to the same image processing device, and the image processing device will make each of the second actual partial images 930, 940 and the second standard partial feature region 811, 821 The shape feature data of the specific mark 32a (or the specific shape 32b) is compared to obtain two second actual partial feature areas 931 in the second actual partial images 930, 940 that match the second standard partial feature areas 811, 821 , 941 of the specific mark 32a' (such as a cross-shaped mark) or the specific shape 32b' (such as a right-angled corner), and store its shape feature data for future use.

Please refer to FIGS. 1a, 7a and 7b. In step (S05), the actual coordinate systems of the two substrates are respectively established to synthesize a pair of assembly coordinate systems. Please refer to FIGS. 6a and 7a again. In this embodiment, the same image processing device (such as a computer) can be used to perform calculations to obtain the center coordinate values ( X1, Y1), (X2, Y2) (ie the position of the first square virtual black dot), to establish the first actual coordinate system of the first substrate 20 ′. Please refer to FIGS. 6a and 7b again. In another embodiment, the same image processing device (such as a computer) can be used to perform calculations to obtain the center coordinate values of the specific outline 22b' of each of the first actual local feature regions 911, 921. (X1, Y1), (X2, Y2) (ie the position of the first square virtual black dot), to establish the first actual coordinate system of the first substrate 20 ′. The first actual coordinate system of the first substrate 20' can be established by two sets of coordinate values (X1, Y1) and (X2, Y2).

At the same time, please refer to Figures 6b and 7a again. In this embodiment, the present invention can also use the same image processing device (such as a computer) to perform calculations to obtain the specific marks 32a' of the second actual local feature regions 931, 941. The coordinate values (X3, Y3) and (X4, Y4) of the center (that is, the position of the virtual black point of the triangle) are used to establish the second actual coordinate system of the second substrate 30 ′. Finally, the first and second actual coordinate systems are synthesized into a pair of assembly coordinate systems. Please refer to FIGS. 6b and 7b again. In another embodiment, the same image processing device (such as a computer) can be used to perform calculations to obtain the center coordinate values of the specific outline 32b' of each of the first actual local feature regions 911, 921. (X3, Y3), (X4, Y4) (that is, the position of the virtual black point of the triangle), so as to establish the first actual coordinate system of the second substrate 30 ′. The second actual coordinate system of the second substrate 30' can be established by two sets of coordinate values (X3, Y3) and (X4, Y4). Finally, the first and second actual coordinate systems are synthesized into a pair of assembly coordinate systems.

Please refer to Fig. 1a, 7a and 7b, in step (S06), compare the specific mark (or specific shape) coordinate value of the two substrates in the two actual coordinate systems to obtain the first set of offsets, and compare the The size of the two substrates is used to obtain the size difference. In this embodiment, when comparing the coordinate values (X1, Y1), (X2, Y2) of the first substrate 20' of the first actual coordinate system and the coordinate values (X1, Y1) and (X2, Y2) of the second actual coordinate system When the coordinate values (X3, Y3) and (X4, Y4) of the specific mark (or specific shape) of the second substrate 30', the first set of displacements in the required X and Y axis directions and theta rotation angle can be obtained ΔX1, ΔY1, Δθ1 are used to compensate the visual difference of the image capture units in the first and second waiting spaces.

Please refer to Fig. 1b, 6a, 6b, 8a and 8b, in step (S07), use the first set of offset and the size difference to correct the specific mark (or specific shape) of one of the two substrates coordinate value. In this embodiment, the same image processing device (such as a computer) can be used to perform calculations, and the first actual partial feature regions 911, 911, The central coordinate values (X1, Y1), (X2, Y2) of the specific mark 22a' (or specific profile 22b') of 921 are corrected as (X1', Y1'), (X2', Y2') (that is, the second square virtual black dot position), so that the specific mark 22a' (or specific shape 22b') of the first substrate 20' in the alignment assembly coordinate system is corrected after the center coordinate values (X1', Y1'), (X2 ', Y2') close to the center coordinate values (X1', Y1'), (X2', Y2') of the specific mark 32a' (or specific shape 32b') of the second substrate 30' (that is, the second square virtual position of the black dot).

Please refer to Fig. 1b, 8a and 8b again, in step (S08), compare the specific mark (or specific shape) coordinate value after the correction of the substrate of the two substrates in the two actual coordinate systems with the coordinate value of the substrate of the two substrates. A specific mark (or a specific shape) coordinate value of another substrate to obtain a second set of offsets. In this embodiment, when comparing the corrected center coordinate values (X1', Y1'), (X2', Y2') of the specific mark (or specific shape) of the first substrate 20' of the first actual coordinate system And when the central coordinate values (X3, Y3) and (X4, Y4) of the specific mark (or specific shape) of the second substrate 30' of the second actual coordinate system, the required displacement and rotation in the X and Y axis directions can be obtained The second set of angle offsets ΔX3, ΔY3, Δθ3 are used to compensate the visual difference of the image capture units in the first and second waiting spaces.

Referring to FIGS. 1 b and 9 again, in step ( S09 ), one of the two substrates is moved to a position compensated by the second set of offsets. In this embodiment, according to the second set of offsets obtained in step (S08), the first substrate 20' is moved to a position compensated by the second set of offsets by the three-axis moving mechanism 40. The second set of offsets ΔX3, ΔY3, and Δθ3 referred to in the present invention do not include the first position in the X-axis direction required for the first substrate 20' to move from the first waiting space 100 to the alignment assembly space 300. A predetermined amount of movement ΔX1' and a second predetermined amount of movement ΔX2' in the X-axis direction required for the second substrate 30' to move from the second waiting space 200 to the alignment assembly space 300, that is, the first The difference between the first actual coordinate system of the substrate 20' and the second actual coordinate system of the second substrate 30' in the X-axis direction is actually ΔX3+ΔX1'+ΔX2', but the first substrate 20' To move from the first actual coordinate system to the alignment assembly space 300 in the direction of the X axis, the offset ΔX3+ΔX1' is required.

In step (S10), it is confirmed whether the second set of offsets is smaller than the target value to be achieved. In this embodiment, if it is not less than the target value to be achieved, then return to step (S08); otherwise, if it is less than the target value to be achieved, then enter the next step (S11).

Referring to FIGS. 1b and 10 , in step ( S11 ), one of the two substrates is moved from the first waiting space to a position assembly space by using a first predetermined moving amount. In this embodiment, the first substrate 20' is moved by the three-axis moving mechanism 40, which moves the first substrate 20' to one of the alignment assembly spaces 300 according to the first predetermined movement amount ΔX1'. Correct position to be assembled.

Referring to FIGS. 1b and 10 again, in step ( S12 ), the other one of the two substrates is moved from the second waiting space to the aligning assembly space by using a second predetermined moving amount. In this embodiment, the rotating table 70 can be used to horizontally rotate and move the carrier table 60 and the second substrate 30' along the X/Y plane into the alignment assembly space 300, which is based on the second predetermined moving amount ΔX2' The second substrate 30' is moved to another correct position to be assembled in the alignment assembly space 300 (such as directly below or directly above the Z-axis of the first substrate 20') to wait for assembly.

Referring to FIGS. 1b and 11 again, in step ( S13 ), the two substrates are stacked and assembled in the alignment assembly space. In this embodiment, the three-axis moving mechanism 40 can be used to move the first substrate 20 ′ along the Z axis by a predetermined amount of movement ΔZ (for example, move vertically downward by a predetermined distance), until it is aligned with the alignment assembly space 300 The second substrate 30 ′ on the carrying platform 60 in the middle is completed until the stacking alignment assembly is completed. In this way, the alignment and assembly operation of the first substrate 20' and the second substrate 30' can be completed.

The alignment method of the present invention is applicable to the alignment of two substrates of different sizes with marks or without marks in different waiting spaces. When the two substrates are located in different waiting spaces, the specific marks (or specific shapes) in the actual local characteristic regions of the two substrates are used to calculate the coordinate values of the coordinates (or specific shapes) of the specific marks of the second substrates. Correcting the coordinate value of a specific mark (or a specific shape) of one of the two substrates, so that the two substrates with different sizes can be simulated as the second substrates with the same size. Then, correct and compensate for the alignment deviation of different-sized substrates in different spaces, and continue with the post-process (such as lamination or assembly), without the need to establish a complex conversion relationship between the image coordinate system and the alignment coordinate system, so it can be effectively Reduce a large number of mathematical calculations and reduce equipment adjustment time, and increase the flexibility of the alignment and bonding process.

Different from the known methods, the method for aligning substrates of different sizes and sizes in the present invention provides a solution, which can truly solve the problem that the substrates of different sizes cannot be precisely aligned and bonded in the process. The method for aligning substrates in different spaces and sizes according to the present invention can be applied to various high-tech industries, such as the touch panel industry. The image alignment of different-sized substrates in space improves the production speed and flexibility of the process.

To sum up, what is described above is only the description of the implementation or examples of the technical means adopted by the present invention to solve the problems, and is not intended to limit the scope of the patent implementation of the present invention. That is, all equivalent changes and modifications that are consistent with the scope of the patent application of the present invention, or made according to the scope of the patent of the present invention, are covered by the scope of the patent of the present invention.

Claims (9)

1. the different sized substrate alignment method in different space, is characterized in that, comprise the following steps:

Utilize two image acquisition units after two image acquisition units after the correction in one first waiting space and the correction in one second waiting space, capture at least two actual topographies of two substrates of the different size in this first and second waiting space respectively;

Specific markers in the standard local characteristic region of this two substrate of difference comparison or given configuration, and the specific markers obtained at least two actual local characteristic region of this two substrate or given configuration;

Set up the actual coordinate system of this two substrate respectively, to synthesize a pair hyte dress coordinate system;

The specific markers of two substrates in this two actual coordinates system of comparison or the coordinate figure of given configuration are to obtain first group of side-play amount, and the size of this two substrate of comparison is to obtain size residual quantity;

Utilize this first group of side-play amount and this size residual quantity, revise the wherein specific markers of a substrate or the coordinate figure of given configuration of this two substrate;

The revised specific markers of wherein this substrate of two substrates in this two actual coordinates system of comparison or the coordinate figure of given configuration and the specific markers of wherein another substrate of this two substrate or the coordinate figure of given configuration, to obtain second group of side-play amount;

Wherein this substrate of two substrates is moved to the position that this second group of side-play amount compensates;

Utilize one first predetermined amount of movement, make wherein this substrate of two substrates move in a pair assembling space by this first waiting space; And

Utilize one second predetermined amount of movement, wherein another substrate of two substrates is moved in this contraposition assembling space by this second waiting space.

2. the different sized substrate alignment method in different space as claimed in claim 1, is characterized in that, also comprise the following step:

The locus of two image acquisition units of precorrection in one first waiting space and two image acquisition units in one second waiting space.

3. the different sized substrate alignment method in different space as claimed in claim 2, is characterized in that, also comprise the following step:

Utilize two image acquisition units after two image acquisition units after the correction in this first waiting space and the correction in this second waiting space, the specific markers in the standard local characteristic region of two substrates of predefine different size or given configuration.

4. the different sized substrate alignment method in different space as claimed in claim 3, is characterized in that, also comprise the following step:

Confirm whether this second group of side-play amount is less than the desired value for reaching.

5. the different sized substrate alignment method in different space as claimed in claim 4, is characterized in that, also comprise the following step:

Make this two substrate in contraposition assembling space, complete stacking contraposition assembling.

6. the different sized substrate alignment method in different space as claimed in claim 2, it is characterized in that, wherein the step of the locus of two image acquisition units of precorrection in one first waiting space and two image acquisition units in one second waiting space comprises the following step:

By superimposed for two correcting sheets, make the specific markers of those correcting sheets overlapping;

Those correcting sheets after superimposed are arranged at above first and second image acquisition unit in this first waiting space, this first and second image acquisition unit mobile with the specific markers at first cornerwise two ends of the dotted line circle zone of those correcting sheets after superimposed in this first waiting space of acquisition, so to correct the position of this first and second image acquisition unit in this first waiting space;

Those correcting sheets after superimposed are arranged at below the 3rd and the 4th image acquisition unit in this second waiting space, mobile 3rd and the 4th image acquisition unit with the specific markers at second cornerwise two ends of the dotted line circle zone of those correcting sheets after superimposed in this second waiting space of acquisition, so to correct the position of the 3rd and the 4th image acquisition unit in this second waiting space; And

This first to fourth image acquisition unit after correction will be fixed motionless.

7. the different sized substrate alignment method in different space as claimed in claim 1, is characterized in that, wherein this two substrate wherein this substrate be specifically marked as cross shape marks, and wherein another substrate of this two substrate be specifically marked as the tubular mark of cross.

8. the different sized substrate alignment method in different space as claimed in claim 1, is characterized in that, wherein the given configuration of wherein this substrate of this two substrate is right angle corner, and the given configuration of wherein another substrate of this two substrate is right angle corner.

9. the different sized substrate alignment method in different space as claimed in claim 1, it is characterized in that, wherein this second group of side-play amount in order to compensate those image acquisition units in this first and second waiting space vision difference needed for X, Y direction displacement and the anglec of rotation.