CN104702262A - Induction misjudgment avoiding structure and input device - Google Patents
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Abstract
本发明提供一种输入装置及其回避感应误判结构。回避感应误判结构包含电路支撑结构层及感应层,其中电路支撑结构层具有复数个电路支撑结构,且复数个电路支撑结构分别用以支撑压电致动器。感应层设置于电路支撑结构层下方,并包含复数个感应单元,复数个感应单元分别对应复数个电路支撑结构。电路支撑结构层及感应层至少其中之一具有复数个切割槽,复数个切割槽以单个化复数个电路支撑结构及/或单个化复数个感应单元,使得复数个电路支撑结构中相邻的电路支撑结构及/或复数个感应单元中相邻的感应单元不直接对应连接。本发明的回避感应误判结构设计可有效达到输入装置操作上的感应分离增进感应正确性,同时保持输入装置的完整性。
The invention provides an input device and its structure for avoiding induction misjudgment. The avoidance induction misjudgment structure includes a circuit support structure layer and an induction layer, wherein the circuit support structure layer has a plurality of circuit support structures, and the plurality of circuit support structures are respectively used to support the piezoelectric actuator. The sensing layer is arranged under the circuit supporting structure layer and includes a plurality of sensing units corresponding to the plurality of circuit supporting structures respectively. At least one of the circuit support structure layer and the induction layer has a plurality of cutting grooves, and the plurality of cutting grooves are used to singulate the plurality of circuit support structures and/or singulate the plurality of sensing units, so that adjacent circuits in the plurality of circuit support structures The supporting structure and/or adjacent sensing units in the plurality of sensing units are not directly correspondingly connected. The structural design for avoiding induction misjudgment of the present invention can effectively achieve the separation of induction in the operation of the input device and improve the correctness of induction while maintaining the integrity of the input device.
Description
技术领域technical field
本发明关于一种回避感应误判结构,具体而言,本发明关于一种可避免感应误判发生的输入装置及其回避感应误判结构。The present invention relates to an induction misjudgment avoidance structure, specifically, the invention relates to an input device capable of avoiding induction misjudgment and an induction misjudgment avoidance structure thereof.
背景技术Background technique
随着电子装置的薄型化要求日益增高,适用的按键结构高度显著缩小。因此,习知按压行程较大的机械式按键结构已逐渐为小行程按键或触碰式按键所取代。然而,按键尺寸的缩小也表示输入装置的感应阵列亦相应的缩小,使得感应误判的机会也随之增加。习知键盘通常使用外加物理结构来限制按键的操作范围,造成装置整体的体积无法有效缩减。With the increasingly high requirements for the thinning of electronic devices, the height of the applicable key structure is significantly reduced. Therefore, the conventional mechanical key structure with a large pressing stroke has been gradually replaced by small stroke keys or tactile keys. However, the reduction of the key size also means that the sensing array of the input device is also correspondingly reduced, which increases the chance of sensing misjudgment. Conventional keyboards usually use an additional physical structure to limit the operating range of the keys, resulting in an ineffective reduction in the overall size of the device.
再者,习知具有触控式按键的薄型键盘通常让使用者直接接触感应阵列,或只在感应阵列上设置一层薄膜,缺乏避免多重感应或误触的结构。亦即,当使用手指触摸等方式触发感应区块时,容易发生同时触发多个感应区块的情况;或者当欲触摸感应阵列中无感应区块的空隙时,容易发生误触造成感应误判。Furthermore, conventional thin keyboards with touch buttons usually allow users to directly touch the sensing array, or only set a layer of thin film on the sensing array, lacking a structure to prevent multiple sensing or false touches. That is to say, when the sensing blocks are triggered by means of finger touch, it is easy to trigger multiple sensing blocks at the same time; .
因此,如何在不增加装置体积的情况下有效达到回避感应误判为研发的主要议题之一。Therefore, how to effectively avoid sensory misjudgment without increasing the size of the device is one of the main issues of research and development.
发明内容Contents of the invention
本发明目的之一在于提供一种输入装置的回避感应误判结构,其藉由在电路支撑结构层及/或感应层形成切割槽来达到各感应单元感应上的分离同时可保持整体形状上的完整性。One of the objects of the present invention is to provide a structure for avoiding misjudgment of induction of an input device, which achieves the separation of each induction unit in induction by forming cutting grooves in the circuit support structure layer and/or induction layer while maintaining the overall shape. integrity.
本发明目的之二在于提供一种输入装置的回避感应误判结构,其藉由切割槽开口不相互面对面的设计,来提升感应单元于感应上的分离效果。The second object of the present invention is to provide a structure for avoiding misjudgment of induction of the input device, which improves the separation effect of the induction unit on the induction by the design that the openings of the cutting grooves do not face each other.
于一实施例,本发明的输入装置的回避感应误判结构,输入装置具有复数个压电致动器,包含电路支撑结构层及感应层,其中电路支撑结构层具有复数个电路支撑结构,且该复数个电路支撑结构分别用以支撑该复数个压电致动器;感应层设置于电路支撑结构层下方,且感应层包含复数个感应单元,复数个感应单元分别对应复数个电路支撑结构。电路支撑结构层及感应层至少其中之一具有复数个切割槽,该复数个切割槽以单个化复数个电路支撑结构及/或单个化复数个感应单元,使得该复数个电路支撑结构中中相邻的电路支撑结构及/或该复数个感应单元中相邻的感应单元不直接对应连接。In one embodiment, the structure for avoiding misjudgment of the input device of the present invention, the input device has a plurality of piezoelectric actuators, including a circuit support structure layer and a sensing layer, wherein the circuit support structure layer has a plurality of circuit support structures, and The plurality of circuit supporting structures are respectively used to support the plurality of piezoelectric actuators; the sensing layer is disposed under the circuit supporting structure layer, and the sensing layer includes a plurality of sensing units corresponding to the plurality of circuit supporting structures. At least one of the circuit supporting structure layer and the sensing layer has a plurality of cutting grooves, and the plurality of cutting grooves are used to singulate the plurality of circuit supporting structures and/or singulate the plurality of sensing units, so that phases in the plurality of circuit supporting structures Adjacent circuit support structures and/or adjacent sensing units in the plurality of sensing units are not directly correspondingly connected.
于一实施例,该复数个切割槽形成于该电路支撑结构层,该复数个切割槽分别围绕该复数个电路支撑结构,使得该复数个电路支撑结构分别藉由至少一连接部相互连接,且该复数个电路支撑结构中相邻的该电路支撑结构的该至少一连接部错开设置。In one embodiment, the plurality of cutting grooves are formed on the circuit supporting structure layer, and the plurality of cutting grooves respectively surround the plurality of circuit supporting structures, so that the plurality of circuit supporting structures are respectively connected to each other through at least one connecting portion, and The at least one connecting portion of the adjacent circuit supporting structures among the plurality of circuit supporting structures is arranged in a staggered manner.
于一实施例,该复数个切割槽成于该感应层,该复数个切割槽以分别围绕该复数个感应单元,使得该复数个感应单元分别藉由至少一连接部相互连接,且该复数个感应单元中相邻的该感应单元的该至少一连接部错开设置。In one embodiment, the plurality of cutting grooves are formed on the sensing layer, and the plurality of cutting grooves respectively surround the plurality of sensing units, so that the plurality of sensing units are connected to each other through at least one connecting portion, and the plurality of The at least one connecting portion of the adjacent sensing units among the sensing units is staggered.
于一实施例,该复数个切割槽为至少一开放环形切割槽,该开放环形切割槽为矩形环或圆形环。In one embodiment, the plurality of cutting grooves are at least one open annular cutting groove, and the open annular cutting groove is a rectangular ring or a circular ring.
于一实施例,该复数个切割槽形成于该电路支撑结构层,该复数个切割槽分别位于该复数个电路支撑结构的周围,使得该复数个电路支撑结构中相邻的该电路支撑结构的至少一侧边互不相连。In one embodiment, the plurality of cutting grooves are formed on the circuit support structure layer, and the plurality of cutting grooves are respectively located around the plurality of circuit support structures, so that the adjacent circuit support structures of the plurality of circuit support structures At least one side is not connected to each other.
于一实施例,该复数个切割槽形成于该感应层,该复数个切割槽分别位于该复数个感应单元的周围,使得该复数个感应单元中相邻的该感应单元的至少一侧边互不相连。In one embodiment, the plurality of cutting grooves are formed on the sensing layer, and the plurality of cutting grooves are respectively located around the plurality of sensing units, so that at least one side of the sensing units adjacent to each other in the plurality of sensing units Not connected.
于一实施例,该复数个切割槽为复数条直线切割槽,其中该复数条直线切割槽至少有一端互不连通。In one embodiment, the plurality of cutting grooves are a plurality of straight cutting grooves, wherein at least one end of the plurality of straight cutting grooves is not connected to each other.
于另一实施例,本发明提供一种具有回避感应误判结构的输入装置,其中输入装置包含复数个压电致动器、电路支撑结构层以及感应层。复数个压电致动器用于接受按压力。电路支撑结构层具有复数个电路支撑结构,复数个电路支撑结构分别用以支撑复数个压电致动器。感应层设置于电路支撑结构层下方,且感应层包含复数个感应单元以分别对应复数个电路支撑结构。电路支撑结构层及感应层至少其中之一具有复数个切割槽,复数个切割槽以单个化复数个电路支撑结构及/或单个化复数个感应单元,使得该复数个电路支撑结构中相邻的电路支撑结构及/或该复数个感应单元中相邻的感应单元不直接对应连接。当复数个压电致动器其中之一接受按压力时,传递该按压力至对应的该复数个电路支撑结构其中之一以触发对应的该复数个感应单元的其中之一,该复数个切割槽避免该按压力传递到未被按压的压电致动器对应的感应单元。In another embodiment, the present invention provides an input device with an induction misjudgment avoidance structure, wherein the input device includes a plurality of piezoelectric actuators, a circuit supporting structure layer, and a sensing layer. A plurality of piezoelectric actuators are used to receive pressing force. The circuit support structure layer has a plurality of circuit support structures, and the plurality of circuit support structures are respectively used to support a plurality of piezoelectric actuators. The sensing layer is disposed under the circuit supporting structure layer, and the sensing layer includes a plurality of sensing units respectively corresponding to the plurality of circuit supporting structures. At least one of the circuit supporting structure layer and the sensing layer has a plurality of cutting grooves, and the plurality of cutting grooves are used to singulate the plurality of circuit supporting structures and/or singulate the plurality of sensing units, so that adjacent ones of the plurality of circuit supporting structures The circuit support structure and/or the adjacent sensing units in the plurality of sensing units are not directly correspondingly connected. When one of the plurality of piezoelectric actuators receives a pressing force, it transmits the pressing force to the corresponding one of the plurality of circuit support structures to trigger the corresponding one of the plurality of sensing units, and the plurality of cutting The groove prevents the pressing force from being transmitted to the corresponding sensing unit of the piezoelectric actuator that is not pressed.
于一实施例,复数个切割槽形成于电路支撑结构层,复数个切割槽分别围绕复数个电路支撑结构,使得复数个电路支撑结构各藉由至少一连接部相互连接,且复数个电路支撑结构中相邻的电路支撑结构的至少一连接部错开设置。In one embodiment, a plurality of cutting grooves are formed on the circuit support structure layer, and the plurality of cutting grooves respectively surround the plurality of circuit support structures, so that each of the plurality of circuit support structures is connected to each other through at least one connection portion, and the plurality of circuit support structures At least one connecting portion of the adjacent circuit support structure is arranged in a staggered manner.
于一实施例,复数个切割槽形成于感应层,复数个切割槽分别围绕复数个感应单元,使得复数个感应单元各藉由至少一连接部相互连接,且复数个感应单元中相邻的感应单元的至少一连接部错开设置。In one embodiment, a plurality of cutting grooves are formed on the sensing layer, and the plurality of cutting grooves respectively surround a plurality of sensing units, so that each of the plurality of sensing units is connected to each other through at least one connection portion, and adjacent sensing units in the plurality of sensing units At least one connection part of the unit is arranged in a staggered manner.
于一实施例,复数个切割槽为至少一开放环形切割槽,且开放环形切割槽为矩形环或圆形环。In one embodiment, the plurality of cutting grooves are at least one open annular cutting groove, and the open annular cutting groove is a rectangular ring or a circular ring.
于一实施例,复数个切割槽形成于电路支撑结构层,复数个切割槽分分别位于复数个电路支撑结构的周围,使得复数个切割槽分中相邻的电路支撑结构的至少一侧边系互不相连。In one embodiment, a plurality of cutting grooves are formed on the circuit support structure layer, and the plurality of cutting grooves are respectively located around the plurality of circuit support structures, so that at least one side of the adjacent circuit support structures in the plurality of cutting grooves is connected to Not connected to each other.
于一实施例,复数个切割槽形成于感应层,复数个切割槽分别位于复数个感应单元的周围,使得复数个感应单元中相邻的感应单元的至少一侧边互不相连。In one embodiment, a plurality of cutting grooves are formed on the sensing layer, and the plurality of cutting grooves are respectively located around the plurality of sensing units, so that at least one side of adjacent sensing units among the plurality of sensing units is not connected to each other.
于一实施例,复数个切割槽为复数条直线切割槽,其中复数条直线切割槽至少有一端互不连通。In one embodiment, the plurality of cutting grooves are a plurality of straight cutting grooves, wherein at least one end of the plurality of straight cutting grooves is not connected to each other.
相较于习知技术,本发明的按键结构及输入装置藉由层叠结构达到薄型化的特性,同时藉由压电致动器提供按压回馈作为使用者操作提示。再者,本发明的按键结构及输入装置藉由整合电路径于支撑结构而成为模组化多层堆叠的电路支撑结构(层),不仅增加电路支撑结构(层)的可制造性,更可藉由层与层之间的相互堆叠而有效达到不同电路径层的电性隔离,有效防止短路发生。此外,本发明的输入装置藉由复数个压电致动器整合为单一部件的压电致动器组合,使压电致动器可轻易地叠置于电路支撑结构而达到电性连接及支撑目的,以简化制造程序及节省成本。再者,本发明的回避感应误判结构设计可有效达到输入装置操作上的感应分离增进感应正确性,同时保持输入装置的完整性。Compared with the conventional technology, the button structure and the input device of the present invention achieve thinner characteristics through the laminated structure, and at the same time, the piezoelectric actuator provides press feedback as a user operation prompt. Furthermore, the button structure and input device of the present invention become a modularized multi-layer stacked circuit support structure (layer) by integrating the electrical path in the support structure, which not only increases the manufacturability of the circuit support structure (layer), but also can The electrical isolation of different electrical path layers can be effectively achieved by stacking the layers, and the occurrence of short circuits can be effectively prevented. In addition, the input device of the present invention integrates a plurality of piezoelectric actuators into a single piezoelectric actuator combination, so that the piezoelectric actuators can be easily stacked on the circuit support structure to achieve electrical connection and support The purpose is to simplify the manufacturing process and save costs. Furthermore, the structural design for avoiding sensing misjudgment of the present invention can effectively achieve sensing separation in the operation of the input device and improve sensing accuracy while maintaining the integrity of the input device.
附图说明Description of drawings
图1A及本发明一实施例的按键结构的爆炸图Figure 1A and an exploded view of the button structure of an embodiment of the present invention
图1B为本发明图1A中的按键结构的剖面图;Fig. 1B is a cross-sectional view of the button structure in Fig. 1A of the present invention;
图1C为图1B的按键结构的按压作动示意图;FIG. 1C is a schematic diagram of the pressing action of the button structure of FIG. 1B;
图1D为本发明另一实施例的按键结构的剖面图;FIG. 1D is a cross-sectional view of a button structure according to another embodiment of the present invention;
图2为图1A的按键结构中的电路支撑结构的爆炸图;FIG. 2 is an exploded view of the circuit support structure in the button structure of FIG. 1A;
图3A为本发明另一实施例的电路支撑结构的爆炸图;3A is an exploded view of a circuit support structure according to another embodiment of the present invention;
图3B为本发明另一实施例的电路支撑结构的立体图;3B is a perspective view of a circuit supporting structure according to another embodiment of the present invention;
图3C本发明又一实施例的电路支撑结构的爆炸图;Fig. 3C is an exploded view of a circuit support structure according to yet another embodiment of the present invention;
图3D为本发明又一实施例的电路支撑结构的立体图;3D is a perspective view of a circuit supporting structure according to another embodiment of the present invention;
图4A为本发明一实施例的输入装置的爆炸图;FIG. 4A is an exploded view of an input device according to an embodiment of the present invention;
图4B至图4E为本发明图4A中的输入装置中的电路支撑结构层的支撑层、第一路径层、第二路径层及保护层的示意图;4B to 4E are schematic diagrams of the support layer, the first path layer, the second path layer and the protection layer of the circuit support structure layer in the input device in FIG. 4A of the present invention;
图4F为本发明图4A中的输入装置中的电路支撑结构层的支撑层、第一路径层及第二路径层叠加后的俯视图;FIG. 4F is a top view of the supporting layer, the first routing layer and the second routing layer of the circuit supporting structure layer in the input device in FIG. 4A of the present invention after being superimposed;
图4G为本发明图4A中的输入装置中的电路支撑结构层的支撑层、第一路径层、第二路径层及保护层叠加后的俯视图;FIG. 4G is a top view of the supporting layer, the first routing layer, the second routing layer and the protective layer of the circuit supporting structure layer in the input device in FIG. 4A of the present invention after being superimposed;
图5A至图5E为本发明另一实施例的输入装置中的电路支撑结构层的支撑层、第一路径甲层、第一路径乙层、第二路径层及保护层的示意图;5A to 5E are schematic diagrams of the support layer, the first path A layer, the first path B layer, the second path layer and the protection layer of the circuit support structure layer in the input device according to another embodiment of the present invention;
图6为本发明一实施例的压电致动器组合的示意图;6 is a schematic diagram of a combination of piezoelectric actuators according to an embodiment of the present invention;
图7A至图7C分别为本发明又一实施例输入装置中的电路支撑结构层的支撑层、电路径层及保护层的示意图;7A to 7C are schematic diagrams of the support layer, the circuit path layer and the protection layer of the circuit support structure layer in the input device according to another embodiment of the present invention;
图7D为本发明图7A至图7C所示的电路支撑结构层的组合示意图;FIG. 7D is a combined schematic diagram of the circuit supporting structure layer shown in FIG. 7A to FIG. 7C of the present invention;
图8A至图8C分别为本发明的回避感应误判结构设置于不同位置的实施例示意图;FIG. 8A to FIG. 8C are schematic diagrams of embodiments of the present invention in which the avoidance induction misjudgment structure is arranged at different positions;
图9A至图9C分别为本发明一实施例的输入装置于电路支撑结构层具有不同形状的切割槽的示意图;9A to FIG. 9C are schematic diagrams of cutting grooves of different shapes in the circuit supporting structure layer of the input device according to an embodiment of the present invention;
图10A至图10C分别为本发明另一实施例的输入装置于感应层具有不同形状的切割槽的示意图。10A to 10C are schematic diagrams of different shapes of cutting grooves on the sensing layer of the input device according to another embodiment of the present invention.
具体实施方式Detailed ways
本发明提供一种输入装置及其回避感应误判结构。具体而言,本发明的输入装置可为任何具有按键结构的输入装置,例如独立的键盘装置、整合于电子产品的输入装置(例如行动装置、平板电脑等配备的按键或键盘等),但不以此为限。于后以键盘为例,参考图式详细说明本发明实施例的回避感应误判结构及输入装置的细节。The invention provides an input device and its structure for avoiding induction misjudgment. Specifically, the input device of the present invention can be any input device with a button structure, such as an independent keyboard device, an input device integrated into an electronic product (such as a button or keyboard equipped with a mobile device, a tablet computer, etc.), but not This is the limit. Hereinafter, taking a keyboard as an example, details of the structure for avoiding misjudgment of sensing and the details of the input device according to the embodiment of the present invention will be described in detail with reference to the drawings.
如图1A及图1B所示,于一实施例,本发明的按键结构100包含压电致动器110、电路支撑结构120、感应单元130及控制电路160(见图1B),其中压电致动器110叠置于电路支撑结构120上,感应单元130设置于电路支撑结构120下方,且控制电路160耦接感应单元130及压电致动器110。具体而言,电路支撑结构120用以支撑压电致动器110并提供驱动压电致动器110的电路径,使得控制电路160可通过电路支撑结构120电连接压电致动器110。感应单元130为开关式感应单元,当感应单元130被按压触发时,感应单元130可输出触发讯号T,进而使控制电路160产生(1)使用者输入字符或指令的感应讯号,及(2)产生驱动压电致动器110震动的驱动讯号D(如后详述)。电路支撑结构120具有容置空间120a、第一接点部120b及第二接点部120c,其中第一接点部120b与第二接点部120c电性隔离。压电致动器110具有被驱动部114及压电部112,其中压电部112设置于容置空间120a内且供电连接第一接点部120b,被驱动部114受电路支撑结构120所支撑,并供电连接第二接点部120c。感应单元130被触发时可输出触发讯号T,而控制电路160于接收触发讯号T后,会输出驱动讯号D给压电致动器110,以驱动压电致动器110发生震动(详述于图1C的相关说明)。As shown in Figure 1A and Figure 1B, in one embodiment, the button structure 100 of the present invention includes a piezoelectric actuator 110, a circuit support structure 120, a sensing unit 130 and a control circuit 160 (see Figure 1B), wherein the piezoelectric actuator The actuator 110 is stacked on the circuit supporting structure 120 , the sensing unit 130 is disposed under the circuit supporting structure 120 , and the control circuit 160 is coupled to the sensing unit 130 and the piezoelectric actuator 110 . Specifically, the circuit supporting structure 120 is used to support the piezoelectric actuator 110 and provide an electrical path for driving the piezoelectric actuator 110 , so that the control circuit 160 can be electrically connected to the piezoelectric actuator 110 through the circuit supporting structure 120 . The sensing unit 130 is a switch-type sensing unit. When the sensing unit 130 is pressed and triggered, the sensing unit 130 can output a trigger signal T, thereby enabling the control circuit 160 to generate (1) a sensing signal for the user to input characters or commands, and (2) A driving signal D (described in detail later) for driving the piezoelectric actuator 110 to vibrate is generated. The circuit support structure 120 has an accommodating space 120a, a first contact portion 120b and a second contact portion 120c, wherein the first contact portion 120b is electrically isolated from the second contact portion 120c. The piezoelectric actuator 110 has a driven part 114 and a piezoelectric part 112, wherein the piezoelectric part 112 is disposed in the accommodating space 120a and connected to the first contact part 120b for power supply, and the driven part 114 is supported by the circuit support structure 120, And power supply is connected to the second contact part 120c. When the sensing unit 130 is triggered, it can output a trigger signal T, and the control circuit 160 will output a driving signal D to the piezoelectric actuator 110 after receiving the trigger signal T, so as to drive the piezoelectric actuator 110 to vibrate (detailed in Related note for Figure 1C).
此外,如图1A及图1B所示,按键结构100进一步可包含基底层140、包覆层150。于一实施例,基底层140设置于感应单元130下方,以增进按键结构100的整体结构强度。换言之,基底层140较佳为相对刚性较大的材质(例如金属板材,硬质塑料或聚合物层),以维持按键结构100的强度而不至于弯折损坏。基底层140可依据电路支撑结构120的结构强度选择性设置。换言之,当电路支撑结构120的结构强度足以支撑按键结构100不至于弯折损坏时,则无需设置基底层140。于一实施例,如图1B所示,包覆层150覆盖于压电致动器110上,其中包覆层150具有字符或图案150a(见图1A)以作为按键结构100的键帽层。字符或图案150a可藉由印刷、压印、黏贴等方式形成于包覆层150,但不以此为限。于另一实施例,如图1D所示,包覆层150’设计为使得压电致动器110、电路支撑结构120、感应单元130及基底层140(或甚至连同控制电路160)完全被包覆于包覆层150’内。换言之,包覆层150、150’不仅可作为按键结构100的键帽层,同时可用以保护构成按键结构的其他元件(例如压电致动器、电路支撑结构、感应单元、基底层、及控制电路)。包覆层150、150’较佳为挠性材质(例如硅胶垫),以增加使用者按压按键结构100的舒适感。于一实施例(未图示),当包覆层150仅覆盖于压电致动器110上作为键帽层时,按键结构100可选择性具有将各元件(例如110、120、130、140、150、160)整合的壳体,使得各元件设置于壳体中且裸露出包覆层150供使用者操作。此外,上述壳体亦可与基底层140整合在一起,使得壳体的底部作为基底层。In addition, as shown in FIG. 1A and FIG. 1B , the button structure 100 may further include a base layer 140 and a covering layer 150 . In one embodiment, the base layer 140 is disposed under the sensing unit 130 to enhance the overall structural strength of the key structure 100 . In other words, the base layer 140 is preferably made of a relatively rigid material (such as metal plate, hard plastic or polymer layer), so as to maintain the strength of the key structure 100 without being bent and damaged. The base layer 140 can be selectively disposed according to the structural strength of the circuit supporting structure 120 . In other words, when the structural strength of the circuit supporting structure 120 is sufficient to support the key structure 100 from being bent and damaged, the base layer 140 does not need to be provided. In one embodiment, as shown in FIG. 1B , the coating layer 150 is covered on the piezoelectric actuator 110 , wherein the coating layer 150 has characters or patterns 150 a (see FIG. 1A ) as a key cap layer of the key structure 100 . The characters or patterns 150a can be formed on the covering layer 150 by printing, embossing, pasting, etc., but not limited thereto. In another embodiment, as shown in FIG. 1D, the cladding layer 150' is designed such that the piezoelectric actuator 110, the circuit support structure 120, the sensing unit 130, and the base layer 140 (or even together with the control circuit 160) are completely covered. covered in the cladding layer 150'. In other words, the cladding layers 150, 150' can not only serve as the key cap layer of the key structure 100, but also can be used to protect other components (such as piezoelectric actuators, circuit support structures, sensing units, base layers, and control elements) that constitute the key structure. circuit). The covering layers 150, 150' are preferably made of flexible materials (such as silicone pads), so as to increase the user's comfort when pressing the button structure 100. In one embodiment (not shown), when the cladding layer 150 only covers the piezoelectric actuator 110 as a key cap layer, the key structure 100 can optionally have various elements (such as 110, 120, 130, 140 , 150, 160) an integrated housing, so that each component is disposed in the housing and exposes the covering layer 150 for user operation. In addition, the above casing can also be integrated with the base layer 140 so that the bottom of the casing serves as the base layer.
再者,控制电路160可依据实际应用需求设置于任何合宜的位置,例如亦被包覆于包覆层150’中,或设置于包覆层150之外。举例而言,控制电路160可设置于基底层140上、包覆层150、150’下、或控制电路160可设置于包覆层150、150’中,但不以此为限。压电致动器110可藉由黏着方式固定于电路支撑结构120及/或包覆层150、150’,或可藉由包覆层150、150’夹设于包覆层150、150’及电路支撑结构120之间,但不以此为限。于此实施例,压电致动器110较佳为部分固定于电路支撑结构120于容置空间120a的一侧,使得压电致动器110在保持元件间的相对设置位置的情况下,仍保有相当程度的悬臂弹性。再者,按键结构100的各元件(例如包覆层150、压电致动器110、电路支撑结构120、感应单元130、基底层140等)之间亦可藉由黏着方式固定,以定位各元件间的相对位置。于后详述各元件的细部结构及相互作用。Furthermore, the control circuit 160 can be disposed in any suitable position according to actual application requirements, for example, it is also wrapped in the cladding layer 150 ′, or it is disposed outside the cladding layer 150 . For example, the control circuit 160 can be disposed on the base layer 140, under the cladding layer 150, 150', or the control circuit 160 can be disposed in the cladding layer 150, 150', but not limited thereto. The piezoelectric actuator 110 can be fixed on the circuit support structure 120 and/or the cladding layer 150, 150' by adhesive, or can be sandwiched between the cladding layer 150, 150' and the cladding layer 150, 150' Between the circuit supporting structures 120, but not limited thereto. In this embodiment, the piezoelectric actuator 110 is preferably partly fixed on one side of the circuit support structure 120 in the accommodating space 120a, so that the piezoelectric actuator 110 can still maintain the relative arrangement position between the components. Retain a considerable degree of cantilever elasticity. Furthermore, the various components of the key structure 100 (such as the covering layer 150, the piezoelectric actuator 110, the circuit support structure 120, the sensing unit 130, the base layer 140, etc.) can also be fixed by adhesion to position each component. The relative position between components. The detailed structure and interaction of each element will be described in detail later.
于一实施例,如图1A及图1B所示,压电致动器110为薄膜型压电致动器,其包含被驱动部114及压电部112。被驱动部114可为导电薄膜/薄板形式,且压电部112由压电材料形成并设置于被驱动部114上。于此实施例,被驱动部114较佳为导电金属层,例如但不限于铜片。于其他实施例,被驱动部114可为导电非金属层。于此实施例,压电部112可为陶瓷压电材料层且设置于被驱动部114的一侧形成单侧压电致动器,但不以此为限。依实际需求,于其他实施例,压电部112可设置于被驱动部114的两侧而形成双侧压电致动器。如图1B所示,当压电致动器110叠置于电路支撑结构120上时,被驱动部114的周围部分叠置于电路支撑结构120上,并由电路支撑结构120所支撑以电连接第二接点部120c,而位于被驱动部114下表面中央部分的压电部112朝向容置空间120a突伸,并实质悬空设置于电路支撑结构120的容置空间120a中以电连接第一接点部120b。In one embodiment, as shown in FIG. 1A and FIG. 1B , the piezoelectric actuator 110 is a thin-film piezoelectric actuator, which includes a driven part 114 and a piezoelectric part 112 . The driven part 114 can be in the form of a conductive film/plate, and the piezoelectric part 112 is formed of a piezoelectric material and disposed on the driven part 114 . In this embodiment, the driven part 114 is preferably a conductive metal layer, such as but not limited to a copper sheet. In other embodiments, the driven part 114 can be a conductive non-metal layer. In this embodiment, the piezoelectric part 112 may be a ceramic piezoelectric material layer and disposed on one side of the driven part 114 to form a one-sided piezoelectric actuator, but not limited thereto. According to actual needs, in other embodiments, the piezoelectric part 112 can be disposed on both sides of the driven part 114 to form a double-sided piezoelectric actuator. As shown in FIG. 1B, when the piezoelectric actuator 110 is superimposed on the circuit support structure 120, the surrounding part of the driven part 114 is superimposed on the circuit support structure 120, and is supported by the circuit support structure 120 to be electrically connected. The second contact part 120c, and the piezoelectric part 112 located at the central part of the lower surface of the driven part 114 protrudes toward the accommodating space 120a, and is substantially suspended in the accommodating space 120a of the circuit support structure 120 to electrically connect the first contact Section 120b.
电路支撑结构120可为具有容置空间120a的矩形、圆形或任何合宜形状的电路支撑结构。于此实施例,容置空间120a可为形成于电路支撑结构120的凹槽或开口,且容置空间120a的形状、大小较佳以容置压电部112为设计考量。第一接点120b及第二接点120c分别为传递驱动讯号的电路径上电性隔离的两个接点。换言之,第一接点120b为电连接压电部112的第一电路径(例如压电路径)的接点,而第二接点120c为电连接被驱动部114的第二电路径(例如被驱动路径)的接点。于此实施例,如图1A所示,电路支撑结构120较佳具有突出部120d,其中突出部120d自容置空间120a的一侧朝容置空间120a中央突出形成悬臂结构,使得突出部120d可相对于电路支撑结构120本体在容置空间120a中上/下位移。第一接点部120b设置于突出部120d上(较佳位于突出部120d末端),使得第一接点部120b伸入容置空间120a。第二接点部120c可设置于容置空间120a周围的电路支撑结构120上。于此实施例,被驱动部114未被压电部112覆盖的部分藉由电路支撑结构120支撑并同时用以电连接第二接点部120c,而压电部112朝下面对容置空间120a并电连接伸入容置空间120a的第一接点部120b。藉由悬臂式突出部120d可提供的弹性位移特性,当压电致动器110震动时,突出部120d及其上设置的第一接点部120b可随着压电致动器110于容置空间120a中震动,增加结构弹性。The circuit supporting structure 120 can be a rectangular, circular or any suitable shape of the circuit supporting structure with the accommodation space 120a. In this embodiment, the accommodating space 120 a can be a groove or an opening formed in the circuit supporting structure 120 , and the shape and size of the accommodating space 120 a are preferably designed to accommodate the piezoelectric part 112 . The first contact 120b and the second contact 120c are respectively two electrically isolated contacts on the electrical path for transmitting the driving signal. In other words, the first contact point 120b is a contact point that is electrically connected to the first electrical path (such as a piezoelectric path) of the piezoelectric part 112, and the second contact point 120c is a point that is electrically connected to a second electrical path (such as a driven path) of the driven part 114. of contacts. In this embodiment, as shown in FIG. 1A , the circuit supporting structure 120 preferably has a protruding portion 120d, wherein the protruding portion 120d protrudes from one side of the accommodating space 120a toward the center of the accommodating space 120a to form a cantilever structure, so that the protruding portion 120d can be Relative to the main body of the circuit supporting structure 120, it can be displaced up/down in the accommodating space 120a. The first contact part 120b is disposed on the protruding part 120d (preferably located at the end of the protruding part 120d), so that the first contact part 120b protrudes into the accommodating space 120a. The second contact portion 120c can be disposed on the circuit supporting structure 120 around the accommodating space 120a. In this embodiment, the part of the driven part 114 not covered by the piezoelectric part 112 is supported by the circuit support structure 120 and is also used to electrically connect the second contact part 120c, and the piezoelectric part 112 faces the accommodation space 120a downward. And electrically connected to the first contact portion 120b protruding into the accommodating space 120a. With the elastic displacement characteristics provided by the cantilevered protrusion 120d, when the piezoelectric actuator 110 vibrates, the protrusion 120d and the first contact part 120b provided thereon can follow the piezoelectric actuator 110 in the accommodation space. Vibration in 120a increases structural flexibility.
如图1C所示,当外界施加按压力F时,按压力F透过压电致动器110、电路支撑结构120向下传递以触发感应单元130,使得感应单元130输出触发讯号T到控制电路160。控制电路160接收触发讯号T而可输出驱动讯号D给压电致动器110进而驱动压电致动器110发生震动。亦即,当使用者按压按键结构100时(例如按压于包覆层150、150’时),藉由电路支撑结构120的结构特性向下压抵触发感应单元130发出触发讯号T,触发讯号T一方面作为操作按键结构100以输入相应的字符或指令的感应讯号,同时亦作为产生驱动讯号D的指示讯号,使得控制电路160接收触发讯号T而发出驱动讯号D。当压电致动器110经由电路支撑结构120的电路径(例如于后叙述的第一电路径及第二电路径)接收到来自控制电路160的驱动讯号D时,压电致动器110可于容置空间120a中产生震动,以提供使用者确认按压的震动回馈。As shown in FIG. 1C , when a pressing force F is applied from the outside, the pressing force F is transmitted downward through the piezoelectric actuator 110 and the circuit support structure 120 to trigger the sensing unit 130, so that the sensing unit 130 outputs a trigger signal T to the control circuit. 160. The control circuit 160 receives the trigger signal T and can output a driving signal D to the piezoelectric actuator 110 to drive the piezoelectric actuator 110 to vibrate. That is, when the user presses the key structure 100 (for example, when pressing on the covering layer 150, 150'), the trigger signal T is issued by pressing down on the trigger sensing unit 130 due to the structural characteristics of the circuit support structure 120, and the trigger signal T On the one hand, it serves as an induction signal for operating the key structure 100 to input corresponding characters or instructions, and at the same time, it serves as an indication signal for generating the driving signal D, so that the control circuit 160 receives the trigger signal T and sends out the driving signal D. When the piezoelectric actuator 110 receives the driving signal D from the control circuit 160 through the electrical path of the circuit support structure 120 (such as the first electrical path and the second electrical path described later), the piezoelectric actuator 110 can Vibration is generated in the accommodating space 120a to provide vibration feedback for the user to confirm the pressing.
于此实施例,如图2所示,电路支撑结构120可为多层结构,其包含支撑层122、第一路径层124以及第二路径层126,其中支撑层122、第一路径层124以及第二路径层126较佳以黏着方式固定,以整合成模组化多层式电路支撑结构。具体而言,支撑层122具有容置部122a,以提供压电致动器110支撑及震动空间。支撑层122较佳具有相对较大的刚性且具有预设的厚度,以限制压电致动器110受到按压时的变形极限,使得压电致动器110不至于受巨大外力而过度变形损坏。换言之,压电致动器110相对于电路支撑结构120震动的变形量,较佳由支撑层122的刚性及厚度或容置部122a的深度来控制。在此需注意,当支撑层122的结构强度足以支撑按键结构不因按压而弯折损坏时,支撑层122可同时提供基底层140的作用而使得按键结构不需要设置基底层140。第一路径层124叠置于支撑层122上,且第二路径层126叠置于第一路径层124上,以提供电连接压电致动器110的电路径。于此实施例,电路支撑结构120的电路径设计为两层的路径层,其中第一路径层124具有第一电路径124c,第二路径层126具有第二电路径126b。第一路径层124为绝缘层上形成有第一电路径124c的可挠性薄膜路径层;第二路径层126较佳为绝缘层上形成有第二电路径126b的可挠性薄膜路径层。第一电路径124c连接压电部112的电路径,其包含第一接点部120b,而第二电路径126b连接被驱动部114的电路径,其包含第二接点部120c。In this embodiment, as shown in FIG. 2 , the circuit supporting structure 120 can be a multi-layer structure, which includes a supporting layer 122, a first routing layer 124 and a second routing layer 126, wherein the supporting layer 122, the first routing layer 124 and The second routing layer 126 is preferably fixed by adhesive, so as to be integrated into a modular multi-layer circuit supporting structure. Specifically, the supporting layer 122 has an accommodating portion 122 a to provide a space for supporting and vibrating the piezoelectric actuator 110 . The support layer 122 is preferably relatively rigid and has a preset thickness to limit the deformation limit of the piezoelectric actuator 110 when pressed, so that the piezoelectric actuator 110 will not be damaged due to excessive deformation due to a huge external force. In other words, the amount of deformation of the piezoelectric actuator 110 relative to the vibration of the circuit support structure 120 is preferably controlled by the rigidity and thickness of the support layer 122 or the depth of the accommodating portion 122a. It should be noted here that when the structural strength of the supporting layer 122 is sufficient to support the key structure from being bent and damaged due to pressing, the supporting layer 122 can simultaneously provide the function of the base layer 140 so that the key structure does not need the base layer 140 . The first routing layer 124 is stacked on the support layer 122 , and the second routing layer 126 is stacked on the first routing layer 124 to provide an electrical path for electrically connecting the piezoelectric actuator 110 . In this embodiment, the electrical paths of the circuit support structure 120 are designed as two-layer routing layers, wherein the first routing layer 124 has a first electrical routing 124c, and the second routing layer 126 has a second electrical routing 126b. The first routing layer 124 is a flexible film routing layer with a first electrical path 124c formed on an insulating layer; the second routing layer 126 is preferably a flexible thin film routing layer with a second electrical path 126b formed on an insulating layer. The first electrical path 124c is connected to the electrical path of the piezoelectric part 112 and includes the first contact part 120b, and the second electrical path 126b is connected to the electrical path of the driven part 114 and includes the second contact part 120c.
具体而言,支撑层122的容置部122a可为形成于支撑层122的开口或凹槽。第一路径层124具有第一开口124a及舌部124b,其中第一开口124a对应支撑层122的容置部122a。舌部124b自第一开口124a的一侧朝第一开口124a中央突伸而形成悬臂结构,且舌部124b作为上述突出部120d的底层部分。第一电路径124c延伸至舌部124b以形成第一接点部120b于舌部124b的末端。相应地,第二路径层126具有第二开口126a,其中第二开口126a对应第一开口124a及容置部122a。第二开口126a、第一开口124a及容置部122a较佳为大小、形状实质相同,但不以此为限。第二路径层126较佳更具有延伸部126c,其中延伸部126c自第二开口126a的一侧朝第二开口126a中央突伸,且延伸部126c遮蔽舌部124b的一部分以裸露出第一接点部120b。亦即,延伸部126c的延伸长度小于舌部124b的延伸长度,以裸露出设置于舌部124b末端的第一接点部120b。于此实施例,延伸部126c作为上述突出部120d的上层部分。Specifically, the accommodating portion 122 a of the supporting layer 122 can be an opening or a groove formed in the supporting layer 122 . The first path layer 124 has a first opening 124 a and a tongue portion 124 b, wherein the first opening 124 a corresponds to the receiving portion 122 a of the support layer 122 . The tongue portion 124b protrudes from one side of the first opening 124a toward the center of the first opening 124a to form a cantilever structure, and the tongue portion 124b serves as a bottom layer of the protruding portion 120d. The first electrical path 124c extends to the tongue portion 124b to form the first contact portion 120b at the end of the tongue portion 124b. Correspondingly, the second path layer 126 has a second opening 126a, wherein the second opening 126a corresponds to the first opening 124a and the accommodating portion 122a. The size and shape of the second opening 126a, the first opening 124a and the accommodating portion 122a are preferably substantially the same, but not limited thereto. The second routing layer 126 preferably further has an extension 126c, wherein the extension 126c protrudes from one side of the second opening 126a toward the center of the second opening 126a, and the extension 126c covers a part of the tongue 124b to expose the first contact. Section 120b. That is, the extension length of the extension portion 126c is smaller than the extension length of the tongue portion 124b, so as to expose the first contact portion 120b disposed at the end of the tongue portion 124b. In this embodiment, the extension portion 126c is used as the upper portion of the protrusion portion 120d.
参考图1A及图2,当支撑层122、第一路径层124及第二路径层126由下而上依序叠置时,容置部122a、第一开口124a及第二开口126a相互对准连通以共同形成容置空间120a,且第二路径层126叠置于第一路径层124上时,第二路径层126较佳遮蔽除第一接点部120b外的第一电路径124c,并裸露出第一接点部120b及第二接点部120c,以分别电连接压电致动器110的压电部112及被驱动部114。亦即,支撑层122、第一路径层124及第二路径层126较佳具有实质相同的外型,使得各层主体相互叠合,且驱动第二路径层126的延伸部126c叠合于第一路径层124的舌部124b。于此实施例,藉由第二路径层的薄膜绝缘层覆盖第一路径层的第一电路径,可有效电性隔离第二电路径及第一电路径,使得电路径分布得到较佳的配置。Referring to FIG. 1A and FIG. 2, when the supporting layer 122, the first routing layer 124 and the second routing layer 126 are stacked sequentially from bottom to top, the accommodating portion 122a, the first opening 124a and the second opening 126a are aligned with each other. connected to jointly form the accommodating space 120a, and when the second routing layer 126 is stacked on the first routing layer 124, the second routing layer 126 preferably shields the first electrical routing 124c except the first contact portion 120b, and exposes The first contact part 120b and the second contact part 120c are provided to electrically connect the piezoelectric part 112 and the driven part 114 of the piezoelectric actuator 110 respectively. That is, the supporting layer 122, the first routing layer 124 and the second routing layer 126 preferably have substantially the same appearance, so that the main bodies of each layer are superimposed on each other, and the extension part 126c of the second routing layer 126 is driven to be superimposed on the first routing layer. A tongue portion 124b of the routing layer 124 . In this embodiment, by covering the first electrical path of the first routing layer with the thin film insulating layer of the second routing layer, the second electrical routing and the first electrical routing can be effectively isolated electrically, so that the distribution of the electrical routing can be better configured. .
在此需注意,电路支撑结构依据电路径设计及支撑强度的要求可具有不同实施方式。如图3A及图3B所示,于另一实施例,电路支撑结构120’除上述的支撑层122、第一路径层124、第二路径层126’,更包含隔离层128,其中隔离层128设置于第一路径层124及第二路径层126’之间以电隔离第一电路径124c及第二电路径126b。于此实施例,配合隔离层128的设置,第二路径层126’可具有不同的形式,其中第二路径层126’具有第二开口126a’,且第二开口126a’对应容置部122a。隔离层128具有第三开口128a及遮蔽部128b,其中第三开口128a对应第一开口124a、第二开口126a’及容置部122a。遮蔽部128b设置于第三开口128a的一侧,以遮蔽舌部124b的一部分并裸露出第一接点部120b。于此实施例,遮蔽部128b作为上述突出部120d的上层部分。当支撑层122、第一路径层124、隔离层128及第二路径层126’由下而上依序叠置时,容置部122a、第一开口124a、第三开口128a及第二开口126a’系相互对准连通以共同形成容置空间120a,其中隔离层128叠置于第一路径层124上时,遮蔽部128b叠合于舌部124b且隔离层128较佳实质遮蔽除第一接点部120b以外的第一电路径124c。于此实施例,藉由隔离层128的设置,不仅可达到第一电路径124及第二电路径126的电隔离,更可进一步增加电路支撑结构的结构强度,以免压电致动器过度变形损坏。It should be noted here that the circuit supporting structure may have different implementations according to the design of the electrical path and the requirement of supporting strength. As shown in FIG. 3A and FIG. 3B , in another embodiment, the circuit supporting structure 120' includes the above-mentioned supporting layer 122, the first routing layer 124, and the second routing layer 126', and further includes an isolation layer 128, wherein the isolation layer 128 It is disposed between the first routing layer 124 and the second routing layer 126' to electrically isolate the first electrical routing 124c and the second electrical routing 126b. In this embodiment, in conjunction with the arrangement of the isolation layer 128, the second path layer 126' can have different forms, wherein the second path layer 126' has a second opening 126a', and the second opening 126a' corresponds to the accommodating portion 122a. The isolation layer 128 has a third opening 128a and a shielding portion 128b, wherein the third opening 128a corresponds to the first opening 124a, the second opening 126a' and the accommodating portion 122a. The shielding portion 128b is disposed on one side of the third opening 128a to shield a part of the tongue portion 124b and expose the first contact portion 120b. In this embodiment, the shielding portion 128b is used as the upper portion of the protruding portion 120d. When the supporting layer 122, the first routing layer 124, the isolation layer 128 and the second routing layer 126' are stacked sequentially from bottom to top, the accommodating portion 122a, the first opening 124a, the third opening 128a and the second opening 126a 'are mutually aligned and communicated to jointly form the accommodating space 120a, wherein when the isolation layer 128 is superimposed on the first path layer 124, the shielding part 128b is superimposed on the tongue part 124b and the isolation layer 128 is preferably substantially shielded except for the first contact The first electrical path 124c other than the portion 120b. In this embodiment, by setting the isolation layer 128, not only the electrical isolation between the first electrical path 124 and the second electrical path 126 can be achieved, but also the structural strength of the circuit supporting structure can be further increased to avoid excessive deformation of the piezoelectric actuator. damage.
在此需注意,于图3A及图3B的实施例中,第二路径层126’选择不设置上述的延伸部126c,而使得第二路径层126’叠置于隔离层128上时,第二路径层126’较佳裸露出遮蔽部128b、第一接点部120b及第二接点部120c,以保持突出部120d的弹性。然而,于其他实施例,电路支撑结构可藉由图2的第二路径层126的延伸部126c及图3B的隔离层128的遮蔽部128b的至少其中之一,来遮蔽部分舌部124b上的第一电路径124c并裸露出舌部124b末端的第一接点部120b。当同时使用延伸部126c及遮蔽部128b来遮蔽部分舌部124b时,遮蔽部128b为突出部120d的中间层部分,而延伸部126c为突出部120d的上层部分。It should be noted here that in the embodiment of FIG. 3A and FIG. 3B , the second routing layer 126 ′ chooses not to provide the above-mentioned extension portion 126 c, so that when the second routing layer 126 ′ is stacked on the isolation layer 128 , the second The routing layer 126' preferably exposes the shielding portion 128b, the first contact portion 120b and the second contact portion 120c, so as to maintain the elasticity of the protruding portion 120d. However, in other embodiments, the circuit support structure can shield part of the tongue portion 124b by at least one of the extension portion 126c of the second routing layer 126 in FIG. 2 and the shielding portion 128b of the isolation layer 128 in FIG. 3B. The first electrical path 124c exposes the first contact portion 120b at the end of the tongue portion 124b. When the extension part 126c and the shielding part 128b are used to shield part of the tongue part 124b, the shielding part 128b is the middle part of the protruding part 120d, and the extending part 126c is the upper part of the protruding part 120d.
再者,当电路支撑结构作为电路径的面积够大或电路径较简单时,可将上述的第一电路径及第二电路径整合于同一个电路径层,以减少电路径层数进而节省成本。于另一实施例,如图3C及图3D所示,电路支撑结构120”包含上述的支撑层122及电路径层124’,其中电路径层124’叠置于支撑层122上以与容置部122a形成容置空间120a,且电路径层124’同时具有第一电路径124c及第二电路径126b。类似地,第一电路径124c包含第一接点部120b,且第二电路径126b包含第二接点部120c。具体而言,电路径层124’具有第一开口124a及舌部124b,其中第一开口124a对应容置部122a,且舌部124b自第一开口124a的一侧朝第一开口124a中央突伸形成悬臂结构,而第一接点部120b设置于舌部124b。于此实施例,第一电路径124c自电路径层124’的一侧延伸至舌部124b而于其末端形成第一接点部120b。第二电路径126b设置于电路径层124’的另一侧(例如邻侧),以在简化电路径层数的同时达到第一电路径124c及第二电路径126b的电性隔离,且不显著影响压电致动器110与电路支撑结构120”电连接时的震动弹性。Furthermore, when the area of the circuit support structure as the electrical path is large enough or the electrical path is relatively simple, the above-mentioned first electrical path and the second electrical path can be integrated into the same electrical path layer to reduce the number of electrical path layers and save cost. In another embodiment, as shown in FIG. 3C and FIG. 3D , the circuit supporting structure 120" includes the above-mentioned supporting layer 122 and the electrical routing layer 124', wherein the electrical routing layer 124' is stacked on the supporting layer 122 to accommodate Part 122a forms accommodating space 120a, and electric path layer 124' has first electric path 124c and second electric path 126b at the same time.Similarly, first electric path 124c includes first contact part 120b, and second electric path 126b includes The second contact portion 120c. Specifically, the circuit path layer 124' has a first opening 124a and a tongue 124b, wherein the first opening 124a corresponds to the accommodating portion 122a, and the tongue 124b is from one side of the first opening 124a toward the second An opening 124a protrudes from the center to form a cantilever structure, and the first contact portion 120b is disposed on the tongue 124b. In this embodiment, the first electrical path 124c extends from one side of the electrical path layer 124' to the tongue 124b and ends at its end Form the first contact portion 120b. The second electrical path 126b is arranged on the other side (such as the adjacent side) of the electrical path layer 124', to reach the first electrical path 124c and the second electrical path 126b while simplifying the number of electrical path layers The electrical isolation of the piezoelectric actuator 110 does not significantly affect the vibration elasticity when the piezoelectric actuator 110 is electrically connected to the circuit support structure 120 ″.
此外,电路支撑结构120”更包含保护层129,其中保护层129设置于电路径层124’上以遮蔽除第一接点部120b及第二接点部120c之外裸露的第二电路径In addition, the circuit support structure 120" further includes a protection layer 129, wherein the protection layer 129 is disposed on the circuit path layer 124' to cover the exposed second circuit path except the first contact portion 120b and the second contact portion 120c
126b及第一电路径124c。于此实施例,保护层129为绝缘层,且具有第四开口129a及遮蔽部129b,其中开口129a对应容置部122a及第一开口124a,遮蔽部129b设置于第四开口129a的一侧且自该侧向第四开口129b中央延伸。当支撑层122、电路径层124’及保护层129由下而上依序叠置时,容置部122a、第一开口124a及第四开口129a相互对准连通以共同形成容置空间120a,其中遮蔽部129b叠合于舌部124b,以遮蔽舌部124b的一部分并裸露出第一接点部120b。在此需注意,于此实施例,保护层129的第四开口129a大于电路径层124’的第一开口124a,使得保护层129叠置于电路径层124’时,可裸露出设置于第一接点部120b相邻侧的第二接点部120c,但不以此为限。于其他实施例(未图示),保护层除对应容置部122a的开口外,还可具有额外的接点窗,其中接点窗设置于对应第二接点部120c的位置,以裸露出第二接点部120c。此外,依据电路设计需求,电路支撑结构120、120’亦可进一步包含类似上述的保护层,以遮蔽除第一接点部120b及第二接点部120c之外裸露的第二电路径126b及第一电路径124c。126b and the first electrical path 124c. In this embodiment, the protective layer 129 is an insulating layer, and has a fourth opening 129a and a shielding portion 129b, wherein the opening 129a corresponds to the accommodating portion 122a and the first opening 124a, and the shielding portion 129b is disposed on one side of the fourth opening 129a and Extends from the side to the center of the fourth opening 129b. When the supporting layer 122, the electrical path layer 124' and the protective layer 129 are stacked sequentially from bottom to top, the accommodating portion 122a, the first opening 124a and the fourth opening 129a are aligned and communicated with each other to jointly form the accommodating space 120a, The shielding portion 129b is superimposed on the tongue portion 124b to shield a part of the tongue portion 124b and expose the first contact portion 120b. It should be noted here that in this embodiment, the fourth opening 129a of the protective layer 129 is larger than the first opening 124a of the electrical routing layer 124', so that when the protective layer 129 is stacked on the electrical routing layer 124', the fourth opening 129a disposed on the electrical routing layer 124' can be exposed. The second contact portion 120c adjacent to the first contact portion 120b, but not limited thereto. In other embodiments (not shown), in addition to the opening corresponding to the accommodating portion 122a, the protective layer may also have an additional contact window, wherein the contact window is provided at a position corresponding to the second contact portion 120c to expose the second contact part 120c. In addition, according to circuit design requirements, the circuit supporting structures 120, 120' may further include a protective layer similar to the above, so as to shield the exposed second electrical path 126b and the first contact part 120b and the first contact part 120c Electrical path 124c.
再者,如图4A所示,于另一实施例,本发明提供一种包含多个前述实施例的按键结构的输入装置1。在此需注意,于此实施例,输入装置1为包含9个按键结构以3x 3阵列方式排列设置进行说明,但于其他实施例,输入装置可包含一个以上的按键结构且以任何合宜的方式配置,不以实施例所示为限。再者,于此实施例,输入装置1以图1A及图1B具有电路支撑结构120的按键结构为例说明,但不以此为限。亦即,本发明的输入装置可由具有电路支撑结构120、120’及/或120”的多个按键结构所组成。具体而言,如图4A所示,输入装置1包含复数个(例如9个)压电致动器110、电路支撑结构层12、感应层13以及控制电路16。电路支撑结构层12具有复数个电路支撑结构120,感应层13包含复数个感应单元130。换言之,当多个按键结构整合成输入装置1(例如键盘)时,各按键结构的元件可对应整合成单一部件层,例如复数个电路支撑结构120可整合于电路支撑结构层12,使得各电路支撑结构120可视为电路支撑结构层12上的一个电路支撑单元、复数个感应单元130可整合于感应层13,且可藉由单一控制电路16控制多个按键,以简化制造程序及组装程序,但不以此为限。Furthermore, as shown in FIG. 4A , in another embodiment, the present invention provides an input device 1 comprising a plurality of key structures of the foregoing embodiments. It should be noted here that in this embodiment, the input device 1 is described as including nine key structures arranged in a 3x3 array, but in other embodiments, the input device may include more than one key structure and be arranged in any suitable manner. The configuration is not limited to the examples shown. Furthermore, in this embodiment, the input device 1 is illustrated by taking the button structure with the circuit supporting structure 120 in FIG. 1A and FIG. 1B as an example, but it is not limited thereto. That is, the input device of the present invention can be made up of a plurality of key structures with circuit support structures 120, 120' and/or 120". Specifically, as shown in FIG. ) piezoelectric actuator 110, circuit supporting structure layer 12, sensing layer 13 and control circuit 16. Circuit supporting structure layer 12 has a plurality of circuit supporting structures 120, and sensing layer 13 includes a plurality of sensing units 130. In other words, when multiple When the button structure is integrated into the input device 1 (such as a keyboard), the elements of each button structure can be integrated into a single component layer, for example, a plurality of circuit support structures 120 can be integrated in the circuit support structure layer 12, so that each circuit support structure 120 can be seen As a circuit support unit on the circuit support structure layer 12, a plurality of sensing units 130 can be integrated in the sensing layer 13, and multiple keys can be controlled by a single control circuit 16 to simplify the manufacturing process and assembly process, but not for this purpose limit.
如图4A所示,复数个压电致动器110分别对应设置于复数个电路支撑结构120上。感应层13设置于电路支撑结构层12下方,使得复数个感应单元130分别对应复数个电路支撑结构120,且各感应单元130可被独立触发以产生相应的触发讯号。控制电路16耦接于复数个感应单元130与复数个压电致动器110。具体而言,控制电路16藉由复数个电路支撑结构120分别电连接对应的压电致动器110,使得控制电路16接收感应单元130的触发讯号而可输出驱动讯号给对应的压电致动器110,进而驱动对应的压电致动器110发生震动。于此实施例,复数个压电致动器110、复数个电路支撑结构120及复数个感应单元130较佳一对一相互对应以构成类似上述的复数个按键结构100,且藉由控制电路16独立控制多个按键结构,但不以此为限。举例而言,于其他实施例,依据按键的大小、数量及电路复杂度,一个电路支撑结构120可支撑一个以上的压电致动器(参见图5A至图5E的实施例),且可藉由一个以上的控制电路控制多个按键结构。As shown in FIG. 4A , the plurality of piezoelectric actuators 110 are correspondingly disposed on the plurality of circuit support structures 120 . The sensing layer 13 is disposed under the circuit supporting structure layer 12, so that the plurality of sensing units 130 correspond to the plurality of circuit supporting structures 120, and each sensing unit 130 can be triggered independently to generate a corresponding trigger signal. The control circuit 16 is coupled to the plurality of sensing units 130 and the plurality of piezoelectric actuators 110 . Specifically, the control circuit 16 is electrically connected to the corresponding piezoelectric actuators 110 through a plurality of circuit support structures 120, so that the control circuit 16 receives the trigger signal of the sensing unit 130 and can output a driving signal to the corresponding piezoelectric actuator. device 110, and then drive the corresponding piezoelectric actuator 110 to vibrate. In this embodiment, the plurality of piezoelectric actuators 110, the plurality of circuit support structures 120 and the plurality of sensing units 130 are preferably one-to-one corresponding to each other to form a plurality of button structures 100 similar to the above, and through the control circuit 16 Independently control multiple button structures, but not limited thereto. For example, in other embodiments, one circuit support structure 120 can support more than one piezoelectric actuator according to the size, quantity and circuit complexity of the keys (see the embodiments of FIGS. Multiple button structures are controlled by more than one control circuit.
再者,类似上述,输入装置1可更包含基底层14及包覆层15,其中基底层14设置于感应层13的下方,以增进输入装置1的结构强度。在此需注意,基底层14较佳具有对应感应层13的尺寸(即输入装置1的尺寸),且具有与上述基底层140相似的性质,于此不再赘述。包覆层15覆盖于复数个压电致动器110上,且包覆层15具有复数个字符或图案150a分别设置于复数个键帽区152,其中复数个键帽区152分别对应复数个电路支撑结构120,使得包覆层15可作为键帽层。在此需注意,包覆层15可具有类似于包覆层150或150”的结构及性质,例如包覆层15可仅覆盖于复数个压电致动器上,或者设计为将复数个压电致动器110、电路支撑结构层12、感应层13及基底层14(或甚至包含控制电路16)完全被包覆于包覆层内,于此不再赘述。Moreover, similar to the above, the input device 1 may further include a base layer 14 and a covering layer 15 , wherein the base layer 14 is disposed under the sensing layer 13 to enhance the structural strength of the input device 1 . It should be noted here that the base layer 14 preferably has a size corresponding to the sensing layer 13 (that is, the size of the input device 1 ), and has properties similar to those of the above base layer 140 , which will not be repeated here. The cladding layer 15 covers the plurality of piezoelectric actuators 110, and the cladding layer 15 has a plurality of characters or patterns 150a respectively disposed on a plurality of keycap areas 152, wherein the plurality of keycap areas 152 respectively correspond to a plurality of circuits The supporting structure 120 enables the covering layer 15 to serve as a key cap layer. It should be noted here that the cladding layer 15 may have a structure and properties similar to the cladding layer 150 or 150", for example, the cladding layer 15 may only cover a plurality of piezoelectric actuators, or be designed to cover a plurality of piezoelectric actuators. The electric actuator 110 , the circuit supporting structure layer 12 , the sensing layer 13 and the base layer 14 (or even including the control circuit 16 ) are completely covered in the cladding layer, and details are omitted here.
类似图2的实施例,各电路支撑结构120具有容置空间120a、第一接点部120b及第二接点部120c,其中第一接点部120b伸入容置空间120a且与第二接点部120c电性隔离。换言之,第一接点部120b及第二接点部120c分别位于容置空间120a的内侧及外侧,使得第一接点部120b在容置空间120a于感应单元130上的投影范围内,而第二接点部120c在容置空间120a于感应单元130上的投影范围外。各压电致动器110具有被驱动部114及压电部112,其中压电部112设置于被驱动部114以对应容置空间120a并供电连接第一接点部120b,且被驱动部114受电路支撑结构120所支撑并供电连接第二接点部120c。当外界施加按压力给复数个按键结构其中一个时,按压力透过压电致动器110,电路支撑结构120而向下传递以触发感应单元130,使感应单元130输出触发讯号,进而使对应的压电致动器110接收到控制电路16输出的驱动讯号而发生震动。在此需注意,各按键结构的压电致动器110、电路支撑结构120、感应单元130的结构细节及其相互之间与控制电路16之间的作动方式可参考上述图1A至图1C的相关说明,于此不再赘述。以下的实施例着重在于电路支撑结构层的电路径配置及支撑结构细节。Similar to the embodiment of FIG. 2 , each circuit supporting structure 120 has an accommodating space 120a, a first contact portion 120b and a second contact portion 120c, wherein the first contact portion 120b extends into the accommodating space 120a and is electrically connected to the second contact portion 120c. Sexual isolation. In other words, the first contact portion 120b and the second contact portion 120c are respectively located inside and outside of the accommodating space 120a, so that the first contact portion 120b is within the projection range of the accommodating space 120a on the sensing unit 130, and the second contact portion 120c is outside the projection range of the accommodating space 120a on the sensing unit 130 . Each piezoelectric actuator 110 has a driven part 114 and a piezoelectric part 112, wherein the piezoelectric part 112 is arranged on the driven part 114 to correspond to the accommodating space 120a and is connected to the first contact part 120b with power supply, and the driven part 114 receives The circuit support structure 120 supports and supplies power to the second contact portion 120c. When the external force is applied to one of the plurality of button structures, the pressing force is transmitted downward through the piezoelectric actuator 110 and the circuit support structure 120 to trigger the sensing unit 130, so that the sensing unit 130 outputs a trigger signal, and then the corresponding The piezoelectric actuator 110 receives the driving signal output by the control circuit 16 and vibrates. It should be noted here that the structural details of the piezoelectric actuator 110, the circuit support structure 120, and the sensing unit 130 of each button structure and their actuation methods between each other and the control circuit 16 can refer to the above-mentioned FIGS. 1A to 1C. Relevant descriptions will not be repeated here. The following embodiments focus on the configuration of the electrical paths and the details of the supporting structure of the circuit supporting structure layer.
如图4A及图4B至图4G所示,电路支撑结构层12为多层结构,其包含支撑层210、第一路径层220以及第二路径层230。如图4B所示,支撑层210具有复数个(例如9个)容置部210a分别对应复数个压电致动器110。复数个容置部210a为形成于支撑层220的复数个开口或凹槽。于一实施例,复数个容置部210a较佳为形成于支撑层220上实质相同的开口或凹槽,但不以此为限。于其他实施例,依据设计需求,复数个容置部210a可为形成于支撑层220上相同或不同形状、大小的开口或凹槽(参考图5A)。于此实施例,电路支撑结构层12的电路径设计为两层的路径层(例如第一路径层220及第二路径层230),其中第一路径层220叠置于支撑层210上,且第二路径层230叠置于第一路径层220上。如图4C所示,第一路径层220具有第一电路径222,且第一电路径222包含复数个第一接点部120b。如图4D所示,第二路径层230具有第二电路径232,且第二电路径232包含复数个第二接点部120c。第一接点部120b及第二接点部120c分别位于容置部210a的内侧及外侧,使得第一接点部120b在容置部210a于感应单元130上的投影范围内,而第二接点部120c在容置部210a于感应单元130上的投影范围外。As shown in FIG. 4A and FIG. 4B to FIG. 4G , the circuit supporting structure layer 12 is a multi-layer structure, which includes a supporting layer 210 , a first routing layer 220 and a second routing layer 230 . As shown in FIG. 4B , the support layer 210 has a plurality of (for example, 9) accommodating portions 210 a corresponding to the plurality of piezoelectric actuators 110 . The plurality of accommodating portions 210 a are a plurality of openings or grooves formed in the supporting layer 220 . In one embodiment, the plurality of accommodating portions 210a are preferably substantially identical openings or grooves formed on the support layer 220 , but not limited thereto. In other embodiments, according to design requirements, the plurality of accommodating portions 210 a may be openings or grooves of the same or different shapes and sizes formed on the supporting layer 220 (refer to FIG. 5A ). In this embodiment, the electrical path of the circuit supporting structure layer 12 is designed as a two-layer path layer (such as a first path layer 220 and a second path layer 230), wherein the first path layer 220 is stacked on the supporting layer 210, and The second routing layer 230 is stacked on the first routing layer 220 . As shown in FIG. 4C , the first routing layer 220 has a first electrical routing 222 , and the first electrical routing 222 includes a plurality of first contact portions 120 b. As shown in FIG. 4D , the second path layer 230 has a second electrical path 232 , and the second electrical path 232 includes a plurality of second contact portions 120c. The first contact part 120b and the second contact part 120c are respectively located inside and outside the accommodating part 210a, so that the first contact part 120b is within the projection range of the accommodating part 210a on the sensing unit 130, and the second contact part 120c is within the projection range of the accommodating part 210a. The accommodating portion 210 a is outside the projection range of the sensing unit 130 .
类似图2的实施例,第一路径层220具有复数个第一开口220a及复数个舌部226,其中复数个第一开口220a分别对应复数个容置部210a。换言之,复数个第一开口220a的数目、大小、位置分别对应复数个容置部210a。复数个舌部226分别对应复数个第一开口220a且自对应的第一开口220a的一侧朝第一开口220a中央突伸。亦即,各第一开口220a较佳具有一个舌部226自开口侧缘朝开口中央突出形成悬臂结构。复数个第一接点部120b分别设置于复数个舌部226。换言之,如图4C所示,第一电路径222具有对应按键数目的电路径(例如9条),分别电性隔离地延伸至各舌部226以于舌部226末端形成对应的第一接点部120b。Similar to the embodiment in FIG. 2 , the first routing layer 220 has a plurality of first openings 220 a and a plurality of tongues 226 , wherein the plurality of first openings 220 a correspond to the plurality of accommodating portions 210 a respectively. In other words, the number, size, and position of the plurality of first openings 220a correspond to the plurality of accommodating portions 210a respectively. The plurality of tongues 226 respectively correspond to the plurality of first openings 220 a and protrude from one side of the corresponding first opening 220 a toward the center of the first opening 220 a. That is, each first opening 220a preferably has a tongue 226 protruding from the side edge of the opening toward the center of the opening to form a cantilever structure. The plurality of first contact portions 120b are respectively disposed on the plurality of tongue portions 226 . In other words, as shown in FIG. 4C , the first electrical path 222 has an electrical path corresponding to the number of keys (for example, 9), and extends to each tongue 226 in an electrically isolated manner to form a corresponding first contact portion at the end of the tongue 226. 120b.
如图4D所示,第二路径层230具有复数个第二开口230a及复数个延伸部234,其中复数个第二开口230a分别对应复数个第一开口220a及复数个容置部210a。复数个延伸部234对应复数个第二开口230a并自对应的第二开口230a的一侧朝第二开口230a中央突伸。于此实施例,第二电路径232作为接地路径,因此第二电路径232设计成网状电路径,使得第二电路径232至少分布于各第二开口230a的一侧,以形成对应的第二接点部120c。As shown in FIG. 4D , the second routing layer 230 has a plurality of second openings 230 a and a plurality of extension portions 234 , wherein the plurality of second openings 230 a respectively correspond to the plurality of first openings 220 a and the plurality of accommodating portions 210 a. The plurality of extensions 234 correspond to the plurality of second openings 230a and protrude from one side of the corresponding second openings 230a toward the center of the second opening 230a. In this embodiment, the second electrical path 232 is used as a grounding path, so the second electrical path 232 is designed as a mesh electrical path, so that the second electrical path 232 is at least distributed on one side of each second opening 230a to form a corresponding first Two contact parts 120c.
如图4F及如图4G的俯视图所示,当支撑层210、第一路径层220及第二路径层230由下而上依序叠置时,复数个容置部210a、复数个第一开口220a及复数个第二开口230a分别相互对准连通,且对应的容置部210a、第一开口220a及第二开口230a共同形成容置空间120a。第二路径层230叠置于第一路径层220时,构成第二路径层230的绝缘层覆盖于第一路径层220的第一电路径222,且裸露出形成于绝缘层上的第二电路径232及其复数个第二接点部120c,其中各舌部226仅被对应延伸部234部分覆盖,而裸露出复数个第一接点部120b。As shown in FIG. 4F and the top view of FIG. 4G , when the supporting layer 210, the first routing layer 220 and the second routing layer 230 are stacked sequentially from bottom to top, the plurality of accommodating portions 210a, the plurality of first openings 220a and the plurality of second openings 230a are respectively aligned and communicated with each other, and the corresponding accommodating portion 210a, the first opening 220a and the second opening 230a jointly form the accommodating space 120a. When the second routing layer 230 is stacked on the first routing layer 220, the insulating layer constituting the second routing layer 230 covers the first electrical routing 222 of the first routing layer 220, and exposes the second electrical routing formed on the insulating layer. The path 232 and its plurality of second contact portions 120c, wherein each tongue portion 226 is only partially covered by the corresponding extension portion 234, and the plurality of first contact portions 120b are exposed.
如图4E所示,电路支撑结构12可更包含保护层240,其中保护层240设置于第二路径层230上以遮蔽除复数个第一接点部120b及复数个第二接点部120c之外裸露的第二电路径232及第一电路径222(若未被第二路径层230遮蔽),以保护电路径避免形成短路或因裸露而受到损坏。于此实施例,保护层240具有一个开口240a,且开口240a设计为使得复数个(例如9个)电路支撑结构120皆自同一开口240a裸露出。然而,于其他实施例,保护层可具有复数个开口,以分别对应复数个电路支撑结构120,而使得电路支撑结构120自对应的开口中裸露出(详见图7A至图7D的实施例)。此外,类似于图3A及图3B的电路支撑结构,电路支撑结构层12可进一步包含隔离层,其中隔离层设置于第一路径层220及第二路径层230之间,以电性隔离第一电路径222及第二电路径232,于此不再赘述。As shown in FIG. 4E , the circuit supporting structure 12 may further include a protective layer 240, wherein the protective layer 240 is disposed on the second routing layer 230 to cover the exposed parts except the plurality of first contact portions 120b and the plurality of second contact portions 120c. The second electrical path 232 and the first electrical path 222 (if not covered by the second routing layer 230 ) are used to protect the electrical paths from being short-circuited or being damaged due to exposure. In this embodiment, the protection layer 240 has an opening 240a, and the opening 240a is designed such that a plurality (for example, nine) of the circuit supporting structures 120 are all exposed from the same opening 240a. However, in other embodiments, the protection layer may have a plurality of openings corresponding to the plurality of circuit support structures 120, so that the circuit support structures 120 are exposed from the corresponding openings (see the embodiments of FIG. 7A to FIG. 7D for details) . In addition, similar to the circuit support structure of FIG. 3A and FIG. 3B , the circuit support structure layer 12 may further include an isolation layer, wherein the isolation layer is disposed between the first routing layer 220 and the second routing layer 230 to electrically isolate the first routing layer 220 and the second routing layer 230. The electrical path 222 and the second electrical path 232 are not described in detail here.
此外,当输入装置的按键结构数目增加而使得第一电路径布局更加复杂,而无法配置于单一第一路径层时,电路支撑结构层可设计为具有多层堆叠的第一路径层。如图5A至图5E所示,于一实施例,电路径支撑结构层用于例如具有81个按键结构的输入装置,且包含支撑层310、第一路径甲层320、第一路径乙层330、第二路径层340以及保护层350。在此需注意,支撑层310、第一路径甲层320、第一路径乙层330、第二路径层340以及保护层350的结构细节及作用可参考上述电路支撑结构层12的各对应元件的说明,于后仅就本实施例不同之处进行说明。如图5A所示,支撑层310具有复数个容置部310a,其中依据对应按键结构的大小,复数个容置部(例如310a、310a’、310a”)可具有不同的尺寸及不同的形状。In addition, when the number of key structures of the input device increases and the layout of the first electrical path becomes more complex and cannot be configured in a single first path layer, the circuit support structure layer can be designed to have a multi-layer stacked first path layer. As shown in FIG. 5A to FIG. 5E , in one embodiment, the electrical path supporting structure layer is used for an input device having, for example, 81 button structures, and includes a supporting layer 310 , a first path A layer 320 , and a first path B layer 330 , the second path layer 340 and the protection layer 350 . It should be noted here that for the structural details and functions of the supporting layer 310, the first routing layer A 320, the first routing layer B 330, the second routing layer 340, and the protective layer 350, please refer to the corresponding components of the above-mentioned circuit supporting structure layer 12. For description, only the differences of this embodiment will be described later. As shown in FIG. 5A , the support layer 310 has a plurality of accommodating portions 310a, wherein the plurality of accommodating portions (such as 310a, 310a′, 310a″) can have different sizes and different shapes according to the size of the corresponding key structure.
再者,于此实施例,电路支撑结构层的第一路径层布局为两层的第一路径层,例如第一路径甲层320及第一路径乙层330,进而使得复数个电路支撑结构的复数个第一接点部分组为第一组第一接点部324及第二组第一接点部334。如图5B所示,第一路径甲层320具有第一电路径甲322,其中第一电路径甲322包含第一组的第一接点部324。具体而言,第一路径甲层320具有复数个第一开口(例如320a、320b),以分别对应支撑层310的复数个容置部310a,其中第一开口320a为设置有舌部326的开口,而第二开口320b为未设置舌部326的开口。至少一第一舌部326自第一开口320a的一侧朝第一开口320a中央突伸,以供设置第一接点部324。换言之,于此实施例,第一路径甲层320较佳仅在欲设置第一接点部324的对应开口(例如320a)设置第一舌部326,而在不设置第一接点部的其余开口(例如320b)则不设置第一舌部。此外,依据按键尺寸,相应于大容置部310a’,第一开口320a’可设置有复数个第一舌部326,以供电连接一个以上的压电致动器110。Furthermore, in this embodiment, the layout of the first routing layer of the circuit supporting structure layer is a two-layer first routing layer, such as the first routing layer A 320 and the first routing B layer 330, so that the multiple circuit supporting structures The plurality of first contact part groups are a first group of first contact parts 324 and a second group of first contact parts 334 . As shown in FIG. 5B , the first trace A layer 320 has a first electrical trace A 322 , wherein the first electrical trace A 322 includes a first group of first contact portions 324 . Specifically, the first path A layer 320 has a plurality of first openings (such as 320a, 320b) to respectively correspond to the plurality of accommodating portions 310a of the support layer 310, wherein the first opening 320a is an opening provided with a tongue portion 326 , and the second opening 320b is an opening without a tongue 326 . At least one first tongue portion 326 protrudes from one side of the first opening 320 a toward the center of the first opening 320 a for disposing the first contact portion 324 . In other words, in this embodiment, the first path A layer 320 is preferably provided with the first tongue 326 only in the corresponding opening (for example 320a) where the first contact portion 324 is to be provided, and the remaining openings (such as 320a) where the first contact portion is not provided ( For example, 320b) does not have a first tongue. In addition, according to the size of the button, corresponding to the large accommodating portion 310a', the first opening 320a' may be provided with a plurality of first tongues 326 for connecting more than one piezoelectric actuator 110 with power.
类似地,如图5C所示,第一路径乙层330具有第一电路径乙332,其中第一电路径乙332包含第二组的第一接点部334。具体而言,第一路径乙层330具有复数个第二开口330a、330b,以分别对应第一路径甲层320的复数个第一开口320b、320a,其中第二开口330a为设置第二舌部336的开口,而第二开口330b为设置遮蔽部338的开口。至少一第二舌部336自第二开口330a的一侧朝第二开口330a中央突伸,以供设置第一接点部334。再者,至少一遮蔽部338自第二开口330b的一侧朝第二开口330b中央突伸,以供遮蔽第一路径甲层320的第一舌部324的一部分以裸露出第一接点324。换言之,第二舌部336设置于与第一路径甲层320未设置舌部的开口(例如320b)对应的第二开口(例如330a)的一侧,而遮蔽部338设置于与第一路径甲层320设置有第一舌部326的第一开口(例如320a)对应的第二开口(例如330b)的一侧。于此实施例,对应的第一开口320a、320b及第二开口330b、330a较佳具有相同的形状、尺寸,而第一舌部326及第二舌部336较佳具有相同的延伸长度。相应于此,遮蔽部338的延伸长度小于第二舌部336的延伸长度。类似地,依据按键尺寸,相应于大容置部310a”,第二开口330a’可设置有复数个第二舌部336,以供电连接一个以上的压电致动器110,而相应于大第一开口320a’的第二开口330b’可设置有对应数目的遮蔽部338,以分别遮蔽对应的第一舌部326的一部分而使其上的第一接点部324裸露出。Similarly, as shown in FIG. 5C , the first trace B layer 330 has a first electrical trace B 332 , wherein the first electrical trace B 332 includes a second set of first contact portions 334 . Specifically, the first path B layer 330 has a plurality of second openings 330a, 330b to respectively correspond to the plurality of first openings 320b, 320a of the first path layer A 320, wherein the second opening 330a is provided with a second tongue 336, and the second opening 330b is the opening for setting the shielding portion 338. At least one second tongue portion 336 protrudes from one side of the second opening 330 a toward the center of the second opening 330 a for disposing the first contact portion 334 . Furthermore, at least one shielding portion 338 protrudes from one side of the second opening 330b toward the center of the second opening 330b for covering a part of the first tongue portion 324 of the first path armor layer 320 to expose the first contact 324 . In other words, the second tongue 336 is disposed on one side of the second opening (for example 330a) corresponding to the opening (for example 320b) of the first route A layer 320 without a tongue, and the shielding portion 338 is disposed on the side of the first route A layer 320. The layer 320 is provided with a side of the first opening (eg 320a ) of the first tongue 326 corresponding to the second opening (eg 330b ). In this embodiment, the corresponding first openings 320a, 320b and second openings 330b, 330a preferably have the same shape and size, and the first tongue portion 326 and the second tongue portion 336 preferably have the same extension length. Correspondingly, the extension length of the shielding portion 338 is smaller than the extension length of the second tongue portion 336 . Similarly, according to the key size, corresponding to the large accommodating part 310a", the second opening 330a' can be provided with a plurality of second tongues 336 to connect more than one piezoelectric actuator 110 with power supply, and corresponding to the large second opening 330a'. The second opening 330b' of the opening 320a' can be provided with a corresponding number of shielding parts 338, so as to respectively cover a part of the corresponding first tongue part 326 and expose the first contact part 324 thereon.
如图5D所示,第二路径层340具有复数个第三开口340a、340b,以分别对应复数个第二开口330a、330b,其中第三开口340a为设置有延伸部346的开口,而第三开口340b为未设置延伸部346的开口。至少一遮蔽部346自第三开口340a的一侧朝第三开口340a中央突伸,以供遮蔽第一路径乙层330的第二舌部336的一部分以裸露出第一接点334。换言之,延伸部346设置于与第一路径乙层330设置有第二舌部336的第二开口(例如330a)对应的第三开口(例如340a)的一侧。第二路径层340具有第二电路径342以作为接地路径,因此第二电路径342设计成网状电路径,使得第二电路径342至少分布于各第三开口340a、340b的一侧,以形成对应的第二接点部344。As shown in FIG. 5D, the second routing layer 340 has a plurality of third openings 340a, 340b corresponding to the plurality of second openings 330a, 330b respectively, wherein the third opening 340a is an opening provided with an extension part 346, and the third The opening 340b is an opening not provided with the extension part 346 . At least one shielding portion 346 protrudes from one side of the third opening 340 a toward the center of the third opening 340 a for covering a part of the second tongue portion 336 of the first path B layer 330 to expose the first contact 334 . In other words, the extension portion 346 is disposed on one side of the third opening (eg 340 a ) corresponding to the second opening (eg 330 a ) of the first path B layer 330 provided with the second tongue portion 336 . The second path layer 340 has a second electric path 342 as a ground path, so the second electric path 342 is designed as a mesh electric path, so that the second electric path 342 is at least distributed on one side of each third opening 340a, 340b, so as to A corresponding second contact portion 344 is formed.
如图5E所示,保护层350叠置于第二路径层340上,以遮蔽除第一组第一接点部324、第一组第二接点部334及复数个第二接点部344以外裸露的电路径(例如第二电路径342、第一电路径乙332、第一电路径甲322)。保护层350可依据欲遮蔽/保护的裸露电路径的分布而具有不同的形状,且保护层350可为单一连续层或由多个分离保护段所组成的组合层。As shown in FIG. 5E , the protection layer 350 is stacked on the second routing layer 340 to cover the exposed parts except the first group of first contact portions 324 , the first group of second contact portions 334 and the plurality of second contact portions 344 . Electrical paths (such as the second electrical path 342, the first electrical path B 332, the first electrical path A 322). The protection layer 350 can have different shapes according to the distribution of exposed electrical paths to be shielded/protected, and the protection layer 350 can be a single continuous layer or a combined layer composed of a plurality of separate protection segments.
当支撑层310、第一路径甲层320、第一路径乙层330、第二路径层340以及保护层350由下而上依序叠置时,复数个容置部310a、第一开口320a、320b、第二开口330b、330a、第三开口340b、340a相互对准连通以共同形成对应的容置空间120a,且第一组第一接点部324及第二组第一接点部334较佳于复数个按键结构(或于压电致动器110)之排列方向上交错设置,以使得第一电路径甲322及第一电路径乙332具有较佳的布局分布。换言之,以第一路径甲层320而言,复数个第一开口320a及第一开口320b较佳间隔设置,而第一路径乙层330的第二开口330a及第二开口330b对应地间隔设置,而使得复杂的第一电路径具有较宽松的布局面积,增加电路支撑结构的可制造性。在此需注意,第一组第一接点部324及第二组第一接点部334的配置方式可依实际设计而变化。举例而言,于其他实施例,第一组第一接点部324及第二组第一接点部334可配置为间隔成行或成列交错间隔的方式,或每两个接点间隔交错的方式,但不以此为限。When the supporting layer 310, the first routing layer A 320, the first routing layer B 330, the second routing layer 340, and the protective layer 350 are stacked sequentially from bottom to top, the plurality of accommodating parts 310a, the first opening 320a, 320b, the second openings 330b, 330a, and the third openings 340b, 340a are aligned and communicated with each other to jointly form the corresponding accommodating space 120a, and the first group of first contact parts 324 and the second group of first contact parts 334 are preferably A plurality of button structures (or in the arrangement direction of the piezoelectric actuators 110 ) are arranged alternately so that the first electrical path A 322 and the first electrical path B 332 have a better layout distribution. In other words, in terms of the first path A layer 320, the plurality of first openings 320a and the first openings 320b are preferably arranged at intervals, while the second openings 330a and the second openings 330b of the first path B layer 330 are correspondingly arranged at intervals, Therefore, the complex first electrical path has a looser layout area, increasing the manufacturability of the circuit supporting structure. It should be noted here that the arrangement of the first set of first contact portions 324 and the second set of first contact portions 334 may vary according to actual design. For example, in other embodiments, the first group of first contact portions 324 and the second group of first contact portions 334 can be arranged in rows or columns, or in a staggered manner every two contacts, but This is not the limit.
此外,当输入装置具有少数按键结构而使电路支撑结构层的电路径设计相对简单时,电路支撑结构层可具有第一电路径及第二电路径整合于单一层的电路径层。如图7A至图7D所示,电路支撑结构层12’包含支撑层710、电路径层720及保护层730。在此需注意,支撑层710、电路径层720及保护层730的结构细节及作用可参考上述电路支撑结构层12的各对应元件的说明,于后仅就本实施例不同的处进行说明。如图7A所示,支撑层710具有复数个(例如9个)容置部710a。如图7B所示,电路层720叠置于支撑层710上,并具有对应数目的第一开口720a及复数个舌部726。复数个第一开口720a分别对应复数个容置部710a,以共同形成复数个容置空间120a。复数个舌部726分别自对应的第一开口720a的一侧朝第一开口720a中央突伸。第一电路径722包含复数条(例如9条)电路径分别延伸至第一开口720a中的对应舌部726,以于舌部726末端形成第一接点120b。第二电路径728作为接地路径,因此第二电路径728设计成网状电路径,使得第二电路径728至少分布于各开口710a的一侧,以形成对应的第二接点部120c。于此实施例,第一电路径722较佳集中设置电路径层720的一侧(例如左侧),而第二电路径728自电路径层720的另一侧(例如右侧)伸入相邻开口710a之间,使得第一电路径722及第二电路径728彼此电性隔离。In addition, when the input device has a few button structures and the electrical path design of the circuit support structure layer is relatively simple, the circuit support structure layer may have an electric path layer in which the first electric path and the second electric path are integrated into a single layer. As shown in FIG. 7A to FIG. 7D , the circuit support structure layer 12' includes a support layer 710, a circuit path layer 720 and a protection layer 730. It should be noted here that for the structural details and functions of the support layer 710 , the circuit path layer 720 and the protection layer 730 , please refer to the description of the corresponding components of the above-mentioned circuit support structure layer 12 , and only the differences of this embodiment will be described later. As shown in FIG. 7A , the support layer 710 has a plurality (for example, 9) of accommodating portions 710 a. As shown in FIG. 7B , the circuit layer 720 is stacked on the support layer 710 and has a corresponding number of first openings 720 a and a plurality of tongues 726 . The plurality of first openings 720a respectively correspond to the plurality of accommodating portions 710a to jointly form a plurality of accommodating spaces 120a. The plurality of tongues 726 respectively protrude from one side of the corresponding first opening 720a toward the center of the first opening 720a. The first electrical path 722 includes a plurality of (for example, 9) electrical paths respectively extending to the corresponding tongues 726 in the first opening 720 a to form the first contact 120 b at the end of the tongues 726 . The second electrical path 728 serves as a ground path, so the second electrical path 728 is designed as a mesh electrical path, so that the second electrical path 728 is distributed at least on one side of each opening 710a to form the corresponding second contact portion 120c. In this embodiment, the first electrical path 722 is preferably concentrated on one side (eg, the left side) of the electrical path layer 720, and the second electrical path 728 extends into the phase from the other side (eg, the right side) of the electrical path layer 720. Between the adjacent openings 710a, the first electrical path 722 and the second electrical path 728 are electrically isolated from each other.
如图7C所示,保护层730设置于电路径层720上,以遮蔽除复数个第一接点部120b及复数个第二接点部120c之外裸露的第二电路径728及第一电路径722。具体而言,于此实施例,保护层730具有复数个第四开口730a及复数个遮蔽部734,其中复数个第四开口730a分别对应电路径层720的第一开口720a,以使各电路径支撑结构自对应的第四开口730a裸露出以供电连接压电致动器110,如图7D所示。As shown in FIG. 7C , the protection layer 730 is disposed on the circuit path layer 720 to cover the exposed second circuit path 728 and the first circuit path 722 except the plurality of first contact portions 120b and the plurality of second contact portions 120c. . Specifically, in this embodiment, the protective layer 730 has a plurality of fourth openings 730a and a plurality of shielding portions 734, wherein the plurality of fourth openings 730a correspond to the first openings 720a of the electrical path layer 720, so that each electrical path The supporting structure is exposed from the corresponding fourth opening 730 a to connect the piezoelectric actuator 110 with power, as shown in FIG. 7D .
再者,输入装置的复数个压电致动器亦可整合成单一的压电致动器组合,以简化组装程序。如图6所示,压电致动器组合11对应于图5A至图5E的电路支撑结构层,其包含复数个(例如82个)压电致动器110及连接件116,其中连接件116连接复数个压电致动器110。如图所示,各压电致动器110具有被驱动部114及压电部112,且压电部112设置于被驱动部114上。此外,依据对应按键的尺寸,压电致动器110可具有一个以上的压电部112设置于被驱动部114上。连接件116连接于复数个压电致动器110的被驱动部114的同一侧,以使得复数个压电致动器110以阵列方式排列连接且各压电致动器110可相对于连接件116独立地摆动。于此实施例,连接件116可为具有复数条平行连接条116a的框形连接件。复数个压电致动器110沿连接条116a相互间隔,且较佳以被驱动部114的同一侧(例如上侧)与连接条116a相接。如图所示,各被驱动部114为矩形形状,且复数个被驱动部114仅以矩形形状的一侧边(例如水平上侧边)与连接条116a相互连接。在此需注意,连接件116的形状及连接条116a的数目及配置,可依据设计需求而变化,不以实施例所示为限。Furthermore, multiple piezoelectric actuators of the input device can also be integrated into a single piezoelectric actuator combination to simplify the assembly process. As shown in Figure 6, the piezoelectric actuator assembly 11 corresponds to the circuit support structure layer of Figure 5A to Figure 5E, which includes a plurality of (for example 82) piezoelectric actuators 110 and connectors 116, wherein the connectors 116 A plurality of piezoelectric actuators 110 are connected. As shown in the figure, each piezoelectric actuator 110 has a driven part 114 and a piezoelectric part 112 , and the piezoelectric part 112 is disposed on the driven part 114 . In addition, according to the size of the corresponding button, the piezoelectric actuator 110 may have more than one piezoelectric portion 112 disposed on the driven portion 114 . The connector 116 is connected to the same side of the driven part 114 of the plurality of piezoelectric actuators 110, so that the plurality of piezoelectric actuators 110 are arranged and connected in an array and each piezoelectric actuator 110 can be connected to the connector. 116 oscillate independently. In this embodiment, the connecting member 116 can be a frame-shaped connecting member having a plurality of parallel connecting bars 116a. The plurality of piezoelectric actuators 110 are spaced apart from each other along the connecting bar 116a, and preferably connect with the connecting bar 116a on the same side (eg upper side) of the driven part 114 . As shown in the figure, each driven portion 114 has a rectangular shape, and the plurality of driven portions 114 are connected to each other with the connecting bar 116a only on one side (eg, the horizontal upper side) of the rectangular shape. It should be noted here that the shape of the connecting member 116 and the number and arrangement of the connecting bars 116 a can be changed according to design requirements, and are not limited to the embodiment shown.
再者,从另一观点而言,图6所示的压电致动器组合可视为包含导电片11a(例如但不限于铜片)及复数个压电件(即压电部112),其中导电片11a具有复数个切割槽118以定义出复数个被驱动部114,且复数个被驱动部114以一侧相互连接,形成悬臂式的复数片体。复数个压电件112分别设置于复数个被驱动部114,以形成复数个压电致动器110。换言之,复数个切割槽118将导电片11a切割为复数个压电致动器110及连接件116。以矩形被驱动部为例,复数个切割槽118包含至少一梳齿状切割槽,其中梳齿状切割槽118具有主槽118a及复数个梳齿槽118b。复数个梳齿槽118b连通主槽118a并沿主槽118a的延伸方向平行排列,其中主槽118a位于复数个被驱动部114的一侧,而梳齿槽118b伸入相邻被驱动部114之间。当压电致动器组合11叠置于电路支撑结构层时,可藉由固定连接条116a或导电片11a位于主槽118a相对侧的部分于电路支撑结构层,即可达到复数个压电致动器110与对应电路支撑结构120的连接。Moreover, from another point of view, the piezoelectric actuator assembly shown in FIG. 6 can be considered to include a conductive sheet 11a (such as but not limited to a copper sheet) and a plurality of piezoelectric elements (ie, piezoelectric parts 112), The conductive sheet 11 a has a plurality of cutting grooves 118 to define a plurality of driven parts 114 , and the plurality of driven parts 114 are connected to each other on one side to form a plurality of cantilevered pieces. A plurality of piezoelectric elements 112 are respectively disposed on a plurality of driven parts 114 to form a plurality of piezoelectric actuators 110 . In other words, the plurality of cutting grooves 118 cut the conductive sheet 11 a into a plurality of piezoelectric actuators 110 and connecting elements 116 . Taking the rectangular driven part as an example, the plurality of cutting grooves 118 includes at least one comb-shaped cutting groove, wherein the comb-shaped cutting groove 118 has a main groove 118a and a plurality of comb-shaped grooves 118b. A plurality of comb-tooth grooves 118b communicate with the main groove 118a and are arranged in parallel along the extending direction of the main groove 118a, wherein the main groove 118a is located on one side of a plurality of driven parts 114, and the comb-tooth grooves 118b extend into adjacent driven parts 114 between. When the piezoelectric actuator assembly 11 is stacked on the circuit support structure layer, a plurality of piezoelectric actuators can be achieved by fixing the connecting strip 116a or the part of the conductive sheet 11a on the opposite side of the main groove 118a to the circuit support structure layer. The actuator 110 is connected to the corresponding circuit support structure 120.
在此需注意,当多个按键结构的各元件整合成对应的部件层时,为了避免相邻按键结构之间的干扰或误触而影响感应单元的感测,输入装置可具有回避感应误判结构。如图8A至图8C的实施例所示,电路支撑结构层12及感应层13至少其中之一具有复数个切割槽170、170a、170b,以单个化复数个电路支撑结构120及/或单个化复数个感应单元130,使得相邻的电路支撑结构120及/或相邻的感应单元130不直接对应连接。It should be noted here that when the components of multiple key structures are integrated into corresponding component layers, in order to avoid interference or false touches between adjacent key structures and affect the sensing of the sensing unit, the input device can have a function to avoid misjudgment of sensing. structure. As shown in the embodiment of FIGS. 8A to 8C , at least one of the circuit support structure layer 12 and the sensing layer 13 has a plurality of cutting grooves 170, 170a, 170b to singulate a plurality of circuit support structures 120 and/or singulate The plurality of sensing units 130 make adjacent circuit supporting structures 120 and/or adjacent sensing units 130 not directly correspondingly connected.
于一实施例,如图8A所示,复数个切割槽170a形成于电路支撑结构层12,以单个化复数个电路支撑结构(或称单元)120,使得相邻的电路支撑结构不直接对应连接,以降低复数个电路支撑结构120之间的连动性。具体而言,切割槽170a贯穿电路支撑结构层12(例如贯穿上述的支撑层、第一路径层、第二路径层、保护层等),以使得各电路支撑结构120至少有一侧边与相邻的电路支撑结构120藉由切割槽170a分隔。亦即,复数个切割槽170a分别位于复数个电路支撑结构120的周围,使得相邻的电路支撑结构120的至少一侧边互不相连(即具有间隙)。从另一观点而言,复数个切割槽170a围绕复数个电路支撑结构120,使得相邻的电路支撑结构120各藉由至少一连接部172相互连接,且相邻的电路支撑结构120的至少一连接部172错开设置。如图所示,对应于矩形的电路支撑结构120,切割槽170a为具有一个开口的矩形开放式环形切割槽,其中连接部172位于开放环形切割槽的开口处,使得各电路支撑结构120形成电路支撑结构层12上的悬臂式电路支撑结构120。再者,复数个切割槽170a皆以开口位于上方的方式环绕对应的电路支撑结构120,使得相邻电路支撑结构120的连接部172不相互直接连接。亦即,复数个切割槽170a设置为不使得切割槽170a的开口直接面对面。In one embodiment, as shown in FIG. 8A, a plurality of cutting grooves 170a are formed in the circuit support structure layer 12 to singulate a plurality of circuit support structures (or units) 120, so that adjacent circuit support structures are not directly correspondingly connected. , so as to reduce the linkage between the plurality of circuit support structures 120 . Specifically, the cutting groove 170a penetrates the circuit support structure layer 12 (for example, through the support layer, the first path layer, the second path layer, the protective layer, etc.), so that each circuit support structure 120 has at least one side and the adjacent The circuit supporting structures 120 are separated by cutting grooves 170a. That is, the plurality of cutting grooves 170 a are located around the plurality of circuit support structures 120 , so that at least one side of adjacent circuit support structures 120 is not connected to each other (that is, there is a gap). From another point of view, the plurality of cutting grooves 170a surrounds the plurality of circuit support structures 120, so that the adjacent circuit support structures 120 are connected to each other by at least one connecting portion 172, and at least one of the adjacent circuit support structures 120 The connection parts 172 are arranged in a staggered manner. As shown in the figure, corresponding to the rectangular circuit supporting structure 120, the cutting groove 170a is a rectangular open annular cutting groove with an opening, wherein the connecting part 172 is located at the opening of the open annular cutting groove, so that each circuit supporting structure 120 forms a circuit A cantilevered circuit support structure 120 on the support structure layer 12 . Furthermore, the plurality of cutting grooves 170 a surround the corresponding circuit supporting structures 120 with openings located above, so that the connecting portions 172 of adjacent circuit supporting structures 120 are not directly connected to each other. That is, the plurality of cutting grooves 170a are arranged so that openings of the cutting grooves 170a do not directly face each other.
当外界施加按压力时,被按压的电路支撑结构120结构上与相邻的电路支撑结构120分隔却又并未真正分离,可有效触发下方对应的感应单元130,而不会带动相邻的电路支撑结构120发生误触操作。When external pressure is applied, the pressed circuit support structure 120 is structurally separated from the adjacent circuit support structure 120 but not really separated, which can effectively trigger the corresponding sensing unit 130 below without driving the adjacent circuit A false touch operation of the support structure 120 occurs.
于另一实施例,如图8B所示,复数个切割槽170b形成于感应层13,以单个化复数个感应单元130,使得相邻的感应单元130不直接对应连接,以降低复数个感应单元130之间的连动性。于此实施例,切割槽170b具有与图8A的切割槽170a实质相同的配置,使得相邻的感应单元130的至少一侧边互不相连,于此不再赘述。In another embodiment, as shown in FIG. 8B, a plurality of cutting grooves 170b are formed on the sensing layer 13 to singulate a plurality of sensing units 130, so that adjacent sensing units 130 are not directly correspondingly connected to reduce the number of sensing units. Linkage between 130. In this embodiment, the cutting groove 170b has substantially the same configuration as that of the cutting groove 170a in FIG. 8A , so that at least one side of adjacent sensing units 130 is not connected to each other, and details are not repeated here.
于又一实施例,如图8C所示,复数个切割槽170a及170b分别形成于电路支撑结构层12及感应层13,以单个化复数个电路支撑结构120及复数个感应单元130,使得相邻的电路支撑结构120/感应单元130不直接对应连接,以降低复数个电路支撑结构120/感应单元130之间的连动性。在此需注意,当切割槽170同时形成于电路支撑结构层12及感应层13时,形成于对应电路支撑结构120及感应单元130周围的切割槽170a及170b较佳具有对应的性状、大小及位置,使得对应切割槽170a及170b可连通为同时贯穿电路支撑结构层12及感应层13的切割槽170。In yet another embodiment, as shown in FIG. 8C, a plurality of cutting grooves 170a and 170b are respectively formed on the circuit supporting structure layer 12 and the sensing layer 13, so as to singulate a plurality of circuit supporting structures 120 and a plurality of sensing units 130, so that the phase Adjacent circuit support structures 120 /sensing units 130 are not connected directly to reduce linkage between the plurality of circuit support structures 120 /sensing units 130 . It should be noted here that when the cutting groove 170 is formed on the circuit supporting structure layer 12 and the sensing layer 13 at the same time, the cutting grooves 170a and 170b formed around the corresponding circuit supporting structure 120 and the sensing unit 130 preferably have corresponding properties, sizes and The positions are such that the corresponding cutting grooves 170a and 170b can be connected to form the cutting groove 170 penetrating through the circuit supporting structure layer 12 and the sensing layer 13 at the same time.
再者,切割槽可依据实际需求而有不同的态样。如图9A及图10A所示,形成于电路支撑结构层12及感应层13的切割槽180a,为具有两个开口的开放环形切割槽,其中两个连接部182分别位于切割槽180a的两个开口处,且相邻的电路支撑结构120/感应单元130的连接部182错开设置,即开口设置成不直接面对面。Furthermore, the cutting grooves can have different shapes according to actual needs. As shown in Figure 9A and Figure 10A, the cutting groove 180a formed in the circuit supporting structure layer 12 and the induction layer 13 is an open annular cutting groove with two openings, wherein the two connecting parts 182 are respectively located at two ends of the cutting groove 180a. At the opening, the connecting portion 182 of the adjacent circuit support structure 120/sensing unit 130 is staggered, that is, the opening is not directly facing each other.
如图9B及图10B所示,形成于电路支撑结构层12及感应层13的切割槽180b为复数条直线切割槽,其中复数条直线切割槽180b至少有一端互不连通。于此实施例,电路支撑结构120及感应单元130为四条切割槽180b所围绕(即四条切割槽180b形成于其四周),且每条四条切割槽180b中的任意两条互不连通,使得电路支撑结构120/感应单元130藉由四个连接部186与其他电路支撑结构120/感应单元130连接。于此实施例,四个连接部186分别位于电路支撑结构120/感应单元130的四个角落,但不以此为限。于其他实施例,可藉由设置复数条长度不同、连接方式不同的直线切割槽于电路支撑结构120/感应单元130的周围,而改变连接部的位置。As shown in FIG. 9B and FIG. 10B , the cutting grooves 180b formed on the circuit supporting structure layer 12 and the sensing layer 13 are a plurality of linear cutting grooves, wherein at least one end of the plurality of linear cutting grooves 180b is not connected to each other. In this embodiment, the circuit support structure 120 and the sensing unit 130 are surrounded by four cutting grooves 180b (that is, the four cutting grooves 180b are formed around it), and any two of the four cutting grooves 180b are not connected to each other, so that the circuit The supporting structure 120 /sensing unit 130 is connected to other circuit supporting structures 120 /sensing unit 130 through four connection portions 186 . In this embodiment, the four connecting portions 186 are respectively located at the four corners of the circuit supporting structure 120 /sensing unit 130 , but it is not limited thereto. In other embodiments, the position of the connection part can be changed by arranging a plurality of straight cut grooves with different lengths and different connection methods around the circuit support structure 120 /sensing unit 130 .
如图9C及图10C所示,于此实施例,相邻的电路支撑结构120/感应单元130于其至少一侧具有共同的切割槽180d,而于其他侧设置有各自的切割槽180c。亦即,相邻的电路支撑结构120/感应单元130之间可藉由一或多个切割槽分离。于此实施例,电路支撑结构120/感应单元130亦可如上实施例所述藉由四个连接部186与其他电路支撑结构120/感应单元130连接。四个连接部186分别位于电路支撑结构120/感应单元130的四个角落,但不以此为限。As shown in FIG. 9C and FIG. 10C , in this embodiment, adjacent circuit support structures 120 /sensing units 130 have a common cutting groove 180 d on at least one side thereof, and have respective cutting grooves 180 c on the other sides. That is, adjacent circuit support structures 120/sensing units 130 may be separated by one or more cutting grooves. In this embodiment, the circuit supporting structure 120 /sensing unit 130 can also be connected to other circuit supporting structures 120 /sensing unit 130 through the four connection portions 186 as described in the above embodiment. The four connecting portions 186 are respectively located at four corners of the circuit supporting structure 120 /sensing unit 130 , but not limited thereto.
在此需注意,切割槽较佳围绕个别的电路支撑结构/感应单元,且切割槽的长度越长越有利于回避感应误判。此外,切割槽的形状不以实施例所示为限。于其他实施例,对应按键结构的形状,切割槽可为圆形环形式或其他几何形式的开放环形切割槽。再者,回避感应误判结构可形成于输入装置之外部触发源与感应层之间的其他结构层,不限于上述实施例的电路支撑结构层(例如图4A、图5A至图5E、图7D所示)、感应层。亦即,切割槽可形成于具有其他电路设计的支撑结构层,以达到各个感应单元操作上的分离,同时亦保持整体形状上的完整性。It should be noted here that the cutting groove preferably surrounds individual circuit support structures/sensing units, and the longer the cutting groove is, the better it is to avoid sensing misjudgment. In addition, the shape of the cutting groove is not limited to the embodiment shown. In other embodiments, corresponding to the shape of the button structure, the cutting groove can be in the form of a circular ring or an open annular cutting groove in other geometric forms. Furthermore, the structure for avoiding misjudgment of induction can be formed on other structural layers between the external trigger source and the sensing layer of the input device, and is not limited to the circuit supporting structural layer of the above-mentioned embodiment (for example, FIG. 4A, FIG. 5A to FIG. 5E, FIG. 7D shown), the sensing layer. That is, the cutting groove can be formed on the support structure layer with other circuit designs, so as to separate the sensing units in operation while maintaining the integrity of the overall shape.
相较于习知技术,本发明的按键结构及输入装置藉由层叠结构达到薄型化的特性,同时藉由压电致动器提供按压回馈作为使用者操作提示。再者,本发明的按键结构及输入装置藉由整合电路径于支撑结构而成为模组化多层堆叠的电路支撑结构(层),不仅增加电路支撑结构(层)的可制造性,更可藉由层与层之间的相互堆叠而有效达到不同电路径层的电性隔离,有效防止短路发生。此外,本发明的输入装置藉由复数个压电致动器整合为单一部件的压电致动器组合,使压电致动器可轻易地叠置于电路支撑结构而达到电性连接及支撑目的,以简化制造程序及节省成本。再者,本发明的回避感应误判结构设计可有效达到输入装置操作上的感应分离增进感应正确性,同时保持输入装置的完整性。Compared with the conventional technology, the button structure and the input device of the present invention achieve thinner characteristics through the laminated structure, and at the same time, the piezoelectric actuator provides press feedback as a user operation prompt. Furthermore, the button structure and input device of the present invention become a modularized multi-layer stacked circuit support structure (layer) by integrating the electrical path in the support structure, which not only increases the manufacturability of the circuit support structure (layer), but also can The electrical isolation of different electrical path layers can be effectively achieved by stacking the layers, and the occurrence of short circuits can be effectively prevented. In addition, the input device of the present invention integrates a plurality of piezoelectric actuators into a single piezoelectric actuator combination, so that the piezoelectric actuators can be easily stacked on the circuit support structure to achieve electrical connection and support The purpose is to simplify the manufacturing process and save costs. Furthermore, the structural design for avoiding sensing misjudgment of the present invention can effectively achieve sensing separation in the operation of the input device and improve sensing accuracy while maintaining the integrity of the input device.
本发明已由上述实施例加以描述,然而上述实施例仅为例示目的而非用于限制。熟此技艺者当知在不悖离本发明精神下,于此特别说明的实施例可有例示实施例的其他修改。因此,本发明范畴亦涵盖此类修改且仅由所附申请专利范围限制。The present invention has been described by the above embodiments, however, the above embodiments are only for the purpose of illustration and not for limitation. Those skilled in the art will appreciate that other modifications of the illustrated embodiments can be made to the embodiments specifically described herein without departing from the spirit of the invention. Accordingly, the scope of the present invention also covers such modifications and is limited only by the appended claims.
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| US20120256848A1 (en) * | 2011-04-08 | 2012-10-11 | Research In Motion Limited | Tactile feedback method and apparatus |
| CN102856104A (en) * | 2011-07-01 | 2013-01-02 | 旭丽电子(广州)有限公司 | Thin key and electronic device with same |
| CN103354185A (en) * | 2013-07-16 | 2013-10-16 | 苏州达方电子有限公司 | Button structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105097339A (en) * | 2015-06-23 | 2015-11-25 | 苏州达方电子有限公司 | Key structure and input device |
| CN108268828A (en) * | 2017-01-03 | 2018-07-10 | 奇景光电股份有限公司 | Fingerprint sensing circuit and electronic device |
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| CN104702262B (en) | 2017-12-15 |
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