CN104701186B - Method and device for planting radiating fins - Google Patents

Abstract

The invention relates to a method and device for planting heat sinks, which includes: a machine platform on which a first rail and a second rail frame and a third rail frame are located on both sides of the first rail; the first rail is provided with a third rail frame. A rail frame, the first, second, and second rail frames are provided with flow channels through which the carrier tray carrying the substrate can be transported; a pressing device straddles the sliding path of the first rail, which is adjacent and located on the third rail frame; A rail frame is provided with a pressing mold on the other side relative to the operator; a pick-and-place mechanism is provided on the side of the first rail frame; the heat sink is placed on the positioning mold linked to the first rail frame; The carrier mold is placed on the substrate on the carrier tray, and the carrier tray moving in flow path and the moving out flow path form an intersection at the place where the heat sink is pressed to improve production efficiency.

Description

Heat sink planting method and device

technical field

The invention relates to a planting method and device, in particular to a heat sink planting method and device for planting a heat sink on a substrate for placing chips.

Background technique

In the general semiconductor packaging process, for semiconductors that need to be packaged with heat sinks, the viscous material is usually injected on the lead frame or substrate where the chip has been placed, and then the heat sink is placed on the viscous material, and then the heat sink is placed on the viscous material. The pressing operation fixes the heat sink and the viscous material for a period of time, and then the whole is moved into a baking device for drying.

The traditional heat sink implantation process uses one machine to simultaneously inject viscous material and implant heat sinks on the lead frame or substrate on which the chip has been placed, but due to the limited space of the machine, it is limited to one by one. The transported lead frame or substrate is packaged with heat sink, which obviously cannot improve the production efficiency! Therefore, it is the current heat sink packaging trend to separate the injection of viscous material and the implantation of the heat sink into different machines, and cooperate with the transfer mechanism between them to form a heat sink packaging trend; a lead frame that places most of the chips Or the substrates are arranged in a matrix in a tray, and then the tray is transported to a machine for injecting viscous material, and then the tray is moved to another machine for implanting heat sinks. use.

The applicant once applied for the patent case of "Automatic Placement Machine for IC Heat Sink" with patent application announcement number No. 582689 in Taiwan. In this case, a positioning mold with positioning grooves was used to move the heat sink above the circuit board to position the heat sink from the mold. The cone-shaped positioning grooves are placed into the corresponding circuit boards below. Although the case does not use the carrier plate to arrange most of the lead frames or substrates with chips placed in a matrix, it has provided a lifting device to operate the lifting circuit board to undertake heat dissipation. sheet, and a method for facilitating the positioning of a heat sink on a circuit board.

An application combining the aforementioned announcement number No. 582689 with the technology of arranging a plurality of chip-placed lead frames or substrates in a disk matrix has been used, which mainly forms a front-to-back parallel three jobs on one machine area, on a rail frame in the front work area, move into the tray carrying the lead frames or substrates with most chips arranged in a matrix; In the middle working area, the heat sink is implanted on each lead frame or substrate in the tray through the positioning mold in the middle working area; and then the rail frame with the heat sink implanted together with the positioning mold is moved to the rear In the working area, the heat sink pressing operation is carried out in the rear working area; after the pressing operation is completed, the rail frame and the positioning mold are moved to the middle working area to remove the positioning mold; and then the rail frame is moved to After the front work area is positioned, unload and collect the trays that have completed the placement and pressing of heat sinks.

Contents of the invention

In the prior art, although the positioning mold and the carrier plate are used to place and press the heat sink at the same time, since the front, middle and rear three juxtaposed work areas are formed on the machine, not only the front and rear depths are too long It is convenient for the operator to maintain, and the carrier plate is moved through the front, middle, and rear for placement and application, and then the rear, middle, and front shift is unloaded. The front and back processes are too tedious and time-consuming, making it difficult to improve production efficiency!

Therefore, the object of the present invention is to provide a heat sink implantation method that improves the efficiency of heat sink implantation.

Another object of the present invention is to provide a heat sink implantation device that improves the efficiency of heat sink implantation.

Another object of the present invention is to provide a heat sink planting and placing device that is easy to detect faults when taking and placing the heat sink.

Another object of the present invention is to provide a device for implementing the heat sink implantation method of the present invention.

The heat sink planting method according to the object of the present invention includes the following steps: a carrier plate moving step: transferring the carrier plate carrying the substrate to a second rail frame; a carrier plate moving step into the supporting mold: the carrier plate moves from the second rail frame It is conveyed through a pressing device and enters above a supporting mold in a first rail frame; a supporting mold pushes to the positioning mold step: the supporting mold rises and touches the substrate in the carrier tray, moves up to push against the first rail frame Positioning under the positioning mold; a heat sink planting step; a pick-and-place mechanism to implant the heat sink through the positioning mold onto each substrate of the first rail frame carrier; a heat sink pressing step: the first rail frame passes through the first track Move to a pressing device to press the heat sink on the substrate with a pressing die; move a tray out of the support mold Step: the first rail frame moves the tray out to a third rail frame; at the same time, the aforementioned tray is moved into the tray The mold step is executed repeatedly; a step of moving out the tray: the third rail rack collects the discharged material of the pressed tray; the step of moving the tray into the step and the step of moving the tray into the supporting mold also includes a pre-pressing runner The step of changing is to make the second rail frame carry the carrier tray on a second track to be displaced to correspond to the first rail frame in the second channel of the press-fitting device; in addition, the step of removing the carrier tray from the supporting mold and the step of removing the carrier tray also includes A step of changing the path of the flow path after lamination, so that the lamination tray of the third rail frame is displaced on a third rail to correspond to a storage box of a material receiving mechanism.

Another cooling fin planting method according to the purpose of the present invention includes: a step of changing the flow channel before pressing, making a second rail frame carrying the carrier plate shift on a second track to correspond to the pressing device in a second channel A first rail frame; a cooling fin planting step: make a positioning mold and a first rail frame with a supporting mold linked, so that the cooling fins are planted in the carrier plate on the supporting mold through the positioning mold On the base plate; a heat sink pressing step: move the first rail frame to the pressing device adjacent to and adjacent to it, and press the heat sink on the carrier plate with a compression mold; change the flow channel after pressing The path step is to make a third rail frame carry the pressed tray and move on a third rail to correspond to a receiving box of a receiving mechanism.

According to another object of the present invention, the heat sink planting device includes: a machine platform, on which the first rail and the second rail frame and the third rail frame located on both sides of the first rail are arranged; A rail frame, on which is provided a positioning mold and a supporting mold that can be driven to move up and down; the first, second, and third rail frames are provided with flow channels for carrying the carrier plate of the substrate; a pressing device, It straddles the sliding path of the first rail, it is adjacent to and arranged on the other side of the first rail frame relative to the operator, and it is provided with a die; a pick-and-place mechanism is arranged on the side of the first rail frame; the The second rail frame supports the displacement of the tray on a second track to correspond to the first rail frame; the third rail frame carries the pressed tray and shifts on a third rail to correspond to a storage box of a receiving mechanism.

Another heat sink planting device according to another object of the present invention includes: a machine platform on which a first rail and second rail frames and third rail frames located on both sides of the first rail are arranged; There is a first rail frame, and the first, second, and third rail frames are provided with flow channels for carrying substrates; a pick-and-place mechanism is located on the side of the first rail frame; Placed on the sliding path of the first rail, it is provided with a die, and the space below the die includes: a first channel for the first rail frame to slide through the first track; a second channel for the second rail frame to slide its The carrier tray for planting and placing the heat sink is transferred to the first rail frame; the third channel is used for the first rail frame to transfer the carrier plate after the heat sink is pressed to the third rail frame; the second rail frame carries The tray is displaced on a second rail to correspond to the first rail frame; the third rail frame carries the pressed tray and is displaced on a third rail to correspond to a storage box of a receiving mechanism.

According to another object of the present invention, the heat sink planting device includes: a machine platform, a first rail frame is provided on a first track, and a flow channel for carrying the carrier plate of the substrate is provided on it; The pressing device is provided with a pressing die; a pick-and-place mechanism is arranged on the side of the first rail frame to place the heat sink on the substrate of the tray, including a slide rail and a slide that can be driven and displaced on the slide rail There are many pick-and-place parts on the slide seat, and these pick-and-place parts are jointly arranged on a pick-and-place seat that can be displaced up and down on the slide seat, and each is connected to a negative pressure by a pipeline; A sensing part is provided at the corresponding position, and a sensor is used to project the sensing part so as to send out a maintenance signal through sensing.

The heat sink planting device according to another object of the present invention includes: a device for performing the heat sink planting method.

In the heat sink planting method and device of the embodiment of the present invention, in the step of planting the heat sink, the positioning mold is fixed and linked with the first rail frame provided with the support mold, so that the heat sink is planted on the heat sink through the positioning mold. On the substrate in the tray on the supporting mold; at the same time, in the pressing step, the first rail frame is moved to the pressing device adjacent to and adjacent to it, and the heat sink on the tray is pressed with the die, so The planting and pressing of the heat sink can be completed only by the two working areas of the first rail frame and the pressing device juxtaposed front and back, and the supporting plate is placed on the first, second, and third tracks and the first, second, and third channels. The transmission displacement between them makes the moving-in flow path formed by the substrate carrying the heat sink to be planted from a second rail frame transported to a first rail frame, and the carrier plate formed by the heat sink pressing is automatically The first rail frame moves to the removal flow path formed by the third rail frame, and the two form an intersection at the pressing device for heat sink pressing, so that not only the efficiency of the transmission flow path is high, but also the feeding and pressing , The flow path of the discharge is on the opposite rear side away from the operator, while the planting of the heat sink is relatively close to the front side of the operator, which is convenient for the operator to handle the complex heat sink planting operation that needs to be repaired. and exclude.

Description of drawings

Fig. 1 is a schematic diagram of the machine used in the embodiment of the present invention.

Fig. 2 is a schematic diagram of the configuration of each rail frame on the machine platform in the embodiment of the present invention.

Fig. 3 is a three-dimensional exploded view of the relationship between the carrier plate on the first rail frame, the positioning die and the pressing die in the pressing device in the embodiment of the present invention.

Fig. 4 is a partial schematic diagram of the positioning mold in the embodiment of the present invention.

Fig. 5 is a schematic diagram of the lower pressing block of the pressing die in the pressing device in the embodiment of the present invention.

Fig. 6 is a three-dimensional schematic diagram of the relationship between the pressing die and the first rail frame on which the positioning die is fixed in the embodiment of the present invention.

Fig. 7 is a three-dimensional schematic diagram of the relative relationship between the first rail frame and the pressing device in the embodiment of the present invention.

Fig. 8 is a front schematic view of Fig. 7 in an embodiment of the present invention.

Fig. 9 is a schematic perspective view of the pick-and-place mechanism in the embodiment of the present invention.

Fig. 10 is a partial schematic view of the pick-and-place mechanism in the embodiment of the present invention.

Fig. 11 is a schematic diagram of the process steps of heat sink implantation in the embodiment of the present invention.

Fig. 12 is a schematic diagram of adding a fourth rail frame according to another embodiment of the present invention.

Symbol Description

1 First rail frame 11 First runner

12 Carrier 13 Side rails

131 Fastener 132 Belt

133 Stop mechanism 134 Stop pin

14 Back form 141 Top seat

142 Negative pressure channel 15 Positioning mold

151 Loading section 152 Guide seat

153 Inclined face 154 Lower edge

155 Limiting section 2 second rail frame

21 Second runner 3 Third rail

31 Third runner 4 Pressing device

41 Die 42 Press block

43 Cavity 44 Press drive

45 Pivot 46 Die Holder

47 First channel 48 Second channel

49 The third channel 5 pick-and-place mechanism

51 Rail 52 Carriage

53 Access parts 54 Access base

55 Tube socket 56 Magazine

57 Sensing part 571 Light source

6 carrier plate 61 hollow section

62 Locating pin 63 Base plate

64 Heat sink 71 Carrier moving steps

72 Runner change steps before lamination 721 Glue quality inspection steps

73 The step of moving the tray into the supporting mold 74 The step of pushing the supporting mold to the positioning mold

75 Heat sink placement steps 751 Heat sink positioning inspection steps

76 Steps of pressing heat sink 77 Steps of moving tray out of supporting mold

78 Runner change procedure after lamination 79 Carrier removal procedure

8 The fourth rail frame A machine table

A1 first rail A11 slide rail

A2 Second track A21 Second driver

A22 Second rail seat A3 Third rail

A31 Third drive member A32 Third rail seat

B Feed mechanism B1 Elevator

B2 storage box B3 opening

B4 Pushing device C Receiving mechanism

C1 Lift C2 Storage Box

C3 opening

detailed description

Please refer to Figures 1 and 2. The method and device for planting a heat sink in the embodiment of the present invention can be described in the device embodiment in the figure. It takes the example of planting a heat sink on a substrate carrying a chip, and it can be cited in the same way. For planting heat sinks on the lead frame; including:

A machine A, on which the first track A1 parallel to each other in the Y axis, and the second track A2 and the third track A3 located on both sides of the first track are arranged; wherein the first track A1 is composed of two parallel and separated The sliding rails A11 of the spacing are formed, and the second track A2 and the third track A3 are respectively formed by the second and third rail seats A22 and A32 formed by the screw transmission parts that are affected by the second and third driving parts A21 and A31. Composition; the first track A1 is provided with a first rail frame 1 that can be driven to perform Y-axis sliding displacement on it, and a first flow channel 11 in the X-axis is formed on it; on the second track A2 There is a second rail frame 2 that can be driven to perform Y-axis sliding displacement on it, and a second flow channel 21 in the X-axis is formed on it; the third track A3 is provided with a drive on it. The third rail frame 3 for Y-axis sliding displacement forms a third flow channel 31 in the X-axis; the first track A1 is also provided with a pressing device straddling the sliding path of the first track A1 4. It is located on the other side of the first rail frame 1 adjacent to the operator; a pick-and-place mechanism 5 is provided on the side of the first rail frame 1;

A feeding mechanism (Load) B is located on the side of the machine A close to the second rail A2 and the second rail frame 2, including a first lifting frame B1, and driven by the lifting frame B1, it can move in the Z-axis A plurality of storage boxes B2 for rising or falling, each storage box B2 forms openings B3 on both sides of the X-axis, and is paralleled on both sides of the lifting frame B1 in a double-parallel manner, and can be driven up and down to correspond to the second rail A2. rail frame 2, and a pushing device B4 can be used to push the tray 6 that has not been placed in the storage box B2 into the second rail frame 2 of the host computer A to be transported;

A material receiving mechanism (Unload) C, which is arranged on the side of the machine A, includes a second lifting frame C1, and a plurality of storage boxes C2 that can be raised or lowered in the Y-axis driven by the lifting frame C1, each containing The box C2 forms openings C3 on both sides of the X-axis, and is paralleled on both sides of the lifting frame C1 in a double-parallel manner, and can be driven to correspond to the third rail frame 3 of the third track A3; the storage box C2 is used to accommodate the cooling The carrier tray 6 where the slices are planted.

Please refer to Fig. 3-6, the first rail frame 1 is arranged on a carrier 12, and it forms the first flow channel 11 through which the tray 6 can be conveyed by two side rails 13 spaced apart from each other, and the two side rails 13 And fixed with the fixing piece 131 and the frame is higher than the position of a height above the carrier 12, the opposite inner sides of the two side rails 13 are respectively provided with a driveable belt 132, and the carrier plate 6 is arranged on the two sides The top of the belt 132 between the rails 13 is transported; one end of the first flow channel 11 is also provided with a stop mechanism 133, which rises with a stop pin 134 to stop the carrier plate 6 being transported in the first flow channel 11 and stops at the position. Or descend to make the tray 6 pass (the second rail frame 2 and the third rail frame 3 in Fig. It is located on a carrier, and will not be described in detail below); a supporting mold 14 is arranged between the two side rails 13 of the first rail frame 1, and it can be driven to move up and down. The top seats 141 arranged in a matrix, each top seat 141 is provided with negative pressure channels 142 which are recessed and crossed; There are positioning pins 62, and substrates 63 with embedded chips and viscous material coated thereon are respectively provided at the hollowed out section 61, and the four corners of the substrate 63 are just embedded between these positioning pins 62 to obtain positioning; when the carrier plate 6 Just when it is transported in the first rail frame 1, the support mold 14 will be driven to move up, and when the upper surface of each top seat 141 touches the base plate 63 by the interlocking lifting top, it will pass through the negative pressure groove. The channel 142 is connected with a negative pressure, so that the substrate 63 is sucked on the top surface of the top seat 141, and the top seat 141 is lifted through the hollowed-out area 61; When there are 62 carrier discs 6, they will be left on the carrier disc 6;

A positioning mold 15 is fixedly provided on the two side rails 13 above the supporting mold 14, and the positioning mold 15 is provided with a loading section 151 corresponding to each hollowed-out section 61 of the carrier plate 6, and each loading section 151 inner periphery is respectively Two guide seats 152 with inclined surfaces spaced apart from each other are provided on the sides, so that the loading section 151 forms the first inner diameter of the loading section 151 above the inclined surfaces 153 of each guiding seat 152 and the inclined surfaces of each guiding seat 152. The second inner diameter of the limiting section 155 between the lower edges 154, wherein the first inner diameter is greater than the second inner diameter, and the second inner diameter of the limiting section 155 is defined as the outer diameter of the cooling fin 64 to be planted;

During the planting process of the heat sink 64, the supporting mold 14 is first driven to lift the supporting mold 14 up, and the upper base 141 touches the substrate 63 and moves up to the bottom of the guiding seat 15 against the positioning mold 15. Positioning, and then the cooling fins 64 are guided by the inner peripheral guide seats 152 of each loading section 151 of the positioning mold 15, and planted and positioned in the second position of the limiting section 155 between the lower edges 154 of the inclined surfaces of the guide seats 152. within the range of the inner diameter, and on the pre-coated viscous material on the base plate 63 carried and positioned under the positioning mold 15 to obtain the implant positioning; and after the heat sink 64 is implanted and positioned, it must be pressed by a press. The lower part of the mold 41 is pressed with the protruding pressing blocks 42 set corresponding to each loading section 151 of the positioning mold 15, so that the heat sink 64 can be firmly secured on the viscous material of the substrate 63, and can be sent out for baking and baking. The process of dry sticky material, and the lower surface of the pressing block 42 forms a mold cavity 43 corresponding to the outline of the cooling fin 64, so as to facilitate the positioning during pressing.

Please refer to Fig. 2, 7, 8, the pressing device 4 that is located on the sliding path of the first track A1, which includes a pressing driving member 44 that can be driven by a cylinder to move up and down between the four pivots 45 The mold base 46 of displacement, the surface of the mold base 46 is used to fix the die 41; the space below the mold base 46 between the four pivots 45 provides:

The first channel 47, in the Y axis, allows the first rail frame 1 to slide through the first track A1; the first rail frame 1 can also be left under the mold base 46 to accept the mold base 46 to be press-fitted and driven 44 drives and presses the fins 64 that have been planted in the first rail frame 1 with the stamper 41;

The second channel 48, in the X-axis, can be used by the second rail frame 2 on the second track A2 to transfer the tray 6 that has not yet planted the cooling fins 64 but has completed the viscous material coating on the substrate 63. Give the first rail frame 1 that has completed the pressing of the heat sink 64 but is still placed under the mold base 46;

The third channel 49, in the X-axis, allows the first rail frame 1 to complete the heat sink 64 pressing under the mold base 46, so that the carrier plate 6 can be transported from the X-axis to the third track of the third track A3 on rack 3.

Referring to Fig. 9, 10, this pick-and-place mechanism 5 comprises an X axial slide rail 51 and the slide seat 52 that can be driven displacement on the slide rail 51, is provided with most pick-and-place parts 53 on the slide seat 52, and these pick-and-place Parts 53 are jointly located on a pick-and-place seat 54 that can be displaced up and down on the slide seat 52, and each is connected to a negative pressure with a pipeline 55, and each pick-and-place part 53 can be moved up and down on the pick-and-place seat 54 but Cannot be pivoted, so that when one of the pick-and-place parts 53 gets jammed from the magazine 56, it can avoid damaging the operation of other pick-and-place parts 53, but each pick-and-place part 53 is provided with a ring at the corresponding position A groove-shaped sensing portion 57 is provided for a sensor to project on the sensing portion 57 with a light source 571 sensing such as infrared rays or lasers, so that when one of the pick-and-place parts 53 is not normally lifted, it can sense and send a maintenance signal.

Referring to Fig. 11, the embodiment of the present invention includes the following steps in the method of planting the heat sink 64:

Step 71 of moving a carrier tray: the feeding mechanism B feeds the carrier tray 6 into the second rail frame 2, and at this time, the carrier tray 6 has carried the chip-embedded substrate 63 coated with viscous material;

A step 72 of changing the runner before lamination: the second rail frame 2 carrying the tray 6 is displaced on the second track A2 to correspond to the first rail frame 1 in the second channel 48 of the lamination device 4;

Step 73 of moving a carrier tray into the supporting mold: the carrier tray 6 is transported from the second rail frame 2 through the moving-in flow path formed by the second channel 48 of the pressing device 4 and enters above the carrier mold 14 in the first rail frame 1;

Step 74 of pushing the supporting mold to the positioning mold: driving the supporting mold 14 so that the supporting mold 14 rises and touches the base plate 63 and moves upward to push against the positioning mold 15 on the first rail frame 1 and position below;

A cooling fin planting step 75; the pick-and-place mechanism 5 implants the cooling fin 64 on the substrates 63 of the first rail frame 1 carrier plate 6 through the positioning mold 15;

A cooling fin pressing step 76: the first rail frame 1 is moved to the pressing device 4 through the first rail A1 and the first channel 47 below the pressing device 4, and the heat sink 64 is pressed on the substrate 63 by the die 41 on applied adhesive materials;

Step 77 of removing a tray from the supporting mold: the first rail frame 1 moves the carrier tray 6 to the third rail frame 3 through the removal flow path formed by the third passage 49 below the pressing device 4; at the same time, the tray 6 Since the second rail frame 2 is transported through the second channel 48 of the pressing device 4 into the top of the supporting mold 14 in the first rail frame 1, the step 73 of moving the tray into the supporting mold is executed repeatedly;

Step 78 of changing the flow path after pressing: the third rail frame 3 carries the pressed tray 6 and moves on the third track A3 to correspond to the storage box C2 of the receiving mechanism C;

Step 79 of removing a tray: the third rail frame 3 discharges the pressed tray 6 to the storage box C2 of the receiving mechanism C for collection.

In the embodiment of the present invention, the feeding mechanism B is adopted to have double-parallel storage boxes B2, and the receiving mechanism C is also equipped with double-parallel storage boxes C2, so it is necessary to have the step 72 of changing the flow path before pressing Select any one of the storage boxes B2 parallel to the feeding mechanism B to receive the tray 6, and step 78 of changing the flow path after pressing to select any one of the storage boxes C2 that moves out of the tray to the parallel storage mechanism C; If the feeding mechanism B or the receiving mechanism C only have single-row storage boxes B2 and C2, then the second track A2 and the third track A3 can be cancelled, so that the second rail frame 2 and the third rail frame 3 are fixed Without selective displacement, the step 72 of changing the flow channel before pressing and the step 78 of changing the flow channel after pressing can be cancelled.

In addition, if the adhesive coating quality inspection is not performed in the adhesive material coating process before the heat sink 64 implantation process, the glue coating quality inspection step 721 can be performed in the flow path change step 72 before lamination, for example, by using The inspection done by the CCD lens; and in the heat sink planting step 75, the heat sink positioning inspection step 751 can also be performed by the CCD lens.

In the heat sink planting method and device of the embodiment of the present invention, the positioning mold 15 is fixed and linked with the first rail frame 1 provided with the support mold 14 in the step of planting the heat sink, so that the heat sink 64 passes through the positioning mold. 15 is planted on the substrate 63 in the carrier plate 6 on the supporting mold 14; at the same time, the first rail frame 1 is moved to the pressing device 4 adjacent to and adjacent to the front and back in the heat sink pressing step to press The mold 41 presses the cooling fins 63 on the carrier plate 6, so only the two working areas such as the first rail frame 1 and the pressing device 4 juxtaposed front and back can complete the planting and pressing of the cooling fins 64. The transmission displacement of the carrier plate 6 between the first, second, and third tracks A1, A2, A3 and the first, second, and third channels 47, 48, and 49 makes the carrier plate 6 of the substrate 63 that is to be planted and placed the heat sink 64 Transported from a second rail frame 2 to a first rail frame 1 formed by moving into the flow path, and the carrier plate 6 pressed by the heat sink 64 is moved from the first rail frame 1 to a third rail frame 3. The formed removal flow path, the two form an intersection at the pressing device 4 where the heat sink 64 is pressed, so that not only the efficiency of the transmission flow path is high, but also the flow path of feeding, pressing, and discharging is far away from the operator. The relative rear side of the cooling fins 64 is placed on the front side relatively close to the operator, which is convenient for the operator to handle and eliminate the complex cooling fins 64 planting operations that need to be repaired.

Please refer to FIG. 12 , which is another embodiment of the present invention, which is on the other side of the pressing device 4 of the first rail A1 relative to the first rail frame 1, and a fourth rail frame 8 is also provided, and the structure on it It is the same as that on the device, mechanism and the first rail frame 1, and its side is also matched with a group of pick-and-place mechanisms 5 (the pick-and-place mechanisms 5 matched by the first rail frame 1 and the fourth rail frame 8 are not shown in the figure) , the pick-and-place mechanism 5 of the fourth rail frame 8 configuration is the same as that shown next to the first rail frame 1 in Fig. 2, only in the opposite direction); , the fourth rail frame 8 can be pressed, and on the contrary, when the fourth rail frame 8 is planting the heat sink 64, the first rail frame 1 can be pressed, so that the overall process efficiency can be further improved.

The above is only a preferred embodiment of the present invention, and should not limit the scope of the present invention, that is, all simple equivalent changes and modifications made according to the patent scope of the present invention and the description of the invention are still the same. It belongs to the scope covered by the patent of the present invention.

Claims (12)

1. A heat sink planting method, comprising the following steps: A tray moving step: transferring the tray carrying the substrate to a second rack; The step of moving a tray into the supporting mold: the tray is transported from the second rail frame through a pressing device into the top of a supporting mold in the first rail frame; The step of pushing a supporting mold to the positioning mold: the supporting mold rises and touches the substrate in the carrier plate, moves up to push against the lower part of a positioning mold on the first rail frame; A cooling fin planting step; a pick-and-place mechanism to implant the cooling fins on each base plate of the first rail carrier through the positioning mold; A heat sink pressing step: the first rail frame is moved to a pressing device through the first track to press the heat sink on the substrate with a pressing die; A step of moving the carrier tray out of the supporting mold: the first rail frame moves the carrier tray to a third rail frame; at the same time, the aforementioned step of moving the carrier tray into the supporting mold is repeatedly executed; Step 1: Carrier tray removal step: the third rail rack collects the pressed carrier trays; Between the step of moving the carrier tray and the step of moving the carrier tray into the supporting mold, there is also a step of changing the flow path before pressing, so that the second rail frame carries the carrier tray on a second track and shifts to correspond to the second channel of the pressing device. The first rail frame; in addition, a step of changing the path of the flow path after pressing is included between the step of removing the carrier plate from the supporting mold and the step of removing the carrier plate, so that the carrier plate that has been pressed on the third rail frame is displaced on a third track To correspond to a storage box of a receiving mechanism. 2. The heat sink planting method according to claim 1, characterized in that, before the step of moving the tray into the supporting mold, it also includes a glue quality inspection step, which can be an inspection by using a CCD lens. 3. The heat sink planting method according to claim 1, characterized in that, before the step of pressing the heat sink, it also includes a heat sink positioning inspection step, which can be an inspection by using a CCD lens. 4. A heat sink planting method, comprising: A step of changing the flow path before lamination, causing a second rail frame to displace the carrier tray on a second rail to correspond to a first rail frame in a second channel of the lamination device; A heat sink planting step: make a positioning mold and a first rail frame with a supporting mold linked, so that the heat sink is planted on the substrate in the carrier plate on the supporting mold through the positioning mold; A cooling fin pressing step: move the first rail frame to the pressing device adjacent to and juxtaposed with the front and back, and press the cooling fin on the carrier plate with a compression mold; A step of changing the path of the runner after lamination, so that a third rail frame carries the lamination tray and moves on a third rail to correspond to a storage box of a receiving mechanism. 5. The heat sink planting method according to claim 1 or 4, characterized in that it comprises: A moving-in flow path: formed by carrying the substrate carrying the heat sink to be planted from a second rail frame to a first rail frame; A removal flow path: it is formed by moving the plate after heat sink pressing is moved from the first rail frame to a third rail frame; The moving-in flow path and the moving-out flow path form an intersection at the place where the fins are pressed together. 6. A cooling fin planting device, comprising: A machine platform, on which the first rail and the second and third rail frames located on both sides of the first rail are arranged; the first rail is provided with the first rail frame, on which is provided a positioning mold and a driven Support molds that move up and down; the first, second and third rail frames are provided with runners that can be used to carry the carrier plate of the substrate; A pressing device straddling the sliding path of the first rail, adjacent to it and located on the other side of the first rail frame relative to the operator, and having a pressing die; A pick-and-place mechanism, located on the side of the first rail frame; The second rail frame supports the displacement of the tray on a second track to correspond to the first rail frame; the third rail frame carries the pressed tray and shifts on a third track to correspond to the storage box of a receiving mechanism . 7. A cooling fin planting device, comprising: A machine platform, on which the first rail and the second and third rail frames located on both sides of the first rail are arranged; the first rail frame is provided on the first rail, and the first, second and third rail frames A flow channel that can be transported by the tray carrying the substrate; A pick-and-place mechanism, located on the side of the first rail frame; A pressing device straddles the sliding path of the first rail, and is provided with a die, and the space below the die includes: a first channel for the first rail frame to slide through the first track; a second channel for The second rail frame transfers the carrier plate on which the heat sink is still planted to the first rail frame; the third channel is used for the first rail frame to transfer the carrier plate after the heat sink is pressed to the third rail frame; The second rail frame supports the displacement of the tray on a second track to correspond to the first rail frame; the third rail frame carries the pressed tray and shifts on a third track to correspond to the storage box of a receiving mechanism . 8 . The heat sink implanting device according to claim 7 , wherein the first channel is on the Y axis, and the second channel and the third channel are on the X axis. 9. A cooling fin planting device, comprising: A machine platform, a first rail frame is provided on a first rail, and a flow channel for carrying the carrier plate of the substrate is provided on it; A pressing device is provided with a pressing die; A pick-and-place mechanism, located on the side of the first rail frame, is used to place the heat sink on the substrate of the tray, including a slide rail and a slide seat that can be driven and displaced on the slide rail. Placement parts, these pick-and-place parts are jointly arranged on a pick-and-place seat that can move up and down on the sliding seat, and each is connected to a negative pressure through a pipeline; each pick-and-place part is provided with an induction part at a corresponding position , which provides a sensor to project the sensing part so that it can sense and send a maintenance signal. 10. The heat sink planting device according to claim 9, wherein each pick-and-place member can move up and down on the pick-and-place seat. 11. The heat sink planting device according to any one of claims 6, 7, and 9, wherein the first rail is further provided with a fourth rail on the other side of the pressing device relative to the first rail, Its side is also matched with a group of pick-and-place mechanisms. 12. A cooling fin planting device, comprising a device for performing the cooling fin planting method according to any one of claims 1 to 5.