CN104678703A - Conductive resin composition for forming conductive loop and conductive loop - Google Patents

Abstract

This invention provides a conductive resin composition suitable for a thermally intolerant substrate, ensuring the excellent conductivity and resolution, and therefore having the excellence in any one of the coating strength and sealability with a base substrate, and a conductive loop formed by using the conductive resin composition. This invention provides a conductive resin composition, comprising: a carboxyl-containing resin, a conductive powder, a multifunctional(meth) acrylic acid monomer, a photoinitiator and a blocked isocyanate compound.

Description

Conducting channel formation conductive resin composition and conducting channel

The divisional application that the application is the applying date is on November 15th, 2013, application number is 2013105737185, denomination of invention is the application of " conducting channel formation conductive resin composition and conducting channel ".

Technical field

The conducting channel that the present invention relates to conductive resin composition and use this conductive resin composition and formed.

Background technology

As the known document of the conductive paste disclosed for forming conductive pattern film on base material, there are patent documentation 1 and patent documentation 2.

Patent documentation 1,2 discloses the conductive paste containing conductive powder, organic binder bond, photopolymerization monomer and Photoepolymerizationinitiater initiater.

The organic principle that these conductive pastes are removed in paste by carrying out roasting at the temperature more than 500 DEG C, thus guarantee the electric conductivity of conductive circuit layer.

In addition, in the conductive paste of bake kind as above, usually contain glass dust together with conductive powder, by carrying out the organic principle in roasting removal paste, and making glass dust melting, ensure that the electric conductivity of conductive pattern and the adaptation with base material.

But due to the roasting temperature more than 500 DEG C, thus there is the problem on the base material that is difficult to be applicable to do not tolerate heat in this photosensitive conductive paste.

Prior art document

Patent documentation

Patent documentation 1: Japanese Unexamined Patent Publication 2003-280181 publication

Patent documentation 2: Japanese Patent No. 4411113 publication

Summary of the invention

the problem that invention will solve

The present invention makes to eliminate the problems referred to above, provides the base material being applicable to and not tolerating heat and the conductive resin composition can guaranteeing excellent electric conductivity and the conducting channel using this conductive resin composition and formed.

And then, the conductive resin composition that the invention provides coating strength, all can improve with the adaptation of base substrate and the conducting channel using this conductive resin composition and formed.

for the scheme of dealing with problems

In order to solve the problem, the conducting channel that the invention provides a kind of conductive resin composition and use this conductive resin composition and formed on base material, the feature of described conductive resin composition is, comprises: containing carboxy resin, electroconductive powder, multifunctional (methyl) acrylate monomer, Photoepolymerizationinitiater initiater and blocked isocyanate compounds.

the effect of invention

According to the present invention, the base material being applicable to and heat is not tolerated can be provided and the conducting channel conductive resin composition that the adaptation of excellent electric conductivity and coating strength and base substrate is all excellent can guaranteed and use this conductive resin composition and formed.

Embodiment

First, composition compounding is in the present compositions described.

(composition compounding in conductive resin composition)

(containing carboxy resin)

As containing carboxy resin, the known conventional resin compound containing carboxyl in molecule can be used.

As containing carboxy resin, can be double bond containing containing carboxyl photoresist, but be preferably not double bond containing containing carboxy resin.The not double bond containing carboxy resin that contains, owing to can not react with (methyl) acrylate monomer, therefore can not form intermolecular linkage.Therefore, the molecular weight containing carboxy resin can not become large, thus easily removes when developing.As its result, electroconductive powder becomes fine and close, can reduce the resistivity value of conductive pattern film.

In addition, even if having double bond containing carboxy resin with few ratio, as long as ratio is the scope that can play the effect same with the present invention, this double bond containing carboxy resin that contains is also contained within " not double bond containing containing carboxy resin " of the present invention.As not double bond containing containing carboxy resin, such as, the material that double bond equivalent is more than 10000 can be listed.

For containing carboxy resin, not double bond containing containing in the middle of carboxy resin, what particularly preferably do not contain any one in double bond and aromatic rings contains carboxy resin.By being set to not containing the structure of aromatic rings, the light absorption containing carboxy resin self can be suppressed, relatively improving the photoreactivity of (methyl) acrylate monomer.

To not be listed below containing the object lesson containing carboxy resin of double bond and aromatic rings.

Can list: (1) by make the unsaturated carboxylic acids such as (methyl) acrylic acid and in addition more than one have unsaturated double-bond compound copolymerization and obtain containing carboxy resin;

(2) obtained by the acid anhydrides that makes maleic anhydride etc. have a unsaturated double-bond and the compound copolymerization with unsaturated double-bond in addition containing carboxy resin;

(3) what make to have that the acid anhydrides of unsaturated double-bond and the multipolymer with the compound of unsaturated double-bond in addition react with the compound with hydroxyl and obtain contains carboxy resin;

(4) multipolymer of the compound making to have epoxy radicals and unsaturated double-bond and the compound with unsaturated double-bond, react with saturated carboxylic acid, what make the secondary hydroxyl of generation and multi-anhydride react and obtain contains carboxy resin;

(5) what make hydroxyl polymer-containing and multi-anhydride react and obtain contains carboxy resin, but is not limited to them.

It should be noted that, in this manual, (methyl) acrylic acid refers to the term being referred to as acrylic acid, methacrylic acid and their potpourri, and other similar expression way is also same.

As above have multiple free carboxyl, therefore, it is possible to utilize dilute alkaline aqueous solution to develop containing carboxy resin on the side chain of trunk polymer.

In addition, the above-mentioned acid number containing carboxy resin is preferably the scope of 40 ~ 200mgKOH/g, is more preferably the scope of 45 ~ 120mgKOH/g.During containing the acid number of carboxy resin less than 40mgKOH/g, alkali development becomes difficulty, on the other hand, during more than 200mgKOH/g, the dissolving aggravation in the exposure portion caused by developer solution, therefore line is carefully to necessity, or according to circumstances, be dissolved by the developing stripping, the description of normal conductive pattern becomes difficulty, therefore not preferred exposure portion and unexposed portion indistinction.

In addition, the above-mentioned matter average molecular weight containing carboxy resin is different according to resin matrix, is usually preferably in the scope of 2000 ~ 150000, is preferably in the scope of 5000 ~ 100000 further.When matter average molecular weight is less than 2000, non-adhesion behavior is poor sometimes, and the moisture-proof of the conductive pattern film after exposure is poor, and produce film during development and reduce, resolution is greatly deteriorated sometimes.On the other hand, when matter average molecular weight is more than 150000, developability is significantly deteriorated sometimes, and storage-stable is poor.

This compounding amount containing carboxy resin is preferably 3 ~ 50 quality %, is more preferably 5 ~ 30 quality % in conductive resin composition entirety.When being less than above-mentioned scope, conductive pattern film strength reduces, therefore not preferred.On the other hand, during more than above-mentioned scope, the reductions such as viscosity uprises, coating, thus not preferred.

(electroconductive powder)

First, as long as the material of electroconductive powder gives the material of electric conductivity to conductive resin composition, then any material can use.As this electroconductive powder, Ag, Au, Pt, Pd, Ni, Cu, Al, Sn, Pb, Zn, Fe, Ir, Os, Rh, W, Mo, Ru etc. can be listed, wherein preferred Ag.These electroconductive powders can use with the form of mentioned component simple substance, also can use with the form of alloy, oxide.And then, also can use tin oxide (SnO ₂), indium oxide (In ₂o ₃), ITO (Indium Tin Oxide; Tin indium oxide) etc.In addition, as electroconductive powder, also can be the carbon dusts such as carbon black, graphite, carbon nano-tube.But, because light transmission reduces, therefore should be noted that.

The shape of electroconductive powder is not particularly limited, except flakey, also particularly preferably needle-like, spherical.Thus, light transmission improves, and can form the conductive pattern film of excellent in resolution.

This electroconductive powder is in order to form fine line, and maximum particle diameter is preferably less than 30 μm.By maximum particle diameter is set to less than 30 μm, the resolution of conductive pattern film improves.

In addition, electroconductive powder is in the mean grain size of random 10 electroconductive powders using electron microscope (SEM) to observe under 10000 times, and it ranges preferably from less than 0.1 ~ 10 μm.When mean grain size is less than this scope, the increase of contact resistance causes resistance value to uprise, therefore not preferred.On the other hand, when mean grain size is greater than above-mentioned scope, when using screen cloth version printed conductor pattern, due to the blocking of screen cloth, operability is deteriorated, and the formation of fine line becomes difficulty, therefore not preferred.In addition, for the mean grain size utilizing micro-mark method (micro track) to measure, the electroconductive powder of 0.5 ~ 3.5 μm of size is preferably used.

The compounding amount of this electroconductive powder containing carboxy resin, is preferably 800 ~ 900 mass parts relative to 100 mass parts.When the compounding ratio of electroconductive powder is very few, the resistance value of conductive resin composition uprises, and worries to can not get sufficient electric conductivity.On the other hand, time in a large number containing electroconductive powder, the permeability of light is deteriorated, and utilizes the formation variation of the conductive pattern film of exposure, therefore not preferred.

(multifunctional (methyl) acrylate monomer)

As (methyl) acrylate monomer, use multifunctional (methyl) acrylate monomer (2 officials can (methyl) acrylate monomer) above.The reason of multifunctional (methyl) acrylate monomer is used to be because compared with when being 1 with functional group number, photoreactivity improves, excellent in resolution.

As (methyl) acrylate monomer, include, for example out conventional known polyester (methyl) acrylate, polyethers (methyl) acrylate, carbamate (methyl) acrylate, carbonic ester (methyl) acrylate, epoxy (methyl) acrylate etc.Specifically, can list in following material at least any one etc.: the hydroxyalkyl acrylates classes such as acrylic acid 2-hydroxyl ethyl ester, acrylic acid 2-hydroxypropyl acrylate; The diacrylate class of the glycol such as ethylene glycol, methoxyl TEG, polyglycol, propylene glycol; The acrylic amides such as N,N-DMAA, N hydroxymethyl acrylamide, N, N-dimethylaminopropylacryl acid amides; The acrylate classes such as acrylic acid N, N-dimethylamino ethyl ester, acrylic acid N, N-dimethylamino propyl ester; The multicomponent methacrylate class of the polyvalent alcohols such as hexanediol, trimethylolpropane, pentaerythrite, dipentaerythritol, three-hydroxyethyl isocyanuric acid ester or their ethylene oxide adduct, propylene oxide adduct or 6-caprolactone addition product etc.; The multicomponent methacrylate class of the ethylene oxide adduct of phenoxy group acrylate, bisphenol a diacrylate and these phenols or propylene oxide adduct etc.; The multicomponent methacrylate class of the glycidol ethers such as glycerin diglycidyl ether, T 55, trihydroxymethylpropanyltri diglycidyl ether, triglycidyl group isocyanuric acid ester; Be not limited to aforementioned, also have and carry out the esters of acrylic acid of urethane acrylate and melamine acrylate and each methyl acrylic ester corresponding with foregoing acrylates by direct acroleic acid esterifications of polyvalent alcohol such as polyether glycol, PCDL, C-terminal polybutadiene, polyester polyols or by diisocyanate.

And then epoxy amino formic ether acrylate compounds that half carbamate compounds of the diisocyanate such as hydroxy acrylate and isophorone diisocyanate such as Epocryl, the hydroxyl making this Epocryl further and the pentaerythritol triacrylate that the polyfunctional epoxy resins such as cresol novolak type epoxy resin and acrylic acid also can be used to react reacts etc. is as photoreactivity monomer.This epoxy acrylate system resin can improve photo-curable and can not reduce dry to touch.

Especially preferably (methyl) acrylate monomer of 4 officials' energy.As (methyl) acrylate monomer of 4 functional groups, tetramethylol methane tetraacrylate, pentaerythritol tetramethylacrylate etc. can be listed.

As (methyl) acrylate monomer of 4 functional groups, the urethane acrylate monomer of 4 functional groups that preferred chemical formula (I), (II) are recorded or ester acrylate.

[chemical formula 1]

In formula (I),

X ¹represent the group comprising acryloxy.

X ²represent the group comprising methacryloxy.

X ³and X ⁴represent independently of one another and comprise the group of acryloxy or comprise the group of methacryloxy.Wherein, X ³and X ⁴in at least one represent the group comprising methacryloxy.

L ¹and L ²represent independently of one another

[chemical formula 2]

* the bonding position with Z is represented.

Z represents the linking group of divalence.

In addition, as acrylate monomer, the L in general formula (I) ¹and L ²be preferably following formula (III)

[chemical formula 3]

Shown urethane acrylate.In formula (III), * represents the bonding position with Z.

And then, as the monomer shown in general formula (I), the urethane acrylate shown in preferred following formula (IV).

[chemical formula 4]

In formula (IV),

Z ¹represent alkylidene.

R ¹represent hydrogen atom.

R ²represent methyl.

R ³and R ⁴represent hydrogen atom or methyl independently of one another.Wherein, R ³and R ⁴in at least one represent methyl.

And then as the acrylate monomer of 4 functional groups, particularly preferably acryloyl group and methacryl are urethane acrylate or the ester acrylate of 1 to 1.

As urethane acrylate or the ester acrylate of this 4 functional groups, such as preferred to glycidyl methacrylate addition acrylic acid, make the material that the hydroxyl that now produces and diisocyanate or dicarboxylic acids react and obtain.

As the commercially available product of the urethane acrylate of 4 functional groups, such as cocoa enumerates NK OLIGO U-4HA (trade name, chemical industry Co., Ltd. of Xin Zhong village manufactures) etc.

In the middle of these multifunctional (methyl) acrylate monomers, the acrylate monomer of 4 functional groups shown in preferred formula (I).This 4 functional acrylate monomers due to functional group number many, therefore photoreactivity is excellent, excellent in resolution.

In addition, the X of the acrylate monomer of this 4 functional group ¹and X ²different from each other, therefore, when photocuring, intramolecular X ¹with X ²reaction slow.But, the X of acrylate monomer ¹or X ²with the X of other acrylate monomer ¹or X ²intermolecular reaction faster than inner molecular reaction.Thus, between multiple acrylate monomer, form intermolecular linkage, therefore the further cure shrinkage of conductive resin composition.In addition, by means of only thermal treatment at low temperatures, just can promote intermolecular reaction further, conductive resin composition is cure shrinkage fully.Its result, can think, electroconductive powder becomes fine and close, and the resistivity value of conductive pattern film reduces further.

It is applicable for being not particularly limited the compounding amount of this multifunctional (methyl) acrylate monomer, relative to aforementioned 100 mass parts containing carboxy resin, being 10 ~ 100 mass parts, being more preferably the ratio of 20 ~ 80 mass parts.During aforementioned compounding quantity not sufficient 10 mass parts, photo-curable reduces, and is difficult to the line being formed conductive pattern by the postradiation alkali development of active energy beam, therefore not preferred.On the other hand, during more than 100 mass parts, reduce the dissolubility of aqueous alkali, conductive pattern becomes fragile, therefore not preferred.

(Photoepolymerizationinitiater initiater)

As Photoepolymerizationinitiater initiater, be not particularly limited, can be benzoin system, phosphine oxide system, preferably use the oxime ester system with the shown group of following general formula (V) or the acetophenone system Photoepolymerizationinitiater initiater with group shown in following general formula (VI).

[chemical formula 5]

In formula (V), R6 represents alkyl or the phenyl of hydrogen atom, carbon number 1 ~ 6, and R7 represents the alkyl of hydrogen atom, carbon number 1 ~ 6.

In formula (VI), R8, R9 represent alkyl or the aralkyl of carbon number 1 ~ 12 independently of one another, and R10, R11 represent the alkyl of hydrogen atom or carbon number 1 ~ 6 independently of one another, or R10, R11 also can form cyclic alkyl ether by bonding.

In the middle of aforementioned oxime ester system Photoepolymerizationinitiater initiater, the TOE-004 etc. that N-1919, NCI-831 that CGI-325, IRGACURE OXE01, IRGACURE OXE02 that preferred BASF Japan Ltd. manufactures, ADEKA Corp. manufacture, Nippon Chemical Ind manufacture.In addition, as Photoepolymerizationinitiater initiater, also can be IRGACURE389.It should be noted that, these Photoepolymerizationinitiater initiaters can be used alone or are used in combination of two or more.

As the acetophenone system Photoepolymerizationinitiater initiater with group shown in aforementioned formula (VI), 2-methyl isophthalic acid-[4-(methyl mercapto) phenyl]-2-morpholinopropanone-1,2-benzyl-2-dimethylamino-1-(4-morphlinophenyl)-butane-1-ketone, 2-(dimethylamino)-2-[(4-aminomethyl phenyl) methyl]-1-[4-(4-morpholinyl) phenyl] 1-butanone, N, N-dimethylamino benzoylformaldoxime etc. can be listed.As commercially available product, IRGACURE907, IRGACURE369, IRGACURE379 etc. that BASF Japan Ltd. manufactures can be listed.

The compounding amount of this Photoepolymerizationinitiater initiater is not particularly limited, aforementioned relative to 100 mass parts containing carboxy resin, be 0.01 ~ 30 mass parts, to be more preferably the scope of 0.5 ~ 15 mass parts be applicable.During compounding quantity not sufficient 0.01 mass parts of Photoepolymerizationinitiater initiater, photo-curable is not enough, and conductive pattern film is peeled off, or the characteristic of the conductive pattern film such as chemical proofing reduces, therefore not preferred.On the other hand, during more than 30 mass parts, the light absorption of Photoepolymerizationinitiater initiater on conductive pattern film surface becomes violent, there is the tendency that deep curability reduces, therefore not preferred.

(blocked isocyanate compounds)

In order to improve the obdurability of the cured film obtained by conductive resin composition and the adaptation with base substrate, compound, the i.e. blocked isocyanate compounds etc. in 1 molecule with blocked isocyanate base can be listed.

Blocked isocyanate base contained in blocked isocyanate compounds is protected by the reaction of isocyanate group and end-capping reagent and the group of temporary transient passivation.When being heated to set point of temperature, this end-capping reagent dissociates, and generates isocyanate group.

As blocked isocyanate compounds, the addition reaction product of isocyanate compound and isocyanate-terminated dose can be used.As the isocyanate compound that can react with end-capping reagent, isocyanuric acid ester type, biuret form can be listed, add mould assembly etc.As this isocyanate compound, such as, can use aromatic polyisocyanate similar to the above, aliphatic polyisocyante or ester ring type polyisocyanates.

As isocyanate-terminated dose, include, for example out the phenol system end-capping reagents such as phenol, cresols, xylenol, chlorophenol and ethyl-phenol; The lactams system end-capping reagents such as epsilon-caprolactams, δ-valerolactam, butyrolactam and azetidinone; Ethyl acetoacetate and diacetone isoreactivity methylene base system end-capping reagent; The alcohol system end-capping reagents such as methyl alcohol, ethanol, propyl alcohol, butanols, amylalcohol, glycol monoethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, propylene glycol monomethyl ether, benzylic ether, methyl glycollate, butyl glycolate, diacetone alcohol, methyl lactate and ethyl lactate; The oxime system end-capping reagents such as formaldoxime, acetaldoxime, acetoxime, methyl ethyl ketoxime, Diacetylmonoxime, cyclohexane oxime; The mercaptan system end-capping reagents such as butyl mercaptan, hexyl mercaptan, tert-butyl mercaptan, benzenethiol, methylbenzene phenyl-sulfhydrate, ethyl thiophenol; The sour acid amides system such as acetamide, benzamide end-capping reagent; The imide series such as succinimide and maleimide end-capping reagent; The amine system end-capping reagents such as xylidin, aniline, butylamine, dibutylamine; The imidazoles system end-capping reagents such as imidazoles, 2-ethyl imidazol(e); The imines system end-capping reagents etc. such as methylene imine and propylidene imines.

Blocked isocyanate compounds can be also commercially available product, include, for example out 7950, 7951, 7960, 7961, 7982, 7990, 7991, 7992 (more than, Baxenden company manufactures, trade name), Sumidur BL-3175, BL-4165, BL-1100, BL-1265, Desmodur TPLS-2957, TPLS-2062, TPLS-2078, TPLS-2117, Desmosome2170, Desmosome2265 (more than, Sumitomo Bayer Urethane Co., Ltd manufacture, trade name), CORONATE2512, CORONATE2513, CORONATE2520 (more than, Nippon Polyurethane Industry Co., Ltd. manufactures, trade name), B-830, B-815, B-846, B-870, B-874, B-882 (MITSUI TAKEDA CHEMICALS, INC manufacture, trade name), TPA-B80E, 17B-60PX, E402-B80T, MF-B60B, MF-K60B, SBN-70D (Asahi Kasei Chemicals Corporation manufactures, trade name), Karenz MOI-BM (Showa Denko K. K manufactures, trade name) etc.Wherein, Sumidule BL-3175, BL-4265 is the material using Methylethyl oxime to obtain as end-capping reagent.

The above-mentioned compound with multiple blocked isocyanate base can be used alone one or is used in combination of two or more.

This compounding amount with the compound of blocked isocyanate base containing carboxy resin, is 1 ~ 100 mass parts relative to 100 mass parts, be more preferably the ratio of 2 ~ 70 mass parts is applicable.During aforementioned compounding quantity not sufficient 1 mass parts, can not get the obdurability of sufficient film, thus not preferred.On the other hand, during more than 100 mass parts, storage stability reduces, therefore not preferred.

The dissociation temperature of the end-capping reagent of blocked isocyanate is not particularly limited, but it is desirable to, this end-capping reagent is not reacted at predrying temperature (such as 80 ~ 90 DEG C), and react when last thermal treatment, therefore, be preferably the temperature higher than predrying temperature, such as more than 100 DEG C.In addition, as base material, such as, when using polyester based resin, when heat treatment temperature is too high, the easy variable color of base material, therefore, is preferably set to the temperature that can prevent base material variable color by the dissociation temperature of the end-capping reagent of blocked isocyanate, such as less than 140 DEG C, can heat-treat at the non-discoloring temperature of base material.

Conductive resin composition of the present invention is in order to improve effect of the present invention further, or in order to play other effect in the scope not hindering effect of the present invention further, following other composition illustrative can be comprised with above-mentioned containing carboxy resin, electroconductive powder, multifunctional (methyl) acrylate monomer, Photoepolymerizationinitiater initiater together with blocked isocyanate compounds.

(organic acid)

As organic acid, preferably not there is the organic acid of aromatic rings.By the compounding organic acid without aromatic rings, the light absorption of organic acid self is suppressed, and relatively the photoreactivity of (methyl) acrylate monomer of 4 functional groups improves, and can obtain excellent resolution.

As organic acid object lesson, can 2 be listed, the carboxylic acidss such as 2 '-thiobis acetic acid, hexane diacid, isobutyric acid, formic acid, citric acid, glutaric acid, acetic acid, oxalic acid, tartrate, lactic acid, pyruvic acid, malonic acid, butyric acid, malic acid, salicylic acid, benzoic acid, phenylacetic acid, acrylic acid, maleic acid, fumaric acid, crotonic acid; The monoesters of the phosphorous acid such as dibutyl phosphite, phosphorous acid butyl ester, dimethylphosphite, methyl phosphite, phosphorous acid dipropyl, phosphorous acid propyl ester, diphenyl phosphite, phenyl-phosphite, diisopropyl phosphite, phosphorous acid isopropyl ester, phosphorous acid-2-Octyl Nitrite or diester class; The monoesters of the phosphoric acid such as dibutylphosphoric acid ester, butylphosphoric acid ester, dimethyl phosphate, methyl orthophosphoric acid, di(2-ethylhexyl)phosphate propyl ester, phosphoric acid propyl ester, diphenyl phosphate, phenyl phosphate, diisopropyl phosphate, p isopropylbenzoic acid ester, phosphoric acid-normal-butyl-2-Octyl Nitrite or diester class etc.As organic acid, preferably 2,2 '-thiobis acetic acid.

As the compounding amount of above-mentioned organic acid, relative to the said conductive powder of 100 mass parts, be preferably the scope of 0.1 ~ 5 mass parts.The compounding amount of aforementioned organic acid relative to the said conductive powder of 100 mass parts less than 0.1 mass parts time, said conductive powder reacts with containing carboxy resin, long-term storing stability is reduced, on the other hand, when aforementioned cooperation amount is more than 5 mass parts, moisture etc. in easy absorption air, thus not preferred.

(spreading agent)

By compounding spreading agent, the dispersiveness of conductive resin composition, settleability can be improved.

As spreading agent, include, for example out ANTI-TERRA-U, ANTI-TERRA-U100, ANTI-TERRA-204, ANTI-TERRA-205, DISPERBYK-101, DISPERBYK-102, DISPERBYK-103, DISPERBYK-106, DISPERBYK-108, DISPERBYK-109, DISPERBYK-110, DISPERBYK-111, DISPERBYK-112, DISPERBYK-116, DISPERBYK-130, DISPERBYK-140, DISPERBYK-142, DISPERBYK-145, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-166, DISPERBYK-167, DISPERBYK-168, DISPERBYK-170, DISPERBYK-171, DISPERBYK-174, DISPERBYK-180, DISPERBYK-182, DISPERBYK-183, DISPERBYK-185, DISPERBYK-184, DISPERBYK-191, DISPERBYK-192, DISPERBYK-2000, DISPERBYK-2001, DISPERBYK-2009, DISPERBYK-2020, DISPERBYK-2025, DISPERBYK-2050, DISPERBYK-2070, DISPERBYK-2095, DISPERBYK-2096, DISPERBYK-2150, BYK-P104, BYK-P104S, BYK-P105, BYK-9076, BYK-9077, BYK-220S (BYK Japan KK manufactures), DISPARLON2150, DISPARLON1210, DISPARLON KS-860, DISPARLON KS-873N, DISPARLON7004, DISPARLON1830, DISPARLON1860, DISPARLON1850, DISPARLON DA-400N, DISPARLON PW-36, DISPARLON DA-703-50 (nanmu originally changes into Co., Ltd. and manufactures), FLOWLEN G-450, FLOWLEN G-600, FLOWLEN G-820, FLOWLEN G-700, FLOWLEN DOPA-44, FLOWLEN DOPA-17 (Kyoeisha Chemical Co., Ltd.'s manufacture).

The content of spreading agent in order to effectively reach above-mentioned purpose, relative to 100 mass parts electroconductive powders, be 0.1 ~ 10 mass parts, be preferably 0.5 ~ 5 mass parts be preferred.

(photopolymerization inhibitor)

By adding photopolymerization inhibitor, by exposing in the conductive resin composition free radical polymerization that occurs of inside that causes, a certain amount of free radical polymerization of kind according to polymerization inhibitor and addition thereof can be suppressed.Thereby, it is possible to suppress the light reaction caused by light weak as scattered light.Therefore, it is possible to acutance forms well the line of fine conductive pattern film, so can preferably use.As long as the material that photopolymerization inhibitor can be used as photopolymerization inhibitor is just not particularly limited, include, for example out 1,4-benzoquinone, naphthoquinones, BHT, hydroquinone monomethyl ether, alpha-Naphthol, acetic acid ethanamidine, hydrazine hydrochloride, trimethyl benzyl ammonia chloride, dinitro benzene, picric acid, quininie dioxime, 1,2,3,-thrihydroxy-benzene, tannic acid, resorcinol, cupferron (cupferron), phenothiazine etc.

The addition of photopolymerization inhibitor is aforementioned relative to 100 mass parts containing carboxy resin, is preferably 0.001 ~ 3 mass parts, is more preferably in the scope of 0.01 ~ 2 mass parts.When being less than this scope, can not play the effect of inhibition, even if be cured under the low exposure obtained by light scattering, wire shaped easily occurs thicker.In addition, during more than this scope, sensitivity decrease, needs more exposure, therefore should be noted that.

(filler)

In conductive resin composition of the present invention, in order to improve the physical strength etc. of its film, can compounding filler as required.As this filler, known conventional inorganic or organic filler can be used, particularly preferably use barium sulphate, silicon dioxide, hydrotalcite and talcum.

(Thermocurable composition)

In conductive resin composition of the present invention, in order to give thermotolerance, Thermocurable composition can be added.As the Thermocurable composition used in the present invention, the known conventional heat-curing resin such as the polyimide resin such as melamine resin, benzoguanamine resin, blocked isocyanate compounds, cyclic carbonate compound, multi-functional epoxy compound, multifunctional oxetane compound, episulfide resin, melamine derivative can be used.Particularly preferably there is in molecule the Thermocurable composition of at least any one (hereinafter referred to as ring-type (sulphur) ether) in two or more cyclic ether group and cyclic thioether base.

The Thermocurable composition in this molecule with two or more ring-type (sulphur) ether is the compound of any one or the two kinds of groups had in molecule in two or more three-membered ring, four-membered ring or pentacyclic cyclic ether group or cyclic thioether base, include, for example out in molecule the compound and episulfide resin etc. in the compound in the compound with at least two or more epoxy radicals and multi-functional epoxy compound, molecule with at least two or more oxetanyl and multifunctional oxetane compound, molecule with at least two or more thioether group.

As aforementioned multi-functional epoxy compound, include, for example out the JER828 that Mitsubishi chemical Co., Ltd manufactures, JER834, JER1001, JER1004, the EPICLON840 that Dainippon Ink Chemicals manufactures, EPICLON850, EPICLON1050, EPICLON2055, the EPOTOHTO YD-011 that Toto Kasei KK manufactures, YD-013, YD-127, YD-128, the D.E.R.317 that Dow Chemical manufactures, D.E.R.331, D.E.R.661, D.E.R.664, the Sumi-epoxy ESA-011 that Sumitomo Chemical Company Ltd manufactures, ESA-014, ELA-115, ELA-128, the A.E.R.330 that Asahi Chemical Industry Co., Ltd manufactures, A.E.R.331, A.E.R.661, A.E.R.664 etc. (being trade name) bisphenol A type epoxy resin, A.E.R.711, A.E.R.714 etc. (the being trade name) brominated epoxy resin that Sumi-epoxy ESB-400, ESB-700 that the D.E.R.542 that EPOTOHTO YDB-400, YDB-500 that EPICLON152, EPICLON165 that the JERYL903 that Mitsubishi chemical Co., Ltd manufactures, Dainippon Ink Chemicals manufacture, Toto Kasei KK manufacture, Dow Chemical manufacture, Sumitomo Chemical Company Ltd manufacture, Asahi Chemical Industry Co., Ltd manufacture, the JER152 that Mitsubishi chemical Co., Ltd manufactures, JER154, the D.E.N.431 that Dow Chemical manufactures, D.E.N.438, the EPICLON N-730 that Dainippon Ink Chemicals manufactures, EPICLON N-770, EPICLON N-865, the EPOTOHTO YDCN-701 that Toto Kasei KK manufactures, YDCN-704, the EPPN-201 that Nippon Kayaku K. K manufactures, EOCN-1025, EOCN-1020, EOCN-104S, RE-306, the Sumi-epoxy ESCN-195X that Sumitomo Chemical Company Ltd manufactures, ESCN-220, the A.E.R.ECN-235 that Asahi Chemical Industry Co., Ltd manufactures, ECN-299 etc. (being trade name) phenolic resin varnish type epoxy resin, (the being trade name) bisphenol f type epoxy resins such as EPOTOHTO YDF-170, YDF-175, YDF-2004 that the JER807 that the EPICLON830 that Dainippon Ink Chemicals manufactures, Mitsubishi chemical Co., Ltd manufacture, Toto Kasei KK manufacture, the bisphenol-A epoxy resins such as EPOTOHTO ST-2004, ST-2007, ST-3000 (trade name) that Toto Kasei KK manufactures, (the being trade name) glycidyl amine type epoxy resins such as the Sumi-epoxy ELM-120 that the EPOTOHTO YH-434 that the JER604 that Mitsubishi chemical Co., Ltd manufactures, Toto Kasei KK manufacture, Sumitomo Chemical Company Ltd manufacture, hydantoins type epoxy resin, (trade name) alicyclic epoxy resins such as the CELLOXIDE2021 that Daisel chemical industry Co., Ltd manufactures, T.E.N., EPPN-501, EPPN-502 etc. (being trade name) the trihydroxy benzene methylmethane type epoxy resin that the YL-933 that Mitsubishi chemical Co., Ltd manufactures, Dow Chemical manufacture, the di-cresols type such as YL-6056, YX-4000, YL-6121 (being trade name) that Mitsubishi chemical Co., Ltd manufactures or united phenol-type epoxy resin or their potpourri, the bisphenol-s epoxy resins such as the EXA-1514 (trade name) that the EPX-30 that the EBPS-200 that Nippon Kayaku K. K manufactures, Asahi Denka Kogyo K. K manufacture, Dainippon Ink Chemicals manufacture, the bisphenol A novolac type epoxy resin such as the JER157S (trade name) that Mitsubishi chemical Co., Ltd manufactures, the JERYL-931 that Mitsubishi chemical Co., Ltd manufactures etc. (trade name) four hydroxy phenyl ethane type epoxy resin, (trade name) hetero ring type epoxy resin such as the TEPIC that Nissan Chemical Ind Ltd manufactures, the o-phthalic acid diglycidyl ester resins such as the BLEMMER DGT that NOF Corp manufactures, the four glycidyl group diformazan phenolic group ethane resin such as the ZX-1063 that Toto Kasei KK manufactures, HP-4032, EXA-4750, EXA-4700 etc. that ESN-190, ESN-360 that Nippon Steel Chemical Co., Ltd manufactures, Dainippon Ink Chemicals manufacture are containing Naphthol-based Epoxy Resin, HP-7200, HP-7200H etc. that Dainippon Ink Chemicals manufactures have the epoxy resin of dicyclopentadiene skeleton, the glycidyl methacrylate copolymerization system epoxy resin such as CP-50S, CP-50M that NOF Corp manufactures, and the copolymerization epoxy resin of N-cyclohexylmaleimide and glycidyl methacrylate, epoxide modified polybutadiene rubber derivant (PB-3600 etc. that such as Daisel chemical industry Co., Ltd manufactures), CTBN modified epoxy (YR-102, YR-450 etc. that such as Toto Kasei KK manufactures) etc., but be not limited to these.These epoxy resin can two or more use alone or in combination.Wherein, particularly preferably phenolic resin varnish type epoxy resin, hetero ring type epoxy resin, bisphenol A type epoxy resin or their potpourri.

As aforementioned multifunctional oxetane compound, two [(3-methyl-3-oxetanylmethoxy) methyl] ether can be listed, two [(3-ethyl-3-oxetanylmethoxy) methyl] ether, 1, two [(3-methyl-3-oxetanylmethoxy) methyl] benzene of 4-, 1, two [(3-ethyl-3-oxetanylmethoxy) methyl] benzene of 4-, acrylic acid (3-methyl-3-oxetanyl) methyl esters, acrylic acid (3-ethyl-3-oxetanyl) methyl esters, methacrylic acid (3-methyl-3-oxetanyl) methyl esters, methacrylic acid (3-ethyl-3-oxetanyl) methyl esters, the multifunctional oxetanes classes such as their oligomer or multipolymer, and oxa-cyclobutanol and novolac resin, poly-(4-Vinyl phenol), Cardo type bisphenols, calixarene kind, resorcinol calixarene kind, or silsesquioxane etc. has the etherate etc. of the resin of hydroxyl.In addition, the multipolymer etc. of unsaturated monomer and (methyl) alkyl acrylate with oxetanes ring can also be listed.

As the compound in previous molecular with two or more cyclic thioether base, include, for example out the bisphenol A-type episulfide resin YL7000 etc. that Mitsubishi chemical Co., Ltd manufactures.In addition, the episulfide resin etc. adopting same synthetic method the oxygen atom of the epoxy radicals of phenolic resin varnish type epoxy resin to be replaced to sulphur atom can also be used.

(thermal curing catalyst)

In conductive resin composition of the present invention, when using in above-mentioned molecule the Thermocurable composition with two or more ring-type (sulphur) ether, preferably containing thermal curing catalyst.As this thermal curing catalyst, include, for example out the imdazole derivatives such as imidazoles, glyoxal ethyline, 2-ethyl imidazol(e), 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyano ethyl-2-phenylimidazole, 1-(2-cyano ethyl)-2-ethyl-4-methylimidazole; Dicyandiamide; Benzyl dimethyl amine, 4-(dimethylamino)-N, N-dimethyl benzyl amine, 4-methoxyl-N, N-dimethyl benzyl amine, 4-methyl-N, the amines such as N-dimethyl benzyl amine; The hydrazine compound such as adipic dihydrazide, sebacic dihydrazide; The phosphorus compounds etc. such as triphenylphosphine.In addition, as commercially available product, include, for example out 2MZ-A, 2MZ-OK, 2PHZ, 2P4BHZ, 2P4MHZ (being the trade name of imidazole compound) that Shikoku Chem manufactures, U-CAT (registered trademark) 3503N, U-CAT3502T (being the trade name of the blocked isocyanate compounds of dimethyl amine) that SAN-APRO Ltd. manufactures, DBU, DBN, U-CATSA102, U-CAT5002 (being two ring type amidine compound and salt thereof) etc.Be not particularly limited to these compounds, as long as the thermal curing catalyst of epoxy resin, the thermal curing catalyst of oxetane compound or promote the material of at least any one and carboxyl reaction in epoxy radicals and oxetanyl, can be used alone or mix two or more use.

In addition, also guanamines, methyl guanamines, benzoguanamine, melamine, 2 can be used, 4-diamido-6-methacryloxyethyl-s-triazine, 2-vinyl-2,4-diamido-s-triazine, 2-vinyl-4,6-diamido-s-triazine isocyanuric acid adduct, 2, these compounds also worked as adaptation imparting agent and aforementioned hot curing catalysts are preferably combinationally used by the Striazine derivatives such as 4-diamido-6-methacryloxyethyl-s-triazine isocyanuric acid adduct.

The compounding amount of these thermal curing catalysts is that the ratio of common amount is namely enough, such as, relative to 100 mass parts containing the Thermocurable composition in carboxy resin or molecule with two or more ring-type (sulphur) ether, be preferably 0.1 ~ 20 mass parts, be more preferably 0.5 ~ 15 mass parts.

(thermal polymerization inhibitor)

Thermal polymerization inhibitor may be used for preventing conductive resin composition of the present invention thermal polymerization or through time polymerization.As thermal polymerization inhibitor, include, for example out 4-metoxyphenol, quinhydrones, alkyl or aryl replaces quinhydrones, tert-butyl catechol, 1,2,3,-thrihydroxy-benzene, 2-dihydroxy benaophenonel, 4-methoxyl-2-dihydroxy benaophenonel, stannous chloride, phenothiazine, chloranil, naphthylamines, betanaphthol, 2, 6-di-t-butyl-4-cresols, 2, 2 '-di-2-ethylhexylphosphine oxide (4-methyl-6-tert-butylphenol), pyridine, nitrobenzene, dinitro benzene, picric acid, 4-toluidine, methylene blue, the reaction product of copper and organic sequestering agent, gaultherolin, and phenothiazine, nitroso compound, the chelate etc. of nitroso compound and Al.

(chain-transferring agent)

In conductive resin composition of the present invention, in order to improve sensitivity, as chain-transferring agent, known N-phenylglycine class, phenoxy acetic acids, sulfo-phenoxy acetic acids, thyroidan etc. can be used.If enumerate the object lesson of chain-transferring agent, then mercapto succinic acid, mercaptoacetic acid, mercaptopropionic acid, methionine, halfcystine, thiosalicylic acid and derivant thereof etc. is such as had to have the chain-transferring agent of carboxyl; Mercaptoethanol, mercaprol, Mercaptobutanol, mercapto-propanediol, sulfydryl butylene glycol, hydroxythiophenol and derivant thereof etc. have the chain-transferring agent of hydroxyl; 1-butyl mercaptan, butyl-3-mercaptopropionic acid ester, methyl-3-mercaptopropionic acid ester, 2,2-(ethylidene dioxy base) diethyl mercaptan, ethyl mercaptan, 4-methylbenzene phenyl-sulfhydrate, lauryl mercaptan, propanethiol, butyl mercaptan, amyl hydrosulfide, 1-spicy thioalcohol, cyclopentanethiol, cyclohexane mercaptan, thioglycerol, 4,4-thiobis-benzenethiol etc.

In addition, multi-functional mercaptan based compound can be used, be not particularly limited, such as hexane-1 can be used, 6-bis-mercaptan, decane-1, the aromatic mercaptans classes such as analiphatic sulphur alcohols, xylylene two mercaptan, 4,4 '-dimercapto diphenylsulfide, Isosorbide-5-Nitrae-dimercaptobenzene such as 10-bis-mercaptan, dimercapto diethyl ether, dimercapto diethyl base thioether; Poly-(mercaptoacetate) class of the polyvalent alcohol such as ethylene glycol bis (mercaptoacetate), polyglycol two (mercaptoacetate), propylene glycol two (mercaptoacetate), glycerine three (mercaptoacetate), trimethylolethane trimethacrylate (mercaptoacetate), trimethylolpropane tris (mercaptoacetate), pentaerythrite four (mercaptoacetate), dipentaerythritol six (mercaptoacetate); Poly-(3-mercaptopropionic acid ester) class of the polyvalent alcohol such as ethylene glycol bis (3-mercaptopropionic acid ester), polyglycol two (3-mercaptopropionic acid ester), propylene glycol two (3-mercaptopropionic acid ester), glycerine three (3-mercaptopropionic acid ester), trimethylolethane trimethacrylate (mercaptopropionic acid ester), trimethylolpropane tris (3-mercaptopropionic acid ester), pentaerythrite four (3-mercaptopropionic acid ester), dipentaerythritol six (3-mercaptopropionic acid ester); Isosorbide-5-Nitrae-bis-(3-sulfydryl butyryl acyloxy) butane, 1,3,5-tri-(3-sulfydryl butoxyethyl group)-1,3,5-triazine-2,4, many (mercaptobutylate) classes such as 6 (1H, 3H, 5H)-triketones, pentaerythrite four (3-mercaptobutylate).

As their commercially available product, include, for example out BMPA, MPM, EHMP, NOMP, MBMP, STMP, TMMP, PEMP, DPMP and TEMPIC (more than, Sakai Chemical Industry Co., Ltd. manufactures), Karenz MT-PE1, Karenz MT-BD1 and Karenz-NR1 (more than, Showa Denko K. K manufactures) etc.

And then, for the heterogeneous ring compound with sulfydryl worked as chain-transferring agent, include, for example out sulfydryl-4-butyrolactone (another name: 2-sulfydryl-4-butyrolactone), 2-sulfydryl-4-methyl-4-butyrolactone, 2-sulfydryl-4-ethyl-4-butyrolactone, 2-sulfydryl-4-thiobutryolacatone, 2-sulfydryl-4-butyrolactam, N-methoxyl-2-sulfydryl-4-butyrolactam, N-ethoxy-2-sulfydryl-4-butyrolactam, N-methyl-2-sulfydryl-4-butyrolactam, N-ethyl-2-sulfydryl-4-butyrolactam, N-(2-methoxyl) ethyl-2-sulfydryl-4-butyrolactam, N-(2-ethoxy) ethyl-2-sulfydryl-4-butyrolactam, 2-sulfydryl-5-valerolactone, 2-sulfydryl-5-valerolactam, N-methyl-2-sulfydryl-5-valerolactam, N-ethyl-2-sulfydryl-5-valerolactam, N-(2-methoxyl) ethyl-2-sulfydryl-5-valerolactam, N-(2-ethoxy) ethyl-2-sulfydryl-5-valerolactam, 2-mercaptobenzothiazole, 2-sulfydryl-5-methyl thio-thiadiazoles, 2-sulfydryl-6-caprolactam, (three associations change into Co., Ltd. and manufacture 2,4,6-tri-thiol-s-triazine: trade name Zisnet F), (three associations change into Co., Ltd. and manufacture 2-dibutylamino-4,6-dimercaptos-s-triazine: trade name Zisnet DB), (three associations change into Co., Ltd. and manufacture: trade name Zisnet AF) etc. with 2-anilino--4,6-dimercaptos-s-triazine.

Especially, about as the heterogeneous ring compound with sulfydryl of chain-transferring agent of developability that can not damage conductive resin composition, preferred 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 2-mercaptobenzothiazole (trade name: chemical industry Co., Ltd. of Kawaguchi manufactures Accel M), 3-sulfydryl-4-methyl-4H-1,2,4-triazole, 5-methyl isophthalic acid, 3,4-thiadiazoles-2-mercaptan, 1-phenyl-5-sulfydryl-1H-TETRAZOLE.These chain-transferring agents can be used alone or combinationally use two or more.

(other adding ingredient)

In conductive resin composition of the present invention, certainly can suitable compounding known conventional composition as required, such as thickening agent, froth breaking/levelling agent, coupling agent, antioxidant, rust preventive etc.

(formation of conducting channel)

Then, the example using conductive resin composition of the present invention to form the method for conducting channel is described.

About conductive resin composition of the present invention, above-mentioned each must composition with and mixing dispersion of any composition use the equipment such as triple-roller mill, mixer.

The conductive resin composition so disperseing to obtain is applied on base material by suitable coating processes such as silk screen print method, bar coater, knife type coaters.Then, in order to obtain dry to touch, by heated air circulation type drying oven, far infrared drying stove etc., containing carboxy resin can not thermal decomposition temperature, make its drying about 5 ~ 40 minutes at such as about 60 ~ 120 DEG C, make organic solvent evaporation, the film do not glued.

In addition, also can by conductive resin composition in advance film forming be film-form, now thin layer is pressed onto on base material.

Then, use the negative mask with the exposing patterns of regulation, carry out contact exposure or noncontact exposure.As exposure light source, use Halogen lamp LED, high-pressure sodium lamp, laser, metal halide lamp, black lamp, electrodeless lamp etc.As exposure, accumulated light can be set to 200mJ/cm ²following low light quantity.In addition, also can not use mask, and utilize laser direct imaging device to form pattern on film.

Then, by the development of spray-on process, infusion process etc., film is made to become pattern-like.As developer solution, the dilute alkaline aqueous solution of the concentration of the amine aqueous solutions such as metal base aqueous solution, monoethanolamine, diethanolamine, triethanolamine such as NaOH, potassium hydroxide, sodium carbonate, sal tartari, sodium silicate, below especially about 1.5 quality % can be used aptly, as long as can by the carboxyl saponification containing carboxy resin in conductive resin composition, remove uncured portion (unexposed portion), be not limited to developer solution as above.In addition, in order to remove unwanted developer solution after development, preferably carry out washing, acid neutralization.

Then, drying can not carried out under the temperature of thermal decomposition to the conductive pattern film obtained containing carboxy resin.Thus, can low resistance be formed and there is the conducting channel of fine conductive pattern film.As baking temperature, be preferably less than 150 DEG C, be more preferably less than 140 DEG C, be more preferably less than 130 DEG C further.

(base material)

In these operations, roasting can not be carried out under 500 DEG C of such high temperature, therefore, as base material, the resinous base material without thermotolerance can be used.Specifically, as resinous base material, include, for example out polyester based resin, polyethersulfone (PES), polystyrene (PS), polymethylmethacrylate (PMMA), polycarbonate (PC), polyamide (PA), polypropylene (PP), polyphenylene oxide (PPO) etc. that polyimide, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), PEN (PEN) are such, polyester based resin can be used aptly.In addition, also can be glass substrate etc.

Embodiment

Based on embodiment, the present invention is specifically described below.But the present invention is not limited to these embodiments.

(compounding ingredients)

[not double bond containing containing carboxy resin]

Synthesis example 1

Methyl methacrylate and methacrylic acid is dropped into the mol ratio of 0.87:0.13 in the flask possessing thermometer, stirring machine, tap funnel and reflux condenser, add the dipropylene glycol monomethyl ether as solvent, the azoisobutyronitrile as catalyzer, in a nitrogen atmosphere, stir 6 hours at 80 DEG C, obtain containing carboxy resin solution.Should be about 10000 containing the matter average molecular weight of carboxy resin, acid number is 74mgKOH/g.

In addition, the matter average molecular weight containing carboxy resin obtained is measured by the high performance liquid chromatograph of three root chromatogram column Shodex (registered trademark) KF-804, KF-803, KF-802 that the pump LC-6AD and Showa Denko K. K being connected with Shimadzu Scisakusho Ltd's manufacture manufactures.Below, this is called A-1 varnish containing carboxy resin solution.It should be noted that, containing carboxy resin not containing double bond, and aromatic rings should do not contained.

[electroconductive powder]

Spherical electroconductive powder: Ag powder (maximum particle diameter less than 30 μm, mean grain size 2 μm (SEM)))

[acrylate monomer]

2 officials' energy (methyl) acrylate monomers: trade name; KAYARAD HX-220 (Nippon Kayaku K. K's manufacture)

3 officials' energy (methyl) acrylate monomers: trade name; ARONIX M-350 (Toagosei Co., Ltd's manufacture)

4 officials' energy (methyl) acrylate monomers: trade name; NK OLIGO U-4HA (manufacture of KCC of Xin Zhong village)

6 officials' energy (methyl) acrylate monomers: dipentaerythritol acrylate (Nippon Kayaku K. K's manufacture)

[Photoepolymerizationinitiater initiater]

Trade name: IRGACURE 379EG (BASF Japan Ltd. manufactures), 2-(dimethylamino)-2-[(4-aminomethyl phenyl) methyl]-1-[4-(4-morpholinyl) phenyl]-1-butanone

[blocked isocyanate]

Trade name 7982 (manufacture of Baxenden company) isocyanates HDI tripolymer end-capping reagent dimethyl pyrazole (dimethylpyrazole)

[organic acid]

2,2 '-thiobis acetic acid

[spreading agent]

Trade name DISPERBYK-111 (BYK Japan KK manufactures)

(evaluation method)

Test film is made:

Use 300 object polyester screen to be applied to by entire surface on the base material of polyester resin by each conductive resin composition evaluated, then, in heated air circulation type drying oven at 80 DEG C dry 30 minutes, form the film that dry to touch is good.Then, as light source, use high-pressure sodium lamp, across negative mask, with the accumulated light on conductive resin composition for 200mJ/cm ²mode carry out pattern exposure after, use 0.4 quality %Na of liquid temperature 30 DEG C ₂cO ₃aqueous solution is developed, washing.Finally, dry under the condition of 140 DEG C × 30 minutes, make the test film being formed with conductive pattern film.

Resolution: the minimum line width evaluating the test film made by said method.

Resistivity value: the pattern being formed 4mm × 10cm by said method, is measured resistance value and thickness, calculates resistivity value.Defective sample minimum line is not had to be evaluated as " well " completely.

Adaptation: the pattern carrying out L/S=30/30um is formed, carrying out Sellotape (registered trademark) and peels off, being evaluated as not having defective sample completely " well ".Defective sample is evaluated as " bad ".

For embodiment 1 ~ 4 within the scope of the present invention and the comparative example 1 ~ 4 departing from scope of the present invention (not compounding blocked isocyanate), its experiment condition and evaluation result are listed in following table 1 and table 2 respectively.

Coating strength: the pattern carrying out L/S=30/30um is formed, uses the device and pencil scratching tester imposed load 750g recorded in JIS K5600-5-4, scrapes and scratches, be evaluated as " well " by the sample that now line does not occur to break line lateral vertical.Defective sample is evaluated as " bad ".The pencil used is Mitsubishi Hi-uni (Mitsubishi Pencil K. K manufactures, hardness: 3H).

[table 1]

Table 1

[table 2]

Table 2

Confirmed by embodiment 1 ~ 4, conductive resin composition of the present invention can obtain being applicable to the base material that do not tolerate heat and can guarantee the conductive resin composition that the adaptation of excellent electric conductivity and resolution and coating strength and base substrate is all excellent.

Claims (8)

1. a conducting channel formation conductive resin composition, is characterized in that, comprises: containing carboxy resin, electroconductive powder, polyfunctional acrylate monomer, Photoepolymerizationinitiater initiater and blocked isocyanate, and the described carboxy resin that contains does not contain double bond.

2. conducting channel formation conductive resin composition according to claim 1, is characterized in that, described polyfunctional acrylate monomer is 4 functional acrylate monomers.

3. conducting channel formation conductive resin composition according to claim 2, is characterized in that, described 4 functional acrylate monomers are the acrylate monomer that following chemical formula (I) is recorded,

In formula (I),

X ¹represent the group comprising acryloxy,

X ²represent the group comprising methacryloxy,

X ³and X ⁴represent the group comprising acryloxy independently of one another or represent the group comprising methacryloxy, wherein, X ³and X ⁴in at least one represent the group comprising methacryloxy,

L ¹and L ²represent independently of one another

* the bonding position with Z is represented,

Z represents the linking group of divalence.

4. conducting channel formation conductive resin composition according to claim 3, wherein, the L in general formula (I) ¹and L ²represented by following formula (III),

In formula (III), * represents the bonding position with Z.

5. conducting channel formation conductive resin composition according to claim 3, wherein, the acrylate monomer of 4 functional groups shown in general formula (I) is represented by following formula (IV),

In formula (IV),

Z ¹represent alkylidene,

R ¹represent hydrogen atom,

R ²represent methyl,

R ³and R ⁴represent hydrogen atom or methyl independently of one another, wherein, R ³and R ⁴in at least one represent methyl.

6. conducting channel formation conductive resin composition according to claim 1, is characterized in that, described Photoepolymerizationinitiater initiater is oxime ester system.

7. conducting channel formation conductive resin composition according to claim 1, is characterized in that, the described not double bond containing carboxy resin that contains also does not contain aromatic rings.

8. a conducting channel, it on base material, is coated with conducting channel formation conductive resin composition according to any one of claim 1 ~ 7 and dry and formed.