CN104668810B - A kind of novel lead-free welding material and the preparation method of scaling powder thereof - Google Patents
A kind of novel lead-free welding material and the preparation method of scaling powder thereof Download PDFInfo
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- CN104668810B CN104668810B CN201510046766.8A CN201510046766A CN104668810B CN 104668810 B CN104668810 B CN 104668810B CN 201510046766 A CN201510046766 A CN 201510046766A CN 104668810 B CN104668810 B CN 104668810B
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- 239000000463 material Substances 0.000 title claims abstract description 58
- 239000000843 powder Substances 0.000 title claims abstract description 39
- 238000003466 welding Methods 0.000 title claims abstract description 25
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 17
- 239000011701 zinc Substances 0.000 claims abstract description 17
- 239000000428 dust Substances 0.000 claims abstract description 14
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims abstract description 13
- 238000009689 gas atomisation Methods 0.000 claims abstract description 13
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 13
- 239000011572 manganese Substances 0.000 claims abstract description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000000203 mixture Substances 0.000 claims description 11
- 229910052787 antimony Inorganic materials 0.000 claims description 10
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000007789 gas Substances 0.000 claims description 9
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 8
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 7
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 7
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- 239000000956 alloy Substances 0.000 abstract description 11
- 230000003647 oxidation Effects 0.000 abstract description 5
- 238000007254 oxidation reaction Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- SSUVWJFPTFMCEH-UHFFFAOYSA-N [Zn].[Mn].[Sn] Chemical compound [Zn].[Mn].[Sn] SSUVWJFPTFMCEH-UHFFFAOYSA-N 0.000 abstract description 2
- 239000002994 raw material Substances 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 description 8
- 238000010298 pulverizing process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910017518 Cu Zn Inorganic materials 0.000 description 2
- 229910017752 Cu-Zn Inorganic materials 0.000 description 2
- -1 Cu-Zn compound Chemical class 0.000 description 2
- 229910017943 Cu—Zn Inorganic materials 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910001074 Lay pewter Inorganic materials 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910007116 SnPb Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000012254 powdered material Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
The invention discloses a kind of novel lead-free welding material and the preparation method of scaling powder thereof, this novel lead-free welding material includes material of main part and scaling powder, and the mass percent of material of main part consists of zinc, the manganese of 0.5 2% and the tin of surplus of 8 12%；Scaling powder includes organic principle and the material of main part of the powdered through Gas atomization techniques process, and its mass percent consists of the organic principle of 2% and the metal dust of 98%；The mass percent of material of main part and scaling powder is 80%:20%.The cost of raw material of the present invention is cheap, low for equipment requirements, production cost can be reduced, the leadless welding material utilizing the solution of the present invention to be produced solves the technical bottlenecks such as grain size size present in tin zinc-manganese lead-free alloy Material Manufacturing Process, branch's size, shape, oxidation level and uniformity, thus solves the performance indications problem of electronics industry series products.
Description
Technical field
The invention belongs to technical field of nonferrous metal processing, be specifically related to a kind of stanniferous and zinc tinbase and close
Gold leadless welding material and the preparation method of scaling powder thereof.
Background technology
Along with the ROHS formal enforcement prohibiting lead instruction in the electronics industry, lead alloy material can be substituted
Main lead-free be exactly SAC.But, the application difficult point of SAC material is not only
It is intended merely to ask reflow oven temperature higher than original metal 25 DEG C, and its cost is also high than leypewter
20%, it is often more important that the raising of this temperature can be substantially reduced the stability exposing components and parts.Tin zinc
The fusing point (183) of the fusing point of alloy eutectic alloy and SnPb eutectic closest to, it is possible to the most not
Soldering is carried out, so Sn-Zn series lead-free solder is subject in the case of changing existing welding equipment and technique
Arrive people's attention.Activity yet with zinc is big, easily aoxidizes, and therefore the oxidation of zinc hinders
The application of this alloy, leadless welding material research and development company of Israel innovation and application microalloying skill
Art, achieves the goal by adding the third element manganese, can improve the anti-oxidant of zinc by adding manganese
Ability, but the addition of manganese have to be sought a kind of brand-new chemistry auxiliary and ensure its superperformance.
Summary of the invention
It is an object of the invention to for above-mentioned the deficiencies in the prior art, it is provided that novel lead-free welding material,
This welding material can effectively suppress the oxidation of zinc on the premise of keeping its eutectic temperature.
For achieving the above object, the technical solution used in the present invention is as follows:
A kind of novel lead-free welding material, including material of main part and scaling powder, wherein:
The mass percent of material of main part consists of the zinc of 8-12%, the manganese of 0.5-2% and the tin of surplus；
Scaling powder includes organic principle and the material of main part of the powdered through Gas atomization techniques process, its
Mass percent consists of the organic principle of 2% and the metal dust of 98%.
Further, main part also includes antimony and the quality hundred that mass percent is 0.05-0.8%
Proportion by subtraction is the copper of 0.05-0.5%.
Further, the mass percent of material of main part consist of 10% zinc, the manganese of 1.5%, 0.4%
Antimony, the copper of 0.25% and the tin of surplus；The mass percent of scaling powder consists of organic one-tenth of 2%
Dividing the material of main part that the powdered with 98% processes, material of main part and scaling powder mass ratio are 80%:
20%.
Further, described organic principle is rosin.
Further, described Gas atomization techniques uses inert gas, and described gas pressure is
1.9-2.2MPa, gas spray angle is 40-45 degree.
Further, the granularity of described powdered material is below 100 μm.
Invention further provides the preparation method of a kind of above-mentioned scaling powder, comprise the following steps:
1) according to the metal material composition that proportioning preparation is identical with material of main part composition and proportioning；
2) it is 1.9-2.2MPa that metal alloy is placed in gas atomization equipment employing gas pressure, angle
Degree is for being atomized under conditions of 40-45 degree；
3) metal material of powdered is passed through in the case of 50-70 DEG C ultrasonic disperse, with prepared gold
Belong to powder；
4) metal dust is uniformly mixed according to a ratio with organic principle, prepares scaling powder.
Further, step 1) and step 4) in mixing carry out the most at normal temperatures.
The invention has the beneficial effects as follows: the cost of raw material of the present invention is cheap, to equipment requirement
Low, it is possible to reducing production cost, the leadless welding material utilizing the solution of the present invention to be produced solves
Grain size size, branch's size, shape, oxygen present in tin zinc-manganese lead-free alloy Material Manufacturing Process
The technical bottlenecks such as change level and uniformity, thus solve the performance indications problem of electronics industry series products.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with enforcement
The present invention is described in further detail by example.Should be appreciated that specific embodiment described herein is only used
To explain the present invention, it is not intended to limit the present invention.
(1) embodiment 1
A kind of novel lead-free welding material, including material of main part and scaling powder, wherein: material of main part
Mass percent consists of the zinc of 8%, the manganese of 0.5% and the tin of 91.5%；Scaling powder includes organic
Composition and the material of main part of the powdered through Gas atomization techniques process, its mass percent composition 2%
Organic principle and the metal dust of 98%；The mass percent of material of main part and scaling powder is 80%:
20%.
The preparation method of the scaling powder of embodiment 1, comprises the steps:
1) tin that mass percent consists of the zinc of 8%, the manganese of 0.5% and 91.5% makes alloy；
2) above-mentioned metal alloy is placed in gas atomization equipment it is atomized, by metal pulverization,
Wherein gas pressure is 1.9MPa, and angle is 40 degree；
3) by the metal of powdered at 50 DEG C of ultrasonic disperse, metal dust is prepared；
4) by metal dust and rosin, ratio for 2%:98% in mass ratio mix, the prepared present invention
Scaling powder.
(2) embodiment 2
A kind of novel lead-free welding material, including material of main part and scaling powder, wherein: material of main part
Mass percent consist of 10% zinc, the manganese of 1.5%, the antimony of 0.4%, the copper of 0.25% and 87.85%
Tin；Scaling powder includes organic principle and the material of main part of the powdered through Gas atomization techniques process,
The organic principle of its mass percent composition 2% and the metal dust of 98%, organic principle is containing matter
Amount mark is the ethanol solution of the rosin of 30%, and adds the ethylenediamine that mass fraction is 5%；Main body
The mass percent of material and scaling powder is 80%:20%.
The preparation method of the scaling powder of embodiment 2, comprises the steps:
1) mass percent is consisted of 10% zinc, the manganese of 1.5%, the antimony of 0.4%, 0.25%
Copper and 87.85% tin make alloy；
2) above-mentioned metal alloy is placed in gas atomization equipment it is atomized, by metal pulverization,
Wherein gas pressure is 2.1MPa, and angle is 42 degree；
3) by the metal of powdered at 60 DEG C of ultrasonic disperse, metal dust is prepared；
4) by metal dust and rosin, ratio for 2%:98% in mass ratio mix, the prepared present invention
Scaling powder.
Copper can generate Cu-Zn compound, in fusing with the zinc atom of the middle free state mutually of zinc-rich in solder
Time, owing to fusion temperature is relatively low, alloy exists Cu-Zn compound in a large number, decreases zinc atom and exist
The oxidation on welding material surface.
Rosin flux has obvious corrosivity to red brass, and adding ethylenediamine can significantly reduce
The corrosion rate of alloy.
Antimony contributes to brazing filler metal alloy and sprawls on masterbatch, adds the melting range of alloy, and antimony also helps simultaneously
Secondary oxidation and the scaling loss of solder is stopped in the oxide-film forming densification on brazing filler metal alloy surface.
(3) embodiment 3
A kind of novel lead-free welding material, including material of main part and scaling powder, wherein: material of main part
Mass percent consist of 12% zinc, the manganese of 2%, the antimony of 0.8%, the copper of 0.5% and 84.7%
Tin；Scaling powder includes organic principle and the material of main part of the powdered through Gas atomization techniques process,
The organic principle of its mass percent composition 2% and the metal dust of 98%；Material of main part and scaling powder
Mass percent be 80%:20%.
The preparation method of the scaling powder of embodiment 3, comprises the steps:
1) mass percent is consisted of 12% zinc, the manganese of 2%, the antimony of 0.8%, 0.5% copper with
And the tin of 84.7% makes alloy；
2) above-mentioned metal alloy is placed in gas atomization equipment it is atomized, by metal pulverization,
Wherein gas pressure is 2.2MPa, and angle is 45 degree；
3) by the metal of powdered at 70 DEG C of ultrasonic disperse, metal dust is prepared；
4) by metal dust and rosin, ratio for 2%:98% in mass ratio mix, the prepared present invention
Scaling powder.
The novel lead-free welding material of present invention offer and performance such as table 1 institute of traditional welding material
Show.
Table 1 novel lead-free welding material and the performance comparison of traditional welding material
The foregoing is only presently preferred embodiments of the present invention, be not used for limiting the enforcement model of the present invention
Enclose；If without departing from the spirit and scope of the present invention, the present invention is modified or equivalent,
All should contain in the middle of the protection domain of the claims in the present invention.
Claims (7)
1. a novel lead-free welding material, it is characterised in that include material of main part and scaling powder, its
In:
The mass percent of material of main part consists of the zinc of 8-12%, the manganese of 0.5-2% and the tin of surplus；
Scaling powder includes organic principle and the material of main part of the powdered through Gas atomization techniques process, its
Mass percent consists of the organic principle of 2% and the metal dust of 98%；
The mass percent of material of main part and scaling powder is 80%:20%；
Material of main part also includes that antimony that mass percent is 0.05-0.8% and mass percent are
The copper of 0.05-0.5%.
Novel lead-free welding material the most according to claim 1, it is characterised in that material of main part
Mass percent consist of 10% zinc, the manganese of 1.5%, the antimony of 0.4%, the copper of 0.25% and remaining
The tin of amount；The mass percent of scaling powder consists of the organic principle of 2% and the powdered of 98% processes
Material of main part, material of main part and scaling powder mass ratio are 80%:20%.
Novel lead-free welding material the most according to claim 1, it is characterised in that described organic
Composition is rosin.
Novel lead-free welding material the most according to claim 1, it is characterised in that described gas
Atomization technique uses inert gas, and gas pressure is 1.9-2.2MPa, and gas spray angle is 40-45
Degree.
Novel lead-free welding material the most according to claim 4, it is characterised in that described powder
The granularity of end formed material is below 100 μm.
6. a preparation method for the scaling powder according to any one of claim 1-5, its feature exists
In, comprise the following steps:
1) according to the metal alloy that proportioning preparation is identical with material of main part composition and proportioning；
2) it is 1.9-2.2MPa that metal alloy is placed in gas atomization equipment employing gas pressure, angle
Degree is for being atomized under conditions of 40-45 degree；
3) metal material of powdered is passed through in the case of 50-70 DEG C ultrasonic disperse, with prepared gold
Belong to powder；
4) metal dust is uniformly mixed according to a ratio with organic principle, prepares scaling powder.
7. according to the preparation method of the scaling powder described in claim 6, it is characterised in that step 1)
With step 4) in mixing carry out the most at normal temperatures.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510046766.8A CN104668810B (en) | 2015-01-29 | 2015-01-29 | A kind of novel lead-free welding material and the preparation method of scaling powder thereof |
| PCT/CN2015/000867 WO2016119096A1 (en) | 2015-01-29 | 2015-12-04 | Lead-free welding material and method for preparing scaling powder thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510046766.8A CN104668810B (en) | 2015-01-29 | 2015-01-29 | A kind of novel lead-free welding material and the preparation method of scaling powder thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104668810A CN104668810A (en) | 2015-06-03 |
| CN104668810B true CN104668810B (en) | 2016-09-07 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510046766.8A Active CN104668810B (en) | 2015-01-29 | 2015-01-29 | A kind of novel lead-free welding material and the preparation method of scaling powder thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104668810B (en) |
| WO (1) | WO2016119096A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104668810B (en) * | 2015-01-29 | 2016-09-07 | 苏州天兼新材料科技有限公司 | A kind of novel lead-free welding material and the preparation method of scaling powder thereof |
| CN113199170B (en) * | 2021-04-25 | 2022-10-25 | 江苏海瑞电源有限公司 | Gel type storage battery soldering flux and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1198117A (en) * | 1995-09-29 | 1998-11-04 | 松下电器产业株式会社 | Lead-Free Solder Alloys |
| CN1337293A (en) * | 2001-09-05 | 2002-02-27 | 北京工业大学 | Rare earth-containing tin-base lead-less brazing alloy and its prepn |
| CN1651180A (en) * | 2005-02-03 | 2005-08-10 | 复旦大学 | Sn-Zn or Sn-Ag-Bi series lead-free solder containing a small amount of doped metal and its preparation method |
| CN1764515A (en) * | 2003-04-01 | 2006-04-26 | 千住金属工业株式会社 | Solder paste and printed circuit board |
| CN102787256A (en) * | 2012-08-28 | 2012-11-21 | 苏州金仓合金新材料有限公司 | Environment-friendly tin-zinc-manganese alloy rod for welding and preparation method thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030021718A1 (en) * | 2001-06-28 | 2003-01-30 | Osamu Munekata | Lead-free solder alloy |
| IL144160A0 (en) * | 2001-07-05 | 2002-05-23 | Ika Ind Consulting Ltd | A lead-free alloy for use as soldering material |
| JP2011156558A (en) * | 2010-01-30 | 2011-08-18 | Nihon Superior Co Ltd | Lead-free solder alloy |
| US9017446B2 (en) * | 2010-05-03 | 2015-04-28 | Indium Corporation | Mixed alloy solder paste |
| EP2974818B1 (en) * | 2013-03-13 | 2019-01-16 | Nihon Superior Co., Ltd. | Solder joining method |
| CN104668810B (en) * | 2015-01-29 | 2016-09-07 | 苏州天兼新材料科技有限公司 | A kind of novel lead-free welding material and the preparation method of scaling powder thereof |
-
2015
- 2015-01-29 CN CN201510046766.8A patent/CN104668810B/en active Active
- 2015-12-04 WO PCT/CN2015/000867 patent/WO2016119096A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1198117A (en) * | 1995-09-29 | 1998-11-04 | 松下电器产业株式会社 | Lead-Free Solder Alloys |
| CN1337293A (en) * | 2001-09-05 | 2002-02-27 | 北京工业大学 | Rare earth-containing tin-base lead-less brazing alloy and its prepn |
| CN1764515A (en) * | 2003-04-01 | 2006-04-26 | 千住金属工业株式会社 | Solder paste and printed circuit board |
| CN1651180A (en) * | 2005-02-03 | 2005-08-10 | 复旦大学 | Sn-Zn or Sn-Ag-Bi series lead-free solder containing a small amount of doped metal and its preparation method |
| CN102787256A (en) * | 2012-08-28 | 2012-11-21 | 苏州金仓合金新材料有限公司 | Environment-friendly tin-zinc-manganese alloy rod for welding and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016119096A1 (en) | 2016-08-04 |
| CN104668810A (en) | 2015-06-03 |
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