CN104654116A - Backlight module and manufacturing method - Google Patents
Backlight module and manufacturing method Download PDFInfo
- Publication number
- CN104654116A CN104654116A CN201310592730.0A CN201310592730A CN104654116A CN 104654116 A CN104654116 A CN 104654116A CN 201310592730 A CN201310592730 A CN 201310592730A CN 104654116 A CN104654116 A CN 104654116A
- Authority
- CN
- China
- Prior art keywords
- substrate
- quantum dot
- dot film
- cover plate
- sealant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 239000002096 quantum dot Substances 0.000 claims abstract description 55
- 239000000565 sealant Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000010422 painting Methods 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims 1
- 230000008023 solidification Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 7
- 238000007789 sealing Methods 0.000 abstract 3
- 238000009877 rendering Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000003086 colorant Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005224 laser annealing Methods 0.000 description 2
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/40—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters with provision for controlling spectral properties, e.g. colour, or intensity
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention provides a backlight module. The backlight module comprises a light source, a substrate, a quantum dot film formed on the substrate and a cover plate covering the quantum dot film, as well as a sealing layer surrounding the quantum dot film; the sealing layer is connected with the substrate and the cover plate so that the quantum dot film can be sealed between the substrate and the cover plate. As the quantum dot film is sealed between the substrate and the cover plate by the sealing layer, the backlight effect of the backlight module is improved. The invention also discloses a manufacturing method of the backlight module.
Description
Technical field
The present invention relates to a kind of backlight module, refer to a kind of display backlight module and manufacture method thereof especially.
Background technology
Existing display is limited to the impact of back light, and its color rendering index (color rendering index), usually between 60 to 70, is difficult to the demand meeting high color rendition.Therefore, industry have devised the color rendering that quantum dot film (quantum dot film) promotes display.The light that back light can send by quantum dot film carries out the conversion of quantum effect, makes it become the light of different colours.Thus, the color rendering index of display can reach the level higher than 70.But; when encapsulation, current quantum dot film is not owing to considering that edge carries out good protection; thus quantum dot film marginal position is caused easily to be subject to the impact (as moisture or dust) of external environment and conversion quantum efficiency is reduced; cause final bright dipping to occur obvious aperture at marginal position, and then have influence on overall backlight effect.
Summary of the invention
Therefore, be necessary to provide a kind of backlight effect preferably backlight module and manufacture method thereof.
A kind of backlight module, comprise light source, substrate, be formed at quantum dot film on substrate and cover the cover plate of quantum dot film, also comprise the sealant around quantum dot film, sealant connection substrate and cover plate and be sealed between substrate and cover plate by quantum dot film.
A manufacture method for backlight module, comprising: provide light source and substrate, and substrate comprises incidence surface and exiting surface; At the periphery of the exiting surface of substrate, sealant is set; The exiting surface of substrate is arranged by sealant around quantum dot film; Quantum dot film covers cover plate, and cover plate is engaged with substrate by sealant.
Owing to adopting sealant around quantum dot film, quantum dot film entirety is made all to be sealed between substrate and cover plate, therefore the edge of quantum dot film can not be subject to external influence, can keep original conversion quantum efficiency, thus promotes the backlight effect of backlight module.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
Accompanying drawing explanation
Fig. 1 is the top view of the backlight module of one embodiment of the invention, and wherein the cover plate of backlight module is hidden.
Fig. 2 is the sectional view of the backlight module of Fig. 1.
Main element symbol description
| Backlight module | 10 |
| Light source | 20 |
| Substrate | 30 |
| Incidence surface | 32 |
| Exiting surface | 34 |
| Quantum dot film | 40 |
| Cover plate | 50 |
| Sealant | 60 |
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
Refer to Fig. 1-2, show the backlight module 10 of one embodiment of the invention.Backlight module 10 comprises multiple light source 20, substrate 30, and is formed at quantum dot film 40, on substrate 30 and covers the cover plate 50 and of quantum dot film 40 around the sealant 60 of quantum dot film 40.
Light source 20 is manufactured by semi-conducting material, and it can send visible ray by exciting of electric current.In the present embodiment, light source 20 comprises multiple blue light-emitting diode.These light emitting diodes line up row, to emit beam towards substrate 30 side direction.
Substrate 30 is made up of transparent materials such as glass, Merlon, polymethyl methacrylates.Substrate 30 is the plate body of a rectangle, and it comprises incidence surface 32 and an exiting surface 34 adjacent with incidence surface 32.In the present embodiment, incidence surface 32 is the side of substrate 30, and exiting surface 34 is the end face of substrate 30.Incidence surface 32 is right against light source 20, thus the light that light source 20 is sent can enter in substrate 30 via incidence surface 32.The thickness of substrate 30 is greater than the height of light emitting diode, can substantially all enter in substrate 30 to make light.In the present embodiment, the thickness of substrate 30 is between 0.3mm to 0.6mm.
Quantum dot film 40 is formed on the exiting surface 34 of substrate 30.Quantum dot film 40 can be made up of indium phosphide and cadmium, and its surface has the chondritic of a large amount of nano-scales.The light that exiting surface 34 from substrate 30 can penetrate by quantum dot film 40 is changed, and makes it have higher color rendering.Specifically, in the middle of the blue light of substrate 30 outgoing, have the light of 1/3rd to convert ruddiness to, separately have the blue light of 1/3rd to convert green glow to, the light of remaining 1/3rd is then directly scattered and keeps blue light.Thus, the light after changing via quantum dot film 40 comprises red, green, blue three kinds of colors, effectively the color rendering index of backlight module 10 can be promoted to more than 70.Quantum dot film 40 is also rectangular, and its area is less than the area of substrate 30.The peripheral position of substrate 30 exiting surface 34 is positioned at outside quantum dot film 40.
The exiting surface 34 that sealant 60 is formed at substrate 30 is positioned at the peripheral position outside quantum dot film 40.Ringwise, it surrounds quantum dot film 40 to sealant 60.The thickness of sealant 60 is identical with the thickness of quantum dot film 40 or be greater than the thickness of quantum dot film 40.Sealant 60 can be made up of glass medium (glass frit), its adhesive base plate 30 and cover plate 50, to be sealed between substrate 30 and cover plate 50 by quantum dot film 40.Sealant 60 can stop that extraneous moisture and dust invade the periphery of quantum dot film 40, thus guarantees the quantum effect conversion efficiency of quantum dot film 40, and the backlight effect of backlight module 10 is improved.
Cover plate 50 covers quantum dot film 40 and sealant 60.Cover plate 50 is made up of glass, and its thickness is between 0.1mm to 0.3mm.Throw light on to external world through cover plate 50 from the light of quantum dot film 40 outgoing.Cover plate 50 seals up whole quantum dot film 40 jointly with substrate 30 and sealant 60, and itself and external environment are completely cut off.
The present invention further provides a kind of manufacture method of backlight module 10.First, light source 20 and substrate 30 are provided.Then at the sealant 60 that the peripheral position coating of the exiting surface 34 of substrate 30 is gluey.Afterwards, the exiting surface 34 by the mode of screen painting quantum dot powder being printed in substrate 30 is avoided the position of sealant 60, thus form quantum dot film 40.Preferably, exiting surface 34 near the density of the quantum dot powder of the position of incidence surface 32 higher than the density of the quantum dot powder of the position away from incidence surface 32, to make final bright dipping evenly change.Again cover plate 50 is covered on quantum dot film 40, cover plate 50 is engaged with sealant 60.Finally, solidify sealant 60 by laser annealing (laser annealing) or other techniques (as high-temperature baking), cover plate 50 is fixedly connected with substrate 30, the seal process thus between completing substrate 30 and cover plate 50.
Claims (10)
1. a backlight module, comprise light source, substrate, quantum dot film and cover plate, quantum dot film, between substrate and cover plate, is characterized in that: also comprise the sealant around quantum dot film, sealant bonded substrate and cover plate and be sealed between substrate and cover plate by quantum dot film.
2. backlight module as claimed in claim 1, is characterized in that: substrate comprises incidence surface and the exiting surface near incidence surface, and light source is towards the incidence surface of substrate, and quantum dot film and sealant are positioned on the exiting surface of substrate.
3. backlight module as claimed in claim 2, is characterized in that: sealant is positioned at the peripheral position of substrate exiting surface.
4. backlight module as claimed in claim 1, is characterized in that: sealant is made up of glass medium.
5. backlight module as claimed in claim 1, is characterized in that: the thickness of substrate is greater than the thickness of cover plate.
6. a manufacture method for backlight module, comprising:
There is provided light source and substrate, substrate comprises incidence surface and exiting surface;
The exiting surface of substrate is arranged sealant and by sealant around quantum dot film;
Quantum dot film covers cover plate, and cover plate is engaged with substrate by sealant.
7. manufacture method as claimed in claim 6, is characterized in that: quantum dot film is by the mode of quantum dot powder by screen painting being arranged on substrate.
8. manufacture method as claimed in claim 7, is characterized in that: quantum dot powder is greater than the density of the position away from substrate incidence surface in the density of the position of the incidence surface near substrate.
9. manufacture method as claimed in claim 6, is characterized in that: sealant is made up of glass medium.
10. manufacture method as claimed in claim 6, is characterized in that: also comprise the step to sealant solidification cover cover plate on quantum dot film after.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310592730.0A CN104654116A (en) | 2013-11-22 | 2013-11-22 | Backlight module and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310592730.0A CN104654116A (en) | 2013-11-22 | 2013-11-22 | Backlight module and manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104654116A true CN104654116A (en) | 2015-05-27 |
Family
ID=53245560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310592730.0A Pending CN104654116A (en) | 2013-11-22 | 2013-11-22 | Backlight module and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104654116A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104864318A (en) * | 2015-06-12 | 2015-08-26 | 深圳市华星光电技术有限公司 | Backlight module and display device |
| CN104932141A (en) * | 2015-06-09 | 2015-09-23 | 武汉华星光电技术有限公司 | Backlight module and display device |
| CN105158954A (en) * | 2015-10-13 | 2015-12-16 | 苏州桐力光电技术服务有限公司 | High-color-gamut liquid crystal display screen and manufacturing method thereof |
| CN105842926A (en) * | 2016-06-17 | 2016-08-10 | 武汉华星光电技术有限公司 | Liquid crystal display (LCD) |
| CN106773283A (en) * | 2016-11-25 | 2017-05-31 | 北京小米移动软件有限公司 | Quantum dot film and preparation method thereof, display device and electronic equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120009686A (en) * | 2010-07-20 | 2012-02-02 | 엘지이노텍 주식회사 | LED package using quantum dot sheet, backlight unit using quantum dot sheet and method of manufacturing same |
| WO2012124986A2 (en) * | 2011-03-14 | 2012-09-20 | Lg Innotek Co., Ltd. | Display device |
| CN202521397U (en) * | 2012-02-15 | 2012-11-07 | 青岛海信电器股份有限公司 | Backlight module |
| CN103117205A (en) * | 2013-01-30 | 2013-05-22 | 深圳市华星光电技术有限公司 | Display device, backlight module, field-emitting light source device of backlight module and manufacturing method of field-emitting light source device |
| CN103278961A (en) * | 2013-04-28 | 2013-09-04 | 京东方科技集团股份有限公司 | Liquid crystal display device |
-
2013
- 2013-11-22 CN CN201310592730.0A patent/CN104654116A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120009686A (en) * | 2010-07-20 | 2012-02-02 | 엘지이노텍 주식회사 | LED package using quantum dot sheet, backlight unit using quantum dot sheet and method of manufacturing same |
| WO2012124986A2 (en) * | 2011-03-14 | 2012-09-20 | Lg Innotek Co., Ltd. | Display device |
| CN202521397U (en) * | 2012-02-15 | 2012-11-07 | 青岛海信电器股份有限公司 | Backlight module |
| CN103117205A (en) * | 2013-01-30 | 2013-05-22 | 深圳市华星光电技术有限公司 | Display device, backlight module, field-emitting light source device of backlight module and manufacturing method of field-emitting light source device |
| CN103278961A (en) * | 2013-04-28 | 2013-09-04 | 京东方科技集团股份有限公司 | Liquid crystal display device |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104932141A (en) * | 2015-06-09 | 2015-09-23 | 武汉华星光电技术有限公司 | Backlight module and display device |
| WO2016197424A1 (en) * | 2015-06-09 | 2016-12-15 | 武汉华星光电技术有限公司 | Backlight module and display device |
| US9958594B2 (en) | 2015-06-09 | 2018-05-01 | Wuhan China Star Optoelectronics Technology Co., Ltd | Backlight module and display device |
| CN104864318A (en) * | 2015-06-12 | 2015-08-26 | 深圳市华星光电技术有限公司 | Backlight module and display device |
| CN105158954A (en) * | 2015-10-13 | 2015-12-16 | 苏州桐力光电技术服务有限公司 | High-color-gamut liquid crystal display screen and manufacturing method thereof |
| CN105158954B (en) * | 2015-10-13 | 2019-06-11 | 苏州桐力光电股份有限公司 | High colour gamut liquid crystal display and its manufacturing method |
| CN105842926A (en) * | 2016-06-17 | 2016-08-10 | 武汉华星光电技术有限公司 | Liquid crystal display (LCD) |
| WO2017215036A1 (en) * | 2016-06-17 | 2017-12-21 | 武汉华星光电技术有限公司 | Liquid crystal display |
| CN105842926B (en) * | 2016-06-17 | 2018-04-06 | 武汉华星光电技术有限公司 | Liquid crystal display |
| CN106773283A (en) * | 2016-11-25 | 2017-05-31 | 北京小米移动软件有限公司 | Quantum dot film and preparation method thereof, display device and electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5848562B2 (en) | Semiconductor light emitting device and manufacturing method thereof. | |
| US6881980B1 (en) | Package structure of light emitting diode | |
| US9685101B2 (en) | Solid state light-emitting devices with improved contrast | |
| CN104654116A (en) | Backlight module and manufacturing method | |
| EP3203280A1 (en) | Substrate for color conversion, manufacturing method therefor, and display device comprising same | |
| CN102714262A (en) | Light emitting diode assembly, backlighting device and display device | |
| US7915061B2 (en) | Environmentally robust lighting devices and methods of manufacturing same | |
| JP2012243822A (en) | Led light-emitting device and manufacturing method thereof | |
| KR20100058779A (en) | Light emitting diode package and manufacturing method thereof | |
| US9681502B2 (en) | Lighting device | |
| KR20130058750A (en) | Optoelectronic semiconductor device | |
| CN107665940A (en) | Light-emitting device and its manufacture method | |
| KR20170053131A (en) | Package structure and method for fabricating the same | |
| TWI578579B (en) | Light emitting device, display unit and image display device | |
| JP2013125850A (en) | Light-emitting device and manufacturing method therefor | |
| JP6282438B2 (en) | Semiconductor light emitting device | |
| JP2008251561A (en) | Display | |
| JP2011176247A (en) | Light emitting device | |
| CN210402971U (en) | Four-side light emitting source and backlight module | |
| TWI552391B (en) | Full-circumferential light-emitting diode component and lighting module | |
| JP2015164234A (en) | LED light-emitting device and manufacturing method thereof | |
| DE102014112973A1 (en) | Optoelectronic component | |
| TWI553919B (en) | Light-emitting diode color conversion substrate and manufacturing method thereof | |
| CN203466189U (en) | Micro-size SMD LED light | |
| CN215298729U (en) | LED display module and electronic equipment comprising same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150527 |
|
| WD01 | Invention patent application deemed withdrawn after publication |