CN104624132B - Epoxy resin self-repairing microcapsule and preparation method thereof - Google Patents
Epoxy resin self-repairing microcapsule and preparation method thereof Download PDFInfo
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- CN104624132B CN104624132B CN201310548440.6A CN201310548440A CN104624132B CN 104624132 B CN104624132 B CN 104624132B CN 201310548440 A CN201310548440 A CN 201310548440A CN 104624132 B CN104624132 B CN 104624132B
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- epoxy resin
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- 239000003094 microcapsule Substances 0.000 title claims abstract description 85
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 79
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 79
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 53
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000000178 monomer Substances 0.000 claims abstract description 25
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 21
- 239000000839 emulsion Substances 0.000 claims abstract description 9
- 239000010954 inorganic particle Substances 0.000 claims abstract description 9
- 239000003999 initiator Substances 0.000 claims abstract description 8
- 239000007764 o/w emulsion Substances 0.000 claims abstract description 8
- 238000007720 emulsion polymerization reaction Methods 0.000 claims abstract description 7
- 238000002156 mixing Methods 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical group C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims description 22
- 239000002245 particle Substances 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 19
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical group N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 18
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 13
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 12
- 239000011162 core material Substances 0.000 claims description 11
- 238000006116 polymerization reaction Methods 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- 238000001694 spray drying Methods 0.000 claims description 7
- 239000006185 dispersion Substances 0.000 claims description 6
- 150000005673 monoalkenes Chemical class 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 239000011259 mixed solution Substances 0.000 claims description 5
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 4
- 229920003986 novolac Polymers 0.000 claims description 4
- 238000010008 shearing Methods 0.000 claims description 4
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims description 4
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 3
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 claims description 3
- 229920000098 polyolefin Polymers 0.000 claims description 3
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 claims description 3
- JJBFVQSGPLGDNX-UHFFFAOYSA-N 2-(2-methylprop-2-enoyloxy)propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)COC(=O)C(C)=C JJBFVQSGPLGDNX-UHFFFAOYSA-N 0.000 claims description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 claims description 2
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 claims description 2
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000004342 Benzoyl peroxide Substances 0.000 claims description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 claims description 2
- VKEQBMCRQDSRET-UHFFFAOYSA-N Methylone Chemical compound CNC(C)C(=O)C1=CC=C2OCOC2=C1 VKEQBMCRQDSRET-UHFFFAOYSA-N 0.000 claims description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 2
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 claims description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims description 2
- 150000004291 polyenes Chemical class 0.000 claims description 2
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 claims description 2
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 claims description 2
- HSOOIVBINKDISP-UHFFFAOYSA-N 1-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(CCC)OC(=O)C(C)=C HSOOIVBINKDISP-UHFFFAOYSA-N 0.000 claims 1
- OGBWMWKMTUSNKE-UHFFFAOYSA-N 1-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CCCCCC(OC(=O)C(C)=C)OC(=O)C(C)=C OGBWMWKMTUSNKE-UHFFFAOYSA-N 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 239000012071 phase Substances 0.000 abstract description 34
- 230000008569 process Effects 0.000 abstract description 12
- 239000003995 emulsifying agent Substances 0.000 abstract description 8
- 239000008346 aqueous phase Substances 0.000 abstract description 4
- 239000002105 nanoparticle Substances 0.000 abstract description 2
- 239000003921 oil Substances 0.000 description 21
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 9
- 239000011159 matrix material Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 238000002411 thermogravimetry Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 239000002775 capsule Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000009471 action Effects 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 238000002329 infrared spectrum Methods 0.000 description 4
- 241000871495 Heeria argentea Species 0.000 description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- -1 Poly(Dimethyl Siloxane Chemical class 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 239000011258 core-shell material Substances 0.000 description 3
- 238000004945 emulsification Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 238000012844 infrared spectroscopy analysis Methods 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 238000010907 mechanical stirring Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000005191 phase separation Methods 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 150000004702 methyl esters Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920002239 polyacrylonitrile Polymers 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 description 1
- 241001247482 Amsonia Species 0.000 description 1
- 241000195493 Cryptophyta Species 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 229920002396 Polyurea Polymers 0.000 description 1
- 239000012327 Ruthenium complex Substances 0.000 description 1
- 206010043275 Teratogenicity Diseases 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- PNPBGYBHLCEVMK-UHFFFAOYSA-N benzylidene(dichloro)ruthenium;tricyclohexylphosphanium Chemical compound Cl[Ru](Cl)=CC1=CC=CC=C1.C1CCCCC1[PH+](C1CCCCC1)C1CCCCC1.C1CCCCC1[PH+](C1CCCCC1)C1CCCCC1 PNPBGYBHLCEVMK-UHFFFAOYSA-N 0.000 description 1
- 230000003592 biomimetic effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011984 grubbs catalyst Substances 0.000 description 1
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 description 1
- 229910000271 hectorite Inorganic materials 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical class CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- 239000012510 hollow fiber Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920013657 polymer matrix composite Polymers 0.000 description 1
- 239000011160 polymer matrix composite Substances 0.000 description 1
- 239000002954 polymerization reaction product Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012925 reference material Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 229920006299 self-healing polymer Polymers 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 231100000211 teratogenicity Toxicity 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 230000002792 vascular Effects 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
- B01J13/02—Making microcapsules or microballoons
- B01J13/06—Making microcapsules or microballoons by phase separation
- B01J13/14—Polymerisation; cross-linking
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing Of Micro-Capsules (AREA)
- Epoxy Resins (AREA)
Abstract
本发明提供一种环氧树脂自修复微胶囊及其制备方法。所述方法包括:将包含纳米无机物颗粒和水的水相与包含环氧树脂、单烯烃类单体、多烯烃类交联剂和引发剂的油相混合,形成稳定的水包油乳液;以及加热所述乳液使其进行乳液聚合,形成所述自修复环氧树脂微胶囊。根据本发明的方法采用无机纳米颗粒作为乳化剂并且通过乳液聚合法来制备环氧树脂自修复微胶囊;与采用分子型乳化剂的方法相比,该方法无需后续去除乳化剂的过程,所以该方法的工艺简单、对环境无污染,而且所制备的环氧树脂自修复微胶囊的稳定性和密闭性优良且包覆率高。
The invention provides an epoxy resin self-repairing microcapsule and a preparation method thereof. The method comprises: mixing an aqueous phase comprising nano-inorganic particles and water with an oil phase comprising epoxy resin, monoolefinic monomer, multiolefinic crosslinking agent and initiator to form a stable oil-in-water emulsion; and heating the emulsion to carry out emulsion polymerization to form the self-healing epoxy resin microcapsules. According to the method of the present invention, inorganic nanoparticles are used as emulsifiers and epoxy resin self-repairing microcapsules are prepared by emulsion polymerization; compared with the method using molecular emulsifiers, the method does not require subsequent emulsifier removal processes, so the method The process of the method is simple and has no pollution to the environment, and the prepared epoxy resin self-repairing microcapsules have excellent stability and airtightness and a high covering rate.
Description
技术领域technical field
本发明涉及具有自修复功能的复合材料技术领域,更具体地,本发明涉及采用乳液聚合法合成的环氧树脂自修复微胶囊及其制备方法。The invention relates to the technical field of composite materials with self-healing function, more specifically, the invention relates to epoxy resin self-healing microcapsules synthesized by emulsion polymerization and a preparation method thereof.
背景技术Background technique
自修复功能的复合材料的概念首先由美国军方于20世纪80年代中期提出。最早的自修复系统是对动物血管网络的简单模拟,将空心玻璃纤维埋入混凝土中,纤维内注入缩醛高分子溶液作为粘接剂。由于空心纤维网络系统制造方法上的难点,该技术很难实现自动化制备,因此难于进入工业应用。The concept of self-healing composite materials was first proposed by the US military in the mid-1980s. The earliest self-healing system was a simple simulation of the animal vascular network. Hollow glass fibers were embedded in concrete, and acetal polymer solution was injected into the fibers as an adhesive. Due to the difficulties in the manufacturing method of the hollow fiber network system, this technology is difficult to realize automatic preparation, so it is difficult to enter into industrial application.
目前国内外研究最多的自修复微胶囊是以聚脲甲醛包覆DCPD(双环戊二烯)单体合成的微胶囊体系。美国伊利诺斯州大学的J.S.Moore和Scottos N.R.等人(参见文献资料1-3)从上个世纪90年代中期以来一直致力于自修复技术的研究。该技术以金属钌配合物Grubbs作催化剂在环氧基质的缺陷区域引发微米尺寸的微胶囊(胶囊壁材是脲醛树脂)破裂释放出DCPD,后者发生活性开环聚合反应,达到自修复的效果。然而,上述以DCPD微胶囊为关键组分的自修复体系存在以下缺点:Grubbs催化剂价格高;不稳定,在高于120℃时易分解,且在合成过程中易受环氧树脂固化剂胺类的影响而减弱催化效率;虽然DCPD微胶囊在室温成型的聚合物基复合材料修复中已经取得了良好的效果,但由于DCPD存在α和β两种异构体(凝聚点分别为19.5℃和33℃),所以DCPD不适用于低温下使用的复合材料的自修复;DCPD聚合反应产物的力学性能较低;在传统的制备脲醛树脂壁材的过程中,主原料为甲醛,后者的致畸性以及毒性已被证实,因此制备低甲醛或者无甲醛的相变微胶囊是非常必要的。此外,日本东北大学三桥博三教授等(文献资料4)将内含粘接剂的空心胶囊掺入混凝土材料中,一旦混凝土在外力作用下发生开裂,部分胶囊破裂,粘接液流入裂纹,粘接液可使混凝土裂纹重新愈合。然而,这种空心胶囊尺寸较大(2-35mm)且不均匀,不利于胶囊与基体复合,从而对基体力学强度有很大影响。At present, the most researched self-healing microcapsules at home and abroad are microcapsule systems synthesized by coating DCPD (dicyclopentadiene) monomer with polyurea formaldehyde. J.S.Moore and Scottos N.R. of the University of Illinois in the United States (see literature 1-3) have been working on the research of self-repair technology since the mid-1990s. This technology uses metal ruthenium complex Grubbs as a catalyst to cause micron-sized microcapsules (capsule wall material is urea-formaldehyde resin) to rupture in the defect area of the epoxy matrix to release DCPD, which undergoes active ring-opening polymerization to achieve self-healing effect . However, the above-mentioned self-healing system with DCPD microcapsules as the key component has the following disadvantages: the price of Grubbs catalyst is high; it is unstable and easy to decompose when it is higher than 120 ° C, and it is susceptible to epoxy resin curing agent amines during the synthesis process. The influence of DCPD weakens the catalytic efficiency; although DCPD microcapsules have achieved good results in the repair of polymer matrix composites formed at room temperature, there are two isomers of α and β in DCPD (condensation points are 19.5°C and 33°C, respectively ℃), so DCPD is not suitable for self-healing of composite materials used at low temperatures; the mechanical properties of DCPD polymerization reaction products are low; in the traditional process of preparing urea-formaldehyde resin wall materials, the main raw material is formaldehyde, and the teratogenicity of the latter Sexuality and toxicity have been confirmed, so it is very necessary to prepare low-formaldehyde or formaldehyde-free phase-change microcapsules. In addition, Professor Hirozo Mihashi of Tohoku University in Japan (document 4) mixed hollow capsules containing adhesives into concrete materials. Once the concrete cracked under the action of external force, part of the capsules ruptured, and the adhesive liquid flowed into the cracks. The bonding fluid can re-heal concrete cracks. However, the size of the hollow capsule is large (2-35mm) and uneven, which is not conducive to the combination of the capsule and the matrix, which has a great impact on the mechanical strength of the matrix.
参考文献资料:Reference materials:
非专利文献资料1:Jones A.S.Rule J.D.和Moore J.S.等人,CatalystMorphology and Dissolution Kinetics of Self-Healing Polymers,Chem.Mater.2006;18:1312-1317Non-patent literature 1: Jones A.S.Rule J.D. and Moore J.S. et al., CatalystMorphology and Dissolution Kinetics of Self-Healing Polymers, Chem.Mater.2006; 18:1312-1317
非专利文献资料2:Keller M.W.,White S.R.和Sottos N.R.等,A Self-healingPoly(Dimethyl Siloxane)Elastomer,Adv.Funct.Mater.,2007;17:2399-2404Non-patent literature 2: Keller M.W., White S.R. and Sottos N.R., etc., A Self-healingPoly(Dimethyl Siloxane) Elastomer, Adv.Funct.Mater., 2007; 17:2399-2404
非专利文献资料3:Rule J.D.,Brown E.N.和Sottos N.R.,Wax-protectedCatalyst Microspheres for Efficient Self-healing Materials,Adv.Mater.,2005;17:205-208Non-patent literature 3: Rule J.D., Brown E.N. and Sottos N.R., Wax-protected Catalyst Microspheres for Efficient Self-healing Materials, Adv. Mater., 2005; 17:205-208
非专利文献资料4:张雄,习志臻,王胜先和姚武等,仿生自愈合混凝土的研究进展,混凝土,2001年;137:10-13Non-patent literature 4: Zhang Xiong, Xi Zhizhen, Wang Shengxian and Yao Wu, etc., Research Progress of Biomimetic Self-healing Concrete, Concrete, 2001; 137:10-13
发明内容Contents of the invention
本发明的目的是提供一种环氧树脂自修复微胶囊的制备方法,该方法通过剪切乳化可以控制自修复微胶囊的粒径,从而制得尺寸从几微米到近百微米且分布均匀的环氧树脂微胶囊,从而使得自修复微胶囊与基体材料之间的力学复合性稳定。The purpose of the present invention is to provide a preparation method of epoxy resin self-healing microcapsules, which can control the particle size of self-healing microcapsules through shear emulsification, so as to obtain uniformly distributed microcapsules with a size from a few microns to nearly a hundred microns. Epoxy resin microcapsules, so that the mechanical composite between the self-healing microcapsules and the matrix material is stable.
本发明的进一步目的是提供一种环氧树脂自修复微胶囊的制备方法,该方法采用无机纳米颗粒作为乳化剂并且通过乳液聚合法来制备环氧树脂自修复微胶囊;与采用分子型乳化剂的方法相比,该方法无需后续去除乳化剂的过程,所以该方法的工艺简单、成本低且对环境无污染。A further object of the present invention is to provide a preparation method of epoxy resin self-repairing microcapsules, which uses inorganic nanoparticles as emulsifier and prepares epoxy resin self-repairing microcapsules by emulsion polymerization; and adopts molecular type emulsifier Compared with the method, this method does not need the subsequent process of removing the emulsifier, so the method has simple process, low cost and no pollution to the environment.
本发明的进一步目的是提供一种稳定性和密闭性优良、包覆率高的微米级环氧树脂自修复微胶囊。A further object of the present invention is to provide a micron-sized epoxy resin self-healing microcapsule with excellent stability and airtightness and high coverage.
上述发明目的是通过以下技术方案来实现的:Above-mentioned invention purpose is realized by following technical scheme:
根据本发明的一个方面,提供一种制备环氧树脂自修复微胶囊的方法,包括:According to one aspect of the present invention, there is provided a method for preparing epoxy resin self-repairing microcapsules, comprising:
a)将纳米无机物颗粒加入到水中并将其分散,以获得的分散液作为水相;a) adding the nano-inorganic particles into water and dispersing them, so that the obtained dispersion is used as an aqueous phase;
b)将环氧树脂、单烯烃类单体、多烯烃类交联剂和引发剂混合均匀,以获得的混合液作为油相;b) Mix the epoxy resin, monoolefinic monomer, polyolefinic crosslinking agent and initiator uniformly, so that the obtained mixed solution is used as the oil phase;
c)将水相和油相混合,并进行搅拌以形成稳定的水包油乳液;以及c) mixing the water and oil phases and stirring to form a stable oil-in-water emulsion; and
d)加热所述乳液使其进行乳液聚合,形成以环氧树脂为芯材、以单烯烃类单体与多烯烃类交联剂共聚的聚合物作为壁材的自修复环氧树脂微胶囊。d) heating the emulsion to carry out emulsion polymerization to form self-healing epoxy resin microcapsules with epoxy resin as the core material and polymers copolymerized with monoolefin monomers and polyolefin crosslinking agents as wall materials.
进一步,所述方法优选包括e)将步骤d)获得的含环氧树脂自修复微胶囊的液体进行喷雾干燥,以得到环氧树脂自修复微胶囊的干粉。Further, the method preferably includes e) spray-drying the liquid containing epoxy resin self-healing microcapsules obtained in step d), so as to obtain a dry powder of epoxy resin self-healing microcapsules.
根据本发明的另一个方面,提供一种环氧树脂自修复微胶囊,所述微胶囊以环氧树脂为芯材,以一种或多种单烯烃类单体聚合且经多烯烃类交联剂交联而成的聚合物为壳部,其中,所述环氧树脂自修复微胶囊是通过上述方法来制备的。According to another aspect of the present invention, there is provided an epoxy resin self-healing microcapsule, the microcapsule uses epoxy resin as a core material, is polymerized with one or more monoolefin monomers and is crosslinked by multiolefins The polymer cross-linked by the agent is the shell part, wherein the epoxy resin self-healing microcapsules are prepared by the above method.
根据本发明的环氧树脂自修复微胶囊的制备方法具有普适性,可以制备一系列不同芯材和壁材的自修复微胶囊,且自修复微胶囊的组成和壳层可控。例如,该方法可用于多种环氧树脂作为芯材,例如,双酚A型树脂E51和酚醛环氧树脂F44等,以各种聚合物为壁材,例如,聚丙烯腈和聚甲基丙烯酸甲酯等,从而获得不同组成和性能的自修复微胶囊。此外,本发明的方法工艺简单,可以一步法合成,且制备的微胶囊的稳定性和密闭性优良、绿色无污染。本发明的方法剪切乳化可以控制自修复微胶囊的粒径,从而制得尺寸从几微米到近百微米且分布均匀的环氧树脂微胶囊,该胶囊可以与基体材料较好的复合而无脆裂,对基体力学性能影响小。The preparation method of the epoxy resin self-healing microcapsules according to the present invention has universality, can prepare a series of self-healing microcapsules with different core materials and wall materials, and the composition and shell layer of the self-healing microcapsules are controllable. For example, this method can be used for a variety of epoxy resins as core materials, such as bisphenol A type resin E51 and novolak epoxy resin F44, etc., with various polymers as wall materials, such as polyacrylonitrile and polymethacrylic acid Methyl ester, etc., so as to obtain self-healing microcapsules with different compositions and properties. In addition, the method of the invention has a simple process and can be synthesized in one step, and the prepared microcapsules have excellent stability and airtightness, and are green and pollution-free. The shear emulsification of the method of the present invention can control the particle diameter of the self-healing microcapsules, thereby producing epoxy resin microcapsules with a size from a few microns to nearly a hundred microns and uniform distribution, and the capsules can be better compounded with the matrix material without Brittle cracking has little effect on the mechanical properties of the matrix.
附图说明Description of drawings
图1是实施例1所制备的环氧树脂自修复微胶囊的扫描电镜(SEM)图;Fig. 1 is the scanning electron microscope (SEM) picture of the epoxy resin self-healing microcapsule prepared in embodiment 1;
图2是实施例1所制备的环氧树脂自修复微胶囊的透射电镜(TEM)图;Fig. 2 is the transmission electron microscope (TEM) picture of the epoxy resin self-healing microcapsule prepared in embodiment 1;
图3是实施例1所制备的环氧树脂自修复微胶囊的红外光谱(IR)图;Fig. 3 is the infrared spectrum (IR) figure of the epoxy resin self-healing microcapsule prepared in embodiment 1;
图4是实施例1所制备的环氧树脂自修复微胶囊的热失重(TGA)曲线图;Fig. 4 is the thermal weight loss (TGA) curve diagram of the epoxy resin self-healing microcapsule prepared in embodiment 1;
图5是根据本发明的制备环氧树脂自修复微胶囊方法的工艺流程图。Fig. 5 is a process flow diagram of the method for preparing epoxy resin self-healing microcapsules according to the present invention.
具体实施方式detailed description
以下具体详细地描述本发明的具体实施方式。Specific embodiments of the present invention are described in detail below.
根据本发明的一个方面,提供一种制备环氧树脂自修复微胶囊的方法,其包括:a)将纳米无机物颗粒加入到水中并将其分散,以获得的分散液作为水相;b)将环氧树脂、单烯烃类单体、多烯烃类交联剂和引发剂混合均匀,以获得的混合液作为油相;c)将水相和油相混合,并进行搅拌以形成稳定的水包油乳液;以及d)加热所述乳液使其进行乳液聚合,形成以环氧树脂为芯材、以单烯烃类单体与多烯烃类交联剂共聚的聚合物作为壁材的自修复环氧树脂微胶囊。According to one aspect of the present invention, there is provided a method for preparing epoxy resin self-healing microcapsules, which includes: a) adding nano-inorganic particles into water and dispersing them, so that the obtained dispersion is used as the water phase; b) Mix the epoxy resin, monoolefinic monomer, multiolefinic crosslinking agent and initiator uniformly to obtain the mixed solution as the oil phase; c) mix the water phase and the oil phase and stir to form a stable water an oil-in-emulsion; and d) heating the emulsion to carry out emulsion polymerization to form a self-healing ring with epoxy resin as the core material and a polymer copolymerized with monoolefin monomer and polyolefin crosslinking agent as the wall material Oxygen resin microcapsules.
进一步地,所述方法还包括e)将步骤d)获得的含环氧树脂自修复微胶囊的液体进行喷雾干燥,以得到环氧树脂自修复微胶囊的干粉。优选地,所述的干燥步骤可以通过其它常用的干燥方法,只要该干燥方法不破坏微胶囊的结构和组成即可。例如,可以采用低温烘干或者自然晾干等方法。Further, the method further includes e) spray-drying the liquid containing epoxy resin self-healing microcapsules obtained in step d), so as to obtain dry powder of epoxy resin self-healing microcapsules. Preferably, the drying step can be performed by other common drying methods, as long as the drying method does not destroy the structure and composition of the microcapsules. For example, low-temperature drying or natural drying may be used.
在本发明方法中所使用的纳米无机物可以是任何化学性质稳定的无机物颗粒。例如,所述纳米无机物颗粒乳化剂可以蒙脱土、锂藻土、碳化硅、二氧化硅、硫酸钡、碳酸钙、氧化铁或二氧化钛,可以使用其中的一种或多种。优选使用锂藻土和碳化硅中的至少一种。The nano-inorganic used in the method of the present invention can be any chemically stable inorganic particle. For example, the emulsifier of nano inorganic particles can be montmorillonite, lithium algae, silicon carbide, silicon dioxide, barium sulfate, calcium carbonate, iron oxide or titanium dioxide, one or more of which can be used. It is preferable to use at least one of lithium celite and silicon carbide.
进一步地,优选所述纳米无机物颗粒乳化剂的平均颗粒尺寸为1nm~1000nm,优选为20nm~800μm,更优选为80-700nm,最优选为100-600nm。Further, preferably, the average particle size of the nano-inorganic particle emulsifier is 1 nm to 1000 nm, preferably 20 nm to 800 μm, more preferably 80-700 nm, most preferably 100-600 nm.
进一步地,优选所述单烯烃类单体选自苯乙烯、甲基苯乙烯、甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸丁酯、甲基丙烯酸叔丁酯、丙烯酸甲酯、丙烯酸乙酯、丙烯酸丁酯、丙烯酸叔丁酯和丙烯酸异辛酸酯中的一种或多种。优选地,所述单烯烃类单体的量相对于环氧树脂材料为20~80重量%。Further, it is preferred that the monoolefinic monomer is selected from the group consisting of styrene, methylstyrene, methyl methacrylate, ethyl methacrylate, butyl methacrylate, tert-butyl methacrylate, methyl acrylate, One or more of ethyl acrylate, butyl acrylate, tert-butyl acrylate and isooctyl acrylate. Preferably, the amount of the monoolefinic monomer is 20-80% by weight relative to the epoxy resin material.
进一步地,所述多烯烃类交联剂优选选自二乙烯基苯、二甲基丙烯酸乙二醇酯、二甲基丙稀酸丙二醇酯、二甲基丙烯酸丁二醇酯和二甲基丙烯酸己二醇酯中的一种或多种。所述多烯烃类交联剂的量相对于所述环氧树脂材料优选为5~80重量%。Further, the multiolefin crosslinking agent is preferably selected from divinylbenzene, ethylene glycol dimethacrylate, propylene glycol dimethacrylate, butylene glycol dimethacrylate and dimethacrylic acid One or more of hexanediol esters. The amount of the polyene-based crosslinking agent is preferably 5 to 80% by weight relative to the epoxy resin material.
进一步地,所述引发剂为偶氮二异丁腈、偶氮二异庚腈、过氧化苯甲酰或过硫酸钾。更优选为偶氮二异丁腈。Further, the initiator is azobisisobutyronitrile, azobisisoheptanonitrile, benzoyl peroxide or potassium persulfate. More preferred is azobisisobutyronitrile.
进一步地,在油相与水相混合之前加热油相组分使其达到60℃的温度,从而使得油相各组分混合均匀。优选地,将油相与水相混合后,使用高速搅拌机进行剪切搅拌,从而形成稳定的水包油乳液。Further, before the oil phase is mixed with the water phase, the components of the oil phase are heated to a temperature of 60° C., so that the components of the oil phase are mixed evenly. Preferably, after mixing the oil phase and the water phase, a high-speed mixer is used for shearing and stirring, thereby forming a stable oil-in-water emulsion.
进一步地,将油相与水相的混合物加热至70℃以上以进行所述聚合反应。Further, the mixture of the oil phase and the water phase is heated to above 70° C. to carry out the polymerization reaction.
进一步地,所述单烯烃类单体是苯乙烯,所述多烯烃类交联剂是二乙烯苯,且所述交联剂是偶氮二异丁腈。Further, the monoolefinic monomer is styrene, the polyolefinic crosslinking agent is divinylbenzene, and the crosslinking agent is azobisisobutyronitrile.
进一步地,所述环氧树脂是双酚A型树脂E51和酚醛环氧树脂F44中的至少一种。Further, the epoxy resin is at least one of bisphenol A resin E51 and novolak epoxy resin F44.
根据本发明的另一方面,提供一种环氧树脂自修复微胶囊,所述微胶囊以环氧树脂为芯材,以一种或多种单烯烃类单体聚合且经多烯烃类交联剂交联而成的聚合物为壳部,其中,所述环氧树脂自修复微胶囊是通过上述方法来制备的。According to another aspect of the present invention, an epoxy resin self-healing microcapsule is provided, the microcapsule uses epoxy resin as a core material, is polymerized with one or more monoolefin monomers and is crosslinked by multiolefins The polymer cross-linked by the agent is the shell part, wherein the epoxy resin self-healing microcapsules are prepared by the above method.
进一步地,所制备的环氧树脂自修复微胶囊的粒径为0.1~1000μm,优选为1~50μm。Further, the prepared epoxy resin self-healing microcapsules have a particle size of 0.1-1000 μm, preferably 1-50 μm.
根据本发明的环氧树脂自修复微胶囊的制备方法具有普适性,可以制备一系列不同芯材和壁材的自修复微胶囊,且自修复微胶囊的组成和壳层可控。例如,该方法可用于多种环氧树脂作为芯材,例如,双酚A型树脂E51和酚醛环氧树脂F44等,以各种聚合物为壁材,例如,聚丙烯腈和聚甲基丙烯酸甲酯等,从而获得不同组成和性能的自修复微胶囊。此外,本发明的方法工艺简单,可以一步法合成,且制备的微胶囊的稳定性和密闭性优良、绿色无污染。本发明的方法剪切乳化可以控制自修复微胶囊的粒径,从而制得微米级尺寸且分布均匀的环氧树脂微胶囊,该胶囊可以与基体材料较好的复合而无脆裂,对基体力学性能影响小。The preparation method of the epoxy resin self-healing microcapsules according to the present invention has universality, can prepare a series of self-healing microcapsules with different core materials and wall materials, and the composition and shell layer of the self-healing microcapsules are controllable. For example, this method can be used for a variety of epoxy resins as core materials, such as bisphenol A type resin E51 and novolak epoxy resin F44, etc., with various polymers as wall materials, such as polyacrylonitrile and polymethacrylic acid Methyl ester, etc., so as to obtain self-healing microcapsules with different compositions and properties. In addition, the method of the invention has a simple process and can be synthesized in one step, and the prepared microcapsules have excellent stability and airtightness, and are green and pollution-free. The shear emulsification of the method of the present invention can control the particle diameter of the self-healing microcapsules, thereby producing micron-sized and evenly distributed epoxy resin microcapsules, which can be better compounded with the matrix material without embrittlement, and have no impact on the matrix. The mechanical properties are less affected.
实施例Example
下面结合具体实施例,进一步阐述本发明。应当理解这些实施例仅用于说明本发明而不用于限制本发明的保护范围。此外,在阅读了本发明所公开或者教导的内容之后,本领域技术人员可以对本发明做各种修改和/或改进,这些修改或者改进的形式都同样落于本发明的权利要求书所限定的范围内。再次,下述实施例中所使用的实验方法如无特殊说明,均为常规方法;下述实例中所用的材料、试剂等,如无特殊说明,均可从商业途径得到。Below in conjunction with specific embodiment, further illustrate the present invention. It should be understood that these examples are only used to illustrate the present invention and are not intended to limit the protection scope of the present invention. In addition, after reading the content disclosed or taught in the present invention, those skilled in the art can make various modifications and/or improvements to the present invention, and these modifications or improved forms all fall within the scope of the claims of the present invention. within range. Again, the experimental methods used in the following examples are conventional methods unless otherwise specified; the materials and reagents used in the following examples can be obtained from commercial sources unless otherwise specified.
实施例1Example 1
将0.5 g锂藻土颗粒(购买自洛克伍德(Rockwood)公司,平均粒径为105nm,最大粒径为500 nm,最小粒径20 nm)加入到100 g水中,得到分散液作为水相。将1.0g双酚A型环氧树脂E51(购买自蓝星新材料公司)、0.5g油溶性单体苯乙烯(St)、0.5g油溶性交联剂二乙烯基苯(DVB)、0.5g苯乙烯和0.002g引发剂偶氮二异丁腈(AIBN)混合,以该混合液作为油相。将所述水相、油相分别放入70℃烘箱加热20分钟和3分钟进行预热,搅拌使油相各组分混合均匀(其中环氧树脂E51与单体和交联剂的总质量的质量比为1:1,二乙烯基苯与苯乙烯质量比1:1)。将水相和油相混合,采用12000rpm转速下高速剪切30秒,得到稳定的水包油乳液。Add 0.5 g of hectorite particles (purchased from Rockwood, with an average particle size of 105 nm, a maximum particle size of 500 nm, and a minimum particle size of 20 nm) into 100 g of water to obtain a dispersion as the water phase. Mix 1.0g of bisphenol A type epoxy resin E51 (purchased from Bluestar New Material Company), 0.5g of oil-soluble monomer styrene (St), 0.5g of oil-soluble crosslinking agent divinylbenzene (DVB), 0.5g Styrene and 0.002 g of initiator azobisisobutyronitrile (AIBN) were mixed, and the mixed liquid was used as an oil phase. Put the water phase and the oil phase into a 70°C oven to heat for 20 minutes and 3 minutes respectively for preheating, and stir to mix the components of the oil phase evenly (the total mass of epoxy resin E51 and monomer and crosslinking agent The mass ratio is 1:1, the mass ratio of divinylbenzene to styrene is 1:1). The water phase and the oil phase are mixed, and a stable oil-in-water emulsion is obtained by high-speed shearing at a speed of 12,000 rpm for 30 seconds.
将该乳液体系转移至提前预热至70℃的反应釜,通入惰性气体氮气,转速为300rpm下机械搅拌,70℃聚合反应12小时。随着聚合反应的进行,二乙烯基苯和苯乙烯开始发生共聚反应,在相分离的作用下,单体和低分子预聚物从环氧树脂内部迁移至油水界面进一步聚合,形成核-壳的自修复微胶囊。具体过程可以参见图5所示的。通过喷雾干燥法干燥得到自修复微胶囊的干粉。The emulsion system was transferred to a reaction kettle preheated to 70°C in advance, an inert gas nitrogen was introduced, mechanical stirring was performed at a rotation speed of 300 rpm, and polymerization was carried out at 70°C for 12 hours. As the polymerization reaction proceeds, divinylbenzene and styrene begin to undergo copolymerization reaction, and under the action of phase separation, monomers and low molecular prepolymers migrate from the interior of the epoxy resin to the oil-water interface for further polymerization to form a core-shell self-healing microcapsules. The specific process can be referred to as shown in FIG. 5 . The dry powder of the self-healing microcapsules is obtained by spray drying.
对上述制备的自修复微胶囊进行扫描电镜照片观察,如图1所示。由图1可以看出:环氧树脂自修复微胶囊的尺寸均匀,平均粒径大约为10.0μm左右。红外光谱分析结果如图2所示。图2是所制备的微胶囊的透射电镜图片,可以看出所制备的环氧树脂自修复微胶囊的密闭性优良。进一步地,由图3可以看出:环氧树脂的-C-O-C-的伸缩振动峰(1250-780cm-1)以及DVB和St的共聚物中的苯环骨架振动峰(1600-1450cm-1三条谱带)清晰可见。进一步地热重分析(TGA)测试结果如图4所示,由图4可以看出:芯材双酚A型环氧树脂E51完全分解温度为330℃左右,壁材DVB和St共聚物的完全分解温度为450℃左右。The self-healing microcapsules prepared above were observed by scanning electron microscope, as shown in FIG. 1 . It can be seen from Figure 1 that the size of the epoxy resin self-healing microcapsules is uniform, and the average particle size is about 10.0 μm. The results of infrared spectroscopy analysis are shown in Figure 2. Figure 2 is a transmission electron microscope picture of the prepared microcapsules, it can be seen that the prepared epoxy resin self-repairing microcapsules have excellent airtightness. Further, it can be seen from Figure 3: the -COC- stretching vibration peak of epoxy resin (1250-780cm -1 ) and the benzene ring skeleton vibration peak in the copolymer of DVB and St (1600-1450cm -1 three spectrum band) is clearly visible. Further thermogravimetric analysis (TGA) test results are shown in Figure 4. It can be seen from Figure 4 that the complete decomposition temperature of the core material bisphenol A epoxy resin E51 is about 330°C, and the complete decomposition temperature of the wall material DVB and St copolymer The temperature is about 450°C.
此外,由图5可知:所制备的环氧树脂自修复微胶囊的包覆率高达87%。In addition, it can be seen from Figure 5 that the coating rate of the prepared epoxy resin self-healing microcapsules is as high as 87%.
将喷雾干燥后得到的微胶囊干粉放置30天后,检测微胶囊外表面所存在的双酚A型环氧树脂E51的量,发现其含量基本没有变化,这反映出本实施例所制备的环氧树脂自修复微胶囊的密闭性和稳定性优良。After the microcapsule dry powder obtained after spray drying was placed for 30 days, the amount of bisphenol A epoxy resin E51 existing on the outer surface of the microcapsule was detected, and it was found that its content did not change substantially, which reflected that the epoxy resin E51 prepared in this example The resin self-healing microcapsules have excellent airtightness and stability.
实施例2Example 2
将0.5g碳化硅颗粒(购买自国药集团化学试剂有限公司,平均粒径为80nm,最小粒径为5nm,最大粒径为230nm)和0.2g过硫酸钾(1%KPS)的水溶液加入到100g水中,获得分散液作为水相。将0.1g油溶性交联剂乙二醇二(甲基丙烯酸)酯(EGDMA)和0.1g油溶性单体甲基丙烯酸甲酯(MMA)、以及1.0g双酚A型环氧树脂E51混合,以此混合液作为油相。将所述水相、油相分别放入70℃烘箱加热20分钟和3分钟进行预热,搅拌使油相各组分混合均匀(其中环氧树脂E51与单体和交联剂的总质量的质量比为5:1,甲基丙烯酸甲酯与乙二醇二(甲基丙烯酸)酯质量比1:1)。将水相和油相混合,采用1200rpm转速下高速剪切30秒,得到稳定的水包油乳液。An aqueous solution of 0.5 g of silicon carbide particles (purchased from Sinopharm Chemical Reagent Co., Ltd., with an average particle size of 80 nm, a minimum particle size of 5 nm, and a maximum particle size of 230 nm) and 0.2 g of potassium persulfate (1% KPS) was added to 100 g In water, a dispersion was obtained as an aqueous phase. Mix 0.1g oil-soluble crosslinking agent ethylene glycol di(methacrylate) ester (EGDMA), 0.1g oil-soluble monomer methyl methacrylate (MMA), and 1.0g bisphenol A epoxy resin E51, This mixed solution was used as the oil phase. Put the water phase and the oil phase into a 70°C oven to heat for 20 minutes and 3 minutes respectively for preheating, and stir to mix the components of the oil phase evenly (the total mass of epoxy resin E51 and monomer and crosslinking agent The mass ratio is 5:1, and the mass ratio of methyl methacrylate to ethylene glycol di(methacrylate) ester is 1:1). The water phase and the oil phase are mixed, and a stable oil-in-water emulsion is obtained by high-speed shearing at 1200 rpm for 30 seconds.
将该乳液体系转移至提前预热至70℃的反应釜,通入惰性气体氮气,转速为300rpm下机械搅拌,70℃聚合反应12小时。随着聚合反应的进行,甲基丙烯酸甲酯和乙二醇二(甲基丙烯酸)酯开始发生共聚反应,在相分离的作用下,单体和低分子预聚物从环氧树脂内部迁移至油水界面进一步聚合,从而形成核-壳的自修复微胶囊。具体过程可以参见图5所示的。此微胶囊乳液可用喷雾干燥法干燥得到自修复微胶囊的干粉。The emulsion system was transferred to a reaction kettle preheated to 70°C in advance, an inert gas nitrogen was introduced, mechanical stirring was performed at a rotation speed of 300 rpm, and polymerization was carried out at 70°C for 12 hours. As the polymerization reaction proceeds, methyl methacrylate and ethylene glycol di(methacrylate) start to undergo a copolymerization reaction, and under the action of phase separation, monomers and low-molecular prepolymers migrate from the interior of the epoxy resin to The oil-water interface is further aggregated to form core-shell self-healing microcapsules. The specific process can be referred to as shown in FIG. 5 . The microcapsule emulsion can be dried by a spray drying method to obtain a dry powder of the self-repairing microcapsule.
对上述制备的自修复微胶囊进行扫描电镜和透射电镜图片观察、红外光谱分析以及热重分析,其测试结果表明:环氧树脂自修复微胶囊的尺寸均匀,平局颗粒尺寸大约为20.30μm左右。红外光谱分析和热重分析结果类似于实施例1所述的测试结果。The self-healing microcapsules prepared above were observed by scanning electron microscope and transmission electron microscope, infrared spectrum analysis and thermogravimetric analysis. The test results showed that the epoxy resin self-healing microcapsules were uniform in size, and the average particle size was about 20.30 μm. The results of infrared spectroscopic analysis and thermogravimetric analysis are similar to the test results described in Example 1.
此外,经测试本实施例所制备的环氧树脂自修复微胶囊的包覆率高达89%,密闭性和稳定性测试结果如同实施例1的测试结果,也都为优良。In addition, the coating rate of the epoxy resin self-healing microcapsules prepared in this example is as high as 89%, and the test results of airtightness and stability are the same as those in Example 1, which are also excellent.
实施例3Example 3
将0.5g锂藻土颗粒(购买自洛克伍德(Rockwood)公司,平均粒径为105nm,最大粒径为500nm,最小粒径20nm)和0.2g引发剂偶氮二异丁腈(AIBN)加入到100g水中,得到分散液作为水相。将1.0g双酚A型环氧树脂F44(购买自蓝星新材料公司)购自上海树脂厂、0.1g油溶性交联剂二乙烯基苯(DVB)和0.1g苯乙烯(St)混合,以该混合液作为油相。将所述水相、油相分别放入70℃烘箱加热20分钟和5分钟进行预热,搅拌使油相各组分混合均匀(其中环氧树脂F44与单体总质量的质量比为5:1,二乙烯基苯与苯乙烯质量比1:1)。将上述制备的水相和油相相混合,并且升温至70℃,采用高速搅拌机在9000转/分的转速下搅拌乳化30秒,得到水包油的乳液。Add 0.5 g of lithium diatomaceous earth particles (purchased from Rockwood (Rockwood) company, with an average particle size of 105 nm, a maximum particle size of 500 nm, and a minimum particle size of 20 nm) and 0.2 g of initiator azobisisobutyronitrile (AIBN) into the 100 g of water to obtain a dispersion as an aqueous phase. Mix 1.0g bisphenol A type epoxy resin F44 (purchased from Blue Star New Material Company) from Shanghai Resin Factory, 0.1g oil-soluble crosslinking agent divinylbenzene (DVB) and 0.1g styrene (St), This mixed solution was used as an oil phase. Put the water phase and the oil phase into a 70°C oven to heat for 20 minutes and 5 minutes respectively for preheating, and stir to mix the components of the oil phase evenly (wherein the mass ratio of epoxy resin F44 to the total mass of monomers is 5: 1. The mass ratio of divinylbenzene to styrene is 1:1). The water phase and oil phase prepared above were mixed, and the temperature was raised to 70° C., and a high-speed mixer was used to stir and emulsify at a speed of 9000 rpm for 30 seconds to obtain an oil-in-water emulsion.
将该乳液体系转移至提前预热至70℃的反应釜,通入惰性气体氮气,转速为300rpm下机械搅拌,70℃下聚合反应12小时。随着聚合反应的进行,二乙烯基苯和苯乙烯开始发生共聚反应,在相分离的作用下,单体和低分子预聚物从环氧树脂内部迁移至油水界面进一步聚合,形成核-壳的自修复微胶囊,具体过程可以参见图5所示的。。通过喷雾干燥法干燥得到自修复微胶囊的干粉。The emulsion system was transferred to a reaction kettle preheated to 70°C in advance, an inert gas nitrogen was introduced, mechanical stirring was performed at a rotation speed of 300 rpm, and polymerization was carried out at 70°C for 12 hours. As the polymerization reaction proceeds, divinylbenzene and styrene begin to undergo copolymerization reaction, and under the action of phase separation, monomers and low molecular prepolymers migrate from the interior of the epoxy resin to the oil-water interface for further polymerization to form a core-shell self-healing microcapsules, the specific process can be referred to as shown in Figure 5. . The dry powder of the self-healing microcapsules is obtained by spray drying.
对上述制备的自修复微胶囊进行扫描电镜照片观察、红外光谱分析以及热重分析,其测试结果表明:环氧树脂自修复微胶囊的尺寸均匀,平均粒径约为25.1μm左右。红外光谱分析和热重分析结果类似于实施例1所述的测试结果。Scanning electron microscope photo observation, infrared spectrum analysis and thermogravimetric analysis were carried out on the self-healing microcapsules prepared above, and the test results showed that the epoxy resin self-healing microcapsules were uniform in size, with an average particle size of about 25.1 μm. The results of infrared spectroscopic analysis and thermogravimetric analysis are similar to the test results described in Example 1.
此外,经测试本实施例所制备的环氧树脂自修复微胶囊的包覆率高达87.5%,密闭性和稳定性测试结果如同实施例1的测试结果,也都为优良。In addition, the coverage rate of the epoxy resin self-healing microcapsules prepared in this example is as high as 87.5%, and the test results of airtightness and stability are the same as the test results of Example 1, which are also excellent.
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CN1560096A (en) * | 2004-03-12 | 2005-01-05 | 清华大学 | Preparation method of carboxyl functional cross-linked core-shell nano-polymer microspheres |
CN101745352A (en) * | 2009-12-15 | 2010-06-23 | 中国科学院化学研究所 | Superhydrophobic surface material and special nano-particles thereof with core-shell structures |
CN102698669A (en) * | 2012-05-07 | 2012-10-03 | 中国人民解放军装甲兵工程学院 | Method for preparing organic nanometer rubber particle enhanced epoxy resin self-repairing microcapsule |
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