CN104619113B - Circuit board and air conditioner - Google Patents
Circuit board and air conditioner Download PDFInfo
- Publication number
- CN104619113B CN104619113B CN201510039030.8A CN201510039030A CN104619113B CN 104619113 B CN104619113 B CN 104619113B CN 201510039030 A CN201510039030 A CN 201510039030A CN 104619113 B CN104619113 B CN 104619113B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- plate body
- radiator
- power device
- felt pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a circuit board and an air conditioner. The circuit board includes: a plate body (1); the power devices (3) are arranged on the board body (1), and insulating pads (2) enabling the power devices (3) to have the same height are arranged between at least part of the power devices (3) and the board body (1); and a heat sink (4) disposed on a side of the plurality of power devices (3) remote from the plate body (1). According to the circuit board, the problem that the heights of the power devices on the circuit board are inconsistent when the power devices are plugged in the prior art can be solved.
Description
Technical field
The present invention relates to circuit boards to lay technical field, in particular to a kind of circuit board and air conditioner.
Background technology
Power device will produce prodigious loss at work, these loss will by way of outwardly function of environment heat emission into
Row release, this just needs to conduct heat to external environment using radiator appropriate.
There are many deficiencies for the mounting structure of existing power device and radiator, such as：Each power device height is inconsistent
Cause the installation between radiator to coordinate inconvenient, influences heat dissipation effect；Between power device and circuit board due to electrical safety away from
Lead to short circuit phenomenon from too small；Beat during screw, due to artificially clamp undue force and caused by device inside damage；Absolutely
Caused by the damage of edge paster or area deficiency phenomena such as short circuit, sparking.
Invention content
A kind of circuit board is provided in the embodiment of the present invention, the power device that can be solved on circuit board in the prior art carries out
Height inconsistent problem when inserting.
In order to solve the above technical problems, the embodiment of the present invention provides a kind of circuit board, including：Plate body；Multiple power devices,
It is arranged on plate body, being at least partly provided between power device and plate body makes multiple power devices have mutually level insulation
Pad；Radiator is arranged in the side of the separate plate body of multiple power devices.
Preferably, being provided with the threaded hole for being connect with radiator and plate body on felt pad.
Preferably, multiple power devices include discrete device and integrated device, felt pad pad is located at discrete device and plate
Between body.
Preferably, being provided with whole insulation paster for isolating the two between multiple power devices and radiator.
Preferably, the side of insulation paster towards radiator is equipped with thermal grease.
Preferably, felt pad is chock.
According to another aspect of the present invention, a kind of air conditioner, including circuit board are provided, which is above-mentioned circuit
Plate.
It applies the technical scheme of the present invention, circuit board includes：Plate body；Multiple power devices are arranged on plate body, at least portion
Dividing to be provided between power device and plate body makes multiple power devices have mutually level felt pad；Radiator is arranged more
The side of the separate plate body of a power device.By the way that felt pad is arranged between power device and plate body, thus it is possible to vary each power
The height of device so that it is highly consistent when power device is inserted, good be engaged can be realized between radiator
Relationship improves the heat dissipation effect of circuit board.
Description of the drawings
Fig. 1 is the structural schematic diagram of the circuit board of the embodiment of the present invention；
Fig. 2 is that the circuit board of the embodiment of the present invention installs the element height design sketch after felt pad additional；
Fig. 3 is that the circuit board of the embodiment of the present invention removes the structural schematic diagram overlooked from plate body direction after plate body；
Fig. 4 is that the circuit board of the embodiment of the present invention removes the structural schematic diagram overlooked from radiator direction after radiator.
Reference sign：
1, plate body；2, felt pad；3, power device；4, radiator；5, threaded hole；6, discrete device；7, integrated device；8,
Insulate paster.
Specific implementation mode
Present invention is further described in detail in the following with reference to the drawings and specific embodiments, but not as the limit to the present invention
It is fixed.
Shown in Fig. 1 to Fig. 4, according to an embodiment of the invention, circuit board includes plate body 1, multiple power devices 3 and dissipates
Hot device 4.Plate body 1 is pcb board, and multiple power devices 3 are arranged on plate body 1, are at least partly set between power device 3 and plate body 1
Being equipped with makes multiple power devices 3 have mutually level felt pad 2, the high consistency for adjusting power device 3.Radiator
4 are arranged in the side of the separate plate body 1 of multiple power devices 3, for radiating to power device 3.
By the way that felt pad is arranged between power device 3 and plate body 1, thus it is possible to vary the height of each power device 3 so that institute
The power device 3 of radiator 4 in need, it is highly consistent when being inserted, good contact can be realized between radiator 4
Matching relationship improves the integral heat sink effect of circuit board, can also reduce circuit board with element height it is inconsistent caused by first device
Part damages problem, reduces the complexity of power device inserting, improves production efficiency, shortens the development cycle.
The threaded hole 5 for being connect with radiator 4 and plate body 1 is provided on felt pad 2, by with fixing devices such as screws
Radiator 4 and the clamping of plate body 1 can be fixed the power component being arranged between, without opening screw thread on power member device
Hole.Threaded hole is opened on felt pad 2, compared in the prior art beating screw on component, there is following benefit：It 1, can be to prevent
Only because when clamping power device 3 and radiator 4, undue force and caused by component and built-in electrical insulation device damage, carry
The yields of high circuit board；2, when occurring to cause component built-in electrical insulation device to damage because of undue force, due to felt pad 2
Insulation effect, can be very good to prevent component caused by due to component short circuit from burning, improve the safety that circuit board uses
Property；3, component damage probability can be reduced；Since power device 3 is arranged on felt pad 2, and threaded hole is opened in felt pad 2
On, the connection between power device 3 and radiator 4 can be realized by felt pad 2 so that the number of openings reduces by one times, saves
Production cost, reducing the time caused by due to device reason wastes.
Multiple power devices 3 include discrete device 6 and integrated device 7, the pad of felt pad 2 be located at discrete device 6 and plate body 1 it
Between.In conjunction with shown in Figure 2, since under normal circumstances, discrete device 6 has different height from integrated device 7, therefore is pacifying
When filling both devices, the height of integrated device 7 is higher so that discrete device 6, which can not be realized preferably between radiator 4, matches
It closes, influences the heat dissipation effect of discrete device 6.And after increasing felt pad 2 so that discrete device 6 has identical as integrated device 7
Height, can realize and contact between radiator together with integrated device 7, reduce power device inserting complexity, carry
High production efficiency, improves the heat dissipation performance of discrete device 6.
Multiple power devices 3 are provided with whole insulation paster 8 for isolating the two with radiator 4.In existing skill
In art, each power device 3 is attachment monolithic insulation paster, therefore during artificial attachment, easily occur paster deviate or
The phenomenon that damage, this can lead to that short circuit occurs between power device 3 and radiator 4, and then phenomena such as strike sparks, breaking-up device
Part；Can also be inadequate because of insulating paper paving area, the electrical distance of the pin distances radiator 4 of power device 3 is too small, on carrying out
When electrically operated, there is a phenomenon where striking sparks, the damage of device and circuit board is caused.
And be provided between multiple power devices 3 and radiator 4 whole insulation paster 8 isolating the two it
Afterwards, it since insulation paster 8 is integrally formed structure, is not susceptible to deviate during operation, and more easily operate,
The probability that insulation paster 8 damages is reduced, the insulation between power device 3 and radiator 4 can also be better achieved, so as to
Power device 3 and 4 short circuit of radiator caused by effectively prevent due to the paster 8 that insulate damages, are also prevented from
Because paving insulate paster 8 area it is inadequate, and caused by safe distance between device pin and radiator 4 it is too small, damage device
The problem of part and circuit board, improves safety and reliability when circuit board uses.
The side of insulation paster 8 towards radiator 4 is equipped with thermal grease, and the heat dissipation of radiator 4 can be further improved
Effect.
Preferably, felt pad 2 is chock.Chock should be selected with higher mechanical strength, good insulating properties, resistance to
It is hot, corrosion-resistant, and lower-cost material, can preferably it meet using needs.
According to an embodiment of the invention, air conditioner includes circuit board, which is above-mentioned circuit board.
Certainly, it is above the preferred embodiment of the present invention.It should be pointed out that for those skilled in the art
For, under the premise of not departing from general principles, several improvements and modifications can also be made, these improvements and modifications
It is considered as protection scope of the present invention.
Claims (2)
1. a kind of circuit board, which is characterized in that including：
Plate body (1)；
Multiple power devices (3) are arranged on the plate body (1), at least partly described power device (3) and the plate body (1)
Between be provided with make the multiple power device (3) have mutually level felt pad (2)；
Radiator (4) is arranged in the side far from the plate body (1) of the multiple power device (3)；
The threaded hole (5) for being connect with the radiator (4) and the plate body (1) is provided on the felt pad (2)；
The multiple power device (3) includes discrete device (6) and integrated device (7), and felt pad (2) pad is located at described point
It stands between device (6) and the plate body (1)；
Whole insulation paster for isolating the two is provided between the multiple power device (3) and the radiator (4)
(8)；
The side of insulation paster (8) towards the radiator (4) is equipped with thermal grease；
The felt pad (2) is chock.
2. a kind of air conditioner, including circuit board, which is characterized in that the circuit board is circuit board described in claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510039030.8A CN104619113B (en) | 2015-01-26 | 2015-01-26 | Circuit board and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510039030.8A CN104619113B (en) | 2015-01-26 | 2015-01-26 | Circuit board and air conditioner |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104619113A CN104619113A (en) | 2015-05-13 |
| CN104619113B true CN104619113B (en) | 2018-10-23 |
Family
ID=53153314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510039030.8A Active CN104619113B (en) | 2015-01-26 | 2015-01-26 | Circuit board and air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104619113B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111081661B (en) * | 2019-12-23 | 2021-05-25 | 珠海格力电器股份有限公司 | Heat dissipation structure based on power semiconductor device and mounting method |
| CN111696939A (en) * | 2020-06-22 | 2020-09-22 | 格力电器（芜湖）有限公司 | Radiator for power device and power device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201266607Y (en) * | 2008-09-10 | 2009-07-01 | 海尔集团公司 | Discrete power module |
| CN101720183A (en) * | 2008-12-12 | 2010-06-02 | 四川虹欧显示器件有限公司 | Heat radiating method for circuit board |
| CN103069930A (en) * | 2010-08-25 | 2013-04-24 | 罗伯特·博世有限公司 | Method for populating a circuit board with a plurality of components and electrical circuit having a circuit board and a plurality of components mounted thereon |
| CN103096636A (en) * | 2012-12-27 | 2013-05-08 | 华为技术有限公司 | Manufacture method and manufacture device of heat conduction structural component and heat conduction structural component |
| CN203951727U (en) * | 2014-07-15 | 2014-11-19 | 杭州华三通信技术有限公司 | A kind of bracing or strutting arrangement of radiator and there is its electronic installation |
| CN204482151U (en) * | 2015-01-26 | 2015-07-15 | 珠海格力电器股份有限公司 | Circuit board and air conditioner |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5467251A (en) * | 1993-10-08 | 1995-11-14 | Northern Telecom Limited | Printed circuit boards and heat sink structures |
-
2015
- 2015-01-26 CN CN201510039030.8A patent/CN104619113B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201266607Y (en) * | 2008-09-10 | 2009-07-01 | 海尔集团公司 | Discrete power module |
| CN101720183A (en) * | 2008-12-12 | 2010-06-02 | 四川虹欧显示器件有限公司 | Heat radiating method for circuit board |
| CN103069930A (en) * | 2010-08-25 | 2013-04-24 | 罗伯特·博世有限公司 | Method for populating a circuit board with a plurality of components and electrical circuit having a circuit board and a plurality of components mounted thereon |
| CN103096636A (en) * | 2012-12-27 | 2013-05-08 | 华为技术有限公司 | Manufacture method and manufacture device of heat conduction structural component and heat conduction structural component |
| CN203951727U (en) * | 2014-07-15 | 2014-11-19 | 杭州华三通信技术有限公司 | A kind of bracing or strutting arrangement of radiator and there is its electronic installation |
| CN204482151U (en) * | 2015-01-26 | 2015-07-15 | 珠海格力电器股份有限公司 | Circuit board and air conditioner |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104619113A (en) | 2015-05-13 |
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