CN104601137B - A kind of method and crystal oscillator for improving crystal oscillator shock resistance - Google Patents
A kind of method and crystal oscillator for improving crystal oscillator shock resistance Download PDFInfo
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- CN104601137B CN104601137B CN201410853811.6A CN201410853811A CN104601137B CN 104601137 B CN104601137 B CN 104601137B CN 201410853811 A CN201410853811 A CN 201410853811A CN 104601137 B CN104601137 B CN 104601137B
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- crystal
- wiring board
- crystal oscillator
- pin
- shock resistance
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- 239000013078 crystal Substances 0.000 title claims abstract description 138
- 230000035939 shock Effects 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000013016 damping Methods 0.000 description 11
- 229910000831 Steel Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- -1 sticky piece Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
Abstract
The present invention discloses a kind of method and crystal oscillator for improving crystal oscillator shock resistance, wherein the method for improving crystal oscillator shock resistance is：Pin, wiring board and crystal are provided, the crystal is fixed on the wiring board, the pin is connected with the wiring board, the part for being at least connected pin with wiring board is made of flexible circuit board (FPC).The part that pin is connected by the method for the raising crystal oscillator shock resistance of the present invention with wiring board is made of flexible circuit board (FPC), can be during crystal oscillator use, the vibrations being delivered on crystal are reduced by flex section, so as to improve the shock resistance of crystal, and then ensure that the performance of crystal is stablized, it is ensured that the service life of crystal.
Description
Technical field
The present invention relates to crystal oscillator technical field, more particularly to a kind of method for improving crystal oscillator shock resistance and crystal to shake
Swing device.
Background technology
Crystal oscillator (Crystal Oscillator) is widely used in different system at present, its main purpose
It is to provide the benchmark of system oscillation frequency.It is well known that quartz crystal is very fragile, and after being given a shock, quartz crystal chip
Frequency can change, it is serious to damage chip.In crystal oscillator industry, the common epoxy glass fiber wiring board of generally use comes
Circuit connection is done, quartz crystal is also mounted on the wiring board, and wiring board is connected with shell pin again, due to common epocel
Wiring board is rigid substrate wiring board, when crystal oscillator is subject to strong motion, the external force such as vibrations, centrifugation and impact that external environment condition produces
It can be directly transferred to by oscillating circuit board on crystal resonator, so as to cause the frequency stability variation or brilliant of crystal resonator
The wafer damaging repercussions in internal portion.
At present, Aseismic Design probably has following two：
1st, earthquake resistant construction is increased outside crystal oscillator finished product.Such as Chinese patent literature CN 103944513A are disclosed
A kind of plum blossom shock-absorbing type antidetonation constant-temperature crystal oscillator, which includes crystal resonator, and is equipped with shaking for oscillating circuit
Circuit board is swung, the crystal resonator is fixed on oscillating circuit board, and is electrically connected with the oscillating circuit on oscillating circuit board,
Further include case, fixed plate, and at least three flexible arc line shaped damping steel wires；The case is consolidated with oscillating circuit board
Connect, and the cover lives crystal resonator, the fixed plate is separated from each other with case；Each damping steel wire is set as around case axial symmetry cloth
Flower-shape, the arc top of each damping steel wire is affixed with fixed plate, and the both ends of each damping steel wire are affixed with case.
2nd, the internal wafer of crystal oscillator is installed on damping device.Such as Chinese patent literature CN103944558
A discloses a kind of more spring shock-absorbing type antidetonation constant-temperature crystal oscillators, which includes crystal resonator, fixed plate, and is equipped with
The oscillating circuit board of oscillating circuit；Multiple through holes are offered on the oscillating circuit board, each pin of crystal resonator is with work
Dynamic fit system is each passed through affixed with fixed plate after each through hole on oscillating circuit board, and is connected respectively by soft wire
Oscillating circuit on oscillating circuit board；Two damping springs are equipped with each pin of the crystal resonator, and it is same
On pin in two damping springs, the both ends for having a damping spring are respectively held against crystal resonator and oscillating circuit board, another
The both ends of root damping spring are then respectively held against oscillating circuit board and fixed plate.
Although both damping modes can reduce damage of the exterior vibration to crystal to a certain extent, due to
Add parts so that the overall volume and weight of whole crystal oscillator can increase, and so be unfavorable for crystal oscillation
The Miniaturization Design of device.
The content of the invention
It is an object of the present invention to provide a kind of method for improving crystal oscillator shock resistance, it can ensure preferably
Anti seismic efficiency while do not increase the volume and weight of crystal oscillator, easy to the Miniaturization Design of crystal oscillator.
It is another object of the present invention to provide a kind of crystal oscillator, its anti seismic efficiency is good, and frequency stability is high, and
It is small, it is light-weight.
For this purpose, the present invention uses following technical scheme：
A kind of method for improving crystal oscillator shock resistance, there is provided pin, wiring board and crystal, fix the crystal
On the wiring board, the pin is set to be connected with the wiring board, the part for being at least connected pin with wiring board is using soft
Property wiring board is made.
As a kind of preferred solution for the method for improving crystal oscillator shock resistance, the wiring board uses flexible circuit board
It is made.
Preferably, the flexible circuit board (FPC) for insulating substrate, sticky piece, copper foil, coating compacting form.
By the way that the wiring board of whole connection crystal is made of flexible circuit board, the flexible circuit board of monoblock can be maximum
The anti-seismic performance of the raising crystal of degree so that crystal is influenced minimum be subject to applied external force.
As a kind of preferred solution for the method for improving crystal oscillator shock resistance, the wiring board includes first line plate
With the second wiring board, second wiring board is fixed on the first line plate periphery, and is connected with the pin, the crystal
It is fixed on the first line plate, second wiring board is made of flexible circuit board.
As a kind of preferred solution for the method for improving crystal oscillator shock resistance, the wiring board includes and the crystal
The first line plate that is fixedly connected and be arranged on the first line plate side the second wiring board, second wiring board with
The pin connection；
Second wiring board is made of flexible circuit board.
Crystal is fixed on first line plate, and first line plate is fixed on to second made of flexible circuit board
On wiring board so that applied external force is transferred to buffering of the vibrations of crystal through the second wiring board and is significantly reduced, and further prevents
Only crystal damage, ensure that the frequency stabilization of crystal.
As a kind of preferred solution for the method for improving crystal oscillator shock resistance, the first line plate uses nonflexible line
Road plate or flexible circuit board are made.
As a kind of preferred solution for the method for improving crystal oscillator shock resistance, make the wiring board that assembles and the crystalline substance
Body encapsulates inside the shell, and the pin portions extend to the outside of the shell, and the maximum deformation quantity of the wiring board is less than institute
State the spacing between crystal and the housing.
By the way that the maximum deformation quantity of wiring board is controlled, can effectively prevent during vibrations, crystal and shell
Body collides, so as to reduce crystal damage.
As a kind of preferred solution for the method for improving crystal oscillator shock resistance, the crystal is set to be fixed on the circuit
The center of plate.
By the way that crystal to be fixed to the center of assist side, can improve flex section makes line in the case of applied external force
Road plate or crystal swing more stable, and the active force for making to be applied on pin is equal, prevents pin from deforming.
Further, the crystal is made to be fixed at the wiring board close to the side of the outer casing bottom.
A kind of crystal oscillator, using the method as described above for improving crystal oscillator shock resistance, including pin, circuit
Plate and the crystal being arranged on the wiring board, the pin are connected with the wiring board, the pin and the wiring board
The part of connection is made of flexible circuit board.
As a kind of preferred solution of crystal oscillator, the wiring board is made of flexible circuit board.
As a kind of preferred solution of crystal oscillator, the wiring board includes first line plate and the second wiring board, institute
State the second wiring board and be fixed on the first line plate periphery, and be connected with the pin, the crystal is fixed on described first
On wiring board, second wiring board is made of flexible circuit board.
Preferably, the wiring board includes first line plate and the second wiring board, and the first line plate is fixed on described
On second wiring board, the crystal is fixed on the first line plate, and the pin is connected with second wiring board, described
Second wiring board is made of flexible circuit board.
As a kind of preferred solution of crystal oscillator, housing is further included, the crystal and the wiring board are encapsulated in institute
State in housing, the one end of the pin away from the wiring board is through the housing and extends to the outside of the housing.
Beneficial effects of the present invention are：The method provided by the invention for improving crystal oscillator shock resistance is by pin and circuit
The part of plate connection is made of flexible circuit board, can be reduced and passed by flexible portion during crystal oscillator use
The vibrations being delivered on crystal, so as to improve the shock resistance of crystal, and then ensure that the performance of crystal is stablized, it is ensured that crystal uses the longevity
Life.
Brief description of the drawings
Fig. 1 is the structure diagram of the crystal oscillator described in the embodiment of the present invention one；
Fig. 2 is the structure diagram of the crystal oscillator described in the embodiment of the present invention two.
In Fig. 1：
110th, wiring board；120th, crystal；130th, pin；140th, shell.
In Fig. 2：
210th, wiring board；211st, first line plate；212nd, the second wiring board；220th, crystal；230th, pin；240th, shell.
Embodiment
Further illustrate technical scheme below with reference to the accompanying drawings and specific embodiments.
The present invention provides a kind of method for improving crystal oscillator shock resistance, there is provided pin, wiring board and crystal, make institute
State crystal to be fixed on the wiring board, the pin is connected with the wiring board, be at least connected pin with wiring board
Part is made of flexible circuit board.It is made up of the part for being connected pin with wiring board of flexible circuit board, Ke Yi
During crystal oscillator use, by flexible circuit board can free bend, folding, winding characteristic reduce be delivered on crystal
Vibrations, so as to improve the shock resistance of crystal, and then ensure that the performance of crystal is stablized, it is ensured that the service life of crystal.
In one embodiment of the invention, wiring board monoblock is made of flexible circuit board, i.e., crystal is fixed on flexibility
On wiring board.By the way that the wiring board of whole connection crystal is made of flexible circuit board, the flexible circuit board of monoblock can be most
The anti-seismic performance of the raising crystal of big degree so that crystal is influenced minimum be subject to applied external force.
Preferably, by flexible circuit board be applied to wiring board in, due to flexible circuit board can free bend, folding, volume
Around characteristic, greatly the vibrations on crystal can be delivered to by absorbing external active force.
In another embodiment of the present invention, wiring board includes the first line plate that is fixedly connected with crystal and is arranged on the
Second wiring board of the side of one wiring board, the second wiring board are connected with pin, and the second wiring board is made of flexible circuit board.
Crystal is fixed on first line plate, and first line plate is fixed on to the second wiring board made of flexible circuit board
On so that applied external force is transferred to buffering of the vibrations of crystal through the second wiring board and is significantly reduced, and further prevents crystal
Damage, ensure that the frequency stabilization of crystal.
Preferably, first line plate is made of rigid line plate or flexible circuit board.
In another embodiment of the present invention, wiring board includes first line plate and the second wiring board, first line plate with
Crystal connects, and the second wiring board is arranged on first line plate periphery, and for being connected with pin, first line plate uses rigid line
Plate is made, and the second wiring board is made of flexible circuit board.Rigidity and the flexible circuit board structure combined, can also reduce crystal
Vibrations.
The present invention can make pin and wiring board the two connecting components formation be flexible coupling by setting flexible circuit board,
When vibrating, buffering and damping can be played the role of, so it will be appreciated by persons skilled in the art that in the present invention
Other embodiment in, the part being connected with wiring board of pin can also be made to be made of flexible circuit board, alternatively, making pin
The two parts being connected with wiring board are all made of flexible circuit board.
The embodiment of the present invention additionally provides a kind of crystal oscillator, raising crystal oscillator shock resistance using the present invention
Method.The crystal oscillator include pin, wiring board, the crystal and housing being arranged on the wiring board, the pin with
The wiring board connection, the pin are made with the part that the wiring board is connected of flexible circuit board, the crystal and institute
State wiring board to be encapsulated in the housing, the one end of the pin away from the wiring board is through the housing and extends to described
The outside of housing.
Fig. 1 is the structure diagram of a crystal oscillator provided according to an embodiment of the invention.As shown in Figure 1, in this
In embodiment, crystal oscillator includes wiring board 110, crystal 120, pin 130 and shell 140, and crystal 120 is fixed on circuit
The center of plate 110, is symmetrical arranged two pins 130, monoblock wiring board 110 uses on wiring board 110 and positioned at the both sides of crystal 120
Flexible circuit board is made.
Wiring board 110 and crystal 120 are encapsulated in shell 140, and shell 140 includes base and be located in the shell on base
Body, the one end of pin 130 away from wiring board 110 is through base and extends to outside shell 140.
Crystal 120 fixes assist side 110 close to the side of base.
Fig. 2 is the structure diagram of two crystal oscillators provided according to an embodiment of the invention.As shown in Fig. 2, in this
In embodiment, crystal oscillator includes wiring board 210, crystal 220, pin 230 and shell 240, and wiring board 210 includes first
211 and second wiring board 212 of wiring board, the second wiring board 212 are fixed on the periphery of first line plate 211, and crystal 220 is fixed on
The center of first line plate 211, claims on the second wiring board 212 to set two pins 230, the second wiring board 212 uses flexible circuitry
Plate is made, and first line plate 211 is made of rigid line plate.
Wiring board 210 and crystal 220 are encapsulated in shell 240, and shell 240 includes base and be located in the shell on base
Body, the one end of pin 230 away from wiring board 210 is through base and extends to outside shell 240.
Crystal 220 is fixed on first line plate 211 close to the side of base.
In description of the invention, it is to be understood that term " first ", " second ", are used only for being subject in description
Distinguish, not special implication.
Above in association with the specific embodiment technical principle that the invention has been described.These descriptions are intended merely to explain the present invention's
Principle, and limiting the scope of the invention cannot be construed in any way.Based on explanation herein, the technology of this area
Personnel would not require any inventive effort the other embodiments that can associate the present invention, these modes are fallen within
Within protection scope of the present invention.
Claims (4)
- A kind of 1. method for improving crystal oscillator shock resistance, it is characterised in that pin, wiring board and crystal are provided, make institute State crystal to be fixed on the wiring board, the pin is connected with the wiring board, be at least connected pin with wiring board Part is made of flexible circuit board, and the wiring board includes first line plate and the second wiring board, and second wiring board is consolidated First line plate periphery is scheduled on, and is connected with the pin, the crystal is fixed on the first line plate, and described the Two wiring boards are made of flexible circuit board, and the first line plate is made of rigid line plate.
- 2. the method according to claim 1 for improving crystal oscillator shock resistance, it is characterised in that make the circuit assembled Inside the shell, the pin portions extend to the outside of the shell for plate and the crystal package, the shell include base and The housing on the base is located in, between the maximum deformation quantity of the wiring board is less than between the crystal and the housing Away from.
- 3. the method according to claim 1 for improving crystal oscillator shock resistance, it is characterised in that fix the crystal At the center of the wiring board.
- 4. a kind of crystal oscillator, it is characterised in that using the method for the raising crystal oscillator shock resistance described in claim 1 It is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410853811.6A CN104601137B (en) | 2014-12-30 | 2014-12-30 | A kind of method and crystal oscillator for improving crystal oscillator shock resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410853811.6A CN104601137B (en) | 2014-12-30 | 2014-12-30 | A kind of method and crystal oscillator for improving crystal oscillator shock resistance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104601137A CN104601137A (en) | 2015-05-06 |
| CN104601137B true CN104601137B (en) | 2018-04-27 |
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| CN201410853811.6A Active CN104601137B (en) | 2014-12-30 | 2014-12-30 | A kind of method and crystal oscillator for improving crystal oscillator shock resistance |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114584072A (en) * | 2020-11-30 | 2022-06-03 | 华为技术有限公司 | A clock oscillator and its preparation method |
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|---|---|---|---|---|
| CN102751948A (en) * | 2012-08-06 | 2012-10-24 | 上海无线电设备研究所 | Anti-vibration installation method for crystal oscillator and crystal oscillator component |
| CN203691756U (en) * | 2013-12-10 | 2014-07-02 | 中国航空工业集团公司金城南京机电液压工程研究中心 | Printed board for improving vibration-proof strength of electronic components |
| CN203722909U (en) * | 2013-11-22 | 2014-07-16 | 深圳市零奔洋科技有限公司 | Flexible circuit board and LED light bar |
| CN103944558A (en) * | 2014-04-29 | 2014-07-23 | 上海鸿晔电子科技有限公司 | Multi-spring shock absorption type anti-seismic constant temperature crystal oscillator |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60150309A (en) * | 1984-01-18 | 1985-08-08 | Matsushita Electric Ind Co Ltd | Crystal oscillator component |
| JP4379932B2 (en) * | 1998-09-18 | 2009-12-09 | エプソントヨコム株式会社 | Crystal oscillator |
| CN200973068Y (en) * | 2006-12-01 | 2007-11-07 | 中兴通讯股份有限公司 | Device for raising antivibration performance of high stability crystal oscillator |
| CN101651446B (en) * | 2009-09-02 | 2011-12-21 | 广东大普通信技术有限公司 | SMD oven controlled crystal oscillator |
| CN101938262B (en) * | 2010-08-03 | 2012-10-10 | 广东大普通信技术有限公司 | Surface-attached type crystal oscillator |
| EP2634914B1 (en) * | 2012-03-02 | 2015-01-28 | Nxp B.V. | An oscillator circuit |
| CN103296991B (en) * | 2013-04-28 | 2016-08-10 | 电子科技大学 | Graphene high frequency based on flexible base board receives electromechanical resonator and preparation technology thereof |
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2014
- 2014-12-30 CN CN201410853811.6A patent/CN104601137B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102751948A (en) * | 2012-08-06 | 2012-10-24 | 上海无线电设备研究所 | Anti-vibration installation method for crystal oscillator and crystal oscillator component |
| CN203722909U (en) * | 2013-11-22 | 2014-07-16 | 深圳市零奔洋科技有限公司 | Flexible circuit board and LED light bar |
| CN203691756U (en) * | 2013-12-10 | 2014-07-02 | 中国航空工业集团公司金城南京机电液压工程研究中心 | Printed board for improving vibration-proof strength of electronic components |
| CN103944558A (en) * | 2014-04-29 | 2014-07-23 | 上海鸿晔电子科技有限公司 | Multi-spring shock absorption type anti-seismic constant temperature crystal oscillator |
Non-Patent Citations (1)
| Title |
|---|
| 微波基频晶体振荡器抗震性能的研究;何彬;《电讯技术》;19920430;第32卷(第2期);全文 * |
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| CN104601137A (en) | 2015-05-06 |
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Address after: 523000 Room 401 and 402, building 5, No. 24, industrial East Road, Songshanhu Park, Dongguan City, Guangdong Province Patentee after: Guangdong daguangxin Technology Co.,Ltd. Address before: 523808 buildings 13-16, small and medium-sized science and technology enterprise entrepreneurship Park, northern industrial city, Songshanhu science and Technology Industrial Park, Dongguan City, Guangdong Province Patentee before: Guangdong Dapu Telecom Technology Co.,Ltd. |