CN104596646B - Workpiece temperature measuring equipment for grinding experiment - Google Patents

Abstract

The invention discloses a workpiece temperature measuring device used for grinding experiments. The device comprises: a workbench; a workpiece to be measured, the workpiece to be measured is arranged on the workbench, and the upper surface of the workpiece to be measured is a grinding surface. A blind hole is formed on the lower surface of the workpiece to be tested, and the inner top surface of the blind hole is spaced apart from the upper surface of the workpiece to be tested; the infrared radiation temperature measurement probe is arranged directly below the blind hole and the infrared radiation temperature measurement probe The temperature measurement focus of the temperature probe is on the inner top surface of the blind hole; the spectrum analyzer is connected with the infrared radiation temperature measurement probe. According to the workpiece temperature measuring device used for grinding experiments in the embodiment of the present invention, an infrared radiation temperature measuring probe and a spectrum analyzer are used, so that the spectrum analyzer can accurately and instantly record the temperature change of the subsurface of the workpiece under test, and the infrared Radiation is not affected by mechanical vibration and external magnetic field, thus improving the stability of measurement and the accuracy of temperature measurement.

Description

Workpiece Temperature Measuring Device for Grinding Experiment

technical field

The invention relates to a workpiece temperature measuring device used in grinding experiments.

Background technique

Existing grinding temperature measurement usually uses thermocouple wires clamped in the middle of the workpiece to be measured. Thermocouple temperature measurement is physical contact, the thermocouple is in direct contact with the grinding wheel, and there is also physical contact with the workpiece through the insulating sleeve. When the grinding wheel grinds the workpiece, the temperature of the processed area will rise, and the temperature of the thermocouple wire will also rise accordingly. Due to the Seebeck effect, a thermoelectromotive force is generated between two wires of different materials. The thermometer converts the electrical signal into a temperature signal to complete the temperature measurement process.

Thermocouple wires are sensitive to mechanical vibration, and there are strong vibration and instability factors in the grinding process, resulting in inaccurate and poor repeatability of measurement results. There is thermal resistance in the thermocouple temperature measurement part, and the thermal electromotive force can be obtained accurately only after the working area is completely heated. However, the temperature rises very quickly during the grinding process. In such a short period of time, the heat distribution in the working end of the thermocouple is uneven, resulting in The hysteresis of the measurement results, the measured value lags behind and is lower than the actual temperature value. Moreover, the thermocouple wire is thermally isolated from the workpiece through the insulating layer, and what is measured is the temperature of the grinding wheel grinding thermocouple, not the surface temperature of the workpiece.

Contents of the invention

The present invention aims to solve one of the above-mentioned technical problems in the prior art at least to a certain extent. Therefore, an object of the present invention is to provide a workpiece temperature measuring device for grinding experiments, which improves the accuracy and stability of workpiece temperature measurement in grinding experiments.

A workpiece temperature measuring device for grinding experiments according to an embodiment of the present invention includes: a workbench; a workpiece to be measured, the workpiece to be measured is arranged on the workbench, and the upper surface of the workpiece to be measured is Grinding surface, a blind hole is formed on the lower surface of the measured workpiece, the inner top surface of the blind hole is spaced from the upper surface of the measured workpiece; an infrared radiation temperature measuring probe, the infrared radiation temperature measuring The probe is arranged directly below the blind hole and the temperature measurement focus of the infrared radiation temperature measurement probe is on the inner top surface of the blind hole; a spectrum analyzer, the spectrum analyzer and the infrared radiation temperature measurement The probe is connected.

According to the workpiece temperature measuring device used for grinding experiments in the embodiment of the present invention, an infrared radiation temperature measuring probe and a spectrum analyzer are used. When measuring, the entire workbench is placed on the grinding car, and the workpiece to be measured is arranged on the workbench. Above, as the grinding progresses, the temperature rises rapidly, and finally the blind hole is ground through. The spectrum analyzer can record the temperature change of the subsurface of the measured workpiece in real time and accurately. The last recorded temperature of the spectrum analyzer is the grinding area. surface temperature. Moreover, the infrared radiation is not affected by mechanical vibration and external magnetic field, thereby improving the stability of measurement and the accuracy of temperature measurement.

In addition, the workpiece temperature measuring device for grinding experiments according to the embodiment of the present invention may also have the following additional technical features:

According to some embodiments of the present invention, the workpiece to be measured is in the shape of a flat plate, the workbench is provided with a receiving groove, and the workpiece to be measured is at least partially accommodated in the receiving groove.

According to some embodiments of the present invention, the measured workpiece is provided with a measured workpiece positioning structure, the workbench has a workbench positioning structure, and the measured workpiece positioning structure is connected to the workbench positioning structure. Cooperate so that the temperature measurement focus of the infrared radiation temperature measurement probe is on the inner top surface of the blind hole.

According to some embodiments of the present invention, the workpiece positioning structure is a positioning boss, and the workbench positioning structure is a positioning hole.

According to some embodiments of the present invention, the positioning boss is circular, and the blind hole is located in the positioning boss and arranged coaxially with the positioning boss.

According to some embodiments of the present invention, the blind hole is tapered.

According to some embodiments of the present invention, the inner top surface of the blind hole is a plane.

According to some embodiments of the present invention, the distance between the inner top surface of the blind hole and the upper surface of the measured workpiece is 0.1mm-0.5mm.

According to some embodiments of the present invention, both the workpiece to be measured and the infrared radiation temperature measuring probes are plural, and the temperature measuring ranges of the multiple infrared radiation temperature measuring probes are different.

According to some embodiments of the present invention, the workpiece temperature measuring device for grinding experiments further includes: a position adjustment device, the infrared radiation temperature measurement probe is arranged on the position adjustment device, and the position adjustment device is set to It is used to adjust the degrees of freedom of the infrared radiation temperature measuring probe in the up-down direction, left-right direction and front-back direction.

Description of drawings

Fig. 1 is a schematic structural view of a workpiece temperature measuring device for a grinding experiment according to an embodiment of the present invention;

Figure 2 is a cross-sectional view of the measured workpiece along its blind hole axis.

Reference signs:

A workpiece temperature measuring device 100 for grinding experiments;

Workbench 1, workbench positioning structure 11;

The workpiece to be tested 2, the positioning structure of the workpiece to be tested 21, the blind hole 22, the inner top surface 221 of the blind hole, and the upper surface of the workpiece to be tested 23;

Infrared radiation temperature measurement probe 3;

Spectrum Analyzer4.

detailed description

Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation or position indicated by "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. The relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, therefore It should not be construed as a limitation of the present invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it can be mechanically connected, or electrically connected, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the present invention, unless otherwise clearly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

A workpiece temperature measuring device 100 for grinding experiments according to an embodiment of the present invention will be described below with reference to FIGS. 1-2 , which improves the accuracy and stability of temperature measurement in grinding experiments.

A workpiece temperature measuring device 100 for grinding experiments according to an embodiment of the present invention may include: a workbench 1 , a workpiece to be measured 2 , an infrared radiation temperature measuring probe 3 and a spectrum analyzer 4 .

As shown in FIG. 1 , the workpiece 2 to be tested can be set on the workbench 1 , the upper surface 23 of the workpiece to be tested can be a grinding surface, and a blind hole 22 can be formed on the lower surface. Specifically, in the measurement process, the workbench 1 can be placed on the grinding car, and the upper surface 23 of the workpiece to be tested is ground using a grinding wheel, and the inner top surface 221 of the blind hole and the upper surface 23 of the workpiece to be tested can be ground. As the grinding proceeds, the distance between the inner top surface 221 of the blind hole and the upper surface 23 of the workpiece to be measured decreases, and finally the inner top surface 221 of the blind hole will be ground through by the grinding wheel.

As shown in FIG. 1 , an infrared radiation temperature measuring probe 3 may be provided directly below the blind hole 22 , and the focus of the infrared radiation temperature measuring probe 3 may be on the top surface 221 inside the blind hole. Thus, the hot spot positioning technology can be used to make the measurement area of the infrared radiation temperature measuring probe 3 be the deepest part of the blind hole 22. At this time, the infrared radiation temperature measuring probe 3 can receive the deepest part of the blind hole 22, that is, the workpiece to be measured. 2 The infrared rays radiated by the sub-surface layer, and then transmit the captured spectrum to the spectrum analyzer 4, and the spectrum analyzer 4 analyzes the spectrum to obtain the temperature of the measured workpiece 2.

The spectrum analyzer 4 is connected with the infrared radiation temperature measuring probe 3. For example, according to an embodiment of the present invention, the infrared radiation temperature measuring probe 3 and the spectrum analyzer 4 can be connected through the infrared conduction special optical fiber 5, and the infrared conduction special optical fiber 5 can realize Infrared ray is totally reflected in the optical fiber, so that the transmission loss of infrared ray in the special optical fiber for infrared ray transmission is small, and the special optical fiber for infrared ray transmission has a fast transmission speed, and finally conducts into the spectrometer. In addition, the surface of the special optical fiber 5 for infrared transmission has a protective layer to isolate the damage of the surrounding environment to the optical fiber transmission. Wherein, the spectrum analyzer may be an infrared spectrum analyzer. Thus, the spectrum analyzer 4 can analyze the infrared rays captured by the infrared radiation temperature measuring probe 3, thereby improving the temperature measurement accuracy of the workpiece temperature measuring device used in the grinding experiment.

Specifically, during the process of grinding the workpiece 2 by the grinding wheel, the spectrum analyzer 4 can analyze the infrared rays captured by the infrared radiation temperature measuring probe 3, so that the spectrum analyzer 4 can accurately record the measured workpiece 2, the last recorded temperature of the spectrometer 4 is the surface temperature of the grinding area.

According to the workpiece temperature measuring device 100 for grinding experiments according to the embodiment of the present invention, by being provided with an infrared radiation temperature measuring probe 3 and a spectrum analyzer 4, during measurement, the spectrum analyzer 4 can immediately and accurately record the subsurface layer of the workpiece 2 under test As the grinding proceeds, the blind hole 22 is finally ground through, and the last recorded temperature of the spectrum analyzer 4 is the surface temperature of the grinding area. Moreover, during the grinding process, the workpiece 2 to be measured inevitably vibrates to a certain extent, and the infrared radiation is not affected by mechanical vibration and external magnetic field, so that the stability of measurement and the accuracy of temperature measurement can also be improved.

According to some embodiments of the present invention, as shown in FIG. 1 , the workpiece 2 to be tested can be in the shape of a flat plate, thereby facilitating the grinding of the workpiece 2 to be tested by the grinding wheel. The workbench 1 can be provided with a receiving groove, and the workpiece 2 to be tested can be at least partially accommodated in the receiving groove, so as to facilitate the placement of the workpiece 2 to be measured, and can also position the workpiece 2 to be measured to a certain extent.

In order to further fix and position the measured workpiece 2, optionally, a measured workpiece positioning structure 21 may be provided on the measured workpiece 2, and a workbench positioning structure 11 may be provided on the workbench. The positioning structure 21 and the workbench positioning structure 11 can be connected and positioned in cooperation, so that the temperature measurement focus of the infrared radiation temperature measurement probe 3 is on the top surface 221 of the blind hole.

For example, the workpiece positioning structure 21 can be a positioning boss, and the workbench positioning structure 11 can be a positioning hole. The positioning boss can be inserted into the positioning hole, so that the positioning boss can cooperate with the positioning hole to position the workpiece 2 to be measured, thereby avoiding the misalignment of the workpiece 2 to be measured during the grinding process, and it is also convenient for the infrared radiation temperature measurement probe 3 capture infrared rays.

Wherein, optionally, as shown in FIG. 2 , the positioning boss can be circular, and the blind hole 22 can be located in the positioning boss and arranged coaxially with the positioning boss. Thus, the infrared radiation temperature measuring probe 3 can immediately receive the infrared rays radiated from the subsurface of the workpiece 2 to be measured.

According to some preferred embodiments of the present invention, as shown in FIG. 2 , the blind hole 22 may be tapered, and the inner top surface 221 of the blind hole may be a plane. The infrared radiation temperature measuring probe 3 can be accurately fixed directly below the tapered hole, so that the infrared radiation temperature measuring probe 3 is just positioned on the inner top surface of the tapered hole. According to the nature of black body radiation, the tapered hole can be considered as a black body. The black body radiation principle of the tapered hole can be used to improve the temperature measurement accuracy of the workpiece temperature measurement device used in the grinding experiment.

According to some embodiments of the present invention, the inner top surface 221 of the blind hole is spaced apart from the upper surface 23 of the workpiece to be tested, for example, the distance between the inner top surface 221 of the blind hole and the upper surface 23 of the workpiece to be tested can be 0.1mm-0.5mm . As a result, not only can the time of the grinding experiment be saved, but also the temperature measurement accuracy of the workpiece temperature measuring device used for the grinding experiment can be guaranteed.

According to some preferred embodiments of the present invention, the workpiece 2 to be measured and the infrared radiation temperature measuring probes 3 can both be multiple, and the temperature measuring ranges of the multiple infrared radiation temperature measuring probes 3 are different. For example, according to one embodiment of the present invention, as shown in Figure 1, there may be two infrared radiation temperature measuring probes 3, including a high temperature infrared radiation temperature measuring probe and a medium and low temperature infrared radiation temperature measuring probe, wherein the high temperature infrared radiation temperature measuring The probe can measure the temperature range of 500-1500°C, and the medium and low temperature infrared radiation temperature measuring probe can measure the temperature range of 20-800°C. Therefore, in the laboratory, different measured workpieces 2 can be measured according to the measurement range, and experimental measurements can also be performed on a plurality of measured workpieces 2 at the same time, thereby improving the accuracy of temperature measurement.

In order to further improve the temperature measurement accuracy of the workpiece temperature measuring device 100 used for grinding experiments, the device can also include: a position adjustment device, the infrared radiation temperature measurement probe 3 can be arranged on the position adjustment device, and the position adjustment device can be set to It is used to adjust the degrees of freedom of the infrared radiation temperature measuring probe 3 in the up-down direction, left-right direction and front-back direction.

For example, the position adjustment device may include a gear structure, a worm gear structure, and the like. Of course, those skilled in the art can flexibly design the position adjustment device according to needs, for example, the design can refer to the feeding device of a turning tool on a lathe.

Therefore, by setting the position adjusting device, the position of the infrared radiation temperature measuring probe 3 can be adjusted, so that the focus of the infrared radiation temperature measuring probe 3 is on the inner top surface 221 of the blind hole, which improves the accuracy of temperature measurement.

The workpiece temperature measuring device 100 for grinding experiments according to the embodiment of the present invention adopts the infrared radiation temperature measuring probe 3 and the spectrum analyzer 4. During the grinding process, the spectrum analyzer can accurately and instantly record the grinding of the measured workpiece. For the surface temperature of the area, a blind hole 22 is arranged in the workpiece 2 to be measured, so that the principle of black body radiation can be used to improve the accuracy of temperature measurement of the device. In addition, the infrared radiation is not affected by mechanical vibration, and the conduction of infrared rays is not affected by the external magnetic field, thereby improving the stability of the measurement.

In the description of this specification, descriptions with reference to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or characteristic is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification.

Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations.

Claims (9)

1. A kind of 1. workpiece temperature measuring equipment for grinding experiment, it is characterised in that including：

   Working gantry；

   Measured workpiece, the measured workpiece are arranged on the Working gantry, and the upper surface of the measured workpiece is grinding surface, institute State and be spaced apart on the lower surface of measured workpiece formed with blind hole, the inner top surface of the blind hole with the upper surface of the measured workpiece, The blind hole is taper；

   Infrared radiation temperature is popped one's head in, and the infrared radiation temperature probe is arranged on the underface of the blind hole and the infra-red radiation The thermometric focal point of temperature probe is on the inner top surface of the blind hole；

   Spectroanalysis instrument, the spectroanalysis instrument are connected with infrared radiation temperature probe.
2. 2. the workpiece temperature measuring equipment according to claim 1 for grinding experiment, it is characterised in that the measured workpiece is Tabular, holding tank is provided with the Working gantry, the measured workpiece is at least partially recessed into the holding tank.
3. 3. the workpiece temperature measuring equipment according to claim 1 for grinding experiment, it is characterised in that on the measured workpiece Measured workpiece location structure is provided with, there is Working gantry location structure, the measured workpiece location structure on the Working gantry Coordinate with the Working gantry location structure so that the thermometric focal point of infrared radiation temperature probe is in the blind hole On top surface.
4. 4. the workpiece temperature measuring equipment according to claim 3 for grinding experiment, it is characterised in that the measured workpiece is determined Bit architecture is positioning boss, and the Working gantry location structure is positioning hole.
5. 5. the workpiece temperature measuring equipment according to claim 4 for grinding experiment, it is characterised in that the positioning boss is Annular, the blind hole are located in the positioning boss and coaxially arranged with the positioning boss.
6. 6. the workpiece temperature measuring equipment according to claim 1 for grinding experiment, it is characterised in that the interior top of the blind hole Face is plane.
7. 7. the workpiece temperature measuring equipment according to claim 1 for grinding experiment, it is characterised in that the interior top of the blind hole Identity distance is from being 0.1mm-0.5mm with a distance from the upper surface of the measured workpiece.
8. 8. the workpiece temperature measuring equipment according to claim 1 for grinding experiment, it is characterised in that the measured workpiece and The infrared radiation temperature probe is multiple, and the temperature-measuring range of multiple infrared radiation temperature probes is different.
9. 9. the workpiece temperature measuring equipment according to claim 1 for grinding experiment, it is characterised in that also include：Adjust position Regulating device, the infrared radiation temperature probe are arranged on the apparatus for adjusting position, and the apparatus for adjusting position is arranged to use In the free degree of the regulation infrared radiation temperature probe on above-below direction, left and right directions and fore-and-aft direction.