CN104518174A - OLED (organic light emitting diode) device - Google Patents

Abstract

The invention provides an OLED (organic light emitting diode) device. The OLED device comprises a substrate (1), an OLED thin-film device (2), an organic packaging thin film (3), an inorganic packaging thin film (4), a protection cover (5) and a rigid supporting plate (6). The OLED thin-film device (2) is arranged on the substrate (1), the organic packaging thin film (3) arranged on the substrate (1) completely covers the OLED thin-film device (2), the inorganic packaging thin film (4) arranged on the substrate (1) completely covers the organic packaging thin film (3), the protection cover (5) is hermetically connected to the peripheral edge of the substrate (1) and covers above the inorganic packaging thin film (4), and the rigid supporting plate (6) is arranged on one side, away from the substrate (1), of the protection cover (5). The OLED device has excellent mechanical performance and is less prone to damages under action of external force, and better airtightness protection can be provided for the OLED thin-film device.

Description

OLED device

technical field

The invention relates to the field of display technology, in particular to an OLED device.

Background technique

Organic Light Emitting Diode (OLED) is a flat panel display technology with great development prospects. It not only has excellent display performance, but also has self-illumination, simple structure, ultra-thin, fast response and wide viewing angle. , low power consumption, and flexible display, it is known as a "dream display". In addition, its production equipment investment is much smaller than that of liquid crystal displays (LiquidCrystal Display, LCD), which has been favored by major display manufacturers and has become a display The main force of the third generation display devices in the technical field.

An OLED device usually includes a glass substrate, an OLED thin film device disposed on the glass substrate, and an encapsulation cover for resisting external environment and preventing water vapor and oxygen from entering the inside of the OLED device. The encapsulation cover usually uses another glass plate. OLED thin film devices generally include: ITO transparent anode placed on a glass substrate, hole injection layer (HIL) placed on the ITO transparent anode, hole transport layer (HTL) placed on the hole injection layer, placed on the hole A light emitting layer (EML) on the hole transport layer, an electron transport layer (ETL) on the light emitting layer, an electron injection layer (EIL) on the electron transport layer, and a cathode on the electron injection layer. In order to improve the efficiency, the light-emitting layer usually adopts a host/guest doping system.

Due to the sharp edges of the glass plate, it is prone to problems such as improper protection during handling and is fragile when subjected to mechanical loads, which are more obvious when applied to large-scale OLED devices. Moreover, the glass plate (substrate or package cover plate) is difficult to install the OLED device to a desired position, such as a wall, by using traditional fixing methods such as screw connection, clamping, drilling and the like.

Existing OLED devices are generally provided with a common housing that can provide a mechanical encapsulation around the exterior of the OLED device, but does not make direct contact with the OLED device over the entire housing area. Since the mechanical robustness of the OLED device itself is not improved, when a mechanical impact occurs, the mechanical impact also acts on the OLED device inside the casing, and eventually damages the OLED device. There is also a shell that embeds the OLED device inside the shell to improve the mechanical properties of the OLED device embedded in the shell, but this shell does not directly seal the OLED device and cannot provide better airtightness for the OLED thin film device sexual protection.

Therefore, it is necessary to provide a novel OLED device to provide better airtight protection for OLED thin film devices while significantly improving the mechanical properties of the OLED device.

Contents of the invention

The object of the present invention is to provide an OLED device, which has good mechanical properties, is not easily damaged by external force, and can provide better airtight protection for OLED thin film devices.

To achieve the above object, the present invention provides an OLED device, comprising a substrate, an OLED thin film device disposed on the substrate, an organic encapsulation film disposed on the substrate to completely cover the OLED thin film device, disposed on the substrate An inorganic packaging film that completely covers the organic packaging film, a protective cover that is sealed and connected to the peripheral edge of the substrate and is placed on the inorganic packaging film, and a protective cover that is located away from the substrate. Rigid support plates on the sides.

A cooling element is provided on the side of the rigid support plate away from the base plate.

The OLED device, further comprising a driver controller adjacent to the substrate and housed in the protective cover, an electronic driver adjacent to the driver controller and housed in the protective cover, An electrical contact adjacent to the electronic driver and housed in the protective covering; the electrical contact is partially exposed to a side of the protective covering.

The protective cover is provided with a first accommodating portion, and second, third and fourth accommodating portions opposite to the opening direction of the first accommodating portion, and the substrate is accommodated in the first accommodating portion. In the accommodating part, the driver controller, the electronic driver, and the electrical contactor are respectively accommodated in the second, third and fourth accommodating parts.

A gap is left between the protective cover and the inorganic encapsulation film.

Both the upper and lower surfaces of the organic encapsulation film are adhesive, and the material thereof is polyparaxylylene, polychlorinated paraxylylene, or polydichlorinated paraxylylene.

The material of the inorganic packaging film is silicon nitride, silicon oxide, aluminum oxide or zirconium oxide.

The material of the protective cover is plastic, which is prepared by injection molding process.

The rigid support plate is a stainless steel plate.

The cooling element is made of aluminum or copper.

Beneficial effects of the present invention: a kind of OLED device provided by the present invention, by covering organic encapsulation film and inorganic encapsulation film on the OLED thin film device, set up a protective cover sealingly connected to the peripheral edge of substrate on the inorganic encapsulation film, and A rigid support plate is provided on the side of the protective cover away from the substrate, which effectively protects the OLED device, significantly improves the mechanical properties of the OLED device, and is not easily damaged by external force, and at the same time, can provide better OLED thin film devices. The airtight protection ensures the performance of OLED thin film devices and prolongs their service life. In addition, due to the provision of the protective cover, it is easier to install the OLED device in any desired position by conventional fixing methods.

Description of drawings

The technical solutions and other beneficial effects of the present invention will be apparent through the detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings.

In the attached picture,

FIG. 1 is a schematic cross-sectional view of an OLED device of the present invention.

Detailed ways

In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.

Please refer to FIG. 1 , the present invention provides an OLED device, including a substrate 1, an OLED thin film device 2 disposed on the substrate 1, and an organic encapsulation film 3 disposed on the substrate 1 to completely cover the OLED thin film device 2 , an inorganic packaging film 4 disposed on the substrate 1 and completely covering the organic packaging film 3 , a protective covering 5 that is sealed and connected to the surrounding edges of the substrate 1 and covered above the inorganic packaging film 4 , and A rigid support plate 6 is provided on the side of the protective covering 5 away from the base plate 1 .

Further, the OLED device further includes a driver controller 8 adjacent to the substrate 1 and accommodated in the protective cover 5, adjacent to the driver controller 8 and accommodated in the protective cover The electronic driver 9 in the object 5, the electrical contactor 10 adjacent to the electronic driver 9 and accommodated in the protective cover 5, the electrical contactor 10 is partially exposed on the side of the protective cover 5 The part is used to be electrically connected to an external power source so as to drive the OLED device.

A cooling element 7 is provided on a side of the rigid support plate 6 away from the base plate 1 .

Specifically, the protective cover 5 is provided with a first accommodating portion 51, and second, third and fourth accommodating portions 52, 53, 54 opposite to the opening direction of the first accommodating portion 51. . The substrate 1 is accommodated in the first accommodating portion 51, and the driver controller 8, electronic driver 9, and electrical contactor 10 are respectively accommodated in the second, third, and fourth accommodating portions. 52, 53, 54.

The substrate 1 is a transparent substrate for the light emitted by the OLED thin film device 2 to pass through. Preferably, the substrate 1 is a glass substrate.

The organic encapsulation film 3 is similar to double-sided tape, its upper and lower surfaces are both adhesive, and can be directly attached to the OLED thin film device 2 . The material of the organic encapsulation film 3 may be parylene, polychlorinated paraxylylene, or polydichlorinated paraxylylene.

Since the structure of the organic encapsulating film 3 is not dense enough, its performance of blocking water vapor and oxygen is not ideal, so an inorganic encapsulating film 4 completely covering the organic encapsulating film 3 is provided. The structure of the inorganic encapsulation thin film 4 is dense, and its material can be silicon nitride, silicon oxide, aluminum oxide or zirconium oxide. The organic encapsulation film 3 can avoid possible damage to the OLED thin film device 2 during the preparation process of the inorganic encapsulation film 4 .

The inorganic encapsulation film 4 and the organic encapsulation film 3 work together, so that the OLED thin film device 2 is completely sealed and isolated, providing good airtight protection for the OLED thin film device 2, blocking the entry of water vapor and oxygen, and ensuring that the OLED thin film device 2 performance and prolong its service life.

The protective cover 5 can effectively protect the OLED device, significantly improve the mechanical properties of the OLED device, and make the OLED device not easily damaged by external force. The protective covering 5 is sealed and connected to the peripheral edge of the substrate 1 and is not in contact with the inorganic packaging film 4 , that is, there is a gap between the protective covering 5 and the inorganic packaging film 4 . The protective cover 5 completely seals the OLED device, providing better airtight protection for the OLED thin film device 2 . The electrical components of the electronic driver 81 , driver controller 82 , and electrical contactor 83 are together covered by the protective cover 5 .

The material of the protective cover 5 is plastic, which can be prepared by injection molding and other molding techniques. It is worth mentioning that the provision of the protective covering 5 can also make it easier for the OLED device to be installed in any desired position through traditional fixing methods.

The rigid support plate 6 runs through the entire side of the protective cover 5 away from the substrate 1 , which can increase the strength of the protective cover 5 to better protect the OLED device. The rigid support plate 6 is made of hard material, preferably, the rigid support plate 6 is a stainless steel plate.

The material of the cooling member 7 is aluminum or copper with better heat dissipation, which is used to dissipate the heat generated during the operation of the OLED device, so as to prevent the failure of the OLED device caused by excessive temperature.

In summary, the OLED device of the present invention covers the organic encapsulation film and the inorganic encapsulation film on the OLED thin film device, and sets up a protective cover that is sealed and connected to the periphery of the substrate above the inorganic encapsulation film. A rigid support plate is set on the side away from the substrate to effectively protect the OLED device, so that the mechanical properties of the OLED device are significantly improved, and it is not easy to be damaged by external force. At the same time, it can provide better air tightness for the OLED thin film device. Protection to ensure the performance of OLED thin film devices and prolong their service life. In addition, due to the provision of the protective cover, it is easier to install the OLED device in any desired position by conventional fixing methods.

As mentioned above, for those of ordinary skill in the art, various other corresponding changes and deformations can be made according to the technical scheme and technical concept of the present invention, and all these changes and deformations should belong to the protection scope of the claims of the present invention .

Claims (10)

1. an OLED device, is characterized in that, comprises substrate (1), is arranged on the OLED thin film device (2) on described substrate (1), is located on described substrate (1) and covers described OLED thin film device completely The organic encapsulation film (3) of (2), the inorganic encapsulation film (4) that is set on the substrate (1) and completely covers the organic encapsulation film (3), is sealed and connected to the surrounding edges of the substrate (1) And cover the protection cover (5) above the inorganic encapsulation film (4), and the rigid support plate (6) provided on the side of the protection cover (5) away from the substrate (1). 2. The OLED device according to claim 1, characterized in that a cooling element (7) is provided on the side of the rigid support plate (6) away from the substrate (1). 3. The OLED device according to claim 1, further comprising a driver controller (8) adjacent to the substrate (1) and accommodated in the protective cover (5), and the The electronic driver (9) adjacent to the driver controller (8) and accommodated in the protective covering (5), adjacent to the electronic driver (9) and accommodated in the protective covering (5) ) in the electrical contactor (10); said electrical contactor (10) is partially exposed to the side of said protective covering (5). 4. The OLED device according to claim 3, characterized in that, the protective covering (5) is provided with a first accommodation portion (51) and an opening with the first accommodation portion (51) The second, third and fourth accommodating portions (52, 53, 54) in opposite directions, the substrate (1) is accommodated in the first accommodating portion (51), and the driver controller (8 ), the electronic driver (9), and the electrical contactor (10) are accommodated in the second, third, and fourth accommodation portions (52, 53, 54) respectively. 5. The OLED device according to claim 1, characterized in that there is a gap between the protective cover (5) and the inorganic encapsulation film (4). 6. OLED device as claimed in claim 1, is characterized in that, the upper and lower surfaces of described organic encapsulation film (3) all have adhesiveness, and its material is parylene, polychlorinated p-xylene, or polydichloro-p-xylylene. 7. The OLED device according to claim 1, characterized in that, the material (4) of the inorganic encapsulation film is silicon nitride, silicon oxide, aluminum oxide or zirconium oxide. 8. The OLED device according to claim 1, characterized in that, the material of the protective cover (5) is plastic and is prepared by injection molding process. 9. The OLED device according to claim 1, characterized in that, the rigid support plate (6) is a stainless steel plate. 10. The OLED device according to claim 2, characterized in that, the material of the cooling member (7) is aluminum or copper.