CN104508040A - Resin composition, and adhesive film and coverlay film each of which is formed of same - Google Patents
Resin composition, and adhesive film and coverlay film each of which is formed of same Download PDFInfo
- Publication number
- CN104508040A CN104508040A CN201380040490.1A CN201380040490A CN104508040A CN 104508040 A CN104508040 A CN 104508040A CN 201380040490 A CN201380040490 A CN 201380040490A CN 104508040 A CN104508040 A CN 104508040A
- Authority
- CN
- China
- Prior art keywords
- film
- aforesaid ingredients
- resin combination
- composition
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title abstract description 5
- 239000002313 adhesive film Substances 0.000 title abstract 3
- 239000012787 coverlay film Substances 0.000 title abstract 3
- 229920005989 resin Polymers 0.000 claims abstract description 137
- 239000011347 resin Substances 0.000 claims abstract description 137
- -1 vinyl compound Chemical class 0.000 claims abstract description 31
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 20
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 19
- 229920002725 thermoplastic elastomer Polymers 0.000 claims abstract description 8
- 239000000203 mixture Substances 0.000 claims description 137
- 238000000576 coating method Methods 0.000 claims description 71
- 239000011248 coating agent Substances 0.000 claims description 70
- 239000004615 ingredient Substances 0.000 claims description 57
- 239000003822 epoxy resin Substances 0.000 claims description 31
- 229920000647 polyepoxide Polymers 0.000 claims description 31
- 229910052799 carbon Inorganic materials 0.000 claims description 29
- 125000000217 alkyl group Chemical group 0.000 claims description 27
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 24
- 239000003973 paint Substances 0.000 claims description 24
- 125000005843 halogen group Chemical group 0.000 claims description 19
- 239000003351 stiffener Substances 0.000 claims description 18
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 17
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 17
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 16
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 14
- 239000000945 filler Substances 0.000 claims description 13
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 10
- 239000004411 aluminium Substances 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 8
- 150000007513 acids Chemical class 0.000 claims description 8
- 235000010290 biphenyl Nutrition 0.000 claims description 8
- 239000004305 biphenyl Substances 0.000 claims description 8
- 229920001400 block copolymer Polymers 0.000 claims description 7
- 239000005011 phenolic resin Substances 0.000 claims description 6
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 6
- 229920005996 polystyrene-poly(ethylene-butylene)-polystyrene Polymers 0.000 claims description 6
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 claims description 6
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 6
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 5
- 229930185605 Bisphenol Natural products 0.000 claims description 5
- 229920001568 phenolic resin Polymers 0.000 claims description 5
- 239000002966 varnish Substances 0.000 claims description 5
- 229920006132 styrene block copolymer Polymers 0.000 claims description 4
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims 1
- 125000005466 alkylenyl group Chemical group 0.000 claims 1
- 239000003063 flame retardant Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 abstract description 23
- ZJKCITHLCNCAHA-UHFFFAOYSA-K aluminum dioxidophosphanium Chemical compound [Al+3].[O-][PH2]=O.[O-][PH2]=O.[O-][PH2]=O ZJKCITHLCNCAHA-UHFFFAOYSA-K 0.000 abstract 1
- 239000010408 film Substances 0.000 description 204
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 238000007731 hot pressing Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 239000002904 solvent Substances 0.000 description 12
- 238000012360 testing method Methods 0.000 description 11
- 238000007639 printing Methods 0.000 description 9
- 239000004848 polyfunctional curative Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000001035 drying Methods 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- 229910052736 halogen Inorganic materials 0.000 description 5
- 150000002367 halogens Chemical class 0.000 description 5
- 150000002460 imidazoles Chemical class 0.000 description 5
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 150000008064 anhydrides Chemical class 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- BEQKKZICTDFVMG-UHFFFAOYSA-N 1,2,3,4,6-pentaoxepane-5,7-dione Chemical compound O=C1OOOOC(=O)O1 BEQKKZICTDFVMG-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 208000034189 Sclerosis Diseases 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000002485 combustion reaction Methods 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 3
- 150000003014 phosphoric acid esters Chemical class 0.000 description 3
- 150000003016 phosphoric acids Chemical class 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000001953 recrystallisation Methods 0.000 description 3
- 238000010023 transfer printing Methods 0.000 description 3
- QCBSYPYHCJMQGB-UHFFFAOYSA-N 2-ethyl-1,3,5-triazine Chemical compound CCC1=NC=NC=N1 QCBSYPYHCJMQGB-UHFFFAOYSA-N 0.000 description 2
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 2
- NPDACUSDTOMAMK-UHFFFAOYSA-N 4-Chlorotoluene Chemical compound CC1=CC=C(Cl)C=C1 NPDACUSDTOMAMK-UHFFFAOYSA-N 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 206010070834 Sensitisation Diseases 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 150000003017 phosphorus Chemical class 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 230000008313 sensitization Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000002076 thermal analysis method Methods 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- JMYZLRSSLFFUQN-UHFFFAOYSA-N (2-chlorobenzoyl) 2-chlorobenzenecarboperoxoate Chemical compound ClC1=CC=CC=C1C(=O)OOC(=O)C1=CC=CC=C1Cl JMYZLRSSLFFUQN-UHFFFAOYSA-N 0.000 description 1
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- OSQBFLZKVLCVGI-UHFFFAOYSA-N 1,2,3,4-tetrahydronaphthalene-1-carbonyl 1,2,3,4-tetrahydronaphthalene-1-carboxylate Chemical compound C1CCC2=CC=CC=C2C1C(=O)OC(=O)C1C2=CC=CC=C2CCC1 OSQBFLZKVLCVGI-UHFFFAOYSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- KVGZZAHHUNAVKZ-UHFFFAOYSA-N 1,4-Dioxin Chemical compound O1C=COC=C1 KVGZZAHHUNAVKZ-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- WVGXBYVKFQJQGN-UHFFFAOYSA-N 1-tert-butylperoxy-2-propan-2-ylbenzene Chemical compound CC(C)C1=CC=CC=C1OOC(C)(C)C WVGXBYVKFQJQGN-UHFFFAOYSA-N 0.000 description 1
- CQOZJDNCADWEKH-UHFFFAOYSA-N 2-[3,3-bis(2-hydroxyphenyl)propyl]phenol Chemical compound OC1=CC=CC=C1CCC(C=1C(=CC=CC=1)O)C1=CC=CC=C1O CQOZJDNCADWEKH-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- RPBWMJBZQXCSFW-UHFFFAOYSA-N 2-methylpropanoyl 2-methylpropaneperoxoate Chemical compound CC(C)C(=O)OOC(=O)C(C)C RPBWMJBZQXCSFW-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- XYFRHHAYSXIKGH-UHFFFAOYSA-N 3-(5-methoxy-2-methoxycarbonyl-1h-indol-3-yl)prop-2-enoic acid Chemical compound C1=C(OC)C=C2C(C=CC(O)=O)=C(C(=O)OC)NC2=C1 XYFRHHAYSXIKGH-UHFFFAOYSA-N 0.000 description 1
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 206010013786 Dry skin Diseases 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- OUUQCZGPVNCOIJ-UHFFFAOYSA-M Superoxide Chemical compound [O-][O] OUUQCZGPVNCOIJ-UHFFFAOYSA-M 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical class N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 1
- XSAOTYCWGCRGCP-UHFFFAOYSA-K aluminum;diethylphosphinate Chemical compound [Al+3].CCP([O-])(=O)CC.CCP([O-])(=O)CC.CCP([O-])(=O)CC XSAOTYCWGCRGCP-UHFFFAOYSA-K 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- NSGQRLUGQNBHLD-UHFFFAOYSA-N butan-2-yl butan-2-yloxycarbonyloxy carbonate Chemical compound CCC(C)OC(=O)OOC(=O)OC(C)CC NSGQRLUGQNBHLD-UHFFFAOYSA-N 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- WRKRMDNAUJERQT-UHFFFAOYSA-N cumene hydroxyperoxide Chemical compound OOOO.CC(C)C1=CC=CC=C1 WRKRMDNAUJERQT-UHFFFAOYSA-N 0.000 description 1
- BLCKNMAZFRMCJJ-UHFFFAOYSA-N cyclohexyl cyclohexyloxycarbonyloxy carbonate Chemical compound C1CCCCC1OC(=O)OOC(=O)OC1CCCCC1 BLCKNMAZFRMCJJ-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexyloxide Natural products O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- BXOUVIIITJXIKB-UHFFFAOYSA-N ethene;styrene Chemical group C=C.C=CC1=CC=CC=C1 BXOUVIIITJXIKB-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- QUPCNWFFTANZPX-UHFFFAOYSA-N hydrogen peroxide;1-methyl-4-propan-2-ylcyclohexane Chemical compound OO.CC(C)C1CCC(C)CC1 QUPCNWFFTANZPX-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- HZVOZRGWRWCICA-UHFFFAOYSA-N methanediyl Chemical compound [CH2] HZVOZRGWRWCICA-UHFFFAOYSA-N 0.000 description 1
- 229940032007 methylethyl ketone Drugs 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000002362 mulch Substances 0.000 description 1
- MWKFXSUHUHTGQN-UHFFFAOYSA-N n-decyl alcohol Natural products CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000003444 phase transfer catalyst Substances 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Substances [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 1
- 235000015320 potassium carbonate Nutrition 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229960001866 silicon dioxide Drugs 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- QDRKDTQENPPHOJ-UHFFFAOYSA-N sodium ethoxide Chemical compound [Na+].CC[O-] QDRKDTQENPPHOJ-UHFFFAOYSA-N 0.000 description 1
- 238000007614 solvation Methods 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- PFBLRDXPNUJYJM-UHFFFAOYSA-N tert-butyl 2-methylpropaneperoxoate Chemical compound CC(C)C(=O)OOC(C)(C)C PFBLRDXPNUJYJM-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- 229960004418 trolamine Drugs 0.000 description 1
- 229940070710 valerate Drugs 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2453/00—Presence of block copolymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2471/00—Presence of polyether
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
- Paints Or Removers (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
The purpose of the present invention is to provide: an adhesive film for electrical/electronic applications and a coverlay film, each of which enables the achievement of a lower dielectric constant and a lower dielectric loss in the frequency range of 1-10 GHz, while having a flame retardancy meeting V-0 or VTM-0 according to UL-94 standard; and a resin composition which is used for the purpose of producing the adhesive film and the coverlay film. The present invention provides a resin composition which is characterized by containing (A) a vinyl compound represented by general formula (1) and having a mass average molecular weight (Mw) of 500-4,000, (B) a thermoplastic elastomer, (C) a thermosetting resin other than the vinyl compound represented by general formula (1), (D) a curing agent and (E) an organic aluminum phosphinate. This resin composition is also characterized in that the component (E) is contained in an amount of 10-50 parts by mass per 100 parts by mass of the total of the component (A), the component (B), the component (C), the component (D) and the component (E).
Description
Technical field
The present invention relates to resin combination.More specifically, the resin combination of the then film of applicable electrical/electronic purposes or the coating film of printing distributing board is related to.
And, the present invention relates to and use then film made by this resin combination and coating film.
Background technology
In recent years, the printing distributing board used in electric/electronic is towards device miniaturization, lightweight and high performance development, especially for multi-layer printed circuit board, high multiple stratification, densification, slimming, lightweight, high reliability and shaping processability etc. are further required.
In addition, along with the high speed requirement of the transmission signal in nearest printing distributing board, the high frequency of transmission signal also significantly develops.By this, for the material used in printing distributing board, requirement can be lowered at high-frequency region, the electric signal loss specifically in frequency 1 ~ 10GHz region.
For the then film that interlayer solid or the surface protection film (i.e. mulch film) as printing distributing board uses, require at high-frequency region display excellent electric characteristic (low dielectric constant (ε), low dielectric tangent (yan δ)).
The material of then film used in such use is essentially flammable, thus except balancedly meet the general chemistry that uses as industrial material, except all characteristics of physics, majority has the security required for flame, namely requires the situation of flame retardancy." flame retardancy based on UL94 meets V-0 or VTM-0 " equal altitudes flame retardancy is mostly required when especially using in household electrical appliances purposes.Generally speaking, to such as then the resin material of film give the method for flame retardancy and can be set forth in resin the halogen series organic compound added as incombustible agent, and then to add as difficult method of firing the antimony compounds of auxiliary agent.
But, produce the problem of corrosive halogen gas or hypertoxicity dioxin when the method has burning.Therefore in recent years, in order to get rid of these halogen system incombustible agents to the detrimentally affect of environment, and strongly expect to use not containing halide, the i.e. incombustible agent of Halogen.
About the incombustible agent formula of Halogen, adopt the formula of such as phosphorus series flame-resisting agent.Such as, the applicant equals to think that phosphoric acid ester such as can using trimethyl phosphate, triphenyl, tricresyl phosphate is as incombustible agent in the paragraph [0040] of patent documentation 1, and discloses the scope containing incombustible agent content during incombustible agent in coating film recorded in the document.
Patent documentation
Patent documentation 1: JP 2011-068713 publication
Summary of the invention
The problem that invention will solve
Coating film described in patent documentation 1 is intended to apply in pliability printing distributing board, does not record and requires above-mentioned height flame retardancy, i.e. the requirement of " flame retardancy based on UL94 meets V-0 or VTM-0 ".
Therefore, the content of the middle incombustible agent recorded of the paragraph [0040] of patent documentation 1 is not intended to reach " flame retardancy based on UL94 meets V-0 or VTM-0 " equal altitudes flame retardancy.
In order to reach " flame retardancy based on UL94 meets V-0 or VTM-0 " equal altitudes flame retardancy, be then necessary the content increasing incombustible agent.
But, when containing the phosphorus series flame-resisting agent of amount can reaching " flame retardancy based on UL94 meets V-0 or VTM-0 " equal altitudes flame retardancy, notify the dielectric constant (ε) in the high-frequency region making frequency 1 ~ 10GHz, dielectric tangent (tan δ) has risen, can problem have been become in the electrical signal loss of high-frequency region.
The present invention is the problem points solving above-mentioned conventional art, its objective is and provide a kind of at high-frequency region, specifically can reach low dielectric constant and low dissipation loss in the region of frequency 1 ~ 5GHz, and then film and the coating film of the electrical/electronic purposes of V-0 or VTM-0 can be met based on the flame retardancy of UL94, and resin combination used in the making of these then film and coating films.
For the means of dealing with problems
For reaching above-mentioned purpose, the invention provides a kind of resin combination, it is characterized by containing following compositions:
(A) weight-average molecular weight (Mw) represented with following general formula (1) is the vinyl compound of 500 ~ 4000,
[changing 1]
(in formula, R
1, R
2, R
3, R
4, R
5, R
6, R
7can be identical or different, be hydrogen atom, halogen atom, alkyl, halogenated alkyl or phenyl ,-(O-X-O)-represent with following structural formula (2),
[changing 2]
R
8, R
9, R
10, R
14, R
15can be identical or different, be the alkyl or phenyl of halogen atom or carbon number less than 6, R
11, R
12, R
13can be identical or different, for the alkyl or phenyl of hydrogen atom, halogen atom or carbon number less than 6,-(Y-O)-be the a kind of structure defined with following structural formula (3) or the structure arbitrary arrangement of more than two kinds defined with following structural formula (3)
[changing 3]
R
16, R
17can be identical or different, be the alkyl or phenyl of halogen atom or carbon number less than 6, R
18, R
19can be identical or different, be the alkyl or phenyl of hydrogen atom, halogen atom or carbon number less than 6, Z is the organic radical of carbon number more than 1, also Sauerstoffatom, nitrogen-atoms, sulphur atom, halogen atom can be contained, a, b at least any one is not 0, represent 0 ~ 300 integer, c, d represent the integer of 0 or 1.)
(B) thermoplastic elastomer,
(C) thermosetting resin beyond the vinyl compound represented with aforementioned formula (1),
(D) stiffening agent, and
(E) organophosphinic acids aluminium, and
Relative to total 100 mass parts of aforesaid ingredients (A), aforesaid ingredients (B), aforesaid ingredients (C), aforesaid ingredients (D) and aforesaid ingredients (E), containing aforesaid ingredients (E) 10 ~ 50 mass parts.
In resin combination of the present invention, preferably, aforesaid ingredients (A)-(O-X-O)-there is the structure represented with following structural formula (4), aforesaid ingredients (A)-(Y-O)-there is the structure represented with following structural formula (5) or following structural formula (6), or the structure represented with following structural formula (5) and the structure of structure arbitrary arrangement represented with following structural formula (6).
[changing 4]
[changing 5]
In resin combination of the present invention, preferably, aforesaid ingredients (A)-(Y-O)-there is the structure represented with aforementioned structural formula (6).
In resin combination of the present invention, preferably, at least one of thermoplastic elastomer for selecting in the group that is made up of styrene-butadiene block copolymer, styrene-ethylene/butylene-styrene block copolymer, styrene isoprene styrene block copolymer (SIS), polyhutadiene and vinylbenzene-(ethylene-vinyl/propylene)-styrene block copolymer of aforesaid ingredients (B).
In resin combination of the present invention, preferably, at least one of thermosetting resin for selecting in the group that is made up of biphenyl type epoxy resin, naphthalene type epoxy resin, bisphenol A type epoxy resin, bisphenol f type epoxy resin, phenolic resin varnish type epoxy resin, bismaleimides and carbon imide of aforesaid ingredients (C).
In resin combination of the present invention, preferably, the content of the thermoplastic elastomer of aforesaid ingredients (B) is 10 ~ 60 mass parts relative to total 100 mass parts of aforesaid ingredients (A), aforesaid ingredients (B), aforesaid ingredients (C), aforesaid ingredients (D) and aforesaid ingredients (E).
In resin combination of the present invention, preferably, the content of the thermosetting resin of aforesaid ingredients (C) is 0.5 ~ 40 mass parts relative to total 100 mass parts of aforesaid ingredients (A), aforesaid ingredients (B), aforesaid ingredients (C), aforesaid ingredients (D) and aforesaid ingredients (E).
Resin combination of the present invention also can contain (F) filler further.In this situation, relative to total 100 mass parts of aforesaid ingredients (A), aforesaid ingredients (B), aforesaid ingredients (C), aforesaid ingredients (D), aforesaid ingredients (E) and aforementioned (F) composition, the aforesaid ingredients (F) containing 10 ~ 60 mass parts.
Resin combination of the present invention also can contain (G) organo-peroxide further.
Preferably, resin combination of the present invention is the dielectric constant (ε) of hardening thing in the region of frequency 1 ~ 10GHz of resin combination is less than 3.0, and dielectric tangent (tan δ) is less than 0.006.
Preferably, resin combination of the present invention meets V-0 or VTM-0 based on the flame retardancy of UL94.
And, the invention provides a kind of then film using resin combination of the present invention to make.
Again, the invention provides a kind of coating film using resin combination of the present invention to make.
In addition, the invention provides a kind of paint vehicle containing resin combination of the present invention.
The effect of invention
Then film of the present invention and coating film owing to showing excellent electrical specification after heat hardening in high-frequency region, specifically, low dielectric constant (ε) and low dielectric tangent (tan δ) is shown in the region of frequency 1 ~ 10GHz, therefore can reach at the low dielectric constant of high-frequency region and low dissipation loss, and meet V-0 or VTM-0 based on the flame retardancy of UL94.
And then film of the present invention and coating film are after heat hardening, and the organic materials used to printing distributing boards such as polyimide, liquid crystalline polymers, potteries or inorganic materials show excellent Bonding strength.
In addition, then film of the present invention and coating film after heat hardening, because pliability is excellent, so be suitable as then film and the coating film of pliability printing distributing board.Again, the pliability of film of the present invention before heat hardening is also excellent, so workability is good in the procedure of processing of film.
Then film of the present invention and coating film can use resin combination of the present invention to make.
The present invention also can replace the form being pre-formed film, and is coated after in film forming surface by the paint vehicle containing resin combination of the present invention, drying and filming.
Embodiment
Described in detail for the present invention below.
Resin combination of the present invention contains composition (A) shown below ~ composition (E) as essential component.
Composition (A): the weight-average molecular weight (Mw) represented with following general formula (1) is the vinyl compound of 500 ~ 4000,
[changing 6]
In general formula (1), R
1, R
2, R
3, R
4, R
5, R
6, R
7can be identical or different, be hydrogen atom, halogen atom, alkyl, halogenated alkyl or phenyl.Wherein, R
1, R
2, R
3, R
4, R
5, R
6, R
7be preferably hydrogen atom.
In formula ,-(O-X-O)-represent with following structural formula (2),
[changing 7]
In structural formula (2), R
8, R
9, R
10, R
14, R
15can be identical or different, be the alkyl or phenyl of halogen atom or carbon number less than 6.Wherein, R
8, R
9, R
10, R
14, R
15be preferably the alkyl of carbon number less than 6.
R
11, R
12, R
13can be identical or different, be the alkyl or phenyl of hydrogen atom, halogen atom or carbon number less than 6, wherein, R
11, R
12, R
13be preferably the alkyl of hydrogen atom, halogen atom or carbon number less than 6.
In general formula (1) ,-(Y-O)-be the a kind of structure defined with following structural formula (3), or with the structure arbitrary arrangement of more than two kinds that following structural formula (3) defines.Wherein ,-(Y-O)-be preferably the a kind of structural arrangement defined with following structural formula (3) to form.
[changing 8]
In structural formula (3), R
16, R
17can be identical or different, be the alkyl or phenyl of halogen atom or carbon number less than 6.Wherein, R
16, R
17be preferably the alkyl of carbon number less than 6.
R
18, R
19can be identical or different, be the alkyl or phenyl of hydrogen atom, halogen atom or carbon number less than 6.Wherein, R
18, R
19be preferably the alkyl of hydrogen atom or carbon number less than 3.
In general formula (1), Z is the organic radical of carbon number more than 1, also can contain Sauerstoffatom, nitrogen-atoms, sulphur atom, halogen atom.Wherein, Z is preferably methylene radical.
A, b at least any one is not 0, represent 0 ~ 300 integer.
C, d represent the integer of 0 or 1.Wherein, c, d are preferably 1.
Wherein, preferably, R
8, R
9, R
10, R
14, R
15for the alkyl of carbon number less than 3, R
11, R
12, R
13for the alkyl of hydrogen atom or carbon number less than 3, R
16, R
17for the alkyl of carbon number less than 3, R
18, R
19for hydrogen atom.
And, in above-mentioned general formula (1)-(O-X-O)-preferably represent with following structural formula (4).
[changing 9]
And, in general formula (1)-(Y-O)-preferably there is the structure represented with following structural formula (5) or following structural formula (6), or the structure represented with following structural formula (5) and the structure of structure arbitrary arrangement represented with following structural formula (6).Wherein, the structure of the structural arrangement that-(Y-O)-preferably have defines with following structural formula (6).
[changing 10]
In resin combination of the present invention, composition (A) contributes to electrical specification, the low dielectric constant (ε) namely in the region of frequency 1 ~ 10GHz and the low dielectric tangent (tan δ) of the thermosetting of then film and the coating film using this resin combination to make, thermotolerance and excellence in high frequency.
And, composition (A) as aftermentioned composition (B) ~ composition (E) phase solvation and play a role.
In resin combination of the present invention, as composition (A), weight-average molecular weight (Mw) in general formula (1) vinyl compound that represents is used to be that the reason of the compound of 500 ~ 4000 is as follows.
When weight-average molecular weight (Mw) does not reach 500, the flexibility of the then film using this resin combination to make and coating film becomes not enough, becomes the film of easy embrittlement.And, due to when hot pressing or heat hardening time melting viscosity too low, probably can damage the thickness homogeneity of film.
On the other hand, when weight-average molecular weight (Mw) is more than 4000, because solvability reduces, therefore become problem when the modulation of resin combination.Specifically, with solvent cut resin combination modulation paint vehicle time must in hot toluene long-time mixed dissolution.Again, in order to make the initial recrystallization when getting back to room temperature of film paint vehicle, the storage stability of paint vehicle is deteriorated.And, due to crystallization after filming, so be difficult to the shape being maintained as film.Therefore, the then film using this resin combination to make and coating film become and easily break.And, the film of film cannot be made as.Moreover, the surface smoothness of film is worsened.
As composition (A), preferably use weight-average molecular weight (Mw) in the vinyl compound shown in general formula (1) to be 800 ~ 3500, more preferably use 1000 ~ 3000.
There is no particular restriction for the method for making of the vinyl compound represented with above-mentioned general formula (1), by any means manufacture.Such as, by to the compound represented with following general formula (7), make 1-chloro-4-methyl-benzene under the basic catalysts such as sodium hydroxide, salt of wormwood, sodium ethylate exist, optionally use the phase-transfer catalyst reaction such as benzyl three normal-butyl brometo de amonio, 18-hat-6-ether and obtain.
[changing 11]
In general formula (7)-(O-X-O) and-(Y-O)-with above-mentioned general formula (1) identical.
Composition (B): thermoplastic elastomer
In resin combination of the present invention, the then film that composition (B) especially contributes to using this resin combination to make and coating film excellent electric characteristic in high frequency (at the low dielectric constant (ε) in the region of frequency 1 ~ 10GHz, low dielectric tangent (tan δ)), film proterties and thermotolerance.
In resin combination of the present invention, the elastomerics of composition (B) can use at least one selected in the group be made up of styrene-butadiene block copolymer, styrene-ethylene/butylene-styrene block copolymer, styrene isoprene styrene block copolymer (SIS), polyhutadiene and vinylbenzene-(ethylene-vinyl/propylene)-styrene block copolymer.Wherein, only can use any one, also can use two or more.
Wherein, any one whether is used suitably can to select according to the characteristic of giving the then film using this resin combination to make and coating film.
Such as, styrene-ethylene/butylene-styrene block copolymer is because the crystallinity of-ethylene/butylene-part is high therefore thermotolerance is high, and it is preferred for giving thermotolerance to the then film using this resin combination to make and coating film.
On the other hand, vinylbenzene-(ethylene-vinyl/propylene)-styrene block copolymer-crystallinity of (ethylene-vinyl/propylene)-part is lower than the corresponding part (-ethylene/butylene-part) of styrene-ethylene/butylene-styrene block copolymer, therefore compared to styrene-ethylene/butylene-styrene block copolymer, higher to the Bonding strength of base material.
In addition, styrene-butadiene block copolymer is owing to making the spring rate step-down of then film and the coating film utilizing this resin combination to make, and film thermal is when press against, to excellent by concavo-convex imbedibility that commissure exists, therefore the Bonding strength of this film improves.Again, the flexibility after film cures is also excellent.
In resin combination of the present invention, the content of composition (B), relative to total 100 mass parts of composition (A) ~ composition (E), is preferably 10 ~ 60 mass parts.
When the content of composition (B) does not reach 10 mass parts, the then film using this resin combination to make and the film proterties of coating film, specifically, the folding resistance of film monomer is poor.And, when hot pressing to ooze out quantitative change large, easily make the thickness of film become heterogeneity.
On the other hand, when the content of composition (B) is more than 60 mass parts, other compositions of resin combination, especially the content of composition (A) tails off, therefore the thermotolerance of the then film utilizing this resin combination to make and coating film reduces.And because the intermiscibility of other compositions with resin combination reduces, therefore the composition heterogeneity of the then film utilizing this resin combination to make and coating film, then the adherence of film and coating film or physical strength decline.
In resin combination of the present invention, the content of composition (B), relative to total 100 mass parts of composition (A) ~ composition (E), is more preferably 12 ~ 55 mass parts, more preferably 13 ~ 45 mass parts.
Composition (C): the thermosetting resin beyond the vinyl compound represented with above-mentioned general formula (1)
In resin combination of the present invention, composition (C) contributes to thermosetting and the adherence of then film and the coating film using this resin combination to make.
As composition (C) as long as namely the thermosetting resin used is not particularly limited as the thermosetting resin beyond the vinyl compound represented with above-mentioned general formula (1) of composition (A).
The thermosetting resin used as composition (C) can use at least one selected in the group be made up of biphenyl type epoxy resin, naphthalene type epoxy resin, bisphenol A type epoxy resin, bisphenol f type epoxy resin, phenolic resin varnish type epoxy resin, bismaleimides and carbon imide.
Again, in above-mentioned thermosetting resin, can use any one, also two or more kinds may be used.
Wherein, any one whether is used suitably can to select according to the characteristic of giving the then film using this resin combination to make and coating film.
The intermiscibility of other compositions of the epoxy resin such as biphenyl type epoxy resin, naphthalene type epoxy resin, bisphenol A type epoxy resin, bisphenol f type epoxy resin, phenolic resin varnish type epoxy resin and resin combination is excellent, and the moisture-proof reliability of the then film using this resin combination to make and coating film is excellent.In above-mentioned epoxy resin, for making the dielectric characteristics of resin itself relatively good, be preferably biphenyl type epoxy resin.
In addition, when using bismaleimides, the linear expansivity after the then film using this resin combination to make and the sclerosis of coating film reduces.
In resin combination of the present invention, the content of the thermosetting resin of composition (C), relative to total 100 mass parts of composition (A) ~ composition (E), is preferably 0.5 ~ 40 mass parts.
When the content of composition (C) does not reach 0.5 mass parts, exist and use the adherence of the then film made of this resin combination and coating film to become the problem such as insufficient.
When the content of composition (C) is more than 40 quality %, seepage discharge when the then film using this resin combination to make and the hot pressing of coating film is excessive.And because composition (C) proportion in whole composition becomes many, therefore the characteristic of the composition of poor heat resistance (C) impacts the then film using this resin combination to make and coating film entirety.Therefore, the then film using this resin combination to make and the thermotolerance of coating film or hardening probably can reduce.
In resin combination of the present invention, the content of composition (C), relative to total 100 mass parts of composition (A) ~ composition (E), is more preferably 1.0 ~ 30 mass parts, more preferably 1.5 ~ 15 mass parts.
The thermosetting resin used as composition (C) is biphenyl type epoxy resin, naphthalene type epoxy resin, bisphenol A type epoxy resin, bisphenol f type epoxy resin, phenolic resin varnish type epoxy resin or carbon imide time, number molecular-weight average (Mn) is when being 150 ~ 2500, is preferred with regard to the reason of the mechanical characteristics after the then film made with regard to using this resin combination and the thermosetting of coating film, adherence, sclerosis.
When the thermosetting resin used as composition (C) is for bismaleimides, number molecular-weight average (Mn) is when being 150 ~ 3500, is preferred with regard to the reason of the mechanical characteristics after the then film made with regard to using this resin combination and the thermosetting of coating film, adherence, sclerosis.
Composition (D): stiffening agent
Resin combination of the present invention contains the stiffening agent of significant quantity as composition (D).
There is no particular restriction for the stiffening agent used as composition (D).At least one stiffening agent gone out from the mass selection be made up of phenolic hardeners, amine type hardeners, imidazoles stiffening agent and anhydrides stiffening agent is preferably used as (D) composition.
Concrete example as phenolic hardeners refers to that monomer, oligomer, the polymkeric substance with phenolic hydroxyl group are whole, such as, can enumerate phenol resol resins, cresol novolac resin, phenol aralkyl (comprise stretch phenyl, stretch biphenyl backbone) resin, naphthols aralkyl resin, triphenol methane resin, dicyclopentadiene-type phenol resins etc.
As the concrete example of amine type hardeners, be enumerated as 2, the tertiary amine compounds such as the triaizine compounds such as 4-bis-amido-6-[2 '-methylimidazolyl-(1 ')] ethyl-s-triazine, 1,8-diazabicyclo [5.4.0] 11 carbon-7-alkene (DBU), Triethylene Diamine, benzyl dimethyl amine, trolamine.Wherein, preferred 2,4-bis-amido-6-[2 '-methylimidazolyl-(1 ')] ethyl-s-triazine.
As imidazoles stiffening agent, be enumerated as the imidazolium compoundss such as glyoxal ethyline, 2-undecyl imidazole, 1-cyano ethyl-2-undecyl imidazole, 2-heptadecyl imidazole, 2-ethyl-4-methylimidazole, 1-cyano ethyl-2-ethyl-4-imidazoles, 2-phenylimidazole, 2-phenyl-4-methylimidazole.Wherein, preferred 2-ethyl-4-methylimidazole, 1-cyano ethyl-2-undecyl imidazole and 1-cyano ethyl-2-ethyl-4-imidazoles.
As the concrete example of anhydrides stiffening agent, be enumerated as Tetra hydro Phthalic anhydride, maleic anhydride, dodecenyl succinic anhydride, trimellitic acid 1,2-anhydride, benzophenone tetracarboxylic dianhydride, tetrahydronaphthalic anhydride, hexahydro phthalic anhydride.
Again, in above-mentioned stiffening agent, can use any one, also two or more kinds may be used.
Wherein, imidazoles stiffening agent, even if it is preferred for also can playing the reasons such as effect from a small amount of interpolation, especially 2-phenyl-4,5-bishydroxymethyl imidazoles is preferred from the quality guaranteed period of serviceable time of the paint vehicle of raising solvent cut resin combination or the then film using this resin combination to make and coating film.
The significant quantity of stiffening agent is different with stiffening agent kind.For each stiffening agent kind, its significant quantity is as follows.
The situation of phenolic hardeners, its significant quantity, relative to total 100 mass parts of composition (A) ~ composition (E), is more preferably 1 ~ 10 mass parts, more preferably 1 ~ 5 mass parts.
The situation of amine type hardeners, its significant quantity, relative to total 100 mass parts of composition (A) ~ composition (E), is more preferably 1 ~ 10 mass parts, more preferably 1 ~ 3 mass parts.
The situation of imidazoles stiffening agent, its significant quantity, relative to total 100 mass parts of composition (A) ~ composition (E), is more preferably 0.1 ~ 5 mass parts, more preferably 0.2 ~ 3 mass parts.
The situation of anhydrides epoxy curing agent, its significant quantity, relative to total 100 mass parts of composition (A) ~ composition (E), is more preferably 1 ~ 10 mass parts, more preferably 1 ~ 5 mass parts.
And in phenolic hardeners, amine type hardeners, imidazoles stiffening agent, anhydrides stiffening agent, and when using two or more, each epoxy curing agent adds in the mode becoming above-mentioned significant quantity.
Composition (E): organophosphinic acids aluminium
In resin combination of the present invention, composition (E) contributes to the flame retardancy of then film and the coating film using this resin combination to make.
The organophosphinic acids aluminium used as composition (E) represents with following general formula.
[changing 12]
In above-mentioned general formula, R
1and R
2can be the same or different, represent alkyl, the phenyl or naphthyl of carbon number 1 ~ 6.Alkyl can be straight-chain, branch-like, ring-type.Be preferably the alkyl of carbon number 1 ~ 3, be more preferably ethyl.
The organophosphinic acids aluminium used as composition (E) is preferably dialkyl phosphinic acid aluminium, is more preferably aluminum diethylphosphinate.
Resin combination of the present invention is by using organophosphinic acids aluminium as composition (E), and the then film making to utilize this resin combination to make and coating film meet V-0 or VTM-0 based on the flame retardancy of UL94.
When using organophosphinic acids aluminium as incombustible agent, the flame retardancy based on UL94 meets V-0 or VTM-0 and is also documented in No. 2009-179774, JP, No. 2011-225883, JP.
But the former situation, is not considered as problem in the electric signal loss of high-frequency region, is studied completely in the electrical specification of high-frequency region.On the other hand, the situation of the latter, due to containing being the resin of less than 2.9 at the ratio dielectric constant of the frequency of more than 1GHz, therefore the 1GHz of resin combination can be made to be in less than 3.0 with the ratio dielectric constant of upper frequency, but due to used be that the weight-average molecular weight (Mw) of the resin of less than 2.9 is high as 1 than dielectric constant in 1GHz is with upper frequency, 000 ~ 300,000, when the resin combination of pretending as then film or coating film uses, decreased solubility, therefore become problem when resin composition modulation.Specifically, long-time mixed dissolution in hot toluene is needed when modulating paint vehicle with solvent cut resin combination.And understand initial recrystallization to make when film makes paint vehicle get back to room temperature, the storage stability of paint vehicle can be deteriorated.In addition, due to crystallization after filming, therefore be difficult to the shape being maintained film.Therefore, the then film using this resin combination to make and coating film easily break.Again, the film of film like cannot be made.Moreover the surface smoothness of film worsens.
In resin combination of the present invention, relative to total 100 mass parts of composition (A) ~ composition (E), the composition (E) containing 10 ~ 50 mass parts.
When the content of composition (E) does not reach 10 mass parts, the flame retardancy of the then film using this resin combination to make and coating film reduces, and the flame retardancy based on UL94 cannot meet V-0 or VTM-0.
When the content of composition (E) is more than 50 mass parts, use this resin combination make then film and coating film time cannot filming.
In resin combination of the present invention, relative to total 100 mass parts of composition (A) ~ composition (E), the composition (E) preferably containing 15 ~ 48 mass parts, more preferably containing 18 ~ 45 mass parts.
Resin combination of the present invention, also can optionally containing following composition (F), composition (G) except composition (A) ~ composition (E).
Composition (F): filler
Resin combination of the present invention, except composition (A) ~ composition (E), also can optionally contain filler as composition (F).
By containing filler as composition (F), can give and use the then film made of resin combination of the present invention and the rheological characteristics desired by coating film, electrical specification, physical property or wherein both.The filler used as composition (F) is suitably selected according to the purposes of the then film using resin combination of the present invention to make and coating film, but can be enumerated as such as heat conductivity material, the material not needing absorbing radiation, ceramic dielectric body material etc.
Heat conductivity material is enumerated as the such as oxide compound such as aluminum oxide, silicon-dioxide, the nitride such as aluminium nitride, boron nitride.
The material of absorbing radiation is not needed to be enumerated as the ferric oxide such as such as ferrite.
Ceramic dielectric body material is enumerated as such as barium titanate, titanium oxide etc.
During containing filler as composition (F), as long as its content in resin combination of the present invention can play the necessary amount of desired characteristic, and can film forming amount then be not particularly limited, but relative to composition (A), composition (B), composition (C), composition (D), total 100 mass parts of composition (E) and composition (F) is 10 ~ 60 mass parts, the then film made from dispersiveness or the use resin combination of resin combination and the processibility aspect of coating film are preferred, be more preferably 20 ~ 55 mass parts, more preferably 25 ~ 50 mass parts.
Again, during containing filler as composition (F), there is no particular restriction for its shape, it can be such as granular, Powdered, flakey etc., but its median size (situation beyond granular is its average largest diameter) is less than 0.5 μm, the then film made from dispersiveness or the use resin combination of resin combination and the processibility aspect of coating film are preferred.
In addition, during containing filler as composition (F), also optionally can use and impose surface-treated filler.Concrete example as this filler is enumerated as the filler forming oxide film in particle surface.
Composition (G): organo-peroxide
Resin combination of the present invention, also can containing organo-peroxide as composition (G) except mentioned component (A) ~ composition (E) (sometimes also comprising composition (F)).
By containing organo-peroxide as composition (G), when using the then film made of resin combination of the present invention and coating film heat hardening, facilitate the reaction of the vinyl compound used as composition (A).
The organo-peroxide of composition (G) can use benzoyl peroxide, isobutyryl peroxide, different nonanoyl superoxide, decanol peroxide, lauroyl peroxide, to chlorobenzoyl peroxide, two (3,5,5-trimethyl acetyl base) the diacyl peroxide class such as superoxide; The peroxy ketal classes such as 2,2-bis-(4,4-bis--(two-t-butylperoxy) cyclohexyl) propane; Peroxy two carbonates such as isopropylperoxy dicarbonate, di-sec-butyl peroxydicarbonate, two-2-ethylhexyl peroxy dicarbonate, two-1-methylheptyl peroxydicarbonate, two-3-methoxybutyl peroxydicarbonate, dicyclohexyl peroxydicarbonate; T-butyl peroxybenzoate, tert-butyl peroxy acetate, t-butyl peroxy-2-ethylhexanoate, tert-butylperoxy isobutyrate, t-butyl peroxy valerate, tertiary butyl diperoxy adipic acid ester, cumyl peroxide neodecanoic acid ester, t-butylperoxybenzoate, 2, the peroxy esters classes such as 5-dimethyl-2,5-bis-(benzoylperoxy) hexane; The ketone peroxide such as methyl-ethyl-ketone peroxide, Cyclohexanone peroxides class; Ditertiary butyl peroxide, diisopropylbenzyl superoxide, tert butyl isopropyl benzene peroxide, 1,1-bis-(tertiary hexyl peroxy)-3, the dialkyl peroxide classes such as 3,5-trimethyl-cyclohexane, two-tertiary hexyl superoxide, two (2-tert butylperoxyisopropyl) benzene; The hydroperoxide kinds such as cumene hydroxyl peroxide, tertbutyl peroxide, p-menthane hydrogen peroxide.Wherein, t-butylperoxybenzoate, its active temperature is the most suitable, namely, in the temperature province of 60 ~ 120 DEG C of the drying step of filming, or the temperature province of about 80 DEG C when the transfer printing of then film or coating film can not sensitization, and the temperature province sensitization of 180 ~ 210 DEG C when the heat hardening of then film or coating film, and the shelf time of then film or coating film is good, so preferably.
During containing organo-peroxide as composition (G), its content in resin combination of the present invention is relative to total 100 mass parts of composition (A), composition (B), composition (C), composition (D), composition (E), (containing being (F) composition sometimes) and composition (G), be preferably below 5 mass parts, be more preferably below 3 mass parts, more preferably 0.1 ~ 1 mass parts.
Resin combination of the present invention also optionally can contain the composition beyond mentioned component (A) ~ composition (G).Concrete example as this composition is enumerated as silane coupling agent, defoamer, flow modifier, film coalescence aid, dispersion agent etc.
Resin combination of the present invention is by conventional process manufacture.Such as, in the presence of solvent or under not existing, by heating, vacuum mixing and kneading machine mixing mentioned component (A) ~ composition (E) (resin combination contain mentioned component (F), (G) or other any compositions time so comprise these any compositions).
Proportional according to containing of formed expectation, by mentioned component (A) ~ composition (E) (resin combination contain mentioned component (F), (G) or other any compositions time contain these any compositions) be dissolved to specific solvent strength, being dropped into specified quantitative by these compositions heats in the reactor of 10 ~ 80 DEG C, while rotate with revolution 100 ~ 1000rpm, while carry out after normal pressure mixes 3 hours, (maximum 1Torr) remix stirs 30 ~ 60 minutes under vacuo.
Then film of the present invention and coating film obtain from resin combination of the present invention by known method.Such as, make paint vehicle with solvent cut resin combination of the present invention, coated at least one side of supporter, after drying, the film with supporter can be provided, or the film that self-supporter is peeled off.
The ketone such as methyl ethyl ketone, methyl iso-butyl ketone (MIBK) is enumerated as the spendable solvent of paint vehicle; The aromatic solvent such as toluene, dimethylbenzene; The high boiling solvent such as dioctyl phthalate (DOP), dibutyl phthalate etc.There is no particular restriction for the usage quantity of solvent, can be the amount that in the past used, but be preferably 20 ~ 90 quality % relative to solids component.
Supporter suitably can be selected according to the form expected in the manufacture method of film, and there is no particular restriction, but is enumerated as the carrier thin film etc. of the resins such as the such as tinsel such as copper, aluminium, polyester, polyethylene.Then, when film of the present invention provides with the film morphology that self-supporter is peeled off, supporter preferably carries out demoulding process with poly-silicon oxide compound etc.
There is no particular restriction for the method for coating paint vehicle, be enumerated as such as slot coated mode, plate gravure coating method, scraper plate coating method etc., suitably select according to the film thickness etc. expected, especially, plate gravure coating method can be designed to thinner, so preferably due to film thickness.Coating the dry rear film thickness formed is become expect that the mode of thickness is carried out.Those skilled in the art can derive this thickness from solvent.
The thickness of then film of the present invention and coating film suitably designs based on characteristics such as required physical strengths according to purposes, but be generally 1 ~ 100 μm, when requiring filming, is preferably 1 ~ 30 μm.
Suitably design such as the solvent species that drying conditions uses according to paint vehicle or amount, the usage quantity of paint vehicle or the thickness of coating etc., there is no particular restriction, but can such as 60 ~ 120 DEG C, carry out under normal atmosphere.
Then film of the present invention before using and coating film adhere to prevent foreign matter, can preserve under the state separated with protective film.As protective film, the film described in base material can be used as.
The use step of then film of the present invention is as follows.
Then film of the present invention is placed in the object in the object using then film of the present invention to carry out then by after on commissure, another object is loaded by the mode that commissure contacts with the exposed surface of then film with it.Herein, when using the then film of attached supporter, to make the exposed surface of then film load then film with the mode contacted by commissure of an object, by this then film transfer in by commissure.Herein, temperature during transfer printing can be set to such as 80 DEG C.
Then, on the face of then film of exposing by peeling off supporter when transfer printing, another object is loaded by the mode that commissure contacts with the exposed surface of then film with it.After implementing these steps, the hot pressing carrying out specified temp and specified time, subsequently heat hardening.
Temperature when hot pressing is preferably 100 ~ 200 DEG C.The hot pressing time of is preferably 0.5 ~ 10 minute.
The temperature of heat hardening is preferably 180 ~ 210 DEG C.The heat hardening time is preferably 30 ~ 120 minutes.
The use step of coating film of the present invention is substantially the same, as long as coating film of the present invention to be placed in the specific position of printing distributing board, namely be placed in behind the coating position of coating film, the hot pressing carrying out specified temp and specified time, with after through heat hardening.
In addition, also filming in advance can be replaced, and implement following steps: by coat with the paint vehicle of solvent cut resin combination of the present invention one then object by commissure (during coating film, position for being coated to film), after drying, an above-mentioned object (being that hot pressing during coating film) is loaded.
Below, the characteristic for then film of the present invention and coating film is described.
Then film of the present invention and coating film after heat hardening, in the excellent electrical characteristic of high frequency.Specifically, the dielectric constant (ε) of the coating film after heat hardening in the region of frequency 1 ~ 10GHz is preferably less than 3.0, is more preferably less than 2.5.And the dielectric tangent (tan δ) in the region of frequency 1 ~ 10GHz is preferably less than 0.01, is more preferably less than 0.0025.
Because the dielectric constant (ε) in the region at frequency 1 ~ 10GHz and dielectric tangent (tan δ) are above-mentioned scope, the electric signal loss in the region of frequency 1 ~ 10GHz can be lowered.
Then film of the present invention and coating film have sufficient Bonding strength after heat hardening.Specifically, the stripping strength for roughening of copper foil face (180 degree of strippings) that then film after heat hardening and coating film measure according to JIS C6471 is preferably more than 5N/cm, be more preferably more than 8N/cm, more preferably more than 10N/cm.
Then film of the present invention and coating film have sufficient flame retardancy after heat hardening.Specifically, in the flame retardancy test that the then film after heat hardening and coating film are implemented according to the flame retardancy specification of UL94V, it is qualified to be preferably set to by flame retardancy grade V-0.In addition, the then film after heat hardening and coating film are in the flame retardancy that the flame retardancy specification according to UL94VTM is implemented is tested, and it is qualified to be preferably set to by flame retardancy grade VTM-0.
Embodiment
Below, describe the present invention in detail with embodiment, but the present invention is not limited to these embodiments.
(embodiment 1 ~ 12, comparative example 1 ~ 6)
After each composition is carried out metering allotment according to the ratio (mass parts) shown in following table, add toluene, drop into and heat in the reactor of 80 DEG C, while rotate with revolution 150rpm, while carry out normal pressure to mix 3 hours.
Paint vehicle containing the resin combination obtained to some extent is coated on the one side of base material (imposing the PET film of demoulding process), 100 DEG C of dryings, obtains the film of attached supporter by this.
Writing a Chinese character in simplified form in table represents respectively as follows.
composition (A)
OPE2200: widow stretches phenyl ether (vinyl compound represented with above-mentioned general formula (1)) (Mn=2200), Mitsubishi Gas Chemical Co., Ltd's system
composition (A ')
S202A: modification is poly-stretches phenyl ether (Mn=16000), Asahi Chemical Corp's system
composition (B)
SEPTON 8007: styrene-ethylene/butylene block-copolymer, KURARAY Co., Ltd. system
SEPTON 4044: vinylbenzene-(ethylene-vinyl/propylene)-styrene block copolymer, KURARAY Co., Ltd. system
TR 2003: styrene-butadiene-styrene block copolymer, JSR Corp.'s system
PB 810: polyhutadiene, JSR Corp.'s system
composition (C)
NC 3000H: biphenyl type epoxy resin, Nippon Kayaku K. K's system
828: bisphenol A type epoxy resin, Mitsubishi chemical Co., Ltd's system
HP 4032D: naphthol novolak type epoxy resin, Dainippon Ink Chemicals's system
BMI-70: bismaleimides, KI change into Co., Ltd.'s system
V-03: carbon imide, Nisshinbo Industries Inc's system
composition (D)
2E4MZ:2-ethyl-4-methylimidazole, Shikoku Chem's system
2PHZ-PW:2-phenyl-4,5-dihydroxyl methylimidazole, Shikoku Chem's system
composition (E)
OP935: organophosphinic acids aluminium, CLARIANT Amada Co., Ltd. system
composition (E ')
FP2200: phosphoric acid salt incombustible agent, Asahi Denka Co., Ltd.'s system
PX-200: phosphoric acid ester incombustible agent, large eight chemical industry systems
composition (F)
SE2050: silica filler, Co., Ltd. ADMATECHS
composition (G)
PERBUTYL Z: t-butylperoxybenzoate, Japan Oil Co
other compositions
KBM403: silane coupling agent, Shin-Etsu Chemial Co., Ltd's system
DISPERBYK 2009: dispersion agent, BYK chemistry Amada Co., Ltd. system
Following evaluation is carried out for made then film.
Dielectric constant (ε), dielectric tangent (tan δ): make then film 180 DEG C of heat hardenings, self-supporter peel off after, from this then film cut out test film (40 ± 0.5mm × 100 ± 2mm), measure thickness.Test film is rolled into length 100mm, the tubular of below diameter 2mm, measures dielectric constant (ε) and dielectric tangent (tan δ) with empty syntonizer perturbation method (10GHz).
Glass transition temperature Tg: measure (DMA) with dynamic viscoelasticity and measure.Make then film 180 DEG C of heat hardenings, self-supporter peel off after, from this then film cut out test film (10 ± 0.5mm × 40 ± 1mm), the width of determination test sheet, thickness.Subsequently, carry out measuring (3 DEG C/min 25-220 DEG C) with DMS6100.Read the peak temperature of tanD as Tg.
Stripping strength: on the two sides of then film, makes alligatoring face become inner side laminating Copper Foil, (180 DEG C of 60min, 10kgf) with press hot pressing.This test film is cut into 10mm wide, tears with universal testing machine (autograph), measure stripping strength.About measurement result, calculate the mean value of each N=5.
Linear expansivity: measure with apparatus for thermal analysis (TMA).Make then film 180 DEG C of heat hardenings, self-supporter peel off after, from this then film cut out test film (5 ± 0.5mm × 20 ± 1mm), carry out measuring (5 DEG C/min25-230 DEG C) with TMA4000S.The C.T.E of 90 ~ 100 DEG C is on average set to α 1, the C.T.E of 170 ~ 180 DEG C is on average set to α 2.
Flame retardancy evaluate: make then film 180 DEG C of heat hardenings, self-supporter peel off after, from this then film cut out test film (50 ± 0.5mm × 200 ± 0.5mm), measure thickness.Test film is rolled into length 200mm, and diameter is about the tubular of 15mm, and is fixed on support.By the flame adjusting of gas burner to highly about 20mm, carry out flame contact after 3 seconds in the lower end of film, measure combustion time, every 1 sample repeats contact flame 3 times.
Each combustion time is less than 10 seconds, and the total of 3 times is the judgement of less than 30 seconds combustion time is qualified.Test with each N=3, all qualified is equivalent to VTM-0.
Paint vehicle stability: be sealed in vial by the paint vehicle containing above-mentioned steps gained resin combination, leaves standstill at 25 DEG C, confirms the stability of solution.Relatively until causing the number of days till crystallization, throw out generation, solution separating etc., more than 1 week stable be designated as about zero, 3 days be designated as △.
Solvability: the paint vehicle containing above-mentioned steps gained resin combination is placed on normal temperature, the composition non-recrystallization of resin combination be evaluated as zero, have being evaluated as of recrystallize ×.
Imbedibility: the substrate (L/S=30/30 μm, distribution is high 20 μm) forming pattern on surface heats laminate film, what be confirmed whether to imbed between pattern is concavo-convex.No problem and can imbed be designated as zero, what a part was not fully imbedded is designated as △, cannot imbed be designated as ×.
Filming: when making the then film of attached supporter with above-mentioned step, what obtain homogeneous film is designated as zero, owing to not completing the homogenization of mixture, therefore produces mottled style during filming, break and cannot being designated as of filming ×.
Table 1
Table 2
Table 3
Obtain homogeneous then film in embodiment 1 ~ 12, imbedibility when hot pressing is excellent.Further, then film is after heat hardening, all excellent in the electrical specification (dielectric constant ε, dielectric tangent Tan δ) of high-frequency region, stripping strength, flame retardancy.In addition, the solvability of paint vehicle and stability also excellent.
(E) content of composition does not reach in the comparative example 1 of 10 mass parts, and the flame retardancy of gained then film is poor.
(E) content of composition is more than in the comparative example 2 of 50 mass parts, produces mottled style during filming.And the imbedibility when hot pressing of gained then film is poor.And the stability of paint vehicle is also poor.
Use the incombustible agent of phosphoric acid salt to replace in the comparative example 3 of (E) composition, the flame retardancy of gained then film is poor.
Use the incombustible agent of phosphoric acid ester to replace in the comparative example 4 of (E) composition, the flame retardancy of gained then film is poor.
Use the incombustible agent of phosphoric acid salt to replace (E) composition, and to increase in the comparative example 5 of the allotment amount of this incombustible agent, though the flame retardancy of gained then film is excellent, during filming, produce mottled style.In addition, the imbedibility when hot pressing of gained then film is poor.And the stability of paint vehicle is also poor.
Poly-more than 4000 of functional quality molecular-weight average (Mw) stretches in the comparative example 6 of phenyl ether as (A) composition, when paint vehicle containing above-mentioned steps gained resin combination is placed on normal temperature, the composition recrystallize of resin combination, and cannot filming.
Claims (14)
1. a resin combination, it contains following composition:
(A) weight-average molecular weight (Mw) represented with following general formula (1) is the vinyl compound of 500 ~ 4000,
(in formula, R
1, R
2, R
3, R
4, R
5, R
6, R
7can be identical or different, be hydrogen atom, halogen atom, alkyl, halogenated alkyl or phenyl;-(O-X-O)-represent with following structural formula (2),
R
8, R
9, R
10, R
14, R
15can be identical or different, be the alkyl or phenyl of halogen atom or carbon number less than 6, R
11, R
12, R
13can be identical or different, for the alkyl or phenyl of hydrogen atom, halogen atom or carbon number less than 6,-(Y-O)-be the a kind of structure defined with following structural formula (3) or the structure arbitrary arrangement of more than two kinds defined with following structural formula (3)
R
16, R
17can be identical or different, be the alkyl or phenyl of halogen atom or carbon number less than 6, R
18, R
19can be identical or different, be the alkyl or phenyl of hydrogen atom, halogen atom or carbon number less than 6, Z is the organic radical of carbon number more than 1, also Sauerstoffatom, nitrogen-atoms, sulphur atom, halogen atom can be contained, a, b at least any one is not 0, represent 0 ~ 300 integer, c, d represent the integer of 0 or 1.)
(B) thermoplastic elastomer,
(C) thermosetting resin beyond the vinyl compound represented with aforementioned formula (1),
(D) stiffening agent, and
(E) organophosphinic acids aluminium, and
Relative to total 100 mass parts of aforesaid ingredients (A), aforesaid ingredients (B), aforesaid ingredients (C), aforesaid ingredients (D) and aforesaid ingredients (E), containing aforesaid ingredients (E) 10 ~ 50 mass parts.
2. resin combination as claimed in claim 1, wherein aforesaid ingredients (A)-(O-X-O)-there is the structure represented with following structural formula (4), aforesaid ingredients (A)-(Y-O)-there is the structure represented with following structural formula (5) or following structural formula (6), or the structure represented with following structural formula (5) and the structure of structure arbitrary arrangement represented with following structural formula (6).
3. resin combination as claimed in claim 2, wherein aforesaid ingredients (A)-(Y-O)-there is the structure represented with aforementioned structural formula (6).
4. the resin combination according to any one of claims 1 to 3, the wherein at least one of thermoplastic elastomer for selecting in the group that is made up of styrene-butadiene block copolymer, styrene-ethylene/butylene-styrene block copolymer, styrene isoprene styrene block copolymer (SIS), polyhutadiene and vinylbenzene-(ethylene-vinyl/propylene)-styrene block copolymer of aforesaid ingredients (B).
5. the resin combination according to any one of Claims 1 to 4, the wherein at least one of thermosetting resin for selecting in the group that is made up of biphenyl type epoxy resin, naphthalene type epoxy resin, bisphenol A type epoxy resin, bisphenol f type epoxy resin, phenolic resin varnish type epoxy resin, bismaleimides and carbon imide of aforesaid ingredients (C).
6. the resin combination according to any one of Claims 1 to 5, wherein the content of the thermoplastic elastomer of aforesaid ingredients (B) is 10 ~ 60 mass parts relative to total 100 mass parts of aforesaid ingredients (A), aforesaid ingredients (B), aforesaid ingredients (C), aforesaid ingredients (D) and aforesaid ingredients (E).
7. the resin combination according to any one of claim 1 ~ 6, wherein the content of the thermosetting resin of aforesaid ingredients (C) is 0.5 ~ 40 mass parts relative to total 100 mass parts of aforesaid ingredients (A), aforesaid ingredients (B), aforesaid ingredients (C), aforesaid ingredients (D) and aforesaid ingredients (E).
8. the resin combination according to any one of claim 1 ~ 7, it is further containing (F) filler, and it is 10 ~ 60 mass parts relative to total 100 mass parts of aforesaid ingredients (A), aforesaid ingredients (B), aforesaid ingredients (C), aforesaid ingredients (D), aforesaid ingredients (E) and aforementioned (F) composition.
9. the resin combination according to any one of claim 1 ~ 8, it is further containing (G) organo-peroxide.
10. the resin combination according to any one of claim 1 ~ 9, wherein the dielectric constant (ε) of the hardening thing of resin combination in the region of frequency 1 ~ 10GHz is less than 3.0, and dielectric tangent (tan δ) is less than 0.006.
11. resin combinations according to any one of claim 1 ~ 10, its flame retardant resistance based on UL94 meets V-0 or VTM-0.
12. 1 kinds of then films using the resin combination according to any one of claim 1 ~ 11 to make.
13. 1 kinds of coating films using the resin combination according to any one of claim 1 ~ 11 to make.
14. 1 kinds of paint vehicles containing the resin combination according to any one of claim 1 ~ 11.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-177857 | 2012-08-10 | ||
| JP2012177857A JP5955156B2 (en) | 2012-08-10 | 2012-08-10 | Resin composition, and adhesive film and coverlay film thereby |
| PCT/JP2013/069912 WO2014024678A1 (en) | 2012-08-10 | 2013-07-23 | Resin composition, and adhesive film and coverlay film each of which is formed of same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104508040A true CN104508040A (en) | 2015-04-08 |
| CN104508040B CN104508040B (en) | 2016-10-26 |
Family
ID=50067912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380040490.1A Active CN104508040B (en) | 2012-08-10 | 2013-07-23 | Resin combination and the then thin film being made up of said composition and cover film |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5955156B2 (en) |
| CN (1) | CN104508040B (en) |
| TW (1) | TWI577729B (en) |
| WO (1) | WO2014024678A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107236252A (en) * | 2016-03-29 | 2017-10-10 | 味之素株式会社 | Resin sheet |
| CN107531991A (en) * | 2015-04-30 | 2018-01-02 | 日立化成株式会社 | Resin combination, prepreg, plywood and multilayer printed circuit board |
| CN108559246A (en) * | 2018-05-03 | 2018-09-21 | 宁波大名包装材料科技有限公司 | A kind of high temperature resistant tear-proof film and preparation method thereof that multilayer stretch film is compound |
| CN111742029A (en) * | 2018-02-05 | 2020-10-02 | 迪睿合株式会社 | Adhesive composition, thermosetting adhesive sheet, and printed wiring board |
| CN112074553A (en) * | 2018-05-29 | 2020-12-11 | 纳美仕有限公司 | Thermosetting resin composition, film comprising the same, and multilayer wiring board using the same |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6106464B2 (en) * | 2013-02-28 | 2017-03-29 | ナミックス株式会社 | Multilayer electronic component and manufacturing method thereof |
| WO2014148155A1 (en) * | 2013-03-22 | 2014-09-25 | ナミックス株式会社 | Resin composition and adhesive film, coverlay film, and interlayer adhesive using resin composition |
| JP6230363B2 (en) * | 2013-10-08 | 2017-11-15 | ナミックス株式会社 | Resin composition for film, insulating film, and semiconductor device |
| JP6458985B2 (en) * | 2014-10-22 | 2019-01-30 | ナミックス株式会社 | Resin composition, insulating film using the same, and semiconductor device |
| KR101797723B1 (en) | 2014-12-08 | 2017-11-14 | 셍기 테크놀로지 코. 엘티디. | Adhesive composition, adhesive film, and flexible metal laminate |
| CN105778410A (en) * | 2014-12-18 | 2016-07-20 | 北京首科化微电子有限公司 | Epoxy molding compound containing triblock polymer |
| CN107535082A (en) | 2015-05-26 | 2018-01-02 | 拓自达电线株式会社 | Screened film and shielding printed circuit board |
| WO2017077912A1 (en) | 2015-11-02 | 2017-05-11 | 東洋紡株式会社 | Low-dielectric flame-resistant adhesive composition |
| JP2017193690A (en) * | 2016-04-22 | 2017-10-26 | 日立化成株式会社 | Adhesive film for multilayer printed board |
| CN111670236B (en) * | 2018-05-28 | 2022-07-08 | 东洋纺株式会社 | Low dielectric adhesive composition |
| CA3106740A1 (en) * | 2018-07-24 | 2020-01-30 | Henkel Ag & Co. Kgaa | Flame retardant adhesive composition |
| CN109135634B (en) * | 2018-07-27 | 2020-08-25 | 四川大学 | Method for preparing high-thermal-conductivity low-dielectric-loss composite adhesive film |
| WO2020116408A1 (en) | 2018-12-04 | 2020-06-11 | ナミックス株式会社 | Resin composition for millimeter-wave substrate, adhesive film for millimeter-wave substrate, millimeter-wave substrate, millimeter-wave radar substrate, and semiconductor device |
| CN115244130B (en) * | 2020-03-06 | 2023-12-29 | 菱环球聚甲醛株式会社 | Resin composition, molded article, and electric wire |
| KR20230039605A (en) | 2020-07-17 | 2023-03-21 | 도요보 가부시키가이샤 | Adhesive compositions, adhesive sheets, laminates and printed wiring boards |
| US20250019572A1 (en) | 2022-01-17 | 2025-01-16 | Toyobo Mc Corporation | Adhesive composition, adhesive sheet, electromagnetic wave shield film, laminate, and printed circuit board |
| JPWO2024185371A1 (en) * | 2023-03-06 | 2024-09-12 | ||
| CN116026780B (en) * | 2023-03-28 | 2023-07-14 | 江西中医药大学 | On-line detection method and system for coating moisture absorption rate based on series strategy wavelength selection |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1646635A (en) * | 2002-04-16 | 2005-07-27 | 日立化成工业株式会社 | Thermosetting resin composition and prepreg and laminated sheet using the same |
| JP2006089683A (en) * | 2004-09-27 | 2006-04-06 | Nippon Steel Chem Co Ltd | Flame retardant resin composition |
| CN1769344A (en) * | 2004-11-05 | 2006-05-10 | 日立化成工业株式会社 | Thermosetting resin composition, and prepreg, metal-clad laminated board and printed wiring board using the same |
| CN1914239A (en) * | 2004-01-30 | 2007-02-14 | 新日铁化学株式会社 | Curable resin composition |
| JP2009126917A (en) * | 2007-11-21 | 2009-06-11 | Namics Corp | Method for producing fiber-reinforced uncured film and fiber-reinforced uncured film |
| JP2011068713A (en) * | 2009-09-24 | 2011-04-07 | Namics Corp | Coverlay film |
-
2012
- 2012-08-10 JP JP2012177857A patent/JP5955156B2/en active Active
-
2013
- 2013-07-23 WO PCT/JP2013/069912 patent/WO2014024678A1/en active Application Filing
- 2013-07-23 CN CN201380040490.1A patent/CN104508040B/en active Active
- 2013-07-31 TW TW102127418A patent/TWI577729B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1646635A (en) * | 2002-04-16 | 2005-07-27 | 日立化成工业株式会社 | Thermosetting resin composition and prepreg and laminated sheet using the same |
| CN1914239A (en) * | 2004-01-30 | 2007-02-14 | 新日铁化学株式会社 | Curable resin composition |
| JP2006089683A (en) * | 2004-09-27 | 2006-04-06 | Nippon Steel Chem Co Ltd | Flame retardant resin composition |
| CN1769344A (en) * | 2004-11-05 | 2006-05-10 | 日立化成工业株式会社 | Thermosetting resin composition, and prepreg, metal-clad laminated board and printed wiring board using the same |
| JP2009126917A (en) * | 2007-11-21 | 2009-06-11 | Namics Corp | Method for producing fiber-reinforced uncured film and fiber-reinforced uncured film |
| JP2011068713A (en) * | 2009-09-24 | 2011-04-07 | Namics Corp | Coverlay film |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107531991A (en) * | 2015-04-30 | 2018-01-02 | 日立化成株式会社 | Resin combination, prepreg, plywood and multilayer printed circuit board |
| CN107531991B (en) * | 2015-04-30 | 2020-08-04 | 日立化成株式会社 | Resin composition, prepreg, laminate, and multilayer printed wiring board |
| US11041045B2 (en) | 2015-04-30 | 2021-06-22 | Showa Denko Materials Co., Ltd. | Resin composition, prepreg, laminate and multilayer printed wiring board |
| CN107236252A (en) * | 2016-03-29 | 2017-10-10 | 味之素株式会社 | Resin sheet |
| CN111742029A (en) * | 2018-02-05 | 2020-10-02 | 迪睿合株式会社 | Adhesive composition, thermosetting adhesive sheet, and printed wiring board |
| CN111742029B (en) * | 2018-02-05 | 2023-11-07 | 迪睿合株式会社 | Adhesive composition, thermosetting adhesive sheet, and printed wiring board |
| CN108559246A (en) * | 2018-05-03 | 2018-09-21 | 宁波大名包装材料科技有限公司 | A kind of high temperature resistant tear-proof film and preparation method thereof that multilayer stretch film is compound |
| CN112074553A (en) * | 2018-05-29 | 2020-12-11 | 纳美仕有限公司 | Thermosetting resin composition, film comprising the same, and multilayer wiring board using the same |
| CN112074553B (en) * | 2018-05-29 | 2023-10-20 | 纳美仕有限公司 | Thermosetting resin composition, film comprising the same, and multilayer wiring board using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104508040B (en) | 2016-10-26 |
| TW201406849A (en) | 2014-02-16 |
| WO2014024678A1 (en) | 2014-02-13 |
| TWI577729B (en) | 2017-04-11 |
| JP5955156B2 (en) | 2016-07-20 |
| JP2014034668A (en) | 2014-02-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104508040A (en) | Resin composition, and adhesive film and coverlay film each of which is formed of same | |
| TWI804597B (en) | Resin materials and multilayer printed wiring boards | |
| TWI609921B (en) | Resin composition, and adhesive film, cover lay film and interlayer adhesive formed therefrom | |
| TWI814907B (en) | Resin compositions, films, laminates and semiconductor devices | |
| KR102364539B1 (en) | Resin compositions | |
| JP5463110B2 (en) | Coverlay film | |
| JP6917636B2 (en) | Resin composition, thermosetting film using it, resin cured product, laminated board, printed wiring board, and semiconductor device | |
| CN106574110A (en) | Resin composition, and insulating film and semiconductor device using same | |
| WO2022102781A1 (en) | Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package | |
| JP2011225639A (en) | Thermosetting resin composition, and resin varnish, prepreg and metal-clad laminate using the same | |
| JP5771186B2 (en) | Film composition, and adhesive film and coverlay film thereby | |
| TWI731901B (en) | Thermosetting resin composition, thermosetting resin film, printed wiring board, and semiconductor device | |
| JP6089615B2 (en) | Thermosetting resin composition, prepreg, metal-clad laminate and printed wiring board | |
| US20160264769A1 (en) | Curable compositions which form interpenetrating polymer networks | |
| JP7219216B2 (en) | Resin composition, insulating layer for wiring board, and laminate | |
| WO2022102782A1 (en) | Maleimide resin composition, prepreg, laminate, resin film, printed wiring board, and semiconductor package | |
| JP2021138795A (en) | Resin composition and its solution | |
| JP2021054889A (en) | Modified hydrogenated polyolefin, resin composition, insulating film, semiconductor device, and method for producing modified hydrogenated polyolefin | |
| TWI861153B (en) | Adhesive composition, adhesive sheet, laminate, and printed wiring board | |
| JP2024129508A (en) | Curable resin composition and interlayer insulating material | |
| JP2004059703A (en) | Epoxy resin composition, prepreg and laminate | |
| CN119731213A (en) | Modified styrene elastomer | |
| WO2024038847A1 (en) | Modified styrene-based elastomer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |